TWM532699U - Portable electronic device and image capturing module thereof - Google Patents

Description

Portable electronic device and image capturing module thereof

The present invention relates to a portable electronic device and an image capturing module thereof, and more particularly to a portable electronic device capable of maintaining optimal coplanarity between a plurality of image sensing wafers and an image capturing module thereof. group.

In the prior art, the special advantage of Complementary Metal-Oxide-Semiconductor (CMOS) image sensor is "low power consumption" and "small volume", so CMOS image sensor is convenient. Integrated into portable electronic products with special needs, such as CMOS image sensors, it is easy to integrate into mobile phones and notebook computers with small integration space. However, the multiple image sensors used in the existing dual-lens mobile phones have poor coplanarity with each other, so that the dual-lens mobile phone cannot capture clear images.

The technical problem to be solved by the present invention is to provide a portable electronic device and an image capturing module thereof for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing module, comprising: a circuit substrate, a structural reinforcing frame, a plurality of image sensing chips, an adhesive colloid, and a plurality of Lens module. The circuit substrate has an upper surface, a lower surface, and a plurality of first through openings connected between the upper surface and the lower surface. The structural reinforcement frame is disposed on the lower surface of the circuit substrate, wherein the structural reinforcement frame has a plurality of second through openings that communicate with the plurality of the first through openings. A plurality of the image sensing wafers are respectively accommodated in the plurality of the second through openings and electrically connected by wire bonding In the circuit substrate, a plurality of the image sensing wafers are disposed in a plane on a reference plane, each of the image sensing wafers has an image sensing area on the front side thereof, and the plurality of image sensing regions The plurality of image sensing regions of the wafer face a plurality of the first through openings of the circuit substrate, respectively. The adhesive colloid is disposed on the structural reinforcing frame, wherein the adhesive colloid is connected between each of the image sensing wafer and the structural reinforcing frame to seal the image sensing wafer and the A gap between the structural reinforcement frames. A plurality of lens modules are disposed on the upper surface of the circuit substrate, wherein each of the lens modules includes an opaque housing disposed on the upper surface of the circuit substrate and a a lens assembly on the opaque housing, and a plurality of the lens assemblies of the plurality of lens modules respectively correspond to a plurality of image sensing regions of the plurality of image sensing wafers.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device including: an electronic module and an image capturing module. The image capturing module is disposed on the electronic module, wherein the image capturing module comprises: a circuit substrate, a structural reinforcing frame, a plurality of image sensing chips, an adhesive colloid, and a plurality of lens modules group. The circuit substrate has an upper surface, a lower surface, and a plurality of first through openings connected between the upper surface and the lower surface. The structural reinforcement frame is disposed on the lower surface of the circuit substrate, wherein the structural reinforcement frame has a plurality of second through openings that communicate with the plurality of the first through openings. The plurality of image sensing wafers are respectively disposed in the plurality of the second through openings and electrically connected to the circuit substrate by wire bonding, wherein the plurality of the image sensing wafers are disposed in a plane in a reference manner a front surface of each of the image sensing wafers has an image sensing area, and the plurality of image sensing areas of the plurality of image sensing wafers respectively face the plurality of the first through portions of the circuit substrate Opening. The adhesive colloid is disposed on the structural reinforcing frame, wherein the adhesive colloid is connected between each of the image sensing wafer and the structural reinforcing frame to seal the image sensing wafer and the A gap between the structural reinforcement frames. a plurality of lens modules disposed on the upper surface of the circuit substrate Each of the lens modules includes an opaque housing disposed on the upper surface of the circuit substrate and a lens assembly disposed on the opaque housing, and the plurality of the lenses The plurality of lens assemblies of the module respectively correspond to a plurality of image sensing regions of the plurality of image sensing wafers.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an image capturing module, comprising: a circuit substrate, a plurality of image sensing chips, an adhesive body, and a plurality of lens modules. . The circuit substrate has a plurality of first through openings. The plurality of image sensing wafers are respectively received in the plurality of first through openings and electrically connected to the circuit substrate by wire bonding, wherein the plurality of image sensing wafers are coplanar with the circuit substrate Grounded on a reference plane. The adhesive colloid is connected between each of the image sensing wafers and the circuit substrate. A plurality of lens modules are disposed on the circuit substrate, wherein the plurality of lens modules respectively correspond to a plurality of the image sensing wafers.

