CN111212202A

CN111212202A - Image acquisition module and portable electronic device

Info

Publication number: CN111212202A
Application number: CN201811397425.5A
Authority: CN
Inventors: 金川
Original assignee: Azurewave Technology Shanghai Co ltd
Current assignee: Azurewave Technology Shanghai Co ltd
Priority date: 2018-11-22
Filing date: 2018-11-22
Publication date: 2020-05-29

Abstract

The invention discloses an image acquisition module and a portable electronic device. The circuit substrate is provided with an upper surface, a lower surface and a through opening. The image sensing chip is arranged on the lower surface of the circuit substrate and is positioned below the through opening. The filter assembly is arranged on the upper surface of the circuit substrate and positioned above the through opening. The lens assembly includes a holder structure and a lens structure. The lower surface of the circuit substrate comprises a first welding point area, a second welding point area and a first welding-free area. The upper surface of the image sensing chip comprises an image sensing area, a first conductive area, a second conductive area and a first non-conductive area. The first welding spot area and the second welding spot area are respectively and electrically connected with the first conductive area and the second conductive area, and the first non-welding spot area corresponds to the first non-conductive area. Therefore, the width or the size of the image sensing chip in the horizontal direction can be reduced.

Description

Image acquisition module and portable electronic device

Technical Field

The present invention relates to an image capturing module and a portable electronic device, and more particularly, to an image capturing module and a portable electronic device for reducing the width of an image sensor.

Background

In the prior art, the CMOS (Complementary Metal-Oxide-Semiconductor) image sensor is based on the features of "low power consumption" and "small volume", so that the CMOS image sensor is easily integrated into a portable electronic product with special requirements, for example, the CMOS image sensor can be easily integrated into a portable electronic product with a small integration space, such as a smart phone, a tablet computer or a notebook computer.

However, the width of the conventional CMOS image sensor cannot be effectively shortened. Therefore, how to effectively shorten the width of the conventional CMOS image sensor by improving the structural design has become an important issue to be solved by the industry.

Disclosure of Invention

The present invention provides an image capturing module and a portable electronic device for overcoming the drawbacks of the prior art.

In order to solve the above technical problems, one of the technical solutions of the present invention is to provide an image capturing module, which includes a circuit substrate, an image sensing chip, a filter assembly and a lens assembly. The circuit substrate is provided with an upper surface, a lower surface and a through opening for connecting the upper surface and the lower surface. The image sensing chip is arranged on the lower surface of the circuit substrate and is positioned below the through opening. The filter assembly is arranged on the upper surface of the circuit substrate and positioned above the through opening. The lens assembly comprises a support structure arranged on the circuit substrate and a lens structure arranged on the support structure. The lower surface of the circuit substrate comprises a first welding point area adjacent to a first side edge of the through opening, a second welding point area adjacent to a second side edge of the through opening and a first welding-free area adjacent to a third side edge of the through opening. The upper surface of the image sensing chip comprises an image sensing area, a first conductive area, a second conductive area and a first non-conductive area, wherein the first conductive area is connected between a first side edge of the image sensing chip and a first side edge of the image sensing area, the second conductive area is connected between a second side edge of the image sensing chip and a second side edge of the image sensing area, and the first non-conductive area is connected between a third side edge of the image sensing chip and a third side edge of the image sensing area. The first pad area and the second pad area of the image sensor chip are electrically connected to the first conductive area and the second conductive area of the circuit board, respectively, and the first non-pad area of the image sensor chip corresponds to the first non-conductive area of the circuit board.

