CN114415444A

CN114415444A - Driving structure for optical actuator and corresponding camera module

Info

Publication number: CN114415444A
Application number: CN202011449531.0A
Authority: CN
Inventors: 魏罕钢; 卞强龙; 刘佳; 李剑虹; 张琼; 黄坚斌; 袁栋立
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2022-04-29
Anticipated expiration: 2040-10-14
Also published as: CN114428430B; CN114428431A; CN114415442B; CN114415444B; CN114428431B; CN114428434B; CN114428436B; CN114415443A; CN114428430A; CN114428432A; CN114428433A; CN114428435B; CN114428434A; CN114428432B; CN114428435A; CN114428436A; CN114428433B; CN114415442A

Abstract

The present invention relates to a driving structure for an optical actuator, which includes a second driving part and a photosensitive assembly, the second driving part including: a second base portion; and the lower end face of the second movable part is bonded with the upper end face of the photosensitive assembly through glue, the second movable part is movably connected with the second base part through a suspension system and is suitable for driving the photosensitive assembly to translate in the directions of an x axis and a y axis relative to the second base part, and the x axis is mutually vertical to the y axis and is parallel to the photosensitive surface of the photosensitive assembly. The application also provides a corresponding camera module. When this application can utilize sensitization chip's removal to carry out the anti-shake, need not make sensitization chip slope to the image that has avoided anti-shake to remove the cause is blurred the problem.

Description

Driving structure for optical actuator and corresponding camera module

RELATED APPLICATIONS

The present application is a divisional application of the parent chinese patent application No. CN202011097162.3, entitled "drive structure for optical actuator and corresponding camera module", filed 10, 14/2020.

Technical Field

The invention relates to the technical field of camera equipment, in particular to a driving structure for an optical actuator and a corresponding camera module.

Background

With the increase of the demand of consumers for mobile phone photographing, the functions of a mobile phone camera (i.e., a camera module) are more and more abundant, functions of portrait photographing, telephoto photographing, optical zooming, optical anti-shake and the like are all integrated in a camera with a limited volume, and the functions of auto-focusing, optical anti-shake, optical zooming and the like are often realized by an optical actuator (sometimes also referred to as a motor).

Fig. 1 shows a typical camera module with a motor in the prior art. Referring to fig. 1, the camera module generally includes a lens 1, a motor mechanism 2 (which may be simply referred to as a motor), and a photosensitive member 3. In the shooting state of the camera module, light from a shooting object is focused on a photosensitive element 3a of a photosensitive assembly 3 through a lens 1. Structurally, the lens 1 is fixed to a motor carrier (specifically shown in fig. 1) of a motor, and the motor carrier is a movable component which can drive the lens 1 to move in the optical axis direction under the action of a driving element of the motor to realize a focusing function. For a camera module with an optical anti-shake (OIS) function, the motor usually has a more complicated structure. This is because the motor needs to drive the lens 1 to move in other degrees of freedom (e.g., in a direction perpendicular to the optical axis) in addition to the lens to move in the optical axis direction to compensate for a shake at the time of shooting. In general, the shake of the image pickup module includes translation in a direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (rotation in the xoy plane, whose rotation axis direction may be substantially the same as the optical axis), and tilt shake (rotation around the x-axis and y-axis, and tilt shake is also called tilt shake in the field of image pickup modules). When the gyroscope (or other position sensing element) in the module detects the shake in a certain direction, a command can be sent to make the motor drive the lens to move a distance in the opposite direction, so as to compensate the shake of the lens. Generally, the lens is only translated and/or rotated in a direction perpendicular to the optical axis to compensate the shake of the camera module, because if the lens is rotated around the x and y axes, i.e. if the anti-shake effect is achieved through tilt adjustment of the lens, the imaging quality of the module may be reduced, and even the basic imaging quality requirement may be difficult to achieve due to imaging blur.

However, as the imaging quality of the mobile phone camera module is higher and higher, the volume and weight of the lens are higher and higher, and the requirement for the driving force of the motor is also higher and higher. However, the current electronic devices (such as mobile phones) also have a great limitation on the size of the camera module, and the occupied size of the motor increases correspondingly with the increase of the lens. In other words, in the trend of the lens barrel toward larger volume and larger weight, the driving force provided by the motor is difficult to increase accordingly. On the premise that the driving force is limited, the heavier the lens is, the shorter the stroke of the motor capable of driving the lens to move is, and the anti-shake capability is affected. On the other hand, the heavier the lens, the slower the motor can drive the lens to move, and the longer the lens reaches the predetermined compensation position, which also affects the anti-shake effect.

Therefore, there is a need for a solution that can avoid blurring and improve the anti-shake stroke and anti-shake response speed of the camera module.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a solution for improving the anti-shake stroke and anti-shake response speed of a camera module, which can avoid image blurring.

In order to solve the above technical problem, the present invention provides a driving structure for an optical actuator, including a second driving part and a photosensitive assembly, the second driving part including: a second base portion; and the lower end face of the second movable part is bonded with the upper end face of the photosensitive assembly through glue, the second movable part is movably connected with the second base part through a suspension system and is suitable for driving the photosensitive assembly to translate in the directions of an x axis and a y axis relative to the second base part, and the x axis is mutually vertical to the y axis and is parallel to the photosensitive surface of the photosensitive assembly.

The photosensitive assembly comprises a circuit board, a photosensitive chip mounted on the surface of the circuit board and a lens base mounted on the circuit board, wherein the lens base surrounds the photosensitive chip; wherein the lower end face of the second movable portion is bonded to the top face of the mirror base by glue.

The photosensitive assembly further comprises an optical filter arranged on the lens base.

Wherein, in the z direction, the second movable part and the second base part are in contact by a ball.

Wherein the balls are arranged in four corner regions of the second driving part in a plan view.

Wherein the glue is distributed to avoid four corner areas of the second movable part.

Wherein the glue is arranged in a closed loop along an edge area of the lower end face of the second movable part.

Wherein the second movable part is moved relative to the second base part in a movement direction defined by the suspension system under the action of a drive element.

Wherein the driving element is a combination of a coil and a magnet.

Wherein the drive element is an SMA element.

Wherein the second movable portion is controlled to be held at its initial position by mutually opposite driving forces.

The second base part comprises a base and a cover, and the cover comprises a side wall which is formed by extending downwards from the base and surrounds the second movable part and a bearing platform which is formed by extending inwards horizontally from the side wall.

Wherein an edge region of the second movable portion is located between the base and an upper surface of the bearing table.

Wherein the edge region of the second movable part and/or the bearing platform is provided with a groove in which the balls are accommodated.

Wherein the ball and an edge region of the second movable portion are sandwiched between the base and the bearing table.

Wherein, the driving element of the second driving part is a combination of a coil and a magnet; wherein the magnet is provided in an edge region of the second base portion, and the coil is provided in an edge region of the second movable portion.

Wherein, the driving element of the second driving part is a combination of a coil and a magnet; wherein the coil and the magnet are respectively provided on side walls of the second movable portion and the second base portion.

Wherein the second movable part and the second base part each have a light passing hole at the center.

Wherein the second movable part comprises a main body part and an edge region, the thickness of the edge region being smaller than the thickness of the main body part.

Wherein an upper surface of an edge region of the second movable part has a depressed step, an outer side step surface of the depressed step is lower than an inner side step surface thereof, and the depressed step forms a receiving cavity for receiving the ball together with the side wall of the cover and the base.

Wherein the glue is distributed at a position avoiding the accommodating structure of the ball.

The driving structure further comprises a first driving part, wherein the first driving part is suitable for mounting a lens and driving the lens to translate in the directions of an x axis and a y axis; wherein the upper surface of the second base part is connected with the first driving part.

Wherein the first driving part includes a first base part and a first movable part, and the second base part is fixed with the first base part.

