CN113259568A

CN113259568A - Circuit board assembly, camera module and electronic equipment

Info

Publication number: CN113259568A
Application number: CN202110554390.7A
Authority: CN
Inventors: 马忠科; 陈小凤
Original assignee: Jiangxi Jinghao Optical Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-08-13

Abstract

The invention relates to the technical field of imaging devices, and discloses a circuit board assembly, a camera module and electronic equipment, wherein the circuit board assembly comprises: the flexible connecting circuit comprises a first circuit board, a second circuit board and a plurality of flexible connecting belts; the first circuit board is provided with a first surface and a second surface which are opposite; the second circuit board is provided with a third surface and a fourth surface which are opposite to each other, and an outer peripheral surface connecting the third surface and the fourth surface, the orientation of the third surface is the same as that of the first surface, the orientation of the fourth surface is the same as that of the second surface, and the third surface and the fourth surface are both rectangular so as to be matched with the shape of the image sensor; the reference surface is a plane where the first surface is located; the flexible connecting band is a flexible circuit board and is provided with at least one bending structure, the redundancy is realized, the deformation resistance can be reduced, the first end of the flexible connecting band is connected with the first circuit board through an ACF process or an integrated type, and the second end of the flexible connecting band is connected with the second circuit board through an ACF process or an integrated type.

Description

Circuit board assembly, camera module and electronic equipment

Technical Field

The invention relates to the technical field of imaging devices, in particular to a circuit board assembly, a camera module and electronic equipment.

Background

The camera module generally comprises a lens and an image sensor, wherein the lens is positioned on one side of an imaging surface of the image sensor, and light rays entering from the lens reach the imaging surface of the image sensor to form an image on the imaging surface.

The image sensor is mounted on a movable circuit board which moves laterally (in a direction perpendicular to the optical axis) with respect to a fixed circuit board to enable the anti-shake effect of the chip. The movable circuit board is connected with the fixed circuit board through the flexible board, and in order to ensure the sufficient wiring width, the flexible board is designed to be large in width at present, certain resistance can be brought when the movable circuit board transversely moves, the response speed of the module is not improved, and the overall transverse size is reduced. How to reduce the resistance of the movable circuit board and achieve miniaturization of the module while maintaining the electrical connection has become an urgent problem to be solved.

Disclosure of Invention

The invention discloses a circuit board assembly, a camera module and electronic equipment, which are used for reducing the resistance of a second circuit board during transverse movement on the premise of not increasing the transverse size.

In order to achieve the purpose, the invention provides the following technical scheme:

in a first aspect, there is provided a circuit board assembly comprising: the flexible connecting circuit comprises a first circuit board, a second circuit board and a plurality of flexible connecting belts; the first circuit board has a first surface and a second surface which are opposite; the second circuit board is provided with a third surface and a fourth surface which are opposite to each other, and the peripheral surface connecting the third surface and the fourth surface is in the same direction as the first surface, the fourth surface is in the same direction as the second surface, the third surface and the fourth surface are both rectangular, firstly, when the circuit board assembly and the image sensor are assembled, the circuit board assembly is convenient to adapt to the shape of the image sensor, secondly, when the second circuit board is formed in a cutting mode, a motherboard is only required to be cut along two vertical directions of tracks, the cutting difficulty is reduced compared with the cutting along a curve or an irregular track, and thirdly, when the second circuit board is cut to form, the utilization rate of the motherboard is high, and few leftover materials are generated; the third surface is provided with an electric connection structure which is used for being fixed and electrically connected with the image sensor, so that the image sensor is fixed and electrically connected with the third surface through the electric connection structure; the orthographic projection of the second circuit board on the reference surface is located in the range of the orthographic projection outline of the first circuit board on the reference surface, so that the second circuit board is prevented from additionally occupying space in the direction parallel to the reference surface, and the size of the circuit board assembly in the direction perpendicular to the optical axis is reduced, wherein the reference surface is the plane where the first surface is located; the flexible connecting band is a flexible circuit board and is provided with at least one bending structure, the first end of the flexible connecting band is connected with the first circuit board through an anisotropic conductive adhesive film process or an integrated connection mode, the second end of the flexible connecting band is connected with the second circuit board through an anisotropic conductive adhesive film process or an integrated connection mode, so that the flexible connection and the electric connection of the first circuit board and the second circuit board are realized, wherein the flexible connecting band is in a band shape, when the second circuit board transversely moves relative to the first circuit board, only small material stress needs to be overcome when the flexible connecting band deforms, and the flexible connecting band has the bending structure, so that a certain redundancy is generated, the overall length of the flexible connecting band can be increased on the premise of not increasing the transverse size, the deformation of the flexible connecting band is reduced, and the resistance of the flexible connecting band during deformation can be further reduced; when the flexible connecting band is selected as the flexible circuit board, the flexible circuit board plays a role in flexibly connecting and electrically connecting the first circuit board and the second circuit board, and basically has no elasticity, when the size of the image sensor is changed, such as the size is increased, the size of the second circuit board can be directly increased, and the elastic reset force of the second circuit board cannot be basically influenced even if the size of the flexible circuit board is reduced, so that the whole size of the circuit board assembly can be basically kept unchanged, and even if the size of the optical anti-shake motor is integrated in a size-dependent manner, the size of the optical anti-shake motor can also be basically kept unchanged, so that the size change of the image sensor cannot easily cause the size change of other components, and the adaptation is more flexible.

The flexible connecting band can be connected with the first circuit board and the second circuit board in various ways, and in a specific practical embodiment, the first circuit board is provided with a first hollow-out part in the middle; the outer peripheral surface of the second circuit board is at least partially arranged opposite to the inner peripheral surface which surrounds the first hollow-out part along the direction parallel to the reference surface, and an annular gap is formed between orthographic projections of the first circuit board and the second circuit board on the reference surface; the second circuit board is at least partially hidden in the first hollow part, so that the space occupied by the circuit board assembly in the direction perpendicular to the reference surface can be reduced.

In a specific implementation scheme, the first hollowed-out part is rectangular to be matched with the shape of the second circuit board, so that the space utilization rate of the first hollowed-out part is improved, in addition, when the first hollowed-out part is processed, only two mutually perpendicular straight line directions are needed to be cut, the cutting difficulty is reduced, and the inner peripheral surface which is surrounded to form the first hollowed-out part is provided with first sub side surfaces which are in one-to-one correspondence with each side edge of the first surface; the first end of the flexible connecting belt is connected with one of the first sub-side faces, so that the stress borne by the flexible connecting belt is distributed along two directions which are parallel to the reference plane and are vertical to each other.

In a specific embodiment, the first end of each flexible connection band is formed with a first corner structure bending from the extending direction of the flexible connection band to the first circuit board, so as to flexibly set the connection position of the first end of the flexible connection band and the first sub-side.

In a specific possible embodiment, an orthographic projection of each of the flexible connecting bands on the reference plane is located within the annular gap; and the second end of each flexible connecting belt is connected with the peripheral surface so as to reduce the occupied space of the flexible connecting belt in the direction vertical to the reference surface.

Wherein, in a more specific embodiment, the outer peripheral surface has a second sub-side surface corresponding to each side of the first surface one by one; each of the two opposite second sub-side surfaces is connected with at least two flexible connecting bands so as to increase the outgoing amount of the two opposite second sub-side surfaces and further increase the joint strength of the second sub-side surfaces and the flexible connecting bands; moreover, the two second sub-side surfaces for increasing the wire outgoing amount are opposite, so that the stress balance degree of the second circuit board can be improved.

