TWM576691U - Image-capturing module and portable electric device - Google Patents

Abstract

The present invention discloses an image capture module and a portable electronic device. The image capture module includes a circuit substrate, an image sensing chip, a filter component, and a lens assembly. The upper surface of the circuit substrate includes a morphing region, a first pad region, and a second pad region. The upper surface of the image sensing wafer includes an image sensing area, a bearing area, a first conductive area and a second conductive area, the bearing area surrounding the image sensing area. The lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area. The first conductive region and the second conductive region of the image sensing wafer are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively, and the connection region of the filter element corresponds to the bearing region of the image sensing wafer. Thereby, the width or size of the image sensing wafer in the horizontal direction can be reduced.

Description

Image capture module and portable electronic device

The present invention relates to an image capture module and a portable electronic device, and more particularly to an image capture module and a portable electronic device for reducing the width of an image sensor.

In the conventional technology, the special advantage of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors lies in the characteristics of "low power consumption" and "small volume", so CMOS image sensor It is easy to integrate into portable electronic products with special needs. For example, CMOS image sensors can be easily integrated into portable electronic products with small integration space, such as smart phones, tablets or notebook computers.

However, the width of conventional CMOS image sensors still cannot be effectively shortened. Therefore, how to effectively shorten the width of the traditional CMOS image sensor by improving the structural design has become an important issue that the business person wants to solve.

The technical problem to be solved by the present invention is to provide an image capturing module and a portable electronic device for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing module, comprising: a circuit substrate, an image sensing chip, a filter component, and a lens component. The circuit substrate has an upper surface and a lower surface. The image sensing wafer is disposed on the upper surface of the circuit substrate. A filter element is disposed on the image sensing wafer. The lens assembly includes a bracket structure disposed on the circuit substrate and a lens structure disposed on the bracket structure. The upper surface of the circuit substrate includes a crystallization region, a first pad region, and a second a solder joint region, the first solder joint region is connected between a first side of the crystallized region and a first side of the circuit substrate, and the second solder joint region is connected to the first region of the crystallized region A third side of the crystallographic region is connected to a third side of the circuit substrate between the two sides and a second side of the circuit substrate. The upper surface of the image sensing chip includes an image sensing area, a bearing area, a first conductive area and a second conductive area. The first conductive area is connected between a first side of the carrying area. a first side of the image sensing wafer, the second conductive area is connected between a second side of the carrying area and a second side of the image sensing wafer, the carrying area surrounding the image sense a third side of the carrying area is connected to a third side of the image sensing die. The lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area. The first conductive region and the second conductive region of the image sensing wafer are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively, the connection region of the filter element Corresponding to the bearing area of the image sensing wafer.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device, comprising: a portable electronic module and an image capturing module. The image capture module is disposed on the portable electronic module. The image capture module includes a circuit substrate, an image sensing chip, a filter component, and a lens assembly. The circuit substrate has an upper surface and a lower surface. The image sensing wafer is disposed on the upper surface of the circuit substrate. A filter element is disposed on the image sensing wafer. The lens assembly includes a bracket structure disposed on the circuit substrate and a lens structure disposed on the bracket structure. The upper surface of the circuit substrate includes a crystallized region, a first solder joint region, and a second solder joint region. The first solder joint region is connected to a first side of the crystallized region and the circuit substrate. a second solder joint region is connected between a second side of the crystallized region and a second side of the circuit substrate, and a third side of the crystal region is connected On a third side of the circuit substrate. The upper surface of the image sensing wafer includes an image sensing area, a bearing area, a first conductive area, and a second conductive area. The first conductive area is connected between a first side of the carrying area and a first side of the image sensing chip, and the second conductive area is connected to a second side of the carrying area and the image Between a second side of the sensing wafer, the carrying area surrounds the image sensing area, and a third side of the carrying area is connected to a third side of the image sensing wafer. The lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area. The first conductive region and the second conductive region of the image sensing wafer are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively, the connection region of the filter element Corresponding to the bearing area of the image sensing wafer.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an image capturing module, comprising: a circuit substrate, an image sensing chip, a filter component, and a lens component. The circuit substrate has an upper surface and a lower surface. The image sensing wafer is disposed on the upper surface of the circuit substrate. A filter element is disposed on the image sensing wafer. The lens assembly includes a bracket structure disposed on the circuit substrate and a lens structure disposed on the bracket structure. The upper surface of the circuit substrate includes a morphing region and a first pad region, the first pad region being connected between a first side of the crystallization region and a first side of the circuit substrate . The upper surface of the image sensing chip includes an image sensing area, a bearing area and a first conductive area. The first conductive area is connected between a first side of the carrying area and the image sensing chip. A first side of the bearing area surrounds the image sensing area. The lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area. The first conductive region of the image sensing wafer is electrically connected to the first pad region of the circuit substrate, and the connection region of the filter component corresponds to the bearing region of the image sensing wafer.