According to another aspect of the present application, there is also provided a camera module, which includes: a lens; and the aforementioned drive structure for an optical actuator; the lens is mounted on the first driving portion, and the photosensitive assembly is mounted on the second driving portion.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can improve the anti-shake stroke of the module of making a video recording to can compensate the great shake of the module of making a video recording.

2. This application can improve the anti-shake response speed of the module of making a video recording.

3. The driving structure for the optical actuator has the advantage of compact structure, and is particularly suitable for miniaturized camera modules.

4. This application need not make the sensitization chip slope when utilizing the removal of sensitization chip to carry out the anti-shake to the image that the anti-shake removal caused is stuck with paste the problem has been avoided.

5. In some embodiments of this application, on the xoy plane, allow camera lens and sensitization chip to remove to opposite direction simultaneously to both avoided the anti-shake to remove the image that causes and pasted the problem, can improve the anti-shake stroke and the anti-shake response speed of making a video recording the module again.

6. In some embodiments of the present application, the lower end surface of the second movable portion may be lower than the lower end surface of the second base portion, so as to ensure that the photosensitive element does not contact the cover of the second base portion after being attached to the second movable portion, thereby avoiding the photosensitive element from being hit or rubbed when the photosensitive element is subjected to anti-shake movement.

7. In some embodiments of this application, the laying of glue avoids the four corners region, can avoid the glue seepage to be located the ball holding structure's in four corners gap, and then avoids causing negative effects to the anti-shake removal.

Drawings

FIG. 1 illustrates a typical camera module having a motor in the prior art;

fig. 2 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to an embodiment of the present application;

fig. 3 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to another embodiment of the present application;

FIG. 4 is a schematic diagram illustrating the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application;

fig. 5 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present application;

fig. 6 is a schematic cross-sectional view illustrating a camera module according to another embodiment of the present disclosure;

fig. 7 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application;

fig. 8 is a schematic cross-sectional view illustrating a camera module according to still another embodiment of the present application;

FIG. 9a illustrates a perspective view of a second drive portion in one embodiment of the present application;

FIG. 9b illustrates an exploded perspective view of the second drive portion in one embodiment of the subject application;

FIG. 10a is a schematic cross-sectional view of a second driving portion and a photosensitive assembly according to an embodiment of the present application;

figure 10b shows a schematic cross-sectional view of a second driving portion with balls arranged on the underside of the movable portion according to a variant embodiment of the present application;

FIG. 10c shows a schematic cross-sectional view of a second drive section with two layers of balls according to a variant embodiment of the present application;

FIG. 11a shows a schematic cross-sectional view of a second drive section in an embodiment of the present application;

FIG. 11b shows an assembled view of the second drive portion in one embodiment of the present application;

FIG. 11c shows a schematic cross-sectional view of a second drive section in another embodiment of the present application;

FIG. 12 shows a schematic cross-sectional view of a second drive portion in yet another embodiment of the present application;

FIG. 13a illustrates a schematic bottom view of the movable portion of the second drive portion in one embodiment of the present application;

fig. 13b shows a schematic bottom view of the movable part of the second driving part in another embodiment of the present application;

FIG. 14 illustrates a mounting position of the drive element of the second drive portion at a bottom view angle in one embodiment of the present application;

FIG. 15a shows a schematic cross-sectional view of a second drive section of an embodiment of the present application including a drive element;

FIG. 15b shows a schematic cross-sectional view of a second drive section of another embodiment of the present application including a drive element;

FIG. 15c shows a schematic cross-sectional view of a second drive section of a further embodiment of the present application including a drive element;

FIG. 16a is a schematic cross-sectional view of a camera module in an embodiment of the present application;

fig. 16b is a schematic view showing an assembly manner of the camera module in an embodiment of the present application;

FIG. 16c shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

fig. 17 shows an arrangement of the camera module and the connecting band thereof in an embodiment of the present application;

FIG. 18 illustrates an assembled perspective view of the second driving portion and the photosensitive assembly in one embodiment of the present application;

FIG. 19 illustrates an exploded view of the second drive portion and photosensitive assembly in one embodiment of the present application;

FIG. 20 is a perspective view of a photosensitive assembly and a suspended circuit board used therein according to one embodiment of the present application;

fig. 21a shows a schematic front view of a suspension board in an embodiment of the present application after deployment;

fig. 21b shows a schematic view of the back side of a hanging wiring board after deployment in one embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The invention is further described below with reference to the accompanying drawings and specific embodiments.

Fig. 2 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to an embodiment of the present application. Referring to fig. 2, in the present embodiment, the image capturing module includes a lens 10, a photosensitive assembly 20, a first driving portion 30, and a second driving portion 40. Wherein the photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in both x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in both x and y directions. In this embodiment, the x and y directions are perpendicular to each other and are parallel to the light-sensing surface of the light-sensing element 20. The z direction is parallel to the normal direction of the light-sensing surface. For the sake of understanding, fig. 2 also shows a three-dimensional rectangular coordinate system constructed based on x, y, and z directions. In this embodiment, the control module drives the lens 10 and the photosensitive chip 21 to move in opposite directions at the same time, so as to achieve optical anti-shake of the camera module. Specifically, the lens 1 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions, for example, when the lens 10 is driven to move in the positive x-axis direction, the photosensitive chip 21 is driven to move in the negative x-axis direction; when the lens 10 is driven to move towards the positive y-axis direction, the photosensitive chip 21 is driven to move towards the negative y-axis direction; alternatively, the lens 10 is driven to move in the x-axis and the y-axis, and the photosensitive chip 21 is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens 10, in other words, when the movement in the x-axis and the y-axis is required, the directions of the displacement vector of the lens 10 and the displacement vector of the photosensitive chip 21 are opposite on the xoy plane. The camera module generally includes a position sensor for detecting shake of the camera module or a terminal device (i.e., an electronic device, such as a mobile phone, on which the camera module is mounted). When the shake is detected, the position sensor sends a signal to the camera module to drive the lens 10 and the photosensitive chip 21 to move correspondingly to compensate the shake, so that the purpose of optical anti-shake is achieved. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the moving directions of the lens 10 and the photosensitive chip 21 are opposite, so that a faster response can be realized, and a better anti-shake effect is achieved. In addition, the anti-shake angle range of the camera module is usually limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in the present embodiment, by driving the lens 10 or the photosensitive chip 21 to move in opposite directions at the same time, compared with a scheme of driving only the lens 10 to move, a stroke of the relative movement between the lens 10 and the photosensitive chip 21 is larger (for convenience of description, the stroke of the relative movement may be referred to as an anti-shake stroke), and a better compensation effect may be achieved. Particularly, due to the increase of the anti-shake stroke, the embodiment also has a good compensation effect on the tilt shake of the camera module. Further, the moving direction of the anti-shake movement of the embodiment can be defined in the xoy plane, and the optical axis of the lens 10 or the photosensitive chip 21 does not need to be inclined, so that the image blurring problem caused by the anti-shake movement is avoided.

Further, in another embodiment of the present application, the photosensitive chip 21 can also be driven by the second driving portion 40 to rotate in the xoy plane, so as to compensate for the shake in the rotation direction of the image capturing module.

