WO2020248444A1

WO2020248444A1 - Camera module, electronic device, and optical image stabilization method thereof

Info

Publication number: WO2020248444A1
Application number: PCT/CN2019/110156
Authority: WO
Inventors: 陈怡和
Original assignee: 南昌欧菲光电技术有限公司
Priority date: 2019-06-11
Filing date: 2019-10-09
Publication date: 2020-12-17

Abstract

The present application provides a camera module, the camera module comprising: a lens assembly, used for receiving optical signals; a chip assembly, arranged opposite to the lens assembly, the chip assembly being used for converting optical signals into image signals; and a drive assembly, the drive assembly being connected to the chip assembly, the drive assembly being capable of driving the chip assembly to return to a position aligned with the optical axis of the lens assembly when the chip assembly is offset with respect to the lens assembly. The present application also provides an electronic device and optical image stabilization method thereof. By means of arranging the drive assembly connected to the chip assembly, the drive assembly is capable of driving the chip assembly to return to a position aligned with the optical axis of the lens assembly when the chip assembly is offset with respect to the lens assembly, so as to compensate for the impact of the shaking of the camera module on the quality of the generated image during the process of photographing, and thus achieve optical image stabilization when the camera module is being photographed, improving the photographing quality of the electronic device.

Description

Camera module, electronic equipment and its optical anti-shake method

This application requires that it be submitted to the Chinese Patent Office on June 11, 2019. The application number is 201910502080.3, the application name is "camera module, electronic equipment and its optical image stabilization method" and the application number is 201920884580.3, the application name is "camera module and The priority of the Chinese patent application for "electronic equipment", the content of the above-mentioned earlier application is incorporated into this text by way of introduction.

Technical field

This application relates to the field of electronic technology, in particular to a camera module, electronic equipment and an optical anti-shake method.

Background technique

With the development of optical technology, many electronic devices have camera functions. When a user uses an electronic device (for example, a camera or a mobile phone, etc.) to take an image, the user's hand shake may cause the electronic device to shake, which may result in blurry images taken by the electronic device.

At present, an optical anti-shake mechanism that can drive the lens to move is usually provided in an electronic device to reduce the impact of the shake of the electronic device on the clarity of a photographed image. However, this method cannot eliminate the impact on the image quality of the photographs caused by the rotation of the camera module around its optical axis.

Summary of the invention

The present application provides a camera module, an electronic device, and an optical anti-shake method thereof, which can eliminate the impact on the image quality of a photograph caused by the rotation of the camera module around its optical axis.

In a first aspect, the present application provides a camera module, the camera module includes:

Lens assembly for receiving optical signals;

A chip assembly arranged opposite to the lens assembly, and the chip assembly is used to convert the optical signal into an image signal; and

A driving component connected to the chip component, and the driving component drives the chip component back to a position aligned with the optical axis of the lens component when the chip component and the lens component are relatively offset .

In the camera module provided by this embodiment, by providing a driving component connected to the chip component, the driving component can drive the chip component to return to the light aligned with the lens component when the chip component and the lens component are relatively shifted. The axis position is used to compensate for the impact of the camera module's shaking during the photographing process on the quality of the generated image, thereby realizing the optical anti-shake when the camera module is photographed, and improving the photographing quality of electronic equipment.

Wherein, the drive assembly has a first movable end that can move relative to the lens assembly, the first movable end is connected to the chip assembly, and the camera module further includes a controller that is electrically connected to the The driving component, when the chip component and the lens component are relatively offset, the controller controls the first movable end to drive the chip component to return to a position aligned with the optical axis of the lens component.

By setting the first movable end, the controller can drive the chip assembly to move by driving the first movable end to move. This driving structure can conveniently drive the chip assembly without affecting the performance of the chip assembly and has good stability.

Wherein, the driving assembly includes a first telescopic rod and a second telescopic rod intersecting, one end of the first telescopic rod is connected with one end of the second telescopic rod to form the first movable end, When the chip assembly and the lens assembly are relatively offset, the first telescopic rod and the second telescopic rod are extended and contracted under the control of the controller, so that the first movable end drives the chip assembly back To align the optical axis position of the lens assembly.

By setting two intersecting telescopic rods, the controller controls the expansion and contraction of the two intersecting telescopic rods, so that the first movable end can move along the X axis, move along the Y axis, and rotate around the Z axis. The two intersecting telescopic rods occupy The space is small, and the driving force generated is large, which can easily drive the chip assembly to move, but has a small impact on the chip assembly and the lens assembly, and also saves the space of the camera module.

Wherein, the drive assembly further includes a third telescopic rod and a fourth telescopic rod, the third telescopic rod is arranged opposite to the first telescopic rod, and the fourth telescopic rod is arranged opposite to the second telescopic rod, One end of the third telescopic rod is connected to one end of the fourth telescopic rod to form a second movable end, and the second movable end is connected to the chip assembly; when the chip assembly is relatively offset from the lens assembly When moving, the third telescopic rod and the fourth telescopic rod expand and contract under the control of the controller, so that the first movable end and the second movable end drive the chip assembly to return to alignment The position of the optical axis of the lens assembly.

By arranging four telescopic rods to form two movable ends, the two movable ends simultaneously drive the chip assembly, which can increase the driving force of the chip assembly, and the two movable ends are connected to different positions of the chip assembly to increase the rotation of the chip assembly. stability.

Wherein, the driving assembly further includes a fifth telescopic rod extending along the optical axis of the lens assembly, one end of the fifth telescopic rod is connected to the chip assembly, when the chip assembly and the lens assembly are relatively offset At this time, the fifth telescopic rod expands and contracts along the optical axis of the lens assembly under the action of the controller to drive the chip assembly back to the position before the offset.

By controlling the expansion and contraction of the fifth telescopic rod, the chip assembly is moved closer to or away from the lens assembly, and the chip assembly is moved along the Z-axis direction to compensate for the blur of the captured image caused by the movement of the camera module along the Z-axis direction during shooting. Problem, improve the shooting stability of the camera module.

Wherein, the camera module further includes a base plate and a bracket, the bottom end of the bracket is fixed on the base plate, the top end of the bracket fixes the lens assembly, and the drive assembly is connected to the lens assembly and the Between the chip components, the chip components are spaced from the support.

