CN203192798U - Lateral contact CMOS image acquisition module group - Google Patents
Lateral contact CMOS image acquisition module group Download PDFInfo
- Publication number
- CN203192798U CN203192798U CN 201320093327 CN201320093327U CN203192798U CN 203192798 U CN203192798 U CN 203192798U CN 201320093327 CN201320093327 CN 201320093327 CN 201320093327 U CN201320093327 U CN 201320093327U CN 203192798 U CN203192798 U CN 203192798U
- Authority
- CN
- China
- Prior art keywords
- positioning
- cmos image
- lens
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The utility model discloses a lateral contact CMOS image acquisition module group. The lateral contact CMOS image acquisition module group comprises a lens seat, a lens arranged in the lens seat and connected with the lens seat through screw threads, a flexible circuit board arranged below the lens seat, a photosensitive chip arranged below the lens and packaged on the flexible circuit board, and reinforcing members coated around the flexible circuit board; the flexible circuit board is provided with electronic components for positioning, and metal sheets are arranged around the reinforcing members. Through the electronic components for positioning being arranged on the flexible circuit board, a conventional positioning method in which positioning columns and positioning holes are used for positioning is abandoned, so that the positioning is high in precision and accuracy. With the metal sheets being arranged around the reinforcing members for connection, the anti-dropping performance and the anti-shock performance are effectively improved, and products can be ultra-small, ultra-thin and low in cost.
Description
Technical field
The utility model relates to a kind of side contacts CMOS image collection module.
Background technology
CMOS is the abbreviation of Complementary Metal Oxide Semiconductor (complementary metal oxide semiconductors (CMOS)), refers to make a kind of technology that large scale integrated chip uses or with the produced chip of this technology.CMOS image collection module is with light, shadow, as being converted to electronic digital signal, and each pixel of CMOS camera lens has comprised amplifier and A/D change-over circuit, and a plurality of positioning electronic components are compressed in the surface area of photosensitive region of single pixel.CMOS image collection module operation principle is to utilize photodiode to carry out the conversion of light and electricity.The light that object is assembled by camera lens (Lens) by the CMOS sensitive integrated circuits, is converted into the signal of telecommunication with light signal, through becoming data image signal output after inner ISP (image-signal processor) conversion.Deliver to processing processing in the digital signal processor again, be converted into YUV, the rgb format picture signal of standard.
CMOS image collection module can be divided into two classes: focus module and the module of focusing automatically.Focusing module is CMOS image collection module after lens group and chipset install that fixed-site, the focussing distance of camera lens is constant.This class module needs the photobehavior according to Sensor in the middle of producing, calculate the focussing distance of camera lens, and fixedly Sensor is on the relative distance of camera lens.Along with development of science and technology, the sensitization wafer of Sensor is done littler and littler, and this also makes the Small-sized C MOS image collection module that CMOS image collection module manufacturer need adapt with it according to the design of the characteristics of Sensor.Along with the arrival in 3G epoch, the trend of two development also appears in the camera module; Aspect is exactly the high end pixel with automatic focusing or optical zoom, and the direction of another development is exactly Small-sized C MOS image collection module.Because the restriction in 3G mobile output bandwidth and mobile phone space, tradition can only be used low pixel Small-sized C MOS image collection module with the localization method of reference column, location hole at preposition camera, to realize the function of video calling.In addition, the CMOS image collection module that adopts the connector form is that the pin with connector joins, because of its contact area less, the problem of the anti-dropping and shock resistance difference of ubiquity, fall or concussion etc. if in use run into, be easy to cause connect looseningly, cause the camera cisco unity malfunction.In addition, because connector need take certain space, can't effectively the module total height be reduced, can't satisfy the requirement of some application scenarios, little space.
Summary of the invention
It is a kind of extra small ultra-thin that main purpose of the present utility model is to provide, the side contacts CMOS image collection module that cost is low.
For addressing the above problem, the utility model adopts following technical scheme: a kind of side contacts CMOS image collection module, comprise lens mount, and the camera lens that is arranged in the lens mount, is threaded with lens mount, and be arranged on the flexible PCB of lens mount below, and be arranged on camera lens below, be encapsulated in the sensitive chip on the flexible PCB, and be coated on the stiffener around the flexible PCB; Described flexible PCB is provided with the electronic component for the location, is provided with sheet metal around the described stiffener.
Further, described electronic component is electric capacity or resistance.
The beneficial effect of the utility model side contacts CMOS image collection module is: because described flexible PCB is provided with the electronic component for the location, abandoned the localization method of tradition with reference column, location hole, and the positioning accuracy height, accurately.Be provided with sheet metal around the described stiffener and connect, effectively raise anti-drop and antidetonation is swung performance, product can be accomplished extra small ultra-thin, and cost is low.
