CN215420451U - Chip module, camera device and electronic equipment - Google Patents

Abstract

The utility model discloses a chip module, which comprises a first circuit component, a second circuit component and a first conductive wire, wherein the first circuit component comprises a first circuit board and an image sensor, and the image sensor is arranged on the first circuit board and is electrically connected with the first circuit board; the second circuit component comprises a second circuit board and a processing chip, the second circuit board is arranged on one side of the first circuit board, which is far away from the image sensor, the processing chip is arranged on the second circuit board and is electrically connected with the second circuit board, and the processing chip is positioned between the first circuit board and the second circuit board; one end of the first conductive wire is connected to the first circuit board, and the other end is connected to the second circuit board. By adopting the scheme of the embodiment, the relative area between the first circuit board and the second circuit board is favorably reduced, and the miniaturization design of the chip module is further realized. In addition, the utility model also discloses a camera device with the chip module and electronic equipment thereof.

Description

Chip module, camera device and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a chip module, an image capturing apparatus, and an electronic device.

Background

With the development of science and technology, the application range of the camera device is wider and wider, and the function, appearance and volume of the camera device are continuously receiving higher challenges. Especially, for a camera device applied to a miniaturized electronic device (such as a mobile phone, a smart watch, a tablet computer, a driving recorder, etc.), the requirement on the volume is more strict. In the prior art, the chip module in the camera device is large in size, so that the further miniaturization cannot be realized, and the size of the camera device cannot be smaller.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses a chip module, a camera device and electronic equipment, which can reduce the volume of a circuit board and further realize the miniaturization design of the camera device.

In order to achieve the above object, a first aspect of the present invention discloses a chip module comprising:

a first circuit assembly including a first circuit board and an image sensor disposed on and electrically connected to the first circuit board;

the second circuit assembly comprises a second circuit board and a processing chip, the second circuit board is arranged on one side of the first circuit board, which is far away from the image sensor, the processing chip is arranged on the second circuit board and is electrically connected with the second circuit board, and the processing chip is connected to the first circuit board so as to be positioned between the first circuit board and the second circuit board; and