A bracket is provided to protect and encapsulate the lens assembly, drive assembly and chip assembly. In addition, the bracket allows the chip assembly to be suspended. The chip assembly is spaced from the bracket, and an active space is formed between the bracket and the chip assembly, so that the chip assembly can be driven Driven by the component, it can be translated, pivoted, rotated, tilted, etc., which in turn encourages the camera module to realize the optical image stabilization function.

On the other hand, an electronic device provided by the present application includes the camera module, the electronic device further includes a housing and a display screen covered on the housing, and the camera module is provided in the housing. Inside the housing, and the lens assembly of the camera module is aligned with the light transmission hole on the housing or the light transmission hole on the display screen.

By providing a driving component on the camera module, the driving component can drive the chip component to move relative to the lens component, so that when the housing is shifted relative to the lens component, the drive component drives the chip component back to the bias Move the forward position so that the chip assembly is always aligned with the optical axis of the lens assembly to compensate for the impact on image quality caused by the rotation of the electronic device around the optical axis of the lens assembly during the photographing process. Optical image stabilization when photographing electronic equipment improves the photographing quality of electronic equipment.

In another aspect, the present application provides an optical image stabilization method for an electronic device, the method is applied to an electronic device, the electronic device includes a camera module, the camera module includes a lens assembly, opposite to the lens assembly The set chip component, the drive component and the controller connected to the chip component; the method includes:

Acquiring, by the controller, an offset direction, an offset angle, and an offset distance of the chip assembly relative to the lens assembly;

The controller drives the drive assembly to deform according to the offset distance, the offset angle, and the offset direction, so as to drive the chip assembly back to a position aligned with the lens assembly.

In the method provided in this embodiment, the controller obtains the offset distance, offset angle, and offset direction of the chip assembly relative to the lens assembly, and calculates the chip assembly order according to the offset distance, offset angle, and offset direction. The direction, rotation angle, and moving distance that need to be offset to achieve optical image stabilization, so as to obtain the amount of expansion and contraction of each telescopic rod in the drive assembly, and the amount of expansion and contraction required by the telescopic rod is controlled by controlling the current through the telescopic rod. In turn, the drive assembly drives the chip assembly back to the position aligned with the optical axis of the lens assembly, compensates for the problem of blurred images caused by the camera module shaking during shooting, and improves the shooting stability of the camera module .

Wherein, the drive assembly includes a first telescopic rod and a third telescopic rod that are arranged oppositely, a second telescopic rod and a fourth telescopic rod that are arranged oppositely, one end of the first telescopic rod and one end of the third telescopic rod Connected to and connected to the chip component, one end of the second telescopic rod is connected to one end of the fourth telescopic rod and connected to the chip component;

When the chip assembly rotates the offset angle in the offset direction relative to the lens assembly, the controller drives the first telescopic rod and the third telescopic rod to have the same deformation, and the second telescopic rod The deformations of the rod and the fourth telescopic rod are the same, and the deformations of the first telescopic rod and the second telescopic rod are opposite, so as to drive the chip assembly to reversely rotate the offset angle along the offset direction.

One of the adjacent telescopic rods is controlled by the controller to extend and the other to shorten, so that the movable end receives a driving force, and the driving force causes the movable end to rotate around the Z axis to drive the chip assembly back to the lens assembly The position where the optical axis of the camera is aligned can compensate for the problem of blurred images caused by the rotation of the camera module around the Z axis during shooting, and improve the shooting stability of the camera module; by setting four telescopic rods, two Two movable ends can drive the chip assembly at the same time, which can increase the driving force for driving the chip assembly, and the two movable ends are connected to different positions of the chip assembly to increase the stability of the chip assembly rotation.

Wherein, when the chip assembly moves the offset distance in the offset direction relative to the lens assembly, the controller drives the first telescopic rod and the lens assembly according to the offset distance and the offset direction. The third telescopic rod undergoes opposite deformation, so as to drive the chip assembly to move the offset distance in a direction opposite to the offset direction;

Alternatively, the controller drives the second telescopic rod and the fourth telescopic rod to undergo opposite deformations according to the offset distance and the offset direction, so as to drive the chip assembly to move along with the offset Move the offset distance in the opposite direction.

The above-mentioned optical image stabilization method can make the chip assembly rotate around the X-axis, Y-axis and Z-axis directions, and can also move along the X-axis, Y-axis and Z-axis directions, so that the camera module can move in six directions, namely six directions. The optical image stabilization function with two degrees of freedom improves the shooting stability of the camera module.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative work, other drawings can be obtained from these drawings.

FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application before the chip assembly moves when the photographing state is rotated;

FIG. 2 is a schematic diagram of an electronic device after a chip assembly is moved when the photographing state is rotated according to an embodiment of the present application; FIG.

3 is a schematic cross-sectional view of a camera module provided by an embodiment of the present application;

4 is a top view of a driving component and a chip component in a camera module provided by an embodiment of the present application;

FIG. 5 is a top view of a clockwise rotation of a chip assembly driven by a driving component in a camera module according to an embodiment of the present application;

FIG. 6 is a top view of a driving component in a camera module that drives a chip component to rotate counterclockwise according to an embodiment of the present application;

FIG. 7 is a top view of a driving component in a camera module provided by an embodiment of the present application driving the chip component to move in the positive X direction.

FIG. 8 is a top view of a driving component in a camera module provided by an embodiment of the present application driving the chip component to move in the reverse direction of X;

FIG. 9 is a top view of a driving component in a camera module provided by an embodiment of the present application driving the chip component to move in the positive Y direction;

FIG. 10 is a top view of a driving component in a camera module provided by an embodiment of the present application driving the chip component to move in the reverse direction of Y;

11 is a schematic cross-sectional view of a camera module provided by another embodiment of the present application;

12 is a schematic cross-sectional view of a camera module provided by still another embodiment of the present application;

FIG. 13 is a flowchart of an optical image stabilization method for an electronic device according to an embodiment of the present application.

Detailed ways

The technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

Please refer to FIG. 1 and FIG. 2. FIG. 1 and FIG. 2 are schematic diagrams of the state of the electronic device provided by the embodiment of the present application in an application scenario. The electronic device 100 provided in this application is any device with a photographing function, such as smart devices such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, and a wearable device. The electronic device 100 uses a mobile phone as an example for explanation. For ease of description, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device 100 is also defined as the optical axis of the lens assembly as the Z direction, where the Z direction is vertical In the XY plane.

