WO2021249191A1 - Photosensitive assembly having anti-shake function, camera module, and assembly methods therefor - Google Patents

Abstract

The present invention relates to a photosensitive assembly having an anti-shake function, comprising: a photosensitive chip; and a planar mobile actuator, which has an intermediate base, a foundation base and a MEMS drive structure. The foundation base comprises a base plate and a support base formed by extending upward from a periphery of the base plate, the intermediate base being located within the foundation base and a gap being provided between a side surface of the intermediate base and the support base; the MEMS drive structure comprises a comb-shaped movable portion and a comb-shaped fixed portion that are mutually fitted, a top surface of the comb-shaped movable portion being connected to a bottom surface of the intermediate base, and a bottom surface of the comb-shaped fixed portion being connected to a top surface of the bottom plate; the photosensitive chip is mounted on a top surface of the intermediate base; and the intermediate base is connected to the support base by means of a plurality of elastic connecting lines, and an electrical connection between the intermediate base and the foundation base is achieved by means of the connecting lines. Further provided are a corresponding camera module, and assembly methods for the photosensitive assembly and the camera module.

Description

Photosensitive component with anti-shake function, camera module and assembly method thereof

Related application

This application claims the priority of the Chinese patent application number 202010512053.7 entitled "Photosensitive component with anti-shake function, camera module and assembly method thereof", filed on June 8, 2020, and includes the above-mentioned application by reference. The entire contents of.

Technical field

The present invention relates to the technical field of camera modules. Specifically, the present invention relates to a photosensitive component with an anti-shake function, a camera module and an assembly method thereof.

Background technique

With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been developed and advanced rapidly, and in recent years, camera modules have The group has been widely used in many fields such as medical treatment, security, industrial production and so on. Currently, in the field of consumer electronics (such as the field of mobile phones), the optical image stabilization function has become one of the common functions of camera modules.

Anti-shake technology was first applied to cameras. Generally, standard focal lengths or wide-angle lenses have a short focal length and low weight. Hand-held can meet the shooting needs, but in the process of telephoto and macro shooting, the aperture needs to be sufficient when the aperture is unchanged. The exposure time is very easy to cause jitter if you hold the shooting at this time. The aperture of the mobile phone itself is limited, and the amount of light entering is worrying. If you want to get a clear enough picture, you need a long enough exposure time. At this time, you need the blessing of anti-shake technology. Specifically, when holding a smartphone to take a photo, the shaking of the hand will cause a slight tilt of the camera (usually within +/-0.5 degrees). This tilt causes a change in the viewing angle of the lens. Taking the lens as the reference object, it is equivalent to The object being photographed moves, so the resulting image will also be shifted from the original position on the image sensor. As a result, the image is always unstable with the shaking of the hand, which affects the imaging quality of the photographing device. Therefore, the support of anti-shake technology is required.

At present, anti-shake technology can be divided into optical anti-shake, electronic anti-shake and body sensor anti-shake. If it is divided according to the degree of freedom of movement of the anti-shake adjustment, it can also be divided into two-axis, three-axis, four-axis and five-axis anti-shake. Electronic image stabilization generally does not require additional hardware, but requires the DSP to handle larger loads. Electronic image stabilization usually analyzes the image on the CCD and then uses the edge image to compensate. However, this compensation method will lose some pixels at the edge. The current common solution is to use a large wide-angle lens. Electronic image stabilization only performs post-processing on the collected data, and does not substantially improve the image quality. On the contrary, it still damages the overall image quality to a certain extent.

Optical image stabilization generally requires hardware support. Optical image stabilization is to correct the "optical axis shift" through the floating lens of the lens. The principle is to detect the slight movement through the gyroscope in the lens, and then send the signal to the microprocessor. The processor immediately calculates the amount of displacement that needs to be compensated, and then compensates the lens group according to the direction and amount of lens shake. Compensation, which effectively compensates for image blur caused by camera shake. This kind of anti-shake technology has relatively high requirements for lens manufacturing (the optical anti-shake currently used in mobile phones mainly drives the entire lens to move together), and the cost is relatively high. The effect of the optical image stabilization function is quite obvious. Under normal circumstances, turning on this function can increase the shutter speed of 2-3 blocks, so that hand-held shooting will not produce blurring. Especially in a large zoom camera, the effect is more obvious, because in general, the larger the zoom is, even the slightest shake will have a great impact on the image quality. The dither function has a greater demand. Compared with electronic image stabilization, the full-frame image pixels of optical image stabilization are all effective pixels, which are more practical, and the image quality can be substantially improved, but its disadvantages are high design cost, high component cost, and high power consumption , And the need for a certain amount of space results in a larger volume required for installation. Due to the limitations of various factors of optical image stabilization, mobile phone manufacturers generally use optical image stabilization technology in their mid-to-high-end models.

In the existing optical image stabilization technology, there are a variety of design solutions based on different degrees of freedom of movement, including two-axis, three-axis, four-axis, and five-axis anti-shake, etc. The biggest difference between these design solutions is that the lens can go in those directions Mobile, in the past, mobile phones were mostly two-axis and three-axis anti-shake, while four-axis anti-shake is based on three-axis anti-shake, which is a further function, while realizing the compensation of horizontal, vertical, forward and roll directions. At present, some four-axis optical image stabilization solutions use the gyroscope and acceleration sensor in the mobile phone to detect the jitter in 8 directions at high speed, and transmit the signal to the microprocessor to immediately calculate the amount of displacement that needs to be compensated, and then transmit the data to it in real time. The micro motor quickly adjusts the posture of the camera module, thereby effectively overcoming the blur of the image caused by the shaking of the mobile phone.

Further, the jitter in the daily shooting process is analyzed. First of all, the human eye itself has an extremely "precise" anti-shake system, and jitter has no effect on the human eye. However, for various scenes in daily photography, jitter is often inevitable. The "shake" in daily mobile phone shooting scenes can include: camera shake, motion blur, and rolling door effect.

Among them, camera shake mainly refers to slight physical muscle and hand vibration, which is common in taking pictures and recording videos. The main cause of camera shake is hand shake. Hand shaking is the easiest to overcome in shaking. Through certain exercises or some stable postures, the anti-shake effect can be improved to a certain extent; in addition, you can also find support for the body when shooting, or simply rely on An external device (such as a tripod) secures a mobile phone or camera.

Dynamic blur can also be called motion blur. Motion blur refers to the obvious blur and drag traces caused by the rapid movement of the picture. There are two main reasons for motion blur. One is that the movement speed is faster than the exposure time. The longer the exposure time, the greater the "jitter" of the motion blur. The second is that continuous motion makes the lens fail to capture every frame of the picture in detail, causing motion blur.

