492170 A7 B7 五、發明説明（） 本發明係與積體電路晶片之構裝有關，特別是指一種 適用於一般或影像用晶片之超薄型積體電路晶片之構裝。 按，現行之電子消費性產品、通訊用品以及電腦等商 品，其體積大都朝向”輕、薄、短、小”之方向設計，連帶 5 使得用於前述商品中之晶片構裝亦朝此方向發展，期待能 達成晶片尺寸般構裝（chiP scale package，CSP)之結果，以 符合商品設计之需求。此外’現今之晶片構裝更朝向價格 低廉、製程簡化並提昇可靠度之方向發展。 以習知之可程式消除唯讀記憶體（erasable 10 programmable read-only memory，EPROM)或影像用之電荷 耦合器（charge coupled devices，CCD)等晶片之構裝為例， 其晶片大體上係於容裝於一陶瓷材質之載體凹室中，並覆 蓋有透明如石英或玻璃等材質之蓋體，以便構裝外部之光 線可穿透該蓋體而照射於該晶片上，其中該陶瓷載體大都 15 由一平板以及一框體所組成，以便夾置一導線架（lead frame)於其中間，使晶片可藉由該導線架與外界電性連 接’然而，此等構裝方式具有價格昂貴與製程繁雜不便之 缺點。 經濟部中央標準局員工消費合作社印製 美國第6,034,429號以及第6，117,705號專利揭露有另 20 一種型態之晶片構裝，藉以改進上述習用構裝之缺點，該 等美國專利係於一承載板(substrate)上設置一晶片，晶片與 承載板之間則利用打線技術、藉由多數個焊線而相互電性 連接’其次，該承載板上於該晶片周緣，圍繞佈設有黏著 劑’並藉由透明或不透明之蓋體（lid)與該黏著劑銜接而罩 -3- 本紙張尺度適用中國國豕榡準（CNS ) A4規格（210X 297公釐） 492170 A7 B7 五、發明説明（） 覆於該晶片上方以完成構裝；雖然此等方式雖可解決習用 技術價格昂貴與製程繁雜之缺點，然而，因晶片上之焊墊 與晶片之表面幾近為同一水平面，致使焊線與焊墊銜接 時，焊線必須以垂直焊墊平面之方式與焊墊銜接方得牢 5 靠，因此晶片表面上方必須有多餘之空間供焊線容置，如 此一來，將影響蓋體設置之位置，使得整體構裝之高度無 法有效地縮小，換言之，此等構裝方式仍有改進之空間。 緣此，本發明之主要目的在於提供一種超薄型積體電 路晶片之構裝，除了可以有效降低製造成本及加工程序之 10 外，更可有效地降低整體構裝之高度者。 經濟部中央標準局員工消費合作社印製 為達成上述之目的，本發明所提供之一種薄型積體電 路晶片之構裝，包含有：一承載板，具有一頂面及一底面， 該頂面佈設有多數之焊墊；至少一晶片，係固設於該承載 板頂面，該晶片之頂面具有多數之焊墊且各該焊墊上分別 15 設置有一突出體；多數之焊線，各該焊線之一端係與該承 載板之焊墊電性連接，各該焊線之另一端則以大致上呈水 平之方式與該突出體電性連接；一黏著物，係佈設於該晶 片頂面周緣；一蓋體，具有一内表面，該内表面係與該黏 著物固接；藉此，該蓋體可以幾近貼住該晶片之方式罩設 20 於該承載板頂面上方，以達成超薄型構裝之效果者。 其次，本發明更揭露有一遮蔽體，係用以封抵住該蓋 體内表面與該承載板頂面之間之間隙，以保護晶片免受外 物破壞者。 此外，本發明更揭露有多種型態之連接裝置，係用以 -4- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 492170 Μ 五、發明説明（ 15 經濟部中央標準局員工消費合作社印製 20 該承載板焊墊至該承載板外部，以提昇該構装之 再者，藉由本發明所揭露之技術内容，可輕 至多晶片模組(multi-chip module，MCM)之構梦卜二 片模組之構裝可達成超薄之功效。 使夕晶 *為使審查委員能詳細瞭解本發明之實際構造及特 點’兹列舉以下實施例並配合圖示說明如后，其中： 第一圖係本發明第一較佳實施例之剖視圖； 第二圖係本發明第二較佳實施例之剖視圖 第三圖係本發明第三較佳實施例之剖視圖 苐四至第七圖係揭露各種型態之連接裳置 第八圖係本發明第四較佳實施例之剖視圖 第九圖係本發明第五較佳實施例之剖視圖。 請先參閱第一圖，係本發明超薄型積體電路晶片之構 裝（20)所提供之一較佳實施例，該構裝（2〇)包含有一承载板 (22)、一晶片（24)、一黏著物（26)、一蓋體（28)以及一連接 裝置(30)，其中： 該承載板(22)，係可為塑膠、玻璃纖維、強化塑膠、 陶瓷…等材質所製成電路板，作為該構裝結構(2〇)與外界 電性連接之橋樑，該承載板(22)具有一頂面（32)、1底面 (34)，且ΰ亥頂面（32)佈没有呈預定態樣之電路（圖中未示）， 其具有多數之焊墊(36)。 該晶片（24)，其底面係可藉由環氧樹脂、矽樹脂、雙 面膠帶…等黏性材料，而黏著固定於該承載板（22)之頂面 請 先 閲 讀 背 ιέ 之 注 意 事 項 再 t 訂 本紙张尺度適用中國國家標隼（CNS ) A4規格（21〇乂297公釐） 492170 kl __B7 五、發明説明（） (32)上，該晶片（24)之頂面亦佈設有多數之焊墊（38)，各該 焊墊（38)上更分別佈植有一突出體(40)，該突出體(40)係金 屬材質，可藉由化學沉積、蝕刻、焊接或其他方式所製成， 並突露出該晶片（24)頂面一預定高度，而後，利用打線技 5 術，藉由多數之金屬焊線(42)將該晶片（24)與該承載板(22) 電性連接；打線作業時，焊線(42)首先以垂直該承載板(22) 焊墊（36)之方式與該焊墊(36)牢靠地銜接（第一焊接點），其 次，焊線(42)往上拉伸與位於該晶片（24)焊墊（38)上之突出 體(40)銜接（第二焊接點），由於該突出體(4〇)係突露出該晶 10片（24)頂面，具有一定之體積與高度，如此一來，焊線(42) 自該第一焊接點焊接之後，即往上垂直爬升約略相等於該 晶片（24)厚度之距離，而後可以大致上呈水平之方式延 伸’並與该突出體(40)銜接，藉此，該晶片（24)上方供焊線 (42)容置之空間即可扁平化而大幅縮小。 15 該黏著物（26)，係可為矽樹脂（Silicones)、環氧樹脂 經濟部中央標準局員工消費合作社印製 (Epoxies)、丙婦酸樹脂（Acrylics)、聚亞胺（Polyamides)、 低溶點之玻璃等材質所構成，該黏著物（26)係佈設於該晶 片（24)頂面周緣，並覆蓋保護著各該焊線(42)與該晶片（24) 突出體（40)之銜接處，該黏著物塗佈之初期係為一膠狀 20體，而後可乾燥固化成硬質之保護體。 該蓋體（28)，係可為一由不透明之塑膠、金屬或透明 之玻璃、石英、塑膠等材質所製成之板件，該蓋體（28)係 直接與該黏著物（26)壓接固定，藉此，該蓋體(28)可以幾近 貼住該晶片（24)頂面之方式罩設固定於該承載板（22)頂面 -6- 本紙張尺度適财關家縣Tc叫 492170 A7 _____ — B7 五、發明説明（） ~ (32)上方，以達成超薄型構裝之效果；在此需特別說明的 是，該蓋體(28)與該黏著物(26)壓接時，該蓋體⑽之位置 甚至可以下降到該蓋體（28)與呈水平狀態之悍線⑽接觸 為止，藉此儘可能地降低該蓋體（28)之水平高度使整體 5構裝(20)可以更薄，此時，各該突出體(4〇)可視為支撑該蓋 體（28)，並使該蓋體(28)可保持在該晶片（24)頂面上方一預 定距離之間隔件。 