CN114222051B - Image pickup assembly and electronic apparatus - Google Patents
Image pickup assembly and electronic apparatus Download PDFInfo
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- CN114222051B CN114222051B CN202111669125.XA CN202111669125A CN114222051B CN 114222051 B CN114222051 B CN 114222051B CN 202111669125 A CN202111669125 A CN 202111669125A CN 114222051 B CN114222051 B CN 114222051B
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- flexible circuit
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- 230000008093 supporting effect Effects 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims description 40
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- 230000006870 function Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
Abstract
The embodiment of the application provides a camera shooting assembly and electronic equipment, wherein the camera shooting assembly comprises a shell, a camera shooting module, a first supporting structure and a second supporting structure, the shell comprises a bottom plate and a bracket, and the bracket is arranged around the bottom plate to form a containing space; at least one part of the camera shooting module is arranged in the accommodating space; the first supporting structure is arranged on the bottom plate; the second supporting structure is arranged on one surface of the camera module, which is far away from the received light, and the second supporting structure is mutually spaced with the first supporting structure and can interact to generate repulsive force so as to keep the bottom plate and one surface of the camera module, which is far away from the received light, in a spaced state. The repulsive force generated by the first supporting structure and the second supporting structure can keep the relative distance between the side, away from the received light, of the camera module and the bottom plate, and the side, away from the received light, of the camera module cannot be inclined at a large angle. Because the image sensor is generally arranged on the surface, far away from the light receiving surface, of the image pickup module, the stability of the image sensor can be kept.
Description
Technical Field
The application relates to the technical field of images, in particular to a camera shooting assembly and electronic equipment.
Background
Imaging technology, such as shooting technology, is widely used in life and industry, and products made of imaging technology, such as mobile electronic devices, are widely used. With technological development and social demands, users have increasingly higher requirements for shooting by using electronic devices and quality requirements.
In the practical application process, when a user shoots through the electronic equipment, the shot picture is easy to be blurred due to shaking generated by the electronic equipment or shaking generated by a shot object. In the related art, an optical anti-shake mechanism (OIS, optical Image Stabilization) is designed in the Image capturing device, and the optical anti-shake mechanism can move a Lens (Lens) and/or an Image Sensor (Image Sensor) to compensate according to shake conditions, so that a picture captured by the Image capturing device designed with the optical anti-shake mechanism is clearer than a picture captured by the Image capturing device not designed with the optical anti-shake mechanism.
In the related art, a lens, an image sensor, and an optical anti-shake mechanism are generally designed in a holder of an image pickup apparatus. The image sensor is connected with the main board of the electronic equipment through a flexible circuit board (FPC) to realize the electrical connection between the image sensor and the main board of the electronic equipment. The flexible circuit board can be abutted against the support in the support and can easily generate acting force with the support to act on the image sensor, so that the compensation effect of the optical anti-shake mechanism is affected.
Disclosure of Invention
The embodiment of the application provides a camera shooting assembly and electronic equipment, which can increase the stability of an image sensor in the camera shooting assembly.
The embodiment of the application provides a structure of making a video recording, it includes:
the shell comprises a bottom plate and a bracket, wherein the bracket is arranged around the bottom plate to form a containing space;
the camera module is at least partially arranged in the accommodating space;
the first supporting structure is arranged on the bottom plate; and
the second supporting structure is arranged on one surface of the camera module, which is far away from the received light, and the second supporting structure and the first supporting structure are mutually spaced and can interact to generate repulsive force so as to keep the bottom plate and one surface of the camera module, which is far away from the received light, in a spaced state.
The embodiment of the application also provides electronic equipment, which comprises a shell and a camera shooting assembly arranged on the shell, wherein the camera shooting assembly is the camera shooting assembly.
According to the image pickup assembly, the first supporting structure and the second supporting structure can interact to generate repulsive force, the opposite distance between the face of the receiving light and the bottom plate of the image pickup module can be kept away from the face of the receiving light through the repulsive force between the first supporting structure and the second supporting structure, and the situation that the face of the receiving light of the image pickup module is far away from the face of the receiving light can not generate large-angle inclination can be avoided. Because the image sensor of the camera module is generally close to the camera module and far away from the surface receiving light, the repulsive force generated between the first supporting structure and the second supporting structure can keep the image sensor of the camera module stable.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts throughout the following description.
Fig. 1 is a schematic structural diagram of an image capturing assembly according to an embodiment of the present application.
Fig. 2 is a schematic partial structure diagram of an image capturing assembly according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of an ideal state of the camera module.
Fig. 4 is a schematic structural diagram of the camera module in a non-ideal state.