a first conductive line having one end connected to the first circuit board and the other end connected to the second circuit board. The first conductive wire is used for electrically connecting the first circuit board and the second circuit board, and the conductive connection mode of the first conductive wire can reduce the limitation on the shapes and the sizes of the first circuit board and the second circuit board, so that the relative area of the first circuit board and the second circuit board can be further reduced, and the miniaturization design of the chip module is realized.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the chip module further includes a first conductive adhesive, and two ends of the first conductive line are respectively packaged on the first circuit board and the second circuit board through the first conductive adhesive. Adopt first conducting resin is right first conductor wire first circuit Board with tie point on the second circuit Board glues and seals the reinforcement, promptly, first circuit Board with the electricity between the second circuit Board adopts COB (Chips on Board) technique, can effectively guarantee first conductor wire with the first circuit Board with the steadiness of the junction of second circuit Board, promptly, can prevent that the junction of first conductor wire and first circuit Board and the junction of second circuit Board and first conductor wire from appearing becoming flexible and coming off and leading to the condition that signal transmission between first circuit Board and the second circuit Board breaks, and then guaranteed first circuit Board with signal transmission's stability between the second circuit Board.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the chip module further includes a second conductive wire, and the image sensor is electrically connected to the first circuit board through the second conductive wire. The image sensor and the electric connection between the first circuit board adopt the mode that the second conducting wire is connected, further reduced on the premise of having realized signal connection the size requirement of first circuit board.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the chip module further includes a second conductive adhesive, and two ends of the second conductive line are respectively packaged on the image sensor and the first circuit board through the second conductive adhesive. Adopt the second conducting resin is right the second conductor wire first circuit Board with tie point on the image sensor encapsulates the reinforcement, promptly, first circuit Board with electricity between the image sensor adopts COB (Chips on Board), can effectively guarantee the second conductor wire with first circuit Board with the steadiness that the image sensor connects can prevent that the second conductor wire from appearing becoming flexible the condition that drops and lead to the signal transmission interrupt between first circuit Board and the image sensor with the junction of first circuit Board and image sensor, and then guaranteed first circuit Board with signal transmission's between the image sensor stability.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the chip module further includes a package structure, and the package structure is disposed on the first circuit board and covers the image sensor and the second conductive line. Because packaging structure's setting makes image sensor and external environment produce the isolation, and effective separation dust, steam etc. in the external environment fall to the image sensor surface, it is right image sensor has played dustproof, prevent the protection effect of steam, has ensured image sensor's work precision, and has prolonged image sensor's life. Meanwhile, the arrangement of the packaging structure effectively protects the image sensor and the stable connection of the second conducting wires.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the package structure includes a protection layer and a sealing layer, the protection layer is disposed on a side of the image sensor, which is away from the first circuit board, and the protection layer makes a surface of the image sensor clean and flat, so as to effectively block damage of dust and water vapor in an external environment to the image sensor, thereby ensuring normal operation of the image sensor, improving reliability of the image sensor, and prolonging a service life of the image sensor. The sealing layer is arranged along the circumferential direction of the protective layer and covers the second conductive lines to seal the second conductive lines and the image sensor. The sealing layer makes image sensor is covered completely and is located packaging structure makes image sensor keeps apart with external environment to prevent that external dust, steam etc. from falling image sensor surface, and then right image sensor plays dustproof, prevent the protection effect of steam. The existence of the sealing layer plays a supporting role for the protective layer, the position of the protective layer is fixed, and the connection stability of the protective layer is ensured. The sealing layer effectively protects the connection between the second conductive wire and the image sensor and between the second conductive wire and the first circuit board by packaging the second conductive wire, the connection stability is consolidated, and the signal transmission stability between the image sensor and the first circuit board is further protected.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the image sensor is disposed in a middle portion of the first circuit board, the processing chip is disposed in a middle portion of the second circuit board, and a projection of the image sensor on the first circuit board is located in a projection area of the processing chip on the first circuit board. Image sensor the first circuit board handle the chip and the second circuit board all adopts the mode of stacking of middle part butt joint, has avoided with image sensor and handle the chip arrange respectively in first circuit board with the border position of second circuit board and lead to first circuit board with the second circuit board is heated the uneven condition, can improve first circuit board with the second circuit board homogeneity of being heated has still been guaranteed when having realized volume minimizing first circuit board with the surface flatness of second circuit board avoids first circuit board the second circuit board takes place the warpage, improves the life of chip module.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the processing chip is adhered to a side of the first circuit board facing away from the image sensor. Will the processing chip bonds in one side that deviates from of first circuit board image sensor, the processing chip with the connected mode of first circuit board is simple, reliable, has replaced the connected mode that adopts the copper post, need to reserve the mode of connecting hole promptly on first circuit board to can reduce the space occupation to first circuit board, and then can reduce the volume of first circuit board, be favorable to the miniaturized design of this chip module.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the first circuit board and/or the second circuit board is provided with heat dissipation holes, and the heat dissipation holes penetrate through two sides of the first circuit board or the second circuit board in a thickness direction. The mode that sets up the louvre on first circuit board and/or second circuit board is adopted, can accelerate the heat conduction on first circuit board and the second circuit board, improves the radiating effect of chip module.

As an alternative implementation, in an embodiment of the first aspect of the utility model,

when the first circuit board is provided with the heat dissipation hole, the arrangement position of the heat dissipation hole on the first circuit board is positioned in a projection area of the image sensor on the first circuit board;

when the second circuit board is provided with the radiating holes, the positions of the radiating holes on the second circuit board are located in the projection area of the processing chip on the second circuit board. The image sensor is provided with a radiating hole in a projection area on the first circuit board, or the processing chip is provided with a radiating hole in a projection area on the second circuit board, and the radiating hole can be arranged corresponding to the image sensor or the processing chip, so that heat emitted by the image sensor or the processing chip can be conducted in time, heat is prevented from being accumulated around the image sensor or the processing chip to influence the normal operation of the image sensor and the processing chip, and the radiating effect of the chip module is improved.

In addition, can know by the foregoing, handle the chip and adopt bonding mode to bond in the one side of first circuit board deviating from image sensor, because the heat-conduction ability of viscose is relatively poor, consequently, this louvre's setting can effectively promote this the radiating effect of second circuit board.

