CN116033267B - Anti-shake mechanism, camera module and electronic equipment - Google Patents
Anti-shake mechanism, camera module and electronic equipment Download PDFInfo
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- CN116033267B CN116033267B CN202211262907.6A CN202211262907A CN116033267B CN 116033267 B CN116033267 B CN 116033267B CN 202211262907 A CN202211262907 A CN 202211262907A CN 116033267 B CN116033267 B CN 116033267B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 97
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- 238000009434 installation Methods 0.000 abstract description 13
- 238000003384 imaging method Methods 0.000 abstract description 10
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- 238000005516 engineering process Methods 0.000 abstract description 3
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- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 239000013039 cover film Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
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- Adjustment Of Camera Lenses (AREA)
Abstract
The present application relates to the field of imaging technologies, and in particular, to an anti-shake mechanism, an imaging module, and an electronic device. The anti-shake mechanism includes a mounting portion and a deformation portion. Wherein the mounting portion is movable in the first direction or the second direction. The deformation part is enclosed and arranged on the installation part, the deformation part is laterally erected along a third direction, and a covering layer of the deformation part is photosensitive polyimide. The deformation part comprises a first part and a second part which are connected, wherein the first part extends along a first direction, and the second part extends along a second direction. The first portion is provided with a first stress relief structure, the second portion is provided with a second stress relief structure, the first stress relief structure is used for relieving stress when the first portion deforms in a third direction, and the second stress relief structure is used for relieving stress when the second portion deforms in the third direction. The anti-shake mechanism provided by the application can effectively reduce the moving counter force of the anti-shake mechanism and the power consumption of the motor under the condition of realizing the anti-shake function, thereby improving the anti-shake effect of the anti-shake mechanism on the camera module.
Description
Technical Field
The present application relates to the field of imaging technologies, and in particular, to an anti-shake mechanism, an imaging module, and an electronic device.
Background
In recent years, with the rapid development of the field of imaging technology, imaging has become an indispensable part of life. The requirements of users on shooting are also higher, and when the users use the shooting module to shoot, the problem of fuzzy shooting images is easily caused due to the shake of hands or the shake of shooting objects. At present, the camera shooting module generally drives the chip assembly to move through the anti-shake mechanism so as to compensate the displacement generated by shake, thereby obtaining a clear image. However, the existing anti-shake mechanism has large counter force and limited anti-shake effect when moving.
Disclosure of Invention
Some embodiments of the present application provide an anti-shake mechanism, an image capturing module, and an electronic device, and the following description of aspects of the present application refers to the following embodiments and advantageous effects.
A first aspect of the present application provides an anti-shake mechanism including: a mounting portion and a deformation portion. Wherein the mounting portion is movable in the first direction or the second direction. The deformation portion encloses and locates the installation department, and the deformation portion is on one's side along the third direction, and the deformation portion is including the first part and the second part that are connected, and first part extends along first direction, and the second part extends along the second direction. The first portion is provided with a first stress relief structure, the second portion is provided with a second stress relief structure, the first stress relief structure is used for relieving stress when the first portion deforms in a third direction, and the second stress relief structure is used for relieving stress when the second portion deforms in the third direction.
For example, the first direction may be an X-axis direction mentioned in the following embodiments, the second direction may be a Y-axis direction mentioned in the following embodiments, and the third direction may be a Z-axis direction mentioned in the following embodiments.
Illustratively, the first direction, the second direction, and the third direction are perpendicular to one another.
It will be appreciated that the anti-shake mechanism may be applied to a camera module, the camera module may be applied to an electronic device, and the electronic device may be, but is not limited to, any one of a mobile phone, a tablet computer, a notebook computer, and other electronic devices having a camera function, which is not particularly limited in the present application.
Above-mentioned anti-shake mechanism, under the circumstances that realizes anti-shake function, through set up stress relief structure on deformation portion, avoid deformation portion and other parts (e.g. motor) of module of making a video recording to produce the interference to effectively reduced the removal counter-force when deformation portion removes along first direction and second direction, and then made anti-shake angle of anti-shake mechanism bigger, application scope is wide. In addition, the anti-shake mechanism has the advantages of being large in design tolerance, low in assembly difficulty, high in yield, stable in mechanical property and the like.
In one possible implementation of the first aspect described above, the first stress relief structure includes a row of apertures spaced apart along the first direction. The hole may be any one of a round hole, an elliptical hole, a rectangular hole and a slot-shaped hole, which is not limited in the present application.
In one possible implementation of the first aspect, the first stress relief structure includes at least two rows of holes respectively spaced along the first direction, and the holes of any two adjacent rows are staggered in the third direction. The first stress relief structure is enabled to relieve stress at various locations of the first portion while ensuring strength of the first portion of the deformed portion.