Further, still referring to fig. 2, in an embodiment of the present application, the image pickup module includes a first driving part 30, a lens 10, a second driving part 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The first driving unit 30 may have a cylindrical first motor carrier, which may be a movable portion of the first driving unit, and the lens may be mounted on an inner side surface of the first motor carrier. The first driving part is also provided with a static part or a basic part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base is provided with a light through hole. The movable part is movably connected with the base part. The drive element may be a coil magnet combination, which may be mounted between the movable part and the base part. For example between the first motor carrier and the motor housing. In fact, the first driving part in the present embodiment may directly adopt the common structure of the optical anti-shake motor in the prior art. Further, in the present embodiment, the second driving portion 40 may be supported and fixed on the bottom surface of the first driving portion 30. The second driving unit 40 may include a base unit and a movable unit. Wherein the base portion is directly connected with the first driving portion. The movable part is positioned below the base part and movably connected with the base part. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21 mounted on a surface of the circuit board, and a lens holder 22 surrounding the photosensitive chip 21. The base of the mirror base 22 may be attached to the surface of the circuit board 23, and the top surface thereof may be fixed to the movable portion of the second driving portion 40. The lens holder 22 has a light-passing hole at the center, and a filter 24 is mounted on the lens holder 22 (the filter 24 can also be regarded as a component of the photosensitive assembly 20). Under the driving of the movable portion of the second driving portion 40, the photosensitive assembly 20 can translate in the x and y directions or rotate on the xoy plane with respect to the base portion. For convenience of description, the base portion of the first driving portion 30 is sometimes referred to as a first base portion, the base portion of the second driving portion 40 is sometimes referred to as a second base portion, the movable portion of the first driving portion 30 is sometimes referred to as a first movable portion, and the movable portion of the second driving portion 40 is sometimes referred to as a second movable portion.

Fig. 3 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to another embodiment of the present application. In this embodiment, the image capturing module includes a first driving portion 30, a lens 10, a second driving portion 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly of the first driving part 30 and the lens 10 may be the same as those of the previous embodiment shown in fig. 2, and are not described again. The present embodiment differs from the previous embodiment in that: the second driving portion 40 is located inside the photosensitive assembly 20. In this embodiment, the photosensitive assembly 20 includes a circuit board 23, a lens holder 22, a filter 24, and a photosensitive chip 21. The base of the lens holder 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the base of the first driving unit 30. The lens holder 22 has a light-passing hole at the center thereof, and a filter 24 is mounted on the lens holder 22. The lens holder 22, the filter 24 and the circuit board 23 may form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving portion 40 may be located in the cavity 25. Specifically, the base portion of the second driving portion 40 may be mounted on the surface of the circuit board 23, and the movable portion of the second driving portion 40 may be movably connected to the base portion. The photosensitive chip 21 is mounted on the surface of the movable portion. In this way, the photosensitive chip 21 can be translated in the x and y directions or rotated on the xoy plane with respect to the base portion by the movable portion of the second driving portion 40.

Different structural implementations of the second driving part of the camera module according to the present application are described above with reference to two embodiments. The following further introduces a method for compensating the tilt jitter of the camera module based on the design idea of the present application.

Fig. 4 is a schematic diagram illustrating the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application. The position A in the figure represents the moving distance combination of the lens and the photosensitive chip for compensating the shake angle a of the camera module. As shown in fig. 4, the lens moving distance is b, the photosensitive chip (hereinafter sometimes simply referred to as chip) moving distance is c, and the lens or chip moving distance may be equivalent to an angle of an image plane from an optical axis in optical imaging. Specifically, when the lens is translated by a distance b in the xoy plane, it causes an arithmetic relationship between the image plane offset angle α 1 and the image distance, which is different at different shooting distances, where the image distance is replaced with the image space focal distance for the sake of calculation and convenience of expression. Specifically, it causes the relationship between the image plane offset angle α 1 and the lens image space focal length f to be: tan (α 1) ═ b/f, which causes the relationship between the image plane shift angle α 2 and the lens image focal length f when the photosensitive chip is translated by a distance c in the xoy plane, to be: tan (α 2) ═ c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation mode of the comprehensive compensation angle a of the camera module is as follows: α 1+ α 2 is arctan (b/f) + arctan (c/f). In one embodiment, the moving distance of the lens and the photosensitive chip may be set to be the same, i.e., b ═ c. In another embodiment, the distance that the lens and the photosensitive chip move may be set to be unequal, for example, the distance that the lens moves may be greater than the distance that the photosensitive chip moves, i.e., b > c. In this embodiment, the second driving portion may select a smaller-sized driver (such as a mems driver, etc., and the movable stroke of such a driver is usually relatively small), so as to help achieve miniaturization of the camera module as a whole.

Further, in an embodiment of the present application, a ratio between a lens moving distance and a photo sensor moving distance is optionally set to maintain a fixed ratio, for example, b/c is 6:4, or b/c is 7:3, or b/c is 5:5, and the moving distances of the lens and the photo sensor maintain the preset ratio no matter what compensation value (for example, the comprehensive compensation angle a) of the camera module shake, which is beneficial to uniformity of compensation effect of the camera module in a compensation range and also beneficial to reduction of design difficulty of the camera module anti-shake system driving logic module.

Further, in a configuration in which the lens movement distance and the photosensitive chip movement distance are subjected to anti-shake movement based on a fixed ratio, since the movable range of the photosensitive chip is small, shake of the image pickup module may exceed the maximum movement stroke of the photosensitive chip sometimes. Therefore, in an embodiment of the present application, an anti-shake threshold may be set, for example, for the shake angle a to be compensated, a threshold K may be set, and when the actually calculated shake angle a is smaller than or equal to the anti-shake threshold K, the lens moving distance b and the photosensitive chip moving distance c are both setHeld at a fixed ratio which may be preset, for example, b/c 6:4, or b/c 7:3, or b/c 5: 5. When the actually calculated shaking angle a is larger than the anti-shaking threshold K, the moving distance c of the photosensitive chip is the maximum value of the moving stroke, namely the maximum stroke c of the photosensitive chip_maxAnd the lens moving distance b is tan (a/f) -c_max. In other words, when the shake angle of the camera module to be compensated is above the anti-shake threshold K, the lens moves to the maximum value corresponding to the moving distance of the photosensitive chip (i.e. the maximum stroke c of the photosensitive chip) based on the preset fixed proportion_max) After the position of (a), the first driving unit may drive the lens to move continuously until the lens moving distance b is tan (a/f) -c_max. At the same time, the photosensitive chip is firstly synchronously moved to the maximum value c of the moving distance of the photosensitive chip in the opposite direction_maxAnd then remain stationary.

Further, in another embodiment of the present application, the maximum stroke b of the lens movement is within the xoy plane_maxThe corresponding anti-shake angle (the anti-shake angle refers to the angle of the camera module inclined shake) can be smaller than the maximum stroke c of the photosensitive chip_maxThe corresponding anti-shake angle. Under this kind of design, the anti-shake system of the module of making a video recording can have faster response speed. In a high-end lens, the lens often has more lenses, for example, the number of lenses in a rear main shooting lens in a current smart phone can reach 8, in order to further improve the imaging quality, some lenses also use glass lenses, which all result in larger lens weight. When the driving force is not increased significantly, the speed at which the driving device drives the lens to move will decrease. And the weight of the photosensitive chip or the photosensitive assembly is relatively light, and the photosensitive chip or the photosensitive assembly can reach the preset position with small driving force. Therefore, in the scheme of the embodiment, the advantages that the weight of the photosensitive chip or the photosensitive assembly is relatively close and the moving speed is relatively high can be better utilized, and the response speed of the camera module anti-shake system is effectively improved.

Further, in another embodiment of the present application, the fixed ratio of the moving distance of the lens to the moving distance of the photosensitive chip may be set according to the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or the photosensitive assembly), the driving force of the second driving portion, and other factors, and a suitable fixed ratio is set, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions is substantially the same, thereby obtaining a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving portion may substantially determine the moving speed of the lens, and the weight of the photosensitive chip (or the photosensitive assembly) and the driving force of the second driving portion may substantially determine the moving speed of the photosensitive chip, and when the moving speed of the lens is smaller than the moving speed of the photosensitive chip (for example, when the weight of the lens is large), the moving distance of the photosensitive chip may occupy a larger proportion when the fixed proportion is set, so that the characteristic that the moving speed of the photosensitive chip is fast can be utilized, so that the photosensitive chip moves a longer distance, and the time for moving the lens and the photosensitive chip to the respective anti-shake target positions is substantially the same.

