CN216162777U - Portable electronic device and image extraction module thereof - Google Patents
Portable electronic device and image extraction module thereof Download PDFInfo
- Publication number
- CN216162777U CN216162777U CN202122182517.5U CN202122182517U CN216162777U CN 216162777 U CN216162777 U CN 216162777U CN 202122182517 U CN202122182517 U CN 202122182517U CN 216162777 U CN216162777 U CN 216162777U
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- lens
- image sensing
- substrate
- conductive contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000605 extraction Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 234
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 92
- 239000002184 metal Substances 0.000 claims description 40
- 230000002787 reinforcement Effects 0.000 claims description 34
- 239000000945 filler Substances 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims 6
- 239000004020 conductor Substances 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Images
Landscapes
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The utility model discloses a portable electronic device and an image extraction module thereof. The image extraction module comprises a circuit substrate, an image sensing chip, a rigid reinforcing structure and a lens assembly. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is arranged on the circuit substrate and electrically connected to the circuit substrate, and comprises an image sensing area and a plurality of chip conductive contacts electrically connected to the plurality of substrate conductive contacts respectively. The rigid reinforcing structure is disposed on the circuit board. The lens assembly comprises a lens bracket and a lens structure arranged on the lens bracket, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. The vertical projections of the substrate conductive contacts and the chip conductive contacts fall on the rigid reinforcing structure, so that the structural strength and the surface flatness of a preset area of the circuit substrate are improved.
Description
Technical Field
The present invention relates to a portable electronic device and an image capturing module thereof, and more particularly, to an image capturing module for enhancing the structural strength and surface flatness of a circuit board, and a portable electronic device using the image capturing module.
Background
In the prior art, when a circuit substrate for carrying the image sensing chip is bent, the electrical connection between the image sensing chip and the circuit substrate is damaged, which results in a short circuit.
SUMMERY OF THE UTILITY MODEL
The present invention provides a portable electronic device and an image capturing module thereof, which are directed to overcome the shortcomings of the prior art.
In order to solve the above technical problems, one of the technical solutions of the present invention is to provide an image capturing module, which includes a circuit board, an image sensing chip, a rigid reinforcing structure, and a lens assembly. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is arranged on the circuit substrate and electrically connected to the circuit substrate, and comprises an image sensing area and a plurality of chip conductive contacts electrically connected to the plurality of substrate conductive contacts respectively. The rigid reinforcing structure is disposed on the circuit board. The lens assembly comprises a lens bracket and a lens structure arranged on the lens bracket, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. Wherein, the vertical projection of the substrate conductive contacts and the chip conductive contacts is on the rigid reinforcing structure.
In order to solve the above technical problem, another technical solution of the present invention is to provide a portable electronic device, wherein the portable electronic device uses an image capturing module, and the image capturing module includes: a circuit substrate, an image sensing chip, a rigid reinforcing structure and a lens component. The circuit substrate has a plurality of substrate conductive contacts. The image sensing chip is arranged on the circuit substrate and electrically connected to the circuit substrate, and comprises an image sensing area and a plurality of chip conductive contacts electrically connected to the plurality of substrate conductive contacts respectively. The rigid reinforcing structure is disposed on the circuit board. The lens assembly comprises a lens bracket and a lens structure arranged on the lens bracket, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip. Wherein, the vertical projection of the substrate conductive contacts and the chip conductive contacts is on the rigid reinforcing structure.
More specifically, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole connected to the upper surface and the lower surface. The plurality of substrate conductive contacts are disposed on the lower surface of the circuit substrate, the image sensing chip is disposed on the lower surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are electrically connected to the plurality of substrate conductive contacts of the circuit substrate, respectively, by flip chip bonding. The rigid reinforcing structure is arranged on the upper surface of the circuit substrate in a surrounding manner and surrounds the through hole, and the lens support of the lens assembly is adhered to the rigid reinforcing structure through an adhesion layer. The rigid reinforcing structure is provided with an outer surrounding, and the outer surrounding of the rigid reinforcing structure is covered by the lens support or is exposed by the lens support. The upper surface of the circuit substrate has a surrounding clearance area connected to and surrounding the through hole, and the surrounding clearance area of the upper surface of the circuit substrate is surrounded by and exposed by the rigid reinforcing structure. The lower surface of the circuit substrate has a surrounding contact area surrounding the through-hole and for carrying a plurality of the substrate conductive contacts, the upper surface of the circuit substrate has a structural reinforcement area surrounding the surrounding clearance area and corresponding to the surrounding contact area, and all or a portion of the rigid reinforcement structure is disposed on the structural reinforcement area for increasing the structural strength and surface flatness of both the structural reinforcement area and the surrounding contact area of the circuit substrate.