In order to solve the above technical problem, another technical solution of the present invention is to provide a portable electronic device, which includes a portable electronic module and an image capturing module. The image acquisition module is arranged on the portable electronic module and comprises a circuit substrate, an image sensing chip, a filtering component and a lens component. The circuit substrate is provided with an upper surface, a lower surface and a through opening for connecting the upper surface and the lower surface. The image sensing chip is arranged on the lower surface of the circuit substrate and is positioned below the through opening. The filter assembly is arranged on the upper surface of the circuit substrate and positioned above the through opening. The lens assembly comprises a support structure arranged on the circuit substrate and a lens structure arranged on the support structure. The lower surface of the circuit substrate comprises a first welding point area adjacent to a first side edge of the through opening, a second welding point area adjacent to a second side edge of the through opening and a first welding-free area adjacent to a third side edge of the through opening. The upper surface of the image sensing chip comprises an image sensing area, a first conductive area, a second conductive area and a first non-conductive area, wherein the first conductive area is connected between a first side edge of the image sensing chip and a first side edge of the image sensing area, the second conductive area is connected between a second side edge of the image sensing chip and a second side edge of the image sensing area, and the first non-conductive area is connected between a third side edge of the image sensing chip and a third side edge of the image sensing area. The first pad area and the second pad area of the image sensor chip are electrically connected to the first conductive area and the second conductive area of the circuit board, respectively, and the first non-pad area of the image sensor chip corresponds to the first non-conductive area of the circuit board.

In order to solve the above technical problem, another technical solution of the present invention is to provide an image capturing module, which includes a circuit substrate, an image sensing chip, a filter assembly, and a lens assembly. The circuit substrate is provided with an upper surface, a lower surface and a through opening for connecting the upper surface and the lower surface. The image sensing chip is arranged on the lower surface of the circuit substrate and is positioned below the through opening. The filter assembly is arranged on the upper surface of the circuit substrate and positioned above the through opening. The lens assembly comprises a support structure arranged on the circuit substrate and a lens structure arranged on the support structure. The lower surface of the circuit substrate comprises a first welding point area adjacent to a first side edge of the through opening and a first welding-free area adjacent to a second side edge of the through opening. The upper surface of the image sensing chip comprises an image sensing area, a first conductive area and a first non-conductive area, wherein the first conductive area is connected between a first side edge of the image sensing chip and a first side edge of the image sensing area, and the first non-conductive area is connected between a second side edge of the image sensing chip and a second side edge of the image sensing area. The first pad area of the image sensor chip is electrically connected to the first conductive area of the circuit substrate through a first solder ball, and the first non-pad area of the image sensor chip is connected to the first non-conductive area of the circuit substrate through a first adhesive.

One of the benefits of the image capture module and the portable electronic device provided by the present invention is that the lower surface of the circuit substrate includes a first solder point region adjacent to a first side of the through opening, a second solder point region adjacent to a second side of the through opening, and a first non-solder area adjacent to a third side of the through opening, the upper surface of the image sensing chip includes an image sensing area, a first conductive area, a second conductive area, and a first non-conductive area, the first conductive area is connected between the first side of the image sensing chip and the first side of the image sensing area, the second conductive area is connected between the second side of the image sensing chip and the second side of the image sensing area, and the first non-conductive area is connected between the third side of the image sensing chip and the third side of the image sensing area And the first conductive area and the second conductive area of the image sensing chip are respectively and electrically connected to the first welding point area and the second welding point area of the circuit substrate, and the first non-conductive area of the image sensing chip corresponds to the first non-welding point area of the circuit substrate, so as to reduce the width or size of the image sensing chip in the horizontal direction.

The image capturing module of the present invention has another advantageous effect in that the lower surface of the circuit substrate includes a first solder point region adjacent to a first side of the through opening and a first non-solder region adjacent to a second side of the through opening, the upper surface of the image sensing chip includes an image sensing region, a first conductive region and a first non-conductive region, the first conductive region is connected between a first side of the image sensing chip and the first side of the image sensing region, the first non-conductive region is connected between a second side of the image sensing chip and the second side of the image sensing region, and the first conductive region of the image sensing chip is electrically connected to the first solder point region of the circuit substrate through a first solder ball, the first non-conductive area of the image sensing chip is connected to the first non-pad area of the circuit substrate through a first adhesive, so as to reduce the width or size of the image sensing chip in the horizontal direction.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic top view of an image sensing chip of an image capturing module according to a first embodiment of the invention.