The present invention provides a portable electronic device and an image capturing module thereof, which can be disposed on a reference plane by "a plurality of the image sensing wafers are disposed in a plane" and "The adhesive is connected between each of the image sensing wafers and the structural reinforcing frame, or the adhesive is connected between each of the image sensing wafers and the circuit substrate" And maintaining the optimal coplanarity between the plurality of image sensing wafers and improving the sharpness of the image captured by the image capturing module.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings. However, the drawings are provided for reference and description only, and are not intended to limit the present invention.

Z‧‧‧ portable electronic device

P‧‧‧Electronic Module

M‧‧‧Image Capture Module

1‧‧‧ circuit substrate

100‧‧‧first through opening

101‧‧‧ upper surface

102‧‧‧lower surface

2‧‧‧Structural reinforcement framework

200‧‧‧second through opening

21‧‧‧ protruding body

210‧‧‧ bottom

3‧‧‧Image sensing chip

300‧‧‧Image sensing area

301‧‧‧ positive

302‧‧‧Back

31‧‧‧Flexible wire

4‧‧‧Adhesive colloid

400‧‧‧ bottom

5‧‧‧Lens module

51‧‧‧ opaque housing

52‧‧‧ lens assembly

520‧‧‧ optical lens

6‧‧‧Auxiliary framework

7‧‧‧Connector

8‧‧‧Transparent substrate

80‧‧‧Support

9‧‧‧heated substrate

C‧‧‧bearing substrate

C101‧‧‧ upper surface

G‧‧‧ gap

S‧‧‧Datum plane

FIG. 1 is a cross-sectional view showing the image capturing module of the first embodiment of the present invention disposed on a carrier substrate.

2 is a cross-sectional view of the image capturing module of the first embodiment of the present invention.

FIG. 3 is a cross-sectional view of the image capturing module of the second embodiment of the present invention.

4 is a cross-sectional view of the image capturing module of the third embodiment of the present invention.

FIG. 5 is a cross-sectional view of the image capturing module of the fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view of the image capturing module of the fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view of the image capturing module of the sixth embodiment of the present invention.

FIG. 8 is a cross-sectional view of the image capturing module of the seventh embodiment of the present invention.

FIG. 9 is a schematic diagram of a portable electronic device according to an eighth embodiment of the present invention.

The following is a specific embodiment to illustrate the implementation of the "portable electronic device and its image capturing module" disclosed in the present disclosure. Those skilled in the art can understand the advantages of the present invention from the contents disclosed in the present specification. effect. The present invention may be implemented or applied in various other specific embodiments, and various details in the present specification may be made based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be delineated by actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2, the first embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1, a structure reinforcing frame 2, a plurality of image sensing chips 3, and an adhesive colloid. 4 and a plurality of lens modules 5. As shown in FIG. 1 , the image capturing module M of the present invention is carried by a carrier substrate C during the manufacturing process, wherein the upper surface C101 of the carrier substrate C is a carrier reference plane. As shown in FIG. 2, after the image capturing module M is completed, the carrier substrate C is removed, so that the image capturing module M is completely separated from the carrier substrate C.

First, as shown in FIG. 1 and FIG. 2, the circuit board 1 has an upper surface 101, a lower surface 102, and a plurality of first through openings 100 connected between the upper surface 101 and the lower surface 102. In addition, the structural reinforcing frame 2 is disposed under the circuit substrate 1 The surface 102 and the structural reinforcing frame 2 have a plurality of second through openings 200 that communicate with the plurality of first through openings 100. It is to be noted that the rigidity of the structural reinforcing frame 2 is much superior to that of the circuit substrate 1. For example, the structural reinforcing frame 2 may be a rigid frame or a harder frame which is better than the circuit substrate 1, and the structural reinforcing frame 2 may be a large monolithic frame or a combination of a plurality of small frames. Made.

