TWM553428U - Portable electronic device and its image capturing module and image sensing component - Google Patents

Description

Portable electronic device and image capturing module and image sensing component thereof

The present invention relates to an image sensing component, and more particularly to an image capturing module using an image sensing component, and a portable electronic device using the image capturing module.

In the prior art, the special advantage of Complementary Metal-Oxide-Semiconductor (CMOS) image sensor is "low power consumption" and "small volume", so CMOS image sensor is convenient. Integrated into portable electronic products with special needs, such as CMOS image sensors, it is easy to integrate into mobile phones and notebook computers with small integration space. However, when the filter element is designed to be fixed to the image sensor directly by glue, or when the filter element is designed not to directly contact the image sensor, many undesirable problems occur.

The technical problem to be solved by the present invention is to provide a portable electronic device, an image capturing module thereof and an image sensing component for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing module, the image capturing module comprising: a circuit substrate, an image sensing chip, a pad structure, A filter element and a lens assembly. The image sensing chip is electrically connected to the circuit substrate, wherein an upper surface of the image sensing chip has an image sensing area and a non-image sensing area surrounding the image sensing area. The pad structure is disposed on the non-image sensing area. The filter element is disposed on the pad structure such that the filter element Separating the image sensing wafer by a predetermined distance. The lens assembly includes a bracket structure disposed on the circuit substrate and a lens structure carried by the bracket structure and corresponding to the image sensing region.

Further, the pad structure includes a plurality of prefabricated pads separated from each other and disposed on the non-image sensing area, and the plurality of prefabricated pads have the same height, wherein each of the prefabricated The upper surface of the pad has a first adhesive layer connected to the filter element, and a lower surface of each of the prefabricated pads has a second adhesive layer connected to the non-image sensing area, and the The predetermined distance of the filter element from the image sensing wafer is equal to a sum of a height of the prefabricated pad, a height of the first adhesive layer, and a height of the second adhesive layer to avoid a bit The microparticles on the filter element are imaged on the image sensing area of the image sensing wafer, wherein the prefabricated liner is one of a glass, a wafer and a semiconductor wafer. The first adhesive layer and the second adhesive layer are glue or tape, and the filter element is a coated glass or an uncoated glass.

Further, the image capturing module further includes: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connects the plurality of the prefabricated pads Forming a sealed space between the image sensing die and the filter element to protect the image sensing area, wherein the image sensing die is disposed on a lower surface of the circuit substrate, And the image sensing wafer is electrically connected to the circuit substrate through a plurality of electrical conductors.

Further, the image capturing module further includes: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connects the plurality of the prefabricated pads Forming a sealed space between the image sensing die and the filter element to protect the image sensing area, wherein the image sensing die is disposed on an upper surface of the circuit substrate, And the image sensing wafer is electrically connected to the circuit substrate through a plurality of conductive lines.

Further, the image capturing module further includes: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element And connecting a plurality of the prefabricated pads to form a sealed space between the image sensing wafer and the filter element to protect the image sensing area, wherein the image sensing wafer is disposed On the upper surface of the circuit substrate, the image sensing wafer is electrically connected to the circuit substrate through a plurality of electrical conductors.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an image sensing component, the image sensing component comprising: an image sensing chip, a pad structure and a filter element. The upper surface of the image sensing wafer has an image sensing area and a non-image sensing area surrounding the image sensing area. The pad structure is disposed on the non-image sensing area. The filter element is disposed on the pad structure such that the filter element separates the image sensing wafer by a predetermined distance.

Further, the pad structure includes a surrounding prefabricated pad disposed on the non-image sensing area and surrounding the image sensing area, and the surrounding prefabricated pad has a uniform height.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device, wherein the portable electronic device uses an image capturing module, wherein the image is The module includes a circuit substrate, an image sensing chip, a pad structure, a filter component, and a lens assembly. The image sensing chip is electrically connected to the circuit substrate, wherein an upper surface of the image sensing chip has an image sensing area and a non-image sensing area surrounding the image sensing area. The pad structure is disposed on the non-image sensing area. The filter element is disposed on the pad structure such that the filter element separates the image sensing wafer by a predetermined distance. The lens assembly includes a bracket structure disposed on the circuit substrate and a lens structure carried by the bracket structure and corresponding to the image sensing region.