In a second aspect, the present invention discloses an image pickup apparatus comprising:

a camera module, and

as for the chip module in the first aspect, the chip module is connected to the camera module and located at the image end of the camera module. The camera device has the chip module of the first aspect, and therefore has the beneficial effects of the chip module, that is, the size of the first circuit board and the second circuit board can be reduced, so that the miniaturization design of the chip module and the camera device can be realized.

In a third aspect, the utility model discloses an electronic apparatus comprising the image pickup device according to the second aspect. The electronic device has the imaging device of the second aspect and also has the beneficial effects of the imaging device, namely, the imaging device can realize miniaturization design, so that the electronic device occupies less volume and can meet the miniaturization design requirement of the electronic device.

Compared with the prior art, the utility model has the beneficial effects that:

according to the chip module, the camera device and the electronic equipment provided by the embodiment of the utility model, the image sensor and the processing chip are respectively arranged on the first circuit board and the second circuit board, and the first conducting wire is adopted to realize the electric connection between the first circuit board and the second circuit board so as to realize the signal connection between the first circuit board and the second circuit board. Adopt first conductor wire to realize the electricity of first circuit board and second circuit board, need not to set up the connector between first circuit board and second circuit board, can reduce the occupation to the connection space of first circuit board and second circuit board, be favorable to the miniaturized design of first circuit board and second circuit board to reach the purpose of dwindling whole chip module, realize camera device's miniaturization, with the small-size electronic equipment of adaptation better.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a chip module according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a chip module (omitting a package structure) disclosed in an embodiment of the utility model;

FIG. 3 is a schematic cross-sectional view of the chip module of FIG. 1 along the A-A direction;

fig. 4 is a partially enlarged structural view at B in fig. 3;

FIG. 5 is a schematic diagram of a connection structure of a first circuit board and a second circuit board in regular shapes according to an embodiment of the disclosure;

FIG. 6 is a schematic view of a connection structure of a first circuit board and a second circuit board with irregular shapes according to an embodiment of the disclosure;

fig. 7 is a partially enlarged structural view at C in fig. 3;

fig. 8 is a schematic structural diagram of an image pickup apparatus disclosed in the embodiment of the present invention;

fig. 9 is a schematic structural diagram of an electronic device disclosed in the embodiment of the present invention.

Icon: 10. a chip module; 11. a first circuit component; 11a, a first circuit board; 11b, an image sensor; 12. a second circuit component; 12a, a second circuit board; 12b, processing the chip; 13. a first conductive line; 131. a first conductive paste; 14. a second conductive line; 141. a second conductive paste; 15. a packaging structure; 151. a protective layer; 152. a sealing layer; 152a, retaining wall glue; 152b, a sealant; 16. heat dissipation holes; 20. a camera device; 21. a camera module; 30. an electronic device.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

Referring to fig. 1 to 4, a first aspect of the present embodiment provides a chip module 10, which can be applied in an image pickup apparatus to process a signal captured by an image pickup module of the image pickup apparatus. The chip module 10 includes a first circuit component 11, a second circuit component 12, and a first conductive line 13. The first circuit assembly 11 includes a first circuit board 11a and an image sensor 11b, and the image sensor 11b is disposed on the first circuit board 11a and electrically connected to the first circuit board 11 a. The second circuit assembly 12 includes a second circuit board 12a and a processing chip 12b, the second circuit board 12a is disposed on a side of the first circuit board 11a away from the image sensor 11b, the processing chip 12b is disposed on the second circuit board 12a and electrically connected to the second circuit board 12a, and the processing chip 12b is located between the first circuit board 11a and the second circuit board 12 a. One end of the first conductive line 13 is connected to the first circuit board 11a, and the other end is connected to the second circuit board 12 a.