The electronic device 100 includes a housing 1 and a camera module 2. During the shooting process of the electronic device 100, the chip component 21 of the camera module 2 collects light signals and converts the light signals into image signals to generate images. The user's hand shakes during the shooting of the handheld electronic device 100 or the user is on a shaking vehicle, which causes the chip assembly and the lens assembly to shift relatively. For example, referring to FIG. 1, the electronic device 100 rotates counterclockwise around the Z axis by an angle of θ, and the chip assembly 21 rotates counterclockwise relative to the lens assembly around the Z axis by an angle of θ. When the camera module 2 generates an image, the chip assembly 21 rotates, which will cause the generated image to be blurred, which will cause the electronic device 100 to fail to shoot, which in turn affects the reliability of the electronic device 100's shooting function and the user’s experience. Shooting experience. Please refer to FIG. 2, the electronic device 100 provided in the present application, when the electronic device 100 rotates counterclockwise about the Z axis by an angle θ, the driving component drives the chip assembly 21 to rotate clockwise about the Z axis by an angle θ to compensate the electronic device 100 in the During the photographing process, rotating a certain angle around the Z direction affects the image quality, thereby realizing optical anti-shake when photographing the electronic device 100 and improving the photographing quality of the electronic device 100.

Please refer to FIG. 3, an embodiment of the present application provides a camera module 2. The camera module 2 includes a lens assembly 20, a chip assembly 21 and a driving assembly 22. The lens assembly 20 is used to pass light signals. The chip assembly 21 is disposed opposite to the lens assembly 20, and the chip assembly 21 is used to receive light signals and convert the light signals into image signals to obtain image information. The driving component 22 is connected to the chip component 21, and the driving component 22 can drive the chip component 21 back to the position of the optical axis aligned with the lens component 20 when the chip component 21 and the lens component 20 are relatively offset. In other words, the driving assembly 22 can drive the chip assembly 21 to return to the position before the offset when the chip assembly 21 and the lens assembly 20 are relatively offset. Specifically, the relative offset between the chip assembly 21 and the lens assembly 20 includes the translation of the chip assembly 21 relative to the lens assembly 20 along the X, Y, and Z axes, and the rotation of the chip assembly 21 relative to the lens assembly 20 around the Z axis, Rotate around the X axis and rotate around the Y axis.

Specifically, referring to FIG. 3, the lens assembly 20 may include a lens 201 and a lens holder 202 for assembling the lens 201, wherein the optical axis of the lens 201 is parallel to the Z axis direction. The chip assembly 21 is located directly below the lens assembly 20. The chip assembly 21 has an image sensor 210 for converting the optical signal collected by the lens assembly 20 into an electrical signal, and the electrical signal is processed to finally generate an image signal. In this embodiment, the specific position of the drive assembly 22 is not limited. Specifically, the drive assembly 22 can be connected between the lens assembly 20 and the chip assembly 21, so that the drive assembly 22 emits in the X-axis, Y-axis, and Z-axis directions. The deformation can drive the chip assembly 21 to move relative to the lens assembly 20; it can also be arranged on the side of the chip assembly 21 away from the lens assembly 20, so that the drive assembly 22 will not block the light signal projected to the chip assembly 21 through the lens assembly 20; It can be arranged side by side with the chip component 21 in the plane where the chip component 21 is located, so that the driving component 22 will not block the optical signal projected to the chip component 21 via the lens component 20 and the thickness of the camera module 2 can be reduced.

When the camera module 2 shakes during the shooting process, a displacement away from the optical axis (Z axis) of the lens assembly 20 occurs, so that all the light cannot be accurately incident on the photosensitive surface of the image sensor 210, resulting in low imaging quality. In the camera module 2 provided in this embodiment, by providing a drive assembly 22 connected to the chip assembly 21, the drive assembly 22 can drive the chip assembly 21 back to the alignment lens assembly 20 when the chip assembly 21 and the lens assembly 20 are relatively offset. The position of the optical axis is to compensate the impact of the jitter of the camera module 2 on the image quality generated during the photographing process, thereby realizing the optical image stabilization of the camera module 2 when photographing, and improving the photographing quality of the electronic device 100.

In a possible embodiment, referring to FIG. 3, the driving assembly 22 has a first movable end 22 a that can move relative to the lens assembly 20. The first movable end 22a is connected to the chip assembly 21. The camera module 2 further includes a controller 23. The controller 23 is electrically connected to the driving assembly 22. When the chip assembly 21 and the lens assembly 20 are relatively offset, the controller 23 controls the first movable end 22a to drive the chip assembly 21 to return to the position of the optical axis aligned with the lens assembly 20.

By setting the first movable end 22a, the controller 23 can drive the chip assembly 21 to move by driving the first movable end 22a to move. This driving structure can conveniently drive the chip assembly 21 without affecting the performance of the chip assembly 21 and is stable. it is good.

Specifically, please refer to FIG. 3, taking the driving assembly 22 provided between the lens assembly 20 and the chip assembly 21 as an example. The driving assembly 22 has fixed ends 22b and 22d. The fixed ends 22b and 22d can be fixedly connected to the lens assembly 20. Under the action of the controller 23, the movable end 22a can move along the X axis, along the Y axis, and rotate around the Z axis relative to the fixed end 22b and the fixed end 22d. Therefore, the chip assembly 21 can be driven by the first movable end 22a along the lower edge X-axis movement, Y-axis movement, and Z-axis rotation. Of course, in other embodiments, the drive assembly 22 is provided on the side of the chip assembly 21 away from the lens assembly 20, and the fixed ends 22b and 22d of the drive assembly 22 can be fixed relative to the lens assembly 20.