The rolling door effect is also called the jelly effect. The formation of this effect is determined by the characteristics of the CMOS sensor. Since most cameras with CMOS sensors use a rolling shutter, it achieves imaging through progressive exposure. For this type of CMOS sensor, during the shooting process, the image sensor scans line by line and performs exposure line by line until all pixels are exposed to obtain a complete picture. Generally speaking, all actions in the shooting process are completed in a very short time, so under normal circumstances it will not affect the shooting. However, if the subject is moving or vibrating rapidly relative to the camera, and the rolling shutter mode is used to shoot, the progressive scan speed is not enough, the shooting result may appear "tilt", "wobbled" or "partially exposed". This kind of rolling shutter mode shooting high-speed motion or rapid vibration of the above-mentioned phenomenon of the target, is defined as the jelly effect or the rolling door effect.

It should be noted that the current OIS technology on the mobile phone module only compensates for the image shift caused by the camera tilt, and does not deal with the image problem caused by the camera's vertical and horizontal translation jitter (this point is different from the public's perception, so it is necessary instruction). When shooting distant objects, the image offset caused by the camera's translational shaking can be considered as non-existent, and no OIS system compensation is required. The image instability is entirely due to the tilt and shake of the camera. But when shooting macros, the effect of camera panning and shaking will gradually become apparent. In order to avoid an overly complex system architecture, the current mobile phone OIS camera module chooses to ignore the macro shooting problem caused by translational jitter. Optical image stabilization has better shooting effects in some special environments: low-light environments, zooming, handheld shooting, shooting during sports or shooting in a bumpy state (at this time, the jitter of the external environment is much greater than the jitter caused by the hand , OIS can reduce the bumpy feeling to a great extent).

In order to effectively cope with various kinds of shaking during shooting, a sensor anti-shake technology has appeared on the market, and the current sensor anti-shake technology is mainly used in the camera field. The technical principle of sensor anti-shake is to install the image sensor on a freely movable bracket, and also cooperate with the gyroscope to sense the direction and amplitude of the camera's shaking, and then control the movement of the sensor for corresponding displacement compensation. The irregularities of various types of jitter make the sensor anti-shake technology usually need to rely on multi-axis movement technology to compensate for jitter in multiple directions at the same time. However, on the other hand, if multi-axis anti-shake is applied to the image sensor, it may increase the volume of the module. Therefore, how to add sensor anti-shake technology based on multi-axis anti-shake in the limited space of electronic devices such as mobile phones is a major problem facing the current market.

Furthermore, when applied to the field of consumer electronic equipment such as mobile phones, the anti-shake design of the camera module also needs to consider the reliability of the device and the production yield. In other words, the sensor anti-shake solution not only needs to solve the miniaturization problem , Also need to have good operability in the production process, in order to improve the reliability of the assembly and yield.

Summary of the invention

The purpose of the present invention is to overcome the shortcomings of the prior art and provide a sensor anti-shake solution that can realize miniaturization.

In order to solve the above technical problems, the present invention provides a photosensitive component with an anti-shake function, which includes: a photosensitive chip; It comprises a bottom plate and a support seat formed upwardly extending from the periphery of the bottom plate, the middle seat is located in the base and there is a gap between the side surface of the middle seat and the support seat; the MEMS driving structure includes A comb-shaped movable portion and a comb-shaped fixed portion adapted to each other, the top surface of the comb-shaped movable portion is connected with the bottom surface of the intermediate seat, and the bottom surface of the comb-shaped fixed portion is connected with the top surface of the bottom plate Wherein, the photosensitive chip is mounted on the top surface of the middle seat; and the middle seat is connected to the support seat through a plurality of flexible connecting wires, and the middle seat and the base are realized by the connecting wires The electrical connection of the socket.

Wherein, the photosensitive component with anti-shake function further includes a circuit board; the bottom surface of the base is installed on the surface of the circuit board.

Wherein, the flexible connecting wire is an SMA wire.

Wherein, the photosensitive chip and the intermediate base are electrically connected by wire bonding.

Wherein, the MEMS driving structure includes an x-axis driving structure and a y-axis driving structure, wherein the x-axis and the y-axis are perpendicular to each other and both are parallel to the photosensitive surface of the photosensitive chip; the x-axis driving structure includes The comb-shaped movable portion that can be translated in the x-axis direction and the comb-shaped fixed portion adapted to it, and the y-axis drive structure includes the comb-shaped movable portion that can be translated in the y-axis direction and the comb-shaped movable portion. The adapted comb-shaped fixing part.

Wherein, the MEMS driving structure includes a rotation driving structure for driving rotation around a z-axis, the z-axis being perpendicular to the x-axis and the y-axis; the rotation driving structure includes the comb-shaped fixed portion And the comb-shaped movable part.

Wherein, the intermediate seat, the base and the MEMS drive structure are manufactured based on semiconductor technology; wherein the gap between the intermediate seat, the base and the MEMS drive structure is formed by removing sacrificial materials.

Wherein, the photosensitive component with anti-shake function further includes a filter, and the filter is installed on the top surface of the support base.

Wherein, the edge area of the circuit board has a lens holder, and the lens holder is suitable for installing a lens assembly.

Wherein, the intermediate seat is a first circuit board made based on a lamination process, the bottom plate is a second circuit board made based on a lamination process, and the support base is installed or directly formed on the circumference of the second circuit board. Along the area; the MEMS drive structure is manufactured based on semiconductor technology, and the MEMS drive structure has a first mounting surface located on its top surface and connected to the comb-shaped movable portion, and located on its bottom surface and fixed with the comb The second mounting surface is connected to the second mounting surface, the first circuit board is mounted on the first mounting surface, and the second circuit board is mounted on the second mounting surface.

Wherein, the first circuit board and the second circuit board are both PCB boards.

According to another aspect of the present application, there is also provided a camera module, which includes: a lens assembly; Shake the top surface of the photosensitive component.

Wherein, the lens assembly includes a motor and an optical lens, and the motor is used to drive the optical lens to move to achieve a focusing function; in the photosensitive assembly with anti-shake function, the planar moving actuator is used to drive the intermediate And drive the photosensitive chip to move to realize the anti-shake function.

According to another aspect of the present application, there is also provided a method for assembling a photosensitive component with anti-shake function, which includes: step 1) preparing a planar moving actuator, which has an intermediate seat, a base and a MEMS drive structure; wherein, The base includes a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate; the middle seat is located above the bottom plate and there is a gap between the side surface of the middle seat and the support seat; the MEMS The driving structure includes a comb-shaped movable part and a comb-shaped fixed part that are adapted to each other. The top surface of the comb-shaped movable part is connected with the bottom surface of the intermediate seat. Top surface connection; step 2) inject a hydrosol into the gap between the middle seat and the base, and then solidify the hydrosol to fix the middle seat in the base; step 3) A photosensitive chip is mounted on the top surface of the intermediate base, a plurality of flexible connecting lines are formed between the intermediate base and the supporting base through the WB process, and the connecting lines electrically conduct the photosensitive chip and the base And step 4) removing the hydrosol through a water washing process to release the intermediate seat.

Wherein, in the step 3), the elastic connecting wire is an SMA wire.

Wherein, the step 3) further includes: electrically connecting the photosensitive chip and the intermediate base through a WB process.