Further, in another embodiment of the present application, the first driving portion may employ a driving element having a large driving force, and a suspension system having a large stroke. For example, the first drive portion may be driven using an SMA (shape memory alloy) element. Compare traditional coil magnet combination, the SMA component can provide great drive power with less occupation space, consequently first drive division can design compacter, is favorable to making a video recording the miniaturization of module.

Further, fig. 5 shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to fig. 5, in the present embodiment, the base portion 41 of the second driving portion 40 is fixed with the base portion (not specifically shown in fig. 5) of the first driving portion 30. The lens 10 may be mounted to a movable portion (e.g., a first motor carrier, not specifically shown in fig. 5) of the first driving portion 30. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21, a lens holder 22, an optical filter 24, and the like. The photosensitive member 20 may be mounted to the movable portion 42 of the second driving portion 40. Specifically, the bottom surface of the moving portion 42 may bear against the top surface of the mirror base 22 of the photosensitive assembly 20. In the second driving portion 40, the base portion 41 and the movable portion 42 may be elastically connected by a suspension system. In this embodiment, the suspension system allows the movable part 42 to translate in the xoy plane relative to the base part 41. Alternatively, the suspension system may be a ball system, which has the advantages of: in the z direction, the movable part 42 and the base part 41 are in contact with each other through the balls, the movable part 42 moves only in the xoy plane, and the movement in the optical axis direction can be prevented by the balls between the movable part 42 and the base part 41, thereby avoiding the influence on the focusing of the image pickup module.

Alternatively, in another embodiment, the suspension system may comprise an elastic element (e.g., a spring) by which the fixed part and the movable part are connected, which allows the movable part to translate relative to the base part in the xoy plane, but prevents the movable part from moving relative to the base part outside the xoy plane. Compared with a ball system, the elastic element has the advantages that: the elastic element can provide an initial force between the base part and the movable part, the initial force can control the moving distance of the movable part or keep the position of the movable part in cooperation with the driving force of the driving element, and the driving element is not required to be additionally arranged to provide a conjugate driving force to control the position of the movable part. If a ball system is used, the movable part is free to move in the xoy direction relative to the base part in the case of a drive element which does not provide a driving force, so that it is often necessary to provide at least one pair of mutually opposite driving forces to control the holding of the movable part in its initial position.

Further, still referring to fig. 5, in one embodiment of the present application, anti-shake may be achieved by driving the entire photosensitive assembly 20 to move. Simultaneously, circuit board 23, sensitization chip 21, microscope base 22, light filter 24 encapsulation are as an organic whole, and circuit board 23, microscope base 22, light filter 24 form an enclosure space, and sensitization chip 21 holds in this enclosure space, has promoted sensitization subassembly 20's closure, has guaranteed that sensitization chip 21 images and does not receive the influence of dust in the module preparation of making a video recording or use.

In this embodiment, still referring to fig. 5, in an embodiment of the present application, the back surface of the circuit board may directly abut against a terminal device (i.e., an electronic device carrying the camera module, such as a mobile phone), and specifically, the back surface of the circuit board 23 may abut against a main board or other abutting member 90 of the terminal device. Although the movable portion 42 is connected to the photosensitive assembly 20 and the base portion 41 is connected to the first driving portion 30 in the present embodiment, it is understood that the movable portion 42 and the base portion 41 move relatively. In the anti-shake movement, the opposite movement direction means: the moving direction of the movable part of the first driving part relative to the base part is opposite to the moving direction of the movable part of the second driving part relative to the base part.

Further, fig. 6 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application. Referring to fig. 6, in the present embodiment, a rear case 49 is added below the second driving portion 40, the rear case 49 is connected to the base portion 41 of the second driving portion 40, and forms an accommodating cavity, and the movable portion 42 of the second driving portion 40 and the photosensitive assembly 20 are accommodated in the accommodating cavity. As shown in fig. 6, there may be a gap 49a between the photosensitive assembly 20 and the bottom of the rear housing 49. That is, the photosensitive assembly 20 is suspended, and the photosensitive assembly 20 is connected only to the movable portion 42 of the second driving portion 40. In this embodiment, the rear housing 49 directly bears against the terminal device. Since the rear case 49 connects the terminal device, the second driving unit 40, and the base of the first driving unit 30, the movable portions of the first driving unit 30 and the second driving unit 40 respectively drive the lens 10 and the photosensitive assembly 20 to move in opposite directions simultaneously with respect to the terminal device during the anti-shake process. Further, in the present embodiment, the movable portion 42 of the second driving portion 40 is directly bonded to the upper end surface of the photosensitive assembly 20, so that the filter 24 can be spaced from the external space, and debris generated by friction or collision of the movable portion 42 during movement relative to the base portion 41 is prevented from directly falling onto the surface of the filter 24.

Fig. 7 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application. Referring to fig. 7, in the present embodiment, the first driving part 30 is implemented to be adapted to drive the lens 10 to move in the optical axis direction to implement a focusing function, while also being adapted to drive the lens 10 to move in the xoy plane to implement an anti-shake function. Optionally, the first driving part 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32, the lens 10 is supported by the first carrier 31, a suspension system is disposed between the first carrier 31 and the second carrier 32, and a suspension system is disposed between the second carrier 32 and the housing 33 of the first driving part 30. In this embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e. the first suspension system) is configured as a ball bearing system, and the suspension system between the second carrier 32 and the housing 33 (i.e. the second suspension system) is a suspension system based on elastic elements (e.g. spring plates). In the present embodiment, the second suspension system is provided outside the first suspension system, the first suspension system allowing the lens 10 and the first carrier 31 to translate in the xoy plane to realize the anti-shake function, and the second suspension system allowing the lens 10, the first carrier 31, and the second carrier 32 to integrally move in the optical axis direction to realize the focusing function. Alternatively, in another embodiment, the second suspension system may also be arranged inside the first suspension system. In another modified embodiment, the second suspension system may also be disposed below the first suspension system. In this embodiment, the suspension system refers to a system in which two members are movably connected and the degree of freedom of relative movement (i.e., the moving direction) of the two members is limited. These two articulatable parts may be referred to as a base part and a movable part, respectively. Typically, the suspension system is used in conjunction with a drive element (e.g., an SMA element or a coil magnet combination). Wherein a driving force is provided by the driving element, under which driving force the movable part is moved relative to the base part in a movement direction defined by the suspension system.

Further, fig. 8 shows a schematic cross-sectional view of a camera module in still another embodiment of the present application. Referring to fig. 8, the movable portion of the second driving portion 40 of the present embodiment may be provided with a downward extending extension arm 42a, and the extension arm 42a is adhered to the circuit board 23 of the photosensitive assembly 20. The extension arm 42a may be provided with an FPC board 42b, and the FPC board 42b may be directly soldered to the wiring board 23, thereby electrically connecting the driving element mounted on the movable portion to the wiring board 23. This embodiment can prevent the glue from flowing onto the filter when the photosensitive assembly 20 is bonded to the movable portion, thereby affecting the image formation. In addition, in the embodiment, a gap is formed between the upper end surface (i.e., the top end) of the photosensitive assembly 20 and the second driving portion 40, so that the color filter can be prevented from being scratched or broken.

Further, fig. 9a shows a schematic perspective view of the second driving part in an embodiment of the present application, and fig. 9b shows a schematic perspective exploded view of the second driving part in an embodiment of the present application. Referring to fig. 9a and 9b, in the present embodiment, the movable portion 42 and the base portion 41 of the second driving portion 40 each have a light-passing hole in the center through which light passing through the lens is incident on the photosensitive chip and imaged. In the present embodiment, four balls 80 are preferably provided at the four corners (four corner positions in a plan view) of the second driving portion 40.

