CN201114373Y

CN201114373Y - Sticker type camera module

Info

Publication number: CN201114373Y
Application number: CNU2007200534324U
Authority: CN
Inventors: 凌代年
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-06-28
Filing date: 2007-06-28
Publication date: 2008-09-10
Anticipated expiration: 2017-06-28

Abstract

A portable camera module group consists of a lens component and an image sensor (CCD or CMOS) chip. The lens component and the image sensor (CCD or CMOS) are sealed together as an electric element form. The portable camera module group has the advantages of simple structure, small size, easy processing and lower manufacture cost, etc. and is broadly applied to digital products like a mobile phone, a PDA, a notebook computer, an MP4 player, etc.

Description

Bonded type camera shooting head mould group

Technical field

The utility model relates to the shooting camera arrangement, more particularly, relates to a kind of camera module that is applicable to portable digital equipments such as mobile phone, palmtop PC, notebook and MP4 player.

Background technology

In recent years, along with development of science and technology, multiple function that various digital products are integrated.The camera module promptly is that optical lens and image sensor (CCD or CMOS) are become a kind of small-sized optical digital image transitions module altogether.The camera module being integrated on the portable digital equipments such as mobile phone, palmtop PC, notebook, MP4, being subjected to liking and pursuing of users, is a kind of embodiment of fashion.

General cameras with fixed focus module is made up of lens assembly (lens), pedestal (holder), image sensor (CCD or CMOS) and wiring board, lens assembly is corresponding with the photosensitive region of image sensor by pedestal, and together is assembled in (Fig. 1) on the wiring board; Image sensor is electrically connected with internal circuit on the wiring board 4, and image sensor and wiring board convert the light signal that collects to data image signal, is connected with ancillary equipment (as the mobile phone main body) by the connector on the wiring board 4 again.Traditional shooting module main flow encapsulation technology has two kinds of wafer-level package (CSP, Chip Scale Package) chip on boards (COB, Chip On Board).

At present, mobile phone, palmtop PC, notebook, MP4 player etc. just develop towards the direction of microminiaturization.But the camera modular structure complexity of prior art need add FPC or PCB draws circuit, and volume is big, has limited the development of digital product microminiaturization.

The utility model content

In order to achieve the above object, the utility model provides a kind of simple in structure, bonded type camera shooting head mould group that volume is little.

The utility model is achieved in that by lens assembly and image sensor (CCD or CMOS) chip to be formed, lens assembly is mounted on the image sensor (CCD or CMOS), its innovative point is: lens assembly directly is mounted on image sensor (CCD or the CMOS) chip, and being connected with the SMT paster between camera module and the ancillary equipment main circuit board finished.

Effective effect of the present utility model is: lens assembly directly is mounted on the chip, utilizes surface mounting technology (SMT, Surface Mount Technology) that the camera module directly is mounted on the ancillary equipment main circuit board, therefore, its structure is simpler compared to existing technology, CSP is littler for the module volume ratio, and directly paster need not lead-in wire, to the basic free of losses of signal, material and technological process have been reduced, handling ease, cleaning, easy to maintenance, yields is higher, saves production cost.

Description of drawings

Fig. 1 is the structural representation of prior art camera module;

Fig. 2,3 is a sectional structure schematic diagram of the present utility model;

Fig. 4 is the utility model operation principle block diagram.

Embodiment

Below in conjunction with most preferred embodiment and accompanying drawing, the utility model is described in further detail.

Shown in Fig. 2,3, the shooting module is made up of lens assembly 1 and image sensor (CCD or CMOS) chip 3; Lens assembly 1 is made up of eyeglass 2 encapsulation of mirror cover and 1～n sheet, as Fig. 2; Perhaps form, as Fig. 3 by the eyeglass 5 direct encapsulation of 1～n sheet.Pixel and chip sensitization size decision eyeglass quantity according to chip.Adopt mounting technology with lens assembly 1 directly with 3 Chip Packaging together, as an electronic component form.Being connected with the SMT paster between camera module and the ancillary equipment main circuit board finished.

The operation principle of camera assembly: as shown in Figure 4, the light that object is assembled by lens assembly (LENS), by image sensor (CCD or CMOS) chip 3, be converted into the signal of telecommunication by light signal, after internal image signal processor (ISP) conversion, become data image signal.Handle through internal digital signal processor (DSP) again, be converted to RGB, the yuv format picture signal of standard.

Claims

1. a bonded type camera shooting head mould group is made up of lens assembly and image sensor dice, it is characterized in that: described lens assembly directly is mounted on the image sensor dice, and the direct SMT paster of camera module and ancillary equipment main circuit board is finished.