In the two opposite second sub-side surfaces, the flexible connecting bands respectively connected with the two second sub-side surfaces are symmetrical with respect to the symmetry axes of the two second sub-side surfaces in a one-to-one correspondence manner, so that the second circuit board can be further stressed in a balanced manner.

In a specific embodiment, the second end of each flexible connection band is formed with a second corner structure bending from the extending direction of the flexible connection band to the second circuit board, so as to flexibly set the connection position of the second end of the flexible connection band and the second sub-side.

Optionally, in a direction normal to the reference plane, the second surface is located on a side of the fourth surface away from the third surface; along in the normal direction of reference surface, flexible connection area is located the fourth surface is kept away from one side of third surface, every a plurality of flexible connection area the orthographic projection of structure of buckling on the reference surface with the orthographic projection of fourth surface on the reference surface at least partially overlaps, and through first end with enclose the inner peripheral surface of first fretwork portion is connected, and through second end with the fourth surface is connected to under the prerequisite that does not change circuit board assembly's overall dimension, increase the size of second circuit board, be convenient for set up the image sensor of bigger size.

Optionally, in a normal direction of the reference plane, the thickness of the flexible connecting tape is smaller than that of the first circuit board, and the flexible connecting tape is interposed between the second surface and the fourth surface, so that no additional space in a normal direction of the reference plane is occupied; and the first end is connected to the inner peripheral surface, and the minimum distance from the first end to the second surface is smaller than the minimum distance from the first end to the first surface, so that a wider dimension is reserved between the first end and the first surface on the inner peripheral surface to be opposite to the outer peripheral surface of the first hollow part, the thickness of the circuit board assembly is reduced, and flexible connection is ensured.

Optionally, the third surface is higher than the first surface; follow on the normal direction of reference surface, flexible connection area is located the first surface deviates from one side of second surface, every flexible connection area the second end with the outer peripheral face is connected, just a plurality of flexible connection area buckle the structure and be in orthographic projection on the reference surface with first surface at least part overlaps, and passes through first end with first surface is connected. On the premise of not changing the whole size of the circuit board assembly, the size of the second circuit board is increased, and the image sensor with larger size is convenient to set.

Optionally, in a normal direction of the reference plane, the thickness of the flexible connecting band is smaller than that of the second circuit board, and the flexible connecting band is interposed between the first surface and the third surface, so that no additional space in a normal direction of the reference plane is occupied; and the second end is connected to the peripheral surface, and the minimum distance from the second end to the third surface is smaller than the minimum distance from the second end to the fourth surface. So that reserve the relative setting of inner peripheral surface with first fretwork portion of wide size between this second end and the fourth surface on the outer peripheral surface, be favorable to reducing circuit board assembly's thickness to, ensure flexible connection.

Optionally, the plane of the first surface and the plane of the fourth surface are arranged oppositely; the first end of each flexible connecting belt is connected with the first surface, the second end of each flexible connecting belt is connected with the fourth surface, and the orthographic projections of the bending structures of the flexible connecting belts on the reference surface are at least partially overlapped with the orthographic projections of the fourth surfaces on the reference surface. Can avoid at first circuit board trompil, improve the structural stability of first circuit board to reduce the technology degree of difficulty, and, the second circuit board directly plays sealed effect, can remove from and set up the fender panel in second surface one side of first circuit board.

Optionally, a second hollow portion extending along the extending direction of the flexible connecting belt is arranged in the middle of each flexible connecting belt, so that the width of the flexible connecting belt in the direction parallel to the reference plane can be reduced, the flexibility of the flexible connecting belt is improved, and the resistance required to be overcome during deformation of the flexible connecting belt is reduced.

In a specific possible embodiment, each of the flexible connection belts extends in a direction parallel to the reference surface, so that more tracks are disposed on the surface of the flexible connection belt parallel to the reference surface, and the tracks are not twisted and are easy to break relative to the tracks disposed on the surface perpendicular to the reference surface.

In a specific possible embodiment, each of the flexible connection strips extends spirally around a central axis of the second circuit board, the central axis being perpendicular to the third surface and passing through a geometric center of the third surface; and the projection of each flexible connecting belt in the width direction is overlapped with the projection of the other flexible connecting belt in the width direction, wherein the width direction is parallel to the reference plane and perpendicular to the extending direction of the flexible connecting belt, so that the length of the flexible connecting belt is increased, the deformation amount of each cross section is reduced when the flexible connecting belt is deformed, and the resistance of the flexible connecting belt in deformation is reduced.

In a specific embodiment, the first end and the second end of each of the flexible connecting strips are respectively angled between 90 ° and 180 ° from a line connecting the central axes, wherein the line is parallel to the reference plane. The two adjacent flexible connecting belts can be overlapped in the width direction, the flexible connecting belts are not overlapped with the third flexible connecting belt in the width direction, and the size of the shooting flexible connecting belt occupied in the reference surface direction is prevented from being excessively increased.

In a second aspect, a camera module is provided, which includes a lens, an image sensor, a driving assembly and the circuit board assembly according to any one of the above technical solutions, wherein the image sensor is disposed on a third surface and electrically connected to the second circuit board through the electrical connection structure, and the lens is disposed on a side of the image sensor away from the second circuit board; the driving component is used for supporting the second circuit board on one side of the lens close to the image sensor and driving the second circuit board to move relative to the first circuit board along a direction parallel to a reference surface so as to realize an anti-shake function.

In the camera module, the driving assembly supports the second circuit board on the lens, so that the second circuit board has flexibility of transverse movement and can be driven to move along a direction parallel to the reference surface, and an anti-shake function is realized; the image sensor is electrically connected with the second circuit board through the electric connection structure, and light rays entering through the lens can be incident to the image sensor for imaging.

Optionally, the drive assembly comprises: the supporting component is used for supporting the second circuit board on the transverse driving component, so that the integration level is improved, and the assembly difficulty is reduced.

Optionally, the drive assembly comprises: a support member and a lateral drive member; the supporting component is used for supporting the second circuit board on one side of the lens close to the image sensor; the transverse driving component is used for driving the second circuit board to move relative to the first circuit board along the direction parallel to the reference surface, and the supporting component and the transverse driving component are independently arranged, so that the manufacture is facilitated respectively, and the cost of parts is reduced.

Optionally, the lateral driving component comprises a coil and a magnet, wherein the coil is arranged on the second circuit board, and the magnet is arranged on the first circuit board; or, the magnet is arranged on the second circuit board, and the coil is arranged on the first circuit board; the coil is used for attracting or repelling the magnet so as to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface.

Optionally, the transverse driving component includes an optical anti-shake motor with good anti-shake effect, and the supporting component includes a suspension wire, which may have a certain supporting effect and make the movable circuit board have a certain degree of freedom in the transverse direction.

Optionally, the camera module further includes a filter support and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor, and the filter support supports the infrared cut-off filter on the third surface; the support member is connected between the lens and the filter holder. The support member is indirectly connected to the second circuit board by the filter support, which is advantageous for reducing the area of the third surface.

Optionally, the camera module further includes a gold wire, and the image sensor is electrically connected to the electrical connection structure through the gold wire, so as to achieve conduction between the image sensor and the electrical connection structure.

Optionally, when the first circuit board is provided with the first hollowed-out portion, the camera module further comprises a strength-preserving plate, the strength-preserving plate is arranged on the surface, deviating from the lens, of the first circuit board, and the strength-preserving plate covers the hollowed-out structure to prevent dust from entering the camera module through the first hollowed-out portion.

In a third aspect, an electronic device is provided, which includes a housing and the camera module provided by the above technical solution, wherein the camera module is disposed in the housing.

