WO2022252888A1

WO2022252888A1 - Packaging module and manufacturing method therefor, and electronic apparatus

Info

Publication number: WO2022252888A1
Application number: PCT/CN2022/089618
Authority: WO
Inventors: 郭学平
Original assignee: 荣耀终端有限公司
Priority date: 2021-06-04
Filing date: 2022-04-27
Publication date: 2022-12-08
Also published as: CN113745202A

Abstract

A packaging module and a manufacturing method therefor, and an electronic apparatus. The packaging module uses double-faced packaging technology, different devices in the module are respectively packaged on two faces of a packaging substrate, and a groove can be dug in an FPC to form a through groove. When the FPC (i.e., a soft board) is interconnected to the packaging substrate (i.e., a hard board), a device close to one face of the FPC is placed in the through groove of the FPC, so that the integration level of the packaging module is improved. In addition, after the FPC is grooved, pads can be provided around the through groove in the FPC, so that the number of interconnection pins of the FPC and the packaging substrate is increased, the application of a high-density interconnection scene is satisfied, and the overall performance of the packaging module is improved.

Description

Encapsulation module, manufacturing method thereof, and electronic device

This application claims the priority of the Chinese patent application with the application number 202110626262.9 and the title of the invention "encapsulation module and its manufacturing method, electronic equipment" submitted to the State Intellectual Property Office on June 4, 2021, the entire contents of which are incorporated by reference in this application.

technical field

The present application relates to the technical field of chip packaging, in particular to a packaging module, a manufacturing method thereof, and electronic equipment.

Background technique

With the development of miniaturization requirements of terminal equipment, the internal space of terminal equipment may have small and irregular features, and a flexible printed circuit board (flexible printed circuit, FPC) is generally used to realize signal interconnection. In chip packaging, the interconnection between soft boards (such as flexible printed circuit boards FPC) and hard boards (such as packaging substrates) can be used to realize signal transmission in chip/device modules.

With the development of system in package (SiP) technology, double-sided packaging technology is generally adopted. At present, due to the limitation of the interconnection structure of the flexible board and the hard board, in the double-sided packaging scenario, the thickness of the double-sided packaging module using the interconnection of the flexible board and the hard board is generally thick, which is not conducive to the miniaturization of terminal equipment.

Contents of the invention

The embodiment of the present application provides a packaging module, its manufacturing method, and electronic equipment. In the scenario of using double-sided packaging technology for chip packaging, the thickness of the packaging module using the interconnection technology of soft board and hard board can be reduced, and the thickness of the packaging module can be improved. The application scenarios and performance of the packaging module.

In a first aspect, the present application provides a packaging module. The packaging module includes: a packaging substrate, a first device, a second device and a flexible printed circuit board FPC. Wherein, the first device is packaged on the first surface of the packaging substrate. The second device is packaged on the second surface of the packaging substrate. The first surface of the FPC is welded to the second surface of the packaging substrate, and the position of the FPC corresponding to the second device is provided with a through groove, and the second device is located in the through groove of the FPC.

Based on the above packaging module, the packaging module adopts double-sided packaging technology to package different devices in the module on both sides of the packaging substrate, and can dig grooves on the FPC to form through grooves. When the FPC (that is, the soft board) is interconnected with the packaging substrate (that is, the hard board), the device close to the FPC side is placed in the through groove of the FPC, thereby improving the integration of the packaging module. In addition, after the FPC is grooved, pads can be set around the through groove in the FPC to increase the number of interconnection pins between the FPC and the package substrate, meet the application of high-density interconnection scenarios, and improve the overall performance of the package module .

With reference to the first aspect, in a possible design manner, the first device includes one or more of a soldered chip, a WB chip, and a passive device.

With reference to the first aspect, in a possible design manner, the second device includes one or more of a soldered chip, a WB chip, and a passive device.

For example, in a battery protection board scenario, the battery protection board circuit may include a control chip, a protection chip, passive components (such as capacitors and resistors), MOS switches, and the like. In this scenario, the first device may include a control chip, a protection chip and passive devices. The second device may be a MOS switch.

For another example, in a bluetooth headset scenario, the bluetooth headset includes a bluetooth main control chip, a passive device, a radio frequency chip, an antenna, and a memory. Wherein, the radio frequency chip may include a radio frequency sending channel and a radio frequency receiving channel. The radio frequency transmitting channel may include a low noise amplifier (low noise amplifier, LNA) and a filter; the radio frequency receiving channel may include a filter and a power amplifier (power amplifier, PA). In this scenario, the first device may include a Bluetooth main control chip, a passive device, and a radio frequency chip. The second device may be a memory.

In combination with the first aspect, in a possible design manner, the size of the through groove matches the size of the second device. In this case, the area of the trench in the FPC can be reduced, thereby increasing the number of the second pads, and improving the flow capacity between the FPC and the packaging substrate.

In combination with the first aspect, in a possible design mode, a first pad is provided at the edge of the second surface of the packaging substrate; a second pad is provided on the first surface of the FPC; the first pad and the second pad The pads are soldered to interconnect the package substrate with the FPC.

In combination with the first aspect, in a possible design mode, on the first surface of the FPC, a plurality of second soldering pads are provided at intervals along the through groove, and a plurality of corresponding second soldering pads are provided on the second surface of the package substrate. multiple first pads of the pad. In this way, the number of interconnection pins between the FPC and the packaging substrate can be increased to meet the application of high-density interconnection scenarios and improve the overall performance of the packaging module.