Furthermore, as shown in FIG. 1 and FIG. 2 , the plurality of image sensing wafers 3 are respectively accommodated in the plurality of second through openings 200 and electrically connected to the circuit substrate 1 by wire bonding, and the plurality of image sensing wafers 3 is disposed in a plane plane on a reference plane S. Furthermore, the front surface 301 of each of the image sensing wafers 3 has an image sensing area 300, and the plurality of image sensing areas 300 of the plurality of image sensing wafers 3 face a plurality of first through portions of the circuit substrate 1, respectively. Opening 100. For example, the image sensing die 3 can be a complementary metal oxide semiconductor (CMOS) sensor or any sensor having an image capturing function.

Further, as shown in FIGS. 1 and 2, the adhesive body 4 is provided on the structural reinforcing frame 2 and between the structural reinforcing frame 2 and the carrier substrate C. Furthermore, the adhesive body 4 is connected to the plurality of image sensing wafers 3 in a surrounding manner for closing a gap G formed between the image sensing wafer 3 and the structural reinforcing frame 2. For example, the adhesive body 4 may be an adhesive made of epoxy or silicone, or may be a UV glue, a thermosetting glue or an AB glue.

Further, as shown in FIGS. 1 and 2, a plurality of lens modules 5 are provided on the upper surface 101 of the circuit board 1. Furthermore, each lens module 5 includes an opaque housing 51 disposed on the upper surface 101 of the circuit substrate 1 and a lens assembly 52 disposed on the opaque housing 51, and a plurality of lenses The plurality of lens assemblies 52 of the module 5 respectively correspond to the plurality of image sensing regions 300 of the plurality of image sensing wafers 3. For example, lens assembly 52 can be comprised of a plurality of optical lenses 520, and depending on the needs of use, lens assembly 52 can be fixedly or movably disposed on opaque housing 51.

Furthermore, as shown in Figure 1 and Figure 2, the image capture of the present creation The module M further includes a plurality of light transmissive substrates 8. The plurality of transparent substrates 8 are respectively disposed in the plurality of first through openings 100, and each of the transparent substrates 8 is disposed on the corresponding image sensing wafer 3 through the plurality of supporting bodies 80, and each of the transparent substrates 8 is disposed. It is disposed between the corresponding image sensing wafer 3 and the corresponding lens assembly 52. In addition, the image sensing wafer 3 can be electrically connected to the circuit substrate 1 through a plurality of conductive lines 31 (eg, gold wires).

Furthermore, as shown in FIG. 1 and FIG. 2, the bottom of the structural reinforcing frame 2 has a plurality of protrusions 21 (for example, at least three protrusions 21) that face the circuit board 1 and penetrate the adhesive body 4. In addition, the plurality of image sensing wafers 3, the adhesive body 4, and the plurality of protrusions 21 are coplanarly disposed on a reference plane S (that is, the upper surface C101 of the carrier substrate C) so that each image is sensed. The back side 302 of the wafer 3, the bottom surface 400 of the adhesive body 4, and the bottom surface 210 of each of the projections 21 are aligned and exposed to each other (as shown in FIG. 2). Thereby, since the plurality of image sensing wafers 3, the adhesive body 4 and the plurality of protruding bodies 21 are coplanarly disposed on a reference plane S, and the adhesive body 4 is connected to each of the image sensing wafers 3 and the structure Between the reinforcing frames 2, the present invention can provide rigidity superior to that of the circuit substrate 1 by the structural reinforcing frame 2 to maintain optimum symplanarity of the plurality of image sensing wafers 3 with each other (that is, multiple The optical axes of the image sensing wafers 3 are parallel to each other without deviation, and the sharpness of the image captured by the image capturing module M is improved.

In summary, as shown in FIG. 2, after the image capturing module M is completed, the carrier substrate C is removed, so that the image capturing module M is completely separated from the carrier substrate C. Although the image capturing module M loses the bearing of the carrier substrate C, the plurality of image sensing wafers 3 can still provide rigidity of the circuit substrate 1 through the structural reinforcing frame 2 to maintain the plurality of image sensing wafers 3 Coplanarly disposed on the same reference plane, thereby maintaining the optimal coplanarity between the plurality of image sensing wafers 3 and improving the sharpness of the image captured by the image capturing module M. It should be noted that since the back surface 302 of each of the image sensing wafers 3 is exposed to the outside, the heat dissipation performance of the plurality of image sensing wafers 3 can be effectively improved.