Further, fig. 10a is a schematic cross-sectional view illustrating a second driving portion and a photosensitive assembly in an embodiment of the present application. Referring to fig. 10a, in the present embodiment, the second driving portion 40 includes a movable portion 42 and a base portion 41, wherein the base portion 41 includes a base 41a and a cover 41 b. The cover 41b includes a side wall 41c extending downward from the base 41a to surround the movable portion 42, and a support base 41d extending horizontally inward from the side wall 41 c. The top of the side wall 41c is connected to the base 41a, and the lower surface of the edge region 42a of the movable portion 42 can be abutted against the upper surface of the abutment table 41 d. The balls 80 and the edge area 42a of the movable portion 42 are held between the base 41a and the bearing base 41d of the cover 41b, and it is ensured that the movable portion 42 and the base portion 41 do not move relative to each other in the optical axis direction (i.e., the z-axis direction). In this way, the second drive portion 40 allows only the movable portion 42 to translate in the xoy plane with respect to the base portion 41. More specifically, at least one accommodating space is provided between the base 41a and the cover 41b, the accommodating space is provided with the balls 80, and the movable part 42 and the base 41a are respectively closely attached to the balls 80, so that the movable part 42 and the base 41 are ensured not to generate relative movement in the optical axis direction. The movable portion 42 may include a main portion 42b and an edge region 42a, and the thickness of the edge region 42a may be smaller than the thickness of the main portion 42 b. The lower surface (also referred to as a lower end surface) of the main body 42b may be lower than the lower surface (also referred to as a lower end surface) of the cover 41b, so as to ensure that the photosensitive assembly 20 does not contact the cover 41b after being attached to the movable portion 42, and avoid the photosensitive assembly 20 from contacting or rubbing the cover during the anti-shake movement.

Further, still referring to fig. 10a, in an embodiment of the present application, the upper surface of the base portion 41 may have a step structure, and the step structure may include a first step surface 41e located at the outer side and a second step surface 41f located at the inner side, and the height of the second step surface 41f is lower than that of the first step surface 41e, so as to provide a larger axial (i.e., z-axis direction) moving space for focusing of the camera module. In this embodiment, the first driving portion may be mounted to the first stepped surface 41e of the base portion 41 of the second driving portion 40. The upper surface of the edge region 42a of the movable portion 42 may be formed with a recess that receives the ball 80 and limits the movement of the ball 80 within the recess, while also retaining debris generated by the friction of the ball 80 with the movable portion 42 or the base portion 41 within the recess. Also, since the balls 80 can be placed in the grooves, the movable portion 42, the base 41a of the base portion 41, and the cover 41b can be more conveniently assembled. In another embodiment, the boss of the groove positioned at the outer side can be eliminated, and the transverse size of the second driving part can be reduced by the design, so that the miniaturization of the camera module is facilitated. Since the outwardly located projection of the recess is eliminated, the recess is now effectively degraded into a recessed step, the outer step face of which is lower than the inner step face, and which forms together with the side wall of the cover and the base a receiving chamber for receiving the ball.

Further, in one embodiment of the present application, the edge area of the movable part may be provided with a plurality of grooves, and the number of grooves may match the number of balls. Each ball is accommodated in the corresponding groove. The bottom surface of the groove can be a plane, so that the movable part can not incline during translation, and meanwhile, the movable part and the base part can relatively move on three axes in the xoy plane only through a single layer of ball. Alternatively, a substrate recess may be provided at a position of the substrate corresponding to the movable portion recess. This design enables the thickness of the second drive portion to be reduced with a constant ball diameter. The bottom surface of the groove or the bottom surface of the recessed step (i.e., the outer step surface of the recessed step) is a flat surface, and allows the movable part to rotate in the xoy plane, i.e., around the z-axis, with respect to the base part. The direction of rotation about the z-axis may be referred to as the Rz direction, and may also be referred to as the Rz-axis rotation. In this embodiment, the photosensitive chip can move in the three directions of x, y and Rz to realize anti-shake, so that the photosensitive chip has better anti-shake capability. Since the three directions of movement x, y, Rz are all in the xoy plane, the relative movement in the xoy plane in three axes, i.e. in the x, y, Rz directions, is described above.

Fig. 10b shows a schematic cross-sectional view of the second driving part with balls arranged on the lower side of the movable part in a variant embodiment of the present application. Referring to fig. 10b, in the present embodiment, the balls 80 are located between the bearing platform 41d of the cover 41b and the movable portion 42. At the positions corresponding to the balls 80, the edge area 42a of the movable part 42 and/or the bearing table 41d may be provided with a groove, and the groove bottom surface of the groove may be provided as a flat surface, thereby allowing the movable part 42 to move only in the xoy plane with respect to the base part 41 and not to tilt when moving in the xoy plane.

Fig. 10c shows a schematic cross-sectional view of a second drive section with two layers of balls according to a variant embodiment of the present application. In this embodiment, two layers of

balls

81 and 82 are provided. Specifically, a single layer of balls 81 is provided between the base 41a and the movable portion 42, and a single layer of balls 82 is provided between the movable portion 42 and the bearing table 41d of the cover 41 b. Compared with the embodiment shown in fig. 10a, in this embodiment, since the layer of balls 82 is added between the movable portion 42 and the bearing platform 41d, the movable portion 42 does not directly rub against the bearing platform 41d during the anti-shake movement, and the generation of debris is reduced. And the resistance of the movable portion 42 when moving can be reduced by providing two layers of

balls

81 and 82.

Further, fig. 11a shows a schematic cross-sectional view of the second driving portion in an embodiment of the present application. Referring to fig. 11a, in the present embodiment, an outer side surface of the movable portion 42 is provided with an inwardly recessed engaging groove 42c, and the bearing base 41d of the cover 41b of the base portion 41 is fitted into the engaging groove 42 c. In this solution, the lower end surface of the second driving portion 40 may have a larger area, and when the lens base 22 is attached to the movable portion 42, the glue may be disposed in an area further outside the lens base 22, so as to keep the glue away from the optical filter as far as possible, thereby reducing the risk that the glue flows onto the optical filter 24, and completely avoiding the risk that the lens base 22 rubs against the base portion 41 during the anti-shake movement process. Further, in the present embodiment, the movable portion 42 may be a split type, for example, the movable portion 42 may include a first movable portion member 43 and a second movable portion member 44, and the side surface of the second movable portion member 44 and/or the first movable portion member 43 is recessed inward to form the engaging groove 42 c. Further, fig. 11b shows an assembly schematic of the second driving part in an embodiment of the present application. With reference to fig. 11a and 11b, in the assembly process of the second driving portion 42, the movable portion first member 43, the base portion 41 and the balls 80 may be assembled, and then the movable portion second member 44 may be attached to the lower end surface of the movable portion first member 43. With the design, the lens base is not required to be contacted with the base part when being attached, and meanwhile, the glue can be arranged at the position close to the edge of the lens base (the base part with four corners is not required to be avoided) to avoid the pollution of the color filter caused by the glue.

Alternatively, fig. 11c shows a schematic cross-sectional view of the second driving portion in another embodiment of the present application. Referring to fig. 11c, in the present embodiment, the movable portion 42 may be integrally formed, that is, the locking groove 42c is directly formed when the movable portion 42 is formed. And the cover 41b may be split. Referring to fig. 11b, the cover 41b may include two separate cover members 41b1 and 41b2, and the two separate cover members 41b1 and 41b2 may be inserted into the locking grooves 42c of the movable part 42 from the left and right sides, respectively, to fix the axial (i.e., z-axis) positions of the movable part 42 and the base part 41, thereby completing the enclosure of the second driving part 40.

Further, fig. 12 shows a schematic cross-sectional view of the second driving portion in a further embodiment of the present application. Referring to fig. 12, in the present embodiment, an outer side surface of the movable portion 42 is provided with an inwardly recessed catching groove 42c in which both the bearing platform 41d of the base portion 41 and the balls 80 are disposed.