The chip module 10 provided in the present embodiment forms the first circuit assembly 11 by disposing the image sensor 11b on the first circuit board 11a and electrically connecting with the first circuit board 11 a. The processing chip 12b is disposed on the second circuit board 12a and electrically connected to the second circuit board 12a to form a second circuit assembly 12. Meanwhile, the second circuit assembly 12 is disposed on a side of the first circuit board 11a away from the image sensor 11b, and the processing chip 12b is disposed between the first circuit board 11a and the second circuit board 12 a. Meanwhile, the first circuit board 11a and the second circuit board 12a are electrically connected by the first conductive wire 13, so as to realize the signal connection between the first circuit board 11a and the second circuit board 12 a. That is, compared with the signal connection of the connector in the related art, the signal connection mode implemented by the first conductive wire 13 in the present embodiment can avoid reserving a position on the first circuit board 11a and the second circuit board 12a except for the circuit design requirement due to the connector to be arranged, so that the relative area between the first circuit board 11a and the second circuit board 12a can be reduced, which is beneficial to implementing the miniaturized design of the chip module 10, and further implementing the miniaturized design of the camera device 20 to better adapt to the small electronic device 30.

It is understood that, since the first circuit board 11a and the second circuit board 12a are connected by the first conductive wire 13, the occupied space of the first circuit board 11a and the second circuit board 12a is small, and the shapes and the sizes of the first circuit board 11a and the second circuit board 12a are not particularly limited, that is, the present invention is applicable to the electrical connection of the first circuit board 11a and the second circuit board 12a with any shapes and sizes, for example, the first circuit board 11a and the second circuit board 12a may be regular-shaped circuit boards, such as circular, quasi-circular, and polygonal circuit boards (as shown in fig. 5, the regular-shaped circuit boards shown in fig. 5 as the first circuit board 11a and the second circuit board 12a, such as the first circuit board 11a is a circular circuit board and the second circuit board 12a is a square circuit board), or the first circuit board 11a and the second circuit board 12a may also be irregular-shaped circuit boards (for example, as shown in fig. 6, fig. 6 shows that the first circuit board 11a is an irregular-shaped circuit board, and the second circuit board 12a is a regular-shaped circuit board).

In some embodiments, the first circuit board 11a is located above the second circuit board 12a, and the area of the second circuit board 12a may be larger or slightly larger than the area of the first circuit board 11a, such that when the first conductive line 13 is connected to the first circuit board 11a and the second circuit board 12a, one end of the first conductive line 13 may be connected to a position close to the edge of the first circuit board 11a, and the other end of the first conductive line 13 may be connected to a position also close to the edge of the second circuit board 12a, so that the middle position of the first circuit board 11a and the second circuit board 12a may be used for arranging devices, that is, the first conductive line 13 is used to electrically connect the first circuit board 11a and the second circuit board 12a, which can reduce occupation of the middle position of the first circuit board 11a and the second circuit board 12 a.

It can be understood that the first conductive wire 13 may be connected to the first circuit Board 11a and the second circuit Board 12a by wire bonding, that is, the connection between the first circuit Board 11a and the second circuit Board 12a may be COB (chip on Board), so that the volume occupied by the connection between the first circuit Board 11a and the second circuit Board 12a can be effectively reduced while the signal connection between the first circuit Board 11a and the second circuit Board 12a is effectively realized.

Further, in order to improve the reliability of the electrical connection between the first circuit board 11a and the second circuit board 12a, the first conductive lines 13 may be a plurality of lines, and the plurality of first conductive lines 13 are connected between the first circuit board 11a and the second circuit board 12a at intervals.

Optionally, in consideration of the requirement of the connection strength of the first conductive wire 13, the material of the first conductive wire 13 may be selected from a gold wire, a copper wire, an aluminum wire, or other conductive materials, and the embodiment is not particularly limited.

Referring to fig. 1, 3 and 4 again, in some embodiments, in order to ensure the stability of the connection between the first conductive traces 13 and the first circuit board 11a and the second circuit board 12a, the chip module 10 further includes a first conductive adhesive 131. The first conductive adhesive 131 respectively seals two ends of the first conductive line 13 on the first circuit board 11a and the second circuit board 12 a. Alternatively, the first conductive paste 131 may be a UV paste, a quick-dry paste, or a high temperature resistant paste.