[Second embodiment]

As shown in FIG. 3 , the second embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , a structure reinforcing frame 2 , a plurality of image sensing chips 3 , an adhesive colloid 4 , and a plurality of Lens module 5. The comparison between FIG. 3 and FIG. 2 shows that the second embodiment of the present invention has the greatest difference from the first embodiment in that the image capturing module M of the second embodiment further includes a heat dissipation substrate 9.

Further, the plurality of image sensing wafers 3, the adhesive body 4, and the plurality of protrusions 21 are disposed on the heat dissipation substrate 9 in a coplanar manner (the upper surface of the heat dissipation substrate 9 is also the reference plane S), so that each The back surface 302 of an image sensing wafer 3, the bottom surface 400 of the adhesive body 4, and the bottom surface 210 of each of the projections 21 are aligned with each other and directly contact the heat dissipation substrate 9. Thereby, since the plurality of image sensing wafers 3, the adhesive body 4 and the plurality of protrusions 21 are coplanarly disposed on the heat dissipation substrate 9, and the adhesive body 4 is connected to each of the image sensing wafers 3 and the structure is reinforced. Between the frames 2, the present invention can provide the rigidity of the circuit substrate 1 by the structural reinforcing frame 2 to maintain the optimal coplanarity of the plurality of image sensing wafers 3, and enhance the image capturing module. The sharpness of the image captured by M. It should be noted that since the back surface 302 of each image sensing chip 3 directly contacts the heat dissipation substrate 9, the heat dissipation performance of the plurality of image sensing wafers 3 can be effectively improved.

[Third embodiment]

Referring to FIG. 4 , a third embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , a structure reinforcing frame 2 , a plurality of image sensing chips 3 , an adhesive colloid 4 , and a plurality of Lens module 5. The comparison between FIG. 4 and FIG. 2 shows that the third embodiment of the present invention has the greatest difference from the first embodiment in that the image capturing module M of the third embodiment further includes an auxiliary frame 6 and a plurality of connecting bodies 7 . .

Further, the auxiliary frame 6 is disposed on the upper surface 101 of the circuit substrate 1, and each of the connecting bodies 7 penetrates the circuit substrate 1 and is connected to the structural reinforcing frame 2 Between the auxiliary frame 6 and the auxiliary frame 6, so that the circuit substrate 1 can be firmly clamped between the structural reinforcing frame 2 and the auxiliary frame 6, thereby increasing the stability of the circuit substrate 1 and the overall structure of the image capturing module M. strength.

[Fourth embodiment]

As shown in FIG. 5, the fourth embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1, a structure reinforcing frame 2, a plurality of image sensing chips 3, an adhesive body 4, and a plurality of Lens module 5. The difference between the fourth embodiment and the third embodiment is that the image capturing module M of the fourth embodiment further includes a heat dissipation substrate 9.

Further, the plurality of image sensing wafers 3, the adhesive body 4, and the plurality of protrusions 21 are disposed on the heat dissipation substrate 9 in a coplanar manner so that the back surface 302 of each of the image sensing wafers 3 and the adhesive body 4 are adhered. The bottom surface 400 and the bottom surface 210 of each of the protrusions 21 are aligned with each other and directly contact the heat dissipation substrate 9. Thereby, since the plurality of image sensing wafers 3, the adhesive body 4 and the plurality of protrusions 21 are coplanarly disposed on the heat dissipation substrate 9, and the adhesive body 4 is connected to each of the image sensing wafers 3 and the structure is reinforced. Between the frames 2, the present invention can provide the rigidity of the circuit substrate 1 by the structural reinforcing frame 2 to maintain the optimal coplanarity of the plurality of image sensing wafers 3, and enhance the image capturing module. The sharpness of the image captured by M. It should be noted that since the back surface 302 of each image sensing chip 3 directly contacts the heat dissipation substrate 9, the heat dissipation performance of the plurality of image sensing wafers 3 can be effectively improved.

[Fifth Embodiment]

Referring to FIG. 6 , a fifth embodiment of the present invention provides an image capturing module M, which includes a circuit substrate 1 , a plurality of image sensing chips 3 , an adhesive body 4 , and a plurality of lens modules 5 . It can be seen from the comparison between FIG. 6 and FIG. 2 that the greatest difference between the fifth embodiment of the present creation and the first embodiment is that in the fifth embodiment, the adhesive colloid 4 Between each of the image sensing wafers 3 and the circuit substrate 1 and between the image sensing wafers 3 and the circuit substrate 1 to be closed between the image sensing wafers 3 and the circuit substrate 1 Gap G.