Further, in one embodiment of the present application, the movable portion is bonded to the upper end surface of the lens holder of the photosensitive assembly, thereby achieving connection between the movable portion and the photosensitive assembly. In a modified embodiment, the movable portion may also be configured to have an extension arm extending downward, and the circuit board of the photosensitive component is bonded through the extension arm, so as to connect the movable portion and the photosensitive component. Referring to fig. 8 in combination, in the scheme of attaching the wiring board 23 to the extension arm 42a of the movable portion, alternatively, the mirror base may be selected to be a small mirror base 22a having a relatively low height, the small mirror base 22a is used only for mounting the photosensitive chip 24, and an electronic component 25 having a relatively high height, such as a capacitor or the like, is disposed outside the photosensitive chip 21 and the small mirror base 22 a. This kind of scheme can reduce the microscope base height to reduce the back burnt of making a video recording the module, and then reduced the whole height of module. In the present embodiment, since at least a portion of the electronic component is disposed outside the lens holder, it is preferable that the outer side surface of the movable portion of the second driving portion 40 has the engaging groove, so that the extending arm is disposed at the edge of the second driving portion, and the extending arm is far away from the electronic component as far as possible, thereby avoiding the electronic component being affected by the glue.

Fig. 13a shows a schematic bottom view of the movable part of the second driving part in an embodiment of the present application. In this embodiment, the glue 50 is disposed between the lower end surface of the movable portion 42 and the upper end surface of the lens holder of the photosensitive assembly. The arrangement of the glue 50 can avoid the four corners area, so that the glue 50 is prevented from leaking into the gaps of the ball containing structures at the four corners, and the anti-shaking movement is prevented from causing negative effects. Meanwhile, the movable part 42 can be prevented from being too close to the optical filter, and the risk of the optical filter being polluted by glue is reduced. Fig. 13b shows a schematic bottom view of the movable part of the second driving part in another embodiment of the present application. In this embodiment, the glue 50 may be arranged in a closed loop along the edge area of the lower end face of the movable part 42. This design may increase the closeness of the photosensitive assembly and prevent dust from falling onto the color filter.

It should be noted that the above embodiments can be combined with each other, for example, the slot designs shown in fig. 11a, 11b and 12 can be combined with the double ball design. Wherein the recess/recessed step may be provided on the bearing platform or on the movable part.

Further, fig. 14 shows a mounting position of the driving element of the second driving portion at a bottom view angle in one embodiment of the present application. Fig. 15a shows a schematic cross-sectional view of a second drive section containing a drive element in an embodiment of the present application. Referring to fig. 14 and 15a together, in an embodiment of the present application, the driving element of the second driving portion 40 is a coil magnet assembly. Wherein the magnet 61 may be disposed at an edge region of the base portion 41, and the coil 62 may be disposed at an edge region 42a of the movable portion 42. The coil 62 may be connected to the circuit board 23 of the photosensitive module 20 by soldering through an FPC board (flexible board) provided on the movable portion 42. Since the movable portion 42 and the photosensitive assembly 20 move synchronously during the anti-shake process, the coil 62 is soldered to the circuit board 23 through the FPC board, so that no relative movement of the lead or the soldering portion during the movement is ensured, and the risk of electrical connection failure or poor contact at the soldering portion is reduced. In this embodiment, the magnet may be provided on the base 41a of the base portion 41.

Further, fig. 15b shows a schematic cross-sectional view of the second driving portion including the driving element in another embodiment of the present application. Referring to fig. 15b, in the present embodiment, a magnet 61 is provided on a receiving base 41d of a cover 41b of the base 41.

Further, fig. 15c shows a schematic cross-sectional view of a second driving portion of the present application, including a driving element. In this embodiment, the coil 62 and the magnet 61 may be provided on the side walls of the movable portion 42 and the base portion 41. This design is advantageous in reducing the thickness of the second driving portion 40, thereby reducing the height of the camera module.

Still referring to fig. 14, in one embodiment of the present application, preferably, three coil magnet pairs (one coil magnet pair, i.e., one coil magnet combination) are provided, referred to as a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65, respectively. The first coil magnet pair 63 and the second coil magnet pair 64 are used for driving the movable portion 42 to translate in the x-axis direction, that is, providing a driving force in the x-axis direction. The third coil magnet pair 65 is used to drive the movable portion 42 to translate in the y-axis direction, i.e., to provide a driving force in the y-axis direction. In a top view (or a bottom view), the first coil magnet pair 63 and the second coil magnet pair 64 may be respectively disposed along two opposite sides of the second driving portion, which may be referred to as a first side 45 and a second side 46, and the first side 45 and the second side 46 do not intersect. And the second coil magnet pair 64 may be arranged along a third side 47 of the second driving portion, the third side 47 intersecting both the first side 45 and the second side 46. In this embodiment, three coil magnet pairs can realize both x-axis translation and y-axis translation, and can also realize rotation on the xoy plane. For example, when the first coil magnet pair 63 and the second coil magnet pair 64 are supplied with driving forces in opposite directions, a combined driving force for rotating the movable portion on the xoy plane can be generated. Note that the drive force for rotation in the xoy plane is not exclusively provided, and for example, the first coil magnet pair 63 and the third coil magnet pair 65 may be operated to generate a combined drive force for rotating the movable portion in the xoy plane. Alternatively, the positions of the first coil magnet pair and the second coil magnet pair may be staggered (that is, the arrangement positions of the first coil magnet pair and the second coil magnet pair may be asymmetric with respect to the central axis of the second driving portion) to provide a driving force to realize rotation of the movable portion within the xoy plane (that is, movement in the Rz direction).

Further, fig. 16a shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to fig. 16a, in the present embodiment, the side wall of the rear case 49 may have a first through hole 49b for a Flexible Printed Circuit (FPC) of the circuit board 23 to pass through, thereby achieving electrical connection with a main board or other components of the terminal device. The bottom plate 49c of the rear case 49 may have a second through hole 49d at the center thereof to facilitate the assembly of the camera module. The process of assembling the camera module may include: the lens 10 is first mounted on the first driving portion 30, the second driving portion 40 is then attached to the bottom of the first driving portion 30, and finally the photosensitive element 20 is attached to the movable portion 42 of the second driving portion 40 upward through the second through hole 49d at the bottom of the rear case 49.

Fig. 16b is a schematic diagram illustrating an assembly of the camera module according to an embodiment of the present application. In this embodiment, the photosensitive assembly 20 may be optionally placed on the adjusting device 29, and the second through hole 49d in the bottom of the rear case 49 allows the adjusting device 29 to determine the preferred position and posture of the photosensitive assembly 20 through the active calibration process, and then to be bonded to the movable portion 42 of the second driving portion 40 by the glue 28.

Fig. 16c shows a schematic cross-sectional view of a camera module in another embodiment of the present application. Referring to fig. 16c, in this embodiment, the bottom of the rear case 49 is a complete bottom plate 49c, that is, the bottom plate 49c is not provided with a second through hole, when assembling, the second driving portion 40 and the photosensitive component 20 may be attached together to form a first assembly, the first driving portion 30 and the lens 10 are assembled together to form a second assembly, then the relative position of the first assembly and the second assembly is determined through the active calibration process (the active calibration includes adjustment of position and posture), and finally the first driving portion 30 and the second driving portion 40 are attached according to the relative position determined by the active calibration, wherein the glue 27 for attaching the first assembly and the second assembly may be disposed between the bottom surface of the first driving portion 30 and the top surface of the second driving portion 40.