Since the chip module 10 is mostly applied to the vehicle-mounted camera device, during the driving process, the vehicle is likely to bump due to the road condition and the driving condition of the driver, and the vehicle-mounted camera device disposed on the vehicle will also shake at this time, for the vehicle-mounted camera device disposed under this condition, there is a higher requirement for the connection stability of the internal structure thereof, that is, there is a higher requirement for the connection stability of the internal structure of the chip module 10, in other words, the connection requirement between the first conductive wire 13 and the first circuit board 11a, and between the first conductive wire 13 and the second circuit board 12a is higher.

Considering that the first conductive line 13 is a very thin metal line, the connection point between the first conductive line 13 and the first circuit board 11a and the connection point between the first conductive line 13 and the second circuit board 12a are smaller, and at this time, the first conductive line 13 easily falls off from the connection point, which causes connection failure, and further causes signal interruption between the first circuit board 11a and the second circuit board 12a, and causes the chip module 10 not to continue to operate normally. Therefore, the first conductive line 13 and the connection point of the first circuit board 11a are sealed by the first conductive adhesive 131, and the first conductive line 13 and the connection point of the second circuit board 12a are sealed by the first conductive adhesive 131, so that the connection points between the first conductive line 13 and the first circuit board 11a and between the first conductive line 13 and the second circuit board 12a are sealed and protected, the connection stability between the first conductive line 13 and the first circuit board 11a and between the first conductive line 13 and the second circuit board 12a is strengthened, the signal transmission stability between the first circuit board 11a and the second circuit board 12a is ensured, and the working reliability of the chip module 10 is realized.

In some embodiments, the image sensor 11b is disposed on the first circuit board 11a and is located approximately at the middle of the first circuit board 11a, and the image sensor 11b and the first circuit board 11a can be connected by wire bonding in order to electrically connect the image sensor 11b and the first circuit board 11 a. Specifically, the chip module 10 further includes a second conductive line 14, and one end of the second conductive line 14 is connected to the first circuit board 11a, and the other end is connected to the image sensor 11b, so as to implement signal connection between the first circuit board 11a and the image sensor 11 b. The second conductive wire 14 is used to electrically connect the image sensor 11b and the first circuit board 11a, and the connection method is simple and can reduce the space occupation of the first circuit board 11a, so that the volume of the first circuit board 11a can be as small as possible.

It can be understood that the second conductive line 14 may be connected to the first circuit Board 11a and the image sensor 11b by wire bonding, that is, the connection between the first circuit Board 11a and the image sensor 11b may be COB (chip on Board), so that the signal connection between the first circuit Board 11a and the image sensor 11b is effectively realized, and the volume occupied by the connection between the first circuit Board 11a and the image sensor 11b is also effectively reduced.

Furthermore, the material of second conductive wire 14 may be selected from gold wire, copper wire, aluminum wire or other conductive materials in consideration of the requirement of the connection strength of second conductive wire 14, and the embodiment is not limited in particular.

In some embodiments, as shown in fig. 7, the chip module 10 further includes a second conductive adhesive 141, and the second conductive adhesive 141 encapsulates two ends of the second conductive line 14 on the first circuit board 11a and the image sensor 11b, respectively, so as to ensure stability of connection of the second conductive line 14 on the first circuit board 11a and the image sensor 11 b.

As can be seen from the foregoing, when the chip module 10 is applied to an on-vehicle image pickup apparatus, the requirement on the connection reliability of the internal structure of the chip module 10 is higher, and considering that the second conductive wire 14 disposed on the chip module 10 is a very thin metal wire, the connection points between the second conductive wire 14 and the first circuit board 11a and between the second conductive wire 14 and the image sensor 11b are smaller, at this time, the second conductive wire 14 is easily separated from the connection points, which results in connection failure, and further results in signal interruption between the first circuit board 11a and the image sensor 11b, and thus the chip module 10 cannot continue to operate normally. Therefore, the second conductive line 14 is glued to the connection point of the first circuit board 11a by the second conductive glue 141, and the second conductive line 14 is glued to the connection point of the image sensor 11b by the second conductive glue 141, so that the connection points between the second conductive line 14 and the first circuit board 11a and between the second conductive line 14 and the image sensor 11b are protected in a sealing manner, the connection stability of the second conductive line 14 and the first circuit board 11a and the image sensor 11b is strengthened, the signal transmission stability of the first circuit board 11a and the image sensor 11b is ensured, and the working reliability of the chip module 10 is realized.

