CN201403146Y - Miniature CMOS image sampling module group - Google Patents
Miniature CMOS image sampling module group Download PDFInfo
- Publication number
- CN201403146Y CN201403146Y CN2009200557221U CN200920055722U CN201403146Y CN 201403146 Y CN201403146 Y CN 201403146Y CN 2009200557221 U CN2009200557221 U CN 2009200557221U CN 200920055722 U CN200920055722 U CN 200920055722U CN 201403146 Y CN201403146 Y CN 201403146Y
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- image collection
- circuit board
- collection module
- sized
- positioning
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Abstract
Disclosed is a miniature CMOS image sampling module group, comprising a lens, a lens seat, a flexible circuit board and a CMOS photographic chip. Wherein the lens is connected with the lens seat through threads, the CMOS photographic chip is installed on the flexible circuit board in a way of sealing, a capacitance with the positioning function or a resistance positioning electronic component arearranged on the flexible circuit board. The positioning electronic component not only is the requirement of the circuit design, but also can play the effect of positioning. The utility model spurns the traditional positioning method which uses a positioning column and a positioning hole to position, but uses a CMOS photographic chip corner and the positioning electronic component to position, theminimum size can be 4. 5millimeter x4. 5millimeter x2. 8millimeter. Meanwhile the structure is compact, the production materials are saved, the reliability of an image module group is increased. In addition, the service life and the anti-interference and anti-seismic performance of the module group are improved.
Description
Technical field
The utility model relates to a kind of CMOS image collection module, is specially a kind of Small-sized C MOS image collection module of miniaturization.
Background technology
CMOS is the abbreviation of Complementary Metal Oxide Semiconductor (complementary metal oxide semiconductors (CMOS)), is meant to make a kind of technology that large scale integrated chip uses or with the produced chip of this technology.CMOS image collection module is with light, shadow, as being converted to electronic digital signal, and each pixel of CMOS camera lens has comprised amplifier and A/D change-over circuit, and a plurality of positioning electronic components are compressed in the surface area of photosensitive region of single pixel.CMOS image collection module operation principle is to utilize photodiode to carry out light and electric conversion.The light that object is assembled by camera lens (Lens) by the CMOS sensitive integrated circuits, is converted into the signal of telecommunication with light signal, through becoming data image signal output after inner ISP (image-signal processor) conversion.Deliver to processed in the digital signal processor again, be converted into YUV, the rgb format picture signal of standard.
CMOS image collection module can be divided into two classes: focus module and the module of focusing automatically.Focusing module is CMOS image collection module after lens group and chipset install that fixed-site, the focussing distance of camera lens is constant.This class module needs the photobehavior according to Sensor in the middle of producing, calculate the focussing distance of camera lens, and fixedly Sensor is on the relative distance of camera lens.Along with development of science and technology, the sensitization wafer of Sensor is done littler and littler, and this also makes the Small-sized C MOS image collection module that CMOS image collection module manufacturer need adapt with it according to the design of the characteristics of Sensor.Along with the arrival in 3G epoch, the trend of two development also appears in the camera module; Aspect is exactly the high end pixel with automatic focusing or optical zoom, and the direction of another development is exactly a Small-sized C MOS image collection module.
Because the restriction in 3G mobile output bandwidth and mobile phone space, tradition can only be used low pixel Small-sized C MOS image collection module with the localization method of reference column, location hole at preposition camera, to realize the function of video calling.
The utility model content
The purpose of this utility model is the characteristics of doing littler and littler according to the CMOS sensitive chip, designs a kind of extra small ultra-thin, Small-sized C MOS image collection module of saving cost; To meet the present developing direction of CMOS image collection module, in the 3G mobile camera module in future, obtain leading superiority.
The utility model is achieved in that Small-sized C MOS image collection module, comprise camera lens, microscope base, circuit board and CMOS sensitive chip, camera lens and microscope base are by being threaded, and the CMOS sensitive chip is encapsulated on the circuit board, and circuit board is provided with the positioning electronic components as positioning function.Positioning electronic components is not only the needs of circuit design, also can play the effect of location.
Described positioning electronic components can be electric capacity or resistance.
The camera lens module that described camera lens and lens mount are formed is outside equipped with protective cover; The effect of radome is to increase the module anti-seismic performance, increases the service life; And effective shield electromagnetic interference has good guarantee for the Electro Magnetic Compatibility of product.
Described circuit board is flexible circuit board (FPC), and the back side that flexible PCB is connected with the CMOS sensitive chip is provided with the reinforcement steel disc, and the back side of the connection pads of flexible PCB is provided with the enhancing hard plastic board.The reinforcement steel disc plays the effect of strengthening protection CMOS sensitive chip and flexible PCB PFC, and hard plastic board also is the effect of playing protection FPC plate.