Wherein, in the step 1), the planar moving actuator is a MEMS actuator manufactured by a semiconductor process, and the manufacturing method of the MEMS actuator includes: 11) manufacturing a base; 12) on the upper surface of the base Making a lower connecting layer, the lower connecting layer includes a lower connecting portion for connecting the base and the comb-shaped fixing portion and a sacrificial material filled between the lower connecting portion; 13) the lower connecting layer A comb-shaped driving structure pattern layer is fabricated on the upper surface. The comb-shaped driving structure pattern layer includes a plurality of comb-shaped driving structure patterns and a sacrificial material filled between the comb-shaped driving structure patterns, each of the comb-shaped driving structure patterns is The comb-shaped fixed part and the comb-shaped movable part are included; 14) an upper connecting layer is fabricated on the upper surface of the comb-shaped driving structure pattern layer, and the upper connecting layer includes a middle seat and the comb-shaped movable part. The upper connecting part of the moving part and the sacrificial material filled between the upper connecting part; 15) fabricating an intermediate seat on the upper surface of the upper connecting layer; and 16) removing the sacrificial material to obtain the required MEMS actuators.

According to another aspect of the present application, there is also provided a method for assembling a camera module, which includes: a) assembling a photosensitive component based on any of the aforementioned methods for assembling a photosensitive component with anti-shake function; and b) assembling the lens assembly with The photosensitive components are assembled together to obtain the camera module.

Compared with the prior art, this application has at least one of the following technical effects:

1. This application can realize the anti-shake function of the photosensitive component with a small space cost.

2. This application can realize the anti-shake function of the photosensitive component in multiple directions.

3. This application can ensure good conductivity between the chip and the base during the movement of the chip.

4. The present application provides a structure for enhancing the strength of the chip, thereby effectively protecting the structural reliability of the chip.

5. In some embodiments of the present application, the middle seat and the base are connected by elastic wires, so that when the middle seat moves relative to the base, good energization between the two is ensured.

6. In some embodiments of the present application, a method suitable for manufacturing the aforementioned photosensitive component with anti-shake function is provided, and mass production of the anti-shake structure can be realized by using this method.

7. In some embodiments of the present application, before the wire bonding process and the chip mounting step, the gap is filled with hydrosol to fix the intermediate seat, which can improve production efficiency and production yield.

8. In some embodiments of the present application, a water washing process can be used to remove the hydrosol. The water washing process is also beneficial to clean the dust generated during the manufacturing process and avoid stains on the surface of the chip or the photosensitive path. With this manufacturing method, the manufacturing process of the anti-shake module can be simplified.

9. In some embodiments of the present application, only the MEMS structure is used, and the chip can be driven to move without the cooperation of other components to achieve the anti-shake effect, which corresponds to the original motor structure of the module based on driving the lens to move, which is a lot of simplification.的Component structure.

Description of the drawings

Figure 1a shows a schematic side view of a photosensitive component with anti-shake function in an embodiment of the present application;

Figure 1b shows a schematic top view of a photosensitive component with anti-shake function in an embodiment of the present application;

FIG. 2 shows a schematic top view of the MEMS driving structure 40 in an embodiment of the present application;

FIG. 3 shows a schematic cross-sectional view of a photosensitive component with anti-shake function in an embodiment of the present application;

4 shows a cross-section of the photosensitive component of FIG. 3 and a top view structure of the rectangular driving structure therein;

FIG. 5 shows a schematic structural diagram of a camera module in an embodiment of the present application;

Figure 6a shows a schematic diagram of the bottom of the base in an embodiment of the present application;

Fig. 6b shows a schematic top view of a circuit board in an embodiment of the present application;

Figure 7 shows a schematic cross-sectional view of a photosensitive component with a circuit board in an embodiment of the present application;

FIG. 8 shows a three-dimensional schematic diagram of a photosensitive component according to another embodiment of the present application;

Figure 9 shows a cross-sectional view of a photosensitive component according to another embodiment of the present application;

FIG. 10 shows a cross-sectional view of the MEMS actuator prepared in step S1 in an embodiment of the present application;

Figure 11 shows a cross-sectional view of the semi-finished product after step S2 in an embodiment of the present application;

Figure 12 shows a cross-sectional view of the semi-finished product after step S3 in an embodiment of the present application;

Figure 13 shows a cross-sectional view of the photosensitive component after step S3 is completed in an embodiment of the present application;

Figure 14 shows a cross-sectional view of the base in an embodiment of the present application;

FIG. 15 shows a cross-sectional view of a semi-finished MEMS actuator after completing step S12 in an embodiment of the present application;

FIG. 16 shows a cross-sectional view of the semi-finished MEMS actuator after step S13 is completed in an embodiment of the present application and the top view shape of the comb-shaped drive structure pattern layer in it;

FIG. 17 shows a cross-sectional view of a semi-finished MEMS actuator after completing step S14 in an embodiment of the present application;

FIG. 18 shows a cross-sectional view of a semi-finished MEMS actuator after completing step S15 in an embodiment of the present application;

Figure 19 shows the assembly process of the photosensitive component in an embodiment of the present application;

FIG. 20 shows a manufacturing process of manufacturing a MEMS actuator based on a semiconductor process in an embodiment of the present application.

detailed description

In order to better understand the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, expressions such as first, second, etc. are only used to distinguish one feature from another feature, and do not represent any restriction on the feature. Therefore, without departing from the teachings of the present application, the first subject discussed below may also be referred to as the second subject.

In the drawings, the thickness, size, and shape of objects have been slightly exaggerated for ease of description. The drawings are only examples and are not drawn strictly to scale.

It should also be understood that the terms "including", "including", "having", "including" and/or "including", when used in this specification, mean that the stated features, wholes, steps, and operations are present. , Elements and/or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and/or their combinations. In addition, when expressions such as "at least one of" appear after the list of listed features, the entire listed feature is modified instead of individual elements in the list. In addition, when describing the embodiments of the present application, the use of “may” means “one or more embodiments of the present application”. And, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially", "approximately" and similar terms are used as terms representing approximation, not terms representing degree, and are intended to illustrate the measurement that will be recognized by those of ordinary skill in the art. The inherent deviation in the value or calculated value.

Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having meanings consistent with their meanings in the context of related technologies, and will not be interpreted in an idealized or excessively formal sense unless This is clearly defined in this article.

It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other if there is no conflict.

The present invention will be further described below in conjunction with the drawings and specific embodiments.

