TWI810857B - Packaging structure, lens module, and electronic device - Google Patents

Abstract

A packaging structure includes a flexible circuit board, an image sensor, a reinforcing board, and an adhesive layer. The flexible circuit board has a first opening, a first connecting portion, and a second connecting portion. The image sensor includes a photosensitive area and a connecting area. The connecting area is electrically connected to the first connecting portion through a conductor, and the photosensitive area is exposed from the first opening. The reinforcing plate is located on the surface of the image sensor away from the flexible circuit board. Along the extension direction of the flexible circuit board, the periphery of the reinforcing plate protrudes out of the image sensor, so that a receiving cavity is formed between the reinforcing plate and the second connecting portion. The adhesive layer is located in the receiving cavity and extends between the connection area and the first connection portion. A lens module including the packaging structure and an electronic device including the lens module are also disclosed.

Description

Package structure, lens module and electronic device

The present application relates to the field of electronic and optical devices, in particular to a packaging structure, a lens module and an electronic device.

Conventional image sensors have two main packaging structures, one is the combination of a wiring ceramic substrate and a flexible circuit board, the ceramic substrate is provided with a two-stage window for accommodating the image sensor and the optical path, and the image sensor accommodates Inside the window, the ceramic substrate containing the image sensor is electrically connected to the flexible circuit board through the anisotropic conductive adhesive. It is easy to break, and debris will fall to the surface of the image sensor, affecting the imaging quality of the image sensor; the other is to use a soft-hard combination board, and the hard board is used to accommodate the image sensor The image sensor is accommodated in one window, but the hard board is easy to drop debris during the windowing process, and the debris will fall to the surface of the image sensor , affecting the imaging quality of the image sensor.

In view of this, in order to solve at least one of the above problems, it is necessary to provide a packaging structure.

In addition, it is also necessary to provide a lens module and an electronic device including the packaging structure.

The present invention provides a packaging structure, the packaging structure includes: a flexible circuit board, an image sensor, a reinforcement board and an adhesive layer, the flexible circuit board has a first opening, a first connection surrounding the first opening portion, and a second connection portion surrounding and connected to the first connection portion; the image sensor includes a photosensitive area and a connection area surrounding the photosensitive area, and the connection The area is electrically connected to the first connection part through a conductor, and the photosensitive area is exposed to the first opening; the reinforcing plate is located on the surface of the image sensor away from the flexible circuit board, and along the The extending direction of the flexible circuit board, the peripheral edge of the reinforcing plate protrudes from the image sensor, so that an accommodation cavity is formed between the reinforcing plate and the second connecting part; the adhesive layer is located on the The accommodating chamber extends to between the connecting area and the first connecting portion.

In some possible implementation manners, the reinforcing plate is made of metal or plastic.

In some possible implementation manners, the reinforcing plate is bonded to the image sensor by another adhesive layer.

The present application also provides a packaging structure, the packaging structure includes: a flexible circuit board, a reinforcement board, an image sensor, and an adhesive layer, the flexible circuit board has a first opening, a first connection surrounding the first opening part, and a second connecting part surrounding the first connecting part and connected to the first connecting part; the reinforcing plate is located on the surface of the second connecting part, and the reinforcing plate has a second opening, so The second opening communicates with the first opening; the image sensor includes a photosensitive area and a connection area surrounding the photosensitive area, the image sensor is located in the second opening, and the connection The area is electrically connected to the first connection part through a conductor, the photosensitive area is exposed to the first opening, and the surface of the image sensor facing away from the flexible circuit board is lower than the surface of the reinforcing plate facing away from the The surface of the flexible circuit board; the adhesive layer is located between the reinforcing plate and the connection area, and extends to between the connection area and the first connection portion.

In some possible implementation manners, along the extending direction of the flexible circuit board, the size of the first opening is smaller than the size of the image sensor, and the size of the image sensor is smaller than that of the second opening. size.

