CN113114919A - Circuit board assembly, camera module and electronic equipment - Google Patents
Circuit board assembly, camera module and electronic equipment Download PDFInfo
- Publication number
- CN113114919A CN113114919A CN202110548020.2A CN202110548020A CN113114919A CN 113114919 A CN113114919 A CN 113114919A CN 202110548020 A CN202110548020 A CN 202110548020A CN 113114919 A CN113114919 A CN 113114919A
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- Prior art keywords
- circuit board
- board
- fixed
- plate portion
- plate
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/58—Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
Abstract
The invention relates to the technical field of imaging, and discloses a circuit board assembly, a camera module and electronic equipment, wherein the camera module comprises: the flexible circuit board comprises a fixed circuit board, a movable circuit board and a flexible connecting piece; the middle part of the fixed circuit board is provided with a hollow structure, at least part of the movable circuit board is arranged in the hollow structure, and the movable circuit board comprises a first board part and a second board part which are distributed along the thickness direction of the fixed circuit board; the orthographic projection of the second plate part on the reference surface is positioned in the orthographic projection range of the first plate part on the reference surface to form a first stepped structure, wherein the reference surface is a plane where the surface of the first plate part departing from the second plate part is; the edge and the fixed circuit board of second board portion are connected to flexible connection spare, and the surface that first board deviates from the second board still is equipped with the electric connection structure who is used for being connected with the image sensor electricity to set up image sensor at first board. The second plate portion is reduced in lateral dimension relative to the space in which the first plate portion is retracted to accommodate the portion of the flexible connector.
Description
Technical Field
The invention relates to the technical field of imaging, in particular to a circuit board assembly, a camera module and electronic equipment.
Background
With the rapid development of mobile terminals such as smart phones, users have higher and higher requirements for imaging quality. In order to have the anti-shake effect, two parts of a movable circuit board and a fixed circuit board of the flexible connecting piece are needed, the movable circuit board carries the image sensor, and the movable circuit board can carry the fixed circuit board to move transversely (perpendicular to the optical axis direction). The space of flexible connectors is reserved between the movable circuit board and the fixed circuit board, so that the transverse size of the camera module is large, and the improvement of the integration level is not facilitated.
Disclosure of Invention
The invention discloses a circuit board assembly, a camera module and electronic equipment, which are used for reducing the transverse size of the camera module.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, a circuit board assembly is provided, which may be applied to a camera module in a mobile terminal such as a mobile phone or a tablet computer, and specifically may include:
the flexible circuit board comprises a fixed circuit board, a movable circuit board and a flexible connecting piece; the middle part of the fixed circuit board is provided with a hollow structure, at least part of the movable circuit board is arranged in the hollow structure, and the movable circuit board comprises a first board part and a second board part which are arranged along the thickness direction of the fixed circuit board and are electrically connected; the orthographic projection of the second plate part on a reference surface is positioned in the orthographic projection range of the first plate part on the reference surface, so that the edge of the first plate part and the edge of the second plate part form a first stepped structure, wherein the reference surface is a plane where the surface of the first plate part, which is far away from the second plate part, is located; the surface of the first plate part, which is far away from the second plate part, is also provided with an electric connection structure for electrically connecting with an image sensor; the flexible connector connects an edge of the second plate portion and the fixed circuit board to electrically connect the second plate portion and the fixed circuit board.
In the camera module, the edge of the first board part and the edge of the second board part are set to be of a first step-shaped structure, the orthographic projection of the second board part on the reference surface is located in the orthographic projection range of the first board part on the reference surface, the surface of the first board part, which is far away from the second board part, is further provided with an electric connection structure used for being electrically connected with an image sensor, so that the image sensor is arranged on the first board part, the area of the first board part is larger than that of the second board part, the bearing area of the surface of the first board part, which bears the image sensor, is not influenced, and due to the existence of the first step-shaped structure, part of flexible connecting pieces are accommodated in the space, which is retracted relative to the first board part, so that the gap between the first board part and the fixed circuit board can be reduced.
Optionally, the first plate portion and the second plate portion are of an integral structure, so that the movable circuit board has high stability; or, the first board with the second board is split type structure, the second board is fixed in the first board, can save the process of etching, reduces fashioned degree of difficulty.
Optionally, the first plate portion and the second plate portion are fixed and electrically connected through a conductive adhesive, so that physical fixation and line conduction of the two are realized.