One of the beneficial effects of the present invention is that the image capturing module and the portable electronic device provided by the present invention can pass the "upper surface of the circuit substrate including a crystal region, a first solder joint region, and a first Two solder joint area, the first solder joint area Connected between a first side of the crystallized region and a first side of the circuit substrate, the second solder joint region is connected to a second side of the crystallized region and a first portion of the circuit substrate A third side of the crystallographic region is connected to a third side of the circuit substrate. The upper surface of the image sensing wafer includes an image sensing area, a bearing area, and a a first conductive area and a first conductive area connected between a first side of the carrying area and a first side of the image sensing wafer, the second conductive area connecting the carrying area Between a second side and a second side of the image sensing chip, the carrying area surrounds the image sensing area, and a third side of the carrying area is connected to a first of the image sensing wafer "three sides", "the lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area" and "the first conductive area and the second conductive area of the image sensing wafer are respectively electrically First connected to the first solder joint area of the circuit substrate The second bond regions, the joint area of the filter element area corresponding to the carrier of the image sensing chip "technical solution to reduce the width of the image sensor chip or the size in the horizontal direction.

Another advantageous effect of the present invention is that the image capturing module provided by the present invention can pass the "the upper surface of the circuit substrate includes a crystallized area and a first solder joint area, and the first solder joint area is connected to Between a first side of the crystallized region and a first side of the circuit substrate, the upper surface of the image sensing wafer includes an image sensing region, a bearing region, and a first conductive region. The first conductive region is connected between a first side of the bearing region and a first side of the image sensing wafer, the bearing region surrounds the image sensing region, and “the lower surface of the filter element has a light-transmitting region and a connecting region surrounding the light-transmitting region and the first conductive region of the image sensing wafer electrically connected to the first solder joint region of the circuit substrate, the connection of the filter element The region corresponds to the technical solution of the bearing region of the image sensing wafer to reduce the width or size of the image sensing wafer in the horizontal direction.

To enable a better understanding of the features and technical content of this creation, please see below The detailed description and drawings of the present invention are provided for illustration and description only, and are not intended to limit the present invention.

Z‧‧‧ portable electronic device

P‧‧‧Portable electronic module

M‧‧‧Image Capture Module

1‧‧‧ circuit substrate

101‧‧‧ first side

102‧‧‧Second side

103‧‧‧ third side

104‧‧‧ fourth side

11‧‧‧ upper surface

12‧‧‧ Lower surface

13‧‧ ‧ crystallized area

131‧‧‧ first side

132‧‧‧Second side

133‧‧‧ third side

134‧‧‧ fourth side

14‧‧‧First solder joint area

141‧‧‧First pad

15‧‧‧second solder joint area

151‧‧‧Second pad

16‧‧‧ Third solder joint area

161‧‧‧ Third pad

2‧‧‧Image sensing wafer

201‧‧‧ first side

202‧‧‧Second side

203‧‧‧ third side

204‧‧‧ fourth side

21‧‧‧ upper surface

22‧‧‧Image sensing area

23‧‧‧bearing area

231‧‧‧ first side

232‧‧‧Second side

233‧‧‧ third side

234‧‧‧ fourth side

24‧‧‧First conductive area

241‧‧‧First Conductive Department

25‧‧‧Second conductive area

251‧‧‧Second Conductive Department

26‧‧‧ Third conductive area

261‧‧‧The third conductive part

3‧‧‧ Filter elements

31‧‧‧ lower surface

32‧‧‧Lighting area

33‧‧‧Connected area

4‧‧‧ lens assembly

41‧‧‧Support structure

42‧‧‧ lens structure

51‧‧‧First wire

52‧‧‧second wire

53‧‧‧ Third wire

6‧‧‧Adhesive

FIG. 1 is a cross-sectional view of the image capturing module of the first embodiment of the present invention.

