TWM550474U - Portable electronic device and image capture module and carrying components thereof - Google Patents

Description

Portable electronic device and image capturing module and bearing component thereof

The present invention relates to a portable electronic device and an image capturing module and a bearing assembly thereof, and more particularly to a portable electronic device for reducing the width of the lens assembly, and an image capturing module and a bearing assembly thereof.

In the prior art, the special advantage of Complementary Metal-Oxide-Semiconductor (CMOS) image sensor is "low power consumption" and "small volume", so CMOS image sensor is convenient. Integrated into portable electronic products with special needs, such as CMOS image sensors, it is easy to integrate into mobile phones and notebook computers with small integration space. However, due to the distribution of peripheral electronic components located on the circuit substrate, the width of the support structure used in the conventional image capture module cannot be reduced.

The technical problem to be solved by the present invention is to provide a portable electronic device and an image capturing module and a bearing component thereof for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing module, the image capturing module comprising: a circuit substrate, an image sensing chip, at least one electronic component, A package structure and a lens assembly. The circuit substrate has an upper surface and a lower surface. The image sensing chip is electrically connected to the circuit substrate, wherein the image sensing wafer has an image sensing area. At least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The lens assembly A support structure disposed on an upper surface of the circuit substrate and a lens structure carried by the support structure and corresponding to the image sensing area are included.

Further, the image capturing module further includes: at least one electrical conductor, at least one of the electrical conductors disposed on a lower surface of the circuit substrate and electrically connected to the circuit substrate, and at least one of the A portion of the electrical conductor is covered by the encapsulation structure such that a lower surface of at least one of the electrical conductors is exposed outside the package structure, wherein the package structure has the lower surface with at least one of the electrical conductors a flat surface that is flush, the package structure surrounds the image sensing wafer, and the thickness of the package structure is greater than a thickness of the image sensing wafer, wherein the upper surface of the circuit substrate has a An electronic component free area surrounded by the support structure and not occupied by other electronic components.

Further, the image capturing module further includes: a heat dissipation structure disposed on the flat surface of the package structure and contacting the lower surface of at least one of the electrical conductors, and The image sensing wafer is attached to the heat dissipation structure by a thermal adhesive, wherein the circuit substrate has a through opening connected between the upper surface and the lower surface, the image sensing wafer And disposed on the lower surface of the circuit substrate, and the image sensing area of the image sensing wafer faces the through opening.

Further, the image capturing module further includes: a filter element, the filter element is disposed on one of the image sensing wafer and the circuit substrate, and the filtering An element is disposed between the image sensing die and the lens structure, wherein the package structure has a single package surrounding the image sensing die and a through the single package and An accommodating space that communicates with each other through the openings, and all of the image sensing wafers are accommodated in the accommodating space of the package structure.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a carrying component, the carrying component comprising: a circuit substrate, a package structure and a bracket structure. The circuit substrate is configured to carry at least one electronic element The circuit substrate has an upper surface and a lower surface, and at least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The bracket structure is disposed on the upper surface of the circuit substrate.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device, wherein the portable electronic device uses an image capturing module, wherein the image is The module includes: a circuit substrate, an image sensing chip, at least one electronic component, a package structure, and a lens assembly. The circuit substrate has an upper surface and a lower surface. The image sensing chip is electrically connected to the circuit substrate, wherein the image sensing wafer has an image sensing area. At least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The lens assembly includes a bracket structure disposed on an upper surface of the circuit substrate and a lens structure carried by the bracket structure and corresponding to the image sensing region.

One of the beneficial effects of the present invention is that the portable electronic device and the image capturing module and the carrying assembly thereof provided by the present invention can be provided by the at least one of the electronic components disposed on the circuit substrate. a lower surface and electrically connected to the circuit substrate, and the package structure is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components" and "the bracket structure is disposed on the circuit substrate The upper surface" is a technical solution to reduce the width or size of the stent structure in the horizontal direction.

In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and description only, and are not intended to limit the creation.