Optionally, the conductive adhesive includes an anisotropic conductive film and/or solder paste, and when the first plate portion and the second plate portion are fixed together, part of the lines on the first plate portion and the second plate portion can be conducted.
Optionally, the flexible connecting part includes a flexible connecting part fixed and electrically connected to the second board part, the flexible connecting part is fixed and electrically connected to the outer peripheral wall of the second board part and the inner peripheral wall of the fixed circuit board, which encloses the hollow structure, so that the flexible connecting part is fixed and electrically connected to the fixed circuit board, and the flexible connecting part is connected to the inner peripheral wall of the hollow structure, which encloses the hollow structure, opposite to the second board part, so that the flexible connecting part can reduce the wear of the first board part without generating a large bend.
Optionally, the flexible connecting piece includes a flexible connecting portion fixed and electrically connected to the second plate portion, the flexible connecting portion is fixed to the outer peripheral wall of the second plate portion, and a fixing portion is further disposed at an end of the flexible connecting portion away from the second plate portion; the inner peripheral wall which forms the hollow structure is provided with a slot matched with the fixing part, the fixing part is inserted into the slot from the inner peripheral wall, so that the flexible connecting part is fixed with the fixed circuit board and keeps electric connection, the occupation of the inner space of the hollow structure is avoided, the transverse size is favorably reduced, the contact area between the slot and the fixing part is favorably increased, and the connection stability is ensured.
Optionally, the fixed circuit board has a second stepped structure along an edge of the hollow structure, and the second stepped structure forms the slot; along the optical axis direction, the opening of first ladder-shaped structure with the opening of second ladder-shaped structure has the same orientation to flexible connecting portion does not produce great bending, avoids the wearing and tearing with first board.
In a second aspect, a camera module is provided, which includes a lens, an image sensor, a driving component and the circuit board assembly of any one of claims 1 to 7, wherein the image sensor is disposed on a surface of the first board portion facing away from the second board portion and is electrically connected to the first board portion through the electrical connection structure, and the lens is disposed on a side of the image sensor facing away from the first board portion; the driving component is used for supporting the movable circuit board on one side of the lens close to the image sensor and driving the movable circuit board to move relative to the fixed circuit board along the direction perpendicular to the optical axis.
In the camera module, the movable circuit board is supported on the lens by the driving assembly, so that the movable circuit board has transverse movement flexibility, and can be driven to move along the direction vertical to the optical axis, and the anti-shake function is realized; the surface that first board deviates from the second board has bigger area, is favorable to bearing image sensor, and image sensor realizes being connected with first board electricity through with electric connection structure, and the light that gets into through the camera lens can be incided to image sensor formation of image. And the circuit board assembly has a smaller transverse dimension, so that the camera module can have a smaller transverse dimension.
Optionally, the drive assembly comprises: the supporting component and the transverse driving component are integrated together, the transverse driving component is connected to one side of the lens close to the image sensor and used for enabling the supporting component to move relative to the fixed circuit board along the direction perpendicular to the optical axis, and the supporting component is used for supporting the movable circuit board on the transverse driving component, so that the integration level is improved, and the assembly difficulty is reduced.
Optionally, the drive assembly comprises: a support member and a lateral drive member; wherein, the supporting component and the transverse driving component are respectively and independently arranged; the supporting component is used for supporting the movable circuit board on one side of the lens close to the image sensor; the transverse driving component is used for driving the movable circuit board to move relative to the fixed circuit board along a direction perpendicular to the optical axis; the supporting component and the transverse driving component are independently arranged, so that the manufacturing is facilitated, and the cost of parts is reduced.
Wherein, this horizontal drive part can include optics anti-shake motor, optics anti-shake motor has good anti-shake effect, support component includes the suspension spring, and the suspension spring can have certain supporting role to make the activity circuit board have certain degree of freedom in horizontal.
Alternatively, the connection form of the support member and the first plate portion may be specifically: the camera module further comprises a filter support and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor, and the filter support supports the infrared cut-off filter on the third surface; the support member is connected between the lens and the filter holder. The support member is indirectly connected to the first plate portion by the filter support, which is advantageous for reducing the area of the first plate portion that occupies the surface of the second plate portion.
Optionally, the camera module further includes a gold wire, and the image sensor is electrically connected to the electrical connection structure through the gold wire.