而該連接裝置⑽，偏以電性連接該承触(22)焊整 (36)至該承載板（22)外部（如電路板上），使該晶片（24)可與 1〇外界構成一完整之電性通路，第一圖中，該連接裝置（30) 係包含有連通該承載板（22)頂面（32)焊墊（36)至該承載板 (22)底面（34)之多數貫孔（thr〇ugh h〇le)(6〇)，以及佈植於該 承載板(22)底面（34)，與各該貫孔（6〇)電性連接之多數個焊 球(solder ball)(62) 〇 15 其次，請參閱第四圖，係揭露另一種型態之連接裝置 (30’），該連接裝置（30，）包含有與第一圖相同之多數貫孔 (through hole)(64)，以及佈植於該承載板(22)底面（34)，與 各該貫孔（64)電性連接之多數個金屬接腳（g〇ld finger)(66) ° 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 20 再者，請參閱第五至第七圖，再揭露另一種型態之連 接裝置（30")，該連接裝置（3〇，，）包含有與第一圖相同之多數 貫孔(throughhole)(68)，以及突露於該承載板(22)外部，與 各該貫孔（68)電性連接並彎折成預定形狀之接腳 (lead)(70)(72)(74);在此需說明的是，實際實施時，各該金 -7- 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ2ς>7公釐） 492170 經濟部中央標準局員工消費合作社印製 A7 ----- B7 五、發明説明（） 屬接腳（lead)可直接以其接腳一端與該承載板(22)頂面（32) 焊墊（36)電性連接，另一端則位於該承載板(22)外部並彎折 成預定形狀者。如此一來，藉由此等多樣化之連接裝置設 计，可提升該構裝與外界電性連接之適用性。 5 請參閱第二圖，係本發明超薄型積體電路晶片之構裝 (8〇)所長1供之第一較佳實施例，該構裝（80)包含有一承載板 (82)、一晶片（84)、一黏著物（86)、一蓋體（88)以及一連接 裝置（90)，本實施例與第一實施例之差異在於，本實施例 所提供之構裝（80)更包含有： 10 一遮蔽體（92)，係銜接該蓋體（88)内表面及該承載板 (82)頂面，位於該承载板（82)各該焊墊（82a)之周緣，用以封 抵住該蓋體（88)内表面與該承載板（82)頂面之間之間隙，以 保護晶片（84)免受外物破壞，本實施例中，該遮蔽體（92) 係為一夾置於該蓋體（88)與該承載板（82)之間之框體，係可 15為塑膠或其他材質所製成，且實際製造時，該框體可與該 承載板或該蓋體一體成型製成。 請參閱第三圖，係本發明之第三較佳實施例，用以揭 露另一種實施型態之遮蔽體(92，），本實施例中，該遮蔽體 (923係為填置於前述間隙中之黏著物，該遮蔽體(92，)之材 20質可選擇與與前一實施例中所揭露之黏著物（86)材質相同 或不同，藉此，該遮蔽體（92’)可與前述之黏著物（86)—次 塗佈完成，亦可待蓋體（88)組裝完成之後，另行塗佈封裝。 請參閱第八圖，係本發明超薄型積體電路晶片之構I (100)所提供之第四較佳實施例，該構裝（100)包含有一承栽 -8- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 、-口 492170 ΑΊ __Β7 五、發明説明（） 板（102)、一晶片（104)、一黏著物（106)、一蓋體（108)以及 一連接裝置（110)，本實施例與第一實施例之差異在於，該 黏著物（106)除了覆蓋住焊線與該晶片突出體之銜接處之 外，更一舉覆蓋住整個晶片（104)之頂面。此等構裝可適用 5 一般晶片之構裝結構，而不適用於EPROM、CCD、CMOS 等需要透光之構裝結構使用。 最後，請參閱第九圖，係本發明超薄型積體電路晶片 之構裝（120)所提供之第五較佳實施例，係顯示將本發明所 揭露之技術内容應用於多晶片模組構裝之態樣，如圖所 10 示’該構裝（I20)係將多數個積體電路晶片（122)固定於一承 载板（124)上，該承載板（124)可以為一般之電路板，其上佈 設有呈預定悲樣之線路以及電子元件（圖中未示），使得整 體構裝可成為一具有特定功能之模組使用者。 綜上所陳，本發明薄型積體電路晶片之構裝，確實具 15 有上述之優點’足以解決習用技術之缺點，故本發明之實 用性與進步性當毋庸置疑，今為保障申請人之權益，遂依 法提出專利申請，祈請審查委員詳加審查，並早曰賜准 本案專利，則為申請人是幸。 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 492170 kl B7 五、發明説明（） 圖示之簡單說明 第一圖係本發明第一較佳實施例之剖視圖； 第二圖係本發明第二較佳實施例之剖視圖； 第三圖係本發明第三較佳實施例之剖視圖； 5 第四至第七圖係揭露各種型態之連接裝置； 第八圖係本發明第四較佳實施例之剖視圖； 第九圖係本發明第五較佳實施例之剖視圖。 圖號說明 「第一實施例」 ml —^ϋ Imi mu III— HI n In ! i mu HI (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 10 構裝（20) 承載板(22) 晶片（24) 黏著物(26) 蓋體(28) 連接裝置（30) 頂面（32) 底面（34) 焊墊（36) 焊墊（38) 突出體(40) 焊線(42) 貫孔（60) 焊球(62) 連接裝置（30’） 15 貫孔（64) 金屬接腳(66) 連接裝置（30”) 貫孔（68) 接腳（70)(72)(74) 「第二實施例」 構裝（80) 承載板(82) 晶片（84) 黏著物（86) 蓋體(88) 連接裝置（90) 20 遮蔽體(92) 焊墊(82a) 「第三實施例」 遮蔽體(92’） 「第四實施例」 構裝（100) 承載板（102) 晶片（104) -10-492170 A7 B7 5. Description of the invention () The present invention relates to the structure of integrated circuit wafers, and particularly refers to an ultra-thin integrated circuit wafer structure suitable for general or imaging wafers. According to the current consumer electronics, communications products and computers and other commodities, most of them are designed in the direction of "light, thin, short, and small", and the joint 5 makes the chip assembly used in the aforementioned products also develop in this direction. It is expected to achieve the results of a chip scale package (CSP) to meet the needs of product design. In addition, today's chip architecture is moving towards lower prices, simplified processes, and improved reliability. Take the conventional structure of erasable 10 programmable read-only memory (EPROM) or charge coupled devices (CCD) for imaging as an example. It is installed in a ceramic carrier cavity and covered with a transparent cover such as quartz or glass, so that external light can penetrate the cover and shine on the wafer. Most