TWI731060B - Split type array camera module and its assembling and application method - Google Patents

Abstract

A split array camera module and its assembling method. The module includes a plurality of sub-modules and a Assemble the bracket. One of the multiple sub-modules is a reference module, and the remaining sub-modules are calibration modules. The reference module and each calibration module are assembled on the assembly bracket respectively, wherein the reference module and each calibration module are independent and qualified single camera modules.

Description

Split type array camera module and its assembling and application method

The present invention relates to a camera module, in particular to a split array camera module, which is suitable for mobile terminals to improve production efficiency and yield, and in particular to improve resource utilization.

With the development of technology, smart portable devices can be said to have become indispensable devices for people in modern times. Among them, a mobile phone or a tablet computer is a very common situation.

In particular, due to advances in technology, the quality of the camera functions in smart portable devices has been continuously improved. Therefore, people are gradually using cameras in smart portable devices to replace traditional cameras to record their daily habits. In particular, with the continuous evolution of various hardware specifications, mobile phone cameras have replaced most of the camera market, but professional cameras with large lenses can collect more light information than mobile phones with small lenses. Therefore, professional cameras The quality of the shots is in principle better than that of a small-lens mobile phone camera. However, because of the lens size, weight and price of a professional camera, it is very difficult to apply the lens of a professional camera to a portable mobile phone.

Especially in 2014, as Yulong released a dual-camera smart phone, the camera module entered the dual-camera era. Therefore, an array camera module can be constructed using multiple small lenses to replace a single bulky and expensive professional camera lens for smart portable devices.

With the development of dual-camera and multi-camera application technology, its advantages are increasingly valued by mobile phone terminal manufacturers or consumer electronics manufacturers, especially for portable electronic products such as mobile phones and digital cameras, and in terms of weight and price. It is also very competitive.

It is worth mentioning that optical zoom has always been the exclusive function of SLR cameras. In the mobile phone camera industry, it has always been expected that the function of optical zoom can be transplanted into mobile phones, narrowing the gap with SLR cameras, and truly replacing its camera status.

In the process of mobile phone camera technology development, cameras with optical zoom function have also appeared. Most of these cameras realize the zoom function by changing the distance between the lenses. The fatal flaw of this type of camera is that it has poor resistance to mechanical stress and cannot be used by terminal mobile phone manufacturers. Accepted by consumer electronics manufacturers.

However, the realization of the zoom function by freely switching between cameras of different focal lengths avoids this biggest problem. The lens and lens structure of this type of design is completely the same as that of ordinary mobile phone cameras, enabling the optical zoom function to be realized on mobile phones.

However, the current array camera modules on the market have the problem of low yield during manufacturing, which undoubtedly increases the production and manufacturing cost of the product, because usually one camera (or lens) in the array camera module is defective. That will lead to the scrapping of the entire array camera module, and the technical tolerance capability and material level of the manufacturing process completely determine the optical axis angles of multiple cameras.

Because the concept of the so-called array camera module in the design is to use multiple lenses to collect image information and process a large amount of information to form an image. When one of the lenses has an optical discrepancy, mechanical positioning error or Electronic noise and other problems will cause the entire array of camera modules to be unable to produce a complete and clear image, resulting in waste of process time and cost.

In addition, there are also related products that apply prisms to camera modules on the market today. For example, Chinese patent CN201480051999.0 discloses a mirror tilt actuation, which is provided with a plurality of lens groups and mirrors and a base supporting the mirror. .

According to this patent, different pivots are used to support the mirror, and elements such as magnets, FP coils, Hall sensors, and springs are used to control the mirror to avoid jitter during use. However, the result of the tilting actuation of the mirror is complicated, the number of parts is large, and the manufacturing and maintenance are complicated.

An object of the present invention is to provide a split array camera module and its assembly and application method, wherein the single camera module in the split array camera module completes the manufacturing, assembly and testing processes independently, and does not occupy each other's assembly and testing time. That is to say, the manufacturing, assembly and testing of the single camera module do not need to be different from the conventional module production form, and there is no need for a private special process station, so as to improve production efficiency and make production resources highly utilized.

Another object of the present invention is to provide a split array camera module and its assembling and application method, wherein after the performance test of the single camera module is qualified, the split array camera module is assembled, which greatly improves The yield rate of the finished product of the split-array camera module is measured.

Another object of the present invention is to provide a split array camera module and its assembling and application method, in which the method of automatically adjusting the optical axis can solve the problem of non-parallelism of the optical axis caused by the tilt of the optical axis in the process, and reduce it to a certain extent. The poor ratio in the depth calibration of dual-camera and multi-camera modules has improved the practical application effects of dual-camera and multi-camera modules with a common substrate and common lens mount.

Another object of the present invention is to provide a split array camera module and its assembly and application method. The single camera module uses a conventional lens. Compared with the optical zoom design principle of a single-lens reflex lens, the dual optical zoom camera is undoubtedly simple Many, no complicated optical path design is required.

Another object of the present invention is to provide a split array camera module and its assembling and application method, in which single camera modules with different FOVs are used, so that compared with the manufacturing process of a SLR lens In other words, the array combination of single camera modules with different FOVs is relatively simple, and therefore the manufacturing capacity challenge for mobile phone camera manufacturers is minimal. Furthermore, the combination of single camera modules with different FOVs is the key to realizing optical zoom, and the smooth switching between single camera modules with different focal lengths achieves the zoom experience effect.

Another object of the present invention is to provide a split array camera module and its assembling and application method, in which multiple single camera modules are combined by an assembly bracket to improve the yield and reliability. In addition, the assembly bracket is made of high-hardness and high-strength materials to ensure that the positional relationship between the single camera modules is not affected by external forces. In other words, general dual-camera modules are easily affected by external forces to change parallax during transportation and installation. Most of the optical zoom algorithms developed for dual-camera have strict requirements on the parallax of the dual-camera module. Therefore, the assembly The bracket can effectively ensure the parallax capability of the split array camera module.

Another object of the present invention is to provide a split array camera module and an assembly and application method thereof, in which the gyroscope can be placed according to the spatial structure of the actual terminal product. In other words, the placement of the gyroscope can be flexibly adjusted according to the spatial difference of the mobile phone installation structure.

In order to achieve at least one of the above objectives, the present invention provides a split array camera module, including: a plurality of sub-modules, at least one of which is a reference module, and the remaining sub-modules are calibration modules; and an assembly A bracket, wherein the reference module and each calibration module are assembled on the assembly bracket respectively, and the reference module and each calibration module are independent and qualified single camera modules.

According to an embodiment of the present invention, the reference module is an adjustable focus camera module or a fixed focus camera module.

According to an embodiment of the present invention, the calibration module is an adjustable focus camera module or a fixed focus camera module.

According to an embodiment of the present invention, the assembly bracket has at least one reference unit and at least one calibration unit, wherein the reference module and the calibration module are respectively assembled in the reference unit and the calibration unit of the assembly bracket.述calibration unit.

According to an embodiment of the present invention, the module center distance between the calibration module and the reference module is 1-100 mm.

According to an embodiment of the present invention, the circumferential assembly gap between the reference module and the reference unit is 0.01-1 mm, and the circumferential assembly gap between the calibration module and the calibration unit is 0.03-3 mm.

According to an embodiment of the present invention, the reference module further includes at least one reference lens, at least one reference driver, and at least one reference photosensitive chip, wherein the reference lens is located on the photosensitive path of the reference photosensitive chip, and the reference The lens is mounted on the reference drive.

According to an embodiment of the present invention, the calibration module further includes at least one calibration lens and one at least calibration photosensitive chip, wherein the calibration lens is located in the photosensitive path of the calibration photosensitive chip.

According to an embodiment of the present invention, the reference module further includes at least one reference base and at least one reference substrate, wherein the reference photosensitive chip is electrically connected to the reference substrate, and the reference base is disposed on the reference substrate. On the substrate, the reference driver is mounted on the reference base.

According to an embodiment of the present invention, the calibration module further includes at least one calibration base and at least one calibration substrate, wherein the calibration photosensitive chip is electrically connected to the calibration substrate. The calibration base is arranged on the calibration substrate.

According to an embodiment of the present invention, the split-array camera module includes at least one common base, the reference module further includes at least one reference substrate, and the calibration module further includes at least one calibration substrate, wherein the The reference photosensitive wafer is electrically connected to the reference substrate, the calibration photosensitive wafer is electrically connected to the calibration substrate, and the common base is disposed on the reference substrate and/or the calibration substrate.

According to an embodiment of the present invention, it includes at least one common base and at least one common substrate, wherein the reference photosensitive chip and the calibration photosensitive chip are electrically connected to the common substrate, and the common base is disposed on the common substrate. On the substrate, the reference driver and the calibration lens are both mounted on the common base.

According to an embodiment of the present invention, a gyroscope is included, which is disposed on the reference substrate of the reference module.

According to an embodiment of the present invention, a gyroscope is included, which is disposed on the calibration substrate of the calibration module.

According to an embodiment of the present invention, a gyroscope is included, which is electrically connected to the reference module and disposed on the common substrate.

According to an embodiment of the present invention, a gyroscope is included, which is electrically connected to the calibration module and disposed on the common substrate.

According to an embodiment of the present invention, the reference driver is selected from the group consisting of a motor, a thermal driver or a micro-actuator.

According to an embodiment of the present invention, the calibration module may further include a calibration driver, and the calibration lens is supported above the calibration driver.

According to an embodiment of the present invention, the reference module is implemented as a lens with a large field of view, and its FOV is generally between 60° and 220°, and the calibration module is implemented as a lens with a small field of view, and its FOV is generally Between 10°~90°. To achieve at least one of the above objectives, the present invention provides a split array camera module, which includes: at least one first camera module, at least one prism module, at least one second camera module, and at least one circuit board, wherein The first camera module and the prism module are arranged coplanar, the prism module and the second camera module are arranged concentrically on the optical axis, and the circuit board is connected to the second camera module.

According to an embodiment of the present invention, the prism module includes a prism unit and a prism base, and the prism unit is rotatably supported in the prism base.

According to an embodiment of the present invention, the second camera module includes at least one second lens, at least one second photosensitive chip, and at least one second substrate, wherein the second lens is located on the second photosensitive chip. The photosensitive path of the wafer, and the second photosensitive wafer is electrically connected to the second substrate.

According to an embodiment of the present invention, the second camera module includes at least one second driver, and the second lens is mounted on the second driver.

According to an embodiment of the present invention, the second camera module includes a camera housing, an anti-shake unit, and a support housing, wherein the camera housing, the second driver, the anti-shake unit, and the The supporting shells are arranged coaxially with each other.

According to an embodiment of the present invention, the first camera module includes at least one first lens, at least one first photosensitive chip, and at least one first substrate, wherein the lens is located in the photosensitive path of the photosensitive chip, The photosensitive chip is electrically connected to the substrate.

According to an embodiment of the present invention, the first camera module includes at least one first driver, and the first lens is mounted on the first driver.

According to an embodiment of the present invention, the prism unit mainly includes a prism housing, a prism, a prism holder, a support sleeve and a support shaft, the prism is fixedly arranged in the prism holder, and the support A shaft sleeve is fixedly installed at the lower part of the prism holder, the supporting shaft is rotatably installed in the supporting shaft sleeve, and the prism holder is arranged in the prism housing.

According to an embodiment of the present invention, glue is applied between the prism holder and the prism to adhere to each other.

According to an embodiment of the present invention, the prism housing is a rectangular frame with a bottom frame and two side frames, each of the two side frames is fixedly connected to the bottom frame at one end, and the other end is outward. The extended free end is provided with a connecting beam between the two free ends.

According to an embodiment of the present invention, the prism base has a first camera module accommodating cavity and a prism module accommodating cavity, wherein the first camera module is accommodated in the first camera module accommodating cavity, The prism unit is accommodated in the prism module accommodating cavity.

