CN203734734U - Mobile phone camera - Google Patents
Mobile phone camera Download PDFInfo
- Publication number
- CN203734734U CN203734734U CN201420052210.0U CN201420052210U CN203734734U CN 203734734 U CN203734734 U CN 203734734U CN 201420052210 U CN201420052210 U CN 201420052210U CN 203734734 U CN203734734 U CN 203734734U
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- China
- Prior art keywords
- image sensor
- sensor chip
- microscope base
- mobile phone
- csp
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Abstract
The utility model discloses a mobile phone camera. The mobile phone camera includes a CSP lens, an infrared ray filter, a COB image sensor chip, a lens seat and a PCB which is located below the lens seat and is fixedly connected with the lens seat; a cavity which is used for connecting the CSP lens and accommodating the infrared ray filter and the COB image sensor chipis arranged in the lens seat; the COB image sensor chip is fixed on the PCB and is located below the CSP lens; the infrared ray filter is located between the CSP lens and the COB image sensor chip; the infrared ray filter is assembled on the surface of the COB image sensor chip; and the joint of the lens seat and the PCB is provided with a sealant. Compared with the prior art, the mobile phone camera provided by the utility model has a certain dustproof function, and at the same time can assist in ensuring high image quality, reducing cost and simplifying manufacture process.
Description
Technical field
The utility model relates to optical camera field, exactly refers to a kind of mobile phone camera.
Background technology
Optical camera module is widely used in consumer digital product, as fields such as mobile phone, computer, toy, industry detection, automobile mounted camera and health cares, is accompanied by the development in epoch, the progress of science and technology, has entered already huge numbers of families.Particularly be accompanied by the arrival in 3G mobile epoch, for the shipment amount of 3G mobile will increase substantially, will drive increasing rapidly of COS photographing module demand.
At present, the traditional C/S P processing procedure of existing mobile phone camera is a kind of surface mounting technology based on SMT, and CSP encapsulation is mainly to occupy most shares in low pixel field.Because there is glass to cover image sensor surface, reduce dust, yields is higher, but the existence of glass has reduced image quality, therefore need avoid with the better glass of refractive index the loss of light source, and its thickness is larger, with respect to day by day requiring compact mobile phone volumetric to unfavorable.The small product size of COB processing procedure is little, image quality is better, be applicable to high pixel product, also be the trend that meets the development of mobile phone volume, but because imageing sensor is connected on hard wiring board PCB, by techniques such as hot pressing, make hard wiring board PCB and flex circuit application FPC conducting again, technique more complicated, cost is also higher, and price advantage is not clearly.
Utility model content
For above-mentioned defect, the technical problem that the utility model solves is to provide a kind of mobile phone camera, has certain dust reduction capability, reduces costs, and simplify manufacturing process when can guarantee product high image quality simultaneously.
In order to solve above technical problem, the mobile phone camera that the utility model provides, comprise CSP camera lens, infrared ray filter, COB image sensor chip, microscope base and the pcb board that is positioned at described microscope base below and is fixedly connected with described microscope base, in described microscope base, be provided with for being connected and holding the cavity of described infrared ray filter and described COB image sensor chip with described CSP camera lens, described COB image sensor chip is fixed on described pcb board and is positioned at the below of described CSP camera lens, described infrared ray filter is between described CSP camera lens and described COB image sensor chip, described infrared ray filter is assemblied in the surface of described COB image sensor chip, the connecting portion of described microscope base and described pcb board is provided with fluid sealant.
Preferably, described CSP camera lens is fixed on described microscope base by screw knob mode, and the threaded connection place of described CSP camera lens and described microscope base scribbles colloid.
Preferably, the inside horizontal-extending in the bottom of described microscope base has dust board.
Preferably, the thickness of described infrared ray filter is 0.3-0.5mm.
The mobile phone camera that the utility model provides, comprise CSP camera lens, infrared ray filter, COB image sensor chip, microscope base and the pcb board that is positioned at described microscope base below and is fixedly connected with described microscope base, in described microscope base, be provided with for being connected and holding the cavity of described infrared ray filter and described COB image sensor chip with described CSP camera lens, described COB image sensor chip is fixed on described pcb board and is positioned at the below of described CSP camera lens, described infrared ray filter is between described CSP camera lens and described COB image sensor chip, described infrared ray filter is assemblied in the surface of described COB image sensor chip, when by CSP camera lens and microscope base fractionation, just infrared blocking sheet is taken out, the direct dust on wiping image sensor chip, when product repairing, be convenient to dismounting.Compared with prior art, the mobile phone camera that the utility model provides, has certain dust reduction capability, reduces costs, and simplify manufacturing process when can guarantee product high image quality simultaneously.
Especially, CSP camera lens is fixed on microscope base by screw knob mode, and the threaded connection place of CSP camera lens and microscope base scribbles colloid, and colloid has certain viscosity, and under nature or after overbaking, can not solidify, for adhering to the dust producing because of screw thread friction.
Further, the inside horizontal-extending in the bottom of microscope base has dust board, even because screw thread friction produces dust, dust can not drop on COB image sensor chip yet, and COB image sensor chip is played a protective role.