In combination with the first aspect, in a possible design manner, the distance between the above-mentioned adjacent second pads is less than 0.3 mm, and the above-mentioned first pad and the second pad are soldered by a reflow soldering process. In this way, on the one hand, the spacing between the pads can be made smaller, realizing high-density interconnection between the FPC and the packaging substrate, and improving the flow capacity; on the other hand, the use of reflow soldering process can avoid the problem of serial welding between pads , so as to improve the yield rate of the packaging module, thereby improving the reliability of the packaging module.

In combination with the first aspect, in a possible design mode, the side of the second device away from the packaging substrate is covered with thermally conductive adhesive, the second surface of the FPC is connected with a thermally conductive plate, and the thermally conductive plate is bonded to the thermally conductive adhesive. In this case, the second device can be dissipated through the heat-conducting adhesive and the heat-conducting plate, thereby improving the performance and reliability of the packaging module.

In combination with the first aspect, in a possible design manner, the above-mentioned thermal conductive adhesive is a thermal interface material (TIM). When the thermally conductive adhesive is bonded to the thermally conductive plate, the thermally conductive adhesive can fill the air gap and reduce the contact thermal resistance, thereby improving the heat dissipation performance.

In combination with the first aspect, in a possible design manner, the heat conduction plate is connected to the edge of the through groove in the FPC, and the heat conduction plate covers the through groove. In this case, the area of the heat conducting plate can be increased to increase the heat dissipation area and improve the heat dissipation efficiency of the packaging module.

In a second aspect, the present application provides a method for manufacturing a packaging module. The method includes: respectively encapsulating the first device and the second device on the first surface and the second surface of the packaging substrate to form a first module. The first module is welded on the first surface of the FPC provided with the through groove, and the second device is located in the through groove of the FPC.

In combination with the second aspect, in a possible design mode, welding the first module on the first surface of the FPC provided with the through groove includes: printing on the second pad on the first surface of the FPC provided with the through groove solder paste. The first pads on the second surface of the packaging substrate are soldered to the corresponding second pads through a reflow soldering process. In this case, compared with the laser welding process, the reflow soldering process may not require special equipment, and the welding cost is low and the welding efficiency is high. In the case of a small spacing between multiple second pads, compared with the hot bar soldering process, the reflow soldering process can avoid the problem of serial soldering between pads, thereby improving the yield rate of the packaging module , thereby improving the reliability of the packaging module.

With reference to the second aspect, in a possible design manner, the above method further includes: covering the side of the second device away from the packaging substrate with thermally conductive glue. Connect the heat conduction plate on the second surface of the FPC, so that the heat conduction plate and the heat conduction adhesive are bonded together.

In a third aspect, the present application provides an electronic device. The electronic device includes an external component and any possible packaging module as described in the above first aspect. Wherein, the encapsulation module is coupled with the external components for communicating with the external components.

In a fourth aspect, the present application provides a battery protection board. The electronic protection board includes a board-to-board BTB connector and any possible packaging module as described in the first aspect above. Wherein the BTB connector is coupled with the first surface of the FPC. The second surface of the FPC is also provided with charging pins for connecting the charging cells.

With reference to the fourth aspect, in a possible design manner, the first device in the packaging module includes a control chip, a protection chip, and passive devices.

With reference to the fourth aspect, in a possible design manner, the second device in the packaging module includes a first MOS switch and a second MOS switch.

In a fifth aspect, the present application provides a Bluetooth headset. The bluetooth headset includes a board-to-board BTB connector and any possible packaging module as described in the first aspect above. The BTB connector is used to connect one of antenna, audio or power supply. The BTB connector is coupled with the first side of the FPC.

With reference to the fifth aspect, in a possible design manner, the first device in the package module includes a Bluetooth main control chip, a passive device, and a radio frequency chip.

With reference to the fifth aspect, in a possible design manner, the second device in the packaging module includes a memory.

With reference to the fifth aspect, in a possible design manner, the above packaging module may further include an antenna. The antenna can be attached to the first surface or the second surface of the FPC and coupled with the FPC. In this way, the antenna can be directly mounted on the FPC, which is easier to implement.

With reference to the fifth aspect, in a possible design manner, the above packaging module may further include an antenna. The antenna can be attached to the side of the first plastic encapsulation layer away from the packaging substrate, and a first conductor column is arranged in the first plastic encapsulation layer, one end of the first conductor column is coupled to the package substrate, and the other end of the first conductor column Coupled with the antenna. The above-mentioned first plastic sealing layer is used to plastic seal the first device. In this way, the integration degree of the packaging module in the bluetooth scenario can be improved, and the size of the packaging module can be reduced.

It can be understood that the manufacturing method, electronic equipment, etc. of any packaging module provided above can be realized by the corresponding packaging module provided above, or related to the corresponding packaging module provided above Therefore, the beneficial effects it can achieve can refer to the beneficial effects in the packaging module provided above, and will not be repeated here.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

Fig. 2 is a schematic cross-sectional structure diagram of a packaging module provided by an embodiment of the present application;

FIG. 3 is a schematic top view of an FPC provided in an embodiment of the present application;

FIG. 4 is a flow chart of a manufacturing method of a packaging module provided in an embodiment of the present application;

Fig. 5 is a schematic diagram of an intermediate structure formed by executing S401 in Fig. 4;

FIG. 6 is a schematic diagram of another intermediate structure formed by performing S401 in FIG. 4;

FIG. 7 is a schematic structural diagram of performing S401 in FIG. 4;

Fig. 8 is a schematic diagram of executing the process of S402 in Fig. 4;

FIG. 9 is a schematic structural diagram of another packaging module provided by the embodiment of the present application;

FIG. 10 is a flow chart of another manufacturing method of a packaging module provided in an embodiment of the present application;

FIG. 11 is a schematic structural diagram of performing S1001 in FIG. 10;

FIG. 12 is a schematic structural diagram of performing S1002 in FIG. 10;

Fig. 13 is a schematic structural diagram formed during the manufacturing process of another packaging module provided by the embodiment of the present application;

FIG. 14 is a schematic structural diagram of another packaging module provided in the embodiment of the present application;

Fig. 15 is a schematic diagram of a packaging structure of a battery protection board provided in an embodiment of the present application;

FIG. 16 is a schematic diagram of a package structure of a Bluetooth headset provided by an embodiment of the present application;

FIG. 17 is a schematic diagram of the packaging structure of another Bluetooth headset provided by the embodiment of the present application;

FIG. 18 is a schematic diagram of the packaging structure of another Bluetooth headset provided by the embodiment of the present application.

Reference signs:

01-electronic equipment; 10-external components; 20-package module; 101-package substrate; 1011-first pad; 1012-first surface of package substrate; 1013-second surface of package substrate; 102-first Device; 1021-welding chip; 1022-passive device; 1023-WB chip; 103-second device; 104-FPC; 1041-second pad; The second side of FPC; 105-BTB connector; 106-thermal adhesive; 107-thermal plate; 108-first plastic sealing layer; 109-adhesive; Device; 2013-protection chip; 2031-first MOS switch; 2032-second MOS switch; 3011-Bluetooth main control chip, 3012-passive device, 3013-radio frequency chip; 304-antenna; 305-first conductor column.

Detailed ways

In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

Hereinafter, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first", "second", etc. may expressly or implicitly include one or more of that feature. In the description of the present application, unless otherwise specified, "plurality" means two or more.

In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the schematic placement of components in the drawings. It should be understood that these directional terms are relative concepts, and they are used for relative For descriptions and clarifications, it may vary accordingly according to changes in the orientation of parts placed in the drawings.

In this application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary. In addition, the term "coupled" may be an electrical connection for signal transmission. "Coupling" can be a direct electrical connection, or an indirect electrical connection through an intermediary.

With the development of miniaturization requirements of electronic equipment, the internal space of electronic equipment may have small and irregular features, and a flexible printed circuit board (flexible printed circuit, FPC) is generally used to realize signal interconnection. In chip packaging, the interconnection between soft boards (such as flexible printed circuit boards FPC) and hard boards (such as packaging substrates) can be used to realize signal transmission in chip/device modules.

With the development of system in package (SiP) technology, double-sided packaging technology is generally adopted. At present, the interconnection between flexible boards and hard boards is generally realized by board-to-board (board to board, BTB) connectors, zero insertion force (zero insertion force, ZIF) connectors, etc. Due to the limitations of the interconnection structure of the flexible board and the rigid board, in the double-sided packaging scenario, the thickness of the double-sided packaging module using the interconnection of the flexible board and the hard board is generally thick, which is not conducive to the miniaturization of terminal equipment.

An embodiment of the present application provides an electronic device. The electronic device includes a mobile phone (mobile phone), a tablet computer (pad), a computer, a smart wearable product (for example, a smart watch, a smart bracelet), a virtual reality (virtual reality, VR) terminal device, an augmented reality (augmented reality, AR ) Terminal equipment and other electronic products. The embodiment of the present application does not specifically limit the specific form of the foregoing electronic device.

As shown in FIG. 1 , the electronic device 01 includes an external component 10 and at least one packaging module 20 coupled with the external component 10 . Wherein, the package module 20 can be coupled with the external component 10 through the BTB connector, so that the package module 20 and the external component 10 realize signal transmission. The above-mentioned external component 10 may be a printed circuit board (printed circuit boards, PCB) or other packaging modules, and other chips may be packaged on the above-mentioned PCB.

The packaging module 20 above provides an improved interconnection structure between the soft board and the hard board, so as to reduce the thickness of the packaging module 20 , thereby reducing the thickness of the electronic device 01 . The above packaging module 20 will be described in detail below.

In some embodiments of the present application, as shown in FIG. 2 , the package module 20 includes a package substrate 101 , a first device 102 , a second device 103 and a flexible printed circuit (flexible printed circuit, FPC) 104 . Wherein, the packaging substrate 101 is a carrier of chip packaging, and the packaging substrate 101 includes one or more wiring layers, which can provide electrical connections to a plurality of chips arranged on the packaging substrate 101, so as to realize the functions of the packaged chips. Both the first device 102 and the second device 103 may include one or more of a passive device 1022, a wire bonding (WB) chip 1023 and a soldered chip 1021, and may also include a packaged ball array package ( Ball grid array, BGA) device, grid array package (land grid array, LGA) device, or quad flat no-leads package (quad flat no-leads package, QFN) device, the embodiment of the present application does not make special limitation.

The first device 102 is packaged on the first surface 1012 of the packaging substrate 101 . Exemplarily, as shown in FIG. 2 , the first device 102 may be coupled to the first surface 1012 of the package substrate 101 and may be overmolded by the first plastic encapsulation layer 108 . The above-mentioned first device includes a passive device 1022 , a WB chip 1023 and a welding chip 1021 . During packaging, the passive device 1022 can be coupled to the packaging substrate 101 through surface mount technology (surface mounted technology, SMT). The WB chip 1023 refers to a chip whose circuit structure is coupled to the packaging substrate 101 through wires during chip packaging. During packaging, the WB chip 1023 may be coupled to the packaging substrate 101 through wire bonds. The soldered chip 1021 refers to a chip whose circuit structure is coupled to the packaging substrate 101 by means of soldering (such as pads and solder balls) during chip packaging. During packaging, the soldering chip 1021 may be coupled to the packaging substrate 101 by soldering.

After the above-mentioned first device 102 is coupled to the packaging substrate 101, the packaging of each device or chip in the first device 102 can be realized through the first plastic sealing layer 108, so as to realize the isolation between different devices or chips and the connection between the device or chip and the external device isolation. The material of the first plastic sealing layer 108 can be a thermosetting material mixed with resin and filler, wherein the resin can be a resin material such as epoxy resin, and the filler can be silicon oxide (SiO ₂ ) or boron nitride (BN), etc. Inorganic materials and fillers can adjust the properties of the resin to achieve material properties of high thermal conductivity, high melting point, and low coefficient of thermal expansion (CTE). Of course, the material of the first plastic sealing layer 108 may also be other types of materials, such as ceramics or glass, which are not specifically limited in this embodiment of the present application.

It should be noted that, in order to realize signal shielding, on the outer surface of the first plastic sealing layer 108 (that is, the side of the first plastic sealing layer 108 away from the packaging substrate 101) and the side of the packaging substrate 101, a sputtering or spraying process can be used to fabricate a A layer of metal or a conductive material layer is used as a shielding layer, which can effectively prevent the first device 102 from interfering with the magnetically sensitive devices outside the packaging module, and can also prevent the interference magnetic signal outside the packaging module from affecting the performance of each device in the first device 102 , thereby improving the reliability of the packaging module.

The second device 103 is packaged on the second surface 1013 of the packaging substrate 101 . Exemplarily, as shown in FIG. 2 , the above-mentioned second device 103 includes two soldered chips 1021 . The soldering chip 1021 is coupled to the packaging substrate 101 by soldering.

When realizing the interconnection between FPC 104 and packaging substrate 101, in general, the first side 1043 of the above-mentioned FPC 104 will be soldered to the second side 1013 of the packaging substrate 101 through the pad, for example, it can be on the second side 1013 of the packaging substrate 101 A first pad 1011 is provided at the edge position of the FPC 104, and a second pad 1041 is provided on the first surface 1043 of the FPC 104. The first pad 1011 and the second pad 1041 are welded to interconnect the packaging substrate 101 and the FPC 104.

If the second side 1013 of the package substrate 101 is packaged with other devices, when the FPC 104 is welded with the package substrate 101, only the second pad 1041 will be set at one side edge of the FPC 104, and now the FPC 104 is welded with the package substrate 101 The number of pads (that is, the number of pins interconnected between the FPC 104 and the package substrate 101) will be greatly limited, and the FPC 104 will extend a lot away from the package substrate 101, so that the integration of the package module 20 lower degree.

If there are more pads between the FPC 104 and the packaging substrate 101 (that is, there are more interconnection pins between the FPC 104 and the packaging substrate 101, such as the first pad 1011 and the second pad 1041), then The overlapping area between the FPC 104 and the packaging substrate 101 is so large that the second surface 1013 of the packaging substrate 101 cannot package devices, so that the packaging module 20 has a relatively large thickness and a low degree of integration.

However, in the embodiment of the present application, the first surface 1043 of the above-mentioned FPC 104 is welded to the second surface 1013 of the packaging substrate 101, and the position of the FPC 104 corresponding to the second device 103 is provided with a through groove 1042, and the above-mentioned second device 103 Located in the through groove 1042 of the above-mentioned FPC 104. That is to say, after the through groove 1042 is set on the FPC 104 (that is, the groove is dug on the FPC 104), in addition, on the first surface of the above-mentioned FPC 104, a plurality of second welding pads 1041 can be arranged at intervals along the above-mentioned through groove 1042. ,As shown in Figure 3. In order to realize the interconnection between the FPC 104 and the packaging substrate 101, a plurality of first pads 1011 corresponding to the second pads 1041 can be arranged on the second surface 1013 of the packaging substrate 101. When the FPC 104 is interconnected with the packaging substrate 101, the interconnection between the FPC 104 and the packaging substrate 101 can be realized by the corresponding welding of the first pad 1011 and the second pad 1041, thereby improving the interconnection between the FPC 104 and the packaging substrate 101. The number of pins meets the application of high-density interconnection scenarios and improves the overall performance of the packaged module. In a high-density interconnection scenario, for example, the distance between adjacent second pads 1041 is less than 0.3 millimeters (mm), and the process of reflow soldering can be used to realize the connection between the first pad 1011 and the second pad 1041. welding.

Moreover, the second pads 1041 are arranged around the through groove 1042 in the FPC 104, which can increase the flow capacity from the FPC 104 to the packaging substrate 101 and improve the performance of the packaging module. In the embodiment of the present application, the pitch of the second pads 1041 in the FPC 104 can be set to 0.3 to 0.5 millimeters, so as to further improve the flow capacity of the FPC 104 to the packaging substrate.

It should be understood that in the scene where the number of pins interconnected between the FPC 104 and the packaging substrate 101 is less, the first pad 1011 can also be provided only at an edge position of the second surface 1013 of the packaging substrate 101, and on the FPC 104 Corresponding second pads 1041 are provided.

In addition, after the FPC 104 is interconnected with the packaging substrate 101, the second device 103 packaged on the second surface 1013 of the packaging substrate 101 can be arranged on the second surface 1013 of the packaging substrate 101 corresponding to the through groove 1042 of the above-mentioned FPC 104. position, so that both sides of the packaging substrate 101 can package device modules, thereby improving the integration of the packaging module and reducing the thickness of the packaging module.

It should be noted that the size of the through groove 1042 in the above-mentioned FPC 104 can match the size of the second device 103. That is to say, the second device 103 can just be placed in the through groove 1042 . In this case, the area of the trench in the FPC 104 can be reduced, so that the number of the second pads 1041 can be increased, and the flow capacity between the FPC 104 and the packaging substrate 101 can be improved.

The manufacturing method of the encapsulation module shown in FIG. 2 is exemplified below. As shown in FIG. 4, the manufacturing method of the encapsulation module 20 includes:

S401. Package the first device 102 and the second device 103 on the first surface 1012 and the second surface 1013 of the packaging substrate 101 to form a first module.

Exemplarily, as shown in FIG. 5, for an SMT device (such as a passive device 1022), solder paste may be printed on the first side 1012 of the packaging substrate 101, so that the SMT device is mounted on the first side 1012 of the packaging substrate 101 and coupled with the packaging substrate 101. For the WB chip 1023, the substrate of the chip can be directed toward the packaging substrate 101 first, and the WB chip 1023 is mounted on the first surface 1012 of the packaging substrate 101 by using adhesive or dispensing, and then the metal wire The circuit structure of the WB chip 1023 is connected to the packaging substrate 101 to realize the interconnection and signal transmission between the WB chip 1023 and the packaging substrate 101 . For the soldering chip 1021, the soldering surface of the soldering chip 1021 (that is, the side on which the solder balls of the chip are arranged) can be directed towards the package substrate 101, and the soldering chip 1021 is welded to the package substrate 101 by means of reflow soldering, laser welding, etc., so as to realize soldering of the chip. 1021 interconnection with the packaging substrate 101 and signal transmission.

As shown in FIG. 6 , after the mounting or interconnection between the device module and the packaging substrate 101 is achieved, the packaging substrate 101 or the device module can be processed using a plasma process. After the plasma treatment, the device can be packaged by plastic packaging, and the gap between the devices and the gap between the device and the packaging substrate 101 need to be packaged in plastic.

As shown in FIG. 7 , taking the second device 103 including two welding chips 1021 as an example, the welding surface of the welding chips 1021 can be directed toward the packaging substrate 101, and the welding chips 1021 can be welded to the packaging substrate by means of reflow soldering, laser welding, etc. 101, so as to realize the interconnection and signal transmission between the bonding chip 1021 and the packaging substrate 101.

S402, welding the first module on the FPC 104 provided with the through groove 1042, and positioning the second device 103 in the through groove 1042 of the above-mentioned FPC 104.

Exemplarily, as shown in FIG. 8, the FPC 104 is fixed by a tooling fixture and the FPC 104 is kept flat. For example, the FPC 104 can be fixed and kept flat by means of vacuum adsorption; or a magnetically adsorbed cover can be added to the fixture to fix and keep the FPC 104 flat. Then, solder paste can be printed on the first surface 1043 of the FPC 104 at the position corresponding to the second pad 1041 through the printing stencil. Next, the above-mentioned packaging substrate 101 (i.e. the first module) that encapsulates the second device 103 and the first device 102 is welded to the FPC 104 by a reflow soldering process or a laser welding process, that is, the first soldering on the packaging substrate 101 The pad 1011 is correspondingly soldered to the second pad 1041 on the FPC 104. And, as shown in FIG. 8, the BTB connector can also be soldered to the FPC 104.

It should be noted that, compared with the laser welding process, the reflow soldering process may not require special equipment, and the welding cost is low and the welding efficiency is high. In the case of a small spacing between multiple second pads, compared with the hot bar soldering process, the reflow soldering process can avoid the problem of serial soldering between pads, thereby improving the yield rate of the packaging module , thereby improving the reliability of the packaging module.

In order to prevent the solder joints from falling when the device module (such as the first device 102 and the second device 103) is welded to the packaging substrate 101, and the solder joints from falling when the packaging substrate 101 is welded to the FPC 104, the device module and the packaging substrate can be connected. Between the solder joints of 101, and between the solder joints of the package substrate 101 and the FPC 104, fill the underfill glue to improve the reliability of the package module.

In some embodiments of the present application, as shown in FIG. 9 , in scenarios with high heat dissipation requirements, devices with high power consumption (such as MOS devices) can be used as devices in the second device 103 and packaged on the packaging substrate. 101's second side. At this time, the thermally conductive adhesive 106 can be covered on the side of the second device 103 away from the package substrate 101, and the thermally conductive plate 107 is connected on the second surface 1044 of the FPC 104, and the thermally conductive plate 107 and the thermally conductive adhesive 106 are bonded together. , so as to realize the heat dissipation of the devices in the second device 103, thereby improving the performance and reliability of the packaging module.

In addition, in order to improve the heat dissipation efficiency, the heat conduction plate 107 can be connected to the edge of the through groove 1042 in the FPC 104, and the heat conduction plate 107 can cover the above-mentioned through groove 1042 and the second device 103 in the through groove 1042 to improve the heat conduction plate 107. area, and the thermally conductive plate 107 is bonded to the thermally conductive adhesive 106, so that the heat of the device can be conducted to the thermally conductive plate 107 through the thermally conductive adhesive 106, so as to realize rapid heat dissipation of the device.

It should be noted that, according to the actual situation of the packaging module, the above-mentioned thermally conductive adhesive 106 can be a complete layer of thermally conductive adhesive film covering the area of the second device 103, or it can be a gel structure in the area of the second device 103, or It may be a colloidal structure in the entire space area between the second device 103 and the FPC 104, so that the thermally conductive glue 106 wraps the entire second device 103 and maximizes the heat dissipation performance of the entire packaging module. Therefore, the embodiment of the present application does not impose special limitations on the structure and coverage of the thermally conductive adhesive 106 .

In addition, the above-mentioned heat conduction plate 107 can also be used for structural reinforcement of the FPC 104, as a structural reinforcement plate of the FPC 104 to improve the structural stability of the FPC 104, thereby improving the structural stability and reliability of the packaging module.

The manufacturing method of the encapsulating module shown in Figure 9 is illustrated below, as shown in Figure 10, on the basis of the manufacturing method of the encapsulating module shown in Figure 4, the manufacturing method of the encapsulating module 20 can also be include:

S1001, cover the side of the second device 103 away from the packaging substrate 101 and the side of the FPC 104 away from the packaging substrate 101 with thermal conductive glue 106.

Exemplarily, as shown in FIG. 11 , after the above S402 is performed, the structure formed by performing S402 is turned over 180 degrees so that the second surface 1044 of the FPC 104 faces upward. At this time, the side of the second device 103 away from the packaging substrate 101 and the side of the FPC 104 away from the packaging substrate 101 can be covered with thermally conductive adhesive 106, so that the thermally conductive adhesive 106 is attached to the chip or device in the second device 103, and the The thermally conductive glue 106 adheres to the second surface 1044 of the FPC 104 . The glue-covered area of the thermally conductive glue 106 on the FPC 104 can be determined by the size of the thermally conductive plate 107.

S1002, bonding the heat conduction plate 107 on the second surface 1044 of the FPC 104, so that the heat conduction plate 107 and the heat conduction adhesive 106 are bonded together.

Exemplarily, as shown in FIG. 12 , after the above S1001 is performed, the thermally conductive plate 107 may be directly covered on the thermally conductive adhesive 106 , so that the thermally conductive plate 107 and the thermally conductive adhesive 106 are bonded together.

The thermal conductive adhesive 106 is a thermal interface material (TIM). After the thermally conductive adhesive 106 is bonded to the thermally conductive plate 107 , the thermally conductive adhesive can fill air gaps, reduce contact thermal resistance, and thereby improve heat dissipation performance.

It should be noted that, when the above-mentioned heat conduction plate 107 is used as a structural reinforcing plate of the FPC 104, the FPC 104 can be fixed with a tooling fixture before the above-mentioned S402 is performed, and then the second surface 1044 of the FPC 104 can be covered with adhesive 109. Mount the heat conducting plate 107 on the second surface 1044 of the FPC 104, and allow the heat conducting plate 107 to cover the through groove 1042 in the FPC 104 to form a structure as shown in (a) in FIG. 13 . After completing the lamination of the heat conducting plate 107 and the FPC 104, the first face 1043 of the FPC 104 faces up, and covers the heat conducting glue 106 in the through groove 1042 in the FPC 104, forming as shown in (b) in Figure 13 Structure. At this time, the above S402 can be performed again, and the first module is welded on the FPC 104 provided with the through groove 1042, so that the second device 103 is located in the through groove 1042 of the above-mentioned FPC 104, and the second device 103 and the thermally conductive adhesive 106 close fit to form a structure as shown in (c) in FIG.

It should be understood that the above-mentioned adhesive 109 can use TIM adhesive like the thermally conductive adhesive 106 ; it can also use ordinary adhesive with adhesive properties, such as epoxy resin adhesive, which is not specifically limited in the embodiment of the present application. In addition, the structure of the heat conducting plate 107 needs to match the thickness of the second device 103 packaged on the second surface 1013 of the packaging substrate 101. The heat conducting plate 107 can be a heat conducting plate with a planar structure as shown in FIG. 9 of the embodiment of the present application. The plate may also be a heat conduction plate with a special-shaped structure matching the thickness of the second device 103 . Specifically, as shown in Figure 14, when the thickness of the second device 103 in the above-mentioned packaging module 20 exceeds the distance from the second surface 1044 of the FPC 104 to the second surface 1013 of the packaging substrate 101, the above-mentioned heat conducting plate 107 is shaped The heat conduction plate of the structure, for example, digs a groove in the middle of the heat conduction plate 107 to form a groove structure, so that when the heat conduction plate 107 is bonded with the FPC 104, the second device 103 is accommodated.

The following two specific examples illustrate the application scenarios of the above packaged modules.

Example 1, the battery protection board can be realized by using the above-mentioned packaging module in FIG. 2 or FIG. 4 . As shown in FIG. 15 , the battery protection board 30 includes a BTB connector 105 and the above-mentioned packaging module in FIG. 2 or FIG. 4 . Wherein, the BTB connector 105 is used to connect the power supply, and the BTB connector 105 is coupled with the first surface 1043 of the FPC 104. The second surface 1044 of the FPC 104 is also provided with charging electrodes (such as the first electrode 204 and the second electrode 205 in Fig. 15 ) for connecting the electric core.

In the battery protection board 30 , as shown in FIG. 15 , the first device 102 may include a control chip 2011 , a protection chip 2013 and a passive device 2012 . The second device 103 may include a first MOS switch 2031 and a second MOS switch 2032 connected in series. Wherein, the protection chip 2013 can be used to detect the charging or discharging state of the battery. The control chip 2011 can control the on and off of the first MOS switch 2031 and the second MOS switch according to the charging or discharging state of the battery provided by the protection chip 2013 . The passive device 2012 may be a resistor or capacitor in the battery protection circuit to ensure normal operation of the circuit.

The battery protection board 30 can provide overcharge protection, overdischarge protection and the like. The working principle of the battery protection board 30 is as follows:

In a charging scenario, the battery protection board 30 can provide overcharge protection. At this time, the protection chip 2013 can detect that the battery is in a charging state, and the protection chip 2013 can send a charging signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 and the second MOS switch 2032 to be turned on, so that the charging circuit is opened. The BTB connector 105 can input the charging current into the charging loop to charge the battery. In this case, the control chip 2011 can monitor in real time whether the voltage at both ends of the battery exceeds the overcharge cut-off voltage. When the voltage at both ends of the battery exceeds the overcharge cut-off voltage and the duration of the voltage at both ends of the battery exceeding the overcharge cut-off voltage has exceeded the preset time, the control chip 2011 can control the second MOS switch 2032 to turn off, so that the charging circuit is cut off. The battery is no longer charged, thereby protecting the battery.

In a discharge scenario, the battery protection board 30 can provide over-discharge protection. At this time, the protection chip 2013 can detect that the battery is in a discharge state, and the protection chip 2013 can send a discharge signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 to turn on, so that the discharge circuit is opened. In this case, the control chip 2011 can monitor in real time whether the voltage at both ends of the battery is less than or equal to the over-discharge cut-off voltage. When the voltage at both ends of the battery is less than or equal to the over-discharge cut-off voltage and the time for which the voltage at both ends of the battery is less than or equal to the over-discharge cut-off voltage has exceeded the preset time, the control chip 2011 can control the first MOS switch 2031 to turn off, so that the discharge circuit is cut off , at this time the battery is no longer discharged, thus protecting the battery.

It should be noted that in the battery protection board 30, there will be a relatively large current in the entire circuit structure of the battery protection board when the battery is being charged, so that the first MOS switch 2031 and the second MOS switch 2032 will generate relatively large heat consumption. And gradually heat up, affecting battery performance. In this case, the first MOS switch 2031 and the second MOS switch 2032 in the battery protection board 30 can be arranged on the second surface of the packaging substrate 101, and the first MOS switch 2031 and the second MOS switch The heat in 2032 is transmitted to the heat guide plate 107 to realize heat dissipation of the battery protection board 30 and improve the thermal performance experience of the battery protection board.

In addition, in the battery protection board 30, by arranging a plurality of second pads in the FPC, the overall flow capacity of the battery protection board can be increased, thereby increasing the battery capacity, improving the charging efficiency, and satisfying the long battery life. need.

Example 2, the bluetooth earphone can be realized by using the above-mentioned packaging module in FIG. 2 or FIG. 4 . As shown in FIG. 16 , the Bluetooth headset 40 may include a BTB connector 105 and the package module in FIG. 2 or FIG. 4 . Wherein the BTB connector 105 can be used to connect the antenna, audio or power supply, etc., and the BTB connector 105 is coupled with the first surface 1043 of the FPC 104.

In the Bluetooth headset 40, as shown in FIG. 16, the first device 102 may include a Bluetooth main control chip 3011, a passive device 3012 (such as a capacitor, a resistor, etc.), a radio frequency chip 3013, and the like. The second device 103 can be devices such as memory (Nor flash) 3031. Wherein, the radio frequency chip 3013 may include a radio frequency sending channel and a radio frequency receiving channel. The radio frequency transmitting channel may include a low noise amplifier LNA and a filter; the radio frequency receiving channel may include a filter and a power amplifier PA.

When the Bluetooth headset is in working condition, the signal, program or data in the Bluetooth main control chip 3011 can be buffered and stored in the memory 3021, and the radio frequency signal sent by the Bluetooth main control chip 3011 can pass through the filter and the LNA and then pass through the package substrate 101 to The FPC 104 is then transmitted to the BTB connector 105 through the FPC 104, so that the radio frequency signal can be transmitted to the antenna to communicate with external devices. Of course, the signal can also be received through the antenna, and transmitted to the Bluetooth main control chip 3011 after passing through the power amplifier PA and the filter, and finally realize the sending and receiving communication between the Bluetooth headset 40 and the external device.

The encapsulation of the internal circuit of the Bluetooth earphone can be realized by the encapsulation module shown in FIG. 2 or FIG. 4 , which can make the encapsulation module more integrated and smaller, meeting the requirement of miniaturization.

In addition, the packaging module in the Bluetooth headset 40 may further include an antenna 304 . As shown in FIG. 17, the antenna 304 can be attached to the first surface 1043 or the second surface 1044 of the FPC 104. Specifically, if the first face 1043 of the FPC 104 is coupled with the BTB connector 105, the antenna 304 can be attached to the second face 1044 of the FPC 104 and coupled with the second face of the FPC 104, thereby realizing the connection between the antenna 304 and the second face of the FPC 104. Communication between bluetooth main control chips 3011.

As shown in FIG. 18 , the antenna 304 can also be attached to the side of the first plastic encapsulation layer 108 away from the package substrate 101 , and a first conductor column 305 is arranged in the first plastic encapsulation layer 108 , and one end of the first conductor column 305 is connected to the The packaging substrate 101 is coupled, and the other end of the first conductor post 305 is coupled to the antenna 304 , so as to realize communication between the antenna 304 and the Bluetooth main control chip 3011 .

It should be noted that the above-mentioned first conductive column 305 may be a column structure made of metal conductive material, such as copper, nickel, tungsten and other metal conductive material. The structure of the conductor column may be any column structure such as a cylinder, a triangular prism, and a conical column structure, which is not particularly limited in this embodiment of the present application.

The above is only a specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.

Claims

A packaging module, characterized in that it includes: a packaging substrate, a first device, a second device, and a flexible printed circuit board (FPC);

The first device is packaged on the first surface of the packaging substrate;

The second device is packaged on the second surface of the packaging substrate;

The first surface of the FPC is welded to the second surface of the packaging substrate, and the FPC is provided with a through groove at a position corresponding to the second device, and the second device is located in the through groove of the FPC Inside.
The packaging module according to claim 1, wherein the first device comprises one or more of soldered chips, WB chips and passive devices.
The packaging module according to claim 1 or 2, wherein the second device includes one or more of soldered chips, WB chips and passive devices.
The packaging module according to any one of claims 1 to 3, wherein the size of the through groove matches the size of the second device.
The package module according to any one of claims 1 to 4, wherein a first pad is provided at an edge position of the second surface of the package substrate; a second pad is provided on the first surface of the FPC. Welding pad: the first welding pad is welded to the second welding pad to interconnect the packaging substrate and the FPC.
The package module according to claim 5, characterized in that, on the first surface of the FPC, a plurality of the second pads are arranged at intervals along the through groove, and the second pads of the package substrate A plurality of the first pads corresponding to the plurality of the second pads are arranged on the surface.
The packaging module according to any one of claims 1 to 6, wherein the side of the second device away from the packaging substrate is covered with thermally conductive glue, and the second surface of the FPC is bonded with a thermally conductive glue. plate, and the heat conduction plate is bonded to the heat conduction adhesive.
The packaging module according to claim 7, wherein the heat conduction plate is connected to an edge of the through groove in the FPC, and the heat conduction plate covers the through groove.
A method for manufacturing a packaging module, characterized in that it includes:

respectively encapsulating the first device and the second device on the first surface and the second surface of the packaging substrate to form a first module;

The first module is welded on the first surface of the FPC provided with the through groove, and the second device is located in the through groove of the FPC.
The method according to claim 9, wherein the welding of the first module on the first surface of the FPC provided with through grooves comprises:

Printing solder paste on the second pad on the first side of the FPC provided with the through groove;

Soldering the first pads on the second surface of the package substrate to the corresponding second pads through a reflow soldering process.
The method according to claim 9 or 10, characterized in that the method further comprises:

The side of the second device away from the packaging substrate and the second surface of the FPC are covered with thermal conductive glue;

A heat conduction plate is glued on the second surface of the FPC, so that the heat conduction plate is adhered to the heat conduction adhesive.
An electronic device, characterized by comprising an external component and the packaging module according to any one of claims 1 to 8; the packaging module is coupled to the external component.
A package module, characterized in that it comprises: a package substrate, a first device, a second device and a flexible printed circuit board FPC;

The first device is packaged on the first surface of the packaging substrate;

The second device is packaged on the second surface of the packaging substrate;

The first surface of the FPC is welded to the second surface of the packaging substrate, and the FPC is provided with a through groove at a position corresponding to the second device, and the second device is located in the through groove of the FPC Inside;

The side of the second device away from the packaging substrate is covered with thermally conductive glue, the second surface of the FPC is bonded with a thermally conductive plate, and the thermally conductive plate is bonded to the thermally conductive adhesive.
The packaging module according to claim 13, wherein the first device comprises one or more of soldered chips, WB chips and passive devices.
The packaging module according to claim 13 or 14, wherein the second device includes one or more of soldered chips, WB chips and passive devices.
The packaging module according to any one of claims 13 to 15, wherein the size of the through groove matches the size of the second device.
The package module according to any one of claims 13 to 16, wherein a first pad is provided at an edge position of the second surface of the package substrate; a second pad is provided on the first surface of the FPC. Welding pad: the first welding pad is welded to the second welding pad to interconnect the packaging substrate and the FPC.
The packaging module according to claim 17, characterized in that, on the first surface of the FPC, a plurality of the second pads are arranged at intervals along the through groove, and the second pads of the packaging substrate A plurality of the first pads corresponding to the plurality of the second pads are arranged on the surface.
The packaging module according to any one of claims 13-18, wherein the heat conduction plate is connected to an edge of the through groove in the FPC, and the heat conduction plate covers the through groove.