Fig. 2 is a schematic bottom view of a circuit substrate of an image capturing module according to a first embodiment of the invention.

Fig. 3 is a schematic cross-sectional view of an image capturing module according to a first embodiment of the invention.

Fig. 4 is a schematic top view of an image sensor chip of an image capturing module according to a second embodiment of the invention.

Fig. 5 is a bottom view of a circuit substrate of an image capturing module according to a second embodiment of the invention.

Fig. 6 is a first top view of an image sensor chip of an image capturing module according to a third embodiment of the present invention.

Fig. 7 is a first bottom view of a circuit substrate of an image capturing module according to a third embodiment of the invention.

Fig. 8 is a second top view of an image sensor chip of an image capturing module according to a fourth embodiment of the present invention.

Fig. 9 is a second bottom view of the circuit substrate of the image capturing module according to the fourth embodiment of the invention.

Fig. 10 is a diagram illustrating a portable electronic device according to a fifth embodiment of the invention.

Detailed Description

The following description is provided for the embodiments of the image capturing module and the portable electronic device disclosed in the present disclosure by specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Referring to fig. 1 to 3, a first embodiment of the invention provides an image capturing module M, which includes: a circuit substrate 1, an image sensing chip 2, a filter component 3 and a lens component 4.

First, the circuit substrate 1 has an upper surface 11 and a lower surface 12. The circuit board 1 has a through opening 13 connecting the upper surface 11 and the lower surface 12. Further, the lower surface 12 of the circuit substrate 1 may include a first pad area 14 adjacent to a first side 131 of the through opening 13, a second pad area 15 adjacent to a second side 132 of the through opening 13, and a first no-pad area 16 adjacent to a third side 133 of the through opening 13. For example, the circuit substrate 1 may be a PCB (e.g. BT, FR4, FR5 material), a rigid-flex board, or a ceramic substrate, but the invention is not limited thereto.

Furthermore, the image sensing chip 2 is electrically connected to the circuit substrate 1, and the image sensing chip 2 is disposed on the lower surface 12 of the circuit substrate 1 and below the through opening 13. Further, the upper surface 21 of the image sensor chip 2 includes an image sensor region 22, a first conductive region 23, a second conductive region 24 and a first non-conductive region 25, the first conductive region 23 is connected between a first side 201 of the image sensor chip 2 and a first side 221 of the image sensor region 22, the second conductive region 24 is connected between a second side 202 of the image sensor chip 2 and a second side 222 of the image sensor region 22, and the first non-conductive region 25 is connected between a third side 203 of the image sensor chip 2 and a third side 223 of the image sensor region 22. And the image sensing area 22 of the image sensing chip 2 faces the through opening 13 of the circuit substrate 1. For example, the image sensor chip 2 may be a Complementary Metal Oxide Semiconductor (CMOS) sensor or any sensor with image capturing function, but the invention is not limited thereto.

Therefore, the image sensor chip 2 can be electrically connected to the first pad area 14 and the second pad area 15 of the circuit substrate 1 through the first conductive area 23 and the second conductive area 24, respectively, and the first non-conductive area 25 of the image sensor chip 2 corresponds to the first non-pad area 16 of the circuit substrate 1.

The image obtaining module M further includes: a filter component 3 disposed on the upper surface 11 of the circuit substrate 1 and above the through opening 13. For example, the filter element 3 may be directly disposed on the image sensor chip 2 through an adhesive (as shown in fig. 3), or the filter element 3 may be supported by a plurality of pillars (not shown) and disposed above the image sensor chip 2. In addition, the filter assembly 3 may be a coated glass or an uncoated glass, but the invention is not limited to this example.

And the image acquisition module M further comprises: a lens assembly 4 includes a frame structure 41 disposed on the circuit substrate 1 and a lens structure 42 disposed on the frame structure 41. For example, the frame structure 41 may be a common base or any type of Voice Coil Motor (VCM), and the lens structure 42 may be composed of a plurality of lenses, the lens structure 42 corresponds to the image sensing area 22, and the lens structure 42 may be fixedly or movably disposed on the frame structure 41 according to different usage requirements, but the invention is not limited thereto. In addition, the supporting structure 41 may be disposed on the upper surface 101 of the circuit substrate 1 by an adhesive (not shown), but the invention is not limited thereto.