More specifically, the circuit substrate has an upper surface and a lower surface opposite to the upper surface. The image sensing chip is arranged on the upper surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are respectively and electrically connected with the plurality of substrate conductive contacts of the circuit substrate through wire bonding. The rigid reinforcing structure is arranged on the lower surface of the circuit substrate, the lens support of the lens component is adhered to the circuit substrate through an adhesion layer, and the vertical projection of the lens support of the lens component is arranged on the rigid reinforcing structure. The upper surface of the circuit substrate is provided with a surrounding joint area which surrounds the image sensing chip and is used for bearing a plurality of substrate conductive joints, the lower surface of the circuit substrate is provided with a structural strengthening area corresponding to the surrounding joint area, and all or part of the rigid strengthening structure is arranged on the structural strengthening area so as to increase the structural strength and the surface flatness of the structural strengthening area and the surrounding joint area of the circuit substrate.
One of the benefits of the present invention is that the portable electronic device and the image capturing module thereof provided by the present invention can be used to increase the structural strength (structural strength) and the surface flatness (surface flatness) of a predetermined area of the circuit substrate by the technical solutions of "the rigid reinforcement structure is disposed on the circuit substrate" and "the vertical projections of the plurality of substrate conductive contacts and the plurality of chip conductive contacts all fall on the rigid reinforcement structure".
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the utility model, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and not for purposes of limitation.
Drawings
Fig. 1 is a schematic cross-sectional view of an image extraction module according to a first embodiment of the utility model.
Fig. 2 is a schematic top view of a part of an image extraction module according to a first embodiment of the utility model.
Fig. 3 is a schematic cross-sectional view of an image extraction module according to a second embodiment of the utility model.
Fig. 4 is a schematic cross-sectional view of an image extraction module according to a third embodiment of the utility model.
Fig. 5 is a schematic top view of an image extraction module according to a third embodiment of the utility model.
Fig. 6 is a schematic cross-sectional view of an image extraction module according to a fourth embodiment of the utility model.
Fig. 7 is a schematic cross-sectional view of an image extraction module according to a fifth embodiment of the utility model.
Fig. 8 is a schematic cross-sectional view of an image extraction module according to a sixth embodiment of the utility model.
Fig. 9 is a schematic cross-sectional view of an image extraction module according to a seventh embodiment of the utility model.
Fig. 10 is a schematic top view of an image extraction module according to a seventh embodiment of the utility model.
Fig. 11 is a functional block diagram of a portable electronic device using an image capturing module according to an eighth embodiment of the utility model.
Detailed Description
The following description is provided for the embodiments of the portable electronic device and the image capturing module thereof according to the present disclosure, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The utility model is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. It should be noted that the drawings of the present invention are merely schematic illustrations and are not drawn to actual dimensions. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
Referring to fig. 1 to 10, the present invention provides an image capturing module M and a portable electronic device P using the image capturing module M, and the image capturing module M includes a circuit board 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. More specifically, the circuit board 1 has a plurality of board conductive contacts 11. The image sensing chip 2 is disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1, and the image sensing chip 2 includes an image sensing area 21 and a plurality of chip conductive contacts 22 electrically connected to the plurality of substrate conductive contacts 11, respectively. The rigid reinforcing structure 3 is provided on the circuit board 1. The lens assembly 4 includes a lens holder 41 and a lens structure 42 disposed on the lens holder 41, and the lens structure 42 of the lens assembly 4 corresponds to the image sensing area 21 of the image sensing chip 2. It should be noted that the vertical projections of the substrate conductive contacts 11 and the chip conductive contacts 22 fall on the rigid reinforcing structure 3.
Therefore, the portable electronic device P and the image capturing module M thereof provided by the present invention can be used to increase the structural strength and the surface flatness of a predetermined region of the circuit substrate 1 (especially, a region of the circuit substrate 1 for carrying or disposing the plurality of substrate conductive contacts 11) by the technical solutions of "the rigid reinforcing structure 3 is disposed on the circuit substrate 1" and "the vertical projections of the plurality of substrate conductive contacts 11 and the plurality of chip conductive contacts 22 are all located on the rigid reinforcing structure 3".