of the ceramic carriers are 15 It is composed of a flat plate and a frame, so that a lead frame is sandwiched between them, so that the chip can be electrically connected to the outside through the lead frame. However, these construction methods have high cost and manufacturing process. Disadvantages of complexity. US Department of Economics Central Standards Bureau ’s Consumer Cooperatives printed US patents No. 6,034,429 and No. 6,117,705, revealing another 20 types of wafer structures to improve the shortcomings of the above conventional structures. These US patents are in a carrier A wafer is arranged on the substrate, and the wafer and the carrier plate are electrically connected to each other by a plurality of bonding wires by using a bonding technology. 'Secondly, the carrier plate is provided with an adhesive around the periphery of the wafer.' Covered by the transparent or opaque lid (lid) and the adhesive -3- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 492170 A7 B7 V. Description of the invention () Overlaying the wafer to complete the structure; although these methods can solve the shortcomings of expensive technology and complicated processes, the bonding pads on the wafer and the surface of the wafer are almost at the same level, resulting in bonding wires and bonding. When the pads are connected, the bonding wires must be connected to the bonding pads in a way that is perpendicular to the plane of the bonding pads. Therefore, there must be extra space above the surface of the wafer for the bonding wires. Will affect the position of the cover body is provided, so that the height of the package as a whole can not be effectively reduced, in other words, these improvements are still loaded mode configuration space. For this reason, the main object of the present invention is to provide an ultra-thin integrated circuit wafer structure, which can effectively reduce the manufacturing cost and the processing procedure, as well as the overall structure height. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs to achieve the above-mentioned purpose, the structure of a thin integrated circuit chip provided by the present invention includes: a carrier board having a top surface and a bottom surface, and the top surface is arranged There are a large number of bonding pads; at least one wafer is fixed on the top surface of the carrier plate, the top surface of the wafer has a plurality of bonding pads and a protrusion is provided on each of the bonding pads; One end of the wire is electrically connected to the pad of the carrier board, and the other end of each wire is electrically connected to the protrusion in a substantially horizontal manner; an adhesive is arranged on the periphery of the top surface of the chip A cover body having an inner surface which is fixedly connected to the adhesive; by this, the cover body can be placed close to the top of the carrier plate in a manner of close to the wafer to achieve super The effect of thin structure. Secondly, the present invention further discloses a shielding body for sealing the gap between the inner surface of the cover body and the top surface of the carrier plate, so as to protect the chip from foreign objects. In addition, the present invention further discloses a variety of types of connection devices, which are