According to an embodiment of the present invention, the prism base includes an intermediate reinforcing plate extending through the prism base along a direction perpendicular to the length of the prism base and across the entire width of the prism base.

According to an embodiment of the present invention, the side wall of the first camera module accommodating cavity has a first opening for distributing the power/signal lines of the first camera module, wherein the prism module The side wall of the accommodating cavity has a second opening, which is used to provide an opening for controlling the power/control signal line of the prism.

According to an embodiment of the present invention, a connecting wall is provided on one side of the prism module accommodating cavity, and at least one positioning post or positioning hole is provided on the surface for precise positioning with the second camera module Connection.

According to an embodiment of the present invention, the camera housing has a housing part surrounding a hollow rectangular column, a front panel fixedly connected to one end of the housing part, and two recessed parts formed on the side surface of the housing part. Two connecting parts.

According to an embodiment of the present invention, the camera housing includes an optical axis opening and at least one positioning hole or positioning post, wherein the optical axis opening is provided in the center of the front panel, and the positioning hole or positioning post Set on the front panel.

According to an embodiment of the present invention, the positioning column is located in the positioning hole, and the free end and the connecting portion are matched with each other and fixedly connected to each other.

According to an embodiment of the present invention, wherein the first camera module is a wide-angle camera module, the second camera module is a zoom camera module, and the optical axis of the first camera module is connected to the second camera module. The optical axes of the camera modules are perpendicular to each other.

In order to achieve at least one of the above objectives, the present invention provides a method for assembling a split array camera module, which includes the following steps: (S11) at least one reference module of a split array camera module is assembled and fixed, that is, the reference module Assembled and fixed in a reference unit of an assembly bracket; (S12) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled to a calibration unit of the assembly bracket Inside; (S13) module height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and calibrating the corresponding height position of the calibration module; (S14) module offset Calibration, measuring the level position offset of each calibration module and the reference module, and calibrating the corresponding level offset position of the calibration module; (S15) module rotation calibration, setting a light source and a standard Board, light up the split-array camera module, take images of the target board, and collect images based on the reference module and each calibration module Use software to calculate the rotation calibration amount of each calibration module, and perform rotation position calibration on each calibration module; (S16) module offset inspection/calibration, and determine each Whether the offset of the horizontal position of the calibration module and the reference module is within the tolerance allowable range, if it is not within the tolerance range, do not calibrate, if it is not within the tolerance range, return to step (S13) to perform a new calibration on each of the calibration modules Height calibration, offset calibration, and rotation calibration until the horizontal position offset of each calibration module and the reference module is within the tolerance range; and (S17) fixing the module, fixing the entire component The body array camera module is assembled.

According to an embodiment of the present invention, the split-array camera module includes one or more sub-modules, at least one of the sub-modules is the reference module, and the remaining sub-modules are the calibration modules, The sub-modules are independent of each other and assembled in the assembly bracket.

According to an embodiment of the present invention, the reference module selects a sub-module with the highest image element in the split-array camera module.

According to an embodiment of the present invention, the reference module and the calibration module are both single camera modules that have been manufactured, assembled, and passed the performance test.

According to an embodiment of the present invention, the circumferential assembly gap between the reference module and the reference unit is 0.01-1 mm, and the circumferential assembly gap between the calibration module and the calibration unit is 0.01-3 mm.

According to an embodiment of the present invention, in step (S11), the step of assembling and fixing the reference module further includes: 1) Using a limit fixture to limit the reference module and the reference unit Assembling; and 2) drawing glue between the reference module and the reference unit, and curing the glue. According to an embodiment of the present invention, wherein the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure.

According to an embodiment of the present invention, in step (S13), the module height calibration specifically includes: 1) measuring the height of a point on the lens end face of the reference module and each calibration module, Respectively calculating the height difference of the lens end face of each calibration module and the reference module; and 2) adjusting the Z-axis displacement of each calibration module.

According to an embodiment of the present invention, in step (S14), the module offset calibration specifically includes: 1) Taking a picture of the lens end face of the reference module and each calibration module, and grabbing the lens For the end image, the horizontal position offset of each calibration module and the reference module is calculated by software; and 2) the X and Y axis displacements of each calibration module are adjusted.

According to an embodiment of the present invention, in step (S15), the center of the target is an MTF test target, and the four corners of the target contain four Mark points.

According to an embodiment of the present invention, in step (S15), the rotation calibration of each calibration module is realized by movement in the three spatial dimensions of U, V, and W, and the purpose is to make each calibration The optical axis of the module is parallel to the reference module.

According to an embodiment of the present invention, in step (S12), the pre-assembly step of the calibration module specifically includes: 1) Mounting and fixing the reference module and the assembly bracket to a module calibration platform On a fixed jig, the reference module is placed in the reference unit of the assembly bracket; 2) Install and fix the calibration module to a calibration jig, the calibration jig is set on a six-axis platform, the calibration module is placed in the calibration unit of the assembly bracket, the calibration mold The group can move with the six-axis platform in six spatial dimensions of X, Y, Z, U, V, and W; and 3) draw glue between the calibration module and the calibration unit, the glue It is a kind of UV thermosetting adhesive.

According to an embodiment of the present invention, in step (S17), the step of fixing the split-array camera module specifically includes: 1) UV exposure of the glue between the calibration module and the calibration unit , The glue is semi-cured; and 2) baking the split-type array camera module, the glue is completely cured, and the entire split-type array camera module is fixed.

According to an embodiment of the present invention, in step (S12), the pre-assembly step of the calibration module specifically includes: 1) Mounting and fixing the reference module and the assembly bracket to a module calibration platform On a fixed jig, the reference module is placed in the reference unit of the assembly bracket; and 2) the calibration module is installed and fixed on the calibration jig, the calibration jig is set on a six-axis platform The calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can move in six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform.

According to an embodiment of the present invention, in step (S17), the step of fixing the split-array camera module specifically includes: 1) drawing glue between the calibration module and the calibration unit, the glue Is a UV thermosetting adhesive; 2) UV-exposing the glue between the calibration module and the calibration unit, and the glue is semi-cured; and 3) Baking the split-type array camera module, the glue is completely cured, and the entire split-type array camera module is fixed.

According to an embodiment of the present invention, the baking temperature of the split-type array camera module in the oven is 50° C. to 200° C., and the baking time is 5 min to 600 min.

In order to achieve at least one of the above objectives, the present invention provides a method for assembling a split array camera module, which includes the following steps: (S11A) a reference module of a split array camera module is assembled and fixed, that is, the reference module Assembled and fixed in a reference unit of an assembly bracket; (S12A) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket (S13A) Module height/offset calibration, measuring the height difference of the lens end face and the horizontal position offset of each calibration module and the reference module, and calibrating the corresponding height position of the calibration module And the corresponding level offset position calibration; (S14A) module rotation calibration, set a light source and a target plate, light up the split array camera module, take pictures of the target plate and collect images according to the The reference module and the image collected by each calibration module are used to calculate the rotation calibration amount of each calibration module using software, and the rotation position calibration of each calibration module is performed; and (S15A ) The fixed module, which fixes the entire split-type array camera module to complete the assembly.

In order to achieve at least one of the above objectives, the present invention provides a split-type array camera module assembly method, which includes the following steps: (S11B) a reference module of a split-type array camera module is assembled and fixed, that is, the reference module Assembled and fixed in a reference unit of an assembly bracket; (S12B) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13B) module offset calibration, measuring each The leveling position offset between the calibration module and the reference module, the corresponding leveling offset position calibration of the calibration module; (S14B) the module height calibration, measuring each calibration module and the Refer to the height difference of the lens end face of the module to calibrate the corresponding height position of the calibration module; (S15B) the module rotates to calibrate, set a light source and a target plate, light up the split array camera module, The target plate captures images, and uses software to calculate the rotation calibration amount of each calibration module based on the images collected by the reference module and each calibration module, and compares the Each calibration module performs rotation position calibration; and (S16B) a fixed module to fix the entire split array camera module to complete the assembly.

In order to achieve at least one of the above objectives, the present invention provides a method for assembling a split array camera module, which includes the following steps: (S21) a reference module of a split array camera module is assembled and fixed, that is, the reference module Assembled and fixed in a reference unit of an assembly bracket; (S22) At least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket (S23) Module height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and calibrating the corresponding height position of the calibration module; (S24) Module offset calibration , Measure the level position offset of each calibration module and the reference module, and calibrate the corresponding level offset position of the calibration module; (S25) Module rotation calibration, set a light source and a target plate , The split-array camera module is lighted, and the target plate is photographed to acquire images, and the acquisition is obtained according to the reference module and each calibration module Use software to calculate the rotation calibration amount of each calibration module, and calibrate the rotation position of each calibration module; (S26) module offset calibration, measure each calibration module and Performing a corresponding horizontal offset position calibration on the calibration module according to the level offset of the reference module; and (S27) a fixing module, fixing the entire split array camera module to complete the assembly.

According to an embodiment of the present invention, the split-array camera module includes one or more sub-modules, one of the sub-modules is the reference module, and the remaining sub-modules are the calibration modules, so The sub-modules are independent of each other and assembled in the assembly bracket.

According to an embodiment of the present invention, the reference module and the calibration module are both single camera modules that have been manufactured, assembled, and passed the performance test.

According to an embodiment of the present invention, the reference module and the calibration module are respectively an adjustable focus camera module or a fixed focus camera module.

According to an embodiment of the present invention, the reference module is an adjustable focus camera module, and the calibration module is a fixed focus camera module.

According to an embodiment of the present invention, the circumferential assembly gap between the reference module and the reference unit is 0.01-1 mm, and the circumferential assembly gap between the calibration module and the calibration unit is 0.01-3 mm.

According to an embodiment of the present invention, the step of assembling and fixing the reference module further includes: 1) using a limit fixture to assemble the reference module and the reference unit with limit elements; and 2) Glue is drawn between the reference module and the reference unit to cure the glue.

According to an embodiment of the present invention, wherein the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure.

According to an embodiment of the present invention, the module height calibration specifically includes: 1) Using a laser ranging method to measure the height of a point on the lens end face of the reference module and each calibration module Calculate the height difference of the lens end face of each calibration module and the reference module respectively; and 2) adjust the Z-axis displacement of each calibration module through the six-axis platform.

According to an embodiment of the present invention, the module offset calibration specifically includes: 1) CCD shooting the lens end face of the reference module and each calibration module, capturing the lens end face image, and using The software separately calculates the horizontal position offset of each calibration module and the reference module; and 2) adjusts the X and Y axis displacement of each calibration module through the six-axis platform.

According to an embodiment of the present invention, the center of the target is an MTF test target, and the target contains 2-20 Mark points.

According to an embodiment of the present invention, the rotation calibration of each calibration module is realized by the movement of the six-axis platform in the three spatial dimensions of U, V, W, and the purpose is to make each calibration module The group is parallel to the optical axis of the reference module.

According to an embodiment of the present invention, the pre-assembly step of the calibration module specifically includes: 1) installing and fixing the reference module and the assembly bracket to a fixture of a module calibration platform; The reference module is placed in the reference unit of the assembly bracket; 2) the calibration module is installed and fixed to a calibration jig, the calibration jig is set on a six-axis platform, and the calibration mold The group is placed in the calibration unit of the assembly bracket, and the calibration module can move in six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform; and 3) in the Glue is drawn between the calibration module and the calibration unit, and the glue is a UV thermosetting glue.

According to an embodiment of the present invention, the step of fixing the split-array camera module specifically includes: 1) UV-exposing the glue between the calibration module and the calibration unit, and the glue is semi-cured And 2) baking the split-type array camera module, the glue is completely cured, and the entire split-type array camera module is fixed.

According to an embodiment of the present invention, the pre-assembly step of the calibration module specifically includes: 1) installing and fixing the reference module and the assembly bracket to a fixture of a module calibration platform; The reference module is placed in the reference unit of the assembly bracket; and 2) the calibration module is installed and fixed to a calibration jig, the calibration jig is set on a six-axis platform, and the calibration The module is placed in the calibration unit of the assembly bracket, and the calibration module can move in six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform.

