WO2022252888A1 - Module d'emballage et son procédé de fabrication, et appareil électronique - Google Patents

Module d'emballage et son procédé de fabrication, et appareil électronique Download PDF

Info

Publication number
WO2022252888A1
WO2022252888A1 PCT/CN2022/089618 CN2022089618W WO2022252888A1 WO 2022252888 A1 WO2022252888 A1 WO 2022252888A1 CN 2022089618 W CN2022089618 W CN 2022089618W WO 2022252888 A1 WO2022252888 A1 WO 2022252888A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc
packaging
groove
substrate
module
Prior art date
Application number
PCT/CN2022/089618
Other languages
English (en)
Chinese (zh)
Inventor
郭学平
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2022252888A1 publication Critical patent/WO2022252888A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present application relates to the technical field of chip packaging, in particular to a packaging module, a manufacturing method thereof, and electronic equipment.
  • a flexible printed circuit board (flexible printed circuit, FPC) is generally used to realize signal interconnection.
  • FPC flexible printed circuit
  • chip packaging the interconnection between soft boards (such as flexible printed circuit boards FPC) and hard boards (such as packaging substrates) can be used to realize signal transmission in chip/device modules.
  • the embodiment of the present application provides a packaging module, its manufacturing method, and electronic equipment.
  • the thickness of the packaging module using the interconnection technology of soft board and hard board can be reduced, and the thickness of the packaging module can be improved.
  • the application scenarios and performance of the packaging module can be improved.
  • the present application provides a packaging module.
  • the packaging module includes: a packaging substrate, a first device, a second device and a flexible printed circuit board FPC.
  • the first device is packaged on the first surface of the packaging substrate.
  • the second device is packaged on the second surface of the packaging substrate.
  • the first surface of the FPC is welded to the second surface of the packaging substrate, and the position of the FPC corresponding to the second device is provided with a through groove, and the second device is located in the through groove of the FPC.
  • the packaging module adopts double-sided packaging technology to package different devices in the module on both sides of the packaging substrate, and can dig grooves on the FPC to form through grooves.
  • the FPC that is, the soft board
  • the packaging substrate that is, the hard board
  • the device close to the FPC side is placed in the through groove of the FPC, thereby improving the integration of the packaging module.
  • pads can be set around the through groove in the FPC to increase the number of interconnection pins between the FPC and the package substrate, meet the application of high-density interconnection scenarios, and improve the overall performance of the package module .
  • the first device includes one or more of a soldered chip, a WB chip, and a passive device.
  • the second device includes one or more of a soldered chip, a WB chip, and a passive device.
  • the battery protection board circuit may include a control chip, a protection chip, passive components (such as capacitors and resistors), MOS switches, and the like.
  • the first device may include a control chip, a protection chip and passive devices.
  • the second device may be a MOS switch.
  • the bluetooth headset includes a bluetooth main control chip, a passive device, a radio frequency chip, an antenna, and a memory.
  • the radio frequency chip may include a radio frequency sending channel and a radio frequency receiving channel.
  • the radio frequency transmitting channel may include a low noise amplifier (low noise amplifier, LNA) and a filter; the radio frequency receiving channel may include a filter and a power amplifier (power amplifier, PA).
  • the first device may include a Bluetooth main control chip, a passive device, and a radio frequency chip.
  • the second device may be a memory.
  • the size of the through groove matches the size of the second device.
  • the area of the trench in the FPC can be reduced, thereby increasing the number of the second pads, and improving the flow capacity between the FPC and the packaging substrate.
  • a first pad is provided at the edge of the second surface of the packaging substrate; a second pad is provided on the first surface of the FPC; the first pad and the second pad The pads are soldered to interconnect the package substrate with the FPC.
  • a plurality of second soldering pads are provided at intervals along the through groove, and a plurality of corresponding second soldering pads are provided on the second surface of the package substrate. multiple first pads of the pad. In this way, the number of interconnection pins between the FPC and the packaging substrate can be increased to meet the application of high-density interconnection scenarios and improve the overall performance of the packaging module.
  • the distance between the above-mentioned adjacent second pads is less than 0.3 mm, and the above-mentioned first pad and the second pad are soldered by a reflow soldering process.
  • the spacing between the pads can be made smaller, realizing high-density interconnection between the FPC and the packaging substrate, and improving the flow capacity; on the other hand, the use of reflow soldering process can avoid the problem of serial welding between pads , so as to improve the yield rate of the packaging module, thereby improving the reliability of the packaging module.
  • the side of the second device away from the packaging substrate is covered with thermally conductive adhesive
  • the second surface of the FPC is connected with a thermally conductive plate
  • the thermally conductive plate is bonded to the thermally conductive adhesive.
  • the second device can be dissipated through the heat-conducting adhesive and the heat-conducting plate, thereby improving the performance and reliability of the packaging module.
  • the above-mentioned thermal conductive adhesive is a thermal interface material (TIM).
  • TIM thermal interface material
  • the heat conduction plate is connected to the edge of the through groove in the FPC, and the heat conduction plate covers the through groove.
  • the area of the heat conducting plate can be increased to increase the heat dissipation area and improve the heat dissipation efficiency of the packaging module.
  • the present application provides a method for manufacturing a packaging module.
  • the method includes: respectively encapsulating the first device and the second device on the first surface and the second surface of the packaging substrate to form a first module.
  • the first module is welded on the first surface of the FPC provided with the through groove, and the second device is located in the through groove of the FPC.
  • welding the first module on the first surface of the FPC provided with the through groove includes: printing on the second pad on the first surface of the FPC provided with the through groove solder paste.
  • the first pads on the second surface of the packaging substrate are soldered to the corresponding second pads through a reflow soldering process.
  • the reflow soldering process may not require special equipment, and the welding cost is low and the welding efficiency is high.
  • the reflow soldering process can avoid the problem of serial soldering between pads, thereby improving the yield rate of the packaging module , thereby improving the reliability of the packaging module.
  • the above method further includes: covering the side of the second device away from the packaging substrate with thermally conductive glue. Connect the heat conduction plate on the second surface of the FPC, so that the heat conduction plate and the heat conduction adhesive are bonded together.
  • the present application provides an electronic device.
  • the electronic device includes an external component and any possible packaging module as described in the above first aspect.
  • the encapsulation module is coupled with the external components for communicating with the external components.
  • the present application provides a battery protection board.
  • the electronic protection board includes a board-to-board BTB connector and any possible packaging module as described in the first aspect above.
  • the BTB connector is coupled with the first surface of the FPC.
  • the second surface of the FPC is also provided with charging pins for connecting the charging cells.
  • the first device in the packaging module includes a control chip, a protection chip, and passive devices.
  • the second device in the packaging module includes a first MOS switch and a second MOS switch.
  • the present application provides a Bluetooth headset.
  • the bluetooth headset includes a board-to-board BTB connector and any possible packaging module as described in the first aspect above.
  • the BTB connector is used to connect one of antenna, audio or power supply.
  • the BTB connector is coupled with the first side of the FPC.
  • the first device in the package module includes a Bluetooth main control chip, a passive device, and a radio frequency chip.
  • the second device in the packaging module includes a memory.
  • the above packaging module may further include an antenna.
  • the antenna can be attached to the first surface or the second surface of the FPC and coupled with the FPC. In this way, the antenna can be directly mounted on the FPC, which is easier to implement.
  • the above packaging module may further include an antenna.
  • the antenna can be attached to the side of the first plastic encapsulation layer away from the packaging substrate, and a first conductor column is arranged in the first plastic encapsulation layer, one end of the first conductor column is coupled to the package substrate, and the other end of the first conductor column Coupled with the antenna.
  • the above-mentioned first plastic sealing layer is used to plastic seal the first device. In this way, the integration degree of the packaging module in the bluetooth scenario can be improved, and the size of the packaging module can be reduced.
  • any packaging module provided above can be realized by the corresponding packaging module provided above, or related to the corresponding packaging module provided above Therefore, the beneficial effects it can achieve can refer to the beneficial effects in the packaging module provided above, and will not be repeated here.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • Fig. 2 is a schematic cross-sectional structure diagram of a packaging module provided by an embodiment of the present application
  • FIG. 3 is a schematic top view of an FPC provided in an embodiment of the present application.
  • FIG. 4 is a flow chart of a manufacturing method of a packaging module provided in an embodiment of the present application.
  • Fig. 5 is a schematic diagram of an intermediate structure formed by executing S401 in Fig. 4;
  • FIG. 6 is a schematic diagram of another intermediate structure formed by performing S401 in FIG. 4;
  • FIG. 7 is a schematic structural diagram of performing S401 in FIG. 4;
  • Fig. 8 is a schematic diagram of executing the process of S402 in Fig. 4;
  • FIG. 9 is a schematic structural diagram of another packaging module provided by the embodiment of the present application.
  • FIG. 10 is a flow chart of another manufacturing method of a packaging module provided in an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of performing S1001 in FIG. 10;
  • FIG. 12 is a schematic structural diagram of performing S1002 in FIG. 10;
  • Fig. 13 is a schematic structural diagram formed during the manufacturing process of another packaging module provided by the embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of another packaging module provided in the embodiment of the present application.
  • Fig. 15 is a schematic diagram of a packaging structure of a battery protection board provided in an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a package structure of a Bluetooth headset provided by an embodiment of the present application.
  • FIG. 17 is a schematic diagram of the packaging structure of another Bluetooth headset provided by the embodiment of the present application.
  • FIG. 18 is a schematic diagram of the packaging structure of another Bluetooth headset provided by the embodiment of the present application.
  • first”, second, etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first”, “second”, etc. may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • connection should be understood in a broad sense, for example, “connection” can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary.
  • coupled may be an electrical connection for signal transmission.
  • Coupling can be a direct electrical connection, or an indirect electrical connection through an intermediary.
  • a flexible printed circuit board (flexible printed circuit, FPC) is generally used to realize signal interconnection.
  • FPC flexible printed circuit
  • the interconnection between soft boards (such as flexible printed circuit boards FPC) and hard boards (such as packaging substrates) can be used to realize signal transmission in chip/device modules.
  • An embodiment of the present application provides an electronic device.
  • the electronic device includes a mobile phone (mobile phone), a tablet computer (pad), a computer, a smart wearable product (for example, a smart watch, a smart bracelet), a virtual reality (virtual reality, VR) terminal device, an augmented reality (augmented reality, AR ) Terminal equipment and other electronic products.
  • the embodiment of the present application does not specifically limit the specific form of the foregoing electronic device.
  • the electronic device 01 includes an external component 10 and at least one packaging module 20 coupled with the external component 10 .
  • the package module 20 can be coupled with the external component 10 through the BTB connector, so that the package module 20 and the external component 10 realize signal transmission.
  • the above-mentioned external component 10 may be a printed circuit board (printed circuit boards, PCB) or other packaging modules, and other chips may be packaged on the above-mentioned PCB.
  • the packaging module 20 above provides an improved interconnection structure between the soft board and the hard board, so as to reduce the thickness of the packaging module 20 , thereby reducing the thickness of the electronic device 01 .
  • the above packaging module 20 will be described in detail below.
  • the package module 20 includes a package substrate 101 , a first device 102 , a second device 103 and a flexible printed circuit (flexible printed circuit, FPC) 104 .
  • the packaging substrate 101 is a carrier of chip packaging, and the packaging substrate 101 includes one or more wiring layers, which can provide electrical connections to a plurality of chips arranged on the packaging substrate 101, so as to realize the functions of the packaged chips.
  • Both the first device 102 and the second device 103 may include one or more of a passive device 1022, a wire bonding (WB) chip 1023 and a soldered chip 1021, and may also include a packaged ball array package ( Ball grid array, BGA) device, grid array package (land grid array, LGA) device, or quad flat no-leads package (quad flat no-leads package, QFN) device, the embodiment of the present application does not make special limitation.
  • a passive device 1022 a wire bonding (WB) chip 1023 and a soldered chip 1021
  • WB wire bonding
  • the first device 102 is packaged on the first surface 1012 of the packaging substrate 101 .
  • the first device 102 may be coupled to the first surface 1012 of the package substrate 101 and may be overmolded by the first plastic encapsulation layer 108 .
  • the above-mentioned first device includes a passive device 1022 , a WB chip 1023 and a welding chip 1021 .
  • the passive device 1022 can be coupled to the packaging substrate 101 through surface mount technology (surface mounted technology, SMT).
  • SMT surface mounted technology
  • the WB chip 1023 refers to a chip whose circuit structure is coupled to the packaging substrate 101 through wires during chip packaging.
  • the WB chip 1023 may be coupled to the packaging substrate 101 through wire bonds.
  • the soldered chip 1021 refers to a chip whose circuit structure is coupled to the packaging substrate 101 by means of soldering (such as pads and solder balls) during chip packaging. During packaging, the soldering chip 1021 may be coupled to the packaging substrate 101 by soldering.
  • the material of the first plastic sealing layer 108 can be a thermosetting material mixed with resin and filler, wherein the resin can be a resin material such as epoxy resin, and the filler can be silicon oxide (SiO 2 ) or boron nitride (BN), etc. Inorganic materials and fillers can adjust the properties of the resin to achieve material properties of high thermal conductivity, high melting point, and low coefficient of thermal expansion (CTE).
  • the material of the first plastic sealing layer 108 may also be other types of materials, such as ceramics or glass, which are not specifically limited in this embodiment of the present application.
  • a sputtering or spraying process can be used to fabricate a A layer of metal or a conductive material layer is used as a shielding layer, which can effectively prevent the first device 102 from interfering with the magnetically sensitive devices outside the packaging module, and can also prevent the interference magnetic signal outside the packaging module from affecting the performance of each device in the first device 102 , thereby improving the reliability of the packaging module.
  • the second device 103 is packaged on the second surface 1013 of the packaging substrate 101 .
  • the above-mentioned second device 103 includes two soldered chips 1021 .
  • the soldering chip 1021 is coupled to the packaging substrate 101 by soldering.
  • the first side 1043 of the above-mentioned FPC 104 will be soldered to the second side 1013 of the packaging substrate 101 through the pad, for example, it can be on the second side 1013 of the packaging substrate 101
  • a first pad 1011 is provided at the edge position of the FPC 104
  • a second pad 1041 is provided on the first surface 1043 of the FPC 104.
  • the first pad 1011 and the second pad 1041 are welded to interconnect the packaging substrate 101 and the FPC 104.
  • the FPC 104 is welded with the package substrate 101, only the second pad 1041 will be set at one side edge of the FPC 104, and now the FPC 104 is welded with the package substrate 101
  • the number of pads that is, the number of pins interconnected between the FPC 104 and the package substrate 101
  • the FPC 104 will extend a lot away from the package substrate 101, so that the integration of the package module 20 lower degree.
  • the packaging module 20 has a relatively large thickness and a low degree of integration.
  • the first surface 1043 of the above-mentioned FPC 104 is welded to the second surface 1013 of the packaging substrate 101, and the position of the FPC 104 corresponding to the second device 103 is provided with a through groove 1042, and the above-mentioned second device 103 Located in the through groove 1042 of the above-mentioned FPC 104. That is to say, after the through groove 1042 is set on the FPC 104 (that is, the groove is dug on the FPC 104), in addition, on the first surface of the above-mentioned FPC 104, a plurality of second welding pads 1041 can be arranged at intervals along the above-mentioned through groove 1042.
  • a plurality of first pads 1011 corresponding to the second pads 1041 can be arranged on the second surface 1013 of the packaging substrate 101.
  • the interconnection between the FPC 104 and the packaging substrate 101 can be realized by the corresponding welding of the first pad 1011 and the second pad 1041, thereby improving the interconnection between the FPC 104 and the packaging substrate 101.
  • the number of pins meets the application of high-density interconnection scenarios and improves the overall performance of the packaged module.
  • the distance between adjacent second pads 1041 is less than 0.3 millimeters (mm), and the process of reflow soldering can be used to realize the connection between the first pad 1011 and the second pad 1041. welding.
  • the second pads 1041 are arranged around the through groove 1042 in the FPC 104, which can increase the flow capacity from the FPC 104 to the packaging substrate 101 and improve the performance of the packaging module.
  • the pitch of the second pads 1041 in the FPC 104 can be set to 0.3 to 0.5 millimeters, so as to further improve the flow capacity of the FPC 104 to the packaging substrate.
  • the first pad 1011 can also be provided only at an edge position of the second surface 1013 of the packaging substrate 101, and on the FPC 104 Corresponding second pads 1041 are provided.
  • the second device 103 packaged on the second surface 1013 of the packaging substrate 101 can be arranged on the second surface 1013 of the packaging substrate 101 corresponding to the through groove 1042 of the above-mentioned FPC 104. position, so that both sides of the packaging substrate 101 can package device modules, thereby improving the integration of the packaging module and reducing the thickness of the packaging module.
  • the size of the through groove 1042 in the above-mentioned FPC 104 can match the size of the second device 103. That is to say, the second device 103 can just be placed in the through groove 1042 . In this case, the area of the trench in the FPC 104 can be reduced, so that the number of the second pads 1041 can be increased, and the flow capacity between the FPC 104 and the packaging substrate 101 can be improved.
  • the manufacturing method of the encapsulation module shown in FIG. 2 is exemplified below. As shown in FIG. 4, the manufacturing method of the encapsulation module 20 includes:
  • solder paste may be printed on the first side 1012 of the packaging substrate 101, so that the SMT device is mounted on the first side 1012 of the packaging substrate 101 and coupled with the packaging substrate 101.
  • the substrate of the chip can be directed toward the packaging substrate 101 first, and the WB chip 1023 is mounted on the first surface 1012 of the packaging substrate 101 by using adhesive or dispensing, and then the metal wire
  • the circuit structure of the WB chip 1023 is connected to the packaging substrate 101 to realize the interconnection and signal transmission between the WB chip 1023 and the packaging substrate 101 .
  • the soldering surface of the soldering chip 1021 (that is, the side on which the solder balls of the chip are arranged) can be directed towards the package substrate 101, and the soldering chip 1021 is welded to the package substrate 101 by means of reflow soldering, laser welding, etc., so as to realize soldering of the chip. 1021 interconnection with the packaging substrate 101 and signal transmission.
  • the packaging substrate 101 or the device module can be processed using a plasma process.
  • the device can be packaged by plastic packaging, and the gap between the devices and the gap between the device and the packaging substrate 101 need to be packaged in plastic.
  • the welding surface of the welding chips 1021 can be directed toward the packaging substrate 101, and the welding chips 1021 can be welded to the packaging substrate by means of reflow soldering, laser welding, etc. 101, so as to realize the interconnection and signal transmission between the bonding chip 1021 and the packaging substrate 101.
  • the FPC 104 is fixed by a tooling fixture and the FPC 104 is kept flat.
  • the FPC 104 can be fixed and kept flat by means of vacuum adsorption; or a magnetically adsorbed cover can be added to the fixture to fix and keep the FPC 104 flat.
  • solder paste can be printed on the first surface 1043 of the FPC 104 at the position corresponding to the second pad 1041 through the printing stencil.
  • the above-mentioned packaging substrate 101 i.e.
  • the first module that encapsulates the second device 103 and the first device 102 is welded to the FPC 104 by a reflow soldering process or a laser welding process, that is, the first soldering on the packaging substrate 101
  • the pad 1011 is correspondingly soldered to the second pad 1041 on the FPC 104.
  • the BTB connector can also be soldered to the FPC 104.
  • the reflow soldering process may not require special equipment, and the welding cost is low and the welding efficiency is high.
  • the reflow soldering process can avoid the problem of serial soldering between pads, thereby improving the yield rate of the packaging module , thereby improving the reliability of the packaging module.
  • the device module In order to prevent the solder joints from falling when the device module (such as the first device 102 and the second device 103) is welded to the packaging substrate 101, and the solder joints from falling when the packaging substrate 101 is welded to the FPC 104, the device module and the packaging substrate can be connected. Between the solder joints of 101, and between the solder joints of the package substrate 101 and the FPC 104, fill the underfill glue to improve the reliability of the package module.
  • devices with high power consumption can be used as devices in the second device 103 and packaged on the packaging substrate. 101's second side.
  • the thermally conductive adhesive 106 can be covered on the side of the second device 103 away from the package substrate 101, and the thermally conductive plate 107 is connected on the second surface 1044 of the FPC 104, and the thermally conductive plate 107 and the thermally conductive adhesive 106 are bonded together. , so as to realize the heat dissipation of the devices in the second device 103, thereby improving the performance and reliability of the packaging module.
  • the heat conduction plate 107 can be connected to the edge of the through groove 1042 in the FPC 104, and the heat conduction plate 107 can cover the above-mentioned through groove 1042 and the second device 103 in the through groove 1042 to improve the heat conduction plate 107. area, and the thermally conductive plate 107 is bonded to the thermally conductive adhesive 106, so that the heat of the device can be conducted to the thermally conductive plate 107 through the thermally conductive adhesive 106, so as to realize rapid heat dissipation of the device.
  • the above-mentioned thermally conductive adhesive 106 can be a complete layer of thermally conductive adhesive film covering the area of the second device 103, or it can be a gel structure in the area of the second device 103, or It may be a colloidal structure in the entire space area between the second device 103 and the FPC 104, so that the thermally conductive glue 106 wraps the entire second device 103 and maximizes the heat dissipation performance of the entire packaging module. Therefore, the embodiment of the present application does not impose special limitations on the structure and coverage of the thermally conductive adhesive 106 .
  • the above-mentioned heat conduction plate 107 can also be used for structural reinforcement of the FPC 104, as a structural reinforcement plate of the FPC 104 to improve the structural stability of the FPC 104, thereby improving the structural stability and reliability of the packaging module.
  • the manufacturing method of the encapsulating module shown in Figure 9 is illustrated below, as shown in Figure 10, on the basis of the manufacturing method of the encapsulating module shown in Figure 4, the manufacturing method of the encapsulating module 20 can also be include:
  • the structure formed by performing S402 is turned over 180 degrees so that the second surface 1044 of the FPC 104 faces upward.