Compared with the prior art, the electronic equipment has the same advantages as the camera module, and is not repeated herein.

Drawings

Fig. 1 is a cross-sectional view of a first camera module provided in an embodiment of the present application;

FIGS. 2a to 2c are schematic structural views of a first circuit board assembly in the embodiment of FIG. 1;

FIG. 3 is a schematic diagram of a second circuit board assembly of the embodiment shown in FIG. 1;

FIG. 4 is a schematic diagram of a third circuit board assembly of the embodiment shown in FIG. 1;

FIGS. 5a to 5c are schematic structural views illustrating a fourth circuit board assembly in the embodiment of FIG. 1;

FIG. 5d is an enlarged view of a portion of FIG. 5c at R1;

FIG. 5e is an enlarged view of a portion of FIG. 5c at R2;

FIGS. 6a to 6c are schematic structural views showing a fifth circuit board assembly in the embodiment shown in FIG. 1;

FIG. 6d is an enlarged view of a portion of FIG. 6b at R3;

FIG. 6e is an enlarged view of a portion of FIG. 6b at R4;

FIG. 7a is a schematic diagram of a sixth circuit board assembly of the embodiment of FIG. 1;

FIG. 7b is a schematic diagram of a seventh circuit board assembly of the embodiment shown in FIG. 1;

fig. 8a is a cross-sectional view of a second camera module provided in the embodiment of the present application;

FIG. 8b is a schematic diagram of the first circuit board assembly of the embodiment shown in FIG. 8 a;

FIG. 8c is a schematic diagram of a second circuit board assembly of the embodiment shown in FIG. 8 a;

fig. 8d shows a schematic view of a third circuit board assembly according to the embodiment shown in fig. 8 a.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The directional terms "upper", "lower", "left" and "right" in the embodiments of the present application refer to the corresponding directions in the respective drawings. It should be understood that fig. 1 is only intended to show the overall frame structure of the camera module, and the specific structure of the circuit board assembly is not completely consistent with the circuit board assembly structure in fig. 2a to 7b, and the specific structure of the circuit board assembly is subject to the circuit board assembly structure in fig. 2a to 7 b. In addition, in the following embodiments, the terms of orientation such as "vertical" and "parallel" are all allowed to have an engineering tolerance. In each drawing, except fig. 1 and 8a, the filling in each drawing does not show a cross section, and is only used for showing a solid structure to distinguish from a virtual structure such as a hollow.

The following first describes a camera module provided in an embodiment of the present application.

Referring to fig. 1, the camera module includes a circuit board assembly including a first circuit board 8, a second circuit board 10, and a connection assembly 4. The first circuit board 8 is used as a fixed circuit board, and the middle part of the first circuit board is provided with a first hollow part U1; the second circuit board 10 is used as a movable circuit board, and is located in the first hollow portion U1, the image sensor 2 is adhered to the surface of the second circuit board 10 by glue 1, the image sensor 2 is connected to the second circuit board 10 by gold wires 7, specifically, the circuit board assembly further includes an electrical connection structure disposed on the surface of the second circuit board 10 (specifically, a third surface B1 which is proposed later), the electrical connection structure may be a plurality of pads distributed dispersedly, the gold wires 7 are connected to the pads to realize electrical connection with the second circuit board 10, but the electrical connection structure is not limited to the pads in specific form, and may also be other structures having an electrical connection function, and the second circuit board 10 may also be provided with electronic devices 17 such as a capacitive inductor; and the bottom sides of the first circuit board 8 and the second circuit board 10 are provided with a strength-keeping board 9, and the strength-keeping board 9 has the functions of strength keeping and module sealing. A groove-shaped first support 12 is buckled on the first circuit board 8 in an inverted mode, the vertical part of the first support 12 extends along the edge of the first circuit board 8, a groove-shaped second support 11 is buckled on the second circuit board 10 in an inverted mode, the vertical part of the second support 11 extends along the edge of the second circuit board 10, an opening is formed in the position, opposite to the second circuit board 10, of the first support 12, an opening is formed in the position, opposite to the image sensor 2, of the second support 11, and an infrared cut-off filter 13 is arranged at the opening of the second support 11; the second support 11 extends inward to a position opposite to the first support 12, the second support 11 is connected with the first support 12 through a suspension wire 16, the suspension wire 16 is used as a supporting component to mainly play a supporting role, the second circuit board 10 is supported on one side of the lens 15 close to the image sensor 2, only the support is indirect support, and besides the suspension wire, other supporting structures with supporting roles such as a spring plate, a silicon wafer and a thin film can be adopted. The edge of the first circuit board 8 is provided with a magnet 5, the magnet 5 is located on the surface (first surface a1) of the first circuit board 8 close to the lens 15, and the edge of the third surface B1 of the second circuit board 10 is provided with a coil 6, and the coil 6 is located on the inner side of the second bracket 11. The magnet 5 and the coil 6 constitute at least a partial structure of a lateral driving member, and the supporting member and the lateral driving member exemplarily constitute at least a partial structure of a driving assembly, and have lateral driving and supporting functions, and the second circuit board 10 is driven to move in a direction parallel to a reference plane, which may be a plane where a face (hereinafter, the first surface a1) of the first circuit board 8 facing away from the strength retention plate 9 is located, relative to the second circuit board 10 by attraction or repulsion of lorentz force between the magnet 5 and the coil 6, wherein switching of attraction or repulsion of the magnet 5 and the coil 6 can be realized by changing a direction of an energizing current of the coil 6. The positions of the magnet 5 and the coil 6 can be interchanged, that is, the coil 6 is located on the first surface a1 of the first circuit board 8, and the magnet 5 is located on the third surface B1 of the second circuit board 10, or other magnetic first driving members can be used to drive the second driving members to move laterally by magnetic force.

An automatic focusing motor 14 is arranged above the first support 12, the automatic focusing motor 14 may be a voice coil motor, a lens 15 is arranged inside the automatic focusing motor 14, the lens 15 of the automatic focusing motor 14 along the optical axis direction is far away from or close to the image sensor 2 to adjust the image distance, the automatic focusing motor 14 may also be other driving devices with a longitudinal driving function, wherein the lens 15, the infrared cut-off filter 13 and the image sensor 2 are sequentially arranged along the optical axis direction, and light enters from the lens 15 and then sequentially passes through the infrared cut-off filter 13 and the image sensor 2. The infrared cut filter 13 can filter out infrared interference in the environment. The autofocus motor 14 is directly connected to the first bracket 12, and the suspension wire 16 supports the second bracket 11 to the first bracket 12, thereby achieving that the suspension wire 16 indirectly supports the second circuit board 10 to the side of the lens 15 facing the image sensor 2. The suspension wires 16 are not directly connected to the second support 11, which can save space on the surface of the second circuit board 10 (specifically, the third surface B1), and is advantageous for disposing more components on the third surface B1 or increasing the size of the image sensor 2.

In order to realize the conduction between the first circuit board 8 and the second circuit board 10, the first circuit board 8 and the second circuit board 10 are connected by the connecting component 4 to carry the traces between the two circuit boards.

Here, the driving assembly is not limited to the above form, and an optical anti-shake motor, which drives the second circuit board 10 to move in a direction parallel to the reference surface with respect to the first circuit board 8, is used as the lateral driving part, instead of the combination of the magnet 5 and the coil 6 in the foregoing embodiment. The optical anti-shake motor and the suspension wires 16 are respectively and independently arranged, so that the component structure is simplified and the cost is reduced compared with the integration.

