TWM623230U - Portable electronic device and image-capturing module thereof - Google Patents

Abstract

The present invention discloses a portable electronic device and an image capturing module thereof. The image capturing module includes a circuit substrate, an image sensing chip, a rigid reinforcing structure and a lens assembly. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. The image sensing chip includes an image sensing area and a plurality of chip conductive contacts that are respectively electrically connected to the plurality of substrate conductive contacts. The rigid reinforcement structure is arranged on the circuit substrate. The lens assembly includes a lens support and a lens structure disposed on the lens support, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. The vertical projections of the plurality of substrate conductive contacts and the plurality of chip conductive contacts fall on the rigid reinforcement structure, thereby increasing the structural strength and surface flatness of a predetermined area of the circuit substrate.

Description

Portable electronic device and image capture module thereof

The present invention relates to a portable electronic device and an image capture module thereof, in particular, to an image capture module for increasing the structural strength and surface flatness of a circuit substrate, and an image capture module using the image capture module. Portable electronic device.

In the prior art, when a circuit substrate for carrying an image sensing chip is bent, the electrical connection between the image sensing chip and the circuit substrate will be damaged, resulting in a short circuit phenomenon.

The technical problem to be solved by this creation is to provide a portable electronic device and an image capture module thereof in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted in this creation is to provide an image capture module, which includes: a circuit substrate, an image sensor chip, a rigid reinforcement structure and a lens assembly. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. The image sensing chip includes an image sensing area and a plurality of chip conductive contacts that are respectively electrically connected to the plurality of substrate conductive contacts. The rigid reinforcement structure is arranged on the circuit substrate. The lens assembly includes a lens support and a lens structure disposed on the lens support, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. The vertical projections of the plurality of substrate conductive contacts and the plurality of wafer conductive contacts all fall on the rigid reinforcement structure.

In order to solve the above-mentioned technical problems, another technical solution adopted in this creation is to provide a portable electronic device. The portable electronic device uses an image capture module, wherein the image capture module includes: a A circuit substrate, an image sensing chip, a rigid reinforcing structure and a lens assembly. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. The image sensing chip includes an image sensing area and a plurality of chip conductive contacts that are respectively electrically connected to the plurality of substrate conductive contacts. The rigid reinforcement structure is arranged on the circuit substrate. The lens assembly includes a lens support and a lens structure disposed on the lens support, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. The vertical projections of the plurality of substrate conductive contacts and the plurality of wafer conductive contacts all fall on the rigid reinforcement structure.

Furthermore, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole connected to the upper surface and the lower surface. A plurality of the substrate conductive contacts are arranged on the lower surface of the circuit substrate, the image sensing chip is arranged on the lower surface of the circuit substrate, and a plurality of the image sensing chips are arranged on the lower surface of the circuit substrate. The chip conductive contacts are respectively electrically connected to the plurality of substrate conductive contacts of the circuit substrate through flip-chip bonding. The rigid reinforcement structure is circumferentially disposed on the upper surface of the circuit substrate and surrounds the through hole, and the lens holder of the lens assembly is adhered to the rigid reinforcement structure through an adhesive layer . The rigid reinforcement structure has an outer periphery, and the outer periphery of the rigid reinforcement structure is covered by the lens holder or exposed by the lens holder. The upper surface of the circuit substrate has a surrounding clearance area connected to and surrounding the through via, and the surrounding clearance area of the upper surface of the circuit substrate is protected by the rigidity The reinforcement structure is surrounded by and exposed by the rigid reinforcement structure. The lower surface of the circuit substrate has a surrounding contact area surrounding the through-hole and used to carry a plurality of the substrate conductive contacts, and the upper surface of the circuit substrate has a surrounding clearance surrounding the surrounding area and corresponds to a structural strengthening area surrounding the contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening area of the circuit substrate and The structural strength and surface flatness of both the surrounding joint areas.

Furthermore, the circuit substrate has an upper surface and a lower surface opposite to the upper surface. A plurality of the substrate conductive contacts are arranged on the upper surface of the circuit substrate, the image sensing chip is arranged on the upper surface of the circuit substrate, and a plurality of the image sensing chips are arranged on the upper surface of the circuit substrate. The chip conductive contacts are respectively electrically connected to a plurality of the substrate conductive contacts of the circuit substrate through wire bonding. The rigid reinforcing structure is disposed on the lower surface of the circuit substrate, the lens holder of the lens assembly is adhered to the circuit substrate through an adhesive layer, and the vertical projection of the lens holder of the lens assembly falls. on rigid reinforced structures. The upper surface of the circuit substrate has a surrounding contact area surrounding the image sensing chip and used to carry a plurality of conductive contacts of the substrate, and the lower surface of the circuit substrate has a corresponding area corresponding to the A structural strengthening area surrounding the contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening area and the surrounding contact area of the circuit substrate Both structural strength and surface flatness.