Optionally, first board deviates from the surface of second board still be equipped with the components and parts that first board electricity is connected, the surface area that first board deviates from the second board is great, sets up components and parts on this surface, is favorable to reducing components and parts and sets up the degree of difficulty.
Optionally, the camera module further comprises a strength-keeping board, the strength-keeping board is arranged on the surface of the lens away from the fixed circuit board, and the strength-keeping board covers the hollow structure to seal the hollow structure and prevent dust from entering the hollow structure.
In a third aspect, an electronic device is provided, where the electronic device includes a housing and a camera module provided by any one of the above technical solutions, and the camera module is disposed in the housing.
Compared with the prior art, the electronic equipment has the same advantages as the camera module, and the description is omitted here.
Drawings
Fig. 1 is an axial cross-sectional view of a first camera module provided in an embodiment of the present application;
fig. 2 is an axial cross-sectional view of a second camera module provided in the embodiment of the present application;
fig. 3 is an axial cross-sectional view of a third camera module according to the embodiment of the present disclosure;
fig. 4 is an axial cross-sectional view of a fourth camera module according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The camera module provided by the embodiment of the application can be applied to mobile terminals such as mobile phones and tablet computers. Referring to fig. 1, the camera module may specifically include:
the fixed circuit board 3, the movable circuit board, the lens 15 and the flexible connecting piece 11; the middle part of the fixed circuit board 3 is provided with a hollow structure 17, the movable circuit board is arranged in the hollow structure 17, the movable circuit board comprises a first board part 12 and a second board part 10 which are arranged in a stacking manner along the thickness direction of the fixed circuit board 3, the thickness direction refers to the arrangement direction from the surface of the fixed circuit board 3 for mounting components to the surface of the fixed circuit board away from the surface of the fixed circuit board for mounting components, the second board part 10 is electrically connected with the first board part 12 so as to realize conduction between the two, and the specific electric connection mode is described later; the orthographic projection of the second board section 10 on the reference surface is positioned in the orthographic projection range of the first board section 12 on the reference surface, so that the edge of the first board section 12 and the edge of the second board section 10 form a first stepped structure T1, wherein the reference surface is a plane of the surface of the first board section 12 away from the second board section 10, in the first stepped structure T1, the second board section 10 is integrally retracted inwards relative to the first board section 12 at the edge position, the retracted space forms an accommodating space, and the retracted position of the second board section 10 is that the edge of the second board section 10 is displaced inwards relative to the first board section 12 by a distance in the direction of the optical axis L; on one hand, the flexible connecting piece 11 connects the edge of the second board portion 10 and the fixed circuit board 3 to provide a physical flexible connection between the second board portion 10 and the fixed circuit board 3, so that the second board portion 10 can move relative to the fixed circuit board 3 in a direction perpendicular to the optical axis L, and on the other hand, the flexible connecting piece 11 is used for electrically connecting the second board portion 10 and the fixed circuit board 3 to realize conduction between the two; the surface of the first plate portion 12 facing away from the second plate portion 10 is provided with an image sensor 8, and a lens 15 is provided on the side of the image sensor 8 facing away from the first plate portion 12. An electrical connection structure is arranged on the surface of the first plate portion 12, which is far away from the second plate portion 10, and the electrical connection structure may be a plurality of pads, the pads are arranged in a one-to-one correspondence manner with the pins of the image sensor 9, the area of the surface of the first plate portion 12, which is far away from the second plate portion 10, is larger than the area of the surface of the second plate portion 10, which is far away from the first plate portion 12, so that the image sensor 8 and enough components 5 can be conveniently arranged, the components 5 may be resistors, capacitors, driving ICs and the like, and the components 5 are electrically connected with the first plate portion 12.
In the camera module described above, the edge of the first board section 12 and the edge of the second board section 10 are provided as the first stepped structure T1, the orthographic projection of the second board section 10 on the reference surface is within the orthographic projection range of the first board section 12 on the reference surface, and moreover, due to the presence of the first stepped structure T1, the accommodation space formed by the second board section 10 receding relative to the first board section 12 accommodates part of the flexible connecting member 11, so that the gap between the first board section 12 and the fixed circuit board 3 can be reduced, and the lateral dimension of the camera module can be reduced.