In summary, since the first pad region 14, the second pad region 15, the first conductive region 23, and the second conductive region 24 are disposed on two sides of the circuit board 1 and the image sensor chip 2 to electrically connect the circuit board 1 and the image sensor chip 2, the width or the size of the other two sides of the circuit board 1 and the image sensor chip 2 in the horizontal direction can be reduced. That is, since the solder pad regions and the conductive regions can be omitted on the other two sides of the circuit board 1 and the image sensor chip 2, the width of the circuit board 1 and the image sensor chip 2 in the horizontal direction (X direction) can be reduced. Therefore, the size of the image sensing chip 2 in the horizontal direction is reduced.

More specifically, the first pad region 14 may include a plurality of first pads 141, the second pad region 15 may include a plurality of second pads 151, the first conductive region 23 may include a plurality of first conductive portions 231, the second conductive region 24 may include a plurality of second conductive portions 241, the plurality of first conductive portions 231 are electrically connected to the plurality of first pads 141 through a plurality of first solder balls 51, respectively, and the plurality of second conductive portions 241 are electrically connected to the plurality of second pads 151 through a plurality of second solder balls 52, respectively. Wherein the first pad area 14 is disposed opposite to the second pad area 15, and the first non-pad area 16 is disposed between the first pad area 14 and the second pad area 15. For example, a plurality of first pads 141 may be disposed on the first pad region 14 of the circuit substrate 1, a plurality of second pads 151 may be disposed on the second pad region 15, a plurality of first conductive portions 231 may be disposed on the first conductive region 23 of the image sensor chip 2, and a plurality of second conductive portions 241 may be disposed on the second conductive region 24. Therefore, the first conductive parts 231 of the image sensor chip 2 are electrically connected to the first pads 141 through the first solder balls 51, and the second conductive parts 241 are electrically connected to the second pads 151 through the second solder balls 52.

It should be noted that the lower surface 12 of the circuit substrate 1 includes a second non-solder region 17 adjacent to a fourth side 134 of the through opening 13, the upper surface 21 of the image sensor chip 2 includes a second non-conductive region 26 connected between a fourth side 204 of the image sensor chip 2 and a fourth side 224 of the image sensor region 22, and the second non-conductive region 26 of the image sensor chip 2 corresponds to the second non-solder region 17 of the circuit substrate 1. A first adhesive is disposed between the first no-solder area 16 and the first non-conductive area 25, and a second adhesive is disposed between the second no-solder area 17 and the second non-conductive area 26. The first pad area 14 is disposed opposite the second pad area 15, the first non-pad area 16 is disposed opposite the second non-pad area 17, and both the first non-pad area 16 and the second non-pad area 17 are disposed between the first pad area 14 and the second pad area 15.

For example, the second no-solder region 17 of the circuit substrate 1 is opposite to the first no-solder region 16, the second non-conductive region 26 of the image sensor chip 2 is opposite to the first non-conductive region 25, and the second non-conductive region 26 of the image sensor chip 2 corresponds to the second no-solder region 17 of the circuit substrate 1. Therefore, the first non-conductive area 25 of the image sensor chip 2 can be connected to the first non-solder area 16 of the circuit substrate 1 by a first adhesive (not shown), and the second non-conductive area 26 of the image sensor chip 2 can be connected to the second non-solder area 17 by a second adhesive (not shown), wherein the first adhesive and the second adhesive can be adhesives made of epoxy or silicone, or can be UV glue, thermosetting glue or AB glue.