P‧‧‧Portable electronic device

S‧‧‧Loading components

M‧‧‧Image Capture Module

1‧‧‧ circuit substrate

100‧‧‧through opening

101‧‧‧ upper surface

1010‧‧‧No electronic component area

102‧‧‧lower surface

103‧‧‧Contact area

2‧‧‧Image sensing wafer

200‧‧‧Image sensing area

3‧‧‧Electronic components

4‧‧‧Package structure

400‧‧‧Flat surface

41‧‧‧One single package

42‧‧‧ accommodating space

5‧‧‧ lens assembly

51‧‧‧Support structure

52‧‧‧ lens structure

6‧‧‧ Filter elements

7‧‧‧Electrical conductor

700‧‧‧ lower surface

8‧‧‧heating structure

C1‧‧‧ electrical connector

C2‧‧‧Electrical structure

H1, H2‧‧‧ thickness

FIG. 1 is a schematic diagram of an image capturing module according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram of an image capturing module according to a second embodiment of the present invention.

FIG. 3 is a schematic diagram of an image capturing module according to a third embodiment of the present invention.

Figure 4 is a schematic diagram of the bearer assembly of the present invention.

FIG. 5 is a schematic diagram of an image capturing module according to a fourth embodiment of the present invention.

FIG. 6 is a schematic diagram of an image capturing module according to a fifth embodiment of the present invention.

FIG. 7 is a schematic diagram of an image capturing module according to a sixth embodiment of the present invention.

FIG. 8 is a schematic diagram of an image capturing module according to a seventh embodiment of the present invention.

FIG. 9 is a schematic diagram of a portable electronic device according to an eighth embodiment of the present invention.

The following is a specific embodiment to explain the implementation of the "portable electronic device and its image capturing module and carrying component" disclosed in the present disclosure. Those skilled in the art can understand the creation by the content disclosed in the present specification. The advantages and effects. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be variously modified and changed without departing from the concept of the present invention. In addition, the drawings of the present creation are only for the purpose of simple illustration, and are not stated in advance according to the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of protection of the present invention.

[First Embodiment]

As shown in FIG. 1 , the first embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5.

First, the circuit substrate 1 has an upper surface 101 and a lower surface 102. Furthermore, the circuit substrate 1 has a through opening 100 connected between the upper surface 101 and the lower surface 102. For example, the circuit substrate 1 may be a PCB hard board (such as BT, FR4, FR5 material), a soft and hard bonding board or a ceramic substrate, but the present invention is not limited by this example.

Furthermore, the image sensing chip 2 is electrically connected to the circuit substrate 1 , and the image sensing wafer 2 has an image sensing area 200 . Furthermore, the image sensing wafer 2 is disposed on the lower surface 102 of the circuit substrate 1, and the image sensing region 200 of the image sensing wafer 2 faces the through opening 100 of the circuit substrate 1. For example, the image sensing wafer 2 can be a complementary metal oxide semiconductor (CMOS) sensor or any sensor having an image capturing function, but the present invention is not limited by this example.

Further, at least one electronic component 3 is disposed on the lower surface 102 of the circuit substrate 1 and electrically connected to the circuit substrate 1. For example, the electronic component 3 may be a passive component such as a capacitor, a resistor, a driver IC, or an electronic erasable rewritable read-only memory (EEPROM). However, the present invention is not limited by this example.

In addition, the package structure 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3. Furthermore, the package structure 4 has a single package body 41 surrounding the image sensing wafer 2 (for example, a surrounding package body) and an accommodating space 42 extending through the single package body 41 and communicating with the through opening 100. . For example, the package structure 4 can be formed by molding to form a molded base, and the package structure 4 can have a flat surface 400 of one micron order by fine grinding. However, this creation is not exemplified by this example. limit.

It is worth mentioning that since the package structure 4 is disposed on the lower surface 102 of the circuit substrate 1, the structural strength of the circuit substrate 1 can be enhanced by the auxiliary support of the package structure 4, thereby making the hardness of the circuit substrate 1 improved. It is not easy to produce warpage.