It should be understood that, the distance that the edges of the second board portion 10 are retracted inwards may be the same or different, but when the geometric center of the first board portion 12 and the geometric center of the hollow structure 17 are both coincident with the optical axis L, if the distance that the edges of the second board portion 10 are retracted inwards is ensured to be the same, the flexible connecting members 11 with equal length can be accommodated along the accommodating space surrounding the second board portion 10, and then the stress of the flexible connecting members 11 in the circumferential direction surrounding the second board portion 10 is the same, which is beneficial to the uniform stress of the second board portion 10 in all directions. In addition, along the direction that encircles optical axis L, the distance that second board portion 10 contracts in relative to first board portion 11 also can be different, for example, flexible connection piece 11 quantity is a plurality of, and encircles optical axis L interval distribution, only needs the distance that contracts in the marginal position that is provided with flexible connection piece 11 great, and the distance that contracts in the marginal position that does not set up flexible connection piece 11 is less. Thus, the larger area of the second plate portion 10 can be reserved, the area of the surface of the second plate portion 10 away from the first plate portion 12 is larger, sufficient area is reserved for arranging the components, the arrangement density of the components 5 is favorably reduced, the arrangement difficulty is reduced, or the arrangement quantity of the components 5 can be increased, the performance is improved, and meanwhile, the overall structural firmness of the movable circuit board is favorably improved.
In fig. 1, the bottom surface (the face that deviates from camera lens 15) of fixed circuit board 3 still is equipped with and protects board 4, should protect board 4 and cover hollow out construction 17 simultaneously, protect board 4 to have and protect and seal effect, can prevent that dust from passing through hollow out construction and getting into the module of making a video recording in, connector M is connected with fixed circuit board 3, concrete connector M can have the golden finger, in order to be connected fixed circuit board 3 and mainboard isoelectronic, make the module of making a video recording can realize signal conduction with electronic equipment's mainboard. The image sensor 8 is conducted with the electric connection structure on the first board part 12 through the gold wire 6, the imaging surface of the image sensor 8 is deviated from the first board part 12, and the lens 15 is arranged opposite to the imaging surface of the image sensor 8; an infrared cut-off filter 7 is arranged between the lens 15 and the image sensor 8 to filter out infrared light before the light incident from the lens 15 enters the image sensor 8, thereby improving the imaging quality. The infrared cut filter 7 is supported on the first plate portion 12 by a filter holder 16. The lens holder 13 is supported on the fixed circuit board 3, and the fixed circuit board 3 and the lens holder 13 are bonded by the adhesive 2 and cover the lens 15. The camera module further includes an Auto Focus (AF) motor 14, and the AF motor 14 is in transmission connection with the lens 15 to realize the longitudinal movement of the lens 15 for focusing. The autofocus motor 14 is connected to a drive assembly, which can therefore also be considered to be connected to the side of the lens 15 near the image sensor 8, except that the drive assembly is connected indirectly to the lens 15 via the autofocus motor 14, the driving assembly includes an Optical Image Stabilization (OIS) motor 1 and a suspension wire integrated with the Optical Stabilization motor 1, the Optical Stabilization motor 1 can drive the suspension wire to move relative to an autofocus motor 14 along a direction perpendicular to an Optical axis, the suspension wires are connected to the filter holder 16 to indirectly support the movable circuit board to the optical anti-shake motor 1, so that the movable circuit board has a degree of freedom of lateral movement, moreover, the suspension wires are not directly connected with the first plate portion 12, so that the area of the surface of the first plate portion 12 away from the second plate portion 10 is saved, and the component 5 can be mounted or a larger image sensor 8 can be placed conveniently. Also, in fig. 1, the suspension wires may support (here, indirectly support) the movable circuit board to the lens 15. The suspension wire is used as a supporting component, and the term "supporting component" means that a component a (such as a movable circuit board) can be supported (directly or indirectly supported) on a component B (such as the lens 15), the component a can move in a C plane relative to the component B but cannot move in a D direction (such as an optical axis L direction), and the D direction is perpendicular to the C plane; the optical anti-shake motor 1 is used as a transverse driving component, and the suspension wire is integrated with the optical anti-shake motor 1, but not limited to the above form, the suspension wire can also be replaced by other supporting components such as a spring plate, a silicon wafer and a thin film, as long as the transverse driving component is connected (directly or indirectly connected) to one side of the lens 15 close to the image sensor and is used for moving the supporting component relative to the fixed circuit board 3 along the direction perpendicular to the optical axis L, and the supporting component is used for supporting the movable circuit board on the transverse driving component, which is beneficial to improving the integration degree and reducing the assembly difficulty. However, this is merely exemplary, and it may be in a form that the lower support member and the lateral driving member are independently provided, respectively, and each independently functions; the supporting component (such as a suspension wire) is used for supporting (directly or indirectly supporting) the movable circuit board on one side of the lens close to the image sensor 8; a lateral driving part (e.g., an optical anti-shake motor 1) may be connected to a side of the lens 15 adjacent to the image sensor 8 and configured to drive the movable circuit board to move in a direction perpendicular to the optical axis with respect to the fixed circuit board 3; the supporting component and the transverse driving component are independently arranged, so that the manufacturing is facilitated, and the cost of parts is reduced. In summary, the driving assembly is for supporting the movable circuit board on a side of the lens 15 close to the image sensor 8 and for driving the movable circuit board to move in a direction perpendicular to the optical axis with respect to the fixed circuit board 3.