In some possible implementations, the reinforcing plate is made of plastic, and the reinforcing plate is formed on the surface of the second connecting portion by injection molding.

In some possible implementation manners, the packaging structure further includes a passive element embedded in the reinforcing plate and electrically connected to the second connection part.

In some possible implementation manners, the glue layer also extends to the surface of the connection area away from the flexible circuit board.

The present application also provides a lens module, which includes the above-mentioned package structure and a lens element arranged on the package structure.

The present application also provides an electronic device, which includes a casing and the above-mentioned lens module located in the casing.

The packaging structure provided by this application only needs to open a first opening on the flexible circuit board. Compared with the conventional packaging structure, there is no need to set up two-stage opening windows, which simplifies the manufacturing process, and the assembly of the packaging structure is easier. The process has little impact on the flatness of the flexible circuit board; by setting a reinforcing plate on the surface of the image sensor away from the flexible circuit board, combined with the adhesive layer, a complete integrated structure can be formed to protect the image sensor and avoid image The damage of the sensor, especially the edge, improves the imaging quality of the image sensor, thereby improving the yield of the package structure; in addition, compared with the structure of the fixed image sensor in the conventional package structure, the thickness of the reinforcing plate is thinner , which is beneficial to reduce the total thickness of the packaging structure.

Another packaging structure provided by the present application can improve the strength and flatness of the flexible circuit board by forming a reinforcing plate on the surface of the flexible circuit board; by placing the reinforcement away from the surface of the flexible circuit board slightly beyond the image sensor Away from the surface of the flexible circuit board, the reinforcement board can well contain the edge of the image sensor without damage. The reinforcement board combined with the adhesive layer can form a complete containment structure to protect the image sensor and prevent the image sensor from being damaged It is the damage of the edge, which improves the imaging quality of the image sensor, thereby improving the yield rate of the packaging structure; and the adhesive layer can also improve the bonding strength between the image sensor and the flexible circuit board and the stability of the electrical connection; in addition, the reinforcement The board is directly injection-molded on the surface of the flexible circuit board, and the reinforcement board is not easy to break and does not generate debris, which reduces the risk of damage to the surface of the image sensor caused by debris.

100,200: package structure

1: Flexible printed circuit board

11: Medium layer

12: Line layer

13: The first soft board

131: First opening

132: The first connecting part

133: the second connection part

14: Second soft board

2: Image sensor

21: photosensitive area

22: Connection area

3,3a: Reinforcing plate

31: Second opening

4: Conductor

5,5a,7: Adhesive layer

6: Accommodating cavity

8: Passive components

300: Lens module

310: mirror holder

320: Lens assembly

400: Electronic devices

410: shell

L1, L2, L3: distance

a: direction

FIG. 1 is a schematic structural diagram of a packaging structure provided by an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a packaging structure provided by another embodiment of the present application.

FIG. 3 is a schematic structural diagram of a packaging structure provided by another embodiment of the present application.

FIG. 4 is a schematic structural diagram of a lens module provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In each embodiment of the present application, for convenience of description and not limitation of the present application, the term "connection" used in the specification of the patent application and the claims of the present application is not limited to physical or mechanical connection, no matter it is direct or indirect. of. "Up", "Down", "Above", "Bottom", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.

Please refer to FIG. 1 , an embodiment of the present application provides a packaging structure 100, including a flexible circuit board 1, an image sensor 2, a reinforcement board 3, a conductor 4 and an adhesive layer 5, and the flexible circuit board 1 has a first opening 131 , a first connecting portion 132 surrounding the first opening 131 , and a second connecting portion 133 surrounding the first connecting portion 132 and connected to the first connecting portion 132 . The image sensor 2 includes a photosensitive region 21 and a connection region 22 surrounding the photosensitive region 21, the connection region 22 is electrically connected to the first connection portion 132 through a conductor 4, and the photosensitive region 21 is exposed to the first opening 131 . The reinforcing plate 3 is located on the surface of the image sensor 2 away from the flexible circuit board 1, and along the extending direction a of the flexible circuit board 1, the peripheral edge of the reinforcing plate 3 protrudes from the image sensor. Detector 2, so that an accommodating chamber 6 is formed between the reinforcing plate 3 and the second connecting portion 133; the adhesive layer 5 is located in the accommodating chamber 6, and extends to the connecting area 22 and the accommodating chamber 6. Between the first connecting parts 132 mentioned above.