[ first embodiment ]
Referring to fig. 1 and 2, a first embodiment of the utility model provides an image extraction module M, which includes: a circuit board 1, an image sensing chip 2, a rigid reinforcing structure 3 (or rigid reinforcing structure, or elastic reinforcing structure, or flexible reinforcing structure), and a lens assembly 4.
First, as shown in fig. 1, the circuit board 1 has a plurality of board conductive contacts 11. In addition, the image sensing chip 2 is disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1, and the image sensing chip 2 includes an image sensing area 21 and a plurality of chip conductive contacts 22 electrically connected to the plurality of substrate conductive contacts 11, respectively. For example, the circuit substrate 1 has an upper surface 101, a lower surface 102 opposite to the upper surface 101, and a through hole 103 connected to the upper surface 101 and the lower surface 102. The plurality of substrate conductive contacts 11 may be disposed on the lower surface 102 of the circuit substrate 1, the image sensing chip 2 may be disposed on the lower surface 102 of the circuit substrate 1, and the plurality of chip conductive contacts 22 of the image sensing chip 2 may be electrically connected to the plurality of substrate conductive contacts 11 of the circuit substrate 1 by flip-chip bonding (flip-chip bonding) through a plurality of conductive materials (not numbered), such as solder balls or solder paste, respectively. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
As shown in fig. 1 and 2, the rigid reinforcing structure 3 is provided on the circuit board 1. In addition, the lens assembly 4 includes a lens holder 41 and a lens structure 42 disposed on the lens holder 41, and the lens structure 42 of the lens assembly 4 corresponds to the image sensing area 21 of the image sensing chip 2. For example, the rigid reinforcing structure 3 may be made of rubber, silicon rubber, or any material with rigidity enhancing effect, and the rigid reinforcing structure 3 may also be made of conductive material. In addition, the rigid reinforcing structure 3 can be disposed on the upper surface 101 of the circuit substrate 1 in a surrounding manner around the through hole 103, and the lens holder 41 of the lens assembly 4 can be adhered to the rigid reinforcing structure 3 in a surrounding manner through an adhesive layer H, so that the lens assembly 4 can improve the structural stability of the lens holder 41 through the rigid reinforcing structure 3. Thereby, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit substrate 1 being bent to separate from the image extraction module M. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
It should be noted that, for example, as shown in fig. 1 and fig. 2, the rigid reinforcing structure 3 has an outer periphery 300, and the outer periphery 300 of the rigid reinforcing structure 3 is covered by the lens holder 41 (not shown) or is exposed by the lens holder 41 (as shown in fig. 1). That is, as long as the vertical projections of the substrate conductive contacts 11 and the chip conductive contacts 22 are all allowed to fall on the rigid reinforcing structure 3, the outermost surrounding portion of the rigid reinforcing structure 3 may be inwardly reduced to be covered by the lens holder 41 (not shown) or may be outwardly extended to be exposed by the lens holder 41 (as shown in fig. 1). In addition, the upper surface 101 of the circuit substrate 1 has a surrounding clearance area 1011 connected to the through hole 103 and surrounding the through hole 103, and the surrounding clearance area 1011 of the upper surface 101 of the circuit substrate 1 is surrounded by the rigid reinforcing structure 3 and is exposed by the rigid reinforcing structure 3. In addition, the lower surface 102 of the circuit substrate 1 has a surrounding contact area 1021 surrounding the through hole 103 and used for carrying a plurality of substrate conductive contacts 11, the upper surface 101 of the circuit substrate 1 has a structural reinforcement area 1012 surrounding the clearance area 1011 and corresponding to the surrounding contact area 1021, and all or a portion of the rigid reinforcement structure 3 is disposed on the structural reinforcement area 1012 for increasing the structural strength and surface flatness of both the structural reinforcement area 1012 and the surrounding contact area 1021 of the circuit substrate 1, thereby enabling each conductive material to reduce the chance of being separated from the corresponding substrate conductive contact 11 and the corresponding chip conductive contact 22 due to the bending of the circuit substrate 1 through the reinforcement of the rigid reinforcement structure 3. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
For example, referring to fig. 1 and fig. 2, the image extraction module M according to the first embodiment of the present invention further includes: a filter assembly 5, and the filter assembly 5 is disposed on the image sensing chip 2 to correspond to the image sensing area 21 of the image sensing chip 2. It should be noted that when the filter assembly 5 is disposed on the image sensor chip 2, the filter assembly 5 is completely accommodated in the through hole 103 of the circuit substrate 1. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
[ second embodiment ]
Referring to fig. 3, a second embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 3 and fig. 1, the main difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the filter assembly 5 is disposed on the circuit substrate 1 to correspond to the image sensing area 21 of the image sensing chip 2. When the filter assembly 5 is disposed on the circuit substrate 1, the through hole 103 of the circuit substrate 1 is closed by the filter assembly 5. That is, the filter assembly 5 may be disposed on the image sensing chip 2 (as shown in the first embodiment with reference to fig. 1) or disposed on the circuit substrate 1 (as shown in the second embodiment with reference to fig. 3) according to different requirements.
