CN104159008A - Camera module - Google Patents
Camera module Download PDFInfo
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- CN104159008A CN104159008A CN201410326435.5A CN201410326435A CN104159008A CN 104159008 A CN104159008 A CN 104159008A CN 201410326435 A CN201410326435 A CN 201410326435A CN 104159008 A CN104159008 A CN 104159008A
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- image sensor
- circuit board
- sensor chip
- camera module
- flexible circuit
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Abstract
A camera module relates to the technical field of camera modules, and adopts the structure that a flexible printed circuit is arranged at the upper end of a reinforcing piece; a CMOS image sensor chip is arranged inside one side of the flexible printed circuit, and is connected with the flexible printed circuit through a plurality of metal wires; a resistive element is arranged on the right side of the CMOS image sensor chip and on the upper surface of the flexible printed circuit; a lens holder is arranged on the upper surface of the flexible printed circuit; a lens barrel is screwed with the inner part of the upper side of the lens holder; a plurality of lenses are arranged inside the lens barrel; a piece of light-filtering glass is arranged below the lens and on the inner side of the lens holder. According to the invention, the image sensor chip is fixedly pasted onto the reinforcing piece, and a circuit board layer between the image sensor and the reinforcing piece is eliminated, so that the height of the whole module is reduced. The structure of the camera module is conducive to the production of a light-weight and thin smart phone, so that competitiveness of products is greatly enhanced.
Description
Technical field:
The present invention relates to technical field of electronic products, be specifically related to a kind of camera module.
Background technology:
Camera module is widely used in consumer digital product, as mobile phone, panel computer, notebook computer, toy, the field such as vehicle-mounted and medical, is accompanied by the development of information age, the progress of science and technology, has come into huge numbers of families.Particularly, in the arrival in mobile Internet epoch, smart mobile phone shipment amount still increases substantially, and the particularly arrival in 4G epoch will further drive the soaring rapidly of camera module demand.
Meanwhile, the competition of camera module industry is also growing more intense, and the effect of camera module, cost remain the two large key elements that module factory wins in market.Mainly there are in the market three kinds of encapsulation technologies, be respectively CSP (Chip Scale Pockage, die size encapsulation), COB (Chip On Board, chip on board encapsulates) and FC (Flip Chip, Flip-Chip Using), wherein CSP is a kind of encapsulation technology based on surface mounting technology, mainly in low pixel field, occupy most shares, owing to there being the naked glass of one deck to cover image sensor surface, reduce dust, yield is higher, but cover glass exists loss of light source to cause image quality low, and its thickness is larger, with respect to day by day requiring compact mobile phone volume, be extremely disadvantageous, FC technology, owing to obtaining splendid electric property, mainly benefits from American apple company and widelys popularize on iphone, but high to material and facility and encapsulation procedure requirement, investment threshold is high, and technical difficulty is large, therefore on cost without any advantage, thereby limit its development, COB technology, its small product size is less, and image quality is better, be applicable to high pixel product, also meet mobile phone volume trend, but the structure of module is too ripe, its thickness is stable, be difficult to be applicable to mobile device to lightening demand, so market competition will be fiercer again.
Summary of the invention:
The object of this invention is to provide a kind of camera module, it is by fixedly sticking on reinforced sheet by image sensor chip, reduce one deck board layer between it, therefore reduced the height of whole module, being configured with of product of the present invention is beneficial to lightening smart mobile phone, greatly the competitiveness of improving product.
In order to solve the existing problem of background technology, the present invention is by the following technical solutions: it comprises reinforced sheet, cmos image sensor chip, flexible circuit board, microscope base, plain conductor, resistive element, filter glass, lens barrel and eyeglass, the upper end of reinforced sheet is provided with flexible circuit board, one side inside of flexible circuit board is provided with cmos image sensor chip, and cmos image sensor chip is connected with flexible circuit board by several plain conductors, the right side of cmos image sensor chip, the upper surface of flexible circuit board is provided with resistive element, the upper surface of flexible circuit board is provided with microscope base, the upper interior of microscope base is connected with lens barrel, the inside of lens barrel is provided with several eyeglasses, the lower end of eyeglass, the inner side of microscope base is provided with filter glass.
Described reinforced sheet material can be any in the organic material of stainless steel, aluminium alloy, metallic copper or hard.
Its thickness of described reinforced sheet and intensity can be decided by the product performance of described camera module.
The present invention has following beneficial effect: it is by fixedly sticking on reinforced sheet by image sensor chip, reduce one deck board layer between it, therefore reduced the height of whole module, being configured with of product of the present invention is beneficial to lightening smart mobile phone, greatly the competitiveness of improving product.
Accompanying drawing explanation:
Fig. 1 is STRUCTURE DECOMPOSITION schematic diagram of the present invention;
Fig. 2 is Facad structure cutaway view of the present invention.
Embodiment:
Referring to Fig. 1-Fig. 2, this embodiment is by the following technical solutions: it comprises reinforced sheet 1, cmos image sensor chip 2, flexible circuit board 3, microscope base 4, plain conductor 5, resistive element 6, filter glass 7, lens barrel 8 and eyeglass 9, the upper end of reinforced sheet 1 is provided with flexible circuit board 3, one side inside of flexible circuit board 3 is provided with cmos image sensor chip 2, and cmos image sensor chip 2 is connected with flexible circuit board 3 by several plain conductors 5, the right side of cmos image sensor chip 2, the upper surface of flexible circuit board 3 is provided with resistive element 6, the upper surface of flexible circuit board 3 is provided with microscope base 4, the upper interior of microscope base 4 is connected with lens barrel 8, the inside of lens barrel 8 is provided with several eyeglasses 9, the lower end of eyeglass 9, the inner side of microscope base 4 is provided with filter glass 7.