2 is a top plan view of the circuit substrate of the first embodiment of the present invention.

3 is a top plan view of the image sensing wafer of the first embodiment of the present invention.

4 is a top plan view of the filter element of the first embodiment of the present invention.

FIG. 5 is a front elevational view showing the circuit substrate, the image sensing chip, and the filter element of the first embodiment of the present invention after being connected.

FIG. 6 is a schematic plan view of a circuit substrate according to a second embodiment of the present invention.

FIG. 7 is a top plan view of the image sensing wafer of the second embodiment of the present invention.

FIG. 8 is a top plan view showing the circuit substrate of the second embodiment of the present invention after being connected to the image sensing wafer.

FIG. 9 is a first top plan view of a circuit substrate according to a third embodiment of the present invention.

FIG. 10 is a first top plan view of the image sensing wafer of the third embodiment of the present invention.

FIG. 11 is a first top plan view showing the circuit substrate of the third embodiment after being connected to the image sensing wafer.

FIG. 12 is a second top plan view of the circuit substrate of the third embodiment of the present invention.

FIG. 13 is a second top plan view of the image sensing wafer of the third embodiment of the present invention.

FIG. 14 is a second top plan view showing the circuit substrate of the third embodiment of the present invention after being connected to the image sensing wafer.

FIG. 15 is a schematic diagram of a portable electronic device according to a fourth embodiment of the present invention.

The following is a specific embodiment to illustrate the implementation of the "image capture module and the portable electronic device" disclosed in the present disclosure. Those skilled in the art can understand the advantages and effects of the present disclosure from the contents disclosed in the present specification. . This creation can pass Various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of this creation are only for a simple illustration, and are not stated in advance according to the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", and the like may be used herein to describe various elements or signals, these elements or signals are not limited by these terms. These terms are primarily used to distinguish one element from another, or one signal and another. In addition, the term "or" as used herein may include a combination of any one or more of the associated listed items, depending on the actual situation.

[First Embodiment]

As shown in FIG. 1 to FIG. 5 , the first embodiment of the present invention provides an image capturing module M, which includes a circuit substrate 1 , an image sensing chip 2 , a filter element 3 , and a lens assembly 4 .

First, the circuit substrate 1 has an upper surface 11 and a lower surface 12. For example, the circuit substrate 1 may be a PCB hard board (such as BT, FR4, FR5 material), a soft and hard bonding board or a ceramic substrate, but the present invention is not limited by this example. Furthermore, the upper surface 11 of the circuit substrate 1 includes a morphing region 13, a first pad region 14, and a second pad region 15. The crystallized region 13 can be a solderless region. The first pad region 14 is connected between a first side 131 of the crystal region 13 and a first side 101 of the circuit substrate 1, and the second pad region 15 is connected to a second side of the crystal region 13. A side 132 is connected to a second side 102 of the circuit substrate 1 , and a third side 133 of the crystal region 13 is connected to a third side 103 of the circuit substrate 1 .

Furthermore, the image sensing wafer 2 is disposed on the upper surface 11 of the circuit substrate 1. Further, the upper surface 21 of the image sensing wafer 2 includes an image sensing area 22, a first carrying area 23, a first conductive area 24 and a second conductive area 25, the first conductive area 24 is connected between a first side 231 of the carrying area 23 and a first side 201 of the image sensing wafer 2. The second conductive region 25 is connected between a second side 232 of the carrying area 23 and a second side 202 of the image sensing wafer 2, and the carrying area 23 surrounds the image sensing area 22 and a third of the carrying area 23. The side 233 is connected to a third side 203 of the image sensing wafer 2. For example, the image sensing wafer 2 can be a complementary metal oxide semiconductor (CMOS) sensor or any sensor having an image capturing function, but the present invention is not limited by this example.