Further, fig. 17 shows an arrangement of the camera module and the connecting belt thereof in an embodiment of the present application. Referring to fig. 17, in the present embodiment, the image capturing module may include a first connecting belt 26a and a second connecting belt 26b, the first connecting belt 26a is disposed at a top region of the first driving portion 30 and electrically connected to the first driving portion 30, and the second connecting belt 26b is communicated with the circuit board 23 of the photosensitive assembly 20. Wherein the second connecting belt 26b can be provided with a plurality of bends to form a bending lamination shape so as to buffer the stress caused by the movement of the photosensitive assembly 20. The ends of the second connecting strips 26b may be provided with connectors that are optionally press-fitted and electrically connected to the center posts, and then the center posts 26c are used to conduct the motherboard (or other components) of the terminal device. Similarly, the end of the first connecting belt 26a can be connected to a connector, which is fixed and electrically connected to the middle rotating column 26c by pressing, and the main board (or other components) of the terminal device is conducted through the middle rotating column 26 c. In the solution of the present embodiment, the conducting circuit of the first driving portion 30 can be separated from the photosensitive element 20, and is not affected by the movement of the photosensitive element 20. The second connection strap 26b and the middle rotating post 26c may be accommodated in the second housing 70, the first connection strap 26a is located outside the second housing 70, and the top of the second housing 70 may have a third through hole 70a so that the connector of the first connection strap 26a extends into and is electrically communicated with the second connection strap 26b or the middle rotating post 26 c.

In the above embodiment, the first driving portion and the second driving portion may constitute a driving structure for the optical actuator, in which the first driving portion is adapted to mount the lens, the second driving portion is adapted to mount the photosensitive component, and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. For example, if the lens is driven to move in the positive x-axis direction, the photosensitive chip is driven to move in the negative x-axis direction; the lens is driven to move towards the positive direction of the y axis, and then the photosensitive chip is driven to move towards the negative direction of the y axis; or the lens is driven to move in the x axis and the y axis, and the photosensitive chip is driven to move in the opposite direction to the lens movement in the x axis and the y axis, in other words, when the lens needs to move in the x axis and the y axis simultaneously, the directions of the displacement vector of the lens and the displacement vector of the photosensitive chip on the xoy plane are opposite. In this embodiment, dispose camera lens and sensitization chip into and move simultaneously, and camera lens and sensitization chip moving direction are opposite, can realize faster response, and it is better to have better anti-shake effect. In addition, the anti-shake angle range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in this embodiment, by driving the lens or the photosensitive chip to move in opposite directions at the same time, compared with a scheme of driving only the lens to move, a stroke of the relative movement between the lens and the photosensitive chip is larger (for convenience of description, the stroke of the relative movement may be referred to as an anti-shake stroke), and a better compensation effect may be achieved. Particularly, due to the increase of the anti-shake stroke, the embodiment also has a good compensation effect on the tilt shake of the camera module. Further, the moving direction of the anti-shake movement of the embodiment can be limited in the xoy plane, and the optical axis of the lens or the photosensitive chip does not need to be inclined, so that the image blurring problem caused by the anti-shake movement is avoided.

Further, in the camera module, the circuit board of the photosensitive assembly generally includes a rigid circuit board main body and a flexible connection belt, one end of the flexible connection belt is connected to the circuit board main body, and the other end of the flexible connection belt is connected to and conducts the main board or other components of the electronic device through the connector. In the prior art, the flexible connecting band of the photosensitive assembly is usually led out from the side of the circuit board main body, and the flexible connecting band is approximately parallel to the surface of the circuit board column. In this arrangement, the flexible connection belt may generate a large resistance to the movement of the circuit board main body, which may increase the force required to drive the circuit board main body to move, resulting in insufficient anti-shake compensation stroke and reduced response speed. Also, the resistance caused by the connection belt is irregular, which makes it difficult for the second driving portion to compensate for the resistance, possibly causing a decrease in accuracy of the anti-shake compensation. Therefore, the present embodiment provides a suspended circuit board as the circuit board of the photosensitive component adapted to the second driving portion, which will help to overcome the above-mentioned drawbacks caused by the connection tape.

Fig. 18 is a perspective view illustrating an assembled second driving unit and photosensitive assembly according to an embodiment of the present disclosure. Fig. 19 shows an exploded view of the second driving portion and the photosensitive member in one embodiment of the present application. Fig. 20 is a perspective view of a photosensitive assembly and a suspension board used therein according to an embodiment of the present application. Referring to fig. 18, 19 and 20, in the camera module according to the embodiment, the photosensitive element 20 is connected to the movable portion 42 of the second driving portion 40, so that the circuit board main body 71 can move in the xoy plane under the driving of the movable portion 42. The circuit board 23 of the present embodiment is designed as a suspended structure. Specifically, the circuit board 23 includes a rigid circuit board main body 71 and a flexible connection tape 72, the connection tape 72 may include a third connection tape 72a and a fourth connection tape 72b, and the third connection tape 72a and the fourth connection tape 72b may be respectively led out from two opposite side surfaces (for convenience of description, the two opposite side surfaces may be referred to as a first side surface 74a and a second side surface 74b) of the circuit board main body 71 and bent upward. The bent third connection band 72a and the bent fourth connection band 72b may form a hanging portion 75, respectively. The suspending portion 75 may be connected with the base portion of the second driving portion 40 (or the first driving portion 30) to form a suspending structure. The suspension structure allows the base portion to suspend the circuit board main body 71 and the components mounted on the surface thereof (i.e., suspend the photosensitive assembly 20) by the bent portion 73 of the flexible connection tape 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75a), and the base portion 41 of the second driving portion 40 may have a corresponding hook 75b, and the hook 75b hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting band and the circuit board main body are generally in the same plane, and the deflection of the connecting band relative to the circuit board main body on the same plane can generate larger resistance. In the present embodiment, the connecting position of the connecting band 72 and the circuit board main body 71 is provided with a bending portion 73 formed by bending upward, and at this time, the resistance generated by the connecting band 72 relative to the circuit board main body 71 in the xoy plane (which can be regarded as a horizontal plane) is relatively small.

Further, in an embodiment of the present application, the third connection tape 72a and the fourth connection tape 72b may extend along the periphery of the circuit board main body 71 and the photosensitive assembly 20, so that the connection tape 72 surrounds the photosensitive assembly on at least three sides. And, the third connection strap 72a and the fourth connection strap 72b are connected to each other and electrically conducted. The photosensitive assembly 20 has a first side 74a and a second side 74b that are aligned with the circuit board main body 71. The first side 74a and the second side 74b are oppositely disposed (i.e., mutually intersected), and the third side 74c of the photosensitive member 20 is intersected with both the first side 74a and the second side 74 b. The connecting band 72 may surround the first side 74a, the second side 74b and the third side 74c of the photosensitive assembly 20. The third connecting band 72a is led out from the first side surface 74a of the circuit board main body 71 and bent upward to form the bent portion 73, and then extends along the first side surface 74a of the photosensitive assembly 20, and is bent in the horizontal direction at a corner and continues to extend along the third side surface 74 c. The fourth connecting band 72b is led out from the second side 74b of the circuit board main body 71 and bent upward to form another bent portion 73, and then extends along the second side 74b of the photosensitive assembly 20, and is horizontally bent at a corner and continues to extend along the third side 74 c. The third connecting band 72a and the fourth connecting band 72b can be joined and conducted to each other at the third side 74c, thereby forming a complete connecting band 72. The three connection belt sections at the first, second and

third side surfaces

74a, 74b and 74c may respectively have at least one suspension portion 75, and each suspension portion 75 has at least one through hole to connect with the base portion 41 of the second driving portion 40 (or the first driving portion 30). In this embodiment, the suspending portion 75 can suspend the circuit board main body 71 through the bending portions 73 located at two opposite sides of the circuit board main body 71, so that when the circuit board main body 71 is driven by the second driving portion 40 to move, the bending portions 73 and the connecting band 72 can be bent and deformed, and the moving stroke of the circuit board main body 71 is satisfied.