Further, the circuit substrate 1, the plurality of image sensing wafers 3, and the adhesive body 4 are coplanarly disposed on a reference plane S such that the back surface 302 of each of the image sensing wafers 3 and the bottom surface of the adhesive body 4 400 and the lower surface 102 of the circuit substrate 1 are aligned and exposed to each other. Therefore, since the circuit substrate 1, the plurality of image sensing wafers 3, and the adhesive body 4 are coplanarly disposed on a reference plane S, and the adhesive body 4 is connected to each of the image sensing wafers 3 and the circuit substrate 1. Therefore, the present invention can maintain the optimum coplanarity of the plurality of image sensing wafers 3 and enhance the image by the rigidity provided by the circuit substrate 1 (for example, a glass substrate or a germanium substrate having a line layout). Capture the sharpness of the image captured by module M. It should be noted that since the back surface 302 of each of the image sensing wafers 3 is exposed to the outside, the heat dissipation performance of the plurality of image sensing wafers 3 can be effectively improved.

[Sixth embodiment]

Referring to FIG. 7 , a sixth embodiment of the present invention provides an image capturing module M, which includes a circuit substrate 1 , a plurality of image sensing chips 3 , an adhesive body 4 , and a plurality of lens modules 5 . The comparison between FIG. 7 and FIG. 6 shows that the sixth embodiment and the fifth embodiment have the greatest difference in that the image capturing module M of the sixth embodiment further includes a heat dissipation substrate 9.

Furthermore, the circuit substrate 1, the plurality of image sensing wafers 3, and the adhesive body 4 are disposed on the heat dissipation substrate 9 in a coplanar manner such that the back surface 302 of each of the image sensing wafers 3 and the bottom surface 400 of the adhesive body 4 And the lower surface 102 of the circuit substrate 1 is aligned with each other and directly contacts the heat dissipation substrate 9. Thereby, since the circuit substrate 1, the plurality of image sensing wafers 3, and the adhesive body 4 are coplanarly disposed on the heat dissipation substrate 9, the adhesive body 4 is connected to each of the image sensing wafers 3 and the circuit. Between the substrates 1, the present invention can maintain the rigidity of the circuit substrate 1 (for example, a glass substrate or a germanium substrate having a line layout) to maintain the optimum coplanarity between the plurality of image sensing wafers 3, And improve the sharpness of the image captured by the image capturing module M. It should be noted that since the back surface 302 of each image sensing chip 3 directly contacts the heat dissipation substrate 9, the heat dissipation performance of the plurality of image sensing wafers 3 can be effectively improved.

[Seventh embodiment]

Referring to FIG. 8 , the seventh embodiment of the present invention provides an image capturing module M, which includes a circuit substrate 1 , a plurality of image sensing chips 3 , and a plurality of lens modules 5 . It should be noted that all of the plurality of image sensing wafers 3 are disposed coplanarly on the circuit substrate 1 (the upper surface 101 of the circuit substrate 1 is the reference plane S), so the present creation can be passed through the circuit substrate 1 (for example, having a line layout) The rigidity provided by the glass substrate or the germanium substrate itself maintains the optimum coplanarity between the plurality of image sensing wafers 3 and enhances the sharpness of the image captured by the image capturing module M.

[Eighth Embodiment]

As shown in FIG. 9 , the present invention provides a portable electronic device Z including an electronic module P and an image capturing module M. The image capturing module M is disposed on the electronic module P, and the image capturing module M includes at least one circuit substrate 1, a structural reinforcing frame 2, a plurality of image sensing chips 3, an adhesive colloid 4, and a plurality of lenses. Module 5. For example, the electronic module P can be a smart phone or a notebook computer, and the image capturing module M of the first embodiment can be installed in the electronic module P, so the electronic module P can pass the image. Capture module M for image capture.