However, the suspension wires may also be integrated with the optical anti-shake motor, the optical anti-shake motor is connected (may be indirect) to one side of the lens 15 facing the image sensor 2, the optical anti-shake motor drives the suspension wires to move parallel to the reference surface, the suspension wires are connected to the second bracket 11, the second circuit board 10 is supported by the optical anti-shake motor, the optical anti-shake motor is connected to the first bracket 12, and the optical anti-shake motor and the suspension wires are integrated into a whole, which is beneficial to improving the integration level and reducing the assembly difficulty.

The optical anti-shake motor can also be replaced by other transverse driving components such as a ceramic motor or SMA (shape memory alloy), and the suspension wires can also be replaced by other supporting components such as spring plates, silicon wafers and thin films.

In summary, the driving assembly is for supporting the second circuit board 10 on a side of the lens 15 close to the image sensor 2 and for driving the second circuit board 10 to move relative to the first circuit board 8 in a direction parallel to the reference plane.

In order to reduce the resistance of the connecting assembly 4 due to material stresses during the movement of the second circuit board 10 relative to the first circuit board 8, the following describes in each case possible embodiments of the connecting assembly 4.

With reference to fig. 2a to 2c, the first circuit board 8 has a first surface a1 and a second surface a2 opposite to each other, and an outer circumferential surface a4 connecting the first surface a1 and the second surface a 2; the first circuit board 8 is provided with a first hollow-out part U1 which penetrates through the first surface A1 and the second surface A2 along the direction perpendicular to the first surface A1, the first hollow-out part U1 is rectangular, when the first hollow-out part U1 is provided, the second surface A2 is provided with a reinforcing plate 9, the reinforcing plate 9 covers the first hollow-out part U1, and the first hollow-out part U1 can be sealed, so that the camera module is sealed, dust can be prevented from entering the camera module from the first hollow-out part U1, imaging quality is prevented from being influenced by the dust, the service life of the camera module is even reduced, and the reinforcing plate 9 can be connected with the first circuit board 8 in a manner of thermal compression bonding, bonding and the like; the second circuit board 10 has a third surface B1 and a fourth surface B2 disposed oppositely, and an outer peripheral surface B3 connecting the third surface B1 and the fourth surface B2; the first surface a1 and the second surface a2 are both rectangular; the third surface B1 and the fourth surface B2 are both rectangular; first, when the image sensor 2 is assembled with the third surface B1, it is convenient to fit the shape of the image sensor 2, saving space; secondly, when the second circuit board 10 is formed in a cutting and forming mode, the motherboard only needs to be cut along the tracks in two vertical directions, and cutting along a curve or an irregular track is beneficial to reducing cutting difficulty, and thirdly, when the second circuit board 10 is formed in a cutting mode, the utilization rate of the motherboard is high, and the generated leftover materials are less; the first hollow-out part U1 is rectangular to match the shape of the second circuit board 10, so that the space utilization rate of the first hollow-out part U1 is improved, and when the first hollow-out part U1 is processed, the first circuit board 8 only needs to be cut along two mutually perpendicular straight line directions, so that the cutting difficulty is reduced; four sides of the first surface a1 and four sides of the second surface a2 are parallel to each other, wherein one of the mutually perpendicular adjacent sides of the first surface a1 is parallel to the X axis, the other side is perpendicular to the Y axis, four sides of the third surface B1 and four sides of the fourth surface B2 are parallel to each other in a one-to-one correspondence manner and are matched to form a second sub-side surface in the outer peripheral surface B3, the profile surface of the first hollow portion U1 is marked as an inner peripheral surface A3, and the inner peripheral surface A3 comprises first sub-side surfaces parallel to the four sides of the first surface a1 in a one-to-one correspondence manner; the third surface B1 faces the same as the first surface a1, and the fourth surface B2 faces the same as the second surface a 2; the first circuit board 8 is partially or completely placed in the first hollow portion U1 to reduce the space occupied in the optical axis direction, and the four second sub-side surfaces in the outer peripheral surface B3 are parallel to the four first sub-side surfaces of the first hollow portion U1 in a one-to-one correspondence manner to form a certain gap. Some positional relationships will be described below with the plane of the first surface a1 as a reference plane (the plane of the XY axis and perpendicular to the optical axis).

The orthographic projection of the second circuit board 10 on the reference surface is positioned in the range of the orthographic projection outline of the first circuit board 8 on the reference surface, so that the second circuit board 10 is prevented from being partially or completely positioned outside the first circuit board 8 in the direction of the reference surface, and miniaturization of the circuit board assembly in the direction in the XY plane (the direction perpendicular to the optical axis) is facilitated.

Since a certain gap is formed between the outer peripheral surface B3 and the inner peripheral surface A3, an annular gap (denoted as Q) exists between orthographic projections of the first circuit board 8 and the second circuit board 10 on the reference surface.

The connecting assembly 4 comprises flexible connecting strips 4e, 4f, 4g and 4h, one end of each flexible connecting strip is called a first end, the other end is called a second end, each flexible connecting strip extends spirally around a central axis L of the second circuit board, the central axis L is perpendicular to the third surface B1, and when the third surface B1 is a centrosymmetric pattern, the central axis L passes through the geometric center of the third surface B1, but it should be understood that the third surface B1 allows certain engineering tolerance compared with the centrosymmetric pattern, and the first end of each flexible connecting strip is connected with the inner circumferential surface A3; specifically, the first end of the flexible connection band and the inner circumferential surface A3 may be integrally connected, and the flexible connection band and the first circuit board 8 are directly formed in an integrally forming manner, so that no additional connection structure is required between the first end of the flexible connection band and the inner circumferential surface A3, the occupied space in the XYZ direction is reduced, the process flow is reduced, wherein "integrally formed" means that at least a part of one structure and at least a part of the other structure of the two structures (the flexible connection tape and the first circuit board 8) connected to each other are simultaneously formed by a process of simultaneous injection molding, extrusion, or the like, later-stage splicing processes such as welding, bonding and the like are not needed, for example, the insulating layer of the flexible connecting belt and the insulating layer of the first circuit board 8 are simultaneously formed during injection molding, and the metal conducting layer of the flexible connecting belt and the metal conducting layer of the first circuit board 8 are formed by etching the same un-spliced metal; or, the first end of the flexible connection band and the inner circumferential surface a3 may also be connected by an ACF (Anisotropic Conductive Film) process, where, compared with the conventional welding process, the welding temperature required by the ACF process is lower, which is beneficial to avoiding the situation that the first circuit board 8 is scalded due to a higher welding temperature, or the flexible connection band of the FPC is bent and deformed due to heating, and both the situations will affect the positioning accuracy when the first circuit board 8 is connected with other devices; in addition, in the ACF process, the anisotropic conductive adhesive film can not only realize adhesion between the flexible connection tape made of the FPC and the first circuit board 8, but also realize longitudinal electrical conduction, which is beneficial to accurate positioning of the flexible connection tape made of the FPC and the first circuit board 8. Similarly, the second end and the outer peripheral surface B3 are connected by anisotropic conductive film process or integrated, and the function and effect thereof refer to the connection of the flexible connection tape and the first circuit board 8, and the connection manner, function and function of each flexible connection tape and the first circuit board 8 and the second circuit board 10 in the following embodiments refer to the connection manner of the flexible connection tape and the first circuit board 8; the flexible connection tape 4e has a function of flexibly connecting the first circuit board 8 and the second circuit board 10, the second circuit board 10 has a degree of freedom of movement in a direction parallel to the reference plane, and the first circuit board 8 and the second circuit board 10 can be electrically connected to achieve conduction by routing on the flexible connection tape 4 e; the