[ third embodiment ]
Referring to fig. 4 and 5, a third embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 4 and fig. 1, the most important difference between the third embodiment of the present invention and the first embodiment is: the image extraction module M provided in the third embodiment of the present invention further includes: a plurality of first electronic components 6A, a plurality of second electronic components 6B, a first metal shielding 7A, a second metal shielding 7B, a first insulating filler 8A, a second insulating filler 8B, and an image extraction module M.
More specifically, referring to fig. 4 and 5, a plurality of first electronic components 6A are disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1, and a plurality of second electronic components 6B are disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1. In addition, a first metal shield 7A is provided on the circuit substrate 1 for covering the plurality of first electronic components 6A, and a second metal shield 7B is provided on the circuit substrate 1 for covering the plurality of second electronic components 6B. Further, a first insulating filler 8A is provided on the circuit substrate 1 and connected between the lens holder 41 and the first metal shield 7A, and a second insulating filler 8B is provided on the circuit substrate 1 and connected between the lens holder 41 and the second metal shield 7B. Thereby, when the lens holder 41 of the lens assembly 4 is disposed between the first metal shield 7A and the second metal shield 7B, the lens holder 41 of the lens assembly 4 can be tightly connected between the first insulating filler 8A and the second insulating filler 8B for increasing the fastness (fastness) of the lens holder 41 of the lens assembly 4 fixed on the rigid reinforcing structure 3, thereby making it possible for the lens assembly 4 to reduce the chance of the image extraction module M being detached due to the circuit substrate 1 being bent by the reinforcement of the rigid reinforcing structure 3.
[ fourth embodiment ]
Referring to fig. 6, a fourth embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 6 and fig. 1, the most important difference between the fourth embodiment of the present invention and the first embodiment is: in the fourth embodiment, the image sensor chip 2 is disposed on the upper surface 101 of the circuit substrate 1, and the plurality of chip conductive contacts 22 of the image sensor chip 2 are electrically connected to the plurality of substrate conductive contacts 11 of the circuit substrate 1 by wire bonding (wire bonding) via a plurality of conductive wires (not numbered). For example, the rigid reinforcing structure 3 is disposed on the lower surface 102 of the circuit substrate 1 in a "through-hole-free manner", and the lens holder 41 of the lens assembly 4 can be adhered to the circuit substrate 1 by an adhesive layer H. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
More specifically, as shown in fig. 6, the upper surface 101 of the circuit substrate 1 has a surrounding contact area 1021 surrounding the image sensing chip 2 and used for carrying a plurality of substrate conductive contacts 11, the lower surface 102 of the circuit substrate 1 has a structural reinforcement area 1012 corresponding to the surrounding contact area 1021, and all or a portion of the rigid reinforcement structure 3 is disposed on the structural reinforcement area 1012 for increasing the structural strength and surface flatness of both the structural reinforcement area 1012 and the surrounding contact area 1021 of the circuit substrate 1.
It should be noted that, as shown in fig. 6, the vertical projection of the lens holder 41 of the lens assembly 4 falls on the rigid reinforcing structure 3 (especially, the vertical projection of a surrounding supporting leg portion of the lens holder 41 adhered to the circuit board 1 by the adhesive layer H falls on the rigid reinforcing structure 3), so that the lens assembly 4 can improve the structural stability of the lens holder 41 by the rigid reinforcing structure 3. Thereby, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit substrate 1 being bent to separate from the image extraction module M.
[ fifth embodiment ]
Referring to fig. 7, a fifth embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 7 and fig. 6, the main difference between the fifth embodiment and the fourth embodiment of the present invention is: in the fifth embodiment, the rigid reinforcing structure 3 is provided on the lower surface 102 of the circuit substrate 1 in a "through-hole manner". That is, the rigid reinforcing structure 3 disposed on the lower surface 102 of the circuit substrate 1 may be a one-piece rigid reinforcing structure (as shown in the fourth embodiment with reference to fig. 6) or a surrounding rigid reinforcing structure (as shown in the fifth embodiment with reference to fig. 7), according to different requirements.
