CN203734735U - Dustproof camera module - Google Patents
Dustproof camera module Download PDFInfo
- Publication number
- CN203734735U CN203734735U CN201420052268.5U CN201420052268U CN203734735U CN 203734735 U CN203734735 U CN 203734735U CN 201420052268 U CN201420052268 U CN 201420052268U CN 203734735 U CN203734735 U CN 203734735U
- Authority
- CN
- China
- Prior art keywords
- optical lens
- lens assembly
- microscope base
- camera module
- flex circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a dustproof camera module. The dustproof camera module comprises a lens seat, an infrared ray filter, an optical lens assembly, a flexible circuit board and an image sensor chip, wherein the optical lens assembly is arranged on the lens seat, and the lens seat is fixed on the flexible circuit board; the joint of the lens seat and the flexible circuit board is provided with a dustproof sealing adhesive; the joint of the lens seat and the optical lens assembly is coated with a sealing adhesive; the image sensor chip is fixedly bonded on the flexible circuit board, and is located in the cavity of the lens seat and is aligned with the optical lens assembly; the flexible circuit board is in connection conduction with the image sensor chip through a circuit; and the infrared ray filter is fixedly bonded on the bottom of the optical lens assembly. Compared with the prior art, the dustproof camera module provided by the utility model can assist in ensuring high-quality images, reducing cost and simplifying manufacture process. The infrared ray filter is fixedly bonded on the bottom of the optical lens assembly, and therefore, the dustproof camera module is convenient to disassemble and assemble in maintenance.
Description
Technical field
The utility model relates to optical camera field, exactly refers to a kind of dustproof camera module.
Background technology
Optical camera module is widely used in consumer digital product, as fields such as mobile phone, computer, toy, industry detection, automobile mounted camera and health cares, is accompanied by the development in epoch, the progress of science and technology, has entered already huge numbers of families.Particularly be accompanied by the arrival in 3G mobile epoch, for the shipment amount of 3G mobile will increase substantially, will drive increasing rapidly of COS photographing module demand.
At present, the traditional C/S P processing procedure of existing mobile phone camera is a kind of surface mounting technology based on SMT, and CSP encapsulation is mainly to occupy most shares in low pixel field.Because there is glass to cover image sensor surface, reduce dust, yields is higher, but the existence of glass has reduced image quality, therefore need avoid with the better glass of refractive index the loss of light source, and its thickness is larger, with respect to day by day requiring compact mobile phone volumetric to unfavorable.The small product size of COB processing procedure is little, image quality is better, be applicable to high pixel product, also be the trend that meets the development of mobile phone volume, but because imageing sensor is connected on hard wiring board PCB, by techniques such as hot pressing, make hard wiring board PCB and flex circuit application FPC conducting again, technique more complicated, cost is also higher, and price advantage is not clearly.
Utility model content
For above-mentioned defect, the technical problem that the utility model solves is to provide a kind of dustproof camera module, reduces costs, and simplify manufacturing process when can guarantee product high image quality.
In order to solve above technical problem, the dustproof camera module that the utility model provides, comprise microscope base, infrared ray filter, optical lens assembly, flex circuit application and image sensor chip, described optical lens assembly is arranged on described microscope base, described microscope base is fixed on described flex circuit application, the connecting portion of described microscope base and described flex circuit application is provided with dust seal glue, connecting portion between described microscope base and described optical lens assembly scribbles fluid sealant, described image sensor chip fixedly sticks on described flex circuit application, and be arranged in microscope base inner chamber and over against described optical lens assembly, between described flex circuit application and described image sensor chip, pass through connection conducting, described infrared ray filter fixedly sticks on the bottom of described optical lens assembly.
Preferably, on the another side at the position of the fixing described microscope base of described flex circuit application, be fixedly fitted with stiffener.
Preferably, described optical lens assembly is fixed on described microscope base by screw knob mode.
Preferably, the connection line between described flex circuit application and described image sensor chip is a kind of in gold thread, copper cash or aluminum steel.
The dustproof camera module that the utility model provides, comprise microscope base, infrared ray filter, optical lens assembly, flex circuit application and image sensor chip, described optical lens assembly is arranged on described microscope base, described microscope base is fixed on described flex circuit application, the connecting portion of described microscope base and described flex circuit application is provided with dust seal glue, connecting portion between described microscope base and described optical lens assembly scribbles fluid sealant, described image sensor chip fixedly sticks on described flex circuit application, and be arranged in microscope base inner chamber and over against described optical lens assembly, between described flex circuit application and described image sensor chip, pass through connection conducting, described infrared ray filter fixedly sticks on the bottom of described optical lens assembly.Compared with prior art, the dustproof camera module that the utility model provides, the connecting portion of described microscope base and described flex circuit application is provided with dust seal glue, can prevent that dust from entering into inside from the connecting portion of described microscope base and described flex circuit application, prevents contamination by dust image sensor chip; Connecting portion between described microscope base and described optical lens assembly scribbles fluid sealant, colloid has certain viscosity, and under nature or after overbaking, can not solidify, for adhering to the dust producing because of screw thread friction, prevent contamination by dust image sensor chip.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of camera module dustproof in the utility model embodiment.
Embodiment
For those skilled in the art can understand technical scheme provided by the utility model better, below in conjunction with specific embodiment, set forth.
Refer to Fig. 1, this figure is the schematic cross-section of camera module dustproof in the utility model embodiment.
The dustproof camera module that the utility model embodiment provides, comprise microscope base 1, infrared ray filter 5, optical lens assembly 2, flex circuit application FPC and image sensor chip 3, optical lens assembly 2 is arranged on microscope base 1, microscope base 1 is fixed on flex circuit application FPC, image sensor chip 3 fixedly sticks on flex circuit application FPC, microscope base 1 is provided with dust seal glue 6 with the connecting portion of flex circuit application FPC, and the connecting portion between microscope base 1 and optical lens assembly 2 scribbles fluid sealant (not shown).
And be arranged in microscope base 1 inner chamber and over against optical lens assembly 2, between flex circuit application FPC and image sensor chip 3, by circuit W, be connected conducting, infrared ray filter 5 fixedly sticks on the bottom of optical lens assembly 2.Flex circuit application FPC is fixedly fixedly fitted with stiffener 4 on the another side at the position of microscope base 1.Optical lens assembly 2 is fixed on microscope base 1 by screw knob mode.Connection line W between flex circuit application FPC and image sensor chip 3 is a kind of in gold thread, copper cash or aluminum steel.
Compared with prior art, the dustproof camera module that the utility model provides, microscope base 1 is provided with dust seal glue 6 with the connecting portion of flex circuit application FPC, can prevent that dust from entering into inside from microscope base 1 and the connecting portion of flex circuit application FPC, prevents contamination by dust image sensor chip; Connecting portion between microscope base 1 and optical lens assembly 2 scribbles fluid sealant, and colloid has certain viscosity, and can not solidify under nature or after overbaking, for adhering to the dust producing because of screw thread friction, prevents contamination by dust image sensor chip.
In addition, infrared ray filter fixedly sticks on the bottom of optical lens assembly, when by optical lens assembly and microscope base fractionation, just infrared blocking sheet is taken out, and directly the dust on wiping image sensor chip is convenient to dismounting when product repairing.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. a dustproof camera module, it is characterized in that, comprise microscope base, infrared ray filter, optical lens assembly, flex circuit application and image sensor chip, described optical lens assembly is arranged on described microscope base, described microscope base is fixed on described flex circuit application, the connecting portion of described microscope base and described flex circuit application is provided with dust seal glue, connecting portion between described microscope base and described optical lens assembly scribbles fluid sealant, described image sensor chip fixedly sticks on described flex circuit application, and be arranged in microscope base inner chamber and over against described optical lens assembly, between described flex circuit application and described image sensor chip, pass through connection conducting, described infrared ray filter fixedly sticks on the bottom of described optical lens assembly.
2. dustproof camera module according to claim 1, is characterized in that, on the another side at the position of the fixing described microscope base of described flex circuit application, is fixedly fitted with stiffener.
3. dustproof camera module according to claim 1, is characterized in that, described optical lens assembly is fixed on described microscope base by screw knob mode.
4. dustproof camera module according to claim 1, is characterized in that, the connection line between described flex circuit application and described image sensor chip is a kind of in gold thread, copper cash or aluminum steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052268.5U CN203734735U (en) | 2014-01-26 | 2014-01-26 | Dustproof camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052268.5U CN203734735U (en) | 2014-01-26 | 2014-01-26 | Dustproof camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203734735U true CN203734735U (en) | 2014-07-23 |
Family
ID=51204774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420052268.5U Expired - Fee Related CN203734735U (en) | 2014-01-26 | 2014-01-26 | Dustproof camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203734735U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109819147A (en) * | 2019-01-31 | 2019-05-28 | 信利光电股份有限公司 | A kind of camera lens camera module and video camera |
| WO2019120055A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera having same, and electronic device |
| CN110830699A (en) * | 2019-11-28 | 2020-02-21 | 宁波为森智能传感技术有限公司 | Camera head |
-
2014
- 2014-01-26 CN CN201420052268.5U patent/CN203734735U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019120055A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera having same, and electronic device |
| CN109819147A (en) * | 2019-01-31 | 2019-05-28 | 信利光电股份有限公司 | A kind of camera lens camera module and video camera |
| CN110830699A (en) * | 2019-11-28 | 2020-02-21 | 宁波为森智能传感技术有限公司 | Camera head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161220 Address after: 523000 Guangdong city in Dongguan Province town of Liaobu City Industrial Road No. 7 business business Patentee after: GUANGDONG JINLONG MACHINERY & ELECTRONICS CO.,LTD. Address before: 523000 Tangxia City, Dongguan Province town Peak Road, No. 1, Patentee before: JINLONG MACHINERY & ELECTRONICS (DONGGUAN) CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20220126 |