Figure 1a shows a schematic side view of a photosensitive component with anti-shake function in an embodiment of the present application. Figure 1b shows a schematic top view of a photosensitive component with anti-shake function in an embodiment of the present application. 1a and 1b, in this embodiment, the photosensitive component with anti-shake function may include a photosensitive chip 10 and a MEMS actuator. The MEMS actuator has an intermediate base 20, a base 30 and a MEMS driving structure 40. Wherein, the base 30 includes a bottom plate 31 and a support seat 32 extending upward from the periphery of the bottom plate 31; the middle seat 20 is located above the bottom plate 31 and the side surface of the middle seat 20 is There is a gap between the seats 32. In the MEMS actuator, between the upper surface of the bottom plate 31 of the base 30 and the lower surface of the middle seat 20 is a MEMS drive structure 40 that can drive the middle seat 20 to move. This structure drives the middle seat 20 to perform according to the instructions sent by the control center. The corresponding movement is used to realize the adjustment of the position of the photosensitive chip 10, so as to achieve the effect of anti-shake. FIG. 2 shows a schematic top view of the MEMS driving structure 40 in an embodiment of the present application. With reference to FIGS. 1a and 2 in combination, in this embodiment, the driving structure of the middle seat 20 is implemented as a MEMS actuator, and the photosensitive chip 10 is mounted on the middle seat 20 and moves accordingly with the movement of the middle seat 20. The MEMS actuator (ie, the MEMS driving structure 40) may include a plurality of rectangular driving structures 41 and a plurality of sector-shaped driving structures 42. The fan-shaped driving structure 42 can rotate its comb-shaped movable part to a certain angle under the driving of electrostatic force, and the size of the angle matches the voltage difference. For the rectangular drive structure 41 located at the four corners, the MEMS comb-shaped movable part can be driven by electrostatic force to move along the positive and negative directions of the X axis, or along the positive and negative directions of the Y axis, thereby driving the chip to shake in the horizontal direction. Compensation. Regardless of the rectangular driving structure 41 or the fan-shaped driving structure 42, each driving structure may include a comb-shaped movable portion 44 and a comb-shaped fixed portion 43 that are adapted to each other. Further, FIG. 3 shows a schematic cross-sectional view of a photosensitive component with anti-shake function in an embodiment of the present application. 3, in this embodiment, the top surface of the comb-shaped movable portion 44 is connected to the bottom surface of the intermediate seat 20, and the bottom surface of the comb-shaped fixed portion 43 is connected to the top surface of the bottom plate 31 (may be With reference to FIG. 4, FIG. 4 shows a cross-section of the photosensitive assembly of FIG. 3 and a top view structure of the rectangular driving structure therein). The photosensitive chip 10 is mounted on the top surface of the middle seat 20. The intermediate base 20 is connected to the support base 32 through a plurality of flexible connecting wires 60, and the electrical connection between the intermediate base 20 and the base 30 is realized through the connecting wires 60. Specifically, the middle seat 20 can be suspended directly above the inner space of the base 30 through an elastic connecting line 60, and the two are indirectly connected together by a MEMS drive structure 40 (also called a MEMS drive module). The middle seat 20 The edge portion of the base 30 is connected to the support base 32 of the base 30 through a plurality of connecting wires 60 to realize the circuit supply of the intermediate base 20. At the same time, the multiple connecting wires 60 can also function to suspend the intermediate base 20 (refer to FIG. 1 b in combination), so that the intermediate base 20 can move relative to the base 30 under the drive of the MEMS driving structure 40. In an embodiment of the present application, the photosensitive chip 10 is mounted on the middle seat 20, and the middle seat 20 and the photosensitive chip 10 are connected through a wire bonding (also called wire bonding, abbreviated as WB) process. In this way, the base 30 connected to the outside can be electrically connected to the photosensitive chip 10 through the intermediate base 20, so as to ensure the normal operation of the photosensitive chip 10. Due to the action of the MEMS driving module, the intermediate base 20 can move relative to the base 30. In order to ensure the conduction of the circuit, the connecting line 60 between the intermediate base 20 and the base 30 may be an elastic wire. In this embodiment, the connecting wire 60 can be an SMA wire (SMA is the English abbreviation of shape memory alloy). Due to its own characteristics, the SMA wire can not only play the role of conducting the circuit, but also realize itself while working. The shape change can better adapt to the movement of the middle seat and avoid problems such as poor contact or open circuit in the electrical connection between the middle seat and the base due to the movement of the middle seat.

In an embodiment of the present application, when manufacturing the MEMS actuator, the middle seat mounted with the photosensitive chip can be suspended in the base through the connecting wire, and the middle seat is passed through the WB (Wire Bonding) process and The photosensitive chip (hereinafter sometimes referred to as the photosensitive chip as a chip) conducts conduction to ensure the normal operation of the chip. The base and the intermediate base can be realized by releasing (that is, removing) the sacrificial layer. Therefore, although the intermediate base and the base can be indirectly connected through the MEMS structure, there is still greater mobility between the two. In this embodiment, a hydrosol method can be used. After the sacrificial layer is released, the gap between the middle seat and the base is filled with hydrosol material, and after the glue is solidified, the middle seat and the base are in a relatively fixed state at this time. In this way, the DB and WB processes are used to conduct conduction between the chip and the intermediate base, and at the same time, the intermediate base and the base can be electrically connected with the SMA wire to realize the circuit setting of the entire structure. When the circuit setting is completed, the water washing process is used to After the sol is disposed of, the intermediate seat can be released and the relative movement of the intermediate seat and the base can be realized. At the same time, the water washing process is also beneficial to clean the dust generated during the manufacturing process and avoid stains on the surface of the chip or the photosensitive path, thus greatly improving the imaging quality of the subsequent camera module.

Further, in an embodiment of the present application, the photosensitive component with anti-shake function may further include a circuit board, and the bottom surface of the base may be installed on the upper surface of the circuit board. In this embodiment, the base may have various functions and functions. A circuit structure may be arranged inside the base, and electrical contacts may be provided at the connection between the support base and the SMA wire, and the contacts may be connected to the SMA wire and then to the intermediate base. At the same time, the part connected to the circuit board at the bottom of the base also has an array of contacts, which can be matched with the contacts on the circuit board to realize the circuit supply of the base.

In this application, the electrical connection between the photosensitive chip and the intermediate base is not limited to the wire bonding process. For example, in another embodiment of the present application, a contact array may be provided on the back of the photosensitive chip, and the contact array may be electrically connected to the intermediate base through the contact array.

Further, still referring to FIG. 3, in an embodiment of the present application, the filter 50 may be directly bonded to the top surface of the support base 32 by means of direct bonding. In this embodiment, the contact of the support base 32 may be arranged on the inner side of the support base 32, and the contact may be connected to the contact of the intermediate base 20 through an SMA wire. In the manufacturing process, the SMA wire can be connected between the support base contact and the intermediate base contact through a wire bonding process (ie, WB process).