According to an embodiment of the present invention, the step of fixing the split-array camera module specifically includes: 1) drawing glue between the calibration module and the calibration unit, and the glue is a UV thermosetting glue; 2) UV exposure is performed on the glue between the calibration module and the calibration unit, and the glue is semi-cured; and 3) the split-array camera module is baked, and the glue is completely cured and fixed The entire split type array camera module.

According to an embodiment of the present invention, the baking temperature of the split-type array camera module in the oven is 50° C. to 200° C., and the baking time is 5 min to 600 min.

1: Reference module, first camera module

2: Calibration module, prism module

3: The second camera module

4: circuit board

M1: MTF test pattern

2M: Fixed focus camera module

13M: Adjustable focus camera module

10: Assemble the bracket

11: Reference lens

12: Reference drive

13: Reference photosensitive chip

14: Reference base

15: Reference substrate

20: Common base

21: Calibrate the lens

22: Calibrate the drive

23: Calibrate the photosensitive chip

24: Calibration base

25: Calibration substrate

30: Common substrate, limit fixture

40: Gyroscope

100A: the first shot

101: Reference bracket unit

102: Calibration bracket unit

201: Prism unit

200A: photosensitive wafer

300A: first drive

301: first groove

302: second groove

400A: first substrate

401: Fixed fixture

402: Calibration Fixture

403: Module Calibration Platform

S11: Reference module assembly and fixing

S12: Calibration module pre-assembly

S13: Module height calibration

S14: Module offset calibration

S15: Module rotation calibration

S16: Module offset inspection

S17: Fixed module

S11A: Refer to Module 1 assembling and fixing

S12A: At least one calibration module 2 pre-assembled

S13A: Module height/offset calibration

S14A: Module rotation calibration

S15A: Fixed module

S11B: Refer to Module 1 assembling and fixing

S12B: At least one calibration module 2 pre-assembled

S13B: Module offset calibration

S14B: Module height calibration

S15B: Module rotation calibration

S16B: Fixed module

S24: Repeat steps

S26: Step

S21: Refer to Module 1 assembling and fixing

S22: At least one calibration module 2 pre-assembled

S23: Module height calibration

S24: Module offset calibration

S25: Module rotation calibration

S26: Module offset calibration

S27: Fixed module

Z axis: height

X, Y axis: horizontal offset

U, V, W axis: rotation

2011: Prism housing

2012: Prism

2013: Prism holder

2014: Support bushing

2015: Support shaft

2016: support deck

FIG. 1 is a schematic top view of a split-array camera module according to the first preferred embodiment of the present invention.

2 is a schematic front view of a split array camera module according to the first preferred embodiment of the present invention.

3 is a schematic front view of a split array camera module according to the first preferred embodiment of the present invention. Further explain the relative relationship of parts.

4 is a schematic front view of a first modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

5 is a schematic front view of a second modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

6 is a schematic front view of a third modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

7 is a schematic front view of a fourth modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

FIG. 8 is a schematic front view of a fifth modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

9 is a schematic front view of a sixth modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

10 is a schematic front view of a seventh modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

11 is a schematic front view of an eighth modified embodiment of a split-array camera module according to the first preferred embodiment of the present invention.

FIG. 12 is a flowchart of a method for assembling a split-array camera module according to the first preferred embodiment of the present invention.

FIG. 13 is a schematic diagram of a split-type array camera module with a fixture during assembly according to the first preferred embodiment of the present invention.

14 is a schematic diagram of a split-type array camera module with a fixture during assembly according to the first preferred embodiment of the present invention. Explain the corresponding relationship between a reference module and a limit fixture.

15 is a schematic diagram of a target plate during calibration of a split-array camera module according to the first preferred embodiment of the present invention.

16 is a flowchart of another method for assembling a split-array camera module according to the first preferred embodiment of the present invention.

FIG. 17 is a perspective view of a split-type array camera module after assembly according to the second preferred embodiment of the present invention.

FIG. 18 is an exploded schematic diagram of a split array camera module according to the second preferred embodiment of the present invention.

19 is an exploded schematic diagram of the prism unit of a split-array camera module according to the second preferred embodiment of the present invention.

20 is a three-dimensional schematic diagram of a prism base of a split-array camera module according to a second preferred embodiment of the present invention.

21 is a schematic diagram of a prism unit of a split-array camera module assembled on a prism base according to a second preferred embodiment of the present invention.

22 is an exploded schematic diagram of a second camera module of a split-array camera module according to a second preferred embodiment of the present invention.

FIG. 23 is a schematic diagram of the interconnection state of the prism module and the second camera module of a split-array camera module according to the second preferred embodiment of the present invention.

FIG. 24 is a logical schematic diagram of a split-array camera module according to the second preferred embodiment of the present invention.

The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above-mentioned terms should not be construed as limiting the present invention.

It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be multiple, and the term "one" cannot be understood as a restriction on the number.

As shown in Figures 1 to 3, it is a split array camera module according to the first preferred embodiment of the present invention, wherein the split array camera module is a plurality of products that have been independently manufactured and assembled and are of qualified quality. The finished camera module is assembled and integrated on the same bracket to form a brand new array Camera module. In this way, the split-type array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.

According to this preferred embodiment of the present invention, the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The reference module 1 is implemented as an adjustable focus camera module such as a 13M adjustable focus camera module. The calibration module 2 is implemented as a fixed-focus camera module such as a 2M fixed-focus camera module. The reference module 1 and the calibration module 2 are individual camera modules that have been manufactured, assembled, and passed performance tests, respectively. It is understandable that the single camera modules may also be adjustable focus camera modules, or may be fixed focus camera modules, or one may be a focus camera module and the other may be a fixed focus camera module. In this embodiment as an example, the split array camera module includes a 13M adjustable focus camera module as the reference module 1, and a 2M fixed focus camera module as the calibration module 2. The reference module 1 and the calibration module 2 are respectively independent single camera modules.

As shown in FIGS. 1 and 2, the split-type array camera module further includes an assembly bracket 10 having a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively. In other words, the reference module 1 is assembled in the reference bracket unit 101 of the assembly bracket 10, and the calibration module 2 is assembled in the calibration bracket unit 102 of the same assembly bracket 10. In other words, the reference module 1 and the calibration module 2 are assembled in the same assembly bracket. In addition, in order to ensure the imaging quality of the dual camera module, it is necessary to strictly ensure the height, optical axis distance, and optical axis parallelism of the reference module 1 and the calibration module 2. The assembly position of the calibration module 2 in the reference support unit 101 and the calibration support unit 102 of the assembly support 10 has strict requirements. In addition, the assembly bracket 10 is made of high-hardness metal and non-metal materials, and the material of the assembly bracket 10 is required to be less deformed by changes in temperature and humidity, so as to fix the reference module 1 and the reference module 1 The spatial position between the calibration modules 2 is described.

In this embodiment, the module center distance between the calibration module 2 and the reference module 1 is 10.5 mm. The assembly gap between the reference module 1 and the reference support unit 101 is 0.1 mm, and the assembly gap between the calibration module 2 and the calibration support unit 102 is 0.3 mm.

As shown in FIG. 3, the reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, a reference base 14 and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the reference substrate 15. The reference base 14 is disposed on the reference substrate 15. The reference driver 12 is mounted on the reference base 14, and the reference lens 11 is mounted on the reference driver 12 so that the reference lens 11 is supported above the reference substrate 15. The reference substrate 15 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

In addition, it is worth mentioning that the reference base 14 can be separately provided on the reference substrate 15, or can be formed on the reference substrate 15 through a molding process, wherein the package connection is integrated through a molding process. In the reference substrate 15, the molding process can be injection molding or molding. In addition, the reference base 14 surrounds the reference photosensitive chip 13 and forms a through hole to provide a light path for the reference lens 11 and the reference photosensitive chip 13. In addition, the reference photosensitive chip 13 can be mounted on the reference substrate 15 in a front-mount or flip-chip manner, which is not a limitation of the present invention.

The calibration module 2 also includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be After being processed by the calibration lens 21, it is further accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration base 24 is disposed on the calibration substrate 25. The calibration lens 21 is supported above the calibration base 24. The calibration substrate 25 may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can also include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, and the calibration lens 21 is installed on the calibration base 24 so that the calibration lens 21 is supported above the calibration substrate 25. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like. In addition, the resolutions of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 are close to ensure the image imaging quality.

In addition, it is worth mentioning that the calibration base 24 can be separately provided on the calibration substrate 25, or can be formed on the calibration substrate 25 through a molding process, wherein the encapsulation connection is integrated through a molding process. In the calibration substrate 25, the molding process can be injection molding or molding. In addition, the calibration base 24 surrounds the calibration photosensitive wafer 23 and forms a through hole to provide a light path for the calibration lens 21 and the calibration photosensitive wafer 23. In addition, the calibration photosensitive wafer 23 can be mounted on the calibration substrate 25 in a front-mount or flip-chip manner, which is not a limitation of the present invention.

In addition, the reference module 1 and the calibration module 2 adopt different FOV lens designs. In other words, the reference module 1 is implemented as a lens with a large field of view, and its FOV is generally between 75° and 120°, and the calibration module 2 is implemented as a lens with a small field of view, and its FOV is generally between 20° and 50. °between. In particular, if both the reference module 1 and the calibration module 2 are implemented as zoom camera modules, their zoom capabilities range from 2 times to 6 times. In other words, the magnification of the image without loss of image quality is achieved through algorithmic synthesis, and the magnification varies from 2 to 6 times depending on the combination. In addition, according to actual needs, the small field of view lens can be adjusted separately The head and the large field of view lens use OIS or AF focus motor, which is not a limitation of the present invention. It is understandable that the OIS or AF focusing function is added to the single camera module to increase the quality of the optical zoom image. In other words, the OIS or AF focusing function can be selectively used in the small field angle lens and the large field angle lens to enhance the optical zoom camera effect.

In addition, those skilled in the art should understand that the split-array camera module can be implemented as more than one dual-camera module, that is to say, multiple cameras can be combined as needed. The single camera module is assembled to the assembly bracket 10. In other words, the split-array camera module includes one or more sub-modules, one of the sub-modules is the reference module 1, the remaining sub-modules are the calibration module 2, and the sub-modules They are independent of each other and assembled in the assembly bracket 10.

As shown in FIG. 4, it is a first modified embodiment of a split-type array camera module according to the first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.

The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively.

The reference module 1 also includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted on the reference driver 12. The reference substrate 15 may be coupled to the electronic device It can be used in conjunction with the electronic equipment. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 may further include a calibration driver 22, wherein the calibration lens 21 is supported above the calibration driver 22. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

It is worth mentioning that the common base 20 is arranged on the reference substrate 15 and the calibration substrate 25, so that the reference module 1 is implemented as an adjustable focus camera module, and the calibration module 2 is implemented as a fixed focus camera module. When focusing the camera module, the reference driver 12 and the calibration lens 21 are both installed on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 can be separately provided on the reference substrate 15 and the calibration substrate 25, or can be formed on the reference substrate 15 and the calibration substrate 25 through a molding process. Above, wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged and connected by a molding process, wherein the molding process may be injection molding or compression molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive wafer 13 can be mounted on the reference substrate 15 in a front-mounted or flip-chip manner, and the calibration photosensitive chip 13 The chip 23 can be mounted on the calibration substrate 25 in a front-mount or flip-chip manner, which is not a limitation of the present invention.

As shown in FIG. 5, it is a second modified embodiment of a split-type array camera module according to the first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base 20 and a common substrate 30. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.

The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively.