[Advantageous Effects of Embodiments]

In summary, the beneficial effects of the present creation are provided by the creative technical solution. Portable electronic device Z and image capturing module M thereof, which can be "coplanarly disposed on a reference plane S" by a plurality of image sensing wafers 3 and "adhesive 4 connected to each image sensing" Between the wafer 3 and the structural reinforcing frame 2, or the adhesive body 4 is connected between each of the image sensing wafers 3 and the circuit substrate 1, or a plurality of image sensing wafers 3 are all disposed on the circuit substrate 1 in a coplanar manner. The upper surface 101 is designed to maintain the optimal coplanarity of the plurality of image sensing wafers 3 with each other and to enhance the sharpness of the image captured by the image capturing module M.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application for this creation. Within the scope of the patent.

M‧‧‧Image Capture Module

1‧‧‧ circuit substrate

100‧‧‧first through opening

101‧‧‧ upper surface

102‧‧‧lower surface

2‧‧‧Structural reinforcement framework

200‧‧‧second through opening

21‧‧‧ protruding body

210‧‧‧ bottom

3‧‧‧Image sensing chip

300‧‧‧Image sensing area

301‧‧‧ positive

302‧‧‧Back

31‧‧‧Flexible wire

4‧‧‧Adhesive colloid

400‧‧‧ bottom

5‧‧‧Lens module

51‧‧‧ opaque housing

52‧‧‧ lens assembly

520‧‧‧ optical lens

8‧‧‧Transparent substrate

80‧‧‧Support

G‧‧‧ gap

S‧‧‧Datum plane

Claims (10)