Further, the pad structure includes a plurality of prefabricated pads separated from each other and disposed on the non-image sensing area, and the plurality of prefabricated pads have the same height, wherein each of the prefabricated The upper surface of the gasket has a connection to the filter a first adhesive layer of the optical element, a lower surface of each of the prefabricated pads has a second adhesive layer connected to the non-image sensing area, and the filter element is spaced apart from the image sensing wafer The predetermined distance is equal to the sum of the height of the prefabricated pad, the height of the first adhesive layer, and the height of the second adhesive layer to prevent the microparticles positioned on the filter element from being imaged. On the image sensing area of the image sensing wafer, wherein the prefabricated pad is one of a glass, a cymbal and a semiconductor wafer, the first adhesive layer and the second adhesive layer It is glue or tape, and the filter element is a coated glass or a non-coated glass.

Further, the portable electronic device further includes: a filling colloid disposed around the image sensing wafer and the filter element and connecting the plurality of the prefabricated pads Forming a sealed space between the image sensing wafer and the filter element to protect the image sensing area.

One of the beneficial effects of the present invention is that the portable electronic device and the image capturing module and the image sensing component thereof are provided by the creation, and the non-image sensing can be set by using the pad structure. a technical solution of "on the region" and "the filter element is disposed on the plurality of prefabricated pads such that the filter element separates the image sensing wafer by a predetermined distance" to enable the present creation to pass the The use of a pad structure (a plurality of said prefabricated pads having the same height or said surrounding prefabricated pads having a uniform height) is capable of maintaining and ensuring parallelism of said filter elements relative to said image sensing wafer Degree, without causing the filter element to tilt relative to the image sensing wafer to affect the degree of parallelism, and allowing the filter element to separate the image sensing wafer by a predetermined distance, thereby The microparticles located on the filter element are prevented from being imaged on the image sensing area of the image sensing wafer, thereby effectively improving the production yield of the creation.

In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and description only, and are not intended to limit the creation.

P‧‧‧Portable electronic device

M‧‧‧Image Capture Module

S‧‧‧ image sensing component

1‧‧‧ circuit substrate

2‧‧‧Image sensing wafer

201‧‧‧Image sensing area

202‧‧‧Non-image sensing area

3‧‧‧ cushion structure

30‧‧‧Prefabricated liners

301‧‧‧First adhesive layer

302‧‧‧Second Adhesive Layer

31‧‧‧Preformed prefabricated liner

4‧‧‧ Filter elements

5‧‧‧ lens assembly

51‧‧‧Support structure

52‧‧‧ lens structure

6‧‧‧filled colloid

B‧‧‧Electrical conductor

W‧‧‧Flexible wire

H, h1, h2‧‧‧ height

D‧‧‧Predetermined distance

R‧‧‧Confined space

1 is a top plan view of the image sensing assembly of the first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view taken along line II-II of Fig. 1.

FIG. 3 is a schematic diagram of an image capturing module according to a first embodiment of the present invention.

FIG. 4 is a schematic diagram of an image capturing module according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram of an image capturing module according to a third embodiment of the present invention.

FIG. 6 is a top plan view of the image sensing assembly of the fourth embodiment of the present invention.

FIG. 7 is a top plan view of the image sensing assembly of the fifth embodiment of the present invention.

FIG. 8 is a schematic diagram of a portable electronic device according to a sixth embodiment of the present invention.

The following is a specific embodiment to describe the implementation of the "portable electronic device and its image capturing module and image sensing component" disclosed in the present disclosure. Those skilled in the art can understand the contents disclosed in the present specification. The advantages and effects of this creation. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be variously modified and changed without departing from the concept of the present invention. In addition, the drawings of the present creation are only for the purpose of simple illustration, and are not stated in advance according to the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of protection of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2 , the first embodiment of the present invention provides an image sensing component S comprising: an image sensing chip 2 , a pad structure 3 , and a filter element 4 .

First, as shown in FIG. 1 and FIG. 2, the upper surface of the image sensing wafer 2 has an image sensing area 201 and a non-image sensing area 202 surrounding the image sensing area 201. For example, the image sensing wafer 2 can be a complementary metal oxide semiconductor (CMOS) sensor or any sensor having an image capturing function, but the present invention is not limited by this example.

Furthermore, as shown in FIG. 1 and FIG. 2, the pad structure 3 includes a plurality of prefabricated pads 30 (or prefabricated spacers) which are separated from each other and disposed on the non-image sensing area 202, and The prefabricated pads 30 have the same height H. For example, the prefabricated liner 30 can be one of glass, wafer and semiconductor wafer, and the semiconductor wafer can be an LED wafer, however the present invention is not limited by this example.