The flexible circuit board 1 includes a dielectric layer 11 and a circuit layer 12 distributed in the dielectric layer 11, and the circuit layer 12 is used for conducting electricity.

The flexible circuit board 1 includes a first flexible board 13 and a second flexible board 14 connected to each other. The first flexible board 13 is used for electrical connection with the image sensor 2, the second flexible board 14 is used for electrical connection with an external circuit, the first opening 131, the first connecting portion 132 and The second connecting portions 133 are located on the first soft board 13 .

The first opening 131 penetrates the first flexible circuit board 13 along the extending direction a perpendicular to the flexible circuit board 1 . The shape of the first opening 131 can be set according to actual needs, for example, it can be circular, square or rectangular.

The first connecting portion 132 surrounds the periphery of the first opening 131 . Wherein, a part of the circuit layer 12 located at the first connecting portion 132 is exposed to the dielectric layer 11 for electrical connection with the conductor 4 , and then realizes electrical connection with the image sensor 2 .

The image sensor 2 includes a photosensitive area 21 and a connection area 22 surrounding the photosensitive area 21. The photosensitive area 21 is used for light sensing, and the connection area 22 is used for connecting with the first flexible circuit board 1. A connecting portion 132 is electrically connected.

The photosensitive area 21 is arranged corresponding to the first opening 131, that is, the photosensitive area 21 is exposed to the first opening 131; the connecting area 22 corresponds to the first connecting portion 132, and the connecting area 22 is The conductor 4 is electrically connected to the first connecting portion 132 , and the conductor 4 is electrically connected to the circuit layer 12 . In this embodiment, the conductor 4 may be gold balls, solder balls, or silver glue.

The reinforcement board 3 is arranged on the surface of the image sensor 2 away from the flexible circuit board 1, and the reinforcement board 3 is pasted on the surface of the image sensor 2 by another adhesive layer 7. The reinforcing plate 3 can provide complete physical protection for the back of the image sensor 2, prevent the image sensor 2 from being damaged during the lens module assembly process, and improve product yield. The other adhesive layer 7 can be double-sided adhesive.

Along the extending direction a of the flexible circuit board 1 , the peripheral edge of the reinforcement board 3 slightly protrudes from the image sensor 2 , that is, the area of the reinforcement board 3 is slightly larger than the area of the image sensor 2 , so that the protruding edge of the reinforcing plate 3 can protect the most fragile corner of the image sensor 2 . In addition, an accommodating cavity 6 can be formed between the protruding edge portion of the reinforcing plate 3 and the second connecting portion 133, and this accommodating cavity 6 can be used to accommodate the adhesive layer 5, and the reinforcing plate 3 combined with the The adhesive layer 5 can cover the image sensor 2 to form a complete protection structure to protect the image sensor 2 from damage. In addition, the adhesive layer 5 in the accommodating cavity 6 also covers the conductor 4 , thereby improving the connection strength and connection stability between the image sensor 2 and the flexible circuit board 1 . Moreover, the reinforcing plate 3 is arranged on the surface of the image sensor 2, and the flexible circuit board 1 only needs to be connected with the image sensor 2 through a conductor 4, so that the flatness of the flexible circuit board 1 The impact on the resistance is small, and the problem of warping of the flexible circuit board 1 will not be caused.

The reinforcing plate 3 is made of metal, and the reinforcing plate 3 made of metal can also function as an electromagnetic shield, and at the same time, it can also enhance the heat dissipation efficiency of the image sensor 2 .