[ sixth embodiment ]
Referring to fig. 8, a sixth embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 8 and fig. 6, the most important difference between the sixth embodiment and the fourth embodiment of the present invention is: in the sixth embodiment, the circuit substrate 1 has a through hole 103 connected to the upper surface 101 and the lower surface 102, and the image sensing chip 2 is accommodated in the through hole 103 and disposed on the rigid reinforcing structure 3. For example, when the rigid reinforcing structure 3 is made of a conductive material, the image sensor chip 2 can enhance its heat dissipation effect through the rigid reinforcing structure 3.
[ seventh embodiment ]
Referring to fig. 9 and 10, a seventh embodiment of the utility model provides an image extraction module M, which includes: a circuit substrate 1, an image sensing chip 2, a rigid reinforcing structure 3 and a lens assembly 4. As can be seen from a comparison between fig. 9 and fig. 6, the most important difference between the seventh embodiment and the fourth embodiment of the present invention is: the image extraction module M according to the seventh embodiment of the present invention further includes: a plurality of first electronic components 6A, a plurality of second electronic components 6B, a first metal shielding 7A, a second metal shielding 7B, a first insulating filler 8A, a second insulating filler 8B, and an image extraction module M.
More specifically, referring to fig. 9 and 10, a plurality of first electronic components 6A are disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1, and a plurality of second electronic components 6B are disposed on the circuit substrate 1 and electrically connected to the circuit substrate 1. In addition, a first metal shield 7A is provided on the circuit substrate 1 for covering the plurality of first electronic components 6A, and a second metal shield 7B is provided on the circuit substrate 1 for covering the plurality of second electronic components 6B. Further, a first insulating filler 8A is provided on the circuit substrate 1 and connected between the lens holder 41 and the first metal shield 7A, and a second insulating filler 8B is provided on the circuit substrate 1 and connected between the lens holder 41 and the second metal shield 7B. Thereby, when the lens holder 41 of the lens assembly 4 is disposed between the first metal shield 7A and the second metal shield 7B, the lens holder 41 of the lens assembly 4 can be tightly connected between the first insulating filler 8A and the second insulating filler 8B for increasing the fastness (fastness) of the lens holder 41 of the lens assembly 4 fixed on the rigid reinforcing structure 3, thereby making it possible for the lens assembly 4 to reduce the chance of the image extraction module M being detached due to the circuit substrate 1 being bent by the reinforcement of the rigid reinforcing structure 3.
[ eighth embodiment ]
Referring to fig. 11, an eighth embodiment of the utility model provides a portable electronic device P, and the portable electronic device P can use an image capturing module M. For example, the image capturing module M used by the portable electronic device P may be any one of the image capturing modules M in the first to seventh embodiments. In addition, the portable electronic device P may be a notebook computer, a tablet computer or a desktop computer. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
[ advantageous effects of the embodiments ]
One of the advantages of the present invention is that the portable electronic device P and the image capturing module M thereof provided by the present invention can be used to increase the structural strength and the surface flatness of a predetermined area of the circuit substrate 1 (especially, the area of the circuit substrate 1 for carrying or disposing the plurality of substrate conductive contacts 11) by the technical solutions of "the rigid reinforcing structure 3 is disposed on the circuit substrate 1" and "the vertical projections of the plurality of substrate conductive contacts 11 and the plurality of chip conductive contacts 22 all fall on the rigid reinforcing structure 3".
More specifically, all or a portion of the rigid reinforcing structure 3 is disposed on the structure reinforcing region 1012 for increasing the structural strength and surface flatness of both the structure reinforcing region 1012 and the surrounding contact region 1021 of the circuit substrate 1, so that each conductive material can be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit substrate 1 being bent to separate from the corresponding substrate conductive contact 11 and the corresponding chip conductive contact 22.
Furthermore, since the lens assembly 4 can improve the structural stability of the lens holder 41 through the rigid reinforcing structure 3, the lens assembly 4 can be reinforced by the rigid reinforcing structure 3 to reduce the chance of being separated from the image extraction module M due to the circuit board 1 being bent.
Furthermore, the lens holder 41 of the lens assembly 4 can be tightly connected between the first insulating filler 8A and the second insulating filler 8B for increasing the fastness of the lens holder 41 of the lens assembly 4 fixed on the rigid reinforcing structure 3, thereby making it possible for the lens assembly 4 to be reinforced by the rigid reinforcing structure 3 to reduce the chance of the circuit board 1 being bent to separate from the image extraction module M.