Described reinforced sheet 1 material can be any in the organic material of stainless steel, aluminium alloy, metallic copper or hard.
Described reinforced sheet 1 its thickness and intensity can be decided by the product performance of described camera module.
This embodiment has following beneficial effect: it is by fixedly sticking on reinforced sheet by image sensor chip, reduce one deck board layer between it, therefore reduced the height of whole module, being configured with of product of the present invention is beneficial to lightening smart mobile phone, greatly the competitiveness of improving product.
Claims (3)
1. a camera module, it is characterized in that it comprises reinforced sheet (1), cmos image sensor chip (2), flexible circuit board (3), microscope base (4), plain conductor (5), resistive element (6), filter glass (7), lens barrel (8) and eyeglass (9), the upper end of reinforced sheet (1) is provided with flexible circuit board (3), one side inside of flexible circuit board (3) is provided with cmos image sensor chip (2), and cmos image sensor chip (2) is connected with flexible circuit board (3) by several plain conductors (5), the right side of cmos image sensor chip (2), the upper surface of flexible circuit board (3) is provided with resistive element (6), the upper surface of flexible circuit board (3) is provided with microscope base (4), the upper interior of microscope base (4) is connected with lens barrel (8), the inside of lens barrel (8) is provided with several eyeglasses (9), the lower end of eyeglass (9), the inner side of microscope base (4) is provided with filter glass (7).
2. a kind of camera module according to claim 1, is characterized in that described reinforced sheet (1) material is any in stainless steel, aluminium alloy, the organic material of metallic copper hard.
3. a kind of camera module according to claim 1, is characterized in that described its thickness of reinforced sheet (1) and intensity play decision by the product performance of described camera module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410326435.5A CN104159008A (en) | 2014-07-07 | 2014-07-07 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410326435.5A CN104159008A (en) | 2014-07-07 | 2014-07-07 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104159008A true CN104159008A (en) | 2014-11-19 |
Family
ID=51884408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410326435.5A Pending CN104159008A (en) | 2014-07-07 | 2014-07-07 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104159008A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773511A (en) * | 2016-12-27 | 2017-05-31 | 未来现实（武汉）科技有限公司 | A kind of many mesh panorama cameras of combined type |
| CN107547778A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN107544108A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Filter element and camera module and its manufacture method and application |
| CN108749345A (en) * | 2018-07-16 | 2018-11-06 | 佛山市特耐家纺实业有限公司 | A kind of digital decorating machine having finished product shooting recording device |
Citations (6)
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| CN101035199A (en) * | 2007-03-30 | 2007-09-12 | 昆山钜亮光电科技有限公司 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
| CN101127838A (en) * | 2006-08-14 | 2008-02-20 | 印像科技股份有限公司 | Image sensing module |
| CN201114373Y (en) * | 2007-06-28 | 2008-09-10 | 凌代年 | Sticker type camera module |
| CN201478311U (en) * | 2009-04-29 | 2010-05-19 | 积高电子(无锡)有限公司 | Ultrathin CMOS image sensor |
| CN203057232U (en) * | 2012-12-30 | 2013-07-10 | 金龙机电（东莞）有限公司 | A novel cell phone camera structure |
| CN203192798U (en) * | 2013-02-27 | 2013-09-11 | 深圳市微高半导体科技有限公司 | Lateral contact CMOS image acquisition module group |
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2014
- 2014-07-07 CN CN201410326435.5A patent/CN104159008A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101127838A (en) * | 2006-08-14 | 2008-02-20 | 印像科技股份有限公司 | Image sensing module |
| CN101035199A (en) * | 2007-03-30 | 2007-09-12 | 昆山钜亮光电科技有限公司 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
| CN201114373Y (en) * | 2007-06-28 | 2008-09-10 | 凌代年 | Sticker type camera module |
| CN201478311U (en) * | 2009-04-29 | 2010-05-19 | 积高电子(无锡)有限公司 | Ultrathin CMOS image sensor |
| CN203057232U (en) * | 2012-12-30 | 2013-07-10 | 金龙机电（东莞）有限公司 | A novel cell phone camera structure |
| CN203192798U (en) * | 2013-02-27 | 2013-09-11 | 深圳市微高半导体科技有限公司 | Lateral contact CMOS image acquisition module group |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107547778A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN107544108A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Filter element and camera module and its manufacture method and application |
| CN107547778B (en) * | 2016-06-23 | 2020-12-18 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module |
| CN106773511A (en) * | 2016-12-27 | 2017-05-31 | 未来现实（武汉）科技有限公司 | A kind of many mesh panorama cameras of combined type |
| CN108749345A (en) * | 2018-07-16 | 2018-11-06 | 佛山市特耐家纺实业有限公司 | A kind of digital decorating machine having finished product shooting recording device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141119 |
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| RJ01 | Rejection of invention patent application after publication |