The reference module 1 also includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted on the reference driver 12. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive chip 23 is electrically connected to the common substrate 30. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module Therefore, the calibration module 2 may further include a calibration driver 22, wherein the calibration lens 21 is supported above the calibration driver 22. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

It is worth mentioning that when the common base 20 is disposed on the common substrate 30, so that the reference module 1 is implemented as an adjustable focus camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately provided on the common substrate 30, or may be formed on the common substrate 30 through a molding process, wherein the common base 20 is integrally packaged and connected to the common substrate 30 through a molding process. In the common substrate 30, the molding process may be injection molding or molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive chip 13 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner, and the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner. This is a limitation of the present invention.

As shown in FIG. 6, it is a third modified embodiment of a split-type array camera module according to the first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40 disposed at The reference module 1. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively.

The reference module 1 also includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, a reference base 14 and a reference substrate 15. The reference lens 11 is located in the reference sense The light-sensing path of the optical chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further received by the reference photosensitive chip 13 after being processed by the reference lens 11 Suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the reference substrate 15. The reference base 14 is disposed on the reference substrate 15. The reference driver 12 is mounted on the reference base 14, and the reference lens 11 is mounted on the reference driver 12 so that the reference lens 11 is supported above the reference substrate 15. The reference substrate 15 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15. The reference driver 12 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

In addition, it is worth mentioning that the reference base 14 can be separately provided on the reference substrate 15, or can be formed on the reference substrate 15 through a molding process, wherein the package connection is integrated through a molding process. In the reference substrate 15, the molding process can be injection molding or molding. In addition, the reference base 14 surrounds the reference photosensitive chip 13 and forms a through hole to provide a light path for the reference lens 11 and the reference photosensitive chip 13. In addition, the reference photosensitive chip 13 can be mounted on the reference substrate 15 in a front-mount or flip-chip manner, which is not a limitation of the present invention.

As shown in FIG. 7, it is a fourth modified embodiment of a split array camera module according to the first preferred embodiment of the present invention, wherein the split array camera module further includes a gyroscope 40 disposed in The calibration module 2. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively.

The calibration module 2 also includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23 Therefore, when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further received by the calibration photosensitive chip 23 after being processed by the calibration lens 21 to be suitable for photoelectric conversion. . The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration base 24 is disposed on the calibration substrate 25. The calibration lens 21 is supported above the calibration base 24. The calibration substrate 25 may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can also include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, and the calibration lens 21 is installed on the calibration base 24 so that the calibration lens 21 is supported above the calibration substrate 25. It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25. The calibration driver 22 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

In addition, it is worth mentioning that the calibration base 24 can be separately provided on the calibration substrate 25, or can be formed on the calibration substrate 25 through a molding process, wherein the encapsulation connection is integrated through a molding process. In the calibration substrate 25, the molding process can be injection molding or molding. In addition, the calibration base 24 surrounds the calibration photosensitive wafer 23 and forms a through hole to provide a light path for the calibration lens 21 and the calibration photosensitive wafer 23. In addition, the calibration photosensitive wafer 23 can be mounted on the calibration substrate 25 in a front-mount or flip-chip manner, which is not a limitation of the present invention.

As shown in FIG. 8, it is a fifth modified embodiment of a split array camera module according to the first preferred embodiment of the present invention, wherein the split array camera module further includes a gyroscope 40. The split-type array camera module includes an assembly bracket 10 and a common base 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The gyroscope 40 is installed in the reference module 1.

The reference module 1 also includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted on the reference driver 12. The reference substrate 15 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15. The reference driver 12 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25. The calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 may further include a calibration driver 22, wherein the calibration lens 21 is supported above the calibration driver 22. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

It is worth mentioning that the common base 20 is arranged on the reference substrate 15 and the calibration substrate 25, so that the reference module 1 is implemented as an adjustable focus camera module, and the calibration module 2 is implemented as a fixed focus camera module. When focusing the camera module, the reference driver 12 and the calibration lens 21 are both installed on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 can be separately provided on the reference substrate 15 and the calibration substrate 25, or can be formed on the reference substrate 15 and the calibration substrate 25 through a molding process. Above, wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged and connected by a molding process, wherein the molding process may be injection molding or compression molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a front-mounting or flip-chip manner, and the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a front-mounting or flip-chip manner. This is a limitation of the present invention.

As shown in FIG. 9, it is a sixth modified embodiment of a split array camera module according to the first preferred embodiment of the present invention, wherein the split array camera module further includes a gyroscope 40. The split-type array camera module includes an assembly bracket 10 and a common base 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The gyroscope 40 is installed in the calibration module 2.

The reference module 1 also includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted on the reference driver 12. The reference substrate 15 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that When the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further received by the calibration photosensitive chip 23 after being processed by the calibration lens 21 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 may further include a calibration driver 22, wherein the calibration lens 21 is supported above the calibration driver 22. It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25. The calibration driver 22 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

It is worth mentioning that the common base 20 is arranged on the reference substrate 15 and the calibration substrate 25, so that the reference module 1 is implemented as an adjustable focus camera module, and the calibration module 2 is implemented as a fixed focus camera module. When focusing the camera module, the reference driver 12 and the calibration lens 21 are both installed on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 can be separately provided on the reference substrate 15 and the calibration substrate 25, or can be formed on the reference substrate 15 and the calibration substrate 25 through a molding process. Above, wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged and connected by a molding process, wherein the molding process may be injection molding or compression molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a front-mounting or flip-chip manner, and the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a front-mounting or flip-chip manner. This is a limitation of the present invention.

As shown in FIG. 10, it is a seventh modified embodiment of a split-type array camera module according to the first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base 20. A common substrate 30 and a gyroscope 40. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively. The gyroscope 40 is disposed on the common substrate 30.

The reference module 1 also includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted on the reference driver 12. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the gyroscope 40 is electrically connected to the reference module 1 and is disposed on the common substrate 30. The reference driver 12 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive chip 23 is electrically connected to the common substrate 30. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can also include a calibration driver 22, wherein the calibration lens 21 is supported Above the calibration driver 22. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

It is worth mentioning that when the common base 20 is disposed on the common substrate 30, so that the reference module 1 is implemented as an adjustable focus camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately provided on the common substrate 30, or may be formed on the common substrate 30 through a molding process, wherein the common base 20 is packaged integrally through a molding process. It is connected to the common substrate 30, wherein the molding process can be injection molding or molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive chip 13 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner, and the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner. This is a limitation of the present invention.

As shown in FIG. 11, it is an eighth modified embodiment of a split-type array camera module according to the first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base 20. A common substrate 30 and a gyroscope 40. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. In this way, the reference module 1 and the calibration module 2 are assembled to the reference support unit 101 and the calibration support unit 102 of the assembly support 10 respectively. The gyroscope 40 is electrically connected to the calibration module 2 and is disposed on the common substrate 30.

The reference module 1 also includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to collect an image of an object, the light reflected by the object can be further processed by the reference lens 11. It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive chip 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted on the reference driver 12. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-actuator (MEMS) or the like.

The calibration module 2 also includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to collect an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive chip 23 is electrically connected to the common substrate 30. The common substrate 30 may be coupled to the electronic device so as to be used in conjunction with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed-focus camera module, so it does not include a driver. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 may further include a calibration driver 22, wherein the calibration lens 21 is supported above the calibration driver 22. It is worth mentioning that the gyroscope 40 is electrically connected to the calibration module 2 and is disposed on the common substrate 30. The calibration driver 22 may be implemented as a motor, a thermal driver, or a micro actuator (MEMS) or the like.

It is worth mentioning that when the common base 20 is disposed on the common substrate 30, so that the reference module 1 is implemented as an adjustable focus camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted on the common base 20. In addition, when the reference module 1 and the calibration module 2 are both implemented as adjustable focus camera modules, the reference driver 12 and the calibration driver 22 are both installed on the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately provided on the common substrate 30, or may be formed on the common substrate 30 through a molding process, wherein the common base 20 is integrally packaged and connected to the common substrate 30 through a molding process. In the common substrate 30, the molding process may be injection molding or molding. In addition, the common base 20 surrounds the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and forms a through hole respectively to provide a light path for the reference photosensitive wafer 13 and the calibration photosensitive wafer 23. In addition, the reference photosensitive chip 13 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner, and the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front-mounting or flip-chip manner. This is a limitation of the present invention.

In this preferred embodiment of the present invention, as shown in FIG. 12, it is the assembling method of the first split array camera module of the first preferred embodiment of the present invention, which includes the following steps: (S11) a split array camera module A reference module 1 of the group is assembled and fixed, that is, the reference module 1 is assembled and fixed in a reference unit 101 of an assembly bracket 10; (S12) At least one calibration module 2 of a split-array camera module is pre-assembled Assemble, that is, pre-assemble the calibration module 2 into a calibration unit 102 of the assembly bracket 10; (S13) calibrate the height of the module, measure the lens of each calibration module 2 and the reference module 1 For the height difference of the end face, calibrate the corresponding height position of each calibration module 2; (S14) module offset calibration, measure the horizontal position offset of each calibration module 2 and the reference module 1 Calibrate each calibration module 2 corresponding to the level offset position; (S15) module rotation calibration, set a light source and a target plate, light up the split array camera module, and perform calibration on the The target plate is taken to capture images. Based on the images collected by the reference module 1 and each calibration module 2, the software is used to calculate the rotation calibration amount of each calibration module 2 and compare the The calibration module 2 performs rotation position calibration; (S16) module offset inspection/calibration, judging whether the horizontal position offset of each calibration module 2 and the reference module 1 is within the allowable tolerance range, If the calibration is not within the tolerance range, if it is not within the tolerance range The inner return step (S13) re-does height calibration, offset calibration and rotation calibration for each calibration module 2 until the horizontal position offset of each calibration module 2 and the reference module 1 is within Within the tolerance range; and (S17) a fixing module, fixing the entire split array camera module to complete the assembly.

It is worth mentioning that the order between step (S13) and step (S14) is not fixed and can be interchanged. That is, if necessary, step (S13) can be performed first and then step (S14), or step (S4) can be performed first and then step (S13), which does not affect the assembly method of the body-type array camera module. It is worth mentioning that, step (S13) and step (S14) can be directly combined into one step, namely: module level calibration, which is to calibrate the X, Y, and Z axes, and the sequence is not limited.

In addition, the step (S16) does not have to exist. In other words, the verification of module calibration can be completed at the same time when the calibration is performed in step (S13), step (S14), and step (S15), so as to simplify the assembly process.

In addition, the split-type array camera module includes one or more sub-modules. One of the sub-modules is the reference module 1, and the remaining sub-modules are the calibration module 2. They are independent of each other and assembled to the assembly bracket 10. In particular, the reference module 1 selects a sub-module with the highest image element in the split-array camera module.

In this preferred embodiment of the present invention, according to step (S11), as shown in FIG. 14, a limit jig 30 is used to limit the reference module 1 and the reference unit 101 of the assembly bracket 10. Element assembly, wherein the reference module 1 and the frame frame of the reference unit 101 are fixed with glue. Preferably, the glue adopts UV thermosetting glue, and the painting glue area is located on the upper edge of the frame of the reference unit 101. After painting, the UV thermosetting glue is pre-cured by ultraviolet exposure. It is worth mentioning that the assembly gap between the reference module 1 and the reference unit 101 is 0.1 mm.

In other words, in step (S11), the step of assembling and fixing the reference module further includes: 1) Use the limit jig 30 to assemble the reference module 1 and the reference unit 101 with limit elements; and 2) draw glue between the reference module 1 and the reference unit 101, Curing the glue.

According to step (S12), as shown in FIG. 13, the reference module 1 and the assembly bracket 10 are installed and fixed to a fixture 401 of a module calibration platform 403, and the calibration module 2 Installed and fixed to a calibration jig 402, the calibration jig 402 is set on a six-axis platform, and at the same time, the calibration module 2 is placed in the calibration unit 102 of the assembly bracket 10, so The calibration module 2 can move in six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform. It is worth mentioning that the assembly gap between the calibration module 2 and the calibration unit 102 is 0.3 mm.