Fig. 5 is a schematic structural diagram of the camera module when optical anti-shake is implemented in a non-ideal state.
Fig. 6 is a schematic diagram of a second structure of an image capturing assembly according to an embodiment of the present application.
Fig. 7 is a schematic diagram of a third structure of an image capturing assembly according to an embodiment of the present application.
Fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present application based on the embodiments herein.
Fig. 1 is a schematic diagram of a first structure of an image capturing assembly according to an embodiment of the present application. A camera assembly such as camera assembly 200 may include a housing such as housing 240, camera module 250, and a support structure. The supporting structure can play a supporting role on the camera module 250, can keep the stability of the camera module 250, especially can keep the image sensor in the camera module 250, and then can increase the definition of the picture shot by the camera module 200.
The following description will be given of the case 240 and the camera module 250, respectively, and then how the support structure supports the camera module 250.
Wherein the housing 240 may include a base 244 and a bracket 242, the bracket 242 being disposed about the base 244, such as the bracket 242 being disposed about an edge of the base 244. The bracket 242 and the base plate 244 are fixedly connected together to form a receiving space 246, and the receiving space 246 is capable of receiving the camera module 250 and the support structure. The bracket 242 and the base 244 may be directly fixedly connected, such as by welding, integrally formed therewith. The bracket 242 and the base 244 may also be fixedly coupled together in other manners, such as by a coupling structure. The fixed attachment structure may have an adhesive property to fixedly attach the bracket 242 to the base plate 244.
It is understood that the housing 240 may be understood as a carrier for housing and protecting the camera module 250 and the support structure. The structure of the casing 240 shown in fig. 1 is only an example of one structure of the embodiment of the present application, and the casing 240 is not limited thereto.
The camera module 250 may include a lens such as the lens 251, an image sensor such as the image sensor 252, a main circuit board such as the main circuit board 253, a first flexible circuit board such as the first flexible circuit board 254, and a second flexible circuit board such as the second flexible circuit board 255, wherein the first flexible circuit board 254 and the second flexible circuit board 255 may be collectively referred to as a flexible circuit module, and it should be noted that the flexible circuit module includes, but is not limited to, the first flexible circuit board 254 and the second flexible circuit board 255.
Referring to fig. 2, fig. 2 is a schematic diagram of a portion of a structure of a camera module provided in this embodiment, a main circuit board 253 is located on a surface of the camera module 250 away from receiving light, for example, the camera module 250 is near to the bottom of the bottom plate 244, an image sensor 252 is disposed on the main circuit board 253, a first flexible circuit board 254 is electrically connected to the main circuit board 253, a second flexible circuit board 255 is electrically connected to the main circuit board 253, and a connection position of the first flexible circuit 254 and the main circuit board 253 and a connection position of the second flexible circuit board 255 and the main circuit board 253 are located on opposite sides of an extending direction of the main circuit board 253. For example, one end of the first flexible circuit board 254 is connected to one side of the extending direction of the main circuit board 253, the other end is connected to the second flexible circuit board 255, one end of the second flexible circuit board 255 is connected to the other side of the extending direction of the main circuit board 253, the other end is connected to the first flexible circuit board 254, and the first flexible circuit board 254 and the second flexible circuit board 255 are enclosed in the main circuit board 253. The other end of the first flexible circuit board 254 and the other end of the second flexible circuit board 255 may be connected by a fixing element, for example, the first flexible circuit board 254 and the second flexible circuit board 255 may be connected by a fixing element such as a positioning post and/or a connecting glue to form the connection portion 258, and the first flexible circuit board 254 and the second flexible circuit board 255 may be conducted by a stamp hole welding manner. The connection portion 258 may be fixedly connected with the bracket 242 to limit the flexible circuit module.
The camera module 250 further includes a first anti-shake mechanism 257 of the image sensor 252, where the first anti-shake mechanism 257 can limit the movement of the image sensor 252 of the camera module within a first preset range, for example, the first anti-shake mechanism 257 can drive the image sensor 252 to move along the X-axis direction, so as to implement optical anti-shake of the image sensor 252 along the X-axis direction; the first anti-shake mechanism 257 may drive the image sensor 252 to move along the Y-axis direction to implement optical anti-shake of the image sensor 252 along the Y-axis direction, and the first anti-shake mechanism 257 may also drive the image sensor 252 to rotate about the Z-axis as a rotation axis to implement optical anti-shake of the image sensor 252 along the Z-axis direction. The Z-axis direction may be an optical axis direction of the lens of the image capturing module 250 or an axis direction parallel to the optical axis, and the image sensor 252 is disposed on the main circuit board, so that the Z-axis direction may be understood as a direction perpendicular to the extending direction of the main circuit board, the X-axis direction and the Y-axis direction may be axis directions perpendicular to the optical axis direction, and the X-axis and the Y-axis may be understood as directions parallel to the extending direction of the main circuit board. The X-axis direction and the Y-axis direction are perpendicular to each other. When the first anti-shake mechanism 257 drives the image sensor 252 to move, the reaction force of the flexible circuit module to the main circuit board 253 can be reduced in an ideal state due to the connection mode of the first flexible circuit board 254 and the second flexible circuit board 255, and the reaction force of the flexible circuit module to the main circuit board 253 can be controlled within 5mN (100 um).