Therefore, the image sensing wafer 2 can be electrically connected to the first pad region 14 and the second pad region 15 of the circuit substrate 1 through the first conductive region 24 and the second conductive region 25, respectively.

The image capturing module M further includes a filter element 3 disposed on the image sensing wafer 2. For example, the filter element 3 can be directly disposed on the image sensing wafer 2 through the adhesive (as shown in FIG. 1), or the filter element 3 can be set up by a plurality of pillars (not shown). Above the image sensing wafer 2. In addition, the filter element 3 may be a coated glass or an uncoated glass, but the present invention is not limited by this example. In a further development, the lower surface 31 of the filter element 3 has a light-transmissive region 32 and a connection region 33 surrounding the light-transmissive region 32. The connection region 33 of the filter element 3 corresponds to the load-bearing region 23 of the image sensing wafer 2. . An adhesive 6 is disposed between the carrying area 23 and the connecting area 33 such that the filter element 3 is disposed on the carrying area 23 of the image sensing wafer 2 by the adhesive 6. For example, the adhesive 6 may be an adhesive made of epoxy or silicone, or may be a UV adhesive, a thermosetting adhesive or an AB adhesive. However, the present invention is not limited by this example.

In addition, the image capturing module M further includes a lens assembly 4 including a bracket structure 41 disposed on the circuit substrate 1 and a lens structure 42 disposed on the bracket structure 41. For example, the bracket structure 41 may be a common base or any kind of voice coil motor (VCM), and the lens structure 42 may be composed of a plurality of lenses, and the lens structure 42 corresponds to the image sensing area 22 . , And the lens structure 42 can be fixedly or movably disposed on the non-bracket structure 41 according to different usage requirements, but the present invention is not limited by this example. In addition, the bracket structure 41 may be disposed on the upper surface 101 of the circuit substrate 1 by an adhesive (not shown), but the present invention is not limited by this example.

In summary, since the two sides of the circuit substrate 1 and the image sensing wafer 2 can pass through the first pad region 14 , the second pad region 15 , and the first conductive region 24 and the second conductive region 25 , The circuit substrate 1 and the image sensing die 2 are electrically connected. Therefore, the width or size of the other sides of the circuit substrate 1 and the image sensing wafer 2 in the horizontal direction can be reduced. In other words, since the solder joint region and the conductive region can be omitted on the other sides of the circuit substrate 1 and the image sensing wafer 2, the width of the circuit substrate 1 and the image sensing wafer 2 in the horizontal direction (X direction) can be Being reduced. Thereby, the size of the wafer 2 in the horizontal direction is sensed by reducing the image.

Further, the first pad region 14 includes a plurality of first pads 141, the second pad region 15 includes a plurality of second pads 151, and the first conductive region 24 includes a plurality of first conductive portions 241, The second conductive portion 251 includes a plurality of second conductive portions 251. The first conductive portions 241 are electrically connected to the first pads 141 through the plurality of first wires 51, and the second conductive portions 251 pass through the first conductive pads 251. A plurality of second wires 52 are electrically connected to the second pads 151 . The first pad region 14 is disposed opposite the second pad region 15 . For example, a plurality of first pads 141 may be disposed on the first pad region 14 of the circuit substrate 1, and a plurality of second pads 151 may be disposed on the second pad region 15, and the image sensing wafer 2 is oppositely disposed. A plurality of first conductive portions 241 may be disposed on the first conductive region 24, and a plurality of second conductive portions 251 may be disposed on the second conductive region 25. Therefore, the plurality of first conductive portions 241 of the image sensing wafer 2 are electrically connected to the plurality of first pads 141 through the plurality of first wires 51, respectively, and the plurality of second conductive portions 251 respectively pass through the plurality of second wires 52 is electrically connected to the plurality of second pads 151.