Furthermore, the lens assembly 5 includes a holder structure 51 disposed on the upper surface 101 of the circuit substrate 1 and a lens structure 52 carried by the holder structure 51 and corresponding to the image sensing area 200. For example, the support structure 51 can be a conventional base or any kind of voice coil motor (VCM), and the lens structure 52 can be composed of a plurality of lenses, however, the present invention is not limited by this example. In addition, for example, the bracket structure 51 can be disposed on the upper surface 101 of the circuit substrate 1 by an adhesive (not shown), but the present invention is not limited by this example.

It is worth mentioning that the upper surface 101 of the circuit substrate 1 has an electronic component free area 1010 surrounded by the support structure 51 and not occupied by any other electronic components. That is, all of the electronic components 3 are disposed on the lower surface 102 of the circuit substrate 1, so that there is no electronic component on the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1, whereby the support structure 51 It can be placed directly in the range covered by the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1.

It is to be noted that the image capturing module M further includes: a filter element 6 , and the filter element 6 can be disposed on one of the image sensing chip 2 and the circuit substrate 1 , and the filter element 6 It is disposed between the image sensing wafer 2 and the lens structure 52. For example, the filter element 6 can be directly disposed on the image sensing wafer 2 (as shown in FIG. 1), or the filter element 6 can be supported by a plurality of pillars (not shown) to provide an image sense. The top of the wafer 2 is measured. In addition, the filter element 6 may be a coated glass or a non-coated glass, but the present invention is not limited by this example.

It is worth mentioning that the outer surface of the package structure 4 may additionally be provided with a protective layer. For example, the outer surface of the package structure 4 has a dust-proof coating layer for reducing the adhesion of particles, but the present invention is not limited by this example.

In summary, since the bracket structure 51 and the electronic component 3 are disposed on opposite surfaces of the circuit board 1, the width or size of the bracket structure in the horizontal direction can be reduced. That is, since the holder structure 51 is directly disposed on the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1 without particularly avoiding the electronic component 3, the stent structure 51 is in the horizontal direction (X direction or Y direction). The width can be reduced, thereby reducing the size of the stent structure 51 in the horizontal direction.

[Second embodiment]

As shown in FIG. 2 , the second embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5. As can be seen from the comparison between FIG. 2 and FIG. 1, The second embodiment of the present invention is the most different from the first embodiment in that the image capturing module M of the second embodiment further includes at least one electrical conductor 7 and at least one electrical conductor 7 is disposed on the lower surface of the circuit substrate 1. 102 is electrically connected to the circuit substrate 1.

As stated above, at least one portion of the electrical conductor 7 is covered by the package structure 4 such that the lower surface 700 of at least one of the electrical conductors 7 is exposed outside of the package structure. For example, the at least one electrical conductor 7 can be electrically connected to the connection region 103 of the circuit substrate 1. Therefore, the connection region 103 of the circuit substrate 1 can be electrically connected to the application system through at least one electrical conductor 7 (not shown). The image capturing module M of the present invention can meet the requirements of Electrostatic Discharge (ESD) and Electromagnetic Disturbance (EMI). In addition, at least one of the electrical conductors 7 may be a conductive member such as a copper pillar, a solder ball, or an electronic component. However, the present invention is not limited by this example.

It should be noted that the package structure 4 is disposed on the lower surface 102 of the circuit substrate 1 and surrounds the image sensing wafer 2, and the thickness H1 of the package structure 4 is greater than the thickness H2 of the image sensing wafer 2. Therefore, since the thickness H1 of the package structure 4 is greater than the thickness H2 of the image sensing wafer 2, the distance of the top end of the package structure 4 relative to the lower surface 102 of the circuit substrate 1 is greater than the top end of the image sensing wafer 2 relative to the circuit. The distance of the lower surface 102 of the substrate 1. Therefore, all of the image sensing wafer 2 is accommodated in the accommodating space 42 of the package structure 4, so that the image sensing wafer 2 can be protected from the package structure 7 and not easily collide with foreign objects.