In addition, as shown in FIG. 2, the filter element 4 is disposed on the plurality of pre-formed pads 30 such that the filter element 4 separates the image sensing wafer 2 by a predetermined distance D. For example, the filter element 4 can be a coated glass or a non-coated glass, however, the present invention is not limited by this example.

Further, as shown in FIG. 2, each prefabricated liner 30 is prefabricated, and a prefabricated prefabricated liner 30 is placed between the image sensing wafer 2 and the filter element 4. In addition, the upper surface of each of the prefabricated pads 30 has a first adhesive layer 301 connected to the filter element 4, and the lower surface of each of the prefabricated pads 30 has a second adhesive attached to the non-image sensing area 202. Layer 302. For example, both the first adhesive layer 301 and the second adhesive layer 302 may be glue or tape, but the present invention is not limited by this example.

It is worth mentioning that, as shown in FIG. 2, since the plurality of prefabricated pads 30 have the same height H, the present invention can maintain and ensure the parallelism of the filter element 4 relative to the image sensing wafer 2 without The filter element 4 is inclined with respect to the image sensing wafer 2 to affect the state of parallelism.

It is worth mentioning that, as shown in FIG. 2, the predetermined distance D of the filter element 4 from the image sensing wafer 2 is substantially equal to the height H of the prefabricated pad 30, the height h1 of the first adhesive layer 301, and the second adhesion. The sum of the heights h2 of the layers 302 is three. Therefore, the present invention enables the filter element 4 to separate the image sensing wafer 2 by a predetermined distance D by using the prefabricated liner 30, the first adhesive layer 301, and the second adhesive layer 302, thereby preventing the positional The microparticles on the filter element 4 are imaged on the image sensing area 201 of the image sensing wafer 2, thereby effectively improving the production yield of the present creation.

With reference to FIG. 1 to FIG. 3, the first embodiment of the present invention further provides a The image capturing module M includes a circuit substrate 1, an image sensing chip 2, a pad structure 3, a filter element 4, and a lens assembly 5.

Furthermore, as shown in FIG. 3 , the image sensing wafer 2 is disposed on the lower surface of the circuit substrate 1 and electrically connected to the circuit substrate 1 . For example, the image sensing wafer 2 can be electrically connected to the circuit substrate 1 through a plurality of electrical conductors B (such as solder balls or any conductive elements), and the circuit substrate 1 can be made of a PCB hard board (such as BT, FR4, FR5 material), soft and hard bonding board or ceramic substrate, etc. However, this creation is not limited to this example.

Furthermore, as shown in FIG. 3, the lens assembly 5 includes a bracket structure 51 disposed on the circuit substrate 1 and a lens structure 52 carried by the bracket structure 51 and corresponding to the image sensing region 201. For example, the support structure 51 can be a conventional base or any kind of voice coil motor (VCM), and the lens structure 52 can be composed of a plurality of lenses, however, the present invention is not limited by this example. In addition, for example, the bracket structure 51 can be disposed on the upper surface of the circuit substrate 1 by an adhesive (not shown), but the present invention is not limited by this example.

[Second embodiment]

The image capture module M includes a circuit substrate 1, an image sensing chip 2, a pad structure 3, a filter element 4, and a second embodiment. Lens assembly 5. 4 and FIG. 3, the second embodiment differs from the first embodiment in that the image sensing wafer 2 is disposed on the upper surface of the circuit substrate 1 and the image is in the second embodiment. The sensing wafer 2 can be electrically connected to the circuit substrate 1 through a plurality of electrical conductors B. For example, the electrical conductor B can be a solder ball or any conductive element, however the present invention is not limited by this example.

[Third embodiment]

As shown in FIG. 5, the third embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1, an image sensing chip 2, and a pad structure 3. A filter element 4 and a lens assembly 5. As can be seen from the comparison between FIG. 5 and FIG. 3, the third embodiment of the present invention is most different from the first embodiment in that, in the third embodiment, the image sensing wafer 2 is disposed on the upper surface of the circuit substrate 1, and the image is The sensing wafer 2 can be electrically connected to the circuit substrate 1 through a plurality of conductive wires W.