The disclosure is only a preferred embodiment of the utility model, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (10)
1. An image extraction module, characterized in that the image extraction module comprises:
a circuit substrate having a plurality of substrate conductive contacts;
the image sensing chip is arranged on the circuit substrate and is electrically connected with the circuit substrate, and the image sensing chip comprises an image sensing area and a plurality of chip conductive contacts which are respectively electrically connected with the plurality of substrate conductive contacts;
the rigid reinforcing structure is arranged on the circuit substrate; and
the lens assembly comprises a lens bracket and a lens structure arranged on the lens bracket, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip;
and the vertical projections of the substrate conductive contacts and the chip conductive contacts are all arranged on the rigid reinforcing structure.
2. The image extraction module of claim 1,
the circuit substrate is provided with an upper surface, a lower surface opposite to the upper surface and a through hole connected with the upper surface and the lower surface;
the plurality of substrate conductive contacts are arranged on the lower surface of the circuit substrate, the image sensing chip is arranged on the lower surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are respectively and electrically connected with the plurality of substrate conductive contacts of the circuit substrate through flip chip bonding;
the rigid reinforcing structure is arranged on the upper surface of the circuit substrate in a surrounding manner and surrounds the through hole, and the lens support of the lens assembly is adhered to the rigid reinforcing structure through an adhesive layer;
the rigid reinforcing structure is provided with an outer surrounding, and the outer surrounding of the rigid reinforcing structure is covered by the lens support or is exposed by the lens support;
wherein the upper surface of the circuit substrate has a surrounding clearance area connected to and surrounding the through via, and the surrounding clearance area of the upper surface of the circuit substrate is surrounded by and exposed by the rigid reinforcing structure;
wherein the lower surface of the circuit substrate has a surrounding contact area surrounding the through via and for carrying a plurality of the substrate conductive contacts, the upper surface of the circuit substrate has a structural reinforcement area surrounding the surrounding clearance area and corresponding to the surrounding contact area, and all or a portion of the rigid reinforcement structure is disposed on the structural reinforcement area for increasing the structural strength and surface flatness of both the structural reinforcement area and the surrounding contact area of the circuit substrate.
3. The image extraction module of claim 2, further comprising:
a light filtering component disposed on the image sensing chip or the circuit substrate to correspond to the image sensing area of the image sensing chip;
the first electronic components are arranged on the circuit substrate and are electrically connected with the circuit substrate;
a plurality of second electronic components disposed on the circuit substrate and electrically connected to the circuit substrate;
a first metal shield disposed on the circuit substrate for covering the plurality of first electronic components;
a second metal shield disposed on the circuit substrate for covering the plurality of second electronic components;
the first insulating filler is arranged on the circuit substrate and connected between the lens support and the first metal shielding piece; and
the second insulating filler is arranged on the circuit substrate and connected between the lens support and the second metal shielding piece;
wherein, when the filter assembly is disposed on the image sensing chip, the filter assembly is completely accommodated in the through hole of the circuit substrate;
when the light filtering component is arranged on the circuit substrate, the through hole of the circuit substrate is sealed by the light filtering component;
wherein when the lens holder of the lens assembly is disposed between the first metal shield and the second metal shield, the lens holder of the lens assembly is tightly connected between the first insulating filler and the second insulating filler for increasing the fastness of the lens holder of the lens assembly to be fixed on the rigid reinforcing structure.
4. The image extraction module of claim 1,
the circuit substrate is provided with an upper surface and a lower surface opposite to the upper surface;
the plurality of substrate conductive contacts are arranged on the upper surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are respectively and electrically connected with the plurality of substrate conductive contacts of the circuit substrate through wire bonding;
the rigid reinforcing structure is arranged on the lower surface of the circuit substrate, the lens support of the lens assembly is adhered to the circuit substrate through an adhesion layer, and the vertical projection of the lens support of the lens assembly falls on the rigid reinforcing structure;
wherein the upper surface of the circuit substrate has a surrounding contact area surrounding the image sensing chip and used for carrying a plurality of substrate conductive contacts, the lower surface of the circuit substrate has a structural reinforcement area corresponding to the surrounding contact area, and all or a part of the rigid reinforcement structure is disposed on the structural reinforcement area for increasing the structural strength and surface flatness of both the structural reinforcement area and the surrounding contact area of the circuit substrate;
when the circuit substrate is provided with a through hole connected to the upper surface and the lower surface, the image sensing chip is accommodated in the through hole and is arranged on the rigid reinforcing structure.