The optical anti-shake motor 1, as a driving component for example, can drive an Auto Focus (AF) motor 14 and a lens 15 to move relative to a fixed circuit board 3 in a direction perpendicular to an optical axis L, thereby achieving anti-shake of the lens 15. The driving assembly can also adopt the cooperation of a coil and a magnet to realize anti-shaking except adopting the optical anti-shaking motor 1, for example, the coil is arranged on the movable circuit board, the magnet is arranged on the fixed circuit board 3, and the attraction or repulsion movement of the movable circuit board relative to the fixed circuit board 3 is realized through the power-on and power-off of the coil. The ceramic motor or SMA (shape memory alloy) can also be used as a driving component, and the adjustment of the transverse moving distance of the movable circuit board can be realized by adjusting the size of the electrifying voltage of the SMA. The driving component only needs to drive the movable circuit board to move along the direction perpendicular to the optical axis L.
In fig. 1, the first board portion 12 and the second board portion 10 are of a split structure, and the "split structure" means that the first board portion 12 and the second board portion 10 are respectively an independent circuit board, and the first board portion 12 and the second board portion 10 are respectively and independently formed and then fixed by welding or an ACF (Anisotropic Conductive Film) process. The surface of the first plate portion 12 facing the second plate portion 10 is provided with a pad, and the surface of the second plate portion 10 facing the first plate portion 12 is also provided with a pad, and the pads of the first plate portion 12 and the pads of the second plate portion 10 are electrically connected in one-to-one correspondence, that is, the electrical connection between the circuit of the first plate portion 12 and the circuit of the second plate portion 10 is realized. Specifically, after the two plates are connected by welding or an ACF process, the first plate portion 12 and the second plate portion 10 are fixed and electrically connected by the conductive adhesive 9, for example, when the two plates are connected by the ACF process, the conductive adhesive 9 includes an anisotropic conductive film, and when the two plates are connected by the welding process, the conductive adhesive 9 includes solder paste, so that the etching process can be omitted, the two plates can be directly attached together to be formed, the forming difficulty is reduced, and the fixation of the two plates is realized. In addition, an ACF process and a soldering process may be used in combination, and thus the conductive adhesive 9 may be a solder paste or an anisotropic conductive adhesive film. The above soldering or ACF process connecting the second board portion 10 and the first board portion 12 is merely exemplary as long as the second board portion 10 and the first board portion 12 can be fixed and the pads of both achieve conduction.
However, the above structure is merely exemplary, as shown in fig. 2, the difference from the structure shown in fig. 1 is that the first plate portion 12 and the second plate portion 10 are an integral structure, and the integral structure is a structure formed by a part of a single independent functional circuit board whose edge is removed by etching or the like to form a first step-like structure T1, in this independent functional circuit board, there is no clear boundary between the first plate portion 12 and the second plate portion 10, for example, the first step-like structure T1 only etches a part of the thickness of an insulating layer, the thickness corresponding to the etched part of the insulating layer belongs to the second plate portion 10, the thickness corresponding to the unetched part belongs to the first plate portion 12, or the boundary of an adjacent, pressed-together insulating layer or metal layer is the boundary of the boundary between the first plate portion 12 and the second plate portion 10, the insulating layer belongs to the first plate portion 12, and the metal layer belongs to the second plate portion 10. Also, when the independently functioning circuit board is a multi-layer PCB, the circuit layer of the first board portion 12 and the circuit layer of the second board portion 10 communicate with each other through a metal via, not through a pad connection. The first board portion 12 and the second board portion 10 can be formed by directly etching the first stepped structure T1 from one plate material. This has the advantage that the active circuit board has a high structural stability. Of course, the first plate portion 12 and the second plate portion 10 may be integrally injection-molded directly by a mold, so that the etching step is omitted, and the movable circuit board has high stability.
The flexible connecting member 11 may be in various forms, in fig. 1, the flexible connecting member 11 includes a flexible connecting portion 11a connected to the outer peripheral wall of the second plate portion 10, and a fixing portion 11b connected to an end of the flexible connecting portion away from the second plate portion 10, the outer peripheral wall of the second plate portion 10 is a wall surface facing the inner peripheral wall F, the fixing portion 11b may be a hard circuit board as a connecting terminal, the flexible connecting portion 11a is fixed and electrically connected to the fixing portion 11b, and the flexible connecting portion 11a may be partially embedded in the hard second plate portion 10, so that, in a specific preparation, a plate may be taken, a flexible carrier may be embedded in an outer hard material, the hard material in the middle of the plate may be removed by etching or the like to expose the flexible connecting portion 11a, the outer hard material is divided into two spaced portions, and a portion is formed as the structure of the second plate portion, the other part forms a structure of a fixed part 11b, and a flexible carrier exposed in the middle is used as a flexible connecting part 11a, so that the stability of the combination of the flexible connecting part 11a with the fixed part 11b and the second plate part 10 is improved, the breakage is avoided, and the service life of the camera module is prolonged; of course, the hard material wrapping the flexible carrier is directly formed at two positions at intervals of the flexible carrier by injection molding and the like respectively to form the fixing part 11b and the second plate part 10 respectively; the fixing portion 11b is connected to the fixed circuit board 3, and the fixing portion 11b facilitates adhesion and fixation with the fixed circuit board 3. The Flexible connection portion 11a may be a Flexible Printed Circuit (FPC) or a Flexible ribbon-shaped connector, which reduces the resistance to be overcome when the Flexible connection portion 11a is bent and deformed, and may also add some perforations on the Flexible connection portion 11a to further improve the flexibility of the Flexible connection portion 11a and reduce the resistance to be overcome when the Flexible connection portion is deformed; in addition, the flexible connecting portion 11a may also be formed with a certain bending or bending structure to generate a certain redundancy, and due to the redundancy, the resistance required to be overcome when the flexible connecting portion 11a is deformed is further reduced when the movable circuit board moves relative to the fixed circuit board 3. The end of the flexible connecting portion 11a may be fixed to the side end surface (the surface for forming the first stepped structure T1) of the second board portion 10 by bonding (e.g., ACF process bonding) or the like. Also can make flexible connection portion 11a and the surperficial parallel and level that second board portion 10 deviates from first board portion 12 to when the face that second board portion 10 deviates from first board portion 12 arranges the components and parts, when wanting to walk line to fixed circuit board 3, conveniently walk the line and can extend to flexible connection portion 11a smoothly, be difficult to the fracture.