[Fourth embodiment]

Referring to FIG. 6 , a fourth embodiment of the present invention provides an image sensing component S including an image sensing chip 2 , a pad structure 3 , and a filter element 4 . It can be seen from the comparison between FIG. 6 and FIG. 1 that the fourth embodiment of the present invention is the most different from the first embodiment in that the image sensing component S of the fourth embodiment further includes a filling colloid 6.

Further, the filling gel 6 is disposed between the image sensing wafer 2 and the filter element 4 and connected to the plurality of prefabricated pads 30 to form a gap between the image sensing wafer 2 and the filter element 4 The sealed space R of the image sensing area 201 is protected. Therefore, during the production of the image capturing module, the image sensing area 201 of the image sensing wafer 2 is protected by the filling gel 6 without being contaminated by foreign substances such as dust or particles. For example, the filling gel 4 can be epoxy or silicon, however the present invention is not limited by this example.

[Fifth Embodiment]

Referring to FIG. 7 , a fifth embodiment of the present invention provides an image sensing component S including an image sensing chip 2 , a pad structure 3 , and a filter element 4 . It can be seen from the comparison between FIG. 7 and FIG. 1 that the fifth embodiment of the present invention is the biggest difference from the first embodiment in that, in the fifth embodiment, the pad structure 3 includes a non-image sensing area 202 and is disposed around The image sensing area 201 is pre-formed with a liner 31, and the surrounding pre-formed liner 31 has a uniform height.

Thereby, the present invention can maintain and ensure the parallelism of the filter element 4 relative to the image sensing wafer 2 by the use of the surrounding prefabricated liner 31 having a uniform height. The filter element 4 is not inclined relative to the image sensing wafer 2 to affect the parallelism, and the filter element 4 can be separated from the image sensing wafer 2 by a predetermined distance, thereby avoiding the position in the filter element 4. The upper microparticles are imaged on the image sensing area 201 of the image sensing wafer 2, thereby effectively improving the production yield of the creation.

[Sixth embodiment]

As shown in FIG. 8 , the sixth embodiment of the present invention provides a portable electronic device P, and the portable electronic device P can use any of the image capturing modules M in the first embodiment to the third embodiment. . For example, the image capture module M can be applied to a mobile phone, a notebook computer, or a tablet computer. However, the present invention is not limited by this example. As shown in FIG. 8, the image capturing module M can be used as a rear lens of the portable electronic device P, and the image capturing module M can include a circuit substrate 1, an image sensing chip 2, and a pad structure. 3. A filter element 4 and a lens assembly 5, however, the present invention is not limited by this example.

[Advantageous Effects of Embodiments]

One of the beneficial effects of the present invention is that the portable electronic device P and the image capturing module M and the image sensing component S are provided by the present invention, and can be disposed in the non-image sensing by the “pad structure 3”. "on the area 202" and "the filter element 4 is disposed on the pad structure 3 such that the filter element 4 separates the image sensing wafer 2 by a predetermined distance D", so that the present creation passes through the pad structure 3 (having The use of a plurality of prefabricated pads 30 of the same height H or a surrounding prefabricated pad 31) having a uniform height can maintain and ensure the parallelism of the filter element 4 relative to the image sensing wafer 2 without filtering The component 4 is tilted relative to the image sensing wafer 2 to affect the parallelism, and the filter element 4 can be separated from the image sensing wafer 2 by a predetermined distance D, thereby preventing microparticles located on the filter element 4. It will be imaged on the image sensing area 201 of the image sensing wafer 2, thereby effectively improving the production yield of the present creation.

Furthermore, the filling gel 6 is disposed between the image sensing wafer 2 and the filter element 4 and is connected to the plurality of prefabricated pads 30 to form a gap between the image sensing wafer 2 and the filter element 4 to protect the image. The sealed space R of the sensing area 201. Therefore, during the manufacturing process of the image capturing module M, the image sensing area 201 of the image sensing wafer 2 is protected by the filling gel 6 without being contaminated by foreign substances such as dust or particles.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the content of the schema are included in the application for this creation. Within the scope of the patent.