In a possible implementation of the first aspect, the second stress relief structure includes a row of holes spaced apart along the second direction. The hole may be any one of a round hole, an elliptical hole, a rectangular hole and a slot-shaped hole, which is not limited in the present application.
In a possible implementation of the first aspect, the second stress relief structure includes at least two rows of holes respectively spaced along the second direction, and the holes of any two adjacent rows are staggered in the third direction. The second stress relief structure is enabled to relieve stress at various locations of the second portion while ensuring strength of the second portion of the deformed portion.
In a possible implementation of the first aspect described above, the first stress relief structure is arranged close to an edge of the first portion. So that when the first part of the deformation part deforms along the third direction, the first stress relief structure is disconnected in time to relieve the stress of the first part.
In a possible implementation of the first aspect described above, the second stress relief structure is arranged close to an edge of the second portion. So that when the second part of the deformation part deforms along the third direction, the second stress relief structure is disconnected in time to relieve the stress of the second part.
In one possible implementation of the first aspect, the deformation portion includes a dielectric layer and a cover layer that are stacked, where the dielectric layer includes a first surface and a second surface that are disposed opposite to each other along a stacking direction, and the first surface and the second surface are respectively provided with the cover layer, and the cover layer is made of photosensitive polyimide.
Wherein the stacking direction may be the first direction or the second direction. For example, the lamination direction of the first portion of the deformed portion is the second direction. For another example, the lamination direction of the second portion of the deformed portion is the first direction.
The cover layer has the characteristics of light weight and thinness, and can effectively reduce the thickness of the deformation part, so that the moving counter force of the deformation part and the driving power consumption of the motor are further reduced, the anti-shake performance of the anti-shake mechanism is further improved, and the structure of the anti-shake mechanism is more compact. It is understood that the thickness of the deformed portion refers to the dimension of the deformed portion in the stacking direction.
In one possible implementation of the first aspect, the dielectric layer includes a substrate and trace layers disposed along a stacking direction, the trace layers are disposed on a surface of the substrate along the stacking direction, and a thickness of the cover layer is greater than or equal to a thickness of the trace layers.
Based on this, when guaranteeing anti-shake mechanism structure's compactness, the overburden can also effectively keep off steam and dust, avoids the routing layer to be oxidized and damaged.
In one possible implementation of the first aspect, the deformation portion is an FPC. The deformation portion is electrically connected to the mounting portion to perform signal transmission, and transmits an electric signal formed by the chip assembly mounted on the mounting portion to other components (for example, an image processor).
A second aspect of the present application provides an image capturing module comprising a lens, a chip assembly, a motor, and any one of the above first aspect and possible implementations of the above first aspect;
the chip component is arranged opposite to the lens in the optical axis direction of the lens, and the motor is used for driving the anti-shake mechanism, so that the anti-shake mechanism can drive the chip component to move relative to the lens.
A third aspect of the present application provides an electronic apparatus including the camera module of the second aspect.
Drawings
Fig. 1 (a) shows a perspective view of a handset 1 in some embodiments of the application;
fig. 1 (b) shows an exploded view of a handset 1 in some embodiments of the application;
FIG. 2 is a schematic diagram illustrating a shake of a camera module according to some embodiments of the present application;
FIG. 3 illustrates a schematic diagram of an anti-shake mechanism in some embodiments;
fig. 4 (a) and 4 (b) are perspective views illustrating an anti-shake mechanism according to an embodiment of the present application;
FIGS. 5 (a) and 5 (b) are perspective views of camera modules according to some embodiments of the present application;
FIG. 5 (C) shows a cross-sectional view of the camera module taken along section C-C of FIG. 5 (a) in accordance with some embodiments of the present application;
FIGS. 6 (a) through 6 (d) through illustrate strain relief diagrams for deformations in some embodiments of the present application;
FIG. 7 illustrates a schematic diagram of a deformation portion in some embodiments of the present application;
fig. 8 shows a schematic structural view of the deformation portion in some embodiments.
Reference numerals illustrate:
1-a mobile phone; 10-a camera module; 100-cameras; a 100' -camera; 200-chip assembly; 300-motor; 310-mounting end; 311-cavity; 320-driving end; 400-an anti-shake mechanism; 410-a mounting portion; 420-deformation part; 421-a first part; 422-a second portion; 423-third part; 424-fourth part; 425-signal lines; 426-dielectric layer; 4261-a first surface; 4262-a second surface; 4263-substrate; 4264-wiring layer; 427-a cover layer; 427' -cover layer; 428-cover film; 429-adhesive; 430-a stress relief structure; 431-a first stress relief structure; 432-a second stress relief structure; 440-accommodating space; 4, a step of; 400 a-anti-shake mechanism; 410 a-a mounting portion; 420 a-a deformation; 421 a-metal lines; 430 a-a movable part; 20-a back shell; 21-a light inlet hole; 30-middle frame; 40-a display screen; s is S 1 -a mounting end interference area; s is S 2 -a bending region; s is S 3 -a deformation zone; s is S 4 -a deformation zone; s is S 5 -a first partial edge region; s is S 6 -a second partial edge region; i-incident light beam; p-shooting an object; p (P) 1 -an image; p (P) 2 -an image; l (L) 1 -a first partDividing the upper edge; l (L) 2 -a first portion lower edge.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings.