Described microscope base and flexible circuit board are by the hot-setting adhesive bonding connection.
Described camera lens and microscope base are adhesively fixed by glue after focusing.
The camera lens module that described camera lens and lens mount are formed is outside equipped with protective cover.
The utility model adopts CSP module encapsulation technology based on the wafer technology of most advanced CMOS sensitive chip, and with the microminiaturization of CMOS image collection module, minimum dimension can be accomplished 4.5mm * 4.5mm * 2.8mm.Betwixt,, all adopt advanced production packaging technology, guaranteed the quality of extra small ultra-thin CMOS image collection mould from being designed into production and assembly.On the lens group and CMOS sensitive chip location of camera lens and microscope base composition, courageously break through, abandoned the localization method of tradition with reference column, location hole, employing CMOS sensitive chip corner and positioning electronic components location, the positioning accuracy height, accurately.
Description of drawings
Fig. 1 is the assembling schematic diagram of the utility model Small-sized C MOS image collection module;
Fig. 2 is the vertical view of camera lens in the utility model Small-sized C MOS image collection module;
Fig. 3 is the part sectioned view of camera lens in the utility model Small-sized C MOS image collection module;
Fig. 4 is the utility model Small-sized C MOS image collection module microscope base vertical view;
Fig. 5 is the utility model Small-sized C MOS image collection module A-A portion cutaway view;
Fig. 6 is the front view of the utility model Small-sized C MOS image collection module;
Fig. 7 is the utility model Small-sized C MOS image collection module C-C portion cutaway view.
Fig. 8 is equipped with the structure chart of protective cover for the utility model Small-sized C MOS image collection module.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model Small-sized C MOS image collection module is described in detail.
Small-sized C MOS image collection module as Fig. 1～shown in Figure 8, comprises camera lens 1, microscope base 2, circuit board 7 and CMOS sensitive chip 4.Camera lens 1 and microscope base 2 are by being threaded.CMOS sensitive chip 4 is encapsulated on the circuit board 7, and circuit board 7 is provided with the positioning electronic components 6 as positioning function.Positioning electronic components 6 is not only the needs of circuit design, also can play the effect of location.Positioning electronic components 6 location of matching with the corner of CMOS sensitive chip 4, the positioning accuracy height, accurately.Positioning electronic components 6 can be electric capacity or resistance.What circuit board 7 adopted is the flexible circuit board (FPC) with frivolous little characteristics; the back side that flexible PCB is connected with CMOS sensitive chip 4 is provided with reinforcement steel disc 3; reinforcement steel disc 3 has been strengthened the rigidity of flexible circuit board, the CMOS sensitive chip 4 of protection packaging on flexible PCB.The back side of the connection pads of flexible PCB is provided with the hard plastic board 5 of humidification, and hard plastic board 5 also is the effect of playing protection FPC plate.Microscope base 2 passes through the hot-setting adhesive bonding connection with flexible circuit board.Camera lens 1 and microscope base 2 focus the back in test and are adhesively fixed by glue.The camera lens module that camera lens 1 and lens mount 2 are formed is outside equipped with protective cover 8.The effect of protective cover 8 is to increase the module anti-seismic performance, increases the service life; And effective shield electromagnetic interference has good guarantee for the Electro Magnetic Compatibility of product.
With the len module.
The utility model is newly in order to accomplish extra small ultra-thin miniaturization, requires each element all to need very high precision and cooperates, and can finish by technology once:
1, paster: at first CMOS sensitive chip 4 can directly mount on the flexible PCB (FPC) by Reflow Soldering.
2, assembling: camera lens 1 and microscope base 2 are by fitting together after the cleaning, microscope base 2 is to locate on flexible PCB by positioning electronic components 6, by black adhesive process microscope base 2 and flexible PCB are bonded together, can microscope base 2 and flexible PCB be fixed together the thermosetting stove to guarantee bad phenomenon such as slit and rake angle can not occur with tool.Furnace temperature can be set according to the character of black glue, uses curing performance hot-setting adhesive preferably, ℃ 15 minutes gets final product in 75 ℃ of furnace temperature～80.
3, focusing: adopt CMOS image collection module focusing test macro that module is focused, the module focal length is debugged the optimum position.The CMOS image collection module that takes out from the thermosetting stove after solidifying is the impact effect of test CMOS image collection module at special-purpose production test focusing system.
4, focus: can seal camera lens 1 with the UV light binding, it is promptly curable to cross the solid machine of UV light, and burnt phenomenon then can not appear running in module.Using the advantage of UV light binding is to need not high temperature, and curing rate is fast, convenient easy operating, and it is very high to be beneficial to very much production in enormous quantities and efficient.