The form of the fixing portion 11b for facilitating the fixing with the fixed circuit board 3 may be various forms as long as the connection conduction can be stabilized. In fig. 1, a second stepped structure T2 is formed at the edge of the hollow structure 17 of the fixed circuit board 3, a part of the opening of the second stepped structure T2 is located on the inner peripheral wall F surrounding the hollow structure 17, and another part of the opening is located on the surface of the fixed circuit board 3 facing the reinforcing plate 4, that is, in the direction of the optical axis L, the first stepped structure T1 and the second stepped structure T2 face the same direction and both face the reinforcing plate 4, but when the first board portion 12 is located on the side of the second board portion 10 away from the lens 15, a part of the opening of the first stepped structure T1 faces the reinforcing plate 4, and a part of the opening of the second stepped structure T2 faces the reinforcing plate 4, so that it can be ensured that the flexible connecting portion 11a does not have a large difference in the direction of the optical axis L, and further, the flexible connecting portion 11a can extend smoothly to prevent the flexible connecting portion 11a from being worn away from the first board portion 12. The second stepped structure T2 may be formed by etching or the like at the edge of the hollow structure 17 of the fixed circuit board 3; the fixing portion 11b is disposed on the step of the second stepped structure T2 and is fixed and electrically connected to the step, specifically, a metal connection portion is disposed on an inner wall of the second stepped structure T2, and the fixing portion 11b is electrically connected to the metal connection portion as a connection terminal, and specifically, the fixing portion 11b and the inner wall of the second stepped structure T2 may be fixed and electrically connected through an anisotropic conductive film. The hollow part of the second stepped structure T2 is matched with the fixing part 11b in shape, which does not occupy extra space in the hollow structure 17, and can make full use of the contactable area of the second stepped structure T2, so as to realize stable connection between the fixing part 11b and the second stepped structure T2, and the two can be bonded by anisotropic conductive film or solder paste, so as to conduct a specific circuit while playing a bonding role, and can also be conducted by an ACF process or a welding process. In addition, the second stepped structure T2 is one of the forms of the slot matching with the fixing portion 11b, the slot may only have an opening located on the inner peripheral wall F surrounding the hollow structure 17, the opening faces the second board portion 10, and the inner wall of the slot has a metal connecting structure, which may be a metal sheet, to realize the electrical connection between the fixing portion 11b and the inner wall of the slot, and further realize the conduction with the fixing circuit board 3. And the shape of the insertion groove matches with that of the fixing portion 11 b.
In addition, referring to fig. 3, the flexible connecting member 11 is different from fig. 1 in that the flexible connecting member 11 includes a flexible connecting portion 11a, one end of the flexible connecting portion 11a is fixed and electrically connected to the outer peripheral wall of the second plate portion 10, and the other end is fixed and electrically connected to the inner peripheral wall F, the outer peripheral wall is a wall surface of the second plate portion 10 facing the inner peripheral wall F, wherein the fixing and electrically connecting to the inner peripheral wall F may be performed in at least two ways: firstly, the inner peripheral wall F is provided with a metal connecting structure, and the corresponding end part of the flexible connecting part 11a is provided with a connecting terminal which is fixed and electrically connected with the metal connecting structure through welding or an ACF process; secondly, the metal line in the flexible connecting portion 11a and the metal line in the fixed circuit board 3 are the same metal layer, the metal layer penetrates through the inner peripheral wall F, and the circuit board with the metal layer is used for etching and exposing the flexible connecting portion 11 a.
Referring to fig. 4, the first plate portion 12 and the second plate portion 10 are fitted in the manner corresponding to the embodiment of fig. 2, and the flexible connector 11 is fitted in the manner corresponding to the fixed circuit board 3 in the manner corresponding to the embodiment of fig. 3.
The structure is simple and stable, and the steps of sticking, welding and the like are reduced.
Based on the same inventive concept, the embodiment of the present application further provides a circuit board assembly, which includes the fixed circuit board 3, the movable circuit board and the flexible connector 11 in the foregoing embodiment, and the specific structure, the matching relationship and the beneficial effects thereof are described with reference to the foregoing embodiment of the camera module.
Based on the same inventive concept, an electronic device is provided, the electronic device may be a mobile terminal such as a mobile phone and a tablet computer, and the electronic device may include a housing and the camera module provided in the foregoing embodiment, where the camera module is used for imaging.
After the electronic equipment adopts the camera module, the lightness and thinness are easier to realize, and other beneficial effects can refer to the corresponding embodiment of the camera module.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (16)
1. A circuit board assembly, comprising:
the flexible circuit board comprises a fixed circuit board, a movable circuit board and a flexible connecting piece;
the middle part of the fixed circuit board is provided with a hollow structure, at least part of the movable circuit board is arranged in the hollow structure, and the movable circuit board comprises a first board part and a second board part which are arranged along the thickness direction of the fixed circuit board and are electrically connected;
the orthographic projection of the second plate part on a reference surface is positioned in the orthographic projection range of the first plate part on the reference surface, so that the edge of the first plate part and the edge of the second plate part form a first stepped structure, wherein the reference surface is a plane where the surface of the first plate part, which is far away from the second plate part, is located;
the surface of the first plate part, which is far away from the second plate part, is also provided with an electric connection structure for electrically connecting with an image sensor;
the flexible connector connects an edge of the second plate portion and the fixed circuit board to electrically connect the second plate portion and the fixed circuit board.