Referring to fig. 1, fig. 3 and fig. 7 again, in some embodiments, in order to protect the image sensor 11b and prolong the service life of the image sensor 11b, the chip module 10 further includes a package structure 15, and the package structure 15 is disposed on the first circuit board 11a and covers the image sensor 11b and the outer periphery of the second conductive line 14. Because packaging structure 15's setting makes image sensor 11b produce the isolation with external environment to prevent dust, steam etc. in the external environment from falling to image sensor 11 b's surface, realized the protection effect to image sensor 11 b's dustproof, prevent steam, and then effectively protected image sensor 11 b's functionality, with extension image sensor 11 b's life. Meanwhile, the arrangement of the sealing structure 15 performs sealing protection on the connection between the image sensor 11b and the second conductive line 14, so that the connection point between the image sensor 11b and the second conductive line 14 is further protected, and the image sensor 11b and the second conductive line 14 are stably connected.

Further, packaging structure 15 includes protective layer 151 and sealing layer 152, and protective layer 151 sets up the one side that deviates from first circuit board 11a at image sensor 11b, and protective layer 151 makes image sensor 11b surface cleaning level and smooth, effectively prevents harm to image sensor 11b such as external dust, steam, and then guarantees image sensor 11 b's normal operating, improves image sensor 11 b's reliability, and prolongs its life-span. Specifically, the protection layer 151 may be a protection glass or a protection glue layer covering the image sensor 11b, so as to be insulated from the image sensor 11b on one hand, and protect the image sensor 11b from being damaged on the other hand.

In some embodiments, the sealing layer 152 is disposed along a circumferential direction of the protective layer 151 and wraps around the second conductive lines 14 to seal the second conductive lines 14 and the image sensor 11 b. The setting of sealing layer 152 makes the complete sealing of image sensor 11b in whole packaging structure 15, realized image sensor 11b and external environment's isolation, thereby can effectively prevent dust, steam etc. in the external environment from falling to image sensor 11 b's surface, in order to realize the dustproof of image sensor 11b, the comprehensive protection of waterproof vapour etc., guarantee image sensor 11 b's functionality, and can prolong image sensor 11 b's life, and then prolong chip module 10's life.

In addition, the existence of sealing layer 152 also plays a supporting role for protective layer 151, fixes the position of protective layer 151, and ensures the stability of protective layer 151 connection. Meanwhile, the encapsulation of the sealing layer 152 on the second conductive line 14 effectively protects the connection between the second conductive line 14 and the image sensor 11b and the first circuit board 11a, consolidates the connection stability between the second conductive line 14 and the image sensor 11b and the first circuit board 11a, and further protects the stability of signal transmission between the image sensor 11b and the first circuit board 11 a.

Further, the sealing layer 152 includes a retaining wall adhesive 152a and a sealant 152b, the retaining wall adhesive 152a is disposed on a side surface of the first circuit board 11a where the image sensor 11b is disposed, the retaining wall adhesive 152a surrounds the image sensor 11b and the periphery of the second conductive line 14, and the sealant 152b is disposed along the circumference of the protection layer 151 and extends to be connected with the retaining wall adhesive 152 a. The arrangement of the retaining wall glue 152a as the sealant 152b lays a foundation, the arrangement range of the sealant 152b is defined, and the sealant 152b can be prevented from overflowing. Optionally, the retaining wall glue 152a and the sealant 152b may be selected from a UV glue, a quick-drying glue, or a high temperature resistant glue, which is not particularly limited in this embodiment.

In some embodiments, the processing chip 12b is disposed in the middle of the second circuit board 12a, and as can be seen from the foregoing, the image sensor 11b is disposed in the middle of the first circuit board 11a, and the projection area of the image sensor 11b on the first circuit board 11a is located in the projection area of the processing chip 12b on the second circuit board 12 a. With such center-to-center connection, i.e., with the first circuit board 11a and the second circuit board 12a substantially centered, the image sensor 11b and the processing chip 12b are respectively disposed at the middle positions of the first circuit board 11a and the second circuit board 12a, so that heat can be dissipated to the edges of the first circuit board 11a and the second circuit board 12a via the middle portions of the first circuit board 11a and the second circuit board 12a, therefore, the first circuit board 11a and the second circuit board 12a are heated uniformly, the phenomenon that the first circuit board 11a and the second circuit board 12a are warped due to uneven heating caused by the fact that the image sensor 11b and the processing chip 12b are respectively arranged on the peripheries of the first circuit board 11a and the second circuit board 12a is avoided, the surface flatness of the first circuit board 11a and the second circuit board 12a is ensured, and the service life of the chip module 10 is prolonged.