It is worth mentioning that a fourth side 134 of the crystallized region 13 of the circuit substrate 1 is connected to a fourth side 104 of the circuit substrate 1 and a fourth side of the carrying area 23. 234 is coupled to a fourth side 204 of the image sensing wafer 2. The first side 101 of the circuit substrate 1 is disposed opposite to the second side 102, and the third side 103 of the circuit substrate 1 is disposed opposite to the fourth side 104. The first side 131 of the crystallized region 13 is disposed opposite to the second side 132, and the third side 133 of the crystallized region 13 is disposed opposite to the fourth side 134. The first side 201 of the image sensing wafer 2 is disposed opposite to the second side 202. The third side 203 of the image sensing wafer 2 is disposed opposite to the fourth side 204. The first side 231 of the carrying area 23 is disposed opposite to the second side 232, and the third side 233 of the carrying area 23 is disposed opposite to the fourth side 234. For example, the fourth side 134 of the seeding region 13 overlaps with the fourth side 104 of the circuit substrate 1, and the fourth side 234 of the carrying region 23 is connected to the fourth side 204 of the image sensing wafer 2 to overlap.

However, the above-mentioned examples are only one of the possible embodiments and are not intended to limit the creation.

[Second embodiment]

The image capture module M includes a circuit substrate 1, an image sensing chip 2, a filter element 3, and a lens assembly 4. 6 , 7 , 8 and 2 , 3 , 5 , the second embodiment of the present invention is different from the first embodiment in that the upper surface 11 of the circuit substrate 1 includes a third solder joint region 16 . The third pad region 16 is connected between a fourth side 104 of the crystal region 13 and a fourth side 104 of the circuit substrate 1. The upper surface 21 of the image sensing wafer 2 includes a third conductive region 26 that connects between a fourth side 234 of the carrier region 23 and a fourth side 204 of the image sensing wafer 2. The first conductive region 24 and the second conductive region 25 of the image sensing wafer 2 are electrically connected to the first pad region 14 and the second pad region 15 of the circuit substrate 1 respectively.

For example, the present invention can provide a third solder joint region 16 between the fourth side 104 of the crystallized region 13 and the fourth side 104 of the circuit substrate 1 according to different design requirements, and the image sensing wafer 2 Corresponding to the fourth side 234 of the carrying area 23 A third conductive region 26 is disposed between the fourth side 204 of the image sensing wafer 2. Further, a plurality of third pads 161 may be disposed on the third pad region 16 , and a plurality of third conductive portions 261 may be disposed on the third conductive region 26 of the image sensing wafer 2 . Therefore, the plurality of third conductive portions 261 of the image sensing wafer 2 are electrically connected to the plurality of third pads 161 through the plurality of third wires 53 respectively.

However, the above-mentioned examples are only one of the possible embodiments and are not intended to limit the creation.

[Third embodiment]

The image capture module M includes a circuit substrate 1, an image sensing chip 2, a filter element 3, and a lens assembly 4. 9 , 10 , 11 and 2 , 3 , 5 , the third embodiment of the present invention is different from the first embodiment in that the upper surface 11 of the circuit substrate 1 includes a crystallized region 13 and a first The solder joint region 14 is connected between a first side 131 of the crystal region 13 and a first side 101 of the circuit substrate 1. The upper surface 21 of the image sensing chip 2 includes an image sensing area 22, a bearing area 23, and a first conductive area 24. The first conductive area 24 is connected between a first side 231 of the carrying area 23 and a sense of image. A first side 201 of the wafer 2 is measured, and the carrying area 23 surrounds the image sensing area 22. The first conductive region 24 of the image sensing wafer 2 is electrically connected to the first pad region 14 of the circuit substrate 1 . The first pad portion 14 includes a plurality of first pads 141. The first conductive portion 241 includes a plurality of first conductive portions 241. The first conductive portions 241 are electrically connected to each other through a plurality of first wires 51. The first pads 141.

For example, the present invention can provide a first solder joint region 14 between the first side 131 of the crystallized region 13 and the first side 101 of the circuit substrate 1 according to different design requirements, and corresponding to the load bearing region. A first conductive region 24 is disposed between the first side 231 of the 23 and the first side 201 of the image sensing wafer 2. That is to say, the image capturing module M of the present invention can be provided with solder joints on one side of the circuit substrate 1. And electrically connecting the circuit substrate 1 to the image sensing chip 2 so that at least two sides of the circuit substrate 1 and the image sensing wafer 2 are horizontally disposed. The width or size in the direction can be reduced.