Specifically, the driving assembly 22 may be a telescopic piece made of telescopic material. The telescopic member expands and contracts under the action of the controller 23 to move the first movable end 22a away from or close to the fixed ends 22b, 22d; or, the driving assembly 22 may also include a rotating rod/disk and driving the rotating rod/disk to rotate in the XY plane One end of the rotating rod/disk forms a first movable end 22a, the other end of the rotating rod/disk is fixed relative to the lens assembly 20, and one end of the rotating rod/disk can move along the X axis relative to the other end of the rotating rod/disk , Move along the Y axis and rotate around the Z axis to drive the chip assembly 21 to move along the X axis, move along the Y axis and rotate around the Z axis; or, the driving assembly 22 can also be multiple magnets, for example, three magnets, where Two magnets are fixed to the lens assembly 20, the other magnet forms the first movable end 22a, and the other magnet moves along the X axis, the Y axis and rotates around the Z axis under the action of the two magnets. Of course, specific embodiments of the drive assembly 22 include but are not limited to the above structures. The drive assembly 22 provided in this embodiment is any structure that can drive the chip assembly 21 to move along the X axis, move along the Y axis, and rotate around the Z axis.

In a possible implementation, referring to FIG. 4, the driving assembly 22 includes a first telescopic rod 221 and a second telescopic rod 222 intersecting. The first end 221a of the first telescopic rod 221 and the first end 222a of the second telescopic rod 222 are connected to form a first movable end 22a. When the chip assembly 21 and the lens assembly 20 are relatively offset, the first telescopic rod 221 and the second telescopic rod 222 expand and contract under the control of the controller 23, so that the first movable end 22a drives the chip assembly 21 back to the alignment lens assembly 20 optical axis position.

By setting two intersecting

telescopic rods

221, 222, the controller 23 can make the first movable end 22a move along the X-axis, along the Y-axis and around the Z-axis by controlling the expansion and contraction of the two intersecting

telescopic poles

221, 222. Rotating, the two intersecting

telescopic rods

221, 222 occupy a small space and generate a large driving force, which can facilitate the movement of the chip assembly 21, but has little impact on the chip assembly 21 and the lens assembly 20, and also saves the camera Module 2 space.

Specifically, referring to FIG. 4, the first end 221a of the first telescopic rod 221 and the first end 222a of the second telescopic rod 222 are connected to form a first movable end 22a, and the second end 221b of the first telescopic rod 221 is fixed to In the lens assembly 20, the second end 222b of the second telescopic rod 222 is fixed to the lens assembly 20. It is understandable that only one end of the first telescopic rod 221 may be fixed to the lens assembly 20, and other parts of the first telescopic rod 221 are separated from the lens assembly 20, and the same is true for the second telescopic rod 222, which will not be repeated here.

4, the material of the first telescopic rod 221 and the second telescopic rod 222 is a telescopic material, specifically, the material of the first telescopic rod 221 and the second telescopic rod 222 may be electrostrictive or magnetostrictive Or thermostrictive and other materials. The electrostrictive material is a material that produces a strain proportional to the square of the field strength under the action of an external electric field. Magnetostrictive material refers to the material whose linearity and volume change due to the change of its magnetization state. Thermostrictive materials are materials that deform with temperature changes. In other words, the controller 23 can change the amount of expansion and contraction of the first telescopic rod 221 and the second telescopic rod 222 by controlling the current or magnetic field or temperature of the first telescopic rod 221 and the second telescopic rod 222, thereby making the first The movable end 22a moves along the X axis, moves along the Y axis, and rotates around the Z axis.

Specifically, please refer to FIGS. 4 to 6 altogether, taking the material of the first telescopic rod 221 and the second telescopic rod 222 as an electrostrictive material as an example, for example, the material of the first telescopic rod 221 and the second telescopic rod 222 It is Shape Memory Alloy (Shape Memory Alloys), SMA for short. Shape memory alloy is an alloy material that can completely eliminate its deformation at a lower temperature after heating and increasing, and restore its original shape before deformation. The first telescopic rod 221 extends in the X-axis direction, and the second telescopic rod 222 extends in the Y-axis direction. Define the direction of the X-axis arrow in Fig. 4 as the positive direction of the X-axis, define the reverse direction of the X-axis arrow in Fig. 4 as the X-axis reverse direction, define the direction of the Y-axis arrow in Fig. 4 as the positive direction of the Y-axis, and define Y in Fig. 4 The reverse direction of the axis arrow is Y reverse.

Referring to FIG. 5, the controller 23 controls the first telescopic rod 221 to extend along the X-axis direction (the first end 221a of the first telescopic rod 221 moves in the positive direction along the X-axis), and controls the second telescopic rod 222 along the Y-axis direction (The first end 222a of the second telescopic rod 222 moves in the reverse direction along the Y axis). Therefore, the first movable end 22a receives the positive force of the X axis and the reverse force of the Y axis. The moment of the Z axis in the clockwise direction, so that the first movable end 22a rotates in the clockwise direction around the Z axis. Correspondingly, referring to FIG. 6, the controller 23 controls the first telescopic rod 221 to shorten along the X axis (the first end 221a of the first telescopic rod 221 moves in the opposite direction along the X axis), and controls the second telescopic rod 222 to move along the X axis. The Y-axis direction stretches (the first end 222a of the second telescopic rod 222 moves in the positive Y direction), so the first movable end 22a receives the X-axis reverse force and the Y-axis positive force, these two actions The force is formed into a moment in the counterclockwise direction around the Z axis, so that the first movable end 22a rotates in the counterclockwise direction around the Z axis.

By setting the intersecting first telescopic rod 221 and second telescopic rod 222, and setting the first telescopic rod 221 and the second telescopic rod 222 to be made of telescopic material, the controller 23 controls the first telescopic rod 221 and the second telescopic rod 222 One of them is extended and the other is shortened, so that the first movable end 22a receives a driving force, and the driving force causes the first movable end 22a to rotate around the Z-axis to drive the chip assembly 21 to rotate around the Z-axis, thereby The problem of blurring of the captured image caused by the rotation of the camera module 2 around the Z axis during shooting can be compensated, and the shooting stability of the camera module 2 can be improved.

Referring to FIG. 7, by controlling the first telescopic rod 221 to extend along the X axis (the first end 221a of the first telescopic rod 221 moves in the positive direction of the X axis), the first movable end 22a drives the chip assembly 21 along the X axis. The axis moves in the positive direction.

Referring to FIG. 8, by controlling the first telescopic rod 221 to be shortened along the X axis (the first end 221a of the first telescopic rod 221 moves in the opposite direction along the X axis), so that the first movable end 22a drives the chip assembly 21 along the X axis Move in the opposite direction.