[Third embodiment]

As shown in FIG. 3 , the third embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5. 3 and FIG. 2, the third embodiment differs from the second embodiment in that the filter element 6 can be directly disposed on the circuit substrate 1 and sensed by the image. The wafers 2 are separated from each other.

That is to say, the present invention can be disposed on the image sensing wafer 2 (as shown in the first embodiment of FIG. 1) or on the circuit substrate 1 according to different design requirements (as shown in FIG. 3). Third embodiment).

It is to be noted that, as shown in FIG. 4, the present invention further provides a carrier assembly S, comprising: a circuit substrate 1, a package structure 4, and a bracket structure 51. The circuit substrate 1 is used to carry at least one electronic component 3, and at least one electronic component 3 is disposed on the lower surface 102 of the circuit substrate 1 and electrically connected to the circuit substrate 1. The package structure 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3. The holder structure 51 is provided on the upper surface 101 of the circuit substrate 1.

That is, the carrier assembly S provided in FIG. 4 is not limited to be used only for carrying the image sensing wafer 2 and the lens structure 52 (for example, the first embodiment to the third embodiment).

[Fourth embodiment]

As shown in FIG. 5 , the fourth embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5. The comparison between FIG. 4 and FIG. 2 shows that the fourth embodiment of the present invention is the most different from the second embodiment in that the image capturing module M of the fourth embodiment further includes a heat dissipation structure 8 and the heat dissipation structure 8 is disposed. On the flat surface 400 of the package structure 4 and in contact with the lower surface 700 of at least one of the electrical conductors 7.

As can be said, the image sensing wafer 2 can be attached to the heat dissipation structure 8 by a thermal conductive adhesive (not labeled), thereby improving the heat dissipation performance of the image sensing wafer 2. In addition, the flat surface 400 of the package structure 4 is flush with the lower surface 700 of the at least one electrical conductor 7, so that the heat dissipation structure 8 can be disposed on the flat surface 400 as a load bearing reference surface. For example, the heat dissipation structure 8 may be a conductive member such as a steel sheet, a copper sheet or a copper foil. However, the present invention is not limited by this example.

It is worth mentioning that at least one electrical conductor 7 can be electrically connected to the circuit substrate 1 The connection area 103 is such that the connection area 103 of the circuit substrate 1 can be electrically connected to the connection area of the application system (not shown) through the at least one electric conductor 7 and the heat dissipation structure 8, thereby using the image of the creation. The capture module M can meet the requirements of Electrostatic Discharge (ESD) and Electromagnetic Disturbance (EMI).

[Fifth Embodiment]

Referring to FIG. 6 , a fifth embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5. It can be seen from the comparison between FIG. 6 and FIG. 2 that the fifth embodiment of the present invention is the most different from the second embodiment in that, in the fifth embodiment, an electrical connector C1 can be additionally added to the circuit substrate 1 to make the image collapse. The module M can be electrically connected to the back end electronic module (not shown) through the electrical connector C1.

[Sixth embodiment]

Referring to FIG. 7 , a sixth embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a package structure 4 , and a lens Component 5. It can be seen from the comparison between FIG. 7 and FIG. 2 that the sixth embodiment is different from the second embodiment in that: in the sixth embodiment, the image capturing module M can pass through a conductive structure C2 (for example, Hot Bar or ACF) is electrically connected to a flexible circuit board (not labeled) so that the image capturing module M can be electrically connected to the back end electronic module (not shown). Thereby, the image capturing module M is electrically matched with different flexible circuit boards through the conductive structure C2, thereby improving the commonality of the image capturing module M of the present invention.

[Seventh embodiment]

Referring to FIG. 8 , the seventh embodiment of the present invention provides two image capturing modules. M. It can be seen from the comparison between FIG. 8 and FIG. 2 that the biggest difference between the seventh embodiment and the second embodiment is that the seventh embodiment can simultaneously use two image capturing modules M (ie, a dual lens module). And the two image capturing modules M can share the same circuit substrate 1. Of course, the two image capturing modules M can share the same package structure 4 and the same electrical conductor 7 according to different design requirements.