Furthermore, with reference to FIG. 12 to FIG. 14, another variation of the image capturing module M of the third embodiment of the present invention is shown. Further, the image sensing chip 2 of the image capturing module M of the fifth embodiment of the present invention can be designed to be eccentric. For example, the upper surface 11 of the circuit substrate 1 of the image capturing module M includes a third pad region 16 , and the third pad region 16 is connected to a fourth side 104 of the crystal region 13 and the circuit substrate 1 . Between the fourth side 104 of the image sensing wafer 2, the upper surface 21 of the image sensing wafer 2 includes a third conductive region 26, and the third conductive region 26 is connected to a fourth side 234 of the bearing region 23 and image sensing. Between a fourth side 204 of the wafer 2. A plurality of third pads 161 may be disposed on the third pad region 16 , and a plurality of third conductive portions 261 may be disposed on the third conductive region 26 of the image sensing wafer 2 . Therefore, the plurality of third conductive portions 261 of the image sensing wafer 2 are electrically connected to the plurality of third pads 161 through the plurality of third wires 53 respectively.

However, the above-mentioned examples are only one of the possible embodiments and are not intended to limit the creation.

[Fourth embodiment]

Referring to FIG. 15 and FIG. 1 to FIG. 14 , the fourth embodiment of the present invention provides a portable electronic device Z, which includes: a portable electronic module P and an image capturing module M. . The image capturing module M is disposed on the portable electronic module. The image capturing module M includes a circuit substrate 1, an image sensing chip 2, a filter element 3, and a lens assembly 4. For example, the portable electronic module P can be a mobile phone, a notebook computer or a tablet computer. However, the present invention is not limited by this example; and any image capturing module in the first embodiment to the fourth embodiment The group M can be installed in the portable electronic module P, so the electronic module P can pass through the image. Take module M for image capture. However, the above-mentioned examples are only one of the possible embodiments and are not intended to limit the creation.

[Advantageous Effects of Embodiments]

One of the beneficial effects of the present invention is that the image capturing module and the portable electronic device provided by the present invention can pass the "upper surface 11 of the circuit substrate 1 including a crystallizing region 13 and a first solder joint region 14 And a second solder joint region 15. The crystal region 13 can be a solderless region. The first solder joint region 14 is connected to a first side 131 of the crystal region 13 and a first side of the circuit substrate 1. Between the 101, the second solder joint region 15 is connected between a second side 132 of the crystallized region 13 and a second side 102 of the circuit substrate 1, and a third side 133 of the crystal region 13 is connected. On the third side 103 ′′ of the circuit substrate 1 , “the upper surface 21 of the image sensing chip 2 includes an image sensing area 22 , a bearing area 23 , a first conductive area 24 , and a second conductive area 25 . The first conductive region 24 is connected between a first side 231 of the carrying area 23 and a first side 201 of the image sensing chip 2, and the second conductive area 25 is connected to a second side 232 of the carrying area 23. Between the second side 202 of the sensing wafer 2, the carrying area 23 surrounds the image sensing area 22, the carrying area A third side 233 of the field 23 is connected to a third side 203" of the image sensing wafer 2, "the lower surface 31 of the filter element 3 has a light transmissive area 32 and a connection area surrounding the light transmissive area 32. 33" and "the first conductive region 24 and the second conductive region 25 are electrically connected to the first pad region 14 and the second pad region 15 of the circuit substrate 1, respectively, and the connection region 33 of the filter element 3 corresponds to the image sense. The technical solution of the bearing area 23" of the wafer 2 is measured to reduce the width or size of the image sensing wafer in the horizontal direction.

Another advantageous effect of the present invention is that the image capturing module provided by the present invention can pass the "upper surface 11 of the circuit substrate 1 including a crystallizing region 13 and a first solder joint region 14, the first solder joint region. 14 is connected between a first side 131 of the crystallized region 13 and a first side 101 of the circuit substrate 1", "image sensing crystal The upper surface 21 of the sheet 2 includes an image sensing area 22, a carrying area 23 and a first conductive area 24. The first conductive area 24 is connected between a first side 231 of the carrying area 23 and the image sensing wafer 2. a first side 201, the carrying area 23 surrounds the image sensing area 22", "the lower surface 31 of the filter element 3 has a light transmitting area 32 and a connecting area 33 surrounding the light transmitting area 32" and "image sense" The first conductive region 24 of the test wafer 2 is electrically connected to the first pad region 14 of the circuit substrate 1, and the connection region 33 of the filter element 3 corresponds to the technical solution of the bearing region 23" of the image sensing wafer 2 to be reduced. The image senses the width or size of the wafer in the horizontal direction.