Description of drawings
Fig. 1 is the schematic diagram of the utility model side contacts CMOS image collection module.
Embodiment
See also shown in Figure 1, a kind of side contacts CMOS image collection module of the present utility model, comprise lens mount 1, and the camera lens 2 that is arranged in the lens mount 1, is threaded with lens mount 1, and be arranged on the flexible PCB 3 of lens mount 1 below, and be arranged on camera lens 2 belows, be encapsulated in the sensitive chip 4 on the flexible PCB 3, and be coated on the stiffener 5 around the flexible PCB 3; Described flexible PCB 3 is provided with the electronic component 6 for the location, and electronic component 6 is not only the needs of circuit design, also can play the effect of location.Electronic component 6 location of matching with the corner of sensitive chip 4, the positioning accuracy height, accurately.Described electronic component 6 is electric capacity or resistance.Be provided with sheet metal 7 around the described stiffener 5, the contact area of sheet metal 7 is big, and full contact has improved anti-drop and antidetonation is swung performance, and product can be accomplished extra small ultra-thin, and cost is low.
The beneficial effect of the utility model side contacts CMOS image collection module is: because described flexible PCB is provided with the electronic component for the location, abandoned the localization method of tradition with reference column, location hole, and the positioning accuracy height, accurately.Be provided with sheet metal around the described stiffener and connect, effectively raise anti-drop and antidetonation is swung performance, product can be accomplished extra small ultra-thin, and cost is low.
The above only is embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any variation or replacement of expecting without creative work all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claims were limited.
Claims (2)
1. side contacts CMOS image collection module, it is characterized in that: comprise lens mount, and the camera lens that is arranged in the lens mount, is threaded with lens mount, and be arranged on the flexible PCB of lens mount below, and be arranged on camera lens below, be encapsulated in the sensitive chip on the flexible PCB, and be coated on the stiffener around the flexible PCB; Described flexible PCB is provided with the electronic component for the location, is provided with sheet metal around the described stiffener.
2. side contacts CMOS image collection module according to claim 1, it is characterized in that: described electronic component is electric capacity or resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320093327 CN203192798U (en) | 2013-02-27 | 2013-02-27 | Lateral contact CMOS image acquisition module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320093327 CN203192798U (en) | 2013-02-27 | 2013-02-27 | Lateral contact CMOS image acquisition module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203192798U true CN203192798U (en) | 2013-09-11 |
Family
ID=49109632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320093327 Expired - Fee Related CN203192798U (en) | 2013-02-27 | 2013-02-27 | Lateral contact CMOS image acquisition module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203192798U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159008A (en) * | 2014-07-07 | 2014-11-19 | 江西盛泰光学有限公司 | Camera module |
-
2013
- 2013-02-27 CN CN 201320093327 patent/CN203192798U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159008A (en) * | 2014-07-07 | 2014-11-19 | 江西盛泰光学有限公司 | Camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210377427A1 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
| US10021283B2 (en) | Light shielding members for solid state image capturing apparatus, camera module and electronic device | |
| EP2496988B1 (en) | Camera module with fold-over flexible circuit and cavity substrate | |
| JP2007318761A (en) | Camera module and camera module assembly | |
| CN103607535A (en) | Camera module for mobile terminal and mobile terminal | |
| KR101442390B1 (en) | Camera module | |
| US10425562B2 (en) | Three-dimensional image sensing module with a low z-height | |
| CN105093473A (en) | Camera module | |
| US20080252776A1 (en) | Camera module | |
| KR20080069909A (en) | Imaging lens, imaging device and portable terminal | |
| WO2016180378A3 (en) | Image capturing module and assembly method therefor | |
| CN203192798U (en) | Lateral contact CMOS image acquisition module group | |
| CN201403146Y (en) | Miniature CMOS image sampling module group | |
| CN111641762B (en) | Camera module and electronic equipment | |
| CN205945947U (en) | Camera module and electronic device | |
| CN104363370B (en) | Cam device and mobile terminal with the cam device | |
| CN204498224U (en) | The imaging modules that integrated optical filter switches | |
| CN201114373Y (en) | Sticker type camera module | |
| CN111796388A (en) | Waterproof and dustproof method for camera module | |
| CN104853078B (en) | Modular broadcast-level high-definition camera | |
| CN204925488U (en) | Camera module | |
| US20230179693A1 (en) | Full-screen display device | |
| CN105163013B (en) | A kind of camera module normal component and its assemble method | |
| JP3209652U (en) | Shooting module | |
| US20190253590A1 (en) | Camera Module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20200227 |