However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

[ second embodiment ]

Referring to fig. 4 and 5, a second embodiment of the invention provides an image capturing module M, which includes: a circuit substrate 1, an image sensing chip 2, a filter component 3 and a lens component 4. As can be seen from comparing fig. 4 and 5 with fig. 1 and 2, the greatest difference between the second embodiment of the present invention and the first embodiment is: the lower surface 12 of the circuit substrate 1 includes a third pad region 18 adjacent to a fourth side 134 of the through opening 13, the upper surface 21 of the image sensor chip 2 includes a third conductive region 27 connected between a fourth side 204 of the image sensor chip 2 and a fourth side 224 of the image sensor chip 22, and the third conductive region 27 of the image sensor chip 2 is electrically connected to the third pad region 18 of the circuit substrate 1. The third pad region 18 includes a plurality of third pads 181, the third conductive region 27 includes a plurality of third conductive portions 271, and the plurality of third conductive portions 271 are electrically connected to the plurality of third pads 181 through a plurality of third solder balls, respectively. The first pad area 14 is disposed opposite the second pad area 15, the third pad area 18 is disposed opposite the first no pad area 16, and both the third pad area 18 and the first no pad area 16 are disposed between the first pad area 14 and the second pad area 15.

For example, the present invention may provide the third pad area 18 adjacent to the fourth side 134 of the through opening 13 and the third conductive area 27 between the fourth side 204 of the image sensor chip 2 and the fourth side 224 of the image sensor area 22 according to different design requirements. Furthermore, the lower surface 12 of the circuit substrate 1 of the image capturing module M of the present embodiment includes a third pad area 18, a plurality of third pads 181 can be disposed on the third pad area 18, and the third pad area 18 is disposed opposite to the first pad area 16 and between the first pad area 14 and the second pad area 15. The upper surface 21 of the image sensor chip 2 includes a third conductive region 27, a plurality of third conductive portions 271 can be disposed on the third conductive region 27, and the third conductive region 27 is disposed opposite to the first non-conductive region 25 and between the first conductive region 23 and the second conductive region 24. The third conductive portions 271 of the image sensor chip 2 can be electrically connected to the third pads 181 through third solder balls (not shown, similar to the arrangement of the first solder balls 51 and the second solder balls 52 shown in fig. 3).

[ third embodiment ]

Referring to fig. 6 to 9, a third embodiment of the invention provides an image capturing module M, which includes: a circuit substrate 1, an image sensing chip 2, a filter component 3 and a lens component 4. As can be seen from comparing fig. 6 and 7 with fig. 1 and 2, or fig. 8 and 9 with fig. 1 and 2, the third embodiment of the present invention is different from the first embodiment in the following ways: the lower surface 12 of the circuit substrate 1 includes a first pad area 14 adjacent to a first side 131 of the through opening 13 and a first non-pad area 16 adjacent to a second side 132 of the through opening 13. The upper surface 21 of the image sensor chip 2 includes an image sensor region 22, a first conductive region 23 and a first non-conductive region 25, the first conductive region 23 is connected between a first side 201 of the image sensor chip 2 and a first side 221 of the image sensor region 22, and the first non-conductive region 25 is connected between a second side 202 of the image sensor chip 2 and a second side 222 of the image sensor region 22. The first conductive region 23 of the image sensor chip 2 is electrically connected to the first pad region 14 of the circuit substrate 1 through a first solder ball 51, and the first non-conductive region 25 of the image sensor chip 2 is connected to the first pad-free region 16 of the circuit substrate 1 through a first adhesive.

For example, the present invention may provide the first non-solder region 16 adjacent to the second side 132 of the through opening 13 and the first non-conductive region 25 between the second side 202 of the image sensor chip 2 and the second side 222 of the image sensor region 22 according to different design requirements. More specifically, the first conductive region 23 of the image sensor chip 2 is electrically connected to the first pad region 14 of the circuit substrate 1 via a first solder ball 51 (as shown in fig. 3), and the first non-conductive region 25 of the image sensor chip 2 is connected to the first non-pad region 16 of the circuit substrate 1 via a first adhesive.