According to step (S13), the height of a point on the lens end surface of the reference module 1 and the calibration module 2 is measured through a laser ranging method, and then the calibration module 2 is calculated separately The height difference between the end face of the lens of the reference module 1 and the Z-axis displacement of the calibration module 2 is adjusted through the six-axis platform.

In other words, in step (S13), the module height calibration specifically includes: 1) Using the laser ranging method to measure each of the reference module 1 and the lens end face of each calibration module 2 The height of the points, respectively calculating the height difference between the lens end face of each calibration module 2 and the reference module 1; and 2) adjust the Z-axis of each calibration module 2 through the six-axis platform Displacement.

According to step (S14), the lens end face of the reference module 1 and each calibration module 2 is photographed by CCD, the lens end face image is captured, and the calibration module is calculated by software 2 The horizontal position offset from the reference module 1 is adjusted by the six-axis platform to adjust the X and Y axis displacement of the calibration module 2 according to the horizontal position offset.

In other words, in step (S14), the module offset calibration specifically includes: 1) Take CCD shooting on the lens end face of the reference module 1 and each calibration module 2, capture the image of the lens end face, and use software to calculate each calibration module 1 and the reference mold The offset of the horizontal position of group 1; and 2) adjust the X and Y axis displacement of each calibration module 2 through the six-axis platform. According to step (S15), the rotation angles of the U, V, and W rotation axes of the six-axis platform are adjusted according to the rotation calibration amount of the calibration module 2 to realize the rotation calibration of the calibration module 2.

According to step (S16), the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 is [10.4, 10.6] mm, and the tolerance of the Y-axis position offset is [-0.1, 0.1 ]mm.

According to step (S17), glue is drawn between the calibration module 2 and the calibration unit 102, the glue is a UV thermosetting glue, and the gap between the calibration module 2 and the calibration unit 102 The UV thermosetting adhesive is pre-cured in ultraviolet exposure, and then the split array camera module is baked in an oven to realize the curing of all UV thermosetting adhesives, and the entire split array camera module is fixed and finally Complete the assembly.

In an embodiment of the present invention, the limiting jig 30 includes a first groove 301 and a second groove 302, which respectively extend inwardly from the surface of the limiting jig 30 to form grooves. The first groove 301 is used to place the reference module 1, and the second groove 302 is used to place the assembly bracket 10.

In addition, as shown in FIG. 14, the assembling step of the reference module 1 and the limiting jig 30 in step (S11) further includes: 1) placing the reference module 1 in the limiting position The first groove 301 of the jig 30; 2) place the assembly bracket 10 in the second groove 302 of the limit jig 30; 3) pass the position of the limit jig 30 The assembly limit of the first groove 301 and the second groove 302 controls the assembly position error of the reference module 1 and the assembly bracket 10.

It is worth mentioning that the steps (S11A) and (S11B) have no sequential assembly sequence, that is, the assembly sequence can be adjusted according to the assembly requirements.

In one embodiment of the present invention, in step (S13), the laser height measurement point of the reference module 1 is located above the lens end surface of the reference module 1, and the laser height measurement point of the calibration module 2 The distance between the point and the laser height measurement point of the reference module 1 is fixed, which is the module center distance between the calibration module 2 and the reference module 1. In this embodiment, the distance It is 10.5mm. Optionally, there are three laser height measuring points for the reference module 1 and the calibration module 2, and average values are obtained respectively, so as to obtain a more accurate reference module 1 and the calibration module 2 height difference, but the height measurement efficiency of this method is much lower than that of one height measurement point.

In an embodiment of the present invention, the schematic diagram of the target plate in step (S15) is shown in FIG. 15. The center of the target plate is an MTF test pattern M1 composed of multiple sets of horizontal and vertical stripes, which is used to compare all The reference module 1 performs focusing, and the four corners of the target plate are four circular Mark points M2, which are used to calculate the rotation calibration amount of the calibration module 2. Further, since the reference module 1 is an adjustable focus module, it is necessary to adjust the focus of the reference module 1 before collecting the target image, and the MTF test pattern M1 is used to adjust the focus of the reference module 1. Adjust the focus, adjust the focus until the MTF test pattern is most clearly imaged in the reference module 1, and then calculate the rotation calibration amount of the calibration module 2. Further, according to the position coordinates of the four Mark points M2 captured by the reference module 1 and the calibration module 2, the light of the reference module 1 and the calibration module 2 can be calculated respectively. The axis is tilted, so that the rotation calibration amount of the calibration module 2 can be calculated.

In addition, if it is defined that the arrangement direction of the reference module 1 and the calibration module 2 is the X axis, and the vertical direction is the Y axis, in this embodiment, the calibration module 2 and the reference module 1 The distance between the module centers is 10.5mm. It is worth mentioning that in step (S16), the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 is [10.4, 10.6] mm, and the tolerance of the Y-axis position offset is [-0.1,0.1] mm, as long as any one of the X and Y axis position offsets of the calibration module 2 and the reference module 1 is not within the corresponding tolerance range, it is necessary to start from step (S13) Start to perform height calibration, offset calibration, and rotation calibration on the calibration module 2 in sequence again, until the X and Y axis position offsets of the calibration module 2 and the reference module 1 fall within the corresponding tolerances Within range.

In this embodiment, in step (S12), glue is not applied between the calibration module 2 and the calibration unit 102, until all calibration processes are completed in step (S17), then the calibration module 2 and the calibration unit 102 to draw glue, the present invention can also put the glue drawing process between the calibration module 2 and the calibration unit 102 in step (S17) at the end of step (S12), also That is to say, the paint between the calibration module 2 and the calibration unit 102 is first performed, and then the assembly position of the calibration module 2 is calibrated. After the calibration is completed, in step (S17), the The glue is semi-cured by UV exposure, and then the entire module is baked to complete the assembly.

Preferably, in step (S17), the baking temperature of the split-type array camera module in the oven is 80° C. to 90° C., and the baking time is 50 min to 60 min.

In addition, the simplified assembly process mentioned in this embodiment is to integrate or interchange step (S13) and step (S14), and to simplify step (S16). In other words, the method for assembling a split array camera module in the first simplified alternative mode of the first preferred embodiment of the present invention includes the following steps: (S11A) a reference module 1 of a split array camera module is assembled and fixed, That is, the reference module 1 is assembled and fixed in a reference unit 101 of an assembly bracket 10; (S12A) At least one calibration module 2 of a split-array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled Assembled into a calibration unit 102 of the assembly bracket 10; (S13A) Module height/offset calibration, measuring the height difference and horizontal position deviation of each calibration module 2 and the reference module 1 The amount of displacement, the corresponding height position calibration and the corresponding level offset position calibration for each calibration module 2; (S14A) Module rotation calibration, set a light source and a target plate, light up the split-array camera module, shoot and collect images of the target plate, according to the reference module 1 and each The image collected by the calibration module 2 is used to calculate the rotation calibration amount of each calibration module 2 using software, and the rotation position calibration of the calibration module 2 is performed; and (S15A) a fixed module to fix the entire The split-type array camera module is assembled.

In this embodiment, the split-array camera module includes one or more sub-modules, one of which is the reference module 1, and the remaining sub-modules are the calibration module 2. The sub-modules are independent of each other and assembled in the assembly bracket 10. Both the reference module 1 and the calibration module 2 are single camera modules that have been manufactured, assembled, and passed the performance test. The reference module 1 can be implemented as a 13M adjustable focus camera module. The calibration module 2 can be implemented as a 2M fixed-focus camera module. In addition, the circumferential assembly gap between the reference module and the reference unit is 0.1 mm, and the circumferential assembly gap between the calibration module and the calibration unit is 0.3 mm.

The method for assembling a split-type array camera module in the second simplified alternative mode of the first preferred embodiment of the present invention includes the following steps: (S11B) a reference module 1 of a split-type array camera module is assembled and fixed, i.e. The reference module 1 is assembled and fixed in a reference unit 101 of an assembly bracket 10; (S12B) At least one calibration module 2 of a split-array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled to In a calibration unit 102 of the assembling bracket 10; (S13B) module offset calibration, measuring the offset of the horizontal position of each calibration module 2 and the reference module 1, and performing the calibration for each calibration module 2 Module 2 performs corresponding leveling offset position calibration; (S14B) Module height calibration, measuring the height difference between the lens end face of each calibration module 2 and the reference module 1, and for each calibration module 2 Make the corresponding height position calibration; (S15B) Module rotation calibration, set a light source and a target plate, light up the split-array camera module, shoot and collect images of the target plate, according to the reference module 1 and each The image collected by the calibration module 2 is used to calculate the rotation calibration amount of each calibration module 2 by using software, and the rotation position calibration of the calibration module 2 is performed; and (S16B) a fixed module to fix the entire The split-type array camera module is assembled.

As shown in FIG. 16, it is a schematic diagram of the method for assembling the second-one split-array camera module in the first preferred embodiment of the present invention. The difference from the first embodiment is that the calibration is not performed in step (S26). The tolerance range is set for the offset of the horizontal position of the module 2 and the reference module 1, no matter how much the offset of the horizontal position of the calibration module 2 and the reference module 1 is, it is directly based on the two measured values. Adjust the X and Y axis displacement of the calibration module through the six-axis platform, that is, step (S26) and repeat step (S24). Compared with the assembly method of the first embodiment, the assembly method of the second embodiment has higher calibration efficiency, but the calibration quality will be relatively low. In the specific implementation, it is necessary to adjust the above-mentioned characteristics according to the characteristics of the split-array camera module. Choose between two options.

In other words, the method for assembling a split-type array camera module according to the second preferred embodiment of the present invention includes the following steps: (S21) a reference module 1 of a split-type array camera module is assembled and fixed, that is, the reference The module 1 is assembled and fixed in a reference unit 101 of an assembly bracket 10; (S22) At least one calibration module 2 of a split-array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled to the In a calibration unit 102 of the assembling bracket 10; (S23) Module height calibration, measuring the height difference between the lens end faces of each calibration module 2 and the reference module 1, and performing the calibration on each calibration module 2 Corresponding height position calibration; (S24) Module offset calibration, measuring the offset of the level position of each calibration module 2 and the reference module 1, and making corresponding adjustments to each calibration module 2 Level offset position calibration; (S25) Module rotation calibration, set a light source and a target plate, light up the split array camera module, shoot and collect images of the target plate, according to the reference module 1 and each The image collected by the calibration module 2 is used to calculate the rotation calibration amount of each calibration module 2 using software, and the rotation position calibration of the calibration module 2 is performed; (S26) module offset calibration, measurement The level offset of each calibration module 2 and the reference module 1 is calibrated corresponding to the level offset position of each calibration module 2; and (S27) a fixed module is fixed to fix the entire The split-type array camera module is assembled.

In the first preferred embodiment of the present invention, the first simplified alternative mode and the second simplified alternative mode and the second preferred embodiment jointly contain the following content: Preferably, the step of assembling and fixing the reference module further includes: 1) Use a limit jig 30 to assemble the limit elements of the reference module 1 and the reference unit 101; and 2) draw glue between the reference module 1 and the reference unit 101 to cure the glue. In particular, the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure. Preferably, the module height calibration specifically includes: 1) Using a laser ranging method to measure the height of a point on the lens end surface of the reference module 1 and each calibration module 2, and calculate them separately The height difference between the lens end face of each calibration module 2 and the reference module 1; and 2) the Z-axis displacement of each calibration module 2 is adjusted through the six-axis platform. Preferably, the module offset calibration specifically includes: 1) CCD shooting of the lens end faces of the reference module 1 and each calibration module 2, captures the lens end face images, and calculates them with software. The offset of the horizontal position of each calibration module 2 and the reference module 1; and 2) adjust the X and Y axis displacement of each calibration module through the six-axis platform.