In some embodiments, in order to facilitate the connection between the processing chip 12b and the first circuit board 11a, and reduce the occupied space of the first circuit board 11a, and achieve a miniaturized design of the chip module 10, the processing chip 12b in the chip module 10 is adhered to a side of the first circuit board 11a away from the image sensor 11 b. Specifically, the processing chip 12b may be attached to the side of the first circuit board 11a facing away from the image sensor 11b by UV glue, quick-drying glue, or high-temperature resistant glue. Bond the processing chip 12b in the one side that deviates from the image sensor 11b of first circuit board 11a, the connected mode of processing chip 12b and first circuit board 11a is simple, reliable, has replaced the mode that adopts the copper post to need to reserve the mode of connecting hole on first circuit board 11a to can reduce the space occupation to first circuit board 11a, and then can reduce the volume of first circuit board 11a, be favorable to the miniaturized design of this chip module 10.

Referring to fig. 3 again, in some embodiments, the first circuit board 11a and/or the second circuit board 12a of the chip module 10 are provided with heat dissipation holes 16, and the heat dissipation holes 16 penetrate through two sides of the first circuit board 11a or the second circuit board 12a in the thickness direction. That is, the heat dissipation hole 16 may be provided on the first circuit board 11a, or the heat dissipation hole 16 may be provided on the second circuit board 12 a. Alternatively, the heat dissipation holes 16 may be formed on the first circuit board 11a and the second circuit board 12a at the same time (for example, as shown in fig. 3, the heat dissipation holes 16 are formed on both the first circuit board 11a and the second circuit board 12 a). Thus, by using the design of the heat dissipation holes 16, the heat conduction on the first circuit board 11a and the second circuit board 12a can be accelerated, and the heat dissipation effect of the chip module 10 can be improved.

Further, when the heat dissipation hole 16 is provided on the first circuit board 11a, the heat dissipation hole 16 is arranged in the projection area of the image sensor 11b on the first circuit board 11 a. When the heat dissipation holes 16 are provided on the second circuit board 12a, the heat dissipation holes 16 are arranged in the projection area of the processing chip 12b on the second circuit board 12 a. By adopting the way of arranging the heat dissipation holes 16 in the projection area of the image sensor 11b on the first circuit board 11a, or arranging the heat dissipation holes 16 in the projection area of the processing chip 12b on the second circuit board 12a, the heat dissipation holes 16 can be arranged corresponding to the image sensor 11b or the processing chip 12b, so that the heat emitted by the image sensor 11b or the processing chip 12b can be conducted in time, the heat is prevented from being accumulated around the image sensor 11b or the processing chip 12b to influence the normal operation of the image sensor 11b and the processing chip 12b, and the heat dissipation effect of the chip module 10 is improved.

It is understood that, in other embodiments, the number of the heat dissipation holes 16 arranged on the first circuit board 11a and/or the second circuit board 12a may be adjusted according to actual needs, and the embodiment is not particularly limited.

The first aspect of the present embodiment provides a chip module 10, in which a first circuit module 11 is formed by disposing an image sensor 11b on a first circuit board 11a and electrically connecting the image sensor to the first circuit board 11 a. The processing chip 12b is disposed on the second circuit board 12a and electrically connected to the second circuit board 12a to form a second circuit assembly 12. Meanwhile, the second circuit assembly 12 is disposed on a side of the first circuit board 11a away from the image sensor 11b, and the processing chip 12b is disposed between the first circuit board 11a and the second circuit board 12 a. The first circuit board 11a and the second circuit board 12a are electrically connected through a first conductive wire 13, one end of the first conductive wire 13 is connected to the first circuit board 11a, and the other end is connected to the second circuit board 12a, so as to realize signal connection between the first circuit board 11a and the second circuit board 12 a. The first circuit board 11a and the second circuit board 12a are connected through the first conductive wire 13 instead of the conventional connector connection, so that no additional requirement is generated on the limitation of the shapes and the sizes of the first circuit board 11a and the second circuit board 12a, meanwhile, the relative areas of the first circuit board 11a and the second circuit board 12a are reduced, the miniaturization of the chip module 10 is realized, the miniaturization of the camera device 20 is further realized, and convenience is provided for the application of the camera device 20 to the small electronic equipment 30.