More specifically, referring to fig. 6 and 7, a variation of the image capturing module M according to the third embodiment of the present invention is shown. Further, the image sensing chip 2 of the image capturing module M according to the fifth embodiment of the present invention can be designed to be eccentric. For example, the lower surface 12 of the circuit substrate 1 of the image capturing module M includes a second pad area 15 adjacent to a third side 133 of the through opening 13, and the second pad area 15 is located between the first pad area 14 and the first non-pad area 16. The upper surface 21 of the image sensor chip 2 includes a second conductive region 24 connected between a third side 203 of the image sensor chip 2 and a third side 223 of the image sensor region 22, and the second conductive region 24 of the image sensor chip 2 is electrically connected to the second pad region 15 of the circuit substrate 1 through the second solder ball 52 (shown in fig. 3).

In addition, referring to fig. 8 and 9, another variation of the image capturing module M according to the third embodiment of the present invention is shown. Further, the lower surface 12 of the circuit substrate 1 may further include a second non-solder region 17 adjacent to a third side 133 of the through opening 13 and a third non-solder region 19 adjacent to a fourth side 134 of the through opening 13. The upper surface 21 of the image sensor chip 2 includes a second non-conductive region 26 and a third non-conductive region 28, the second non-conductive region 26 is connected between a third side 203 of the image sensor chip 2 and a third side 223 of the image sensor region 22, and the third non-conductive region 28 is connected between a fourth side 204 of the image sensor chip 2 and a fourth side 224 of the image sensor region 22. The second non-conductive region 26 of the image sensor chip 2 is connected to the second non-pad region 17 of the circuit substrate 1 by a second adhesive, and the third non-conductive region 28 of the image sensor chip 2 is connected to the third non-pad region 19 of the circuit substrate 1 by a third adhesive.

[ fourth embodiment ]

Referring to fig. 10 and fig. 1 to 9, a fourth embodiment of the invention provides a portable electronic device Z, which includes: a portable electronic module P and an image acquisition module M. The image acquisition module M is disposed on the portable electronic module P, and the image acquisition module P includes: a circuit substrate 1, an image sensing chip 2, a filter component 3 and a lens component 4. For example, the portable electronic module P may be a mobile phone, a notebook computer or a tablet computer, but the invention is not limited thereto; and any one of the image capturing modules M of the first to third embodiments can be installed in the portable electronic module P, so that the electronic module P can perform image capturing through the image capturing module M. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

[ advantageous effects of the embodiments ]

One of the advantages of the image capturing module M and the portable electronic device Z provided by the present invention is that the lower surface 12 of the circuit substrate 1 may include a first solder joint area 14 adjacent to a first side 131 of the through opening 13, a second solder joint area 15 adjacent to a second side 132 of the through opening 13, and a first solder free area 16 adjacent to a third side 133 of the through opening 13, the upper surface 21 of the image sensing chip 2 includes an image sensing area 22, a first conductive area 23, a second conductive area 24, and a first non-conductive area 25, the first conductive area 23 is connected between a first side 201 of the image sensing chip 2 and a first side 221 of the image sensing area 22, the second conductive area 24 is connected between a first side 202 of the image sensing chip 2 and a second side 222 of the image sensing area 22, the first non-conductive region 25 is connected between a third side 203 of the image sensing chip 2 and a third side 223 of the image sensing region 22, and the first conductive region 23 and the second conductive region 24 are electrically connected to the first pad region 14 and the second pad region 15 of the circuit substrate 1, respectively, and the first non-conductive region 25 of the image sensing chip 2 corresponds to the first pad region 16 of the circuit substrate 1, so as to reduce the width or size of the image sensing chip in the horizontal direction.

Another advantageous effect of the present invention is that the image capturing module M provided by the present invention can be obtained by "the lower surface 12 of the circuit substrate 1 includes a first pad region 14 adjacent to a first side 131 of the through opening 13 and a first non-pad region 16 adjacent to a second side 132 of the through opening 13", "the upper surface 21 of the image sensing chip 2 includes an image sensing region 22, a first conductive region 23 and a first non-conductive region 25", the first conductive region 23 is connected between a first side 201 of the image sensing chip 2 and a first side 221 of the image sensing region 22, the first non-conductive region 25 is connected between a first side 202 of the image sensing chip 2 and a second side 222 of the image sensing region 22 ", and" the first conductive region 23 of the image sensing chip 2 is electrically connected to the first pad region 14 of the circuit substrate 1 through a first solder ball 51, the first non-conductive area 25 of the image sensor chip 2 is connected to the first non-pad area 16 ″ of the circuit substrate 1 by a first adhesive, so as to reduce the width or size of the image sensor chip in the horizontal direction.