One of the beneficial effects of the present invention is that a portable electronic device and an image capture module thereof provided by the present invention can be arranged on a circuit substrate through "a rigid reinforcing structure" and "a plurality of substrate conductive contacts and The vertical projections of the plurality of chip conductive contacts all fall on the rigid reinforcing structure", which is used to increase the structural strength and surface flatness of a predetermined area of the circuit substrate.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the provided drawings are only for reference and description, and are not intended to limit this creation.

The following is a description of the implementation of the "portable electronic device and its image capture module" disclosed in this creation through specific specific embodiments. Those skilled in the art can understand the advantages and disadvantages of this creation from the content disclosed in this specification. Effect. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, it should be stated in advance that the drawings of this creation are only for simple schematic illustration, and are not drawn according to the actual size. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Referring to FIG. 1 to FIG. 10, the present invention provides an image capture module M and a portable electronic device P using the image capture module M, and the image capture module M includes a circuit substrate 1, a The image sensing chip 2 , a rigid reinforcing structure 3 and a lens assembly 4 . Furthermore, the circuit substrate 1 has a plurality of substrate conductive contacts 11 . The image sensing chip 2 is disposed on the circuit substrate 1 and is electrically connected to the circuit substrate 1, and the image sensing chip 2 includes an image sensing area 21 and a plurality of chips electrically connected to the plurality of substrate conductive contacts 11 respectively Conductive contacts 22 . The rigid reinforcement structure 3 is provided on the circuit board 1 . The lens assembly 4 includes a lens support 41 and a lens structure 42 disposed on the lens support 41 , and the lens structure 42 of the lens assembly 4 corresponds to the image sensing area 21 of the image sensing chip 2 . It is worth noting that the vertical projections of the plurality of substrate conductive contacts 11 and the plurality of wafer conductive contacts 22 all fall on the rigid reinforcement structure 3 .

Thereby, a portable electronic device P and its image capture module M provided by the present invention can be disposed on the circuit substrate 1 through the "rigid reinforcement structure 3" and "a plurality of substrate conductive contacts 11 and a plurality of chips" The vertical projection of the conductive contacts 22 all fall on the rigid reinforcement structure 3”, so as to increase a predetermined area of the circuit substrate 1 (especially the circuit substrate 1 for carrying or arranging a plurality of substrate conductive contacts 11). area) structural strength and surface flatness.

[First Embodiment]

Referring to FIG. 1 and FIG. 2 , the first embodiment of the present invention provides an image capture module M, which includes: a circuit substrate 1 , an image sensing chip 2 , and a rigid reinforcement structure 3 (or a rigid reinforcement structure) , or an elastic reinforced structure, or a toughened reinforced structure) and a lens assembly 4 .

First, as shown in FIG. 1 , the circuit board 1 has a plurality of board conductive contacts 11 . In addition, the image sensing chip 2 is disposed on the circuit substrate 1 and is electrically connected to the circuit substrate 1 , and the image sensing chip 2 includes an image sensing area 21 and a plurality of conductive contacts 11 respectively electrically connected to the substrate. A wafer conductive contact 22 . For example, the circuit substrate 1 has an upper surface 101 , a lower surface 102 opposite to the upper surface 101 , and a through hole 103 connected to the upper surface 101 and the lower surface 102 . The plurality of substrate conductive contacts 11 may be disposed on the lower surface 102 of the circuit substrate 1 , the image sensing chip 2 may be disposed on the lower surface 102 of the circuit substrate 1 , and the plurality of chip conductive contacts 22 of the image sensing chip 2 The plurality of substrate conductive contacts 11 of the circuit substrate 1 may be electrically connected to the circuit substrate 1 by flip-chip bonding through a plurality of conductive materials (not labeled, such as solder balls or solder paste). However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