However, in the process that the first anti-shake mechanism 257 drives the image sensor 252 to move to realize optical anti-shake of the image sensor 252, the main circuit board 253 moves together with the image sensor 252, and the first flexible circuit board 254 and the second flexible circuit board 255 connected with the main circuit board 253 collide with the support 242 in the support 242 to easily generate acting force with the support 242 to act on the image sensor 252, so that compensation effect of the first anti-shake mechanism is affected. With continued reference to fig. 3 to 5, fig. 3 is a schematic structural diagram illustrating an ideal state of the camera module. Fig. 4 is a schematic structural diagram of the camera module in a non-ideal state. Fig. 5 is a schematic structural diagram of the camera module when optical anti-shake is implemented in a non-ideal state.
In an ideal situation, there is a space (as shown in fig. 2) between the first flexible circuit board 254 and the second flexible circuit board 255 connected to opposite sides of the main circuit board 253 and the support 242, that is, the flexible circuit module does not incline towards the support 242 and contacts the support 242 along with the movement of the main circuit board 253, so that the flexible circuit module can be prevented from being abutted against the support 242 in the support 242 to easily generate a force with the support 242 to act on the main circuit board 253 connected to the image sensor 252, and further the inclination of the main circuit board 253 and the image sensor 252 is prevented. In the irrational state, due to the structural characteristic that the flexible circuit module is soft, the flexible circuit module is easy to fall to the support 242 (as shown in fig. 3), the first flexible circuit board 254 and the second flexible circuit board 255 connected to opposite sides of the main circuit board 253 are in contact with the support 242, that is, the flexible circuit module falls to the support 242 in an inclined manner along with the movement of the main circuit board 253, and when the first anti-shake mechanism 257 of the camera module 250 drives the image sensor 252 to realize optical anti-shake, the flexible circuit module collides to the support 242 in the support 242, and generates a force with the support 242 to act on the main circuit board 253 connected with the image sensor 252, so that the main circuit board 253 and the image sensor 252 incline (as shown in fig. 4). The problem that the image sensor is unstable due to the inclination of the main circuit board 253 and the image sensor 252 in the process of realizing optical anti-shake of the image sensor is solved, so that the compensation effect of the optical anti-shake mechanism is affected. The supporting structure of the camera module can interact to generate repulsive force, so that the relative distance between one face, far away from the received light, of the camera module and the bottom plate can be kept, and the situation of large-angle inclination cannot be generated.
With continued reference to fig. 1, the support structure includes a first support structure 210 and a second support structure 220, the first support structure is disposed on the bottom plate 244, the second support structure 220 is disposed on a surface of the camera module 250 away from receiving light, for example, the second support structure 220 is disposed on the main circuit board 253 of the camera module 250 and between the bottom plate 244 and the main circuit board 253, and the second support structure 220 is spaced from the first support structure 210 and can interact to generate a repulsive force to keep the bottom plate 244 and the surface of the camera module away from receiving light, such as the main circuit board 253, in a spaced state.
The first support structure 210 and the second support structure 220 in the image capturing assembly 200 provided in the embodiment of the application can interact to generate a repulsive force, and the relative distance between the surface of the image capturing module, which receives the light, and the bottom plate 244 can be kept by the repulsive force between the first support structure 210 and the second support structure 220 without generating a large-angle inclination. Because the image sensor 252 of the camera module 250 is generally disposed near a surface of the camera module away from the light receiving surface, the repulsive force generated between the first support structure 210 and the second support structure 220 can keep the image sensor of the camera module stable.
Wherein the first support structure 210 may include at least one first magnet 212, the second support structure 220 may include at least one second magnet 222, and one first magnet 212 and one second magnet 222 are disposed opposite to form one support structure group 23A, any of which is capable of generating a repulsive force. It is understood that the magnetic pole of the first magnet 212 opposite to the second magnet 222 is a first magnetic pole, the magnetic pole of the second magnet 222 opposite to the first magnet 212 is a second magnetic pole, and the first magnetic pole and the second magnetic pole are the same magnetic pole, so that a repulsive force can be generated between the first magnet and the second magnet. For example, the first magnetic pole may be an S-pole, the second magnetic pole may be an S-pole, and a repulsive force may be generated between the first magnetic pole and the second magnetic pole. Of course, the first magnetic pole may be an N pole, and the second magnetic pole may be an N pole.