Furthermore, compared to the prior art, in the image capturing module M and the portable electronic device Z of the present invention, at least one side of the circuit substrate 1 and the image sensing chip 2 can be electrically connected to the circuit substrate 1 and the image sensing chip 2 by disposing the first pad region 14 and the first conductive region 23, so that the width or the size of at least two sides of the circuit substrate 1 and the image sensing chip 2 in the horizontal direction can be reduced. That is, since the pad region and the conductive region can be omitted from at least one side of the circuit board 1 and the image sensor chip 2, the width of the circuit board 1 and the image sensor chip 2 in the horizontal direction (X direction) can be reduced. Therefore, the size of the image sensing chip 2 in the horizontal direction is reduced.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims

1. An image acquisition module, comprising:

a circuit substrate having an upper surface, a lower surface and a through opening connecting the upper surface and the lower surface;

an image sensing chip arranged on the lower surface of the circuit substrate and positioned below the through opening;

a filter assembly disposed on the upper surface of the circuit substrate and above the through opening; and

the lens assembly comprises a support structure arranged on the circuit substrate and a lens structure arranged on the support structure;

the lower surface of the circuit substrate comprises a first welding spot area adjacent to a first side edge of the through opening, a second welding spot area adjacent to a second side edge of the through opening and a first non-welding spot area adjacent to a third side edge of the through opening;

the upper surface of the image sensing chip comprises an image sensing area, a first conductive area, a second conductive area and a first non-conductive area, wherein the first conductive area is connected between a first side edge of the image sensing chip and a first side edge of the image sensing area, the second conductive area is connected between a second side edge of the image sensing chip and a second side edge of the image sensing area, and the first non-conductive area is connected between a third side edge of the image sensing chip and a third side edge of the image sensing area;

the first conductive area and the second conductive area of the image sensing chip are electrically connected to the first pad area and the second pad area of the circuit substrate, respectively, and the first non-conductive area of the image sensing chip corresponds to the first non-pad area of the circuit substrate.

2. The image capturing module of claim 1, wherein the first pad area comprises a plurality of first pads, the second pad area comprises a plurality of second pads, the first conductive area comprises a plurality of first conductive portions, the second conductive area comprises a plurality of second conductive portions, the first conductive portions are electrically connected to the first pads through a plurality of first solder balls, respectively, and the second conductive portions are electrically connected to the second pads through a plurality of second solder balls, respectively; the first welding point area and the second welding point area are arranged oppositely, and the first welding-free area is arranged between the first welding point area and the second welding point area.

3. The image capturing module of claim 1, wherein the lower surface of the circuit substrate includes a second non-solder region adjacent to a fourth side of the through opening, the upper surface of the image sensor chip includes a second non-conductive region connected between a fourth side of the image sensor chip and a fourth side of the image sensor region, the second non-conductive region of the image sensor chip corresponding to the second non-solder region of the circuit substrate; wherein a first adhesive is disposed between the first non-solder area and the first non-conductive area, and a second adhesive is disposed between the second non-solder area and the second non-conductive area; the first welding point area and the second welding point area are arranged oppositely, the first welding-free area and the second welding-free area are arranged oppositely, and the first welding-free area and the second welding-free area are arranged between the first welding point area and the second welding point area.