designed to comply with the Chinese National Standard (CNS) A4 specification (210X 297 mm) 492170 Μ for the paper size. 5. Description of the invention (15 Central Standard of the Ministry of Economic Affairs) Bureau Consumer Consumption Cooperative printed 20 the carrier plate solder pads to the outside of the carrier plate to enhance the structure. Furthermore, with the technical content disclosed by the present invention, it can be as light as a multi-chip module (MCM). The structure of the two-module module can achieve ultra-thin effect. In order to enable the review committee to understand the actual structure and characteristics of the present invention in detail, the following examples are illustrated and illustrated together with the illustration below. Among them, : The first diagram is a sectional view of the first preferred embodiment of the present invention; the second diagram is a sectional view of the second preferred embodiment of the present invention; the third diagram is a sectional view of the third preferred embodiment of the present invention; The eighth figure is a cross-sectional view of the fourth preferred embodiment of the present invention. The ninth figure is a cross-sectional view of the fifth preferred embodiment of the present invention. Please refer to the first figure for the ultra-thin type of the present invention. Integrated body A preferred embodiment provided by the circuit wafer structure (20), the structure (20) includes a carrier plate (22), a wafer (24), an adhesive (26), and a cover (28). And a connecting device (30), wherein: the carrier board (22) is a circuit board made of materials such as plastic, fiberglass, reinforced plastic, ceramic, etc., as the structural structure (20) and external electrical properties For the connected bridge, the load bearing plate (22) has a top surface (32) and a bottom surface (34), and the top surface (32) of the cypress is not provided with a circuit in a predetermined state (not shown in the figure). The solder pad (36). The bottom surface of the wafer (24) can be adhered and fixed to the top surface of the carrier plate (22) by using adhesive materials such as epoxy resin, silicone resin, double-sided tape, etc. After reading the notes, the paper size of the book is applicable to China National Standard (CNS) A4 (21〇 乂 297 mm) 492170 kl __B7 V. Description of the invention () (32), the chip (24) The top surface is also provided with a plurality of welding pads (38), and each of the welding pads (38) is respectively provided with a protruding body (40), and the protruding body (40) is It is a material, which can be made by chemical deposition, etching, welding or other methods, and protrudes a predetermined height from the top surface of the wafer (24). Then, using wire bonding techniques, most metal bonding wires (42 ) The chip (24) is electrically connected to the carrier plate (22); during the wire bonding operation, the bonding wire (42) is firstly connected with the solder pad (36) in a manner vertical to the solder plate (36) of the carrier plate (22). Connect firmly (first welding point). Secondly, the wire (42) is stretched upward to engage with the protrusion (40) on the wafer (24) pad (38) (second welding point). The protruding body (40) protrudes from the top surface of the 10 pieces (24) of the crystal, and has a certain volume and height. In this way, the welding wire (42) climbs up slightly after the first welding point is welded. The distance is equal to the thickness of the wafer (24), and then it can be extended in a substantially horizontal manner and connected with the protrusion (40), thereby the space for the welding wire (42) to be accommodated above the wafer (24) It can be flattened and greatly reduced. 