The reinforcing board 3 adopts a thinner metal plate combined with the adhesive layer 5 to achieve the above purpose of protecting the image sensor 2 , thus effectively reducing the thickness of the overall packaging structure 100 .

The adhesive layer 5 fills the gaps among the first connecting portion 132, the reinforcing board 3, the connecting area 22 and the conductor 4, and the adhesive layer 5 connects the flexible circuit board 1, The image sensor 2 , the reinforcing plate 3 and the conductor 4 are bonded together, so that the reinforcing plate 3 and the adhesive layer 5 form a structure covering the image sensor 2 and the conductor 4 to protect the image sensor 2 from damage, and can improve the connection strength and connection stability between the image sensor 2 and the flexible circuit board 1 . The glue layer 5 can be selected from UV (ultraviolet) curing glue or heat curing glue, etc. In this embodiment, the glue layer 5 is heat curing glue.

The assembly process of the package structure 100 includes the following steps:

Step S11: providing the flexible circuit board 1, the flexible circuit board 1 has a first opening 131, a first connecting portion 132 surrounding the first opening 131, and a first connecting portion 132 surrounding the first connecting portion 132 and The first connecting portion 132 is connected to the second connecting portion 133 .

Step S12: providing an image sensor 2, the image sensor 2 includes a photosensitive region 21 and a connection region 22 surrounding the photosensitive region 21, connecting the connection region 22 to the photosensitive region 22 through the conductor 4 The first connecting portion 132 is electrically connected and exposes the photosensitive region 21 to the first opening 131 .

Step S13: attaching the reinforcement board 3 on the surface of the image sensor 2 away from the flexible circuit board 1, and along the extension direction a of the flexible circuit board 1, the periphery of the reinforcement board 3 protrudes The image sensor 2 is protruded so that an accommodating cavity 6 is formed between the reinforcing plate 3 and the second connecting portion 133 .

Step S14: filling the accommodating cavity 6 with thermosetting glue, extending the thermosetting glue to between the connecting area 22 and the first connecting portion 132, and curing the thermosetting glue to form the adhesive layer 5, so as to obtain the packaging structure 100.

It can be understood that, in other implementation manners, the reinforcing plate 3 can also be pasted on the surface of the image sensor 2 first, and then the image sensor 2 pasted with the reinforcing plate 3 can be fixed on the surface of the image sensor 2. On the above-mentioned flexible circuit board 1, in this method, when installing the image sensor 2, the reinforcement board 3 is pasted first, so that the image can be The sensor 2 plays a certain protective role, which can further avoid damage to the edge and surface of the image sensor when the image sensor 2 is directly fixed on the flexible circuit board 1 .

The packaging structure 100 provided by this application only needs to open a first opening 131 on the flexible circuit board 1. Compared with the conventional packaging structure, there is no need to set two-stage window opening, which simplifies the manufacturing process and makes the assembly of the packaging structure 100 easier. It is easy, and the flatness of the flexible circuit board 1 is less affected during the assembly process; by arranging the reinforcing plate 3 on the surface of the image sensor 2 away from the flexible circuit board 1, and combining the adhesive layer 5, a complete integrated structure can be formed, In order to protect the image sensor 2, avoid damage to the image sensor 2, especially the edge, and improve the yield rate of the packaging structure 100; in addition, compared with the structure of fixing the image sensor 2 in the conventional packaging structure, the reinforcing plate 3 The thickness is thinner, which is beneficial to reduce the total thickness of the package structure 100 .

Please refer to FIG. 2 , another embodiment of the present application also provides a packaging structure 200. The difference between the packaging structure 200 and the packaging structure 100 of the previous embodiment is that the packaging structure 200 includes a reinforcing plate 3a and an adhesive layer 5a, so The reinforcing plate 3 a is located on the surface of the second connecting portion 133 , the reinforcing plate 3 a has a second opening 31 , and the second opening 31 communicates with the first opening 131 . The image sensor 2 is located in the second opening 31 , the connection area 22 is electrically connected to the first connection portion 132 through the conductor 4 , and the photosensitive area 21 is exposed to the first opening 131 The surface of the image sensor 2 facing away from the flexible circuit board 1 is lower than the surface of the reinforcement board 3 a facing away from the flexible circuit board 1 . The adhesive layer 5 a is located between the reinforcing plate 3 a and the connection area 22 , and extends to between the connection area 22 and the first connection portion 132 .