Furthermore, as shown in FIG. 1 and FIG. 2 , the rigid reinforcing structure 3 is provided on the circuit board 1 . In addition, the lens assembly 4 includes a lens support 41 and a lens structure 42 disposed on the lens support 41 , and the lens structure 42 of the lens assembly 4 corresponds to the image sensing area 21 of the image sensing chip 2 . For example, the rigid reinforcing structure 3 can be made of rubber, silicone rubber or any material with a rigidity enhancing effect, and the rigid reinforcing structure 3 can also be made of conductive material. In addition, the rigid reinforcement structure 3 can be circumferentially disposed on the upper surface 101 of the circuit substrate 1 and surround the through hole 103 , and the lens holder 41 of the lens assembly 4 can be adhered to the rigid reinforcement structure 3 through an adhesive layer H in a surrounding manner , so the lens assembly 4 can improve the structural stability of the lens holder 41 through the rigid reinforcement structure 3 . In this way, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance that the circuit substrate 1 is bent and separated from the image capturing module M. As shown in FIG. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

It is worth noting that, for example, as shown in FIG. 1 and FIG. 2 , the rigid reinforcement structure 3 has an outer periphery 300 , and the outer periphery 300 of the rigid reinforcement structure 3 is covered by the lens holder 41 (not shown) Or exposed by the lens holder 41 (as shown in FIG. 1 ). That is to say, as long as the vertical projections of the plurality of substrate conductive contacts 11 and the plurality of wafer conductive contacts 22 can all fall on the rigid reinforcement structure 3, the outermost surrounding portion of the rigid reinforcement structure 3 can be reduced inward to be captured by the lens. The bracket 41 is covered (not shown in the figure) or can extend outward and be exposed by the lens bracket 41 (as shown in FIG. 1 ). In addition, the upper surface 101 of the circuit substrate 1 has a surrounding clearance area 1011 connected to the through-hole 103 and surrounding the through-hole 103 , and the surrounding clearance area 1011 of the upper surface 101 of the circuit substrate 1 is surrounded by the rigid reinforcement structure 3 And it is exposed by the rigid reinforcement structure 3 . In addition, the lower surface 102 of the circuit substrate 1 has a surrounding contact area 1021 surrounding the through holes 103 and used to carry a plurality of substrate conductive contacts 11 , and the upper surface 101 of the circuit substrate 1 has a surrounding surrounding clearance area 1011 corresponding to A structurally reinforced area 1012 surrounding the contact area 1021, and all or a part of the rigid reinforcement structure 3 is disposed on the structurally strengthened area 1012, so as to increase the structural strengthening area 1012 of the circuit substrate 1 and the surrounding area of the contact area 1021. Structural strength and surface flatness, so that each conductive material can be reinforced by the rigid reinforcing structure 3 to reduce the circuit substrate 1 being bent and detached from the corresponding substrate conductive contacts 11 and the corresponding chip conductive contacts. 22 chances. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

For example, as shown in FIG. 1 and FIG. 2 , the image capture module M provided by the first embodiment of the present invention further includes: a filter element 5 , and the filter element 5 is disposed on the image sensor chip 2 , so as to correspond to the image sensing area 21 of the image sensing chip 2 . It is worth noting that when the filter element 5 is disposed on the image sensing wafer 2, the filter element 5 will be completely accommodated in the through hole 103 of the circuit substrate 1. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[Second Embodiment]

Referring to FIG. 3 , a second embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , a rigid reinforcing structure 3 and a lens assembly 4 . As can be seen from the comparison between FIG. 3 and FIG. 1 , the main difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the filter element 5 is arranged on the circuit substrate 1 to correspond to the image sensor. The image sensing area 21 of the wafer 2 is measured. When the filter element 5 is disposed on the circuit substrate 1 , the through hole 103 of the circuit substrate 1 will be closed by the filter element 5 . That is to say, according to different requirements, the filter element 5 can be disposed on the image sensing chip 2 (as shown in the first embodiment in conjunction with FIG. 1 ), or disposed on the circuit substrate 1 (as shown in the second embodiment in conjunction with the diagram) 3 shown).

[Third Embodiment]

Referring to FIG. 4 and FIG. 5 , a third embodiment of the present invention provides an image capture module M, which includes: a circuit substrate 1 , an image sensor chip 2 , a rigid reinforcement structure 3 and a lens assembly 4 . It can be seen from the comparison between FIG. 4 and FIG. 1 that the main difference between the third embodiment of the present invention and the first embodiment is that the image capture module M provided by the third embodiment of the present invention further includes: a plurality of first Electronic component 6A, a plurality of second electronic components 6B, a first metal shield 7A, a second metal shield 7B, a first insulating filler 8A, a second insulating filler 8B, and an image capture module M .