15 The adhesive (26) can be made of Silicones, Epoxies, Acrylics, Polyamides, Low The melting point is made of glass and other materials. The adhesive (26) is arranged on the periphery of the top surface of the wafer (24) and covers and protects each of the bonding wires (42) and the protrusions (40) of the wafer (24). At the joint, the initial stage of the application of the adhesive is a gel-like 20 body, and then it can be dried and solidified into a hard protective body. The cover (28) can be a plate made of opaque plastic, metal or transparent glass, quartz, plastic and other materials. The cover (28) is directly pressed against the adhesive (26). The cover (28) can be fixed to the top surface of the carrier plate (22) in a manner that the cover (28) can be close to the top surface of the wafer (24). Called 492170 A7 _____ — B7 V. Description of the invention () ~ (32) above, to achieve the effect of ultra-thin structure; here it is necessary to specify that the cover (28) and the adhesive (26) are pressed. When connected, the position of the cover body ⑽ can even be lowered until the cover body (28) contacts the horizontal wire 之, thereby reducing the horizontal height of the cover body (28) as much as possible so that the entire body 5 is assembled. (20) can be thinner. At this time, each of the protrusions (40) can be regarded as supporting the cover (28), and the cover (28) can be maintained a predetermined distance above the top surface of the wafer (24). Of spacers. The connection device ⑽ is electrically connected to the contact (22) and welded (36) to the outside of the carrier board (22) (such as a circuit board), so that the chip (24) can form an external environment. A complete electrical path. In the first figure, the connection device (30) includes a majority of the soldering pads (36) connecting the top surface (32) of the carrier plate (22) to the bottom surface (34) of the carrier plate (22). Thruugh hole (60), and a plurality of solder balls that are planted on the bottom surface (34) of the carrier plate (22) and electrically connected to each of the through holes (60) ) (62) 〇15 Secondly, please refer to the fourth figure, which discloses another type of connection device (30 '). The connection device (30,) contains the same majority of through holes as in the first figure. (64), and a plurality of metal pins (66) that are planted on the bottom surface (34) of the carrier plate (22) and electrically connected to the through holes (64) ° Central Standard of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperative (please read the precautions on the back before filling out this page) 20 Furthermore, please refer to the fifth to seventh pictures, then reveal another type of connection device (30 "), the connection device (30 ,,) includes the same number of through holes (68) as in the first figure, and is exposed outside the carrier plate (22), and is