4. The image capturing module of claim 1, wherein the lower surface of the circuit substrate includes a third pad region adjacent to a fourth side of the through opening, the upper surface of the image sensor chip includes a third conductive region connected between a fourth side of the image sensor chip and a fourth side of the image sensor region, the third conductive region of the image sensor chip is electrically connected to the third pad region of the circuit substrate; the third welding spot area comprises a plurality of third welding pads, the third conductive area comprises a plurality of third conductive parts, and the third conductive parts are respectively electrically connected with the third welding pads through a plurality of third solder balls; the first welding point area and the second welding point area are arranged oppositely, the third welding point area and the first welding-free area are arranged oppositely, and the third welding point area and the first welding-free area are arranged between the first welding point area and the second welding point area.

5. A portable electronic device, comprising:

a portable electronic module; and

an image acquisition module, it sets up on this portable electronic module, this image acquisition module includes:

6. The portable electronic device of claim 5, wherein the first pad area comprises a plurality of first pads, the second pad area comprises a plurality of second pads, the first conductive area comprises a plurality of first conductive portions, the second conductive area comprises a plurality of second conductive portions, the first conductive portions are electrically connected to the first pads through a plurality of first solder balls, respectively, and the second conductive portions are electrically connected to the second pads through a plurality of second solder balls, respectively; the first welding point area and the second welding point area are arranged oppositely, and the first welding-free area is arranged between the first welding point area and the second welding point area.

7. The portable electronic device of claim 5, wherein the lower surface of the circuit substrate includes a second non-solder-point region adjacent to a fourth side of the through opening, the upper surface of the image sensor chip includes a second non-conductive region connected between a fourth side of the image sensor chip and a fourth side of the image sensor region, the second non-conductive region of the image sensor chip corresponding to the second non-solder-point region of the circuit substrate; wherein a first adhesive is disposed between the first non-solder area and the first non-conductive area, and a second adhesive is disposed between the second non-solder area and the second non-conductive area; the first welding point area and the second welding point area are arranged oppositely, the first welding-free area and the second welding-free area are arranged oppositely, and the first welding-free area and the second welding-free area are arranged between the first welding point area and the second welding point area.

8. The portable electronic device of claim 5, wherein the lower surface of the circuit substrate includes a third pad region adjacent to a fourth side of the through opening, the upper surface of the image sensor chip includes a third conductive region connected between a fourth side of the image sensor chip and a fourth side of the image sensor region, the third conductive region of the image sensor chip is electrically connected to the third pad region of the circuit substrate; the third welding spot area comprises a plurality of third welding pads, the third conductive area comprises a plurality of third conductive parts, and the third conductive parts are respectively electrically connected with the third welding pads through a plurality of third solder balls; the first welding point area and the second welding point area are arranged oppositely, the third welding point area and the first welding-free area are arranged oppositely, and the third welding point area and the first welding-free area are arranged between the first welding point area and the second welding point area.

9. An image acquisition module, comprising:

the lower surface of the circuit substrate comprises a first welding spot area adjacent to a first side edge of the through opening and a first non-welding spot area adjacent to a second side edge of the through opening;

the upper surface of the image sensing chip comprises an image sensing area, a first conductive area and a first non-conductive area, wherein the first conductive area is connected between a first side edge of the image sensing chip and a first side edge of the image sensing area, and the first non-conductive area is connected between a second side edge of the image sensing chip and a second side edge of the image sensing area;

the first conductive region of the image sensing chip is electrically connected to the first pad region of the circuit substrate through a first solder ball, and the first non-conductive region of the image sensing chip is connected to the first pad-free region of the circuit substrate through a first adhesive.

10. The image capturing module of claim 9, wherein the lower surface of the circuit substrate includes a second non-solder region adjacent to a third side of the through opening and a third non-solder region adjacent to a fourth side of the through opening; the upper surface of the image sensing chip comprises a second non-conductive area and a third non-conductive area, wherein the second non-conductive area is connected between a third side of the image sensing chip and a third side of the image sensing area, and the third non-conductive area is connected between a fourth side of the image sensing chip and a fourth side of the image sensing area; the second non-conductive area of the image sensing chip is connected to the second non-bonding area of the circuit substrate through a second adhesive, and the third non-conductive area of the image sensing chip is connected to the third non-bonding area of the circuit substrate through a third adhesive.