[Eighth Embodiment]

As shown in FIG. 9 , the eighth embodiment of the present invention provides a portable electronic device P, and the portable electronic device P can use any of the image capturing modules M of the first to seventh embodiments. For example, the image capture module M can be applied to a mobile phone, a notebook computer, or a tablet computer. However, the present invention is not limited by this example. As shown in FIG. 9 , the image capturing module M can be used as a rear lens of the portable electronic device P, and the image capturing module M can include a circuit substrate 1 , an image sensing chip 2 , and at least one electronic component. 3. A package structure 4 and a lens assembly 5, however, the present invention is not limited by this example.

[Advantageous Effects of Embodiments]

One of the beneficial effects of the present invention is that the portable electronic device P and its image capturing module M and the carrying component S are provided by the present invention, which can be disposed under the circuit substrate 1 by "at least one electronic component 3". The surface 102 is electrically connected to the circuit substrate 1 , and the package structure 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3 ′′ and “the support structure 51 is disposed on the upper surface 101 of the circuit substrate 1 ” To reduce the width or size of the stent structure 51 in the horizontal direction. That is, since the bracket structure 51 is directly disposed on the upper surface 101 of the circuit substrate 1 without particularly avoiding the electronic component 3, the bracket structure 51 can be horizontally oriented (X direction or Y without avoiding the electronic component 3). The width of the direction can be reduced, thereby reducing the size of the bracket structure 51 in the horizontal direction.

It is worth mentioning that since the package structure 4 is disposed on the lower surface of the circuit substrate 1 102, the structural strength of the circuit substrate 1 can be reinforced by the auxiliary support of the package structure 4, so that the hardness of the circuit substrate 1 is improved without warpage.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the content of the schema are included in the application for this creation. Within the scope of the patent.

M‧‧‧Image Capture Module

1‧‧‧ circuit substrate

100‧‧‧through opening

101‧‧‧ upper surface

1010‧‧‧No electronic component area

102‧‧‧lower surface

103‧‧‧Contact area

2‧‧‧Image sensing wafer

200‧‧‧Image sensing area

3‧‧‧Electronic components

4‧‧‧Package structure

400‧‧‧Flat surface

41‧‧‧One single package

42‧‧‧ accommodating space

5‧‧‧ lens assembly

51‧‧‧Support structure

52‧‧‧ lens structure

6‧‧‧ Filter elements

7‧‧‧Electrical conductor

700‧‧‧ lower surface

H1, H2‧‧‧ thickness

Claims (10)