electrically connected to each of the through holes (68) and is bent. Into a predetermined shape of the lead (lead) (70) (72) (74); it should be noted here that, in actual implementation, each gold -7- This paper size applies Chinese National Standard (CNS) A4 specifications (210 × 2ς > 7mm) 492170 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 ----- B7 V. Description of the invention () The lead can be directly connected to the top of the carrier plate (22) with one end of the pin. The pad (36) on the surface (32) is electrically connected, and the other end is located outside the carrying plate (22) and is bent into a predetermined shape. In this way, with such diverse connection device designs, the applicability of the structure to the external electrical connection can be improved. 5 Please refer to the second figure, which is a first preferred embodiment of the structure (80) of the ultra-thin integrated circuit wafer of the present invention. The structure (80) includes a carrier plate (82) and a wafer. (84), an adhesive (86), a cover (88), and a connecting device (90). The difference between this embodiment and the first embodiment is that the configuration (80) provided in this embodiment further includes There are: 10 A shielding body (92) connecting the inner surface of the cover body (88) and the top surface of the carrying plate (82), located at the periphery of each of the pads (82a) of the carrying plate (82), for sealing Abut the gap between the inner surface of the cover (88) and the top surface of the carrier plate (82) to protect the wafer (84) from foreign objects. In this embodiment, the shielding body (92) is a The frame sandwiched between the cover (88) and the carrying plate (82) can be made of 15 plastic or other materials. In actual manufacture, the frame can be connected with the carrying plate or the cover. The body is made of one piece. Please refer to the third figure, which is the third preferred embodiment of the present invention, for exposing another type of shielding body (92,). In this embodiment, the shielding body (923 is filled in the aforementioned gap) The material 20 of the shielding body (92,) may be the same as or different from the material of the adhesive body (86) disclosed in the previous embodiment, whereby the shielding body (92 ') may be The aforementioned adhesive (86) is coated once, and can be coated and sealed separately after the cover (88) is assembled. Please refer to FIG. 8 for the structure I of the ultra-thin integrated circuit chip of the present invention ( 100) The fourth preferred embodiment provided, the structure (100) includes a support -8- This paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) (Please read the precautions on the back first Fill out this page again),-口 492170 ΑΊ __Β7 V. Description of the invention () Plate (102), a chip (104), an adhesive (106), a cover (108) and a connection device (110), this The difference between this embodiment and the first embodiment is that, in addition to covering the bonding wire and the wafer protrusion, the adhesive (106) Beyond the joint, it covers the top surface of the entire wafer (104) in one fell swoop. These structures can be used for 5 general wafer structures, but not for EPROM, CCD, CMOS and other structures that require light transmission. Finally, please refer to the ninth figure, which is the fifth preferred embodiment provided by the structure (120) of the ultra-thin integrated circuit wafer of the present invention, which shows that the technical content disclosed by the present invention is applied to a multi-chip mold. As shown in Fig. 10, the structure of the assembly is shown in the figure. 