flexible connection bands

4e, 4f, 4g, and 4h are located between the outer peripheral surface B3 and the four first sub-side surfaces of the first hollowed-out portion U1, so that the projections of the

flexible connection bands

4e, 4f, 4g, and 4h on the reference surface are located within the annular gap Q to reduce the space occupied by the

flexible connection bands

4e, 4f, 4g, and 4h in the optical axis direction. The

Flexible connection bands

4e, 4f, 4g and 4h are Flexible Printed Circuit boards (FPCs) that are used to flexibly connect and electrically connect the first Circuit board 8 and the second Circuit board 10, and have substantially no elasticity relative to the spring, and when the size of the image sensor 2 changes, such as the size of the image sensor 2 increases, the size of the Flexible Circuit board can be directly increased by increasing the size of the second Circuit board 10, and even if the size of the Flexible Circuit board is reduced, the reset force of the second Circuit board 10 will not be increased, otherwise, the size of the image sensor 2 becomes smaller, the size of the Flexible Circuit board increases, and the reset force of the second Circuit board 10 will not be reduced, so that the overall size of the Circuit board assembly can be substantially maintained, and even if the Flexible connection bands are integrated in relation to the size of the optical anti-shake motor, the size of the optical anti-shake motor can be substantially maintained, and therefore, the size change of the image sensor 2 does not easily cause the size change of other components, and the adaptation is more flexible.

Referring to fig. 2a, taking the flexible connection tape 4e as an example, a first end of the flexible connection tape 4e is formed with a first corner structure V1 bent from the extending direction of the flexible connection tape 4e to the first circuit board 8, a second end is formed with a second corner structure V2 bent from the extending direction of the flexible connection tape 4e to the second circuit board 10, during the process of extending from the first corner structure V1 to the second corner structure V2, the middle portions of the first corner structure V1 and the second corner structure V2 extend rightward first and then extend downward to connect with the second corner structure V2, the first corner structure V1 bends to the upper first sub-side of the inner peripheral surface A3 of the first circuit board 8 and connects with the middle position thereof, the second corner structure V2 bends leftward to the middle portion (not necessarily the middle portion) of the second sub-side of the right side of the outer peripheral surface B3 of the second circuit board 10, first corner structure V1 facilitates flexible connection strip 4e in its flexible connection position to the corresponding first sub-side instead of extending straight, and similarly second corner structure V2 facilitates flexible connection strip 4e in its flexible connection position to the corresponding second sub-side. Furthermore, in fig. 2a to 2c, each flexible connection band is parallel (allowing for engineering errors) to the reference plane, and compared to the case of being perpendicular to the reference plane, it is possible to directly connect the first circuit board 8 and the second circuit board 10 on the reference plane without twisting the traces, whereas if the flexible connection band is perpendicular to the reference plane, the traces need to be twisted and are prone to breaking.

The flexible connection tape 4e is sequentially rotated by 90 °, 180 ° and 270 ° around the central axis L of the second circuit board 10 to obtain

flexible connection tapes

4f, 4g and 4h, respectively, so that the projections of every two adjacent flexible connection tapes in the width direction (perpendicular to the extending direction of the flexible connection tapes and parallel to the reference plane) are not overlapped, and the adjacent flexible connection tapes can be prevented from interfering with each other.

In fig. 2a, the flexible connection belt 4e is a belt-shaped structure with a small width, so that only a small material stress needs to be overcome when bending, and the total number of wires can be satisfied by separately arranging a plurality of flexible connection belts; the flexible connection belt 4e is substantially L-shaped, the flexible connection belt 4e has a substantially 90 ° folding angle, the folding angle forms a folding structure W1, no matter the second circuit board 10 is driven to move along the up-down direction or the left-right direction, a certain redundancy can be provided between the first end and the second end of the flexible connection belt 4e, the overall length of the flexible connection belt can be increased without increasing the transverse dimension, the deformation amount per unit dimension is reduced, and large resistance does not need to be overcome when the first circuit board 8 moves in the XY plane direction relative to the second circuit board 10.

It will be appreciated that it is not necessary that flexible connecting strip 4e be generally L-shaped, and that flexible connecting strip 4e may also have a resistance-reducing effect when flexible connecting strip 4e includes a plurality of bend structures W1, or each bend structure is angled at an angle other than 90 °, but extending flexible connecting strip 4e in the form of fig. 2a substantially in the X-direction or the Y-direction ensures that the stresses in flexible connecting strip 4e are distributed substantially in the directions in the XY-plane. When the flexible connecting band 4e includes a plurality of bending structures W1, it is also possible to improve the resistance to be overcome by the deformation of the flexible connecting band 4e, and the flexible connecting band 4e includes at least one bending structure W1.

The first end of the flexible connecting belt 4e is connected with a first sub-side of the inner circumferential surface A3 of the first hollow-out portion U1, instead of being provided with a chamfer at the corner of the inner circumferential surface A3 and being connected with the chamfer, so that the stress borne by the flexible connecting belt 4e is distributed along two directions which are parallel to the reference plane and perpendicular to each other.

The connection assembly 4 comprises 4 flexible connection strips only for exemplary purposes and may be a plurality of flexible connection strips of 3, 5 or even more.

In the embodiment corresponding to fig. 2a to 2c, the flexible connection tape is disposed between the inner peripheral surface a3 and the outer peripheral surface B3, and the second circuit board 10 can be hidden in the first hollow-out portion U1 of the first circuit board 8, which is beneficial to reducing the thickness of the circuit board assembly.

Referring to fig. 3, the difference from fig. 2a to 2c is that the

flexible connection tapes

4e and 4g are replaced with flexible connection tapes 4e 'and 4 g', respectively, the flexible connection tape 4e 'and the flexible connection tape 4f are symmetrical with respect to the axis of symmetry of the second circuit board 10 parallel to the X-direction, the flexible connection tape 4 g' and the flexible connection tape 4h are symmetrical with respect to the axis of symmetry of the second circuit board 10 parallel to the X-direction, and this distribution pattern of the connection assembly 4 facilitates the symmetry of stress distribution in the respective flexible connection tapes, facilitating balancing. In this structure, each second sub-side of the outer peripheral surface B3 is connected to two flexible connection bands, such as the upper side is connected to the flexible connection bands 4e 'and 4h, and the lower side is connected to the

flexible connection bands

4f and 4 g' to increase the outgoing amount of the two oppositely disposed second sub-sides, and it can be known that the flexible connection bands 4e 'and 4h are respectively symmetrically disposed with the

flexible connection bands

4f and 4 g' in one-to-one correspondence with respect to the symmetry axes of the upper side and the lower side, which is beneficial to improving the stress balance degree of the second circuit board 10, wherein the number of the flexible connection bands connected to the upper side and the lower side is not limited to 2, and may be more than 2, such as 3, 4, and the like. This is only an example, as long as in the opposite second sub-sides, each second sub-side is connected with two or more flexible connection tapes, which is beneficial to increase the wire outgoing amount of the above second sub-sides, thereby increasing the joint strength of the second sub-sides and the flexible connection tapes, and the two second sub-sides with large wire outgoing amount are oppositely arranged to facilitate the force balance of the second circuit board.

Referring to fig. 4, the difference is that the second end of the flexible connection band 4a is connected to the upper end of the right second sub-side of the outer peripheral surface B3 of the second circuit board 10 through the second corner structure V2 bent to the right first sub-side of the outer peripheral surface B3, and extends downward and extends to the left until the first end of the flexible connection band 4a is connected to the position near the lower end of the left first sub-side of the inner peripheral surface A3 of the first hollow-out portion U1. The structure of the connecting assembly 4 is such that every two adjacent flexible connecting strips overlap in the width direction, which is a direction parallel to the reference plane and perpendicular to the extending direction of the flexible connecting strips, but is advantageous in increasing the length of each flexible connecting strip, reducing the amount of deformation of the individual cross-sectional area, and reducing the resistance to deformation. The

flexible connection strips

4b, 4c and 4d have a similar structure to the flexible connection strip 4a and are connected in a similar manner, and the flexible connection strip 4a is rotated by 90 °, 180 ° and 270 ° in sequence around the axis of the geometric center of the second circuit board 10 to obtain the

flexible connection strips

4b, 4c and 4d, respectively. The included angle between the first end and the second end of each flexible connecting band and the connecting line of the central axis L (the connecting lines are parallel to the reference plane) is between 90 ° and 180 °, specifically 90 °, 95 °, 100 °, 120 °, 150 °, 175 ° or 180 °, wherein the included angle corresponding to the flexible connecting band 4a is about 175 °, so as to ensure that two adjacent flexible connecting bands may overlap in the width direction, and the adjacent flexible connecting bands may overlap with the third flexible connecting band in the width direction, thereby avoiding excessively increasing the size occupied by the camera flexible connecting band in the reference plane direction.

With reference to fig. 5a to 5c, the difference from fig. 2a to 2c is that, along the normal direction of the reference plane (i.e., the optical axis direction in this figure), the second surface a2 is located on the side of the fourth surface B2 away from the third surface B1; the fourth surface B2 is offset with respect to the second surface a2 in the direction of the plane of the third surface B1 along the direction of the optical axis, so that the plane of the fourth surface B2 is located between the plane of the second surface a2 and the plane of the third surface B1, and thus the fourth surface B2 is recessed with respect to the second surface a2, so as to accommodate the connecting assembly 4, the connecting assembly 4 includes flexible connecting

strips

4q, 4r, 4s and 4t, and the structure of the flexible connecting

strips

4q, 4r, 4s and 4t can be referred to the flexible connecting

strips

4a, 4B, 4c and 4d in turn. Taking the flexible connection tape 4q and the flexible connection tape 4a as an example for distinction, the flexible connection tape 4q is attached (only kept attached, not fixed by bonding or the like) to the fourth surface B2, the second end (reference J position) is fixed and electrically connected to the fourth surface B2 (hereinafter, the flexible connection tape 4r is taken as an example, and the manner of fixing and electrically connecting here will be described with reference to fig. 5 d), the first end (reference I position) is connected to one first sub-side of the inner circumferential surface A3 and is no longer located in the gap between the outer circumferential surface B3 and the inner circumferential surface A3, wherein at least the orthographic projection of the bending structure W2 of the flexible connection tape 4q on the reference surface is ensured to be located within the orthographic projection of the fourth surface B2 on the reference surface, at which time the gap between the outer circumferential surface B3 and the inner circumferential surface A3 can be reduced, and the size of the second circuit board 10 can be increased without increasing the overall size of the circuit board assembly, a larger size of the image sensor 2 can be placed, thereby improving the performance of the image sensor 2; moreover, the flexible connecting belt is not required to be arranged in an annular gap between the inner circumferential surface A3 and the outer circumferential surface B3, when the second end is connected with the fourth surface B2 and the first end is connected with the inner circumferential surface A3, the operation space is increased, the process difficulty is reduced, and the yield is improved; and the size of the flexible connection tape can be set larger, the softness thereof is increased, the resistance is reduced, and the second circuit board 10 is more flexible when moving laterally. When the flexible connection tape 4q has the plurality of bending structures W2, the effect of reducing the size of the circuit board assembly in the XY plane direction can be achieved as long as it is ensured that the orthographic projection of the plurality of bending structures W2 on the reference plane at least partially overlaps the orthographic projection of the fourth surface B2 on the reference plane. Flexible connecting

strips

4r, 4s and 4t have similar deformations with respect to flexible connecting

strips

4b, 4c and 4d, respectively.

Referring to fig. 5c and 5d, the end face of the first end of the flexible connecting band 4r is connected to the inner circumferential surface a3, taking the flexible connecting band 4r as an example. And, along the normal direction of the reference plane (here, the direction of the optical axis L), the thickness dimension of the flexible connecting tape 4r is smaller than that of the first circuit board 8, and the flexible connecting tape 4r is interposed between the second surface a2 and the fourth surface B2, so that the flexible connecting tape 4r is hidden in the accommodation space formed by the concavity of the fourth surface B2 relative to the second surface a2 in the normal direction of the reference plane, and does not occupy an additional space in the normal direction of the reference plane. With continued reference to fig. 5c and 5e, the minimum distance h2 from the first end of the flexible connecting strip 4r to the second surface a2 is smaller than the minimum distance h1 from the first end to the first surface a1, so that a wider dimension h1 is reserved between the first end and the first surface a1 on the inner circumferential surface of the first hollow-out portion U1 to be opposite to the outer circumferential surface B3, which is beneficial to reducing the overall thickness of the circuit board assembly and ensuring flexible connection.

Referring to fig. 5d and 5E, a connection pad E1 is disposed between the second end of the flexible connection tape 4r and the fourth surface B2, and the connection pad E1 may be a metal sheet or a metal solder, which can fix and electrically connect the second end of the flexible connection tape 4r and the pad on the fourth surface B1. The connection pad E1 heightens the second end of the flexible connection band 4r so that a portion between the first end and the second end of the flexible connection band 4r may be spaced apart from the fourth surface B2, so that the flexible connection band 4r may be more flexibly deformed.

The flexible connecting band 4r is only used as an example, and the rest of the flexible connecting bands can also have similar structures and connecting modes.

Referring to fig. 6a to 6B, the difference from fig. 2a to 2c is that, in the normal direction of the reference plane (i.e. the optical axis direction in this figure), the third surface B1 is higher than the first surface a1, the plane of the third surface B1 is located on the side of the first surface B1 facing away from the second surface a2, and the positional relationship between the first circuit board 8 and the second circuit board 10 in fig. 6a to 6B is the same as that in fig. 5a to 5B, specifically, the first circuit board 8 and the second circuit board 10 may have the same thickness, and the second circuit board 10 is moved by a partial distance along the direction in which the second surface a2 points to the first surface a1, which is smaller than the board thickness of the first circuit board 8. The connecting assembly 4 comprises flexible connecting

strips

4i, 4j, 4k and 4l, the structure of the flexible connecting

strips

4i, 4j, 4k and 4l being referred to in turn in figures 2a to 2c as flexible connecting

strips

4e, 4f, 4g and 4h, but other structures are also possible.

Taking the flexible connection belt 4i as an example, the second end of the flexible connection belt 4i is connected to a second sub-side of the outer circumferential surface B3, so as to reduce the thickness in the direction perpendicular to the reference surface, and the bending structure W3 of the flexible connection belt 4i is attached to the first surface a1, and the first end is bonded to the first surface a1 by bonding or the like, without being connected to the inner circumferential surface A3, so that the operable space is large, the process difficulty is reduced, and the yield is improved. When the flexible connecting strip 4i has a plurality of bending structures W3, the orthographic projection of the plurality of bending structures W3 on the reference plane at least partially overlaps the first surface a1, and the size of the circuit board assembly in the direction parallel to the reference plane may also be reduced as shown in fig. 5a to 5 c.

In this case, the size of the flexible connection tape can be increased compared to the case where the flexible connection tape is disposed in the annular gap between the inner circumferential surface a3 and the outer circumferential surface B3, so that the flexibility is further improved, the resistance is reduced, and the second circuit board can move more flexibly in the plane of XY. In addition, the fourth surface B2 is located between the first surface a1 and the second surface a2 in the normal direction of the reference plane, which is beneficial to providing a containing space on the side of the fourth surface B2 away from the third surface B1, and some components can be arranged.