An image capturing module includes: a circuit substrate having an upper surface, a lower surface, and a plurality of first through openings connected between the upper surface and the lower surface; a frame, the structural reinforcing frame is disposed on the lower surface of the circuit substrate, wherein the structural reinforcing frame has a plurality of second through openings communicating with the plurality of first through openings; and a plurality of image sensing a plurality of the image sensing wafers are respectively disposed in the plurality of the second through openings and electrically connected to the circuit substrate by wire bonding, wherein the plurality of the image sensing wafers are disposed coplanarly An image sensing area is disposed on a front surface of each of the image sensing wafers, and a plurality of the image sensing areas of the plurality of image sensing wafers respectively face the plurality of the circuit boards a through-opening; an adhesive colloid disposed on the structural reinforcing frame, wherein the adhesive colloid is coupled to each of the image sensing wafer and the structural reinforcing frame a gap formed between the image sensing wafer and the structural reinforcing frame; and a plurality of lens modules disposed on the upper surface of the circuit substrate, Each of the lens modules includes an opaque housing disposed on the upper surface of the circuit substrate and a lens assembly disposed on the opaque housing, and the plurality of lens modules A plurality of the lens assemblies respectively correspond to a plurality of image sensing regions of the plurality of image sensing wafers. The image capturing module of claim 1, wherein the structural reinforcing frame has a plurality of protrusions facing the circuit substrate and penetrating the adhesive body, and the plurality of image sensing wafers, The adhesive colloid and the plurality of the protrusions are disposed coplanarly on the reference plane such that a back surface of each of the image sensing wafers, a bottom surface of the adhesive colloid, and each of the protrusions Bottom of the body They are in line with each other and exposed. The image capturing module of claim 1, further comprising: a heat dissipating substrate, wherein the structural reinforcing frame has a plurality of protrusions facing away from the circuit substrate and penetrating the adhesive body, and a plurality of The image sensing wafer, the adhesive body, and the plurality of the protruding bodies are disposed on the heat dissipating substrate in a coplanar manner such that a back surface of each of the image sensing wafers and a bottom surface of the adhesive colloid And a bottom surface of each of the protrusions is aligned with each other and contacts the heat dissipation substrate. The image capturing module of claim 1, further comprising: an auxiliary frame, a plurality of connecting bodies, and a plurality of transparent substrates, wherein the auxiliary frame is disposed on the upper surface of the circuit substrate, And each of the connecting bodies runs through the circuit substrate and is connected between the structural reinforcing frame and the auxiliary frame such that the circuit substrate is firmly clamped between the structural reinforcing frame and the auxiliary frame A plurality of the transparent substrates are respectively disposed in the plurality of first through openings, and each of the transparent substrates is disposed on the corresponding image sensing wafer through a plurality of supporting bodies. And each of the transparent substrate is disposed between the corresponding image sensing wafer and the corresponding lens component; wherein the image sensing wafer is electrically connected to the device through a plurality of conductive wires The circuit board is described. A portable electronic device includes: an electronic module; and an image capturing module, wherein the image capturing module is disposed on the electronic module, wherein the image capturing module comprises: a circuit substrate having an upper surface, a lower surface, and a plurality of first through openings connected between the upper surface and the lower surface; a structural reinforcing frame, the structural reinforcing frame being disposed The lower surface of the circuit substrate, wherein the structural reinforcing frame has a plurality of second through openings communicating with the plurality of first through openings; a plurality of the image sensing wafers, wherein the plurality of image sensing wafers are respectively received in the plurality of the second through openings and electrically connected to the circuit substrate by wire bonding, wherein the plurality of the image sensing wafers Coplanarly disposed on a reference plane, each of the image sensing wafers has an image sensing area on a front side thereof, and a plurality of image sensing areas of the plurality of image sensing wafers respectively face the circuit substrate a plurality of the first through openings; an adhesive colloid disposed on the structural reinforcing frame, wherein the adhesive colloid is connected between each of the image sensing wafers and the structural reinforcing frame; Separating a gap formed between the image sensing wafer and the structural reinforcing frame; and a plurality of lens modules, wherein the plurality of lens modules are disposed on the upper surface of the circuit substrate, wherein each The lens module includes an opaque housing disposed on the upper surface of the circuit substrate, and a lens assembly disposed on the opaque housing, and a plurality of the plurality of lens modules A plurality of lens components respectively corresponding to the plurality of the image sensing region of the image sensor chip. The portable electronic device of claim 5, wherein the structural reinforcing frame has a plurality of protrusions facing away from the circuit substrate and penetrating the adhesive body, and the plurality of image sensing wafers, The adhesive colloid and the plurality of the protrusions are disposed coplanarly on the reference plane such that a back surface of each of the image sensing wafers, a bottom surface of the adhesive colloid, and each of the protrusions The bottom surfaces of the bodies are aligned and exposed to each other. The portable electronic device of claim 5, wherein the image capturing module further comprises a heat dissipating substrate, the structural reinforcing frame having a plurality of backing the circuit substrate and penetrating the adhesive colloid a plurality of the image sensing wafers, the adhesive body, and the plurality of the protrusions are disposed on the heat dissipation substrate in a plane so that the back of each of the image sensing wafers The bottom surface of the adhesive colloid and the bottom surface of each of the protruding bodies are aligned with each other and Contacting the heat dissipation substrate. The portable electronic device of claim 5, wherein the image capturing module further comprises an auxiliary frame and a plurality of connecting bodies, the auxiliary frame being disposed on the upper surface of the circuit substrate And each of the connecting bodies runs through the circuit substrate and is connected between the structural reinforcing frame and the auxiliary frame such that the circuit substrate is firmly clamped between the structural reinforcing frame and the auxiliary The image capturing module further includes a plurality of transparent substrates, and the plurality of transparent substrates are respectively disposed in the plurality of first through openings, and each of the transparent substrates passes through a plurality of support bodies are disposed on the corresponding image sensing wafers, and each of the light transmissive substrates is disposed between the corresponding image sensing wafer and the corresponding lens assembly; The image sensing wafer is electrically connected to the circuit substrate through a plurality of conductive lines. An image capturing module includes: a circuit substrate having a plurality of first through openings; a plurality of image sensing wafers, wherein the plurality of image sensing wafers are respectively accommodated in the plurality of a plurality of the image sensing wafers are disposed coaxially with the circuit substrate on a reference plane; and an adhesive colloid is connected to the circuit substrate. Between each of the image sensing wafers and the circuit substrate; and a plurality of lens modules, a plurality of lens modules are disposed on the circuit substrate, wherein the plurality of the lens modules respectively correspond to the plurality of The image sensing wafer. The image capturing module of claim 9, wherein the image capturing module further comprises a plurality of transparent substrates, each of the transparent substrates being disposed in a corresponding body through a plurality of supporting bodies Each of the transparent substrate is disposed between the corresponding image sensing wafer and the corresponding lens module, and the image sensing wafer passes through a plurality of conductive lines. Electrically connected to the circuit substrate.