In this embodiment, the center of the target is the MTF test target, and the four corners of the target contain four circular Mark points.

Preferably, the rotation calibration of each calibration module is realized by the movement of the six-axis platform in the three spatial dimensions of U, V, and W. The purpose is to make each calibration module communicate with the reference module. The optical axis of the group is parallel.

Preferably, the pre-assembly step of the calibration module specifically includes: 1) Mounting and fixing the reference module and the assembly bracket to a fixed fixture 401 of a module calibration platform 403, the reference module The assembly is placed in the reference unit of the assembly bracket; 2) the calibration module is installed and fixed to a calibration jig 402, the calibration jig 402 is set on a six-axis platform, the calibration module 2 Placed in the calibration unit 102 of the assembly bracket 10, the calibration module can move with the six-axis platform in six spatial dimensions of X, Y, Z, U, V, and W; and 3) Glue is drawn between the calibration module and the calibration unit, and the glue is a UV thermosetting glue.

Cooperating with the above-mentioned pre-assembly step of the calibration module, the fixing step of the split-array camera module specifically includes: 1) UV-curing the glue between the calibration module 2 and the calibration unit 102 Exposing, the glue is semi-cured; and 2) baking the split array camera module, the glue is completely cured, and the entire split array camera module is fixed. Preferably, the pre-assembly step of the calibration module specifically includes: 1) installing and fixing the reference module 1 and the assembly bracket 10 to the fixing fixture 401 of the module calibration platform 403; The reference module 1 is placed in the reference unit 101 of the assembly bracket; and 2) Install and fix the calibration module to a calibration jig 402, the calibration jig 402 is set on a six-axis platform, and the calibration module is placed in the calibration unit 102 of the assembly bracket 10, The calibration module can move in six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform.

Cooperating with the above-mentioned pre-assembly step of the calibration module, the fixing step of the split-array camera module specifically includes: 1) drawing glue between the calibration module 2 and the calibration unit 102, the glue Is a kind of UV thermosetting glue; 2) UV-exposing the glue between the calibration module 2 and the calibration unit 102, and the glue is semi-cured; and 3) baking the split array camera module Group, the glue is completely cured, and the entire split-array camera module is fixed.

In particular, the baking temperature of the split-type array camera module in the oven is 80°C to 90°C, and the baking time is 50min to 60min.

The present invention provides a method for assembling the split-type array camera module. The split-type array camera module refers to the integrated assembly of more than one fully independent and qualified camera module products through a common assembly bracket. Into an array camera module. In the assembly process of the array module, not only the module height between each sub-module must be strictly controlled, but also the optical axis spacing and optical axis parallelism between each sub-module must be strictly controlled. In order to solve the above technical problems, this The technical solution adopted by the patented split-array camera module assembly method is as follows: one sub-module of the split-array camera module is used as the reference module 1, and the other sub-modules are used as the calibration module 2. Assemble and fix the reference module 1 on the assembly bracket 10, and then use the reference module 1 as a reference standard to sequentially adjust the height (Z axis) and level offset (X, Y axis) of the calibration module 2 , Rotate (U, V, W axis) a total of six axis assembly positions for calibration, after the calibration is completed, the calibration module 2 and the assembly support The frame 10 is fixed, and the assembly process of the split array camera module is completed. The above-mentioned assembling method of the split array camera module not only improves the production efficiency, yield rate and quality of the module, but also realizes the high utilization of production resources.

As shown in Figures 17-24, it is a split-type array camera module according to the second preferred embodiment of the present invention, wherein the split-type array camera module is a plurality of products that have been independently manufactured and assembled and are of qualified quality. The finished camera module or prism module is assembled and integrated into a brand new array camera module. In this way, the split-type array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.

According to this preferred embodiment of the present invention, the split-array camera module is implemented as a dual-camera zoom module, which includes a first camera module 1, a prism module 2, a second camera module 3 and One circuit board 4. As shown in the figure, the first camera module 1 is detachably coupled to the prism module 2, and the second camera module 3 is installed between the prism module 2 and the circuit board 4. between. Furthermore, the first camera module 1 is arranged on the leftmost side of the entire dual-camera zoom module, and the prism module 2 is arranged thereafter. And as shown in FIGS. 17 and 18, according to an embodiment of the present invention, after the first camera module 1 and the prism module 2 are assembled with each other, they are fixedly connected to the second camera module 3 with each other. When realizing this connection, the two are required to be strictly positioned and aligned with each other, so as to ensure that the light refracted in the prism module 2 is concentric or coaxial with the optical axis of the camera lens in the second camera module 3 . This positioning structure will be described in further detail later in conjunction with related drawings. In this embodiment, after the prism module 2 to which the first camera module 1 is fixed and the second camera module 3 are positioned with each other, they are fixedly connected to each other by laser welding or bonding. The circuit board 4 may be pre-assembled on the second camera module 3, and then the prism module 2 of the first camera module 1 and the second camera module 3 are fixedly connected to each other. Alternatively, the prism module 2 of the first camera module 1 and the second camera module 3 may be fixedly connected to each other, and then the circuit board 4 may be fixedly connected to each other. Connected to the second camera module 3. So far, the dual-camera zoom module according to the present invention is assembled to form a complete dual-camera zoom module as shown in FIG. 17.

According to this embodiment, as shown in FIG. 24, the first camera module 1 includes a first lens 100A, a first driver 300A, a first photosensitive chip 200A, and a first substrate 400A. The first lens 100A is located on the photosensitive path of the first photosensitive chip 200A, so that when the first camera module 1 is used to capture an image of an object, the light reflected by the object can pass through the first lens After the 100A treatment, it is further accepted by the first photosensitive wafer 200A to be suitable for photoelectric conversion. The first photosensitive chip 200A is electrically connected to the first substrate 400A. The first lens 100A is mounted on the first driver 300A. The first substrate 400A may be coupled to the electronic device so as to cooperate with the electronic device. It is worth mentioning that the first driver 300A can be implemented as a motor, a thermal driver, a micro actuator (MEMS), or the like.

According to this embodiment, the prism module 2 includes a prism unit 201 and a prism base 202. The prism base 202 has a rectangular shape and is provided with two positions, one of which is for accommodating the prism unit 201 and the other is for accommodating the first camera module 1. This arrangement allows the first camera module 1 and the prism unit 201 to be mutually mounted on a base plate or plane, or the first camera module 1 and the prism unit 201 are arranged coplanar. In this way, the mutual positional error caused by setting the first camera module 1 and the prism unit 201 on different bases is eliminated. This arrangement ensures the parallelism of the light entering the first camera module 1 and the prism unit 201 with a simple structure, that is, the imaging quality is guaranteed.

FIG. 19 shows the prism unit 201 in the prism module 2 in the dual-camera zoom module according to the present invention in an exploded schematic view.

As shown in FIG. 19, the prism unit 201 mainly includes a prism housing 2011, a prism 2012, a prism holder 2013, a supporting sleeve 2014, a supporting shaft 2015, and a supporting holder 2016. The prism housing 2011 is a rectangular frame surrounded by three side walls or frames, and the three side walls or frames are respectively a bottom frame 2011a and two side frames 2011b. The two side frames 2011b have the same structure and shape, and are arranged opposite to each other. The bottom frame 2011a is provided at one end of the two side frames 2011b. This forms an approximately U-shaped frame. This frame is a rectangular frame with one side open or open. It can be understood that the side openings of the U-shaped frame are arranged on the opposite side of the bottom frame 2011a. The two side frames 2011b are respectively fixedly connected to the bottom frame 2011a at one end, and the other end is a free end 2011c extending outward, that is, the side opening is formed at the free end 2011c. In this embodiment, the two free ends 2011c are used to connect with the second camera module 3 sequentially arranged thereafter. A connecting beam 2011d is also provided between the two free ends 2011c. On the one hand, the connecting beam 2011d is used to fix the distance between the two free ends 2011c, so that it can be more accurately connected to the second camera module 3 and then fixedly connected to each other; on the other hand, The connecting beam 2011d also serves to block light that may leak into the space between the prism 2012 and the second camera module 3 at the connecting gap. This helps to improve the image quality. The connecting beam 2011d improves the overall rigidity of the prism housing 2011 and effectively prevents unwanted light from entering the dual-camera zoom module according to the present invention. It is worth mentioning that the connecting beam 2011d can be implemented as a long strip or a rectangular frame. It can be understood that if the connecting beam 2011d is the long strip, it is arranged on the two side frames 2011b and between the two free ends 2011c. If the connecting beam 2011d is the rectangular frame, it is located above the bottom frame 2011a and the two side frames 2011b, and one side of the rectangular frame is located between the two free ends 2011c.

As shown in FIG. 19, the seed prism unit 201 further includes the prism 2012, the prism holder 2013, the support sleeve 2014, and the support shaft 2015. The prism 2012 is fixedly arranged in the prism holder 2013. It can be clearly seen from the figure that in the assembled state, the upper surface of the prism 2012 protrudes from the prism holder 2013. The supporting sleeve 2014 is fixedly installed on the prism holder 2013 The lower part is the other side of the prism holder 2013 opposite to the position where the prism 2012 is installed. The supporting shaft 2015 is rotatably installed in the supporting sleeve 2014.

As shown in FIG. 19, the cross section of the prism 2012 is basically a right triangle, and the prism 2012 shown in the figure is in a horizontal state. As shown in the figure, the plane of a right-angled side of the right-angled triangle faces upwards. In this way, the plane of the hypotenuse of the right triangle on the prism mirror 2012 faces the prism holder 2013 and is supported therein.

As shown in FIG. 19, in an embodiment according to the present invention, the support sleeve 2014 and the support shaft 2015 cooperate with each other to support the entire prism holder 2013 and the prism 2012 so that they can surround The support shaft 2015 rotates.

In an embodiment according to the present invention as shown in FIG. 19, firstly, glue for bonding is applied to the prism holder 2013, and then the prism 2012 is put into the prism holder 2013 and the glue is cured, thereby The prism 2012 and the prism holder 2013 are firmly bonded to each other. Put the support sleeve 2014 into the through hole 2013a on the prism holder 2013 and fix it. The prism holder 2013 assembled with the prism 2012 is rotatably supported on the prism base 202 through the supporting shaft 2015, and then the prism housing 2011 is installed on the prism holder 2013.

In the embodiment according to the present invention, the prism holder 2013 is further provided with a magnet for driving the prism holder 2013 to move, and the prism base 202 is provided with a magnet for driving the prism holder 2013 to move as described above. The magnets cooperate with the coils and circuits. Thus, a driving device for driving the prism 2012 to move is formed. Driven by the driving device, the prism 2012 rotates or moves relative to the supporting shaft 2015, so as to realize the adjustment movement of the prism 2012 in different degrees of freedom.

FIG. 20 shows the specific shape and structure of the prism base 202 in the form of a three-dimensional view. As shown in the figure, the prism base 202 is rectangular and has a bottom plate 2025 which is a rectangular flat plate. On one surface of the bottom plate 2025, a positioning frame wall 2026 extending along the side length is provided. As shown in the figure, in this embodiment according to the present invention, the positioning frame wall 2026 is not It extends continuously around the entire length of the bottom plate 2025, but extends intermittently. In particular, when the positioning frame wall 2026 surrounds the bottom plate 2025, a first opening 2028 is formed in the middle.

The prism base 202 shown in FIG. 20 is divided into two different cavities by a middle partition wall 2027, one of which is used for accommodating or arranging the prism unit 201 is a prism module accommodating cavity 2022. Another one for accommodating the first camera module 1 is a first camera module accommodating cavity 2021. It is worth mentioning that the first opening 2028 is formed on the side wall of the first camera module accommodating cavity 2021. In addition, a second opening 2029 is formed on the side wall of the prism module containing cavity 2022. As shown in the figure, the first opening 2028 is used for distributing the power/signal lines of the first camera module 1. In the same way, the second opening 2029 is also an opening for applying power/control signal lines for controlling the prism 2012.