Furthermore, the image capturing module M and the portable electronic device Z of the present invention are compared with the prior art, since at least one side of the circuit substrate 1 and the image sensing wafer 2 can pass through the first solder joint region. 14 and the first conductive region 24 to electrically connect the circuit substrate 1 and the image sensing wafer 2, so that the width or size of the circuit substrate 1 and at least two sides of the image sensing wafer 2 in the horizontal direction can be reduced. . In other words, since at least one side of the circuit substrate 1 and the image sensing wafer 2 can be omitted from arranging the solder joint region and the conductive region, the width of the circuit substrate 1 and the image sensing wafer 2 in the horizontal direction (X direction) can be reduce. Thereby, the size of the wafer 2 in the horizontal direction is sensed by reducing the image.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the content of the schema are included in the application for this creation. Within the scope of the patent.

Claims (10)

An image capturing module includes: a circuit substrate having an upper surface and a lower surface; an image sensing wafer disposed on the upper surface of the circuit substrate; a filter element disposed at the An image sensing wafer; and a lens assembly including a support structure disposed on the circuit substrate and a lens structure disposed on the support structure; wherein the upper surface of the circuit substrate includes a crystallized area, a solder joint region and a second solder joint region, wherein the first solder joint region is connected between a first side of the crystallized region and a first side of the circuit substrate, and the second solder joint region is connected A third side of the crystallographic region is connected to a third side of the circuit substrate between a second side of the crystallized region and a second side of the circuit substrate; wherein the image The upper surface of the sensing wafer includes an image sensing area, a bearing area, a first conductive area and a second conductive area, the first conductive area connecting between a first side of the carrying area and the image sense One of the test wafers a second conductive area is connected between a second side of the carrying area and a second side of the image sensing chip, the carrying area surrounding the image sensing area, the first of the carrying area The third side is connected to a third side of the image sensing chip; wherein the lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area; wherein the image sensing chip The first conductive region and the second conductive region are respectively electrically connected to the first pad region and the second pad region of the circuit substrate, and the connection region of the filter component corresponds to the image sensing chip The bearer area. The image capturing module of claim 1, wherein the first solder joint area comprises a plurality of first pads, the second pad region includes a plurality of second pads, the first conductive region includes a plurality of first conductive portions, and the second conductive region includes a plurality of second conductive portions, the plurality of Each of the conductive portions is electrically connected to the first pads through a plurality of first wires, and the second conductive portions are electrically connected to the pads by a plurality of second wires respectively; wherein the first portion a solder joint area is disposed opposite to the second solder joint area, and an adhesive is disposed between the load bearing area and the connection area, so that the filter element is disposed on the load bearing area of the image sensing wafer through the adhesive on. The image capturing module of claim 1, wherein a fourth side of the crystallizing area is connected to a fourth side of the circuit substrate, and a fourth side of the carrying area is connected to the image Sensing a fourth side of the wafer; wherein the first side of the circuit substrate is opposite to the second side, and the third side of the circuit substrate is opposite to the fourth side; The first side of the crystallized region is disposed opposite to the second side, and the third side of the crystallized region is disposed opposite to the fourth side; wherein the first side of the image sensing wafer Opposite the second side, the third side of the image sensing wafer is disposed opposite to the fourth side; wherein the first side of the carrying area is opposite to the second side, The third side of the carrying area is disposed opposite to the fourth side. The image capturing module of claim 1, wherein the upper surface of the circuit substrate includes a third pad region, the third pad region is connected to a fourth side of the crystal region and the circuit a fourth side of the substrate; wherein the upper surface of the image sensing wafer includes a third conductive region, the third conductive region connecting a fourth side of the carrying region and one of the image sensing wafer The first conductive region and the second conductive region of the image sensing wafer are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively. A portable electronic device includes: a portable electronic module; and an image capturing module disposed on the portable electronic module, the image capturing The module includes: a circuit substrate having an upper surface and a lower surface; an image sensing wafer disposed on the upper surface of the circuit substrate; a filter element disposed on the image sensing wafer; And a lens assembly comprising: a support structure disposed on the circuit substrate; and a lens structure disposed on the support structure; wherein the upper surface of the circuit substrate includes a crystallized area, a first solder joint area, and a a second solder joint region, the first solder joint region is connected between a first side of the crystallized region and a first side of the circuit substrate, and the second solder joint region is connected to the crystallized region a third side of the crystal substrate is connected to a third side of the circuit substrate; wherein the image sensing wafer is on the upper surface An image sensing area, a bearing area, a first conductive area, and a second conductive area, the first conductive area connecting between a first side of the carrying area and a first of the image sensing chip Side, the second An electrical area is connected between a second side of the carrying area and a second side of the image sensing chip, the carrying area surrounding the image sensing area, a third side of the carrying area is connected to the image Sensing a third side of the wafer; wherein a lower surface of the filter element has a light transmissive area and a connection area surrounding the light transmissive area; wherein the first conductive area of the image sensing wafer is The second conductive regions are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively, and the connection region of the filter component corresponds to the bearing region of the image sensing wafer. The portable electronic device of claim 5, wherein the first pad region comprises a plurality of first pads, the second pad region comprises a plurality of second pads, the first conductive region comprising First conductive portions, the second conductive region includes a plurality of second The first conductive portion is electrically connected to the first pads through the plurality of first wires, and the second conductive portions are electrically connected to the pads through the plurality of second wires respectively. Wherein the first solder joint area is disposed opposite to the second solder joint area, and an adhesive is disposed between the load bearing area and the connection area, so that the filter element is disposed in the image sense through the adhesive The load bearing area of the wafer is measured. The portable electronic device of claim 5, wherein a fourth side of the seeding region is connected to a fourth side of the circuit substrate, and a fourth side of the carrying region is connected to the image Sensing a fourth side of the wafer; wherein the first side of the circuit substrate is opposite to the second side, and the third side of the circuit substrate is opposite to the fourth side; The first side of the crystallized region is disposed opposite to the second side, and the third side of the crystallized region is disposed opposite to the fourth side; wherein the first side of the image sensing wafer Opposite the second side, the third side of the image sensing wafer is disposed opposite to the fourth side; wherein the first side of the carrying area is opposite to the second side, The third side of the carrying area is disposed opposite to the fourth side. The portable electronic device of claim 5, wherein the upper surface of the circuit substrate includes a third pad region, the third pad region is connected to a fourth side of the crystal region and the circuit a fourth side of the substrate; wherein the upper surface of the image sensing wafer includes a third conductive region, the third conductive region connecting a fourth side of the carrying region and one of the image sensing wafer The first conductive region and the second conductive region of the image sensing wafer are electrically connected to the first pad region and the second pad region of the circuit substrate, respectively. An image capturing module includes: a circuit substrate having an upper surface and a lower surface; an image sensing wafer disposed on the upper surface of the circuit substrate; a filter element disposed at the Image sensing on the wafer; A lens assembly includes a support structure disposed on the circuit substrate and a lens structure disposed on the support structure; wherein an upper surface of the circuit substrate includes a crystallized area and a first solder joint area, the first A solder joint region is connected between a first side of the crystallized region and a first side of the circuit substrate; wherein the upper surface of the image sensing wafer includes an image sensing region, a bearing region, and a first conductive region connecting a first side of the bearing region and a first side of the image sensing wafer, the bearing region surrounding the image sensing region; wherein the filter The lower surface of the optical component has a light-transmitting region and a connecting region surrounding the light-transmitting region; wherein the first conductive region of the image sensing wafer is electrically connected to the first soldering region of the circuit substrate, The connection region of the filter element corresponds to the load bearing region of the image sensing wafer. The image capturing module of claim 9, wherein the first pad region comprises a plurality of first pads, the first conductive region comprises a plurality of first conductive portions, and the first conductive portions respectively pass The plurality of first wires are electrically connected to the first pads; wherein an adhesive is disposed between the bearing region and the connecting region, so that the filter element is disposed in the image sense through the adhesive The load bearing area of the wafer is measured.