  • the side of the second device 103 away from the packaging substrate 101 and the side of the FPC 104 away from the packaging substrate 101 can be covered with thermally conductive adhesive 106, so that the thermally conductive adhesive 106 is attached to the chip or device in the second device 103, and the The thermally conductive glue 106 adheres to the second surface 1044 of the FPC 104 .
  • the glue-covered area of the thermally conductive glue 106 on the FPC 104 can be determined by the size of the thermally conductive plate 107.
  • the thermally conductive plate 107 may be directly covered on the thermally conductive adhesive 106 , so that the thermally conductive plate 107 and the thermally conductive adhesive 106 are bonded together.
  • the thermal conductive adhesive 106 is a thermal interface material (TIM). After the thermally conductive adhesive 106 is bonded to the thermally conductive plate 107 , the thermally conductive adhesive can fill air gaps, reduce contact thermal resistance, and thereby improve heat dissipation performance.
  • TIM thermal interface material
  • the FPC 104 can be fixed with a tooling fixture before the above-mentioned S402 is performed, and then the second surface 1044 of the FPC 104 can be covered with adhesive 109. Mount the heat conducting plate 107 on the second surface 1044 of the FPC 104, and allow the heat conducting plate 107 to cover the through groove 1042 in the FPC 104 to form a structure as shown in (a) in FIG. 13 .
  • the first face 1043 of the FPC 104 faces up, and covers the heat conducting glue 106 in the through groove 1042 in the FPC 104, forming as shown in (b) in Figure 13 Structure.
  • the above S402 can be performed again, and the first module is welded on the FPC 104 provided with the through groove 1042, so that the second device 103 is located in the through groove 1042 of the above-mentioned FPC 104, and the second device 103 and the thermally conductive adhesive 106 close fit to form a structure as shown in (c) in FIG.
  • the above-mentioned adhesive 109 can use TIM adhesive like the thermally conductive adhesive 106 ; it can also use ordinary adhesive with adhesive properties, such as epoxy resin adhesive, which is not specifically limited in the embodiment of the present application.
  • the structure of the heat conducting plate 107 needs to match the thickness of the second device 103 packaged on the second surface 1013 of the packaging substrate 101.
  • the heat conducting plate 107 can be a heat conducting plate with a planar structure as shown in FIG. 9 of the embodiment of the present application.
  • the plate may also be a heat conduction plate with a special-shaped structure matching the thickness of the second device 103 .
  • the above-mentioned heat conducting plate 107 is shaped
  • the heat conduction plate of the structure for example, digs a groove in the middle of the heat conduction plate 107 to form a groove structure, so that when the heat conduction plate 107 is bonded with the FPC 104, the second device 103 is accommodated.
  • the battery protection board can be realized by using the above-mentioned packaging module in FIG. 2 or FIG. 4 .
  • the battery protection board 30 includes a BTB connector 105 and the above-mentioned packaging module in FIG. 2 or FIG. 4 .
  • the BTB connector 105 is used to connect the power supply, and the BTB connector 105 is coupled with the first surface 1043 of the FPC 104.
  • the second surface 1044 of the FPC 104 is also provided with charging electrodes (such as the first electrode 204 and the second electrode 205 in Fig. 15 ) for connecting the electric core.
  • the first device 102 may include a control chip 2011 , a protection chip 2013 and a passive device 2012 .
  • the second device 103 may include a first MOS switch 2031 and a second MOS switch 2032 connected in series.
  • the protection chip 2013 can be used to detect the charging or discharging state of the battery.
  • the control chip 2011 can control the on and off of the first MOS switch 2031 and the second MOS switch according to the charging or discharging state of the battery provided by the protection chip 2013 .
  • the passive device 2012 may be a resistor or capacitor in the battery protection circuit to ensure normal operation of the circuit.
  • the battery protection board 30 can provide overcharge protection, overdischarge protection and the like.
  • the working principle of the battery protection board 30 is as follows:
  • the battery protection board 30 can provide overcharge protection.
  • the protection chip 2013 can detect that the battery is in a charging state, and the protection chip 2013 can send a charging signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 and the second MOS switch 2032 to be turned on, so that the charging circuit is opened.
  • the BTB connector 105 can input the charging current into the charging loop to charge the battery.
  • the control chip 2011 can monitor in real time whether the voltage at both ends of the battery exceeds the overcharge cut-off voltage.
  • control chip 2011 can control the second MOS switch 2032 to turn off, so that the charging circuit is cut off. The battery is no longer charged, thereby protecting the battery.
  • the battery protection board 30 can provide over-discharge protection.
  • the protection chip 2013 can detect that the battery is in a discharge state, and the protection chip 2013 can send a discharge signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 to turn on, so that the discharge circuit is opened.