Referring to FIG. 9, by controlling the second telescopic rod 222 to extend along the Y axis (the first end 222a of the second telescopic rod 222 moves in the positive direction along the Y axis), the first movable end 22a drives the chip assembly 21 along the Y axis. The axis moves in the positive direction.

10, by controlling the second telescopic rod 222 to shorten along the Y axis (the first end 222a of the second telescopic rod 222 moves in the reverse direction along the Y axis), so that the first movable end 22a drives the chip assembly 21 along the Y axis Move in the opposite direction.

The drive assembly 22 provided in the present application can make the chip assembly 21 move in the X-axis direction, the Y-axis direction, and can also rotate around the Z-axis direction to compensate for the camera module 2’s rotation around the Z-axis and movement in the XY plane during shooting. The resulting problem of blurring of the captured image improves the shooting stability of the camera module 2.

In a possible embodiment, referring to FIG. 4, the driving assembly 22 further includes a third telescopic rod 223 and a fourth telescopic rod 224. The third telescopic rod 223 is arranged opposite to the first telescopic rod 221. The fourth telescopic rod 224 is arranged opposite to the second telescopic rod 222. The first end 223a of the third telescopic rod 223 is connected to the first end 224a of the fourth telescopic rod 224 and forms a second movable end 22c. The second movable end 22c is connected to the chip assembly 21. When the chip assembly 21 and the lens assembly 20 are relatively offset, the third telescopic rod 223 and the fourth telescopic rod 224 expand and contract under the control of the controller 23, so that the first movable end 22a and the second movable end 22c drive the chip assembly 21 Return to the optical axis position of the alignment lens assembly 20.

Specifically, referring to FIG. 4, the first telescopic rod 221 and the third telescopic rod 223 extend along the X-axis direction, and the second telescopic rod 222 and the fourth telescopic rod 224 extend along the Y-axis direction. The first end 221a and the first end 222a of the second telescopic rod 222 are connected to form a first movable end 22a. The first end 223a of the third telescopic rod 223 and the first end 224a of the fourth telescopic rod 224 are connected to form a second movable end 22c. The second end 221b of the first telescopic rod 221 and the second end 224b of the fourth telescopic rod 224 may be connected to form a fixed end 22b, the second end 222b of the second telescopic rod 222 and the second end 223b of the third telescopic rod 223 It can be connected to form a fixed end 22d, and the fixed end 22b and the fixed end 22d are fixed on the lens assembly 20.

By arranging four telescopic rods to form two movable ends, the two movable ends simultaneously drive the chip assembly 21 to increase the driving force of the chip assembly 21, and the two movable ends are connected to different positions of the chip assembly 21 to increase the chip Stability of component 21 rotation.

For example, referring to FIGS. 5 and 6, the controller 23 controls the first end 221a of the first telescopic rod 221 to move in the positive direction along the X axis (the first telescopic rod 221 extends along the X axis), and the controller 23 controls The first end 223a of the third telescopic rod 223 moves in the reverse direction along the X axis (the third telescopic rod 223 extends in the X-axis direction), and the first end 222a of the second telescopic rod 222 is controlled to move in the reverse direction along the Y axis (the second The telescopic rod 222 is shortened in the Y-axis direction), and the first end 224a of the fourth telescopic rod 224 is controlled to move in the positive direction along the Y-axis (the fourth telescopic rod 224 is shortened in the Y-axis direction), so that the first movable end 22a and the second The movable end 22c rotates clockwise around the optical axis of the lens assembly 20 to generate a relatively large driving force on the chip assembly 21 so that the chip assembly 21 can rotate stably.

Specifically, please refer to FIG. 4, the outer surface of the chip assembly 21 is roughly rectangular, the chip assembly 21 has a pair of oppositely arranged first sides 211 and a pair of oppositely arranged second sides 212, a first telescopic rod 221 and a third The telescopic rod 223 respectively extends along a pair of first sides 211, and the second telescopic rod 222 and the third telescopic rod 223 respectively extend along a pair of second sides 212. The first telescopic rod 221, the second telescopic rod 222, the third telescopic rod 223, and the fourth telescopic rod 224 are arranged around the periphery of the image sensor 210 on the chip assembly 21, so that the drive assembly 22 will not receive the chip assembly 21 Optical signals cause interference.

Further, referring to FIG. 4, the first telescopic rod 221, the second telescopic rod 222, the third telescopic rod 223, and the fourth telescopic rod 224 may be close to the edge of the chip assembly 21, so that the driving assembly 22 is disposed on the chip assembly 21 The edge area reduces the space occupied by the drive assembly 22. In addition, the connection between the first movable end 22a and the chip assembly 21 and the connection between the second movable end 22c and the chip assembly 21 are far apart, so that the chip assembly 21 is in the first place. The one movable end 22a and the second movable end 22c can rotate more stably under the driving.

In a possible implementation, please refer to FIG. 11, the driving assembly 22 further includes a fifth telescopic rod 225 extending along the optical axis of the lens assembly 20. One end of the fifth telescopic rod 225 is connected to the chip assembly 21. When the chip assembly 21 and the lens assembly 20 are relatively offset, the fifth telescopic rod 225 can expand and contract along the optical axis of the lens assembly 20 under the action of the controller 23 to drive the chip assembly 21 back to the position before the offset.

Specifically, referring to FIG. 11, the fifth telescopic rod 225 extends along the Z-axis direction. When the driving assembly 22 is arranged between the lens assembly 20 and the chip assembly 21, one end of the fifth telescopic rod 225 can be fixed to the lens assembly 20, and the other end of the fifth telescopic rod 225 can be connected to the chip assembly 21. The fifth telescopic rod 225 is made of a telescopic material. The controller 23 controls the expansion and contraction of the fifth telescopic rod 225 so that the chip assembly 21 is close to or away from the lens assembly 20, so that the chip assembly 21 moves along the Z axis to compensate for the camera mold. Group 2 moves along the Z-axis direction during shooting to cause the problem of blurred images taken, which improves the shooting stability of the camera module 2.