5. The image extraction module of claim 4, further comprising:
a filter assembly disposed on the image sensing chip to correspond to the image sensing area of the image sensing chip;
the first electronic components are arranged on the circuit substrate and are electrically connected with the circuit substrate;
a plurality of second electronic components disposed on the circuit substrate and electrically connected to the circuit substrate;
a first metal shield disposed on the circuit substrate for covering the plurality of first electronic components;
a second metal shield disposed on the circuit substrate for covering the plurality of second electronic components;
the first insulating filler is arranged on the circuit substrate and connected between the lens support and the first metal shielding piece; and
the second insulating filler is arranged on the circuit substrate and connected between the lens support and the second metal shielding piece;
wherein when the lens holder of the lens assembly is disposed between the first metal shield and the second metal shield, the lens holder of the lens assembly is closely connected between the first insulating filler and the second insulating filler for increasing the fastness with which the lens holder of the lens assembly is fixed on the upper surface of the circuit substrate.
6. A portable electronic device, which uses an image extraction module, the image extraction module comprising:
a circuit substrate having a plurality of substrate conductive contacts;
the image sensing chip is arranged on the circuit substrate and is electrically connected with the circuit substrate, and the image sensing chip comprises an image sensing area and a plurality of chip conductive contacts which are respectively electrically connected with the plurality of substrate conductive contacts;
the rigid reinforcing structure is arranged on the circuit substrate; and
the lens assembly comprises a lens bracket and a lens structure arranged on the lens bracket, and the lens structure of the lens assembly corresponds to the image sensing area of the image sensing chip;
and the vertical projections of the substrate conductive contacts and the chip conductive contacts are all arranged on the rigid reinforcing structure.
7. The portable electronic device of claim 6,
the circuit substrate is provided with an upper surface, a lower surface opposite to the upper surface and a through hole connected with the upper surface and the lower surface;
the plurality of substrate conductive contacts are arranged on the lower surface of the circuit substrate, the image sensing chip is arranged on the lower surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are respectively and electrically connected with the plurality of substrate conductive contacts of the circuit substrate through flip chip bonding;
the rigid reinforcing structure is arranged on the upper surface of the circuit substrate in a surrounding manner and surrounds the through hole, and the lens support of the lens assembly is adhered to the rigid reinforcing structure through an adhesive layer;
the rigid reinforcing structure is provided with an outer surrounding, and the outer surrounding of the rigid reinforcing structure is covered by the lens support or is exposed by the lens support;
wherein the upper surface of the circuit substrate has a surrounding clearance area connected to and surrounding the through via, and the surrounding clearance area of the upper surface of the circuit substrate is surrounded by and exposed by the rigid reinforcing structure;
wherein the lower surface of the circuit substrate has a surrounding contact area surrounding the through via and for carrying a plurality of the substrate conductive contacts, the upper surface of the circuit substrate has a structural reinforcement area surrounding the surrounding clearance area and corresponding to the surrounding contact area, and all or a portion of the rigid reinforcement structure is disposed on the structural reinforcement area for increasing the structural strength and surface flatness of both the structural reinforcement area and the surrounding contact area of the circuit substrate.
8. The portable electronic device of claim 7, wherein the image extraction module further comprises:
a light filtering component disposed on the image sensing chip or the circuit substrate to correspond to the image sensing area of the image sensing chip;
the first electronic components are arranged on the circuit substrate and are electrically connected with the circuit substrate;
a plurality of second electronic components disposed on the circuit substrate and electrically connected to the circuit substrate;
a first metal shield disposed on the circuit substrate for covering the plurality of first electronic components;
a second metal shield disposed on the circuit substrate for covering the plurality of second electronic components;
the first insulating filler is arranged on the circuit substrate and connected between the lens support and the first metal shielding piece; and
the second insulating filler is arranged on the circuit substrate and connected between the lens support and the second metal shielding piece;
wherein, when the filter assembly is disposed on the image sensing chip, the filter assembly is completely accommodated in the through hole of the circuit substrate;
when the light filtering component is arranged on the circuit substrate, the through hole of the circuit substrate is sealed by the light filtering component;
wherein when the lens holder of the lens assembly is disposed between the first metal shield and the second metal shield, the lens holder of the lens assembly is tightly connected between the first insulating filler and the second insulating filler for increasing the fastness of the lens holder of the lens assembly to be fixed on the rigid reinforcing structure.