Furthermore, as shown in FIG. 4 and FIG. 5 , a plurality of first electronic components 6A are arranged on the circuit substrate 1 and are electrically connected to the circuit substrate 1 , and a plurality of second electronic components 6B are arranged on the circuit substrate 1 . And it is electrically connected to the circuit substrate 1 . In addition, a first metal shield 7A is provided on the circuit substrate 1 for covering a plurality of first electronic components 6A, and a second metal shield 7B is provided on the circuit substrate 1 for covering a plurality of second electronic components 6A Element 6B. In addition, the first insulating filler 8A is provided on the circuit substrate 1 and is connected between the lens holder 41 and the first metal shield 7A, and the second insulating filler 8B is provided on the circuit substrate 1 and connected between the lens holder 41 and the first metal shield 7A. between the second metal shields 7B. Thereby, when the lens holder 41 of the lens assembly 4 is disposed between the first metal shielding member 7A and the second metal shielding member 7B, the lens holder 41 of the lens assembly 4 can be tightly connected to the first insulating filler 8A and the second metal shielding member 7B. Between the two insulating fillers 8B, to increase the fastness of the lens holder 41 of the lens assembly 4 being fixed on the rigid reinforcement structure 3 , so that the lens assembly 4 can be lowered by the reinforcement of the rigid reinforcement structure 3 . There is a chance that the circuit substrate 1 is detached from the image capturing module M due to being bent.

[Fourth Embodiment]

Referring to FIG. 6 , a fourth embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , a rigid reinforcing structure 3 and a lens assembly 4 . It can be seen from the comparison between FIG. 6 and FIG. 1 that the main difference between the fourth embodiment of the present invention and the first embodiment is that in the fourth embodiment, the image sensing chip 2 is disposed on the upper surface 101 of the circuit substrate 1, And the plurality of chip conductive contacts 22 of the image sensor chip 2 are electrically connected to the plurality of substrate conductive contacts 11 of the circuit substrate 1 by wire bonding through a plurality of conductive wires (not numbered). For example, the rigid reinforcement structure 3 is disposed on the lower surface 102 of the circuit substrate 1 in a "no through-hole" manner, and the lens holder 41 of the lens assembly 4 can be adhered to the circuit substrate 1 through an adhesive layer H. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

Furthermore, as shown in FIG. 6 , the upper surface 101 of the circuit substrate 1 has a surrounding contact area 1021 surrounding the image sensor chip 2 and used for carrying a plurality of substrate conductive contacts 11 . 102 has a structural reinforcement area 1012 corresponding to the surrounding contact area 1021, and all or a part of the rigid reinforcement structure 3 is disposed on the structural reinforcement area 1012, so as to increase the structural reinforcement area 1012 of the circuit substrate 1 and the surrounding contact area 1021 The structural strength and surface flatness of both.

It is worth noting that, as shown in FIG. 6 , the vertical projection of the lens holder 41 of the lens assembly 4 will fall on the rigid reinforcement structure 3 (especially a surrounding shape where the lens holder 41 is adhered to the circuit substrate 1 through the adhesive layer H). The vertical projection of the support leg portion will fall on the rigid reinforcement structure 3 ), so the lens assembly 4 can improve the structural stability of the lens holder 41 through the rigid reinforcement structure 3 . In this way, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance that the circuit substrate 1 is bent and separated from the image capturing module M. As shown in FIG.

[Fifth Embodiment]

Referring to FIG. 7 , a fifth embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , a rigid reinforcing structure 3 and a lens assembly 4 . It can be seen from the comparison between FIG. 7 and FIG. 6 that the main difference between the fifth embodiment of the present invention and the fourth embodiment is that: in the fifth embodiment, the rigid reinforcing structure 3 is arranged on the circuit in a “through-hole manner” on the lower surface 102 of the substrate 1 . That is to say, according to different requirements, the rigid reinforcement structure 3 disposed on the lower surface 102 of the circuit substrate 1 may adopt a complete rigid reinforcement structure (as shown in FIG. 6 in the fourth embodiment) or a surrounding Rigid reinforcement structure (as shown in the fifth embodiment in conjunction with Figure 7).

[Sixth Embodiment]

Referring to FIG. 8 , a sixth embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , a rigid reinforcing structure 3 and a lens assembly 4 . It can be seen from the comparison between FIG. 8 and FIG. 6 that the main difference between the sixth embodiment of the present invention and the fourth embodiment is that in the sixth embodiment, the circuit substrate 1 has a through-hole connected to the upper surface 101 and the lower surface 102 The hole 103 is formed, and the image sensing chip 2 is accommodated in the through hole 103 and disposed on the rigid reinforcement structure 3 . For example, when the rigid reinforcement structure 3 can be made of conductive material, the image sensor chip 2 can improve its heat dissipation effect through the rigid reinforcement structure 3 .