Further, the number of fifth telescopic rods 225 may be multiple, and multiple fifth telescopic rods 225 are connected between the chip assembly 21 and the lens assembly 20. Specifically, the number of the fifth telescopic rod 225 is four, which are the first rod, the second rod, the third rod, and the fourth rod, wherein the first rod, the second rod, the third rod, and the fourth rod are sequentially It is arranged on each side of the chip assembly 21, and the first rod and the third rod are arranged symmetrically, and the second rod and the fourth rod are arranged symmetrically. In the X-axis direction, by controlling the extension of the second rod and the shortening of the fourth rod, the chip assembly 21 is rotated counterclockwise around the Y axis; by controlling the shortening of the second rod and the extension of the fourth rod, the chip assembly 21 is rotated around the Y axis. The Y axis rotates clockwise; the chip assembly 21 is rotated counterclockwise around the X axis by controlling the first rod to extend and the third rod to shorten; the chip assembly 21 is rotated around the X axis by controlling the first rod to shorten and the third rod to extend The X axis rotates clockwise; by controlling the first rod, second rod, third rod, and fourth rod to extend the same length or shorten the same length, the chip assembly 21 is moved closer to or away from the lens assembly along the Z axis 20.

The drive assembly 22 provided by the embodiment of the present application can make the chip assembly 21 rotate around the X-axis, Y-axis, and Z-axis directions, and can also move along the X-axis, Y-axis, and Z-axis directions, so that the camera module 2 can The optical image stabilization function of six directions, namely six degrees of freedom, improves the shooting stability of the camera module 2.

In another possible implementation, referring to FIG. 12, the lens assembly 20 includes a lens 201 and a lens holder 202 for fixing the lens 201. The lens holder 202 is provided with a voice coil motor 203. The voice coil motor 203 is connected to the lens 201. To adjust the distance between the lens 201 and the chip assembly 21 or to make the lens 201 tilt relative to the chip assembly 21. Specifically, the voice coil motor 203 includes two sets of upper and lower coils arranged on the lens 201. One set of coils corresponds to one magnet, and the other set of coils corresponds to two magnets. The electromagnetic force in the axial direction produces a translation in the XY plane; after a set of coils corresponding to two magnets are energized, they receive an electromagnetic force parallel to the Z-axis direction, which causes the Z-axis direction displacement or horizontal tilt, which is finally realized The camera module 2 has the anti-shake function of translation, Z-axis displacement or horizontal tilt in the XY plane.

In this embodiment, the camera module 1 also includes devices such as a gyroscope sensor (not shown). The gyroscope sensor senses the direction and amplitude of the camera module 1 shaking through the gyroscope, and then the gyroscope sensor transmits these data to the controller. 23 performs screening and amplification, calculates the displacement of the chip assembly 21 that can offset the jitter, and then drives the first movable end 22a and the second movable end 22c of the driving assembly 22 to move, thereby driving the chip assembly 21 to move to achieve the anti-shake effect .

In a possible implementation manner, referring to FIG. 3, the camera module 2 further includes a substrate 24 and a bracket 25. The bottom end of the bracket 25 is fixed on the base plate 24. The top end of the bracket 25 fixes the lens assembly 20. One end of the driving assembly 22 is fixed to the lens assembly 20. The other end of the driving component 22 is connected to the chip component 21, and the chip component 21 is spaced from the bracket 25.

Specifically, please refer to FIGS. 3 and 4 together. The bracket 25 is cylindrical, the top end of the bracket 25 fixes the lens assembly 20, the drive assembly 22 is arranged in the bracket 25, and the fixed ends 22b, 22d of the drive assembly 22 are fixed to the lens assembly. 20, the first movable end 22a of the drive assembly 22 is connected to the chip assembly 21, and the bottom end of the bracket 25 is fixed on the substrate 24. The bracket 25 is provided to protect and package the lens assembly 20, the drive assembly 22 and the chip assembly 21. In addition , The support 25 makes the chip assembly 21 suspended, the chip assembly 21 is spaced from the support 25, and an active space is formed between the support 25 and the chip assembly 21, so that the chip assembly 21 can translate, pivot and rotate under the drive of the drive assembly 22 , Tilt, etc., which in turn encourages the camera module 2 to realize the optical image stabilization function.

In other embodiments, the drive assembly 22 can also be arranged on the side of the chip assembly 21 facing away from the lens assembly 20, wherein the fixed ends 22b and 22d of the drive assembly 22 are fixed on the substrate 24, and the chip assembly 21 is arranged on the drive assembly 22 , And the first movable end 22a of the driving component 22 is connected to the chip component 21. The lens assembly 20 is fixed on the bracket 25, and the chip assembly 21 is spaced from the lens assembly 20 so that the chip assembly 21 can move relative to the lens assembly 20 in the Z-axis direction.

Furthermore, referring to FIGS. 3 and 4 together, the driving component 22 includes a light-transmitting area 226 and a peripheral area 227 surrounding the light-transmitting area 226. Specifically, the light-transmitting area 226 may be a through hole. The light-transmitting area 226 faces the lens in the lens assembly 20 and the image sensor 210 of the chip assembly 21. The peripheral area 227 faces the lens holder 202 of the lens assembly 20 and the package shell 213 surrounding the image sensor 210 on the chip assembly 21. The telescopic rod of the driving assembly 22 is arranged in the peripheral area 227.

The drive assembly 22 is provided with a light transmission area 226 for transmitting light signals and the telescopic rod of the drive assembly 22 is arranged outside the light transmission area 226, so that the drive assembly 22 will not interfere with the chip assembly 21 to collect light and ensure the camera The shooting quality of module 2.

Further, referring to FIGS. 3 and 4 together, the chip assembly 21 further includes a first circuit board 214 spaced apart from the substrate 24. The image sensor 210 and the packaging case 213 are disposed on the first circuit board 214. The camera module 2 further includes a second circuit board 26 and a flexible circuit board 27. The second circuit board 26 is disposed on the substrate 24, and the flexible circuit board 27 is electrically connected to the first circuit board 214 and the second circuit board 26.

By spacing the first circuit board 214 of the chip assembly 21 from the substrate 24, an active space is formed between the circuit board of the chip and the substrate 24. This active space enables the chip assembly 21 to tilt and approach and move away from the lens assembly 20. The lens assembly 20 further promotes the camera module 2 to realize the optical anti-shake function.