A connecting wall 2023 is provided on one side of the prism module accommodating cavity 2022, and the connecting wall 2023 is used to connect with the second camera module 3, and at the same time, it also plays a role in connecting with the second camera module 3 When they are connected to each other, they can accurately locate each other. Furthermore, the connecting wall 2023 is arranged on the opposite side of the middle partition wall 2027. In the prism module accommodating cavity 2022, a supporting seat for supporting the supporting shaft 2015 is also provided. The supporting shaft 2015 is fixedly supported on the supporting seat, so that the prism 2012 can move under the driving of a driving mechanism.

According to the present invention, the first camera module 1 and the prism module 2 are respectively provided on the prism base 202. One of the purposes of this arrangement is to align the effective optical area formed by the prism unit 201 and the lens in the first camera module 1 with each other. This is very important for image quality. However, when two components or units are installed on the prism base 202 at the same time, the prism base 202 is caused to bear two parts with a certain weight. In this way, the middle part of the prism base 202 becomes a relatively fragile part on the entire base. When the dual-camera zoom module according to the present invention is subjected to relatively strong impact or vibration during use, the prism base 202 may break in the middle part.

In order to prevent the middle part of the prism base 202 from breaking, a middle reinforcing plate 2024 is provided in the middle part according to the present invention. It can be seen from FIG. 20 that the middle reinforcing plate 2024 extends through the prism base 202 along the direction perpendicular to the length of the prism base 202 and extends through the prism base 202 across its entire width. The middle reinforcing plate 2024 has a certain thickness, thereby enhancing the strength of the middle part of the prism base 202. This effectively prevents the middle reinforcing plate 2024 from being broken or damaged. In addition, the intermediate reinforcing plate 2024 improves the overall rigidity of the prism base 202, so that the installation foundation of the first camera module 1 and the prism unit 201 is firmer, and the positional relationship between the two is ensured. .

It can be seen from FIG. 21 that at least one positioning protrusion 2030 is provided on the other surface of the connecting wall 2023 at the end of the prism base 202. In this embodiment according to the present invention, four positioning protrusions 2030 are provided. The four positioning protrusions 2030 are distributed on the four corners of the surface of the connecting wall 2023. The positioning protrusions 2030 are used to cooperate with the positioning holes 301c on the camera housing 301 of the second camera module 3 to determine the prism base 202 and the second camera housing 301. The connection position between the camera modules 3 ensures that the optical axis of the prism 2012 and the optical axis of the lens in the second camera module 3 are coaxial with each other. At the same time, a through hole for passing light is also opened in the central part of the connecting wall 2023. The light refracted by the prism 2012 will pass through this through hole, enter the second camera module 3, pass through the lens therein and reach the photosensitive chip.

FIG. 21 also clearly shows the free end 2011c of the prism housing 2011. In this embodiment according to the present invention, the two free ends 2011c are used for fixed connection with the second camera module 3 behind. This will be described in further detail later.

According to this embodiment, as shown in FIG. 24, the second camera module 3 includes a second lens 102A, a second driver 302A, a second photosensitive chip 202A, and a second substrate 402A. The second lens 102A is located on the photosensitive path of the second photosensitive chip 202A, so that when the first and second camera modules 3 are used to capture images of an object, the light reflected by the object can pass through the second After the processing of the lens 102A, it is further accepted by the second photosensitive chip 202A so as to be suitable for photoelectric conversion. The second photosensitive chip 202A is electrically connected to the second substrate 402A. The second lens 102A is mounted on the second driver 302A. The second substrate 402A may first be coupled to the electronic device, so as to cooperate with the electronic device. It is worth mentioning that the second driver 302A can be implemented as a motor, a thermal driver, a micro actuator (MEMS), or the like.

In addition, FIG. 22 shows a partial structure of the second camera module 3 according to the present invention.

In an embodiment according to the present invention, the second camera module 3 includes a camera housing 301A. As shown in FIG. 22, the camera housing 301A is in the shape of a hollow rectangular column, with a housing portion 301a surrounding the hollow rectangular column, and a front panel 301e fixedly connected to one end of the housing portion 301a. As shown in FIG. 22, the length of the front panel 301e is smaller than the width of the camera housing 301A because two connecting portions 301b are respectively provided at both ends of the camera housing 301A in the width direction. The two connecting portions 301b are two recesses on the side surface of the camera housing 301A. In combination with the prism housing 2011 shown in FIG. 5, it can be seen that in the assembled state, the free end 2011c of the prism housing 2011 is attached to the two recessed surfaces on both sides of the end of the camera housing 301A. At the connecting portion 301b, the two are fixedly connected together by laser welding or bonding.

As shown in Fig. 22, the front panel 301e is provided with at least one positioning hole 301c. In this embodiment according to the present invention, four positioning holes 301c are provided on the four corners of the front panel 301e. When the second camera module 3 and the prism base 202 on which the prism unit 201 and the first camera module 1 are mounted are combined and fixed to each other, the positioning holes 301c play a positioning role, and The optical axis of the prism 2012 is coaxial with the optical axis of the lens in the first camera module 1 and the optical axis of the lens in the second camera module 3.

FIG. 22 also schematically shows a second driver 302A, an anti-shake unit 303 and a support shell 304 in this embodiment according to the present invention. These components are arranged coaxially with each other. The second driver 302A is installed in the anti-shake unit 303, and can be driven by the driving mechanism in the The anti-shake unit 303 moves in order to offset the deviation caused by the shaking. The anti-shake unit 303 is integrally installed in the supporting shell 304 and can move in the supporting shell 304 to drive the lens in the camera module to adjust the focus.

FIG. 22 only schematically shows the components of the second camera module 3 according to the present invention, and does not specifically show, for example, driving magnets, corresponding Hall sensors, etc. in detail.

FIG. 23 schematically shows the interconnection state of the prism module 2 and the second camera module 3 in an embodiment according to the present invention.

After the prism unit 201 is integrally mounted on the prism base 202, the combination of the prism unit 201 and the prism base 202 as shown in FIG. 21 is obtained. Then, the end surface of the prism base 202 facing the second camera module 3 is coated with adhesive glue, and the front panel of the camera housing 301 on the corresponding end surface of the second camera module 3 is applied. Adhesive glue is also attached to 301e.

Then, align the four positioning protrusions 2030 on the prism base 202 with the four positioning holes 301c on the camera housing 301 of the second camera module 3, and then insert the Positioning hole 301c. In this way, it can be ensured that the second camera module 3 and the prism unit 201 are strictly aligned with each other.

After the above-mentioned alignment is achieved, the free end 2011c of the prism housing 2011 is attached to the two concave connecting portions 301b on both sides of the end of the camera housing 301. Laser welding is applied to the free end 2011c and the connecting portion 301b or adhesive is also applied by applying glue to fix the connection between the two. After connection, the combination shown in FIG. 23 is obtained, but the first camera module 1 and the corresponding circuit board 4 on the rightmost side are omitted in FIG. 23. The circuit board 4 can be connected to the back of the second camera module 3 by bonding or the like. In addition, the circuit board 4 can also be connected to the back of the second camera module 3 through structural cooperation, such as screw or hook fitting. This is not a limitation of the present invention.

Those skilled in the art should understand that the above description and the embodiments of the present invention shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been completely and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the principles, the implementation of the present invention may have any deformation or modification.

S11: Reference module assembly and fixing

S12: Calibration module pre-assembly

S13: Module height calibration

S14: Module offset calibration

S15: Module rotation calibration

S16: Module offset inspection

S17: Fixed module

Claims (55)