Fig. 9 shows a cross-sectional view of a photosensitive component according to another embodiment of the present application. Referring to FIG. 9, in another embodiment of the present application, a molded seat 33 may be formed on the top surface of the support seat 32. In this embodiment, a support base contact 32a may be provided on the top surface of the support base 32, and the support base contact 32a is electrically connected to the contact of the intermediate base 20 with an SMA wire based on a wire bonding process. At this time, the SMA wire will be bridged between the middle seat 20 and the support seat 32 to realize the circuit conduction between the middle seat 20 and the base 30. In actual use, the intermediate base 20 will continuously move relative to the base 30 due to the driving force. In this embodiment, in order to protect the stability of the SMA wire connected to the contact, it can be directly mounted on the support base of the base. A molding layer is made on the top surface through a molding process, thereby forming the molding seat 33 on the top surface of the support seat. The molded seat 33 can directly mold (encapsulate) the contacts connected to the SMA wire inside the structure, thereby effectively protecting the SMA wire during movement and preventing frequent movement of the middle seat during long-term use (referring to relative The movement of the base) causes the SMA wire to fall off. Further, the filter 50 is mounted on (for example, pasted on) a mold base 33 formed by molding. In this embodiment, the molded base 33 and the support base 32 can also be regarded as an integral composite support base. The composite support base includes a support base made based on a semiconductor process and a molded base made based on a molding process. The support base contact is located between the molded base and the support base made based on the semiconductor process. The support base contact and the SMA The sections of the wire close to the contact of the support base are all encapsulated in the composite support base by the molded base, thereby effectively protecting the SMA wire during movement and preventing problems such as poor contact or open circuit in the circuit.

Further, in an embodiment of the present application, the photosensitive chip has a photosensitive surface. The MEMS drive structure includes an x-axis drive structure for driving translation along the x-axis direction, a y-axis drive structure for driving translation along the y-axis direction, and a rotation drive structure for driving rotation around the z-axis, wherein the The x-axis and the y-axis are perpendicular to each other and parallel to the photosensitive surface; the combined shape of the comb-shaped fixed portion and the comb-shaped movable portion of the x-axis drive structure is rectangular, and the y The combined shape of the comb-shaped fixed part and the comb-shaped movable part of the shaft drive structure is also rectangular; the MEMS drive structure includes a rotary drive structure for driving rotation around the z-axis, and the z-axis is perpendicular to The photosensitive surface (that is, perpendicular to the x-axis and the Y-axis); the combined shape of the comb-shaped fixed part and the comb-shaped movable part of the rotation drive structure is a fan shape. It should be noted that the driving direction and shape combination of the MEMS driving structure described in this application are not limited to the situation described in this embodiment. For example, in some other embodiments of the present application, the MEMS drive structure may also only include an x-axis drive structure for driving translation along the x-axis direction and a y-axis drive structure for driving translation along the y-axis direction, excluding A rotary drive structure used to drive rotation around the z-axis; or only a rotary drive structure used to drive rotation around the z-axis, excluding the x-axis drive structure used to drive translation along the x-axis direction and drive along the y-axis direction A translational y-axis drive structure; or only an x-axis drive structure for driving translation along the x-axis direction, excluding a y-axis drive structure for driving translation along the y-axis direction and a rotary drive for driving rotation around the z-axis structure.

Further, FIG. 5 shows a schematic structural diagram of a camera module in an embodiment of the present application. Referring to FIG. 5, this embodiment provides a camera module, which includes a photosensitive component with an anti-shake function and a lens assembly 200 mounted on the photosensitive component. The photosensitive component with anti-shake function may include a circuit board 80 (the circuit board 80 may include a PCB rigid board 80a, an FPC connection belt 80b and a connector 80c), and the bottom surface of the base 30 may be mounted on the circuit board The upper surface of 80. In this embodiment, a circuit structure may be provided inside the base, and electrical contacts may be provided at the connection between the support base and the SMA wire, and the contacts may be connected to the SMA wire and then to the intermediate base. At the same time, the part connected to the circuit board at the bottom of the base also has an array of contacts, which can be matched with the contacts on the circuit board to realize the circuit supply of the base. The edge area of the circuit board may have a lens holder, and the lens holder is suitable for mounting a lens assembly.

Further, FIG. 6a shows a schematic diagram of the bottom of the base in an embodiment of the present application. Fig. 6b shows a schematic top view of a circuit board in an embodiment of the present application. Referring to Figures 6a and 6b, in this embodiment, electrical contacts are provided at the bottom of the base to realize the electrical conduction between the base and the circuit board, and also to supply current to the MEMS drive structure. Specifically, by matching the electrical contacts 34 of the base and the electrical contacts 82 of the circuit board 80 with each other, the current supply of the base 30 can be realized. A fixing position 33 may be provided in the middle of the base 30, and the fixing position 33 is used for fixing with the circuit board 80. At the fixing position 33, the bonding form can be selected, or other fixing forms can be selected, as long as the electrical contacts between the base and the circuit board can be matched well.

In an embodiment of the present application, the MEMS actuator not only includes elements that provide driving force (that is, comb-shaped movable parts and fixed parts), but also includes a base, an intermediate base and other elements connected to it, through SMA The wire can conduct the base and the intermediate base, and the gold wire can conduct the chip and the intermediate base, and then conduct the circuit of the entire photosensitive component. Among them, the multiple electrical contacts on the bottom surface of the base can be arranged into a base contact array, and the contact array is mainly used to contact the corresponding contact array on the surface of the circuit board (ie, the circuit board contact array). In order to realize the energization of the entire MEMS drive structure. Since the MEMS actuator and the circuit board are directly fixed together, when the MEMS actuator is fixed on the surface of the circuit board, the filter 50 can be directly installed on the top surface of the support base of its base (refer to Figure 3 and Figure 7) , In order to realize the filtering of stray light, and at the same time, it can also protect the surface of the chip and prevent the surface of the chip from falling dust.

Fig. 7 shows a schematic cross-sectional view of a photosensitive component with a circuit board in an embodiment of the present application. Referring to FIG. 7, the edge area of the circuit board 80 is equipped with a lens holder 81, and the top surface 81a of the lens holder 81 is suitable for installing a lens assembly with a driving motor (the lens assembly is not shown in FIG. 7). The driving motor can be Drive the optical lens to move along the optical axis to realize the autofocus function of the lens. The MEMS drive structure mainly realizes the function of jitter correction. The drive motor of the lens assembly and the MEMS drive structure in the photosensitive assembly cooperate with each other to effectively improve imaging the quality of. At the same time, there is also an electrical contact array matching the base on the circuit board, and the power terminal on the circuit board can be connected to the power supply of an electronic device (such as a mobile phone) by a connecting strap to realize power supply. There are conductive electrical contacts between the circuit board and the base to realize the power supply of the circuit in the base. The base uses its internal circuit settings (not shown in the figure) to supply power to the MEMS drive structure and the chip to ensure The normal operation of the entire camera module.