The surface of the reinforcing plate 3a facing away from the flexible circuit board 1 is slightly more than the surface of the image sensor 2 facing away from the flexible circuit board 1, which can protect the edge of the image sensor 2 to a certain extent. , reducing the risk of damage to the corners of the image sensor 2 . In addition, the reinforcing plate 3 a disposed on the surface of the second connecting portion 133 can also increase the strength of the flexible circuit board 1 and maintain the flatness of the flexible circuit board 1 , thereby improving the yield of the packaging structure 200 .

Along the extending direction a of the flexible circuit board 1 , the size L1 of the first opening 131 is smaller than the size L2 of the image sensor 2 , and the size L2 of the image sensor 2 is smaller than the second opening 31 The size L3.

The reinforcement board 3 a is insulated and connected to the flexible circuit board 1 , and the reinforcement board 3 a is connected to the dielectric layer 11 . Specifically, the reinforcing plate 3 a is made of plastic, and the reinforcing plate 3 a is formed on the surface of the second connecting portion 133 by injection molding.

Please refer to FIG. 2 again, the package structure 200 further includes a passive element 8 embedded in the reinforcing plate 3 a and electrically connected to the second connection portion 133 . Because the passive component 8 has been completely covered by the reinforcing plate 3a before the image sensor 2 is welded on the flexible circuit board 1, thereby preventing the soldering pollutants on the passive component 8 from falling into the The possibility on the image sensor 2 reduces the risk of damage to the surface of the image sensor 2 and improves the yield of the packaging structure 200 .

Please refer to FIG. 3 , the adhesive layer 5 a also extends to the surface of the connection area 22 away from the flexible circuit board 1 , that is, the adhesive layer 5 a covers the edge portion of the image sensor 2 for further protection. The edge of the image sensor 2 is not damaged.

The assembly process of the package structure 200 includes the following steps:

Step S21: providing the flexible circuit board 1, the flexible circuit board 1 has a first opening 131, a first connecting portion 132 surrounding the first opening 131, and a first connecting portion 132 surrounding the first connecting portion 132 and The first connecting portion 132 is connected to the second connecting portion 133 .

Step S22 : welding the passive element 8 on the surface of the second connecting portion 133 .

Step S23: welding the surface of the passive component 8 on the second connecting portion 133 to form the reinforcing plate 3a by injection molding, covering the passive component 8 with the reinforcing plate 3a, and the reinforcing plate 3a has The second opening 31 communicates with the first opening 131 .

Step S24: placing the image sensor 2 in the second opening 31, the image sensor 2 is set apart from the reinforcement board 3a and the flexible circuit board 1, the image sensor The photosensitive area 21 of the image sensor 2 is exposed to the first opening 131 , and the connection area 22 of the image sensor 2 is electrically connected to the first connection portion 132 through the conductor 4 . And the surface of the image sensor 2 facing away from the flexible circuit board 1 is lower than the surface of the reinforcing board 3 a facing away from the flexible circuit board 1 .

Step S25: filling the thermosetting glue between the reinforcing plate 3a and the connecting area 22, and extending the thermosetting glue to between the connecting area 22 and the first connecting portion 132, curing the thermosetting glue The adhesive layer 5 a is formed to obtain the packaging structure 200 .