1 and 2 together, this application also provides an electronic device 100, including any one of the above-mentioned camera module 2, the electronic device 100 further includes a housing 1 and a display covered on the housing 1. Screen (not shown), the camera module 2 is arranged in the housing 1, and the lens assembly 20 of the camera module 2 is aligned with the light-transmitting hole on the housing 1 or the light-transmitting hole on the display screen 3.

By providing the drive assembly 22 on the camera module 2, the drive assembly 22 can drive the chip assembly 21 to move relative to the lens assembly 20, so that when the housing 1 is offset relative to the lens assembly 20, the drive assembly 22 drives the chip assembly 21 back The position before shifting so that the chip assembly 21 is always aligned with the optical axis of the lens assembly 20 to compensate for the effect on the image quality caused by the rotation of the electronic device 100 around the optical axis of the lens assembly 20 during the photographing process. The optical image stabilization when shooting the electronic device 100 is realized, and the photographing quality of the electronic device 100 is improved.

Please refer to FIG. 13 in conjunction with FIG. 1 to FIG. 12, an optical image stabilization method for an electronic device 100 is provided in Embodiment 1 of the present application. The method is applied to the above-mentioned electronic device 100. The electronic device 100 includes a housing 1 and a device. The camera module 2 on the housing 1 includes a lens assembly 20, a chip assembly 21 disposed opposite to the lens assembly 20, a driving assembly 22 connected to the chip assembly 21 and a controller 23.

Please refer to FIG. 13, an optical image stabilization method provided by the present application includes but is not limited to the following steps.

In step S101, the controller 23 obtains the offset distance, the offset angle, and the offset direction of the chip assembly 21 relative to the lens assembly 20.

Step S102, the controller 23 drives the driving assembly 22 to deform according to the offset distance, the offset angle and the offset direction, so as to drive the chip assembly 21 back to the position aligned with the optical axis of the lens assembly 20.

Specifically, the electronic device 100 may be provided with a sensor, which detects the offset distance, offset angle, and offset direction of the chip assembly relative to the lens assembly 20, and sends the offset distance, offset angle, and offset direction. To controller 23.

In the method provided in this embodiment, the controller 23 obtains the offset distance, offset angle, and offset direction of the chip assembly 21 relative to the lens assembly 20, and calculates the chip assembly according to the offset distance, offset angle, and offset direction 21 In order to achieve optical image stabilization, the offset direction, rotation angle, and moving distance are required to obtain the amount of expansion and contraction of each telescopic rod in the drive assembly 22, and the current through the telescopic rod is controlled to meet the needs of the telescopic rod. The amount of expansion and contraction in turn causes the drive assembly 22 to drive the chip assembly 21 back to the position aligned with the optical axis of the lens assembly 20, to compensate for the problem of blurred images caused by the shaking of the camera module 2 during shooting, and to improve the camera module 2. The shooting stability.

It can be understood that the driving assembly 22 includes a first telescopic rod 221 and a third telescopic rod 223 arranged oppositely, a second telescopic rod 222 and a fourth telescopic rod 224 arranged oppositely, one end of the first telescopic rod 221 and the third telescopic rod One end of the 22321 is connected to and connected to the chip assembly 21, and one end of the second telescopic rod 222 is connected to one end of the fourth telescopic rod 224 and connected to the chip assembly 21.

Further, when the chip assembly 21 is rotated by an offset angle in the offset direction relative to the lens assembly 20, the controller 23 drives the first telescopic rod 221 and the third telescopic rod 223 to have the same deformation, and the second telescopic rod 222 and the fourth telescopic rod 222 The deformation of the rod 224 is the same and the deformation of the first telescopic rod 221 and the second telescopic rod 222 are opposite, so as to drive the chip assembly 21 to rotate in the reverse direction along the offset direction to offset the angle.

Specifically, please refer to FIG. 5. When the chip assembly 21 rotates in a clockwise direction relative to the lens assembly 20 (refer to FIG. 5) by an offset angle θ, the controller 23 controls the third telescopic rod 223 and the first telescopic rod 221 Both extend the same length L, control the fourth telescopic rod 224 and the second telescopic rod 222 to shorten the same length L, so that the first movable end 22a and the second movable end 22c drive the chip assembly 21 to rotate in the counterclockwise direction θ. Please refer to FIG. 6, when the chip assembly 21 is rotated counterclockwise relative to the lens assembly 20 (refer to FIG. 6) by an offset angle θ, the controller 23 controls the third telescopic rod 223 and the first telescopic rod 221 to shorten the same The fourth telescopic rod 224 and the second telescopic rod 222 are controlled to extend the same length L, so that the first movable end 22a and the second movable end 22c drive the chip assembly 21 to rotate θ in the clockwise direction.

One of the adjacent telescopic rods is controlled by the controller 23 to extend and the other to shorten, so that the movable end receives a driving force, and the driving force makes the movable end rotate around the Z axis to drive the chip assembly 21 back to and The position where the optical axis of the lens assembly 20 is aligned can compensate the problem of blurred images caused by the rotation of the camera module 2 around the Z axis during shooting, and improve the shooting stability of the camera module 2; by setting four retractable The rods form two movable ends. The two movable ends simultaneously drive the chip assembly 21 to increase the driving force of the chip assembly 21. The two movable ends are connected to different positions of the chip assembly 21 to increase the stability of the rotation of the chip assembly 21. Sex.

Further, when the chip assembly 21 moves an offset distance in the offset direction relative to the lens assembly 20, the controller 23 drives the first telescopic rod 221 and the third telescopic rod 223 to undergo opposite deformations according to the offset distance and the offset direction. Alternatively, the controller 23 drives the second telescopic rod 222 and the fourth telescopic rod 224 to undergo opposite deformations according to the offset distance and the offset direction, so as to drive the chip assembly 21 to move the offset distance in the direction opposite to the offset direction.

Specifically, please refer to FIG. 7. When the chip assembly 21 moves backwards along the X axis by a distance of L relative to the lens assembly 20, the offset controller 23 controls the first telescopic rod 221 to extend and the third telescopic rod 223 to shorten, which can drive The chip assembly 21 moves along the X-axis in the positive direction by a distance of L to return the chip assembly 21 to a position aligned with the optical axis of the lens assembly 20.