In an embodiment of the present application, the photosensitive component with anti-shake function can be applied to a periscope camera module. Compared with the traditional camera module structure, in the periscope camera module of this embodiment, the photosensitive chip can realize the horizontal direction under the force of the driving device (here the horizontal direction refers to the direction parallel to the photosensitive surface) Movement and rotation adjustments. When jitter occurs during the photographing process, the chip can be corrected directly from the horizontal direction. Compared with the traditional driving lens to achieve the correction effect, this embodiment can reduce the driving force while reducing the design difficulty of the driving structure, making the correction effect more significant. In this embodiment, the motor driving the lens can only realize the function of focusing, and the photosensitive component can realize the function of chip anti-shake, that is, the movement of the chip is used instead of the movement of the optical lens to realize anti-shake. In this embodiment, the focus function and the anti-shake function are separately set (that is, the focus function and the anti-shake function are respectively implemented by the motor driving the lens and the MEMS driving structure driving the photosensitive chip), which will make the correction result more accurate and better Meet the current requirements for photographic imaging quality. When assembling the camera module, the structure can be divided into a photosensitive component and a lens component with anti-shake function, and the two modules (ie, photosensitive component and lens component) are prefabricated separately, and then the two modules are assembled Come together.

When manufacturing the photosensitive component, the MEMS actuator can be manufactured first, and then the MEMS actuator can be fixed to the upper surface of the circuit board, and the contact array at the bottom of the base can be matched with the contact array of the circuit board. Glue can be applied to the bottom of the base to fix the base and the circuit board structure together, or other methods can be used to fix the circuit board and the combined structure of the base together, such as welding. After the base is fixed, the mirror holder can also be fixed on the surface of the circuit board, and the mirror holder can surround the outside of the base so as to accommodate the entire base inside. The lens assembly can be fixed on the top surface of the lens holder. Among them, the lens assembly may be a focus motor and an optical lens. During the initial installation process, the optical axis of the optical lens and the center of the chip can be aligned by mechanical correction (the two can be regarded as aligned if they are kept within a certain error range). In the subsequent calibration process of the camera module, the error of the chip and the optical axis after calibration can also be ensured within a certain error range, thereby effectively improving the imaging quality of the camera module.

In the above embodiment, the involved base and the intermediate base are made based on semiconductor technology, and they form an integral MEMS actuator together with the MEMS drive structure. The MEMS actuator can be regarded as a plane movement actuator, which is used to realize the plane movement of the photosensitive chip, where the plane movement refers to the movement of the photosensitive chip on a plane parallel to the photosensitive surface, such as x-axis translation, y-axis translation or Rotation around the z axis. However, the photosensitive component of the present application is not limited to this. For example, in another embodiment of the present application, the base and the intermediate base may be manufactured by a non-semiconductor process, and only the MEMS drive structure is manufactured by a semiconductor process. Fig. 8 shows a three-dimensional schematic diagram of a photosensitive assembly according to another embodiment of the present application. Referring to FIG. 8, in this embodiment, the base and the intermediate base may both be realized by using a circuit board manufactured based on a lamination process. Specifically, the MEMS driving structure 40 may include a comb-shaped movable part and a comb-shaped fixed part matching the comb-shaped movable part. The first mounting surface may be located on the comb-shaped movable portion or connected to the comb-shaped movable portion, and the second mounting surface may be located on the comb-shaped fixed portion or connected to the comb-shaped fixed portion. Optionally, the first mounting surface may be located on the top of the MEMS driving structure, and the second mounting surface may be located on the bottom of the MEMS driving structure. The first circuit board 20a can be mounted on the first mounting surface, and the second circuit board 30a can be mounted on the second mounting surface. In this way, the first circuit board 20a, the second circuit board 30a and the MEMS driving structure 40 can jointly constitute a planar moving actuator. Among them, the first circuit board 20a can constitute the movable part of the planar moving actuator, which can be regarded as the intermediate seat in the foregoing embodiment, and the second circuit board 30a can constitute the fixed part of the planar moving actuator, which can be regarded as It is the base in the previous embodiment. Further, the peripheral edge of the second circuit board 30a may extend upward to form a support seat (not shown in FIG. 8). The second circuit board and the support base may be integrally formed, or they may be separately prefabricated and then assembled into a whole (for example, a separately formed support base may be fixed on the periphery of the second circuit board). In this embodiment, the first circuit board and the second circuit board may be PCB boards. In other embodiments, the first circuit board and the second circuit board may also be ceramic substrates. The supporting seat formed by the peripheral edge of the second circuit board may be a molded seat. In this embodiment, after the first circuit board and the second circuit board are mounted on the first mounting surface and the second mounting surface of the MEMS drive structure, respectively, it can be installed between the first circuit board and the second circuit board. The gap is filled with hydrosol, and after the hydrosol is cured, the first circuit board is temporarily fixed to the second circuit board. At this time, the first circuit board and the second circuit board can be electrically connected with an SMA wire through a wire bonding process. In this embodiment, the photosensitive chip can be mounted on the upper surface of the first circuit board, and is electrically connected to the first circuit board through a wire bonding process. After the photosensitive chip is installed and the wire bonding process is completed to realize the electrical connection between the photosensitive chip and the first circuit board, the first circuit board and the second circuit board, the hydrosol can be removed by a water washing process, thereby releasing the first circuit plate. In this embodiment, the SMA wire can be electrically connected, or the first circuit board can be suspended in the central area of the second circuit board. Driven by the MEMS driving structure, the first circuit board can move relative to the second circuit board in a direction parallel to the photosensitive surface. The photosensitive component of this embodiment is particularly suitable for use in a periscope camera module. In this embodiment, although two circuit boards are used in the photosensitive component, since it is applied to the periscope module, the thickness direction of the circuit board is not the thickness direction of the electronic device (such as a mobile phone) equipped with the periscope module. Therefore, the solution of increasing the circuit board does not lead to an increase in the thickness of the electronic device (such as a mobile phone).

Further, according to an embodiment of the present application, there is also provided a method for assembling a photosensitive component with anti-shake function, which includes the following steps.

Step S1, prepare the MEMS actuator. FIG. 10 shows a cross-sectional view of the MEMS actuator prepared in step S1 in an embodiment of the present application. 10, the MEMS actuator has an intermediate base 20, a base 30, and a MEMS drive structure; wherein, the base 30 includes a base plate and a support base extending upward from the periphery of the base plate; the intermediate base 20 It is located above the bottom plate and has a gap between the side surface of the intermediate seat 20 and the support seat; the MEMS drive structure includes a comb-shaped movable portion 44 and a comb-shaped fixed portion 43 that are adapted to each other. The top surface of the movable portion 44 is connected to the bottom surface of the intermediate seat 20, and the bottom surface of the comb-shaped fixed portion 43 is connected to the top surface of the bottom plate. The MEMS actuator of this embodiment can be manufactured by a semiconductor process. The method of manufacturing a MEMS actuator based on a semiconductor process will be further described below in conjunction with other embodiments.

Step S2, inject the hydrosol. FIG. 11 shows a cross-sectional view of the semi-finished product after step S2 is completed in an embodiment of the present application. Referring to FIG. 11, in this step, a hydrosol 90 is injected into the gap between the middle seat 20 and the base 30, and then the hydrosol 90 is cured to fix the middle seat 20, that is, through the cured hydrosol 90 The intermediate base 20 is fixed in the base 30 to prevent the intermediate base 20 from shaking relative to the base 30 when the subsequent steps are performed.