With reference to fig. 6B and fig. 6d, taking the flexible connection band 4k as an example, the end surface of the second end of the flexible connection band 4k is connected to the outer peripheral surface B3, wherein the flexible connection band 4k can be integrally formed with the second circuit board 10, the thickness of the flexible connection band 4k is smaller than that of the second circuit board 10 along the normal direction of the reference plane (here, the direction of the optical axis L), and the flexible connection band 4k is interposed between the first surface and the third surface B1 of the a1, so that the flexible connection band 4k is hidden in the accommodating space formed by the first surface a1 being recessed relative to the third surface B1 in the normal direction of the reference plane, and does not occupy an additional space in the normal direction of the reference plane; moreover, the minimum distance (denoted as h3, since the top surface of the flexible connecting band is flush with the third surface B1 and h3 is 0, which is not shown in the figure) from the second end of the flexible connecting band 4k to the third surface B1 is less than the minimum distance h4 from the second end of the flexible connecting band 4k to the fourth surface B2. So that a wider dimension h4 is reserved between the second end of the flexible connecting belt 4k and the fourth surface B2 on the inner circumferential surface A3 to be opposite to the inner circumferential surface A3 of the first hollow-out portion U1, which is beneficial to reducing the overall thickness of the circuit board assembly and ensures flexible connection.

Referring to fig. 6b and 6E, a connection pad E2 is disposed between the first end of the flexible connection tape 4k and the first surface a1, and the connection pad E2 may be a metal sheet or a metal solder, which can fix and electrically connect the first end of the flexible connection tape 4k and the pad on the first surface a 1. The connection pad E2 heightens the first end of the flexible connection band 4k so that a portion between the first end and the second end of the flexible connection band 4k may be spaced apart from the first surface a1, so that the flexible connection band 4k may be more flexibly deformed.

The flexible connecting band 4k is only used as an example, and the rest of the flexible connecting bands can have similar structures and connecting modes.

In fig. 6a to 6c, the structure of the flexible connecting band may be modified, and referring to fig. 7a, the connecting assembly 4 includes flexible connecting

bands

4m, 4n, 4o and 4p, the flexible connecting

bands

4m, 4n, 4o and 4p are arranged and connected at two ends in a manner referring to the flexible connecting

bands

4i, 4j, 4k and 4l in fig. 6a to 6c, but the winding structure thereof may refer to 4q, 4r, 4s and 4t in fig. 4.

Referring to fig. 7b, on the basis of fig. 7a, a second hollow portion U2 extending along the extending direction of each flexible connecting band (e.g. 4q) is disposed in the middle of each flexible connecting band, and the second hollow portions U2 are distributed in the middle of the flexible connecting band in a strip shape, so that the width of the flexible connecting band in the direction parallel to the reference plane can be reduced, thereby improving the flexibility of the flexible connecting band and reducing the resistance to be overcome when the flexible connecting band is deformed.

In the exemplary embodiment corresponding to fig. 1 to 7B, the first circuit boards 8 each have a first cutout U1, and the second circuit board 10 projects at least partially into the first cutout U1 in a direction normal to the reference plane, so that the outer circumferential surface B3 of the second circuit board 10 is arranged at least partially opposite the inner circumferential surface A3 enclosing the first cutout U1 in a direction parallel to the reference plane, i.e. the projection of the second circuit board 10 overlaps at least partially the projection of the first circuit board 8 in a direction parallel to the reference plane.

Referring to fig. 8a and 8b, the first circuit board 8 and the second circuit board 10 are disposed side by side in the optical axis direction, instead of the second circuit board 10 being partially or entirely disposed within the first hollowed-out portion U1 of the first circuit board 8. And the fourth surface B2 is positioned on the side of the plane of the first surface B1, which is far away from the plane of the second surface A2, and the plane of the fourth surface B2 is opposite to the plane of the second surface A2. A flexible connecting strip (e.g. 4q) extends onto first surface a 1; a second hollow-out part U2 extending along the extending direction of the flexible connecting belt is arranged in the middle of each flexible connecting belt (such as 4q), and the second hollow-out parts U2 are distributed in the middle of the flexible connecting belt in a strip shape, so that the flexibility of the flexible connecting belt is improved, and the resistance required to be overcome during deformation of the flexible connecting belt is reduced. Moreover, by observing fig. 8a, when the first circuit board 8 is not provided with the first hollowed-out portion U1, since the first circuit board 8 itself has the functions of strength retention and sealing, the strength retention plate on the bottom surface of the first circuit board 8 may not be necessary, which simplifies the process steps. Also, in contrast to the embodiment of fig. 2a to 2c, the flexible connecting band has a large operating space when both ends are connected. And the size of the flexible connection tape can be further increased, which is beneficial to reducing the transverse movement resistance of the second circuit board 10. Moreover, compared with the embodiments corresponding to fig. 5a to 5c, the flexible connecting band is not limited in the hollow structure U1, and the movable degree of freedom is greater, which is beneficial to further increasing the degree of freedom of the second circuit board 10. Moreover, since the first hollowed-out portion U1 is not provided, the structural strength of the first circuit board 8 is greater. In addition, the transverse moving space of the second circuit board 10 is no longer limited to the first hollow-out portion U1, but is enlarged to the whole area of the first circuit board 8, which is beneficial to further improving the anti-shake performance. In addition, the size of the second circuit board 10 is not limited to the first hollowed-out portion U1, and the second circuit board 10 may be smaller than the first circuit board 8, which is equivalent to a larger second circuit board 10, and is beneficial for the third surface B1 to place a larger image sensor 2.

Alternatively, as shown in fig. 8c, the difference from fig. 8b is that the second hollowed-out portion U2 is not provided, which is advantageous, and the orthographic projection of each flexible connecting belt on the reference surface is completely located within the orthographic projection range of the third surface on the reference surface.

Further alternatively, as shown in fig. 8d, a first hollow-out portion U1 is added at a position where the first circuit board 8 is opposite to the second circuit board 10, but the first circuit board 8 is not located therein, so that the first hollow-out portion U1 can achieve a weight reduction effect.

The resistance to movement of the second circuit board 10 in the directions within the XY plane can also be reduced while additionally occupying the space in the directions within the XY plane as long as the following conditions are satisfied: the plane of the second surface A2 is opposite to the plane of the third surface B1; each flexible connecting strip has a first end connected to second surface a2, a second end connected to third surface B1, and an orthographic projection of the plurality of bending structures of the flexible connecting strip on the reference plane at least partially overlaps with an orthographic projection of second surface a2 on the reference plane.

Based on the same inventive concept, a circuit board assembly is provided, which includes the first circuit board 8, the second circuit board 10 and the connecting component in the foregoing camera module embodiment, and the structure and effect thereof can be referred to the related description of the foregoing embodiment.

Based on the same inventive concept, an electronic device is provided, which may be a mobile phone or a tablet computer, and includes the camera module provided in the foregoing embodiment, and the effect analysis of the camera module embodiment can be referred to with respect to the effect of the prior art.