Accompanying drawing explanation
Fig. 1 is the decomposition texture schematic diagram of mobile phone camera in the utility model embodiment.
Embodiment
For those skilled in the art can understand technical scheme provided by the utility model better, below in conjunction with specific embodiment, set forth.
Refer to Fig. 1, this figure is the decomposition texture schematic diagram of mobile phone camera in the utility model embodiment.
The mobile phone camera that the utility model embodiment provides, comprise CSP camera lens 1, infrared ray filter 2, COB image sensor chip 3, microscope base 4 and the pcb board 5 that is positioned at microscope base 4 belows and is fixedly connected with microscope base 4, in microscope base 4, be provided with for being connected and holding the cavity of infrared ray filter 2 and COB image sensor chip 3 with CSP camera lens 1, COB image sensor chip 3 is fixed on pcb board 4 and is positioned at the below of CSP camera lens 1, infrared ray filter 2 is between CSP camera lens 1 and COB image sensor chip 3, infrared ray filter 2 fixedly sticks on the surface of COB image sensor chip 3, microscope base 4 is provided with fluid sealant with the connecting portion of pcb board 5, can prevent that dust from entering from microscope base 4 and the connecting portion of pcb board 5, prevents contamination by dust COB image sensor chip 3.
Mobile phone camera also comprises FPC plate 6 and connector 7, and pcb board 5 is fixed on a side of FPC plate 6 by hot pressing mode, and the opposite side of FPC plate 6 is welded to connect part 7.
The thickness of infrared ray filter 2 is 0.3-0.5mm, can make the imaging effect of mobile phone camera more clear evenly.
Especially, CSP camera lens 1 is fixed on microscope base 4 by screw knob mode, and CSP camera lens 1 scribbles colloid with the threaded connection place of microscope base 4, and colloid has certain viscosity, and under nature or after overbaking, can not solidify, for adhering to the dust producing because of screw thread friction.
Further, the inside horizontal-extending in the bottom of microscope base 4 has dust board 41, even because screw thread friction produces dust, dust can not drop on COB image sensor chip 3 yet, and COB image sensor chip 3 is played a protective role.
Compared with prior art, the mobile phone camera that the utility model provides, infrared ray filter is assemblied in the surface of described COB image sensor chip, when by CSP camera lens and microscope base fractionation, just infrared blocking sheet is taken out, directly the dust on wiping image sensor chip is convenient to dismounting when product repairing, has certain dust reduction capability, when can guarantee product high image quality, reduce costs, and simplify manufacturing process simultaneously.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. a mobile phone camera, it is characterized in that, comprise CSP camera lens, infrared ray filter, COB image sensor chip, microscope base and the pcb board that is positioned at described microscope base below and is fixedly connected with described microscope base, in described microscope base, be provided with for being connected and holding the cavity of described infrared ray filter and described COB image sensor chip with described CSP camera lens, described COB image sensor chip is fixed on described pcb board and is positioned at the below of described CSP camera lens, described infrared ray filter is between described CSP camera lens and described COB image sensor chip, described infrared ray filter is assemblied in the surface of described COB image sensor chip, the connecting portion of described microscope base and described pcb board is provided with fluid sealant.
2. mobile phone camera according to claim 1, is characterized in that, described CSP camera lens is fixed on described microscope base by screw knob mode, and the threaded connection place of described CSP camera lens and described microscope base scribbles colloid.
3. mobile phone camera according to claim 1, is characterized in that, the inside horizontal-extending in bottom of described microscope base has dust board.
4. mobile phone camera according to claim 1, is characterized in that, the thickness of described infrared ray filter is 0.3-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052210.0U CN203734734U (en) | 2014-01-26 | 2014-01-26 | Mobile phone camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052210.0U CN203734734U (en) | 2014-01-26 | 2014-01-26 | Mobile phone camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203734734U true CN203734734U (en) | 2014-07-23 |
Family
ID=51204773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420052210.0U Expired - Fee Related CN203734734U (en) | 2014-01-26 | 2014-01-26 | Mobile phone camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203734734U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106998414A (en) * | 2016-01-26 | 2017-08-01 | 三星电机株式会社 | Image sensor module and the camera model including the image sensor module |
| CN109819147A (en) * | 2019-01-31 | 2019-05-28 | 信利光电股份有限公司 | A kind of camera lens camera module and video camera |
-
2014
- 2014-01-26 CN CN201420052210.0U patent/CN203734734U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106998414A (en) * | 2016-01-26 | 2017-08-01 | 三星电机株式会社 | Image sensor module and the camera model including the image sensor module |
| CN106998414B (en) * | 2016-01-26 | 2020-10-13 | 三星电机株式会社 | Image sensor module and camera module including the same |
| CN109819147A (en) * | 2019-01-31 | 2019-05-28 | 信利光电股份有限公司 | A kind of camera lens camera module and video camera |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161215 Address after: 523000 Guangdong city in Dongguan Province town of Liaobu City Industrial Road No. 7 business business Patentee after: Guangdong Jinlong electromechanical Co., Ltd. Address before: 523000 Tangxia City, Dongguan Province town Peak Road, No. 1, Patentee before: Jinlong electromechanical (Dongguan) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20190126 |