  • the control chip 2011 can monitor in real time whether the voltage at both ends of the battery is less than or equal to the over-discharge cut-off voltage.
  • the control chip 2011 can control the first MOS switch 2031 to turn off, so that the discharge circuit is cut off , at this time the battery is no longer discharged, thus protecting the battery.
  • the first MOS switch 2031 and the second MOS switch 2032 in the battery protection board 30 can be arranged on the second surface of the packaging substrate 101, and the first MOS switch 2031 and the second MOS switch The heat in 2032 is transmitted to the heat guide plate 107 to realize heat dissipation of the battery protection board 30 and improve the thermal performance experience of the battery protection board.
  • the overall flow capacity of the battery protection board can be increased, thereby increasing the battery capacity, improving the charging efficiency, and satisfying the long battery life. need.
  • the bluetooth earphone can be realized by using the above-mentioned packaging module in FIG. 2 or FIG. 4 .
  • the Bluetooth headset 40 may include a BTB connector 105 and the package module in FIG. 2 or FIG. 4 .
  • the BTB connector 105 can be used to connect the antenna, audio or power supply, etc., and the BTB connector 105 is coupled with the first surface 1043 of the FPC 104.
  • the first device 102 may include a Bluetooth main control chip 3011, a passive device 3012 (such as a capacitor, a resistor, etc.), a radio frequency chip 3013, and the like.
  • the second device 103 can be devices such as memory (Nor flash) 3031.
  • the radio frequency chip 3013 may include a radio frequency sending channel and a radio frequency receiving channel.
  • the radio frequency transmitting channel may include a low noise amplifier LNA and a filter; the radio frequency receiving channel may include a filter and a power amplifier PA.
  • the signal, program or data in the Bluetooth main control chip 3011 can be buffered and stored in the memory 3021, and the radio frequency signal sent by the Bluetooth main control chip 3011 can pass through the filter and the LNA and then pass through the package substrate 101 to The FPC 104 is then transmitted to the BTB connector 105 through the FPC 104, so that the radio frequency signal can be transmitted to the antenna to communicate with external devices.
  • the signal can also be received through the antenna, and transmitted to the Bluetooth main control chip 3011 after passing through the power amplifier PA and the filter, and finally realize the sending and receiving communication between the Bluetooth headset 40 and the external device.
  • the encapsulation of the internal circuit of the Bluetooth earphone can be realized by the encapsulation module shown in FIG. 2 or FIG. 4 , which can make the encapsulation module more integrated and smaller, meeting the requirement of miniaturization.
  • the packaging module in the Bluetooth headset 40 may further include an antenna 304 .
  • the antenna 304 can be attached to the first surface 1043 or the second surface 1044 of the FPC 104. Specifically, if the first face 1043 of the FPC 104 is coupled with the BTB connector 105, the antenna 304 can be attached to the second face 1044 of the FPC 104 and coupled with the second face of the FPC 104, thereby realizing the connection between the antenna 304 and the second face of the FPC 104. Communication between bluetooth main control chips 3011.
  • the antenna 304 can also be attached to the side of the first plastic encapsulation layer 108 away from the package substrate 101 , and a first conductor column 305 is arranged in the first plastic encapsulation layer 108 , and one end of the first conductor column 305 is connected to the The packaging substrate 101 is coupled, and the other end of the first conductor post 305 is coupled to the antenna 304 , so as to realize communication between the antenna 304 and the Bluetooth main control chip 3011 .
  • first conductive column 305 may be a column structure made of metal conductive material, such as copper, nickel, tungsten and other metal conductive material.
  • the structure of the conductor column may be any column structure such as a cylinder, a triangular prism, and a conical column structure, which is not particularly limited in this embodiment of the present application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un module d'emballage et son procédé de fabrication, ainsi qu'un appareil électronique. Le module d'emballage utilise une technologie d'emballage double face, différents dispositifs dans le module sont respectivement conditionnés sur deux faces d'un substrat d'emballage, et une rainure peut être creusée dans un FPC pour former une rainure traversante. Lorsque le FPC (c'est-à-dire, une carte souple) est interconnecté au substrat d'emballage (c'est-à-dire, une carte dure), un dispositif proche d'une face du FPC est placé dans la rainure traversante du FPC, de telle sorte que le niveau d'intégration du module d'emballage est amélioré. De plus, une fois que le FPC est rainuré, des plots peuvent être disposés autour de la rainure traversante dans le FPC, de telle sorte que le nombre de broches d'interconnexion du FPC et du substrat d'emballage est augmenté, l'application d'une scène d'interconnexion à haute densité est satisfaite, et la performance globale du module d'emballage est améliorée.
PCT/CN2022/089618 2021-06-04 2022-04-27 Module d'emballage et son procédé de fabrication, et appareil électronique WO2022252888A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110626262.9 2021-06-04
CN202110626262.9A CN113745202A (zh) 2021-06-04 2021-06-04 封装模组及其制作方法、电子设备