In order to increase the support capability of the support structure, there are at least two sets of support structures between the first flexible circuit board 254 and the second flexible circuit board 255, wherein one set of support structures 23A is disposed proximate to the first flexible circuit board 254 and the other set of support structures 23B is disposed proximate to the second flexible circuit board 255. It will be appreciated that, in order to further improve the supporting capability of the supporting structure, multiple supporting structure groups 23A and multiple supporting structure groups 23B may be arranged along the Y-axis direction, where the multiple supporting structure groups 23A may be arranged at equal intervals along the Y-axis direction, and the multiple supporting structure groups 23B may be arranged at equal intervals along the Y-axis direction. The plurality of support structure groups 23A are equally spaced apart, which is understood to mean that the distances between two adjacent support structure groups 23A are identical. The plurality of support structure groups 23B are equally spaced apart and may be understood as the same distance between two adjacent support structure groups 23B. When the first flexible circuit board 254 and the second flexible circuit board 255 collapse to the support 242 due to the soft structural characteristics of the materials, the reaction force of the support 242 to the first flexible circuit board 254 and the second flexible circuit board 255 and the acting force acting on the main circuit board 253 can be offset by the acting force of the supporting structure to the main circuit board 253, and the stability of the image sensor arranged on the main circuit board 253 can be maintained.
At least five groups of support structures can be arranged between the main circuit board and the bottom plate, and the at least five groups of support structures are distributed at equal intervals along the X-axis direction. With continued reference to fig. 6, fig. 6 is a schematic diagram of a second structure of the camera module according to the embodiment of the present application.
Five support structure groups are arranged between the main circuit board 253 and the bottom plate 244 at equal intervals along the X-axis direction, and the equal-interval arrangement of the five support structure groups can be understood as that the distances between two adjacent support structure groups in the five support structure groups are the same. The five supporting structure groups comprise a supporting structure group 23A close to the joint of the first flexible circuit board 254 and the main circuit board 253, a supporting structure group 23B close to the joint of the second flexible circuit board 255 and the main circuit board 253, and three supporting structure groups arranged between the supporting structure group 23A and the supporting structure group 23B, so that the supporting capability of the supporting structure to the bottom of the camera shooting assembly can be improved. In some embodiments, multiple support structure groups arranged along the Y-axis direction and multiple support structure groups arranged along the X-axis direction may be disposed between the main circuit board 253 and the bottom plate 244 according to actual requirements.
The dimension L1 of the first magnet 212 in the same support structure group may be equal to the dimension L2 of the second magnet 222, where the dimension L1 of the first magnet 212 is a length of the first magnet 212 along a direction parallel to the extending direction (X-axis direction) of the main circuit board 253, and the dimension L2 of the second magnet 222 is a length along a direction parallel to the extending direction (X-axis direction) of the main circuit board 253. In some embodiments, the first magnet 212 may be sized to be a length of the first magnet in a direction parallel to the main circuit board extension direction (Y-axis direction), and the second magnet may be sized to be a length in a direction parallel to the main circuit board extension direction (Y-axis direction). In some embodiments, the first magnet 212 may be sized to be a length of the first magnet in a direction parallel to the main circuit board extension direction (X-axis direction and Y-axis direction), and the second magnet may be sized to be a length in a direction parallel to the main circuit board extension direction (X-axis direction and Y-axis direction).
In order to avoid that when the main circuit board 253 is displaced along the X-axis in the bracket, the supporting force of the supporting structure on the main circuit board 253 is insufficient to counteract the reactive force of the flexible circuit module on the main circuit board 253 due to the overlarge displacement distance, so that the main circuit board 253 is inclined, and the image sensor 252 is unstable, the size of the magnet can be improved, the size of the second magnet 222 in the same supporting structure group can be larger than that of the first magnet 212, the size of the first magnet 212 is the length of the first magnet 212 along the X-axis, and the size of the second magnet 222 is the length of the second magnet 222 along the X-axis. Further, the difference between the size of the second magnet 222 and the size of the first magnet 212 in the same support structure set is greater than or equal to the maximum distance that the image sensor 252 can move along the X-axis direction.
In some embodiments, the first magnet 212 in the same support structure set may have a larger size than the second magnet 222, the first magnet 212 having a length of the first magnet 212 along the X-axis direction, and the second magnet 222 having a length of the second magnet 222 along the X-axis direction. Further, the difference between the size of the first magnet 212 and the size of the second magnet 222 in the same support structure set is greater than or equal to the maximum distance that the image sensor 252 can move along the X-axis direction.
In order to avoid that when the main circuit board 253 is displaced in the support along the Y axis, the support force of the support structure on the main circuit board 253 is insufficient to counteract the reaction force of the flexible circuit module on the main circuit board 253 due to the overlarge displacement distance, so that the main circuit board 253 is inclined, and the image sensor 252 is unstable, the size of the magnets can be improved, the size of the second magnets 222 in the same support structure group can be larger than that of the first magnets 212, the size of the first magnets 212 is the length of the first magnets 212 along the Y axis, and the size of the second magnets 222 is the length of the second magnets 222 along the Y axis. Further, the difference between the size of the second magnet 222 and the size of the first magnet 212 in the same set of support structures is greater than or equal to the maximum distance the image sensor 252 can move along the Y-axis.
In some embodiments, the first magnet 212 in the same support structure set may have a larger size than the second magnet 222, the first magnet 212 having a length of the first magnet 212 along the Y-axis direction, and the second magnet 222 having a length of the second magnet 222 along the Y-axis direction. Further, the difference between the size of the first magnet 212 and the size of the second magnet 222 in the same set of support structures is greater than or equal to the maximum distance the image sensor 252 can move along the Y-axis. In some embodiments, the second support structure may include a coil, and with continued reference to fig. 7, fig. 7 is a schematic diagram of a third structure of the camera assembly provided in the embodiments of the present application.
The second support structure 220 may include a coil 221, where the coil 221 is disposed on the main circuit board 253 of the camera module and is electrically connected to the main circuit board 253 of the camera module, the coil 221 is disposed on a surface of the main circuit board 253, which is far away from the camera module and receives light, and the first support structure 210 includes a plurality of magnets, and the coil 221 can generate a repulsive force with the magnets of the first support structure 210 in an energized state. All magnets are disposed on the base plate 244 and are disposed between the first flexible circuit board 254 and the second flexible circuit board 255, and in order to improve the supporting effect of the supporting structure, at least one magnet 212 of the plurality of magnets is disposed near the first flexible circuit board 254, and at least one magnet 214 of the plurality of magnets is disposed near the second flexible circuit board 255. Specifically, at least one magnet 212 is disposed proximate to the junction of the first flexible circuit board 254 and the main circuit board 253, and at least one magnet 214 is disposed proximate to the junction of the second flexible circuit board 255 and the main circuit board 253. When the first anti-shake mechanism 257 is moved by driving the image sensor 252 to implement optical anti-shake, the coil 221 is in an energized state so that the magnetic force generated by the coil 221 and the magnetic force of all the magnets are repulsive, so as to keep the base plate 244 and the main circuit board 253 at the bottom of the camera module in a spaced state. When the flexible circuit module collapses to the support 242 due to the soft structural characteristic of the material, the reaction force of the support 242 to the first flexible circuit board 254 and the second flexible circuit board 255 and the acting force acting on the main circuit board 253 can not cause the inclination of the main circuit board 253, so that the image sensor arranged on the main circuit board 253 does not move within the first preset range. Affecting the optical anti-shake effect.
In some embodiments, the first support structure may include coils disposed on the base plate, routed through the base plate to a main circuit board or other circuit board such as a circuit board disposed outside the camera module. The second support structure comprises a plurality of magnets which are arranged on the main circuit board and are positioned between the main circuit board and the bottom plate, and the coil can generate repulsive force with the magnets of the second support structure in an electrified state. All magnets set up in the main circuit board and all are located between first flexible circuit board and the second flexible circuit board, in order to improve bearing structure's supporting effect, at least one magnet in a plurality of magnets sets up near first flexible circuit board, and at least one magnet in a plurality of magnets sets up near the second flexible circuit board. Specifically, at least one magnet is arranged near the connection of the first flexible circuit board and the main circuit board, and at least one magnet is arranged near the connection of the second flexible circuit board and the main circuit board. When the first anti-shake mechanism drives the image sensor to move so as to realize optical anti-shake, the coil is in an electrified state, so that magnetic force generated by the coil and magnetic force of all magnets are repulsive force, and the bottom plate and the main circuit board at the bottom of the camera module are kept in a spaced state. The main circuit board is not inclined due to the fact that the main circuit board is inclined due to the fact that the support 242 reacts to the first flexible circuit board and the second flexible circuit board and then acts on the acting force of the main circuit board when the flexible circuit module is collapsed to the support due to the soft structural characteristics of materials, and the image sensor arranged on the main circuit board is not moved in the first preset range. Affecting the optical anti-shake effect.