[Seventh Embodiment]

Referring to FIGS. 9 and 10 , a seventh embodiment of the present invention provides an image capture module M, which includes: a circuit substrate 1 , an image sensor chip 2 , a rigid reinforcement structure 3 and a lens assembly 4 . It can be seen from the comparison between FIG. 9 and FIG. 6 that the main difference between the seventh embodiment of the present invention and the fourth embodiment is that the image capture module M provided by the seventh embodiment of the present invention further includes: a plurality of first Electronic component 6A, a plurality of second electronic components 6B, a first metal shield 7A, a second metal shield 7B, a first insulating filler 8A, a second insulating filler 8B, and an image capture module M .

Furthermore, as shown in FIG. 9 and FIG. 10 , a plurality of first electronic components 6A are arranged on the circuit substrate 1 and are electrically connected to the circuit substrate 1 , and a plurality of second electronic components 6B are arranged on the circuit substrate 1 . And it is electrically connected to the circuit substrate 1 . In addition, a first metal shield 7A is provided on the circuit substrate 1 for covering a plurality of first electronic components 6A, and a second metal shield 7B is provided on the circuit substrate 1 for covering a plurality of second electronic components 6A Element 6B. In addition, the first insulating filler 8A is provided on the circuit substrate 1 and is connected between the lens holder 41 and the first metal shield 7A, and the second insulating filler 8B is provided on the circuit substrate 1 and connected between the lens holder 41 and the first metal shield 7A. between the second metal shields 7B. Thereby, when the lens holder 41 of the lens assembly 4 is disposed between the first metal shielding member 7A and the second metal shielding member 7B, the lens holder 41 of the lens assembly 4 can be tightly connected to the first insulating filler 8A and the second metal shielding member 7B. Between the two insulating fillers 8B, to increase the fastness of the lens bracket 41 of the lens assembly 4 being fixed on the rigid reinforcement structure 3 , so that the lens assembly 4 can be lowered by the reinforcement of the rigid reinforcement structure 3 . There is a chance that the circuit substrate 1 is detached from the image capturing module M due to being bent.

[Eighth Embodiment]

Referring to FIG. 11 , an eighth embodiment of the present invention provides a portable electronic device P, and the portable electronic device P can use an image capture module M. As shown in FIG. For example, the image capturing module M used by the portable electronic device P may be any image capturing module M in the first embodiment to the seventh embodiment. In addition, the portable electronic device P may be a notebook computer, a tablet computer or a desktop computer. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that a portable electronic device P and an image capturing module M thereof provided by the present invention can be disposed on the circuit substrate 1 through the "rigid reinforcement structure 3" and "a plurality of substrates" The vertical projections of the conductive contacts 11 and the plurality of chip conductive contacts 22 all fall on the rigid reinforcement structure 3", so as to increase a predetermined area of the circuit substrate 1 (especially the circuit substrate 1 for carrying or arranging The structural strength and surface flatness of a plurality of substrate conductive contacts 11 ).

Furthermore, all or a part of the rigid reinforcing structure 3 is disposed on the structurally reinforced area 1012 to increase the structural strength and surface flatness of the structurally reinforced area 1012 and the surrounding contact area 1021 of the circuit substrate 1 . This enables each conductive material to be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit substrate 1 being bent away from the corresponding substrate conductive contacts 11 and the corresponding chip conductive contacts 22 .

Furthermore, since the lens assembly 4 can enhance the structural stability of the lens holder 41 through the rigid reinforcement structure 3, the lens assembly 4 can be reinforced through the rigid reinforcement structure 3 to reduce the loss of separation from the image capture due to the circuit substrate 1 being bent. Chance to take mod M.

Furthermore, the lens holder 41 of the lens assembly 4 can be tightly connected between the first insulating filler 8A and the second insulating filler 8B, so as to increase the lens holder 41 of the lens assembly 4 to be fixed on the rigid reinforcing structure 3 . Therefore, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit substrate 1 being detached from the image capturing module M due to bending.

The contents disclosed above are only the preferred and feasible embodiments of this creation, and are not intended to limit the scope of the patent application of this creation. Therefore, any equivalent technical changes made by using the descriptions and drawings of this creation are included in the application for this creation. within the scope of the patent.

P: Portable Electronic Device M: Image capture module 1: circuit board 101: Upper surface 1011: Around Clearance Area 1012: Structural Strengthening Areas 102: Lower surface 1021: Around the joint area 103: Through hole 11: Substrate conductive contacts 2: Image sensor chip 21: Image sensing area 22: Chip conductive contacts 3: Rigid reinforcement structure 300: Outer surrounds 4: Lens assembly 41: Lens holder 42: Lens Structure H: adhesive layer 5: filter element 6A: The first electronic component 6B: Second electronic component 7A: First metal shield 7B: Second metal shield 8A: First insulating filler 8B: Second insulating filler

FIG. 1 is a schematic cross-sectional view of an image capturing module according to a first embodiment of the invention.

FIG. 2 is a schematic top view of a part of the image capturing module according to the first embodiment of the invention.

FIG. 3 is a schematic cross-sectional view of an image capturing module according to a second embodiment of the invention.

FIG. 4 is a schematic cross-sectional view of an image capturing module according to a third embodiment of the invention.

FIG. 5 is a schematic top view of an image capturing module according to a third embodiment of the invention.

FIG. 6 is a schematic cross-sectional view of an image capturing module according to a fourth embodiment of the invention.

FIG. 7 is a schematic cross-sectional view of an image capturing module according to a fifth embodiment of the invention.

FIG. 8 is a schematic cross-sectional view of an image capturing module according to a sixth embodiment of the invention.

FIG. 9 is a schematic cross-sectional view of an image capture module according to a seventh embodiment of the invention.

FIG. 10 is a schematic top view of an image capture module according to a seventh embodiment of the invention.

11 is a functional block diagram of an image capture module used in a portable electronic device according to an eighth embodiment of the invention.

M: Image capture module

1: circuit board

101: Upper surface

1011: Around Clearance Area

1012: Structural Strengthening Areas

102: Lower surface

1021: Around the joint area

103: Through hole

11: Substrate conductive contacts

2: Image sensor chip

21: Image sensing area

22: Chip conductive contacts

3: Rigid reinforcement structure

300: Outer surrounds

4: Lens assembly

41: Lens holder

42: Lens Structure

H: adhesive layer

5: filter element

Claims (10)

An image capture module, comprising: a circuit substrate, the circuit substrate has a plurality of substrate conductive contacts; an image sensing chip, the image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate, the image sensing chip includes an image sensing area and is electrically connected to a plurality of a plurality of chip conductive contacts of the substrate conductive contacts; a rigid reinforcement structure, the rigid reinforcement structure is disposed on the circuit substrate; and a lens assembly, the lens assembly includes a lens support and a lens structure disposed on the lens support, the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip; Wherein, the vertical projections of the plurality of the substrate conductive contacts and the plurality of the wafer conductive contacts all fall on the rigid reinforcement structure. The image capture module according to claim 1, Wherein, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole connected to the upper surface and the lower surface; Wherein, a plurality of the substrate conductive contacts are arranged on the lower surface of the circuit substrate, the image sensing chip is arranged on the lower surface of the circuit substrate, and the image sensing chip is arranged on the lower surface of the circuit substrate. a plurality of the chip conductive contacts are respectively electrically connected to the plurality of the substrate conductive contacts of the circuit substrate through flip-chip bonding; Wherein, the rigid reinforcement structure is circumferentially disposed on the upper surface of the circuit substrate and surrounds the through hole, and the lens holder of the lens assembly is adhered to the rigid reinforcement through an adhesive layer structurally; Wherein, the rigid reinforcement structure has an outer circumference, and the outer circumference of the rigid reinforcement structure is covered by the lens bracket or exposed by the lens bracket; Wherein, the upper surface of the circuit substrate has a surrounding clearance area connected to the through hole and surrounding the through hole, and the surrounding clearance area of the upper surface of the circuit substrate is covered by the surrounding clearance area. surrounded by the rigid reinforcement structure and exposed by the rigid reinforcement structure; Wherein, the lower surface of the circuit substrate has a surrounding contact area surrounding the through hole and used for carrying a plurality of the substrate conductive contacts, and the upper surface of the circuit substrate has a surrounding area surrounding the A structural strengthening area surrounding the clearance area and corresponding to the surrounding contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening of the circuit substrate Structural strength and surface flatness of both the area and the surrounding joint area. The image capture module according to claim 2, further comprising: a filter element, the filter element is disposed on the image sensing chip or the circuit substrate to correspond to the image sensing area of the image sensing chip; a plurality of first electronic components, the plurality of first electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a plurality of second electronic components, the plurality of second electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a first metal shielding member, the first metal shielding member is disposed on the circuit substrate for covering a plurality of the first electronic components; a second metal shielding member, the second metal shielding member is disposed on the circuit substrate for covering a plurality of the second electronic components; a first insulating filler, the first insulating filler is disposed on the circuit substrate and connected between the lens holder and the first metal shield; and a second insulating filler, the second insulating filler is disposed on the circuit substrate and connected between the lens holder and the second metal shield; Wherein, when the filter element is disposed on the image sensing wafer, the filter element is completely accommodated in the through hole of the circuit substrate; Wherein, when the filter element is disposed on the circuit substrate, the through hole of the circuit substrate is closed by the filter element; Wherein, when the lens bracket of the lens assembly is disposed between the first metal shield and the second metal shield, the lens bracket of the lens assembly is tightly connected to the first metal shield between the insulating fillers and the second insulating fillers, so as to increase the fastness of the lens bracket of the lens assembly being fixed on the rigid reinforcing structure. The image capture module according to claim 1, Wherein, the circuit substrate has an upper surface and a lower surface relative to the upper surface; Wherein, a plurality of the substrate conductive contacts are disposed on the upper surface of the circuit substrate, and the plurality of the chip conductive contacts of the image sensing chip are respectively electrically connected to the image sensor chip through wire bonding a plurality of the substrate conductive contacts of the circuit substrate; The rigid reinforcing structure is disposed on the lower surface of the circuit substrate, the lens holder of the lens assembly is adhered to the circuit substrate through an adhesive layer, and the lens assembly of the lens assembly is adhered to the circuit substrate through an adhesive layer. The vertical projection of the lens bracket falls on the rigid reinforcement structure; Wherein, the upper surface of the circuit substrate has a surrounding contact area surrounding the image sensing chip and used for carrying a plurality of conductive contacts of the substrate, and the lower surface of the circuit substrate has corresponding A structural strengthening area surrounding the contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening area and the surrounding contact area of the circuit substrate. Structural strength and surface flatness of both point areas; Wherein, when the circuit substrate has a through hole connected to the upper surface and the lower surface, the image sensing chip is accommodated in the through hole and disposed on the rigid reinforcement structure. The image capture module according to claim 4, further comprising: a filter element, the filter element is disposed on the image sensing chip to correspond to the image sensing area of the image sensing chip; a plurality of first electronic components, the plurality of first electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a plurality of second electronic components, the plurality of second electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a first metal shielding member, the first metal shielding member is disposed on the circuit substrate for covering a plurality of the first electronic components; a second metal shielding member, the second metal shielding member is disposed on the circuit substrate for covering a plurality of the second electronic components; a first insulating filler, the first insulating filler is disposed on the circuit substrate and connected between the lens holder and the first metal shield; and a second insulating filler, the second insulating filler is disposed on the circuit substrate and connected between the lens holder and the second metal shield; Wherein, when the lens bracket of the lens assembly is disposed between the first metal shield and the second metal shield, the lens bracket of the lens assembly is tightly connected to the first metal shield between the insulating fillers and the second insulating fillers, so as to increase the fastness of the lens holder of the lens assembly being fixed on the upper surface of the circuit substrate. A portable electronic device using an image capture module, wherein the image capture module comprises: a circuit substrate, the circuit substrate has a plurality of substrate