Publications (1)

Publication Number Publication Date
WO2022252888A1 true WO2022252888A1 (fr) 2022-12-08

Family

ID=78728426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/089618 WO2022252888A1 (fr) 2021-06-04 2022-04-27 Module d'emballage et son procédé de fabrication, et appareil électronique

Country Status (2)

Country Link
CN (1) CN113745202A (fr)
WO (1) WO2022252888A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113745202A (zh) * 2021-06-04 2021-12-03 荣耀终端有限公司 封装模组及其制作方法、电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1348328A (zh) * 2000-10-05 2002-05-08 三洋电机株式会社 半导体器件和半导体模块
KR20070019361A (ko) * 2005-08-12 2007-02-15 삼성전자주식회사 적층 인쇄회로기판을 이용한 멀티 칩 패키지 및 그의 제조방법
CN105140255A (zh) * 2015-09-25 2015-12-09 江西芯创光电有限公司 一种覆晶摄像头封装片及其制作方法
CN210607245U (zh) * 2019-08-07 2020-05-22 佐臻股份有限公司 模块堆叠封装结构
CN111867274A (zh) * 2019-04-26 2020-10-30 华为技术有限公司 柔性电路板与印刷电路板的焊接方法、器件
TW202044500A (zh) * 2019-05-29 2020-12-01 佐臻股份有限公司 模組堆疊封裝結構
CN113745202A (zh) * 2021-06-04 2021-12-03 荣耀终端有限公司 封装模组及其制作方法、电子设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053409A (ja) * 1999-08-11 2001-02-23 Fujikura Ltd チップ実装モジュール
TWI232567B (en) * 2004-05-31 2005-05-11 Chipmos Technologies Inc Image sensor package with a FPC surrounding a window
US7498646B2 (en) * 2006-07-19 2009-03-03 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1348328A (zh) * 2000-10-05 2002-05-08 三洋电机株式会社 半导体器件和半导体模块
KR20070019361A (ko) * 2005-08-12 2007-02-15 삼성전자주식회사 적층 인쇄회로기판을 이용한 멀티 칩 패키지 및 그의 제조방법
CN105140255A (zh) * 2015-09-25 2015-12-09 江西芯创光电有限公司 一种覆晶摄像头封装片及其制作方法
CN111867274A (zh) * 2019-04-26 2020-10-30 华为技术有限公司 柔性电路板与印刷电路板的焊接方法、器件
TW202044500A (zh) * 2019-05-29 2020-12-01 佐臻股份有限公司 模組堆疊封裝結構
CN210607245U (zh) * 2019-08-07 2020-05-22 佐臻股份有限公司 模块堆叠封装结构
CN113745202A (zh) * 2021-06-04 2021-12-03 荣耀终端有限公司 封装模组及其制作方法、电子设备

Also Published As

Publication number Publication date
CN113745202A (zh) 2021-12-03

Similar Documents

Publication Publication Date Title
US8026584B2 (en) Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof
CN211879369U (zh) 芯片封装结构及电子设备
US8916958B2 (en) Semiconductor package with multiple chips and substrate in metal cap
US20060086890A1 (en) Package structure of image sensor device
US20070053167A1 (en) Electronic circuit module and manufacturing method thereof
JP2001077301A (ja) 半導体パッケージ及びその製造方法
US20220254695A1 (en) Embedded package structure and preparation method therefor, and terminal
JP2002510148A (ja) 複数の基板層と少なくとも１つの半導体チップを有する半導体構成素子及び当該半導体構成素子を製造する方法
TW201244034A (en) Package structure having embedded electronic component and fabrication method thereof
WO2013004083A1 (fr) Structure de blindage d'un boîtier à substrat flexible, et procédé de fabrication de celle-ci
CN101877349A (zh) 半导体模块及便携式设备
CN212991092U (zh) 封装模组、模组载板和电子设备
US20100101081A1 (en) Manufacturing method for protection circuit module of secondary battery
TWI285421B (en) Packaging structure having connector
KR20000015941A (ko) 반도체 장치 및 그 제조 방법
WO2022252888A1 (fr) Module d'emballage et son procédé de fabrication, et appareil électronique
WO2022179295A1 (fr) Module d'emballage, procédé de fabrication d'un module d'emballage, et dispositif électronique
KR20130034310A (ko) 인쇄회로기판 어셈블리
KR102128868B1 (ko) 배터리 보호회로 패키지 및 그 제조방법
WO2023116592A1 (fr) Ensemble carte de circuit imprimé et équipement électronique
CN104218034A (zh) 半导体封装
KR19980025624A (ko) 볼 그리드 어레이 반도체 패키지
TW201208035A (en) Multi-chip stacked assembly with ground connection of EMI shielding
JP2004087936A (ja) 半導体装置及び半導体装置の製造方法並びに電子機器
CN217444379U (zh) 半导体器件的封装结构和电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22814935

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22814935

Country of ref document: EP

Kind code of ref document: A1