Referring to fig. 8, a second aspect of the present embodiment provides a camera device 20, including a camera module 21 and the chip module 10 according to the first aspect, wherein the chip module 10 is connected to the camera module 21 and located at an image end of the camera module 21.

Referring to fig. 9, a third aspect of the present embodiment provides an electronic device 30, which includes the image capturing apparatus 20 according to the second aspect.

It is understood that the electronic device may include, but is not limited to, a cell phone, a tablet computer, a smart watch, a palm top computer, a car recorder, a back up video, etc. The electronic apparatus may further include an apparatus main body, and the image pickup device may be provided to the apparatus main body. And the camera device can be used as a front camera device or a rear camera device of the equipment main body.

The chip module, the camera device and the electronic device disclosed in the embodiments of the present invention are described in detail above, and a specific example is applied in the description to explain the principle and the embodiments of the present invention, and the description of the embodiments is only used to help understand the chip module, the camera device and the electronic device and the core ideas thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (12)

1. A chip module, comprising:

a first circuit assembly including a first circuit board and an image sensor disposed on and electrically connected to the first circuit board;

the second circuit assembly comprises a second circuit board and a processing chip, the second circuit board is arranged on one side of the first circuit board, which is far away from the image sensor, the processing chip is arranged on the second circuit board and is electrically connected with the second circuit board, and the processing chip is connected to the first circuit board so as to be positioned between the first circuit board and the second circuit board; and

a first conductive line having one end connected to the first circuit board and the other end connected to the second circuit board.

2. The chip module according to claim 1, further comprising a first conductive adhesive, wherein both ends of the first conductive line are respectively packaged on the first circuit board and the second circuit board by the first conductive adhesive.

3. The chip module according to claim 1, further comprising a second conductive wire, wherein the image sensor is electrically connected to the first circuit board through the second conductive wire.

4. The chip module according to claim 3, further comprising a second conductive adhesive, wherein both ends of the second conductive line are respectively packaged on the image sensor and the first circuit board by the second conductive adhesive.

5. The chip module according to claim 3, further comprising a package structure disposed on the first circuit board and covering the image sensor and the second conductive lines.

6. The chip module according to claim 5, wherein the package structure includes a protection layer disposed on a side of the image sensor facing away from the first circuit board, and a sealing layer disposed along a circumferential direction of the protection layer and covering the second conductive lines to seal the second conductive lines and the image sensor.

7. The chip module according to claim 1, wherein the image sensor is disposed in a middle portion of the first circuit board, the processing chip is disposed in a middle portion of the second circuit board, and a projection of the image sensor on the first circuit board is located in a projection area of the processing chip on the first circuit board.

8. The chip module according to claim 1, wherein the processing chip is bonded to a side of the first circuit board facing away from the image sensor.

9. The chip module according to any one of claims 1 to 8, wherein the first circuit board and/or the second circuit board is provided with heat dissipation holes that penetrate both sides in the thickness direction of the first circuit board or the second circuit board.

10. The chip module according to claim 9,

when the first circuit board is provided with the heat dissipation hole, the arrangement position of the heat dissipation hole on the first circuit board is positioned in a projection area of the image sensor on the first circuit board;

when the second circuit board is provided with the radiating holes, the positions of the radiating holes on the second circuit board are located in the projection area of the processing chip on the second circuit board.

11. An image pickup apparatus, comprising:

a camera module, and

the chip module according to any one of claims 1 to 10, wherein the chip module is connected to the camera module and located at an image end of the camera module.

12. An electronic apparatus characterized by comprising the image pickup device according to claim 11.

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