S‧‧‧ image sensing component

2‧‧‧Image sensing wafer

201‧‧‧Image sensing area

202‧‧‧Non-image sensing area

3‧‧‧ cushion structure

30‧‧‧Prefabricated liners

301‧‧‧First adhesive layer

302‧‧‧Second Adhesive Layer

4‧‧‧ Filter elements

H, h1, h2‧‧‧ height

D‧‧‧Predetermined distance

Claims (10)

An image capture module includes: a circuit substrate; an image sensing chip, the image sensing chip is electrically connected to the circuit substrate, wherein the image sensing chip The upper surface has an image sensing area and a non-image sensing area surrounding the image sensing area; a pad structure, the pad structure is disposed on the non-image sensing area; a filter element, The filter element is disposed on the pad structure such that the filter element separates the image sensing chip by a predetermined distance; and a lens assembly including a lens assembly disposed on the circuit substrate a support structure and a lens structure carried by the support structure and corresponding to the image sensing area. The image capture module of claim 1, wherein the pad structure comprises a plurality of prefabricated pads separated from each other and disposed on the non-image sensing area, and the plurality of prefabricated pads have The same height, wherein the upper surface of each of the prefabricated pads has a first adhesive layer connected to the filter element, and a lower surface of each of the prefabricated pads has a connection to the non-image sense Measuring a second adhesive layer of the region, and the predetermined distance of the filter element from the image sensing wafer is equal to a height of the prefabricated pad, a height of the first adhesive layer, and the second adhesive layer The sum of the heights of the three to prevent micro-particles on the filter element from being imaged on the image sensing area of the image sensing wafer, wherein the pre-formed pad is glass, germanium One of the chip and the semiconductor wafer, the first adhesive layer and the second adhesive layer are glue or tape, and the filter element is a coated glass or a non-coated glass. The image capturing module of claim 2, further comprising: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connecting the plurality of prefabrications Padding, forming a image sensing a sealed space between the wafer and the filter element for protecting the image sensing area, wherein the image sensing chip is disposed on a lower surface of the circuit substrate, and the image sensing wafer passes through a plurality of The electrical conductor is electrically connected to the circuit substrate. The image capturing module of claim 2, further comprising: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connecting the plurality of prefabrications a gasket to form a sealed space between the image sensing wafer and the filter element to protect the image sensing region, wherein the image sensing wafer is disposed on an upper surface of the circuit substrate And the image sensing wafer is electrically connected to the circuit substrate through a plurality of conductive lines. The image capturing module of claim 2, further comprising: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connecting the plurality of prefabrications a gasket to form a sealed space between the image sensing wafer and the filter element to protect the image sensing region, wherein the image sensing wafer is disposed on an upper surface of the circuit substrate And the image sensing wafer is electrically connected to the circuit substrate through a plurality of electrical conductors. An image sensing component includes: an image sensing die, an upper surface of the image sensing die having an image sensing area and a non-image sensing area surrounding the image sensing area a pad structure disposed on the non-image sensing area; and a filter element disposed on the pad structure to separate the filter element The image senses the wafer a predetermined distance. The image sensing assembly of claim 6, wherein the pad structure comprises a surrounding prefabricated pad disposed on the non-image sensing area and surrounding the image sensing area, and the surrounding The prefabricated liner has a uniform height. A portable electronic device, wherein the portable electronic device uses an image capturing module, wherein the image capturing module comprises: a circuit substrate; an image sensing chip, the image sensing The wafer is electrically connected to the circuit substrate, wherein an upper surface of the image sensing wafer has an image sensing area and a non-image sensing area surrounding the image sensing area; a pad structure, a pad structure disposed on the non-image sensing area; a filter element disposed on the pad structure such that the filter element separates the image sensing chip by a predetermined distance And a lens assembly including a support structure disposed on the circuit substrate and a lens structure carried by the support structure and corresponding to the image sensing area. The portable electronic device of claim 8, wherein the pad structure comprises a plurality of prefabricated pads separated from each other and disposed on the non-image sensing area, and the plurality of prefabricated pads have The same height, wherein the upper surface of each of the prefabricated pads has a first adhesive layer connected to the filter element, and a lower surface of each of the prefabricated pads has a connection to the non-image sense Measuring a second adhesive layer of the region, and the predetermined distance of the filter element from the image sensing wafer is equal to a height of the prefabricated pad, a height of the first adhesive layer, and the second adhesive layer The sum of the heights of the three to prevent micro-particles on the filter element from being imaged on the image sensing area of the image sensing wafer, wherein the pre-formed pad is glass, germanium One of the chip and the semiconductor wafer, the first adhesive layer and the second adhesive layer are glue or tape, and the filter element is a coated glass or a non-coated glass. The portable electronic device of claim 9, further comprising: a filling gel, the filling gel is disposed around the image sensing wafer and the filter element and connecting the plurality of prefabricated Padding to form a seal between the image sensing wafer and the filter element to protect the image sensing area space.