Specifically, please refer to FIG. 8. When the chip assembly 21 moves forward by a distance of L relative to the lens assembly 20 along the X axis, the offset controller 23 controls the first telescopic rod 221 to shorten and the third telescopic rod 223 to extend, which can drive The chip assembly 21 moves backward along the X-axis by a distance of L, so that the chip assembly 21 returns to a position aligned with the optical axis of the lens assembly 20.

Specifically, please refer to FIG. 9. When the chip assembly 21 moves backwards along the Y axis by a distance of L relative to the lens assembly 20, the offset controller 23 controls the second telescopic rod 222 to extend and the fourth telescopic rod 224 to shorten, which can drive The chip assembly 21 moves along the Y-axis in the positive direction by a distance of L to return the chip assembly 21 to a position aligned with the optical axis of the lens assembly 20.

Specifically, please refer to FIG. 10, when the chip assembly 21 moves forward by a distance of L relative to the lens assembly 20 along the Y axis, the offset controller 23 controls the second telescopic rod 222 to shorten and the fourth telescopic rod 224 to extend, which can drive The chip assembly 21 is moved backward along the Y axis by a distance of L to return the chip assembly 21 to a position aligned with the optical axis of the lens assembly 20.

The optical image stabilization method for the electronic device 100 provided in this embodiment can make the chip assembly 21 rotate around the X-axis, Y-axis, and Z-axis directions, and can also move along the X-axis, Y-axis, and Z-axis directions to realize a camera The module 2 can provide optical image stabilization in six directions, namely six degrees of freedom, to improve the shooting stability of the camera module 2.

The above are part of the implementation of this application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and modifications can be made, and these improvements and modifications are also regarded as the original The scope of protection applied for.

Claims

A camera module, characterized in that the camera module includes:

Lens assembly for receiving optical signals;

A chip assembly arranged opposite to the lens assembly, and the chip assembly is used to convert the optical signal into an image signal; and

The drive assembly is connected to the chip assembly, and the drive assembly can drive the chip assembly back to the position aligned with the optical axis of the lens assembly when the chip assembly and the lens assembly are relatively offset position.
The camera module of claim 1, wherein the drive assembly has a first movable end that can move relative to the lens assembly, the first movable end is connected to the chip assembly, and the camera module It also includes a controller, which is electrically connected to the drive assembly. When the chip assembly and the lens assembly are relatively offset, the controller controls the first movable end to drive the chip assembly to return to the Align the position of the optical axis of the lens assembly.
The camera module of claim 2, wherein the drive assembly comprises a first telescopic rod and a second telescopic rod, one end of the first telescopic rod is connected to one end of the second telescopic rod to The first movable end is formed, and when the chip assembly and the lens assembly are relatively offset, the first telescopic rod and the second telescopic rod are extended and contracted under the control of the controller, so that the The first movable end drives the chip assembly to return to a position aligned with the optical axis of the lens assembly.
The camera module according to claim 3, wherein the drive assembly further comprises a third telescopic rod and a fourth telescopic rod, the third telescopic rod is arranged opposite to the first telescopic rod, and the first telescopic rod Four telescopic rods are arranged opposite to the second telescopic rod, one end of the third telescopic rod is connected with one end of the fourth telescopic rod to form a second movable end, and the second movable end is connected to the chip assembly When the chip assembly and the lens assembly are relatively offset, the third telescopic rod and the fourth telescopic rod expand and contract under the control of the controller, so that the first movable end and the The second movable end drives the chip assembly to return to a position aligned with the optical axis of the lens assembly.
5. The camera module of claim 3, wherein the drive assembly further comprises a fifth telescopic rod extending along the optical axis of the lens assembly, and one end of the fifth telescopic rod is connected to the chip assembly, When the chip assembly and the lens assembly are relatively offset, the fifth telescopic rod expands and contracts along the optical axis of the lens assembly under the action of the controller to drive the chip assembly back to the position before the offset s position.
The camera module according to any one of claims 1 to 5, wherein the camera module further comprises a substrate and a bracket, the bottom of the bracket is fixed on the substrate, and the top of the bracket is fixed In the lens assembly, the driving assembly is connected between the lens assembly and the chip assembly, and the chip assembly is spaced from the bracket.
An electronic device, characterized by comprising the camera module of any one of claims 1 to 6, the electronic device further comprising a housing and a display screen covered on the housing, the camera module It is assembled in the housing, and the lens assembly of the camera module is aligned with the light-transmitting hole on the housing or the light-transmitting hole on the display screen.
An optical image stabilization method for electronic equipment, characterized in that the method is applied to an electronic equipment, the electronic equipment includes a camera module, the camera module includes a lens assembly, and a chip assembly disposed opposite to the lens assembly , Connecting the drive component and the controller of the chip component; the method includes:

Acquiring, by the controller, an offset direction, an offset angle, and an offset distance of the chip assembly relative to the lens assembly;

The controller drives the drive assembly to deform according to the offset distance, the offset angle, and the offset direction, so as to drive the chip assembly back to a position aligned with the lens assembly.
8. The optical image stabilization method according to claim 8, wherein the driving assembly comprises a first telescopic rod and a third telescopic rod arranged oppositely, and a second and fourth telescopic rod arranged oppositely. One end of a telescopic rod is connected to one end of the third telescopic rod and connected to the chip assembly, and one end of the second telescopic rod is connected to one end of the fourth telescopic rod and is connected to the chip assembly ；

When the chip assembly rotates the offset angle in the offset direction relative to the lens assembly, the controller drives the first telescopic rod and the third telescopic rod to have the same deformation, and the second telescopic rod The deformations of the rod and the fourth telescopic rod are the same, and the deformations of the first telescopic rod and the second telescopic rod are opposite, so as to drive the chip assembly to reversely rotate the offset angle along the offset direction.
9. The optical image stabilization method of claim 9, wherein when the chip assembly moves the offset distance in the offset direction relative to the lens assembly, the controller is based on the offset distance and The offset direction drives the first telescopic rod and the third telescopic rod to undergo opposite deformations, so that the chip assembly is driven to move the offset distance in a direction opposite to the offset direction;

Alternatively, the controller drives the second telescopic rod and the fourth telescopic rod to undergo opposite deformations according to the offset distance and the offset direction, so as to drive the chip assembly to move along with the offset Move the offset distance in the opposite direction.