'The assembly (I20) fixes a plurality of integrated circuit chips (122) on a carrier board (124), and the carrier board (124) can be a general circuit. The board is provided with a predetermined circuit and electronic components (not shown), so that the overall structure can become a module user with a specific function. In summary, the thin integrated circuit chip of the present invention The structure does have 15 advantages as described above. It is enough to solve the shortcomings of conventional technology. Therefore, the practicability and progress of the present invention are undoubted. To protect the rights and interests of the applicant, a patent application is submitted in accordance with the law. Scrutinize, It is fortunate for the applicant to grant the patent in this case as early as possible. The paper size printed by the Employees Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 492170 kl B7 ) Brief description of the figures The first figure is a sectional view of the first preferred embodiment of the present invention; the second figure is a sectional view of the second preferred embodiment of the present invention; the third figure is a sectional view of the third preferred embodiment of the present invention 5 The fourth to seventh diagrams show various types of connection devices; the eighth diagram is a cross-sectional view of a fourth preferred embodiment of the present invention; the ninth diagram is a cross-sectional view of a fifth preferred embodiment of the present invention. The drawing number explains the "first embodiment" ml — ^ ϋ Imi mu III— HI n In! I mu HI (Please read the precautions on the back before filling out this page) Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 10 Structure (20) Carrier board (22) Wafer (24) Adhesive (26) Cover (28) Connection device (30) Top surface (32) Bottom surface (34) Pad (36) Pad (38) Protruding body (40 ) Welding wire (42) Through hole (60) Solder ball (62) Connecting device (30 ') 15 Through hole (64) Metal pin (66) Connecting device (30 ") Through hole (68) Pin (70) (72) (74) "Second embodiment" Structure (80) Carrier plate (82) Wafer (84) Adhesive (86) Cover (88) Connecting device (90) 20 Shield (92) Welding pad ( 82a) "Third embodiment" Shield (92 ') "Fourth embodiment" Structure (100) Carrier plate (102) Chip (104) -10-
、1T 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 492170 經濟部中央標準局員工消費合作社印製 五、發明説明（ 黏著物（106) 「第五實施例 構裝（120) 蓋體（108) 晶片（122) 11· 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 連接裝置（110) 承載板（124) ; ：----^-------、玎------ (請先閱讀背面之注意事項再填寫本頁)1. The paper size of the 1T line is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 492170 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (Adhesive (106) "Fifth Embodiment ) Cover body (108) Chip (122) 11 · This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) Connection device (110) Carrier board (124);: ---- ^ --- ----, 玎 ------ (Please read the notes on the back before filling this page)