The packaging structure 200 provided by the present application forms the reinforcing plate 3a on the surface of the flexible circuit board 1 by injection molding, and the second opening 31 for accommodating the image sensor 2 is formed during the injection molding process, without having to open two sections separately Formed window opening simplifies the manufacturing process, and the assembly of the packaging structure 100 is easier, and the formed reinforcing plate 3a can improve the strength and flatness of the flexible circuit board 1; Beyond the surface of the image sensor 2 facing away from the flexible circuit board 1, the reinforcing plate 3a can well contain the edge of the image sensor 2 without damage, and the reinforcing plate 3a can form a complete containing structure in combination with the adhesive layer 5a to protect The image sensor 2 can avoid damage to the image sensor 2, especially the edge, and improve the yield rate of the packaging structure 100, and the adhesive layer 5a can also improve the bonding strength and electrical connection between the image sensor 2 and the flexible circuit board 1 stability; the reinforcing plate 3a is directly injection-molded on the surface of the flexible circuit board 1 , the reinforcing plate 3a is not easy to break and does not generate debris, which reduces the risk of damage to the surface of the image sensor 2 caused by debris. In addition, the passive component 8 has been completely covered by the reinforcing plate 3a before the image sensor 2 is welded on the flexible circuit board 1, thereby preventing the soldering pollutants on the passive component 8 from falling to the possibility of the image sensor 2.

Please refer to FIG. 4 , referring to FIG. 1 and FIG. 2 in combination, the present application further provides a lens module 300 , the lens module 300 includes the packaging structure 100 ( 200 ), a mirror base 310 and a lens assembly 320 . The mirror base 310 is arranged on the surface of the packaging structure 100 (200) away from the reinforcing board 3 (3a), the mirror base 310 is connected to the first soft board 13, and the second soft board 14 protrudes extending from the mirror base 310 . The lens assembly 320 is disposed at an end of the mirror base 310 away from the packaging structure 100 ( 200 ).

Referring to FIG. 5 , the present application also provides an electronic device 400 , which includes a housing 410 and the above-mentioned lens module 300 . The lens module 300 can be applied to various electronic devices 400 with camera modules, fingerprint recognition modules or image projection modules, such as mobile phones, wearable devices, computer devices, vehicles or monitoring devices. In this embodiment, the lens module 300 is applied in a mobile phone.

100: Package structure

1: Flexible printed circuit board

11: Medium layer

12: Line layer

13: The first soft board

131: First opening

132: The first connecting part

133: the second connection part

14: Second soft board

2: Image sensor

21: Photosensitive area

22: Connection area

3: Reinforcing board

4: Conductor

5,7: Adhesive layer

6: Accommodating cavity

a: direction

Claims (6)

A package structure, wherein the package structure includes: a flexible circuit board, the flexible circuit board has a first opening, a first connection portion surrounding the first opening, and a first connection portion surrounding the first connection portion and The second connecting part connected to the first connecting part; the reinforcing plate is located on the surface of the second connecting part, the reinforcing plate has a second opening, and the second opening communicates with the first opening; image sense detector, including a photosensitive area and a connection area surrounding the photosensitive area, the image sensor is located in the second opening, the connection area is electrically connected to the first connection part through a conductor, The photosensitive area is exposed to the first opening, the surface of the image sensor facing away from the flexible circuit board is lower than the surface of the reinforcement board facing away from the flexible circuit board; and an adhesive layer is located on the reinforcement board Between the connection area and extending to between the connection area and the first connection part, the reinforcement plate is made of plastic, and the reinforcement plate is formed on the second connection by injection molding. surface of the part. The packaging structure according to claim 1, wherein, along the extending direction of the flexible circuit board, the size of the first opening is smaller than the size of the image sensor, and the size of the image sensor is smaller than the The size of the second opening. The package structure according to claim 1, further comprising a passive element embedded in the reinforcing plate and electrically connected to the second connection part. The package structure according to claim 1, wherein the glue layer also extends to the surface of the connection area away from the flexible circuit board. A lens module, wherein the lens module includes the package structure as described in any one of Claims 1 to 4 and a lens element disposed on the package structure. An electronic device, wherein, the electronic device includes a casing and the lens module according to claim 5 located in the casing.

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