Further, in one embodiment of the present application, the suspending portions 73 of the three connecting band sections located at the first side surface 74a, the second side surface 74b and the third side surface 74c may be each reinforced by a rigid substrate. For example, a rigid substrate may be attached to a partial region of the flexible connection tape to form the suspension portion 73. And other areas of the flexible connecting belt still keep a flexible state so as to be capable of bending and deforming and meet the moving stroke of the circuit board main body 71.

Further, in an embodiment of the present application, the connection band section located on the third side 74c may have a rigid suspension portion 75c, the suspension portion 75c may lead out a fifth connection band 76, and the fifth connection band 76 may be used for connecting a main board of an electronic device (e.g., a mobile phone).

Further, in another embodiment of the present application, the suspension portion may also be connected with an external bracket (not shown in the drawings), which is directly or indirectly fixed with the base portion of the second driving portion. In the present application, the suspension portion may be fixed to the base portion of the second driving portion by another intermediary. The intermediate member may be directly or indirectly fixed to the base portion of the second driving portion. The intermediate has hooks for hooking the suspending part, or the intermediate is adhered to the suspending part. The intermediary member may be an external frame, a base of the first driving unit, or another intermediary member.

Further, in another embodiment of the present application, the suspension portion may not have the through hole. In this embodiment, the suspension portion may be fixed to the base portion of the second driving portion (or to the base portion of the first driving portion or the outer bracket) by bonding. Further, in another embodiment of the present application, the third connecting band and the fourth connecting band may be rigid-flexible boards, wherein the portion forming the suspension portion may be a rigid board, and both the portion connecting the suspension portion and the bent portion formed by bending upward may be a flexible board. Since the suspension portion is directly formed by the hard plate, the suspension portion in this embodiment may not be reinforced by attaching a rigid substrate.

Further, in an embodiment of the present application, the circuit board main body, the third connecting band and the fourth connecting band may be formed by a complete rigid-flex board.

Further, still referring to fig. 18, 19 and 20, in an embodiment of the present application, the circuit board may further have a fixing portion 76a for fixing the fifth connection band 76, which is designed to prevent the circuit board main body 71, the third connection band 72a and the fourth connection band 72b from being affected by external factors.

Further, fig. 21a shows a schematic front view of a suspension board in an embodiment of the present application after deployment; fig. 21b shows a schematic view of the back side of a hanging wiring board after deployment in one embodiment of the present application. Referring to fig. 21a and 21b, in this embodiment, the circuit board 23 may be formed by a rigid-flex board. The sections of the third connecting band 72a and the fourth connecting band 72b on the third side 74c can be snapped together by connectors 78 and 79 (refer to fig. 20), so that the third connecting band 72a and the fourth connecting band 72b are fixed and further electrically connected. The third connecting band 72a and the fourth connecting band 72b are provided with circuits therein to lead out the circuits in the circuit board main body 71, and further connected to an external circuit through the fifth connecting band 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can respectively lead out a part of the circuit through the corresponding bending part 73 formed by bending upwards, the circuit required to be led out by each bending part 73 can be reduced, so that the width of each bending part 73 can be reduced, and the resistance of the flexible connecting band 72 to the movement of the circuit board main body 71 can be further reduced, and the driving force required to be provided by the second driving part 40 can be further reduced. Note that in other embodiments of the present application, the circuit of the circuit board main body may also be led out through only one of the bent portions (for example, the bent portion bent upward of the third connection tape or the bent portion bent upward of the fourth connection tape).

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A driving structure for an optical actuator, comprising a second driving section and a photosensitive member, the second driving section comprising:

a second base portion; and

the movable portion of second, the lower terminal surface of the movable portion of second passes through glue bonding the up end of sensitization subassembly, the movable portion of second with the second basic portion passes through suspension swing joint, and is suitable for the drive the sensitization subassembly for the translation of second basic portion in x axle and y axle direction, the x axle with y axle mutually perpendicular, and all with the sensitization face of sensitization subassembly is parallel.

2. The driving structure for an optical actuator according to claim 1, wherein the photosensitive assembly includes a circuit board, a photosensitive chip mounted on a surface of the circuit board, and a mirror base mounted on the circuit board, the mirror base surrounding the photosensitive chip; wherein the lower end face of the second movable portion is bonded to the top face of the mirror base by glue.

3. A drive arrangement for an optical actuator as claimed in claim 2, wherein the photosensitive assembly further comprises a filter mounted to the mirror mount.

4. The drive structure for an optical actuator according to claim 1, wherein the second movable part and the second base part are in contact by a ball in the z direction.

5. The drive structure for an optical actuator according to claim 4, wherein the balls are arranged at four corner regions of the second drive portion in a plan view.

6. A drive structure for an optical actuator according to claim 5, wherein the glue is laid out avoiding four corner regions of the second movable portion.

7. A drive structure for an optical actuator according to claim 4, wherein the glue is arranged as a closed loop along an edge region of the lower end face of the second movable part.

8. The drive structure for an optical actuator according to claim 4, wherein the second movable portion is moved relative to the second base portion in a movement direction defined by the suspension system by a drive element.

9. A drive structure for an optical actuator according to claim 8, wherein the drive element is a combination of a coil and a magnet.

10. A drive structure for an optical actuator according to claim 8, wherein the drive element is an SMA element.

11. The drive structure for an optical actuator according to claim 4, wherein the second movable portion is controlled to be held at its initial position by mutually opposing drive forces.

12. The driving structure for optical actuator as claimed in claim 4, wherein the second base portion includes a base and a cover, the cover including a side wall formed to extend downward from the base to surround the second movable portion and a bearing table formed to extend horizontally inward from the side wall.

13. The drive structure for an optical actuator according to claim 12, wherein an edge region of the second movable portion is located between the base and an upper surface of the bearing table.

14. A drive structure for an optical actuator according to claim 12, wherein an edge region of the second movable portion and/or the bearing table is provided with a groove in which the ball is accommodated.

15. The drive structure for an optical actuator according to claim 12, wherein the ball and an edge region of the second movable portion are sandwiched between the base and the bearing table.

16. The driving structure for an optical actuator according to claim 8, wherein the driving element of the second driving section is a combination of a coil and a magnet; wherein the magnet is provided in an edge region of the second base portion, and the coil is provided in an edge region of the second movable portion.

17. The driving structure for an optical actuator according to claim 8, wherein the driving element of the second driving section is a combination of a coil and a magnet; wherein the coil and the magnet are respectively provided on side walls of the second movable portion and the second base portion.

18. The drive structure for an optical actuator according to claim 4, wherein the second movable portion and the second base portion each have a light passing hole in the center.

19. The drive structure for an optical actuator according to claim 4, wherein the second movable part includes a main body part and an edge region having a thickness smaller than that of the main body part.

20. The driving structure for an optical actuator as claimed in claim 12, wherein an upper surface of the edge region of the second movable portion has a recessed step whose outer step surface is lower than its inner step surface, and the recessed step forms a housing cavity for housing the ball together with the side wall of the cover and the base.

21. A drive arrangement for an optical actuator as claimed in claim 4, characterized in that the glue deployment position avoids the ball receiving structure.

22. The driving structure for an optical anti-shake camera module according to any one of claims 1-21, further comprising a first driving part adapted to mount a lens and drive the lens to translate in x-axis and y-axis directions;

wherein the upper surface of the second base part is connected with the first driving part.

23. The drive structure for an optical actuator according to claim 22, wherein the first drive portion includes a first base portion and a first movable portion, and the second base portion is fixed with the first base portion.

24. The utility model provides a module of making a video recording which characterized in that includes:

a lens; and

a drive structure for an optical actuator according to claim 22 or 23;

the lens is mounted on the first driving portion, and the photosensitive assembly is mounted on the second driving portion.