An image capturing module includes: a circuit substrate having an upper surface and a lower surface; an image sensing chip, wherein the image sensing chip is electrically connected to the image sensing chip a circuit substrate, wherein the image sensing wafer has an image sensing area; at least one electronic component, at least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate; a package structure disposed on the lower surface of the circuit substrate to cover at least one of the electronic components; and a lens assembly including a bracket disposed on an upper surface of the circuit substrate And a lens structure carried by the support structure and corresponding to the image sensing region. The image capturing module of claim 1, further comprising: at least one electrical conductor, wherein at least one of the electrical conductors is disposed on a lower surface of the circuit substrate and electrically connected to the circuit substrate, and at least one A portion of the electrical conductor is covered by the encapsulation structure such that a lower surface of at least one of the electrical conductors is exposed outside the package structure, wherein the package structure has the same as the at least one of the electrical conductors a flat surface having a flush surface, the package structure surrounding the image sensing wafer, and a thickness of the package structure is greater than a thickness of the image sensing wafer, wherein the upper surface of the circuit substrate has An electronic component free area surrounded by the support structure and not occupied by other electronic components. The image capturing module of claim 2, further comprising: a heat dissipation structure disposed on the flat surface of the package structure and contacting the lower surface of at least one of the electrical conductors And the image sensing wafer is attached to the heat dissipation structure by a thermal adhesive, wherein the circuit substrate has a through opening connected between the upper surface and the lower surface, the image sense a test wafer disposed on the lower surface of the circuit substrate, and the image sensing crystal The image sensing area of the sheet faces the through opening. The image capturing module of claim 3, further comprising: a filter element, wherein the filter element is disposed on one of the image sensing die and the circuit substrate, and a filter element is disposed between the image sensing die and the lens structure, wherein the package structure has a single package surrounding the image sensing chip and a through the single package and The accommodating spaces of the through-openings communicate with each other, and all of the image sensing wafers are accommodated in the accommodating space of the package structure. A load bearing assembly comprising: a circuit substrate, wherein the circuit substrate is configured to carry at least one electronic component, wherein the circuit substrate has an upper surface and a lower surface, and at least one of the electronic components is disposed at The lower surface of the circuit substrate is electrically connected to the circuit substrate; a package structure disposed on the lower surface of the circuit substrate to cover at least one of the electronic components; and a bracket structure The bracket structure is disposed on the upper surface of the circuit substrate. The load-bearing component of claim 5, further comprising: at least one electrical conductor; and a heat dissipation structure; wherein at least one of the electrical conductors is disposed on a lower surface of the circuit substrate and electrically connected to the circuit substrate And at least one portion of the electrical conductor is covered by the encapsulation structure such that a lower surface of at least one of the electrical conductors is exposed outside the package structure; wherein the package structure has at least one of the conductive structures a flat surface that is flush with the lower surface of the body, and the heat dissipation structure is disposed on the flat surface of the package structure and contacts the lower surface of at least one of the electrical conductors; wherein the circuit substrate The upper surface has a circumference surrounded by the bracket structure An area without electronic components that is wrapped around and not occupied by other electronic components. A portable electronic device, wherein the portable electronic device uses an image capturing module, wherein the image capturing module comprises: a circuit substrate, the circuit substrate has an upper surface and a lower surface An image sensing chip electrically connected to the circuit substrate, wherein the image sensing wafer has an image sensing area; at least one electronic component, at least one of the electronic components is disposed at The lower surface of the circuit substrate is electrically connected to the circuit substrate; a package structure disposed on the lower surface of the circuit substrate to cover at least one of the electronic components; and a lens And a lens assembly including a support structure disposed on an upper surface of the circuit substrate and a lens structure carried by the support structure and corresponding to the image sensing area. The portable electronic device of claim 7, wherein the image capturing module further comprises: at least one electrical conductor, at least one of the electrical conductors disposed on a lower surface of the circuit substrate and electrically Is electrically connected to the circuit substrate, and a portion of the at least one of the electrical conductors is covered by the package structure such that a lower surface of at least one of the electrical conductors is exposed outside the package structure, wherein the package structure Having a planar surface that is flush with the lower surface of at least one of the electrical conductors, the package structure surrounding the image sensing wafer, and the thickness of the packaging structure is greater than the thickness of the image sensing wafer, wherein The upper surface of the circuit substrate has an electronic component free area surrounded by the support structure and not occupied by other electronic components. The portable electronic device of claim 8, wherein the image capturing module further comprises: a heat dissipation structure disposed on the flat surface of the package structure and contacting At least one of the lower surfaces of the electrical conductor, and the image sensing wafer is attached to the heat dissipation structure by a thermal adhesive, wherein the circuit substrate has a connection to the upper surface and the lower surface a through opening between the surfaces, the image sensing wafer is disposed on the lower surface of the circuit substrate, and the image sensing region of the image sensing wafer faces the through opening. The portable electronic device of claim 9, wherein the image capturing module further comprises: a filter element, wherein the filter element is disposed on the image sensing chip and the circuit a filter element disposed between the image sensing wafer and the lens structure, wherein the package structure has a single package surrounding the image sensing wafer And an accommodating space extending through the single package and communicating with the through opening, and all of the image sensing wafers are received in the accommodating space of the package structure.