With continued reference to fig. 1, in order to implement the dual-optical anti-shake function of the image capturing assembly 200, the image capturing assembly 200 may further include a second anti-shake mechanism 256, where the second anti-shake mechanism 256 is configured to limit movement of the lens 251 of the image capturing module within a second predetermined range. The second anti-shake mechanism 256 may drive the lens 251 to move along the X-axis direction to implement optical anti-shake of the X-axis, the second anti-shake mechanism 256 may drive the lens 251 to move along the Y-axis direction to implement optical anti-shake of the Y-axis, and the second anti-shake mechanism 256 may also drive the lens 251 to move along the Z-axis direction to implement optical anti-shake of the Z-axis or implement a zoom function of the lens 251. Wherein, the Z-axis direction may be an optical axis direction of the lens of the image capturing module 250 or an axis direction parallel to the optical axis, and the X-axis direction and the Y-axis direction may be axis directions perpendicular to the optical axis direction, and the X-axis direction and the Y-axis direction are perpendicular to each other. In the related art, only a single anti-shake function such as anti-shake of a lens or an image sensor is usually achieved, however, an anti-shake angle that can be achieved by a single anti-shake structure such as anti-shake of a lens or an image sensor is limited by a structural space of an electronic device, and only a small-angle (such as within 1 ° or within 1.5 °) optical anti-shake function can be achieved. The shooting device of this application embodiment can realize camera lens anti-shake and image sensor anti-shake simultaneously, and integrated camera lens anti-shake function and image sensor anti-shake function can realize the optics anti-shake of bigger angle for the correlation technique, effectively promotes the optics anti-shake effect of subassembly of making a video recording.
It can be appreciated that the first anti-shake mechanism 257 for implementing anti-shake of the image sensor 252 provided in the embodiments of the present application may implement an anti-shake function by using any one of an electromagnetic motor, a piezoelectric motor, a memory alloy driver, and a microelectromechanical system, and the electromagnetic motor may include a dome motor and a ball motor. For example, the first anti-shake mechanism 257 may adopt a memory alloy driver, and the memory alloy driver may include a deformation member, where the deformation member may deform to drive the image sensor 252 to move in a direction perpendicular to an optical axis of the lens 251 (including an X direction or a Y direction), or drive the image sensor 252 to rotate about an axis direction of the lens 251 or an axis direction (Z axis) parallel to the optical axis direction as a rotation axis, so as to implement an optical anti-shake function of the image sensor 252. The deformation member can be made of shape memory alloy (shape memory alloys, SMA), the shape memory alloy can be heated and deformed in the electrified state, and the length of the deformation member can be changed in the deformation process, so that the image sensor 252 is driven to move, and the anti-shake function of the image sensor 252 is realized.
The second anti-shake mechanism 256 for implementing the anti-shake of the lens 251 provided in the embodiment of the present application may implement the anti-shake function of the lens 251 by using any one of an electromagnetic motor, a piezoelectric motor, a memory alloy driver and a microelectromechanical system.
The embodiment of the application further provides an electronic device, which may be a mobile phone, a tablet computer, a notebook computer, a wearable device and other portable devices, and the mobile phone is taken as an example for description below, and referring to fig. 1 and fig. 8, fig. 8 is a schematic structural diagram of the electronic device provided in the embodiment of the application.
The electronic device 100 may include a housing 110, a camera assembly 200, and a display 120. The display screen 120 is disposed on the housing 110, and may be used for displaying a picture, and the image capturing assembly 200 may be disposed on the housing 110 and may be capable of receiving light incident from an external environment to capture the picture. The camera assembly 200 may be the camera assembly 200 described above.
The image capturing assembly 200 may include a first anti-shake mechanism 257, a second anti-shake mechanism 256, a lens 251, and an image sensor 252. Wherein, the first anti-shake mechanism 257 drives the image sensor 252 to move to realize the optical anti-shake function of the image sensor 252, and the second anti-shake mechanism 256 drives the lens 251 to move to realize the lens anti-shake function of the lens 251. The image sensor 252 is disposed opposite to the lens 251, and in this embodiment, the image capturing assembly 200 may be used to implement functions of photographing, video recording, face recognition unlocking, code scanning payment, etc. of the electronic device 100. Note that, the camera module 200 may be a front camera as shown in fig. 8, or may be a rear camera, which is not limited in this embodiment.
Specifically, the lens 251 may be made of glass or plastic. The lens 251 is mainly used to change the propagation path of light and focus the light. Lens 251 may include multiple sets of lenses that correct the filtered light rays with each other; when light passes through the lens 251, the multiple lens layers filter stray light (such as infrared light) so as to increase the imaging effect of the image capturing assembly 200. The image sensor 252 may be an image sensor such as a CCD (Charge Coupled Device ) or an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor ). The image sensor 252 may be disposed opposite to the lens 251 in the optical axis direction of the image capturing assembly 200 (i.e. the optical axis direction of the lens 251), and is mainly configured to receive the light collected by the lens 251 and convert the light signal into an electrical signal, so as to achieve the imaging requirement of the image capturing assembly 200. The first anti-shake mechanism 257 and the second anti-shake mechanism 256 are mainly used for improving the imaging effect of the image capturing assembly 200 caused by shake of the user during use, so that the imaging effect of the image sensor 252 can meet the use requirement of the user.
Based on the optical anti-shake technology, a sensor such as a gyroscope or an accelerometer provided in the electronic device 100 (or the image capturing assembly 200) may detect shake of the lens 251 and/or the image sensor 252 to generate a shake signal, and transmit the shake signal to a processing chip of the electronic device 100 and/or the image capturing assembly 200, and the processing chip of the electronic device 100 and/or the image capturing assembly 200 may calculate a displacement amount of the first anti-shake mechanism 257 and/or the second anti-shake mechanism 256 that needs to be compensated, so that the first anti-shake mechanism 257 and/or the second anti-shake mechanism 256 may compensate the lens 251 and/or the image sensor 252 according to a shake direction and the shake displacement amount, thereby improving an imaging effect of the image capturing assembly 200 generated by shake generated in a use process of a user.
According to the image pickup assembly of the electronic equipment, the first supporting structure and the second supporting structure can interact to generate repulsive force, the opposite distance between the side, away from which receives light, of the image pickup module and the bottom plate can be kept through the repulsive force between the first supporting structure and the second supporting structure, and when the first anti-shake mechanism is used for realizing optical anti-shake, the main circuit board, away from the side, away from which receives light, of the image pickup module can not generate large-angle inclination. Therefore, the image sensor arranged on the main circuit board cannot generate large-angle inclination, and the repulsive force generated between the first supporting structure and the second supporting structure can keep the image sensor of the camera module stable. The optical anti-shake effect of the first anti-shake mechanism is ensured.
The imaging assembly and the electronic device provided in the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, where the description of the above embodiments is only used to help understand the method and core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (11)
1. A camera assembly, comprising:
the shell comprises a bottom plate and a bracket, wherein the bracket is arranged around the bottom plate to form a containing space;
the camera module is at least partially arranged in the accommodating space;
the first supporting structure is arranged on the bottom plate; and
the second supporting structure is arranged on one surface of the camera shooting module far away from the light receiving surface, and the second supporting structure and the first supporting structure are mutually spaced and can interact to generate repulsive force so as to keep the bottom plate and one surface of the camera shooting module far away from the light receiving surface in a spaced state;
the camera module comprises a main circuit board, a first flexible circuit board and a second flexible circuit board, wherein the main circuit board is located on one surface of the camera module, which is far away from the surface for receiving light, the second support structure is arranged on the other surface of the main circuit board, which is far away from the surface for receiving light, the camera module, one end of the first flexible circuit board is connected to one side of the main circuit board, one end of the second flexible circuit board is connected to the other side of the main circuit board, the connection positions of the first flexible circuit and the main circuit board and the connection positions of the second flexible circuit board and the main circuit board are located on two opposite sides of the extending direction of the main circuit board, and the other end of the first flexible circuit board and the other end of the second flexible circuit board are fixedly connected to the support through fixing pieces.
2. The camera assembly of claim 1, wherein the first support structure comprises at least one first magnet and the second support structure comprises at least one second magnet, one of the first magnets and one of the second magnets being disposed opposite to form a set of support structures, any one of the set of support structures being capable of generating a repulsive force.
3. The camera assembly of claim 2, wherein there are at least two sets of support structures between the main circuit board and the base plate, one set of support structures being disposed proximate the first flexible circuit board and the other set of support structures being disposed proximate the second flexible circuit board.
4. The camera assembly of claim 2, wherein at least five sets of support structures are provided between the first flexible circuit board and the second flexible circuit board, each set of support structures being equally spaced.
5. The camera assembly of claim 2, wherein a dimension of a first magnet in a same set of support structures is equal to a dimension of a second magnet, the dimension of the first magnet being a length of the first magnet in a direction parallel to an extension direction of the main circuit board, the dimension of the second magnet being a length of the second magnet in a direction parallel to the extension direction of the main circuit board.
6. The camera assembly of claim 2, wherein a size of a second magnet in the same set of support structures is greater than a size of a first magnet, the first magnet having a length of the first magnet in a direction parallel to an extension direction of the main circuit board, the second magnet having a size of the second magnet in a direction parallel to the extension direction of the main circuit board.