It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A circuit board assembly, comprising: the flexible connecting circuit comprises a first circuit board, a second circuit board and a plurality of flexible connecting belts;

the first circuit board has a first surface and a second surface which are opposite;

the second circuit board is provided with a third surface and a fourth surface which are opposite to each other, and an outer peripheral surface connecting the third surface and the fourth surface, the orientation of the third surface is the same as that of the first surface, the orientation of the fourth surface is the same as that of the second surface, the third surface and the fourth surface are both rectangular, and the third surface is provided with an electric connection structure used for being electrically connected with an image sensor;

the orthographic projection of the second circuit board on the reference surface is positioned in the range of the orthographic projection outline of the first circuit board on the reference surface, wherein the reference surface is a plane where the first surface is located;

the flexible connecting band is a flexible circuit board and is provided with at least one bending structure, the first end of the flexible connecting band is connected with the first circuit board through an anisotropic conductive film process or an integrated type, and the second end of the flexible connecting band is connected with the second circuit board through an anisotropic conductive film process or an integrated type, so that the flexible connection and the electric connection of the first circuit board and the second circuit board are realized.

2. The circuit board assembly according to claim 1, wherein the first circuit board has a first hollow portion in a middle portion, an outer circumferential surface of the second circuit board is at least partially disposed opposite to an inner circumferential surface surrounding the first hollow portion along a direction parallel to the reference surface, and an annular gap exists between orthographic projections of the first circuit board and the second circuit board on the reference surface.

3. The circuit board assembly according to claim 2, wherein the first hollow portion is rectangular, and an inner circumferential surface surrounding the first hollow portion has first sub-side surfaces corresponding to each side of the first surface one by one;

the first end of the flexible connecting band is connected with one of the first sub-sides.

4. A circuit board assembly according to claim 3, wherein the first end of each flexible connecting strip is formed with a first corner structure that bends from the direction of extension of the flexible connecting strip towards the first circuit board.

5. A circuit board assembly according to claim 3, wherein an orthographic projection of each of the flexible connecting strips on the reference plane is located within the annular gap;

the second end of each flexible connecting band is connected with the peripheral surface.

6. The circuit board assembly of claim 5, wherein the peripheral surface has a second sub-side surface in one-to-one correspondence with each side of the first surface;

and in the two opposite second sub-side surfaces, each second sub-side surface is connected with at least two flexible connecting belts.

7. The circuit board assembly according to claim 6, wherein, in the two opposite second sub-side surfaces, the flexible connection tapes respectively connected with the two second sub-side surfaces are symmetrical with respect to the symmetry axes of the two second sub-side surfaces in a one-to-one correspondence.

8. A circuit board assembly according to claim 6, wherein the second end of each flexible connection tape is formed with a second corner structure that is bent from the direction of extension of the flexible connection tape towards the second circuit board.

9. The circuit board assembly of claim 2, wherein the second surface is located on a side of the fourth surface away from the third surface in a direction normal to the reference plane;

and in the normal direction of the reference surface, the flexible connecting band is positioned on one side of the fourth surface, which is far away from the third surface, and the orthographic projections of the bending structures of each flexible connecting band on the reference surface are at least partially overlapped with the orthographic projection of the fourth surface on the reference surface, and are connected with the inner peripheral surface which is surrounded into the first hollow part through the first end and connected with the fourth surface through the second end.

10. The circuit board assembly of claim 9, wherein the flexible connection tape has a thickness less than a thickness of the first circuit board, in a direction normal to the reference plane, the flexible connection tape being interposed between the second surface and the fourth surface; and the number of the first and second electrodes,

the first end is connected to the inner circumferential surface, and the minimum distance from the first end to the second surface is smaller than the minimum distance from the first end to the first surface.

11. The circuit board assembly of claim 2, wherein the third surface is higher than the first surface;

follow on the normal direction of reference surface, flexible connection area is located the first surface deviates from one side of second surface, every flexible connection area the second end with the outer peripheral face is connected, just a plurality of flexible connection area buckle the structure and be in orthographic projection on the reference surface with first surface at least part overlaps, and passes through first end with first surface is connected.

12. The circuit board assembly of claim 11, wherein the flexible connection tape has a thickness less than a thickness of the second circuit board, and is interposed between the first surface and the third surface, in a direction normal to the reference plane; and the number of the first and second electrodes,

a minimum distance from the second end to the third surface is less than a minimum distance from the second end to the fourth surface.

13. The circuit board assembly of claim 1, wherein the plane of the first surface is disposed opposite the plane of the fourth surface;

the first end of each flexible connecting belt is connected with the first surface, the second end of each flexible connecting belt is connected with the fourth surface, and the orthographic projections of the bending structures of the flexible connecting belts on the reference surface are at least partially overlapped with the orthographic projections of the fourth surfaces on the reference surface.

14. The circuit board assembly according to claim 1, wherein a second hollow extending along the extending direction of the flexible connecting band is provided in the middle of each flexible connecting band.

15. A circuit board assembly according to claim 1, wherein each of the flexible connection strips extends in a direction parallel to the reference plane.

16. The circuit board assembly of claim 15, wherein each of the flexible connection strips extends helically around a central axis of the second circuit board, the central axis being perpendicular to the third surface and passing through a geometric center of the third surface; and the number of the first and second electrodes,

the projection of each flexible connecting belt in the width direction overlaps with the projection of another flexible connecting belt in the width direction, wherein the width direction is a direction parallel to the reference plane and perpendicular to the extending direction of the flexible connecting belt.

17. The circuit board assembly of claim 16, wherein the first and second ends of each of the flexible connecting strips are each angled between 90 ° and 180 ° from a line drawn along the central axis, wherein the line is parallel to the reference plane.

18. A camera module comprising a lens, an image sensor, a driver assembly and the circuit board assembly of any one of claims 1 to 17,

the image sensor is arranged on the third surface and is electrically connected with the second circuit board through the electric connection structure, and the lens is arranged on one side of the image sensor, which is far away from the second circuit board;

the driving component is used for supporting the second circuit board on one side of the lens close to the image sensor and driving the second circuit board to move relative to the first circuit board along a direction parallel to a reference surface so as to realize an anti-shake function.

19. The camera module of claim 18, wherein the drive assembly comprises: a supporting member and a lateral driving member, the lateral driving member being connected to a side of the lens close to the image sensor and being configured to move the supporting member relative to the first circuit board in a direction parallel to the reference surface, the supporting member being configured to support the second circuit board to the lateral driving member.

20. The camera module of claim 18, wherein the drive assembly comprises: a support member and a lateral drive member; wherein the content of the first and second substances,

the supporting component is used for supporting the second circuit board on one side of the lens close to the image sensor;

the transverse driving component is used for driving the second circuit board to move relative to the first circuit board along a direction parallel to a reference surface.

21. The camera module of claim 20, wherein the lateral drive component comprises a coil and a magnet, wherein,

the coil is arranged on the second circuit board, and the magnet is arranged on the first circuit board; or, the magnet is arranged on the second circuit board, and the coil is arranged on the first circuit board;

the coil is used for attracting or repelling the magnet.

22. The camera module of claim 19 or 20, wherein the transverse drive component comprises an optical anti-shake motor and the support component comprises a suspension wire.

23. The camera module according to claim 19 or 20, further comprising a filter holder and an ir-cut filter, wherein the ir-cut filter is located between the lens and the image sensor, and the filter holder supports the ir-cut filter on the third surface;

the support member is connected between the lens and the filter holder.

24. The camera module of claim 18, further comprising gold wires, wherein the image sensor is electrically connected to the electrical connection structure through the gold wires.

25. The camera module according to claim 18, wherein when the first circuit board is provided with the first hollow portion, the camera module further comprises a strength-maintaining plate, the strength-maintaining plate is disposed on a surface of the first circuit board facing away from the lens, and the strength-maintaining plate covers the hollow structure.

26. An electronic device comprising a housing and the camera module of any one of claims 18-25, wherein the camera module is disposed in the housing.