2. The circuit board assembly of claim 1, wherein the first plate portion and the second plate portion are a unitary structure; alternatively, the first and second electrodes may be,
the first plate portion and the second plate portion are of a split structure, and the second plate portion is fixed to the first plate portion.
3. The circuit board assembly of claim 2, wherein the first and second plate portions are secured and electrically connected by a conductive adhesive.
4. The circuit board assembly of claim 3, wherein the conductive adhesive comprises anisotropic conductive film and/or solder paste.
5. The circuit board assembly according to claim 1, wherein the flexible connecting member includes a flexible connecting portion, and the flexible connecting portion is fixed to the outer peripheral wall of the second plate portion and the inner peripheral wall of the fixed circuit board, which forms the hollow structure, so that the flexible connecting portion is fixed to and electrically connected to the fixed circuit board.
6. The circuit board assembly according to claim 1, wherein the flexible connecting member includes a flexible connecting portion, the flexible connecting portion is fixed to an outer peripheral wall of the second plate portion and an inner peripheral wall of the fixed circuit board surrounding the hollowed-out structure,
one end of the flexible connecting part far away from the second plate part is also provided with a fixing part,
the inner peripheral wall is provided with a slot matched with the fixing part, and the fixing part is inserted into the slot from the inner peripheral wall so that the flexible connecting part is fixed with the fixed circuit board and keeps electric connection.
7. The circuit board assembly of claim 6, wherein the fixed circuit board has a second stepped structure along an edge of the hollowed-out structure, the second stepped structure forming the slot;
the openings of the first stepped structure and the openings of the second stepped structure have the same orientation in the optical axis direction.
8. A camera module comprising a lens, an image sensor, a driving assembly, and the circuit board assembly of any one of claims 1 to 7,
the image sensor is arranged on the surface, away from the second plate part, of the first plate part and is electrically connected with the first plate part through the electric connection structure, and the lens is arranged on one side, away from the first plate part, of the image sensor;
the driving component is used for supporting the movable circuit board on one side of the lens close to the image sensor and driving the movable circuit board to move relative to the fixed circuit board along the direction perpendicular to the optical axis.
9. The camera module of claim 8, wherein the drive assembly comprises: the lens driving device comprises a supporting component and a transverse driving component, wherein the transverse driving component is connected to one side of the lens close to the image sensor and used for moving the supporting component relative to the fixed circuit board along the direction perpendicular to the optical axis, and the supporting component is used for supporting the movable circuit board on the transverse driving component.
10. The camera module of claim 8, wherein the drive assembly comprises: a support member and a lateral drive member; wherein the content of the first and second substances,
the supporting component is used for supporting the movable circuit board on one side of the lens close to the image sensor;
the transverse driving component is used for driving the movable circuit board to move relative to the fixed circuit board along the direction perpendicular to the optical axis.
11. The camera module of claim 9 or 10, wherein the transverse drive component comprises an optical anti-shake motor and the support component comprises a suspension wire.
12. The camera module according to claim 9 or 10, further comprising a filter holder and an ir-cut filter, wherein the ir-cut filter is located between the lens and the image sensor, and the filter holder supports the ir-cut filter on the third surface;
the support member is connected between the lens and the filter holder.
13. The camera module of claim 8, further comprising gold wires, wherein the image sensor is electrically connected to the electrical connection structure through the gold wires.
14. The camera module of claim 8, wherein a surface of the first plate portion facing away from the second plate portion is further provided with a component electrically connected to the first plate portion.
15. The camera module according to claim 8, further comprising a strength-maintaining plate, wherein the strength-maintaining plate is disposed on a surface of the fixed circuit board away from the lens, and covers the hollowed-out structure.
16. An electronic device comprising a housing and the camera module of any one of claims 8-15, wherein the camera module is disposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110548020.2A CN113114919A (en) | 2021-05-19 | 2021-05-19 | Circuit board assembly, camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110548020.2A CN113114919A (en) | 2021-05-19 | 2021-05-19 | Circuit board assembly, camera module and electronic equipment |
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| Publication Number | Publication Date |
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| CN113114919A true CN113114919A (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110548020.2A Pending CN113114919A (en) | 2021-05-19 | 2021-05-19 | Circuit board assembly, camera module and electronic equipment |
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