9. The portable electronic device of claim 6,
the circuit substrate is provided with an upper surface and a lower surface opposite to the upper surface;
the plurality of substrate conductive contacts are arranged on the upper surface of the circuit substrate, and the plurality of chip conductive contacts of the image sensing chip are respectively and electrically connected with the plurality of substrate conductive contacts of the circuit substrate through wire bonding;
the rigid reinforcing structure is arranged on the lower surface of the circuit substrate, the lens support of the lens assembly is adhered to the circuit substrate through an adhesion layer, and the vertical projection of the lens support of the lens assembly falls on the rigid reinforcing structure;
wherein the upper surface of the circuit substrate has a surrounding contact area surrounding the image sensing chip and used for carrying a plurality of substrate conductive contacts, the lower surface of the circuit substrate has a structural reinforcement area corresponding to the surrounding contact area, and all or a part of the rigid reinforcement structure is disposed on the structural reinforcement area for increasing the structural strength and surface flatness of both the structural reinforcement area and the surrounding contact area of the circuit substrate;
when the circuit substrate is provided with a through hole connected to the upper surface and the lower surface, the image sensing chip is accommodated in the through hole and is arranged on the rigid reinforcing structure.
10. The portable electronic device of claim 9, wherein the image extraction module further comprises:
a filter assembly disposed on the image sensing chip to correspond to the image sensing area of the image sensing chip;
the first electronic components are arranged on the circuit substrate and are electrically connected with the circuit substrate;
a plurality of second electronic components disposed on the circuit substrate and electrically connected to the circuit substrate;
a first metal shield disposed on the circuit substrate for covering the plurality of first electronic components;
a second metal shield disposed on the circuit substrate for covering the plurality of second electronic components;
the first insulating filler is arranged on the circuit substrate and connected between the lens support and the first metal shielding piece; and
the second insulating filler is arranged on the circuit substrate and connected between the lens support and the second metal shielding piece;
wherein when the lens holder of the lens assembly is disposed between the first metal shield and the second metal shield, the lens holder of the lens assembly is closely connected between the first insulating filler and the second insulating filler for increasing the fastness with which the lens holder of the lens assembly is fixed on the upper surface of the circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110210315 | 2021-09-01 | ||
| TW110210315U TWM623230U (en) | 2021-09-01 | 2021-09-01 | Portable electronic device and image-capturing module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216162777U true CN216162777U (en) | 2022-04-01 |
Family
ID=80848106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122182517.5U Active CN216162777U (en) | 2021-09-01 | 2021-09-09 | Portable electronic device and image extraction module thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN216162777U (en) |
| TW (1) | TWM623230U (en) |
-
2021
- 2021-09-01 TW TW110210315U patent/TWM623230U/en unknown
- 2021-09-09 CN CN202122182517.5U patent/CN216162777U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM623230U (en) | 2022-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9760754B2 (en) | Printed circuit board assembly forming enhanced fingerprint module | |
| CN211879388U (en) | Photosensitive module | |
| TWI639048B (en) | Portable electronic device and image-capturing module thereof, and carrier assembly thereof | |
| CN106470527B (en) | It is used to form the printed circuit board arrangement of enhanced identification of fingerprint module | |
| WO2019100962A1 (en) | Electronic device and image capture module of electronic device | |
| JP4883145B2 (en) | Semiconductor device | |
| TWM550941U (en) | Portable electronic device and its image capturing module and carrying component | |
| CN109244067B (en) | Portable electronic device and image acquisition module and image sensing assembly thereof | |
| CN103582286B (en) | Circuit board assemblies and camera module | |
| CN100561754C (en) | The integrated ball grid array optical mouse sensor encapsulation | |
| CN216162777U (en) | Portable electronic device and image extraction module thereof | |
| CN115767235A (en) | Portable electronic device and image extraction module thereof | |
| JP2020092399A (en) | Imaging module and portable electronic apparatus | |
| JP6743219B2 (en) | Imaging module and portable electronic device | |
| US7638865B2 (en) | Sensor package | |
| TWM550474U (en) | Portable electronic device and image capture module and carrying components thereof | |
| JP5299492B2 (en) | Semiconductor device | |
| CN216697344U (en) | Capacitive fingerprint sensing module | |
| TWM576691U (en) | Image-capturing module and portable electric device | |
| CN215420451U (en) | Chip module, camera device and electronic equipment | |
| CN220173709U (en) | Display module and display device | |
| CN212062430U (en) | Chip module and electronic equipment | |
| CN210040172U (en) | Chip packaging structure and electronic equipment | |
| TWI337395B (en) | Image sensor package | |
| TW492170B (en) | Thin type IC chip package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |