CN108769495A - A kind of camera module and assemble method and electronic equipment - Google Patents
A kind of camera module and assemble method and electronic equipment Download PDFInfo
- Publication number
- CN108769495A CN108769495A CN201810892173.7A CN201810892173A CN108769495A CN 108769495 A CN108769495 A CN 108769495A CN 201810892173 A CN201810892173 A CN 201810892173A CN 108769495 A CN108769495 A CN 108769495A
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- China
- Prior art keywords
- wiring board
- lens
- camera module
- positioning column
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The invention discloses a kind of camera modules, including；One stiffening plate；An at least wiring board, the wiring board have at least a void region and at least a positioning hole, are attached at the reinforcement plate surface；An at least sensitive chip, the sensitive chip are attached at the reinforcement plate surface by the void region on the wiring board；An at least lens subassembly, the lens subassembly include an at least positioning column corresponding with the location hole, and the positioning column passes through the location hole on the wiring board to be fitted in the reinforcement plate surface, to realize the assembling to lens subassembly.Also disclose a kind of assemble method of camera module.Camera module and assemble method can reduce the assembling tolerance of camera module, to improve the optical property of camera module.
Description
Technical field
The present invention relates to optical imaging fields, and in particular to a kind of camera module, a kind of assemble method of camera module with
And a kind of electronic equipment based on the camera module.
Background technology
Optical property is an important performance of camera module, and the optical property of camera module is removed by camera lens, sensitive chip
Etc. outside the influence of component capabilities quality, assembly precision equally influences the optical property of camera module, i.e. assembly precision reduces direct
The optical property of camera module can be caused to reduce.
Existing module group assembling process is：One sensitive chip is attached on a wiring board, and is connected after the wiring board, it will
One pedestal is set on the wiring board, and a filter element and an actuator are installed on pedestal.In entire assembling process, group
It fills more step, very complicated and often step assembling and refers to different planes, the component that an assembling steps are brought tilts direct
The assembling of next assembling parts can be caused to tilt, the assembling accumulation of multiple components tilts the light that can seriously affect entire camera module
Learn performance.
Such as：Pedestal and sensitive chip are that face paste invests on wiring board on the basis of PCB surface, and actuator is the bottom of with
Face is fixed on the base on the basis of seating face, when PCB surface and susceptor surface out-of-flatness or it is not parallel when, then can cause to drive
Moving part generates inclination, next, after installing camera lens on the basis of actuator, the inclination of actuator can cause the inclination of camera lens, into
And camera lens optical axis and sensitive chip optical axis is caused to generate deviation, influence optical property.
Currently, to improve camera module assembly precision, pacify again after carrying out active correction with motor sub-assembly to camera lens or camera lens
Loaded on actuator, so that camera lens optical axis can be with the deviation of sensitive chip optical axis coincidence or camera lens optical axis and sensitive chip optical axis
Control is in a certain range.But the active correction of camera lens or camera lens and motor sub-assembly can cause the assembly process is complicated to change so that
Assembling difficulty becomes larger, and packaging technology elapsed time increases, and cost increases.
Publication No. CN101035199A patent applications disclose a kind of image sensor and directly connect encapsulation with soft board
The production method of image module, the specific steps are：First, trepanning at image sensor dice installation position is corresponded on soft board, is taken
One with image module pedestal size cooperation reinforcement steel plate, by the reinforcement Interal fixation soft board tapping back side；Then, will
Image sensor dice is placed in the hole of soft board, is connect with reinforcement Interal fixation, routing make each pin of image sensor dice with
Corresponding circuits electrical connection on soft board；Finally, the connection pillar and soft board and reinforcement of mounting seat and lens unit by bottom
Interal fixation connects, and realizes the encapsulation of image module.The bright structure using in soft board uplifting window of the patent application, utilizes reinforcement steel
Plate realizes the fixation of image sensor dice and pedestal, need not be packaged using printed circuit board, be taken the photograph with reaching reduction again
As module height, cost is reduced as goal of the invention.Since soft board is a flexible material, rigidity is not strong, draws in the patent application
Enter reinforcement steel plate to increase the rigidity of camera module, and fixed across soft board from the connection pillar known to attached drawing 1 in mounting seat
In reinforcement steel plate, reinforcement steel plate only plays fixed supporting role to soft board and mounting seat.
Invention content
The object of the present invention is to provide a kind of camera module, in the camera module, lens subassembly and sensitive chip are to mend
Face is installed on stiffening plate on the basis of strong plate surface, to reduce the assembling tolerance of camera module.
The object of the present invention is to provide a kind of camera module, in the camera module, lens subassembly and sensitive chip are to mend
Face is installed on stiffening plate on the basis of strong plate surface, and the position relationship between lens subassembly optical axis and sensitive chip optical axis is made to meet light
Learn performance requirement.
It is a further object of the present invention to provide a kind of assemble method of camera module, which can shorten assembling stream
Journey reduces packaging technology difficulty, promotes packaging efficiency, reduces cost.
It is a further object of the present invention to provide a kind of electronic equipment, the electronic equipment image quality is high.
For achieving the above object, following technical scheme is provided：
A kind of camera module, including；
One stiffening plate；
An at least wiring board, the wiring board have at least a void region and at least a positioning hole, are attached at the benefit
Strong plate surface；
An at least sensitive chip, the sensitive chip are attached at the stiffening plate by the void region on the wiring board
Surface；
An at least lens subassembly, the lens subassembly includes an at least positioning column corresponding with the location hole, described fixed
Position column passes through the location hole on the wiring board to be fitted in the reinforcement plate surface, to realize the assembling to lens subassembly.
In the camera module, sensitive chip and lens subassembly are that face is installed on the basis of the extremely flat stiffening plate in surface
In reinforcement plate surface so that the optical axis of lens subassembly and the optical axis coincidence of sensitive chip or there are between in certain spacing range
Away from, the assembling tolerance of reduction sensitive chip and lens subassembly, and then improve the optical property of camera module.
A kind of assemble method of camera module, includes the following steps：
Stiffening plate, sensitive chip, the wiring board for offering void region and location hole are provided, and with the saturating of positioning column
Mirror assembly；
The wiring board is bonded in the stiffening plate；
The sensitive chip is placed in the void region of the wiring board, and is attached at the reinforcement plate surface and is connected
In the wiring board；
The lens subassembly is installed in face on the basis of the reinforcement plate surface, and the positioning column of the lens subassembly is across described
Location hole on wiring board is bonded the reinforcement plate surface, so that the lens subassembly is fixed on the wiring board, completes camera shooting
The assembling of module.
Lens subassembly is a camera lens and filter element be completed after it is one whole, in the assemble method of camera module
In, lens subassembly and the sensitive chip face on the basis of reinforcement plate surface control lens subassembly by stiffening plate surface smoothness
With the installation of sensitive chip so that the optical axis position of the optical axis of lens subassembly and sensitive chip overlap or in a certain range,
Assembling tolerance is reduced, in addition, using the integral type lens subassembly after assembling, multiple assembling steps subtract during tradition is assembled
As low as two assembling steps, the accumulation of assembling tolerance is further reduced, ensures that the assembly precision of camera module.
A kind of electronic equipment, the electronic equipment include above-mentioned camera module.The electronic equipment is due to including above-mentioned camera shooting mould
Group so that its image quality is high.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to do simply to introduce, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art, can be with root under the premise of not making the creative labor
Other accompanying drawings are obtained according to these attached drawings.
Fig. 1 is the sectional view of the image module of the patent application publication of Publication No. CN101035199A, wherein 1 soft board,
2 image sensor dices, 3 reinforcement steel plates, 4 pedestals, 5 lens units, 6 connection pillars；
Fig. 2 is the structural blast schematic diagram for the camera module that embodiment 1 provides；
Fig. 3 is the structural schematic diagram for the camera module that embodiment 1 provides.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, with reference to the accompanying drawings and embodiments to this
Invention is described in further detail.It should be appreciated that the specific embodiments described herein are only used to explain the present invention,
Do not limit protection scope of the present invention.
To reduce the assembling tolerance of camera module, following embodiment is provided.
Embodiment 1
As shown in Figures 2 and 3, camera module provided in this embodiment includes：Stiffening plate 101, wiring board 102, photosensitive core
Piece 103 is with lens subassembly 104.
Wherein, stiffening plate 101 can be metal material, illustrate but do not limit, and be implemented as obtaining by techniques such as punching presses
The metal products such as steel disc.The stiffening plate 101 has high flatness, is being played to camera module outside support fixed function,
Main can be that sensitive chip 103 and lens subassembly 104 provide a very smooth reference plane, sensitive chip 103 and thoroughly
Mirror assembly 104 is installed based on the reference plane, can greatly reduce assembling tolerance.
The number of wiring board 102 is unrestricted, and the camera module that this embodiment provides includes 1 wiring board 102, is opened up
There are at least one void region 107 and at least one location hole 106, and is attached at the upper surface of stiffening plate 101.Void region
107 be the region for penetrating wiring board 102, and for being embedded in sensitive chip 103, shape is unrestricted.Location hole 106 is implemented as leading to
Hole, this can have internal thread to the through-hole, play restriction effect to the positioning column on lens subassembly 104,106 quantity of location hole can be with
It is limited to 1,2,3,4, it is even more.
Sensitive chip 103 can be charge coupled cell (CCD), can also be metal oxide semiconductor device
(CMOS), the number of sensitive chip 103 is arranged according to demand, i.e., the number of sensitive chip 103 can be 1,2, even more
It is more.In camera module, sensitive chip 103 is embedded into void region 107, and is attached to 101 upper surface of stiffening plate, photosensitive core
Piece 103 is electrically connected on wiring board 102, and realization sensitive chip 103 is conducted with wiring board 102.
Lens subassembly 104 refers to the component for having light transmission function, includes at least camera lens and filter element.The lens subassembly
104 include at least one positioning column 105 corresponding with location hole 106, and in camera module, positioning column 105 passes through wiring board 102
On location hole 106 be fitted in 101 upper surface of stiffening plate so that 104 bottom surface of lens subassembly be bonded assist side 102 on, realize
Installation to lens subassembly 104, the camera lens and the filter element are sequentially located on the photosensitive path of the sensitive chip.
In camera module, sensitive chip 103 and lens subassembly 104 are on the basis of the extremely flat stiffening plate in surface 101
Face is installed on 101 surface of stiffening plate so that optical axis coincidence or the presence of the camera lens optical axis and sensitive chip 103 of lens subassembly 104
Spacing in certain spacing range reduces the assembling tolerance of sensitive chip and lens subassembly, and then improves the optics of camera module
Performance.
Preferably, the lens subassembly 104 includes the equal two or more positioning column 105 of height.That is lens subassembly 104
The height of all positioning columns 105 it is equal, after positioning columns 105 all in this way pass through corresponding location hole 106, the bottom of positioning column 105
Face is fitted in reinforcement plate surface, and lens subassembly 104 and reinforcement plate surface can be kept horizontal, avoid inclining for lens assembly 104
Tiltedly.
It should be noted that 105 identical of height of two or more positioning column of the present invention is for example, not representing this
The certain equal height of the corresponding positioning column 105 of invention, it will be appreciated by those skilled in the art that at least height such as two positioning columns 105, only
In order to ensure camera lens optical axis and chip inclined light shaft control errors are in a certain range.105 size relationship of positioning column of the present invention is not right
The present invention is construed as limiting, i.e., the present invention be more focused on by 105 lower surface of the positioning column and the sensitive chip 103 be all with
Face is attached or/and is assembled on the basis of 101 upper surface of the stiffening plate, that is, is based on same reference plane.
Wherein, at least one positioning column is distributed on the lens subassembly 104, specifically, the described two and above positioning
Column 105 is symmetrically distributed in the lens subassembly 104, and two or more location hole corresponding with the positioning column 105 106 symmetrically divides
It is distributed in the wiring board 102.Citing, the positioning column 105 can central symmetry or axial symmetry be distributed on lens subassembly, install
When, it may make the gravity of lens module 104 to be evenly distributed on above-mentioned multiple positioning columns 105, can be that camera module 104 provides
More stable support, to keep camera module 104 to provide safeguard with 101 level of stiffening plate.
Specifically, in a pre-installation, according to the number of the positioning column 105 on lens subassembly 104 and position, assist side 102
Corresponding position, be opened in positioning column 105 cooperation location hole.To improve support and guarantor of the positioning column 105 to lens subassembly 104
The effect of holding, in the positioning column 105 after the location hole is attached at 101 surface of the stiffening plate, in the positioning column 105
Increase adhesive between the location hole, to more stably play positioning action to lens subassembly, i.e., more stably keeps
Lens subassembly 104 is horizontal with stiffening plate 101.
In camera module provided in this embodiment, sensitive chip 103 and lens subassembly 104 are with the extremely flat reinforcement in surface
Face is installed on 101 surface of stiffening plate on the basis of plate 101, and during the installation process, the number of positioning column 105, arrangement mode and
Cooperation with location hole 106 is that the face installation on the basis of stiffening plate 101 of lens subassembly 104 provides stable guarantee, greatly
Reduce assembling tolerance.In addition, entirety of the lens subassembly 104 as an assembling tolerance qualification in the present embodiment, it will be traditional
Multiple assembling steps reduce to two assembling steps in assembling process, further reduced the accumulation of assembling tolerance, so that it is guaranteed that
The assembly precision of camera module.
It is noted that lens subassembly 104 needs separated multiple tracks technique to go to assemble in tradition assembling, then ensure optical axis
Optical property ensures the parameters such as inclined light shaft degree, swing.But in the present invention, the lens subassembly 104 is according to photosensitive core
The demand of piece or/and module goes to design, and is assembled into an entirety.It can make producing line in process of production in the present invention,
It without individually assembling with imported components to all parts, and need to only test to assembled lens subassembly 104, verify its optics
Whether performance meets demand.
Embodiment 2
On the basis of embodiment 1, the present embodiment provides a kind of camera module, which includes stiffening plate, circuit
Plate, sensitive chip and lens subassembly, wherein stiffening plate, wiring board and sensitive chip are same as Example 1, no longer superfluous herein
It states.
Camera module provided in this embodiment is an auto-focusing module, wherein the lens subassembly includes：
Drive component, the driving component includes the actuator of pedestal, camera lens carrier and driving camera lens movement, described
One surface of pedestal carries an outwardly extending at least positioning column；
Camera lens, the camera lens are installed on the camera lens carrier of the driving component；
Filter element is installed on the pedestal of the driving component；
The camera lens is sequentially located at the photosensitive path of the sensitive chip with the filter element.
It is noted that in other embodiments of the invention, the driving component can not include camera lens carrier, i.e. camera lens
Lens barrel and the camera lens carrier are integrated.
Specifically, filter element is optical filter, and the camera lens is sequentially located at the sensitive chip with the filter element
On photosensitive path, it can be understood as the optical axis coincidence of camera lens optical axis and sensitive chip, the light of filter element optical axis and sensitive chip
Overlapping of axles.The coincidence that the present invention mentions can be understood as overlapping or there are certain gaps, such as sensitive chip optical axis and camera lens
There are certain gap, which in a certain range, meets entire lens for optical axis coincidence or sensitive chip optical axis and camera lens optical axis
The optical performance requirements of component.It is noted that the pedestal should have avoiding space, so that the actuator draws
Foot can be connected by the avoiding space in wiring board.
In a variant embodiment of the invention, the pin of the actuator is integrally formed with the positioning column, the positioning
When column passes through the wiring board, actuator is made to be conducted with the wiring board.Specifically, the conducting wire or copper of actuator are launched in advance
The conductive materials such as column are in positioning post mold, and when moulding by casting positioning column, conducting wire or copper post are coated in positioning column, installation
When, actuator passes through wiring board by positioning column conductance.In this way, positioning column has positioning action, and there is conducting function.
Specifically, the pin can be exposed to the positioning column side wall, when the positioning column passes through the location hole, with the circuit
Conducting is realized in the line layer contact of plate.
After the positioning column passes through the correspondence location hole of wiring board, bottom surface fits in reinforcement plate surface so that drive component bottom
Seat is attached on wiring board, and sensitive chip optical axis is with lens subassembly optical axis coincidence or there are the spacing in certain spacing range, drops
The assembling tolerance of low sensitive chip and lens subassembly, and then improve the optical property of camera module.It is worth one to say, it is described
Mirror assembly fixation is should be, and by adhesive bonding in the PCB surface, can impose one on the wiring board in advance
Adhesive, it is to be understood that when imposing described adhesive, preferably to avoid the location hole.Can also be, it is described
Mirror assembly position is with fixation, then imposes adhesive and be fixed.
In detail, the driving component can be regarded as integrated motor, and the camera lens is installed in the integrated motor,
Bottom surface is pasted with the filter element that optical axis is overlapped with camera lens optical axis, and the bottom surface of the integrated motor, which also carries, to extend outwardly
An at least positioning column.I.e. it is understood that the driving component can attach the color-filter element (without additional setting placement
The pedestal of color-filter element), one or more positioning columns are integrally extended downwardly along integrated motor bottom surface, it is preferable that positioning column
To be multiple, each positioning column has an identical height, and distribution according to certain rules for example, when even number can select it is symmetrical.
When installation, after which passes through the correspondence location hole of wiring board, bottom surface fits in reinforcement plate surface so that drive component pedestal
It is attached on wiring board, sensitive chip optical axis is with lens subassembly optical axis coincidence or there are the spacing in certain spacing range, reduces
The assembling tolerance of sensitive chip and lens subassembly, and then improve the optical property of camera module.
When drive component is integral type motor, integrated motor had both been used to install camera lens, was also used for installation filter element.
It is noted that when camera lens is arranged at motor carrier, camera lens optical axis can be with the bottom surface of motor carrier or integrated motor
Center overlaps, can also be such as angled with the bottom center of motor carrier or integrated motor at other positions relationship.
For example, when positioning column is three or more, the ground can be understood as the face that multiple positioning column lower surfaces are formed.Work as camera lens
When optical axis is with the bottom center of motor carrier or integrated motor at other positions relationship, it can be understood as, lens subassembly is
Lens subassembly is integral supplied materials, each light-transmitting component component should assemble by one semi-finished product in module group assembling technique
It completes, i.e., camera lens, motor, color-filter element and positioning column relative position are fixed, in this way during follow-up assembling, lens
Each component in component ensures light-transmitting component precision without being individually adjusted by itself assembly precision of each component.
Wherein, the pin of the integrated motor is integrally formed with the positioning column, and the positioning column passes through the circuit
When plate, integrated motor is made to be conducted with the wiring board.Specifically, conducting wire or the copper post etc. for launching integrated motor in advance are led
Electric material is in positioning post mold, and when moulding by casting positioning column, conducting wire or copper post are coated in positioning column, when installation, one
Formula motor passes through wiring board by positioning column conductance.In this way, positioning column has positioning action, and there is conducting function.
In detail, the lens subassembly is the integrated integrated motor of the driving component, camera lens and filter element,
The bottom surface of the integrated motor also carries an outwardly extending at least positioning column.I.e. it is understood that multiple positioning columns are along one
Body formula motor bottom surface integrally extends downwardly, and each positioning column has identical height, is distributed according to certain rules, citing but does not limit pair
Claim distribution etc., can also be wherein threaded in separate embodiment.When installation, which passes through the correspondence location hole of wiring board
Afterwards, bottom surface fits in reinforcement plate surface so that integrated motor pedestal is attached on wiring board, sensitive chip optical axis and integral type
Motor optical axis coincidence or there are the spacing in certain spacing range, the assembling for reducing sensitive chip and super integrated motor is public
Difference, and then improve the optical property of camera module.
Wherein, the pin of the integrated motor is integrally formed with the positioning column, and the positioning column passes through the circuit
When plate, integrated motor is made to be conducted with the wiring board.
Embodiment 3
On the basis of embodiment 1, the present embodiment provides a kind of camera module, which includes stiffening plate, circuit
Plate, sensitive chip and lens subassembly, wherein stiffening plate, wiring board and sensitive chip are same as Example 1, no longer superfluous herein
It states.
Camera module provided in this embodiment is a fixed-focus module, wherein the lens subassembly includes：
Pedestal, one surface of the pedestal carry an outwardly extending at least positioning column；
Filter element, the filter element are set to the other end opposite with positioning column of the pedestal；
Camera lens, the camera lens are set to the pedestal；
The camera lens is sequentially located at the photosensitive path of the sensitive chip with the filter element.
Specifically, filter element is optical filter, and the camera lens is sequentially located at the sensitive chip with the filter element
On photosensitive path, it can be understood as the optical axis coincidence of camera lens optical axis and sensitive chip, the light of filter element optical axis and sensitive chip
Overlapping of axles.The coincidence that the present invention mentions can be understood as overlapping or there are certain gaps, such as sensitive chip optical axis and camera lens
There are certain gap, which in a certain range, meets entire lens for optical axis coincidence or sensitive chip optical axis and camera lens optical axis
The optical performance requirements of component.
In this embodiment, susceptor surface carries the multiple positioning columns integrally extended downwardly, multiple positioning column height phase
Deng, according to certain rules distribution citing but do not limit symmetrical etc., wherein in separate embodiment, can also be set outside positioning column
There is screw thread.After the positioning column passes through the correspondence location hole of wiring board, bottom surface fits in reinforcement plate surface so that drive component pedestal
Be attached on wiring board, sensitive chip optical axis overlapped with lens subassembly optical axis (namely filter element optical axis, camera lens optical axis) or
There are the spacing in certain spacing range.Sensitive chip and lens subassembly are reduced using the extremely flat stiffening plate in surface as reference plane
It is installed, since each positioning column holding of lens subassembly flushes, and the ground of each positioning column is generally aligned in the same plane, it is ensured that
The installation accuracy of light-transmitting component reduces the assembling tolerance of sensitive chip and lens subassembly, and then improves the optical of camera module
Energy.
In Examples 1 to 3, in order to further decrease camera module height, wiring board further includes an electronic component, should
Electronic component is arranged at wiring board surrounding, encounters color-filter element to prevent the electronic component.It is noted that electric
Sub- component is arranged at wiring board surrounding, can also reduce color-filter element to wiring board distance, to reduce camera module
Size.
Embodiment 4
On the basis of Examples 1 to 3, camera module provided in this embodiment is array camera module, such as double takes the photograph mould
Group, three take the photograph module.The camera module is double when taking the photograph module, including a stiffening plate, and one opens up that there are two void regions
Wiring board or two wiring boards for offering a void region, two sensitive chips and two lens subassemblies, the wiring board
It is attached at the stiffening plate, described two sensitive chips are attached at the stiffening plate by two void regions, described two
Positioning column on mirror assembly passes through the location hole on the wiring board to be fitted in the stiffening plate upper surface, to realize to two thoroughly
The fixation of mirror assembly.
When the camera module takes the photograph module for three, including a stiffening plate, a circuit opened up there are three void region
Plate or three wiring boards for offering a void region or open up there are one void region wiring board and one open up there are two
The wiring board of void region, three sensitive chips and three lens subassemblies, the wiring board is attached at the stiffening plate, described
Three sensitive chips are attached at the stiffening plate, at least three positioning on three lens subassemblies by three void regions
Column passes through the location hole on the wiring board to be fitted in the stiffening plate upper surface, to realize the assembling to three lens subassemblies.
For array camera module, when assembling, the optical axis between each camera module is adjusted, so that light shaft coaxle, work
Skill is complicated.And in the present embodiment, sensitive chip and light-transmitting component are based on stiffening plate and are assembled, it can be ensured that array images mould
The optical axis of multiple camera modules of group is parallel, need not additionally be adjusted again, and process complexity is reduced.
Embodiment 5
The present embodiment provides a kind of preparation methods of the camera module in Examples 1 to 4, include the following steps：
Stiffening plate, sensitive chip, the wiring board for offering void region and location hole are provided, and with the saturating of positioning column
Mirror assembly；
The wiring board is bonded in the stiffening plate；
The sensitive chip is placed in the void region of the wiring board, and is attached at the reinforcement plate surface and is connected
In the wiring board；
The lens subassembly is installed in face on the basis of the reinforcement plate surface, and the positioning column of the lens subassembly is across described
Location hole on wiring board is bonded the reinforcement plate surface, so that the lens subassembly is fixed on the wiring board, completes camera shooting
The assembling of module.
In the assemble method of camera module, lens subassembly and the sensitive chip face on the basis of reinforcement plate surface pass through
Stiffening plate surface smoothness controls the installation of lens subassembly and sensitive chip, so that the optical axis of lens subassembly and sensitive chip
Optical axis position overlaps or in a certain range, reduces assembling tolerance, in addition, saturating using the almost nil integral type of assembling tolerance
Mirror assembly, i.e., the described integral type lens subassembly meet module group assembling demand, and multiple assembling steps lower during tradition is assembled
To two assembling steps, the accumulation of assembling tolerance is further reduced, ensures that the assembly precision of camera module.
To keep light-transmitting component firm in the circuit board, the assemble method further includes：
Before the lens subassembly is mounted, the region coating adhesive of the lens subassembly is installed in the circuit board.
Specifically, the adhesive of coating should avoid location hole；Such as location hole is implemented as four, is located at wiring board
Four corners, then adhesive should be coated between four turnings.
Wherein, the assemble method further includes：
After the lens subassembly is mounted, application of adhesive is mended between the wiring board and the lens subassembly.It is logical
It crosses coating adhesive and further fixes light-transmitting component in wiring board, and seal sensitive chip.
It is noted that the present invention is in advance to be completed lens subassembly, then it is positioned over wiring board, forms camera shooting mould
Group.Therefore, lens subassembly will ensure assembly precision in an assembling process, should be at least certain position column during lens subassembly
Bottom surface is formed by face on the basis of plane, i.e. the positioning column of lens subassembly is placed on a reference plane, then removes adjustment, fixed lens
Drive component in lens subassembly.
Wherein it is possible to according to Lens parameter adjustment camera lens, such as in process engineering, lens parameters such as optical axis drives
In dynamic component for carrier dimensions of camera lens etc. are installed it is known that therefore only need to be provided with a mark, camera lens is adjusted by the mark, is made
It obtains camera lens and is installed on drive component with meeting demand.
Wherein, camera lens can also be adjusted according to sensitive chip, specially：Camera lens is opened by the sensitive chip of test
Figure goes adjustment camera lens in the position of drive component, so that the lens group that lens assembling is formed in drive component according to figure is opened
Part meets the requirements.
In another embodiment, the camera lens can be pre-assembled in the carrier of the integrated motor, wherein described
Camera lens has at least one adjustable eyeglass, makes the lens assembling in the integrated motor by adjusting the adjustable eyeglass
Lens subassembly after carrier meets module group assembling demand.Wherein, the adjustment of adjustable eyeglass can be by will be pre-assembled described
Mirror assembly tests its optical property by testing sensitive chip, is realized mostly certainly to the adjustment eyeglass by test result
By the adjustment spent, such as the multiple degrees of freedom adjustment such as horizontal, vertical, rotation, inclination.
When the lens subassembly is made of integrated motor and camera lens, the positioning column on integrated motor passes through the line
Location hole on the plate of road is bonded the reinforcement plate surface, after keeping integrated motor to stablize, the camera lens is adjusted and is fixed, with
Make camera lens optical axis and sensitive chip optical axis coincidence.
It is noted that above-mentioned assemble method be to provide it is a kind of by stiffening plate, sensitive chip, wiring board and lens group
The method that part is assembled into camera module does not limit the number of stiffening plate, sensitive chip, wiring board and lens subassembly, according to
The type of camera module, stiffening plate, sensitive chip, wiring board and lens subassembly number adjust accordingly.In addition to this, line
The number and state (arrangement position, shape and height) of the positioning column on location hole and lens subassembly on the plate of road are all in accordance with taking the photograph
It is adjusted as module does adaptation, it is unrestricted.
Embodiment 6
On the basis of Examples 1 to 5, the present embodiment provides a kind of electronic equipment, including times that Examples 1 to 5 provides
Meaning camera module.The electronic equipment can be able to be energy with mobile terminal, such as mobile phone, tablet computer, laptop, POS machine
The equipment enough installed camera module and be made of electronic components such as integrated circuit, transistor, electron tubes.The electronic equipment by
In with above-mentioned camera module, high quality graphic can be obtained.
Technical scheme of the present invention and advantageous effect is described in detail in above-described specific implementation mode, Ying Li
Solution is not intended to restrict the invention the foregoing is merely presently most preferred embodiment of the invention, all principle models in the present invention
Interior done any modification, supplementary, and equivalent replacement etc. are enclosed, should all be included in the protection scope of the present invention.
Claims (14)
1. a kind of camera module, which is characterized in that including；
One stiffening plate；
An at least wiring board, the wiring board have at least a void region and at least a positioning hole, are attached at the stiffening plate
Surface；
An at least sensitive chip, the sensitive chip are attached at the stiffening plate table by the void region on the wiring board
Face；
An at least lens subassembly, the lens subassembly include an at least positioning column corresponding with the location hole, the positioning column
Location hole on the wiring board is fitted in the reinforcement plate surface, to realize the assembling to lens subassembly.
2. camera module as described in claim 1, which is characterized in that the lens subassembly include height it is equal two and with
Upper positioning column.
3. camera module as claimed in claim 2, which is characterized in that described two and be symmetrically distributed in upper positioning column described
Lens subassembly, two or more location hole corresponding with the positioning column are symmetrically distributed in the wiring board.
4. camera module as claimed in claim 3, which is characterized in that the lens subassembly includes：
Drive component, the driving component include the actuator of pedestal, camera lens carrier and driving camera lens movement, the pedestal
One surface carries an outwardly extending at least positioning column；
Camera lens, the camera lens are installed on the camera lens carrier of the driving component；
Filter element is installed on the pedestal of the driving component；
The camera lens is sequentially located at the photosensitive path of the sensitive chip with the filter element.
5. camera module as claimed in claim 4, which is characterized in that the driving component is integral type motor, the one
The installation camera lens in formula motor, bottom surface is pasted with the filter element that optical axis is overlapped with camera lens optical axis, the integral type horse
The bottom surface reached also carries an outwardly extending at least positioning column.
6. camera module as claimed in claim 3, which is characterized in that the lens subassembly includes：
Pedestal, one surface of the pedestal carry an outwardly extending at least positioning column；
Filter element, the filter element are set to the pedestal；
Camera lens, the camera lens are set to the pedestal；
The camera lens is sequentially located at the photosensitive path of the sensitive chip with the filter element.
7. camera module as claimed in claim 4, which is characterized in that the pin of the actuator and the positioning column one at
Type makes actuator be conducted with the wiring board when positioning column passes through the wiring board.
8. camera module as claimed in claim 5, which is characterized in that the pin of the integrated motor and the positioning column one
It is body formed, when the positioning column passes through the wiring board, integrated motor is made to be conducted with the wiring board.
9. such as claim 1~8 any one of them camera module, which is characterized in that the stiffening plate is metal material.
10. such as claim 1~8 any one of them camera module, which is characterized in that the camera module takes the photograph module to be double
When, including a stiffening plate, a wiring board or two circuits for offering a void region opened up there are two void region
Plate, two sensitive chips and two lens subassemblies, the wiring board are attached at the stiffening plate, and described two sensitive chips are logical
It crosses two void regions and is attached at the stiffening plate, the positioning column on described two lens subassemblies passes through to be determined on the wiring board
Position hole is fitted in the stiffening plate upper surface, to realize the assembling to two lens subassemblies.
11. a kind of assemble method of camera module, includes the following steps：
Stiffening plate, sensitive chip, the wiring board for offering void region and location hole, and the lens group with positioning column are provided
Part；
The wiring board is bonded in the stiffening plate；
The sensitive chip is placed in the void region of the wiring board, and is attached at the reinforcement plate surface and is connected in institute
State wiring board；
The lens subassembly is installed in face on the basis of the reinforcement plate surface, and the positioning column of the lens subassembly passes through the circuit
Location hole on plate is bonded the reinforcement plate surface, so that the lens subassembly is fixed on the wiring board, completes camera module
Assembling.
12. the assemble method of camera module as claimed in claim 11, which is characterized in that the assemble method further includes：
Before the lens subassembly is mounted, the region coating adhesive of the lens subassembly is installed in the circuit board.
13. the assemble method of the camera module as described in claim 11 or 12, which is characterized in that the assemble method also wraps
It includes：
After the lens subassembly is mounted, application of adhesive is mended between the wiring board and the lens subassembly.
14. a kind of electronic equipment, which is characterized in that including such as claim 1~10 any one of them camera module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892173.7A CN108769495A (en) | 2018-08-07 | 2018-08-07 | A kind of camera module and assemble method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892173.7A CN108769495A (en) | 2018-08-07 | 2018-08-07 | A kind of camera module and assemble method and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108769495A true CN108769495A (en) | 2018-11-06 |
Family
ID=63969124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810892173.7A Pending CN108769495A (en) | 2018-08-07 | 2018-08-07 | A kind of camera module and assemble method and electronic equipment |
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| Country | Link |
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| CN (1) | CN108769495A (en) |
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| CN110062902A (en) * | 2019-03-04 | 2019-07-26 | 深圳市汇顶科技股份有限公司 | Modular structure and electronic equipment |
| CN111050057A (en) * | 2020-01-03 | 2020-04-21 | 昆山丘钛微电子科技有限公司 | Camera module and electronic product |
| CN111770256A (en) * | 2020-07-20 | 2020-10-13 | 福州鑫图光电有限公司 | Parallelism adjusting structure for scientific grade CMOS camera |
| CN111796471A (en) * | 2019-04-09 | 2020-10-20 | 格科微电子（上海）有限公司 | Auto-focusing motor and assembling method thereof |
| CN111935384A (en) * | 2020-08-28 | 2020-11-13 | 昆山丘钛微电子科技有限公司 | Photosensitive assembly, camera module, terminal equipment and preparation method |
| CN114340153A (en) * | 2020-09-30 | 2022-04-12 | 宁波舜宇光电信息有限公司 | Circuit board assembly, camera module, terminal equipment and manufacturing method of circuit board assembly |
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