Focus finish after, the production of extra small ultra-thin CMOS image collection module is substantially finished.Follow-up is check and finished product packing.Whole process of production is evaded the production bottleneck of also a plurality of mobile phone cam modules, and production efficiency is got a promotion, quality also arrived good guarantee.Both meet CMOS sensitive chip future thrust, catered to the trend in mobile phone cam market again.
The utility model adopts CSP module encapsulation technology based on the wafer technology of most advanced CMOS sensitive chip, and with the microminiaturization of CMOS image collection module, minimum dimension can be accomplished 4.5mm * 4.5mm * 2.8mm.Betwixt,, all adopt advanced production packaging technology, guaranteed the quality of extra small ultra-thin CMOS image collection mould from being designed into production and assembly.On the lens group and CMOS sensitive chip 5 location of camera lens 1 and microscope base 2 compositions, courageously break through, abandoned the localization method of tradition with reference column, location hole, employing CMOS sensitive chip 5 corners and positioning electronic components location, the positioning accuracy height, accurately.
Claims (7)
1, Small-sized C MOS image collection module, comprise camera lens, microscope base, circuit board and CMOS sensitive chip, it is characterized in that: camera lens and microscope base are by being threaded, and the CMOS sensitive chip is encapsulated on the circuit board, and circuit board is provided with the positioning electronic components as positioning function.
2, Small-sized C MOS image collection module as claimed in claim 1, it is characterized in that: described positioning electronic components is electric capacity or resistance,
3, Small-sized C MOS image collection module as claimed in claim 1, it is characterized in that: described circuit board is a flexible circuit board, the back side that flexible PCB is connected with the CMOS sensitive chip is provided with the reinforcement steel disc.
4, Small-sized C MOS image collection module as claimed in claim 3, it is characterized in that: the back side of the connection pads of described flexible PCB is provided with the hard plastic board of enhancing.
5, Small-sized C MOS image collection module as claimed in claim 1 is characterized in that: described microscope base and flexible circuit board are by the hot-setting adhesive bonding connection.
6, Small-sized C MOS image collection module as claimed in claim 1 is characterized in that: described camera lens and microscope base are adhesively fixed by glue after focusing.
7, Small-sized C MOS image collection module as claimed in claim 1 is characterized in that: the camera lens module that described camera lens and lens mount are formed is outside equipped with protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200557221U CN201403146Y (en) | 2009-04-30 | 2009-04-30 | Miniature CMOS image sampling module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200557221U CN201403146Y (en) | 2009-04-30 | 2009-04-30 | Miniature CMOS image sampling module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201403146Y true CN201403146Y (en) | 2010-02-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200557221U Expired - Fee Related CN201403146Y (en) | 2009-04-30 | 2009-04-30 | Miniature CMOS image sampling module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201403146Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336348A (en) * | 2013-07-01 | 2013-10-02 | 南昌欧菲光电技术有限公司 | Image module assembly and image module |
| CN105163013A (en) * | 2015-08-28 | 2015-12-16 | 广州大凌实业股份有限公司 | Standard device of camera module and assembly method thereof |
| CN105282403A (en) * | 2014-07-07 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Method of controlling camera shooting module resolution power uniformity and the camera shooting module |
| CN105278069A (en) * | 2014-06-20 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Shooting module and manufacture method thereof |
-
2009
- 2009-04-30 CN CN2009200557221U patent/CN201403146Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336348A (en) * | 2013-07-01 | 2013-10-02 | 南昌欧菲光电技术有限公司 | Image module assembly and image module |
| CN103336348B (en) * | 2013-07-01 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Image die set and image module |
| CN105278069A (en) * | 2014-06-20 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Shooting module and manufacture method thereof |
| CN105278069B (en) * | 2014-06-20 | 2019-03-12 | 宁波舜宇光电信息有限公司 | A kind of camera module and its manufacturing method |
| CN105282403A (en) * | 2014-07-07 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Method of controlling camera shooting module resolution power uniformity and the camera shooting module |
| CN105282403B (en) * | 2014-07-07 | 2019-08-23 | 宁波舜宇光电信息有限公司 | A kind of method and camera module controlling camera module resolving power uniformity |
| CN105163013A (en) * | 2015-08-28 | 2015-12-16 | 广州大凌实业股份有限公司 | Standard device of camera module and assembly method thereof |
| CN105163013B (en) * | 2015-08-28 | 2018-10-30 | 广州大凌实业股份有限公司 | A kind of camera module normal component and its assemble method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20100430 |