Step S3, install the photosensitive chip and complete the wire connection. Figure 12 shows a cross-sectional view of the semi-finished product after step S3 is completed in an embodiment of the present application. Referring to FIG. 12, in this step, the photosensitive chip 10 is mounted on the top surface of the intermediate base 20, and a plurality of flexible connecting wires 60 are formed between the intermediate base 20 and the support base 30 through a wire bonding process. And the connecting wire 60 electrically connects the photosensitive chip 10 and the base 30 (wherein the photosensitive chip 10 can be electrically connected to the middle seat 20 through a gold wire, and then the middle seat 20 is electrically connected to the base through the connecting wire 60. Block 30). In this embodiment, the connecting wire 60 may be an SMA wire, and the photosensitive chip 10 and the intermediate base 20 may be electrically connected through a wire bonding process.

In step S4, the hydrosol is removed by a water washing process to release the intermediate seat. FIG. 13 shows a cross-sectional view of the photosensitive component after step S3 is completed in an embodiment of the present application. FIG. 19 shows the assembly process of the photosensitive component in an embodiment of the present application (which includes the cross-sectional view of the semi-finished product or the finished product obtained after each step of steps S1 to S4 is performed). Further, in one embodiment, a molded seat 33 may be formed on the top surface of the support seat 32 of the base 30 to obtain a photosensitive component as shown in FIG. 9. Referring to FIG. 9, the top surface of the mold base 33 can be further mounted on the filter 50.

Further, according to an embodiment of the present application, a method for manufacturing a MEMS actuator based on a semiconductor process is also provided, and the method can be applied in step S1 to obtain the required MEMS actuator. The method for manufacturing a MEMS actuator based on a semiconductor process includes the following steps.

Step S11, making a base. Figure 14 shows a cross-sectional view of the base in an embodiment of the present application. The base includes a bottom plate 31 and a support seat 32 extending upward from the periphery of the bottom plate 31. The support base 32 may be ring-shaped (in a top view), thereby forming a receiving groove in the center of the base that can accommodate the middle and photosensitive chips. In this embodiment, the base with the support base 32 can be manufactured in this step. In other embodiments, the bottom plate 31 can also be fabricated first, and then the support seat 32 can be fabricated on the surface of the bottom plate 31 in a subsequent step.

Step S12, the lower connection layer is made. FIG. 15 shows a cross-sectional view of a semi-finished MEMS actuator after completing step S12 in an embodiment of the present application. In this step, a lower connecting layer is made on the upper surface of the bottom plate 31 by a semiconductor process. The lower connecting layer includes a lower connecting portion 45 for connecting the base and the comb-shaped fixing portion and a sacrificial material 46 filled between the lower connecting portion. The shape of the lower connecting portion 45 may be consistent with the comb-shaped fixing portion, that is, the lower connecting portion 45 may completely overlap the bottom surface of the comb-shaped fixing portion. In another embodiment, the shape of the lower connecting portion 45 may also be inconsistent with the comb-shaped fixing portion. For example, the lower connecting portion 45 may only connect the comb-shaped fixing portion in a partial area of the bottom surface of the comb-shaped fixing portion, as long as the connection has sufficient The structural strength and reliability can be achieved.

Step S13, fabricating a comb-shaped driving structure pattern layer. FIG. 16 shows a cross-sectional view of a semi-finished MEMS actuator after step S13 is completed in an embodiment of the present application and the top view shape of the comb-shaped driving structure pattern layer in the semi-finished product. In this step, a comb-shaped driving structure pattern layer is fabricated on the upper surface of the lower connection layer by a semiconductor process, which includes a plurality of comb-shaped driving structure patterns and a sacrificial material 46 filled between the comb-shaped driving structure patterns. Each comb-shaped driving structure pattern may include a comb-shaped fixed portion 43 and a comb-shaped movable portion 44. The bottom surface of the comb-shaped fixing portion 43 is located on the top surface of the lower connecting portion 45 so as to connect the two. The bottom surface of the comb-shaped movable portion 44 is made on the sacrificial material 46 of the lower connecting layer. In this application, the shape and number of comb-shaped driving structure patterns are not unique. In different embodiments, the number and shape of comb-shaped driving structure patterns can be set according to actual conditions.

Step S14, the upper connection layer is made. FIG. 17 shows a cross-sectional view of a semi-finished MEMS actuator after completing step S14 in an embodiment of the present application. In this step, the upper connection layer is formed on the upper surface of the comb-shaped driving structure pattern layer by a semiconductor process. The upper connecting layer includes an upper connecting portion 47 for connecting the middle seat and the comb-shaped movable portion 44 and a sacrificial material 46 filled between the upper connecting portion. The bottom surface of the upper connecting portion 47 is made on the top surface of the comb-shaped movable portion 44. The top surface of the comb-shaped fixing portion 43 is filled with a sacrificial material 46. The shape of the upper connecting portion 47 may be consistent with the comb-shaped movable portion, that is, the upper connecting portion 47 may completely overlap the top surface of the comb-shaped movable portion. In another embodiment, the shape of the upper connecting portion 47 may also be inconsistent with the comb-shaped movable portion. For example, the upper connecting portion 47 may connect the comb-shaped movable portion only in a partial area of the top surface of the comb-shaped movable portion, as long as The connection has sufficient structural strength and reliability.

Step S15, fabricate the middle seat. FIG. 18 shows a cross-sectional view of the semi-finished MEMS actuator after completing step S15 in an embodiment of the present application. In this step, the intermediate seat 20 is fabricated on the upper surface of the upper connection layer by a semiconductor process.

In step S16, the sacrificial material 46 is removed. For example, a corrosive material can be injected, and the corrosive material can corrode and remove the sacrificial material 46, but the other structure of the semi-finished MEMS actuator remains intact. After performing step S16, the required MEMS actuator can be obtained, as shown in Fig. 10. FIG. 20 shows a manufacturing process of manufacturing a MEMS actuator based on a semiconductor process in an embodiment of the present application (which includes a cross-sectional view of a semi-finished product or a finished product obtained after each step of steps S11-S16 is performed). Further, steps S2, S3, and S4 can be continued to obtain a photosensitive component. The finished photosensitive component may be the photosensitive component as shown in FIG. 13 or FIG. 9.

In an embodiment of the present application, on the basis of the above-mentioned photosensitive assembly, a lens assembly may be further mounted on the photosensitive assembly to obtain a camera module.

Further, in an embodiment of the present application, a circuit board may be mounted on the bottom surface of the base of the above-mentioned photosensitive assembly, and the edge area of the circuit board may have a lens holder for mounting the lens assembly. The circuit board can include PCB hard board, FPC connection belt and connector. Wherein, the bottom surface of the base is mounted on the surface of the PCB rigid board, and the lens holder is also mounted on the edge area of the PCB rigid board.

The above description is only a preferred embodiment of the application and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover the above technical features without departing from the inventive concept. Or other technical solutions formed by any combination of its equivalent features. For example, the above-mentioned features and the technical features disclosed in this application (but not limited to) with similar functions are mutually replaced to form a technical solution.