A split-type array camera module, which is characterized by comprising: a plurality of sub-modules, at least one of which is a reference module, and the remaining sub-modules are calibration modules; and an assembly bracket, wherein the reference The module and each calibration module are assembled in the assembly bracket respectively, wherein the reference module and each calibration module are respectively independent and qualified single camera modules, wherein the reference module is also It includes at least one reference base, at least one reference substrate, at least one reference photosensitive chip, and at least one reference driver, wherein the reference photosensitive chip is electrically connected to the reference substrate, and the reference base is disposed on the reference substrate, so The reference driver is mounted on the reference base. According to the split array camera module described in item 1 of the scope of patent application, the reference module is an adjustable focus camera module or a fixed focus camera module. According to the split array camera module described in item 2 of the scope of patent application, the calibration module is an adjustable focus camera module or a fixed focus camera module. The split array camera module according to item 3 of the scope of patent application, wherein the assembly bracket has at least one reference unit and at least one calibration unit, wherein the reference module and the calibration module are respectively assembled in the Assembling the reference unit and the calibration unit of the bracket. The split array camera module according to item 4 of the scope of patent application, wherein the module center distance between the calibration module and the reference module is 1-100 mm. The split array camera module according to item 5 of the scope of patent application, wherein the assembly gap between the reference module and the reference unit is 0.01-1mm, and the calibration module is assembled with the circumference of the calibration unit The gap is 0.03-3mm. The split-array camera module according to item 1 of the scope of patent application, wherein the reference module further includes at least one reference lens, wherein the reference lens is located on the photosensitive path of the reference photosensitive chip, and the reference lens is Install on the reference drive. The split array camera module according to item 7 of the scope of patent application, wherein the calibration module further includes at least one calibration lens and one at least calibration photosensitive chip, wherein the calibration lens is located in the photosensitive path of the calibration photosensitive chip . The split array camera module according to item 1 of the scope of patent application, wherein the calibration module further includes at least one calibration base and at least one calibration substrate, wherein the calibration photosensitive chip is electrically connected to the calibration substrate, The calibration base is arranged on the calibration substrate. The split array camera module according to item 8 of the scope of patent application, wherein the split array camera module includes at least one common base, the calibration module further includes at least one calibration substrate, and the calibration photosensitive chip It is electrically connected to the calibration substrate, and the common base is disposed on the reference substrate and/or the calibration substrate. The split array camera module according to item 8 of the scope of patent application, which includes at least one common base and at least one common substrate, wherein the reference photosensitive chip and the calibration photosensitive chip are electrically connected to the common substrate, The common base is arranged on the common substrate, and the calibration lens is installed on the common base. The split-array camera module according to item 9 of the scope of patent application includes a gyroscope which is arranged on the reference substrate of the reference module. The split array camera module according to item 9 of the scope of patent application, which includes a gyroscope, which is disposed on the calibration substrate of the calibration module. The split array camera module according to item 10 of the scope of patent application, which includes a gyroscope, which is disposed on the reference substrate of the reference module. The split array camera module according to item 10 of the scope of patent application includes a gyroscope arranged on the calibration substrate of the calibration module. The split array camera module according to item 11 of the scope of patent application includes a gyroscope electrically connected to the reference module and disposed on the common substrate. The split array camera module according to item 11 of the scope of patent application includes a gyroscope which is electrically connected to the calibration module and is disposed on the common substrate. The split array camera module according to item 17 of the scope of patent application, wherein the reference driver is selected from the group consisting of a motor, a thermal driver or a micro-actuator. According to the split array camera module described in item 8 of the scope of patent application, the calibration module may further include a calibration driver, wherein the calibration lens is supported above the calibration driver. According to the split-array camera module described in item 1 of the scope of patent application, the reference module is implemented as a lens with a large field of view, and its FOV is generally between 60° and 220°, and the calibration module is implemented as The FOV of a lens with a small field of view is generally between 10° and 90°. A method for assembling a split array camera module, which is characterized by comprising the following steps: (S11) at least one reference module of a split array camera module is assembled and fixed, that is, the reference module is assembled and fixed in an assembly In a reference unit of the bracket; (S12) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13) Module Height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and calibrating the corresponding height position of the calibration module; (S14) module offset calibration, measuring each calibration module The level offset between the group and the reference module, and perform a corresponding level offset calibration on the calibration module; (S15) Module rotation calibration, setting a light source and a target plate, lighting the split-array camera module, taking pictures of the target plate and collecting images, according to the reference module and each calibration The image collected by the module is used to calculate the rotation calibration amount of each calibration module using software, and the rotation position calibration of each calibration module is performed; (S16) module offset inspection/calibration, judgment Whether the offset of the horizontal position of each calibration module and the reference module is within the tolerance allowable range, if the calibration is not performed within the tolerance range, if it is not within the tolerance range, return to step (S13) to re-check each The calibration module performs height calibration, offset calibration, and rotation calibration until the horizontal position offset of each calibration module and the reference module is within the tolerance range; and (S17) fixing the module, fixing The entire split-type array camera module is assembled. The method for assembling the split-type array camera module according to item 21 of the scope of patent application, wherein the split-type array camera module includes one or more sub-modules, and at least one of the sub-modules is the reference module, The remaining sub-modules are the calibration modules, and the sub-modules are independent of each other and assembled in the assembly bracket. According to the method for assembling the split-type array camera module according to item 22 of the scope of patent application, the reference module selects the sub-module with the highest picture element in the split-type array camera module. According to the method for assembling the split array camera module according to any one of items 21 to 23 in the scope of patent application, wherein the reference module and the calibration module are both manufactured, assembled and qualified in performance testing Single camera module. The method for assembling the split-array camera module according to item 21 of the scope of patent application, wherein the assembly gap between the reference module and the reference unit is 0.01-1mm, and the calibration module and the calibration unit The surrounding assembly gap is 0.01-3mm. The method for assembling the split-array camera module according to item 21 of the scope of patent application, wherein in step (S11), the step of assembling and fixing the reference module further includes: 1) using a limit fixture to align the reference The module and the reference unit are assembled with limit elements; and 2) glue is drawn between the reference module and the reference unit to cure the glue. According to the method for assembling the split-array camera module according to item 26 of the scope of patent application, the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure. According to the method for assembling the split array camera module according to item 21 of the scope of patent application, in step (S13), the module height calibration specifically includes: 1) measuring the reference module and each calibration module For the height of a point on the lens end face of the group, the height difference between the lens end face of each calibration module and the reference module is calculated respectively; and the Z-axis displacement of each calibration module is adjusted. The method for assembling the split-array camera module according to item 21 of the scope of patent application, wherein in step (S14), the module offset calibration specifically includes: 1) calibrating the reference module and each The lens end face of the module is photographed, the image of the lens end face is captured, and the horizontal position offset of each calibration module and the reference module is calculated by software; and 2) each calibration module is adjusted The X and Y axis displacement of the group. According to the method for assembling the split-array camera module according to item 21 of the scope of patent application, in step (S15), the center of the target is an MTF test target, and the four corners of the target contain four Mark points. According to the method for assembling the split-array camera module described in item 21 of the scope of patent application, in step (S15), the rotation calibration of each calibration module is performed by movement in the three spatial dimensions of U, V, and W. The purpose is to make each calibration module parallel to the optical axis of the reference module. According to the method for assembling the split-array camera module according to item 21 of the scope of patent application, in step (S12), the pre-assembly step of the calibration module specifically includes: 1) assembling the reference module with the The bracket is installed and fixed to a fixed jig of a module calibration platform, the reference module is placed in the reference unit of the assembly bracket; 2) the calibration module is installed and fixed to a calibration jig The calibration jig is set on a six-axis platform, the calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can perform X, Y, Z, U along with the six-axis platform. , V, and W six spatial dimensions; and 3) draw glue between the calibration module and the calibration unit, the glue is a UV thermosetting glue. According to the method for assembling the split array camera module according to item 32 of the scope of patent application, in step (S17), the fixing step of the split array camera module specifically includes: 1) aligning the calibration module with the The glue between the calibration units is exposed to ultraviolet light, and the glue is semi-cured; and 2) baking the split array camera module, the glue is completely cured, and the entire split array camera module is fixed. According to the method for assembling the split-array camera module according to item 21 of the scope of patent application, in step (S12), the pre-assembly step of the calibration module specifically includes: 1) assembling the reference module with the The bracket is installed and fixed to a fixed fixture of a module calibration platform, the reference module is placed in the reference unit of the assembly bracket; and 2) the calibration module is installed and fixed to the calibration fixture, The calibration jig is set on a six-axis platform, the calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can perform X, Y, Z, U, and U, along with the six-axis platform. Movement of the six spatial dimensions of V and W. According to the method for assembling the split array camera module according to item 34 of the scope of patent application, in step (S17), the fixing step of the split array camera module specifically includes: 1) the calibration module and the Draw glue between the calibration units, and the glue is a UV thermosetting glue; 2) Perform ultraviolet exposure on the glue between the calibration module and the calibration unit, and the glue is semi-cured; and 3) bake the split-array camera module, and the glue is completely cured and fixed The entire split type array camera module. According to the method for assembling the split-array camera module described in item 33 or 35 of the scope of patent application, the baking temperature of the split-array camera module in the oven is 50℃~200℃, and the baking time is 5min~ 600min. A method for assembling a split array camera module, which is characterized in that it comprises the following steps: (S11A) a reference module of a split array camera module is assembled and fixed, that is, the reference module is assembled and fixed to an assembly bracket (S12A) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13A) Module height /Offset calibration, measuring the height difference between the lens end face and the leveling position offset of each calibration module and the reference module, and calibrating the corresponding height position and the corresponding leveling offset position of the calibration module Calibration; (S14A) module rotation calibration, set a light source and a target plate, light up the split array camera module, take pictures of the target plate and collect images, according to the reference module and each Using software to calculate the rotation calibration amount of each calibration module and calibrate the rotation position of each calibration module; and (S15A) fix the module to fix the entire The split-type array camera module is assembled. A method for assembling a split array camera module is characterized in that it comprises the following steps: (S11B) A reference module of a split array camera module is assembled and fixed, that is, the reference module is assembled and fixed in a reference unit of an assembly bracket; (S12B) at least one of a split array camera module Calibration module pre-assembly, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13B) Module offset calibration, measuring the level position deviation of each calibration module and the reference module (S14B) Module height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and calibrating the calibration module accordingly. The module performs corresponding height position calibration; (S15B) module rotation calibration, sets a light source and a target plate, lights up the split-array camera module, takes pictures of the target plate and collects images, according to the Using software to calculate the rotation calibration amount of each calibration module with reference to the image collected by the reference module and each calibration module, and perform rotation position calibration on each calibration module; and (S16B ) The fixed module, which fixes the entire split-type array camera module to complete the assembly. A method for assembling a split array camera module, which is characterized in that it comprises the following steps: (S21) a reference module of a split array camera module is assembled and fixed, that is, the reference module is assembled and fixed to an assembly bracket (S22) At least one calibration module of a split-array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S23) Module height Calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and calibrating the corresponding height position of the calibration module; (S24) module offset calibration, measuring each calibration module The level offset from the reference module, and perform a corresponding level offset calibration on the calibration module; (S25) Module rotation calibration, setting a light source and a target plate, lighting the split-array camera module, taking pictures of the target plate to collect images, according to the reference module and each calibration The image collected by the module is used to calculate the rotation calibration amount of each calibration module, and the rotation position calibration of each calibration module is performed; (S26) module offset calibration, measuring each Calibrate the horizontal offset position of the calibration module and the reference module corresponding to the calibration module; and (S27) fix the fixed module to fix the entire split array camera module, Complete the assembly. According to the method for assembling the split array camera module according to any one of items 37 to 39 in the scope of patent application, wherein the split array camera module includes one or more sub-modules, and one of the sub-modules is The reference module and the remaining sub-modules are the calibration modules, and the sub-modules are independent of each other and assembled in the assembly bracket. According to the method for assembling the split-array camera module according to any one of items 37 to 39 in the scope of the patent application, the reference module and the calibration module are both manufactured, assembled and qualified for performance testing Single camera module. The split array camera module according to any one of items 37 to 39 in the scope of patent application, wherein the reference module and the calibration module are respectively an adjustable focus camera module or a fixed focus camera module group. The split array camera module according to any one of items 37 to 39 in the scope of patent application, wherein the reference module is an adjustable focus camera module, and the calibration module is a fixed focus camera module . According to the method for assembling the split-array camera module according to any one of items 37 to 39 in the scope of patent application, the assembly gap between the reference module and the reference unit is 0.01-1mm, and the calibration mold The assembly gap between the group and the calibration unit is 0.01-3 mm. According to the method for assembling the split array camera module according to any one of items 37 to 39 in the scope of patent application, the step of assembling and fixing the reference module further includes: 1) Using a limit fixture to align the The reference module and the reference unit are assembled with limit elements; and 2) glue is drawn between the reference module and the reference unit to cure the glue. According to the method for assembling the split array camera module according to item 45 of the scope of patent application, the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure. According to the method for assembling the split-array camera module according to any one of items 37 to 39 in the scope of the patent application, the height calibration of the module specifically includes: 1) Using a laser ranging method to measure each of the reference modules Group and the height of a point on the end face of the lens of each calibration module, respectively calculating the height difference between the end face of the lens of each calibration module and the reference module; and 2) through the six-axis The platform adjusts the Z-axis displacement of each calibration module. According to the method for assembling the split-array camera module according to any one of the 37th to 39th items in the scope of the patent application, the module offset calibration specifically includes: 1) Perform a comparison between the reference module and each The lens end face of the calibration module is photographed by CCD, the image of the lens end face is captured, and the horizontal position offset of each calibration module and the reference module is calculated by software; and 2) through the six axes The platform adjusts the X and Y axis displacements of each calibration module. According to the method for assembling the split-array camera module according to any one of items 37 to 39 in the scope of patent application, the center of the target plate is an MTF test target plate, and the target plate contains 2-20 Mark points. According to the method for assembling the split array camera module according to any one of items 37 to 39 in the scope of patent application, the rotation calibration of each calibration module is performed by the six-axis platform in U, The movement of the three spatial dimensions of V and W is realized in order to make each calibration module parallel to the optical axis of the reference module. According to the method for assembling the split array camera module according to any one of items 37 to 39 in the scope of patent application, the pre-assembly step of the calibration module specifically includes: 1) combining the reference module with the The assembly bracket is installed and fixed to a fixed fixture of a module calibration platform, and the reference module is placed in the reference unit of the assembly bracket; 2) the calibration module is installed and fixed to a calibration fixture Above, the calibration jig is set on a six-axis platform, the calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can perform X, Y, Z, Movement in six spatial dimensions of U, V, and W; and 3) draw glue between the calibration module and the calibration unit, the glue is a UV thermosetting glue. According to the method for assembling the split-type array camera module according to item 51 of the scope of patent application, the step of fixing the split-type array camera module specifically includes: 1) Performing the alignment between the calibration module and the calibration unit The glue is exposed to ultraviolet light, and the glue is semi-cured; and 2) baking the split-type array camera module, the glue is completely cured, and the entire split-type array camera module is fixed. According to the method for assembling the split array camera module according to any one of items 37 to 39 in the scope of patent application, the pre-assembly step of the calibration module specifically includes: 1) combining the reference module with the The assembly bracket is installed and fixed to a fixed fixture of a module calibration platform, the reference module is placed in the reference unit of the assembly bracket; and 2) the calibration module is installed and fixed to a calibration fixture On the tool, the calibration jig is set on a six-axis platform, the calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can perform X, Y, Z along with the six-axis platform. , U, V, and W movement in six spatial dimensions. The method for assembling the split-type array camera module according to item 53 of the scope of patent application, wherein the step of fixing the split-type array camera module specifically includes: 1) drawing glue between the calibration module and the calibration unit , The glue is a UV thermosetting glue; 2) UV-exposing the glue between the calibration module and the calibration unit, and the glue is semi-cured; and 3) baking the split array In the camera module, the glue is completely cured to fix the entire split array camera module. According to the method for assembling the split array camera module described in item 51 of the scope of patent application, the baking temperature of the split array camera module in the oven is 50° C. to 200° C., and the baking time is 5 min to 600 min.

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