7. The camera assembly of claim 2, further comprising a first anti-shake mechanism for compensating movement of an image sensor of the camera module at least in a direction parallel to the main circuit board extension direction;
the difference between the size of the second magnet and the size of the first magnet in the same supporting structure group is larger than or equal to the maximum distance of the compensating movement of the image sensor along the extending direction parallel to the main circuit board.
8. The camera assembly of claim 7, further comprising a second anti-shake mechanism for compensating movement of a lens of the camera module at least in a direction of an optical axis of the lens.
9. The camera assembly of claim 1, wherein the second support structure comprises a coil disposed on and electrically connected to the main circuit board of the camera module, and the first support structure comprises a plurality of magnets, the coil being capable of generating a repulsive force with all of the magnets in an energized state.
10. The camera assembly of claim 9, wherein the coil is disposed on a side of the main circuit board that is remote from the camera module that receives light; all magnets are located between the main circuit board and the base plate, at least one of the magnets being disposed proximate the first flexible circuit board and at least one of the magnets being disposed proximate the second flexible circuit board.
11. An electronic device, characterized in that the electronic device comprises a housing and a camera assembly provided to the housing, the camera assembly being as claimed in any one of claims 1 to 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111669125.XA CN114222051B (en) | 2021-12-31 | 2021-12-31 | Image pickup assembly and electronic apparatus |
| PCT/CN2022/136355 WO2023124783A1 (en) | 2021-12-31 | 2022-12-02 | Photographing assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111669125.XA CN114222051B (en) | 2021-12-31 | 2021-12-31 | Image pickup assembly and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114222051A CN114222051A (en) | 2022-03-22 |
| CN114222051B true CN114222051B (en) | 2024-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111669125.XA Active CN114222051B (en) | 2021-12-31 | 2021-12-31 | Image pickup assembly and electronic apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114222051B (en) |
| WO (1) | WO2023124783A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114222051B (en) * | 2021-12-31 | 2024-03-01 | Oppo广东移动通信有限公司 | Image pickup assembly and electronic apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7881598B1 (en) * | 2009-12-03 | 2011-02-01 | Tdk Taiwan Corporation | Anti-shake auto-focus modular structure |
| CN111654612A (en) * | 2020-06-17 | 2020-09-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112822350A (en) * | 2020-12-25 | 2021-05-18 | 维沃移动通信有限公司 | Electronic equipment and camera module |
| CN113114919A (en) * | 2021-05-19 | 2021-07-13 | 江西晶浩光学有限公司 | Circuit board assembly, camera module and electronic equipment |
| CN215300727U (en) * | 2021-06-24 | 2021-12-24 | 江西晶浩光学有限公司 | Sensitization chip subassembly, periscopic module and electronic equipment of making a video recording |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8982464B2 (en) * | 2010-10-22 | 2015-03-17 | Tdk Taiwan Corporation | Tilt-type anti-shake compensation structure for auto-focus module |
| JP5838270B2 (en) * | 2012-10-31 | 2016-01-06 | 富士フイルム株式会社 | The camera module |
| WO2021159391A1 (en) * | 2020-02-13 | 2021-08-19 | 南昌欧菲光电技术有限公司 | Camera module, photographing apparatus, and electronic device |
| CN112887550B (en) * | 2021-01-22 | 2022-03-25 | 维沃移动通信有限公司 | Electronic equipment and camera module |
| CN114222051B (en) * | 2021-12-31 | 2024-03-01 | Oppo广东移动通信有限公司 | Image pickup assembly and electronic apparatus |
-
2021
- 2021-12-31 CN CN202111669125.XA patent/CN114222051B/en active Active
-
2022
- 2022-12-02 WO PCT/CN2022/136355 patent/WO2023124783A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7881598B1 (en) * | 2009-12-03 | 2011-02-01 | Tdk Taiwan Corporation | Anti-shake auto-focus modular structure |
| CN111654612A (en) * | 2020-06-17 | 2020-09-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112822350A (en) * | 2020-12-25 | 2021-05-18 | 维沃移动通信有限公司 | Electronic equipment and camera module |
| CN113114919A (en) * | 2021-05-19 | 2021-07-13 | 江西晶浩光学有限公司 | Circuit board assembly, camera module and electronic equipment |
| CN215300727U (en) * | 2021-06-24 | 2021-12-24 | 江西晶浩光学有限公司 | Sensitization chip subassembly, periscopic module and electronic equipment of making a video recording |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114222051A (en) | 2022-03-22 |
| WO2023124783A1 (en) | 2023-07-06 |
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