Claims (18)

1. A photosensitive component with anti-shake function, characterized in that it comprises:

   Photosensitive chip; and

   A planar moving actuator, which has an intermediate seat, a base and a MEMS drive structure; wherein the base includes a bottom plate and a support seat formed upwardly from the periphery of the bottom plate, and the intermediate seat is located in the base And there is a gap between the side surface of the middle seat and the support seat; the MEMS drive structure includes a comb-shaped movable portion and a comb-shaped fixed portion that are adapted to each other, and the top surface of the comb-shaped movable portion is The bottom surface of the intermediate seat is connected, and the bottom surface of the comb-shaped fixing portion is connected with the top surface of the bottom plate;

   Wherein, the photosensitive chip is installed on the top surface of the middle seat; and the middle seat is connected to the support seat through a plurality of flexible connecting wires, and the middle seat and the base are realized by the connecting wires Electrical connection.
2. The photosensitive component with anti-shake function according to claim 1, wherein the photosensitive component with anti-shake function further comprises a circuit board; the bottom surface of the base is mounted on the surface of the circuit board.
3. The photosensitive component with anti-shake function according to claim 2, wherein the flexible connecting wire is an SMA wire.
4. The photosensitive component with anti-shake function according to claim 2, wherein the photosensitive chip and the intermediate base are electrically connected by wire bonding.
5. The photosensitive component with anti-shake function according to claim 2, wherein the MEMS drive structure comprises an x-axis drive structure and a y-axis drive structure, wherein the x-axis and the y-axis are perpendicular to each other and are uniform. Parallel to the photosensitive surface of the photosensitive chip; the x-axis drive structure includes the comb-shaped movable portion that can be translated along the x-axis direction and the comb-shaped fixed portion adapted to it, and the y-axis drive structure It includes the comb-shaped movable part which can be translated along the y-axis direction and the comb-shaped fixed part adapted to the comb-shaped movable part.
6. The photosensitive component with anti-shake function according to claim 5, wherein the MEMS drive structure comprises a rotary drive structure for driving rotation around a z-axis, the z-axis being perpendicular to the x-axis and the y-axis; the rotation drive structure includes the comb-shaped fixed portion and the comb-shaped movable portion.
7. The photosensitive component with anti-shake function according to claim 1, wherein the intermediate base, the base and the MEMS drive structure are manufactured based on semiconductor technology; wherein, the intermediate base, the base and the MEMS The gap between the driving structures is formed by removing the sacrificial material.
8. The photosensitive component with anti-shake function according to claim 1, wherein the photosensitive component with anti-shake function further comprises a filter, and the filter is installed on the top surface of the support base.
9. The photosensitive component with anti-shake function according to claim 2, wherein the edge area of the circuit board has a lens holder, and the lens holder is suitable for mounting a lens component.
10. The photosensitive component with anti-shake function according to claim 1, wherein the middle seat is a first circuit board made based on a lamination process, and the bottom plate is a second circuit board made based on a lamination process, The support base is installed or directly formed on the peripheral area of the second circuit board; the MEMS drive structure is manufactured based on semiconductor technology, and the MEMS drive structure has a top surface and is connected to the comb-shaped movable part. Connected to the first mounting surface and the second mounting surface located on the bottom surface and connected to the comb-shaped fixing portion, the first circuit board is mounted on the first mounting surface, and the second circuit board is mounted on the The second mounting surface.
11. The photosensitive component with anti-shake function according to claim 10, wherein the first circuit board and the second circuit board are both PCB boards.
12. A camera module, characterized in that it comprises:

    Lens assembly; and

    The photosensitive component with anti-shake function of any one of claims 1-11, wherein the bottom surface of the lens assembly is mounted on the top surface of the photosensitive component with anti-shake function.
13. The camera module according to claim 12, wherein the lens assembly includes a motor and an optical lens, and the motor is used to drive the optical lens to move to achieve a focusing function; the photosensitive assembly with anti-shake function Wherein, the planar moving actuator is used to drive the intermediate seat and drive the photosensitive chip to move, so as to realize the anti-shake function.
14. A method for assembling a photosensitive component with anti-shake function, which is characterized in that it comprises:

    Step 1) Prepare a planar moving actuator, which has an intermediate seat, a base and a MEMS drive structure; wherein the base includes a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate; the intermediate seat is located at the bottom Above the bottom plate and there is a gap between the side surface of the middle seat and the support seat; the MEMS drive structure includes a comb-shaped movable portion and a comb-shaped fixed portion that are adapted to each other, and the top of the comb-shaped movable portion The surface is connected with the bottom surface of the intermediate seat, and the bottom surface of the comb-shaped fixing portion is connected with the top surface of the bottom plate;

    Step 2) Inject a hydrosol into the gap between the intermediate seat and the base, and then solidify the hydrosol to fix the intermediate seat in the base;

    Step 3) Mount a photosensitive chip on the top surface of the middle seat, form a plurality of flexible connecting lines between the middle seat and the support seat through the WB process, and the connecting lines connect the photosensitive chip and The base is electrically conductive; and

    Step 4) The hydrosol is removed by a water washing process to release the intermediate seat.
15. The method for assembling a photosensitive component with an anti-shake function according to claim 14, wherein in the step 3), the flexible connecting wire is an SMA wire.
16. The method for assembling a photosensitive component with an anti-shake function according to claim 14, wherein the step 3) further comprises: electrically connecting the photosensitive chip and the intermediate base through a WB process.
17. The method for assembling a photosensitive component with an anti-shake function according to claim 14, wherein in the step 1), the planar moving actuator is a MEMS actuator manufactured by a semiconductor process, and the MEMS actuator is Production methods include:

    11) Making the base;

    12) Making a lower connecting layer on the upper surface of the base, the lower connecting layer including a lower connecting portion for connecting the base and a comb-shaped fixing portion, and a sacrificial material filled between the lower connecting portion ；

    13) A comb-shaped driving structure pattern layer is fabricated on the upper surface of the lower connecting layer. The comb-shaped driving structure pattern layer includes a plurality of comb-shaped driving structure patterns and a sacrificial material filled between the comb-shaped driving structure patterns. Each of the comb-shaped driving structure patterns includes the comb-shaped fixed portion and the comb-shaped movable portion;

    14) An upper connecting layer is fabricated on the upper surface of the comb-shaped driving structure pattern layer, the upper connecting layer includes an upper connecting portion for connecting the intermediate seat and the comb-shaped movable portion and filling the upper connecting portion Sacrificial material between;

    15) Making an intermediate seat on the upper surface of the upper connecting layer; and

    16) Remove the sacrificial material to obtain the required MEMS actuator.
18. A method for assembling a camera module is characterized in that it comprises:

    a) Assembling a photosensitive component based on the method for assembling a photosensitive component with anti-shake function according to any one of claims 14-17; and

    b) Assembling the lens assembly and the photosensitive assembly to obtain the camera module.

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