conductive contacts; an image sensing chip, the image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate, the image sensing chip includes an image sensing area and is electrically connected to a plurality of a plurality of chip conductive contacts of the substrate conductive contacts; a rigid reinforcement structure, the rigid reinforcement structure is disposed on the circuit substrate; and a lens assembly, the lens assembly includes a lens support and a lens structure disposed on the lens support, the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip; Wherein, the vertical projections of the plurality of the substrate conductive contacts and the plurality of the wafer conductive contacts all fall on the rigid reinforcement structure. The portable electronic device as claimed in claim 6, Wherein, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole connected to the upper surface and the lower surface; Wherein, a plurality of the substrate conductive contacts are arranged on the lower surface of the circuit substrate, the image sensing chip is arranged on the lower surface of the circuit substrate, and the image sensing chip is arranged on the lower surface of the circuit substrate. a plurality of the chip conductive contacts are respectively electrically connected to the plurality of the substrate conductive contacts of the circuit substrate through flip-chip bonding; Wherein, the rigid reinforcement structure is circumferentially disposed on the upper surface of the circuit substrate and surrounds the through hole, and the lens holder of the lens assembly is adhered to the rigid reinforcement through an adhesive layer structurally; Wherein, the rigid reinforcement structure has an outer circumference, and the outer circumference of the rigid reinforcement structure is covered by the lens bracket or exposed by the lens bracket; Wherein, the upper surface of the circuit substrate has a surrounding clearance area connected to the through hole and surrounding the through hole, and the surrounding clearance area of the upper surface of the circuit substrate is covered by the surrounding clearance area. surrounded by the rigid reinforcement structure and exposed by the rigid reinforcement structure; Wherein, the lower surface of the circuit substrate has a surrounding contact area surrounding the through hole and used for carrying a plurality of the substrate conductive contacts, and the upper surface of the circuit substrate has a surrounding area surrounding the A structural strengthening area surrounding the clearance area and corresponding to the surrounding contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening of the circuit substrate Structural strength and surface flatness of both the area and the surrounding joint area. The portable electronic device of claim 7, wherein the image capture module further comprises: a filter element, the filter element is disposed on the image sensing chip or the circuit substrate to correspond to the image sensing area of the image sensing chip; a plurality of first electronic components, the plurality of first electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a plurality of second electronic components, the plurality of second electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a first metal shielding member, the first metal shielding member is disposed on the circuit substrate for covering a plurality of the first electronic components; a second metal shielding member, the second metal shielding member is disposed on the circuit substrate for covering a plurality of the second electronic components; a first insulating filler, the first insulating filler is disposed on the circuit substrate and connected between the lens holder and the first metal shield; and a second insulating filler, the second insulating filler is disposed on the circuit substrate and connected between the lens holder and the second metal shield; Wherein, when the filter element is disposed on the image sensing wafer, the filter element is completely accommodated in the through hole of the circuit substrate; Wherein, when the filter element is disposed on the circuit substrate, the through hole of the circuit substrate is closed by the filter element; Wherein, when the lens bracket of the lens assembly is disposed between the first metal shield and the second metal shield, the lens bracket of the lens assembly is tightly connected to the first metal shield between the insulating fillers and the second insulating fillers, so as to increase the fastness of the lens bracket of the lens assembly being fixed on the rigid reinforcing structure. The portable electronic device as claimed in claim 6, Wherein, the circuit substrate has an upper surface and a lower surface relative to the upper surface; Wherein, a plurality of the substrate conductive contacts are disposed on the upper surface of the circuit substrate, and the plurality of the chip conductive contacts of the image sensing chip are respectively electrically connected to the image sensor chip through wire bonding a plurality of the substrate conductive contacts of the circuit substrate; The rigid reinforcing structure is disposed on the lower surface of the circuit substrate, the lens holder of the lens assembly is adhered to the circuit substrate through an adhesive layer, and the lens assembly of the lens assembly is adhered to the circuit substrate through an adhesive layer. The vertical projection of the lens bracket falls on the rigid reinforcement structure; Wherein, the upper surface of the circuit substrate has a surrounding contact area surrounding the image sensing chip and used for carrying a plurality of conductive contacts of the substrate, and the lower surface of the circuit substrate has corresponding A structural strengthening area surrounding the contact area, and all or a part of the rigid reinforcing structure is disposed on the structural strengthening area, so as to increase the structural strengthening area and the surrounding contact area of the circuit substrate. Structural strength and surface flatness of both point areas; Wherein, when the circuit substrate has a through hole connected to the upper surface and the lower surface, the image sensing chip is accommodated in the through hole and disposed on the rigid reinforcement structure. The portable electronic device of claim 9, wherein the image capture module further comprises: a filter element, the filter element is disposed on the image sensing chip to correspond to the image sensing area of the image sensing chip; a plurality of first electronic components, the plurality of first electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a plurality of second electronic components, the plurality of second electronic components are disposed on the circuit substrate and are electrically connected to the circuit substrate; a first metal shielding member, the first metal shielding member is disposed on the circuit substrate for covering a plurality of the first electronic components; a second metal shielding member, the second metal shielding member is disposed on the circuit substrate for covering a plurality of the second electronic components; a first insulating filler, the first insulating filler is disposed on the circuit substrate and connected between the lens holder and the first metal shield; and a second insulating filler, the second insulating filler is disposed on the circuit substrate and connected between the lens holder and the second metal shield; Wherein, when the lens bracket of the lens assembly is disposed between the first metal shield and the second metal shield, the lens bracket of the lens assembly is tightly connected to the first metal shield between the insulating fillers and the second insulating fillers, so as to increase the fastness of the lens holder of the lens assembly being fixed on the upper surface of the circuit substrate.

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