The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
The application provides electronic equipment, which comprises at least one group of camera shooting modules, wherein the camera shooting modules comprise lenses, chip components, motors and anti-shake mechanisms.
It is understood that the electronic device provided by the application can be any one of electronic devices with camera shooting function, such as a mobile phone, a tablet computer or a notebook computer, and the application is not limited in particular. For convenience of description, the following will take the example that the electronic device is a mobile phone as an example.
Fig. 1 (a) shows a perspective view of a handset 1 in some embodiments of the application. Fig. 1 (b) shows an exploded view of a handset 1 in some embodiments of the application. For convenience of description and understanding below, the X-direction (as a first direction), the Y-direction (as a second direction), and the Z-direction (as a third direction) of the cellular phone 1 will be defined below with reference to fig. 1 (a) and 1 (b). As shown in fig. 1 (a) and 1 (b), the width direction of the mobile phone 1 is the X-axis direction, wherein the width direction can be understood as the direction in which the user holds; the length direction of the mobile phone 1 is the Y-axis direction, wherein the length direction may be the length direction of the display screen 40, and may be understood as a direction perpendicular to the direction in which the user holds the display screen 40 in the plane; the thickness direction of the mobile phone 1 is the Z-axis direction. Illustratively, the X-axis direction, the Y-axis direction, and the Z-axis direction intersect one another.
In some implementations of the application, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to one another. It is understood that the perpendicularity of the present application is not absolute, and that approximate perpendicularity due to machining errors and assembly errors (e.g., an angle of 89.9 ° between two structural features) is also within the scope of the perpendicularity of the present application. The present application is not particularly limited in this regard, and the description of the mutually perpendicular limitations will not be repeated hereinafter.
As can be seen in fig. 1 (a) and 1 (b), in some embodiments of the present application, the mobile phone 1 includes at least one camera module 10 (fig. 1 (b) shows the camera module 10), a back shell 20, a middle frame 30, a display 40, and a processor (not shown). The back shell 20, the middle frame 30 and the display screen 40 are sequentially arranged along the positive direction of the Z axis, and the back shell 20, the middle frame 30 and the display screen 40 together form an installation cavity (not labeled). The camera module 10 is located in the mounting cavity and is mounted on at least one of the back shell 20, the middle frame 30 and the display screen 40.
Taking the camera module 10 as a rear camera for example, the back shell 20 of the mobile phone 1 is formed with a light inlet 21, and the camera module 10 includes a light sensing surface (not shown) facing the back shell 20 and opposite to the light inlet 21 of the back shell 20. That is, along the Z-axis direction, the projection of the photosurface of the camera module 10 and the projection of the light inlet 21 are completely or partially overlapped, so that the incident light beam i outside the mobile phone 1 can enter the inside of the camera module 10 through the light inlet 21 on the back shell 20 and irradiate the photosurface of the camera module 10. Based on this, the shot scenery can be transmitted to the processor for processing through the camera module 10, and finally converted into a displayable image, thereby realizing the shooting function of the mobile phone 1.
It should be understood that the above implementation is only a partial example showing the specific structure of the mobile phone 1, and other mobile phones 1 including the camera module 10 are also within the scope of the present application, which is not limited in particular.
In order to further understand the technical solution of the present application, the structure of the camera module 10 in some embodiments will be briefly described below.
With continued reference to fig. 1 (b), the incident beam i may enter the camera module 10 through the light entrance hole 21 on the back shell 20 along the positive Z-axis direction. For convenience of the following description, a side on which the incident light beam i is located will be defined as an incident light side, and a side opposite to the incident light side will be defined as an outgoing light side. As shown in fig. 1 (b), the camera module 10 includes a lens 100, a chip assembly 200 (or "image sensor assembly"), and a motor 300. Wherein the motor 300 is formed with a cavity extending in the Z-axis direction (i.e., a cavity 311 of the motor 300 mentioned later), and the lens 100 is provided in the cavity 311. The chip assembly 200 is disposed on the light-emitting side of the lens 100. The incident light beam i enters the lens 100 from the light entrance side of the lens 100, and then exits the lens 100 from the light exit side of the lens 100, and the incident light beam i exiting the lens 100 reaches the chip assembly 200 for imaging.
When a user takes a picture by using the mobile phone 1, the camera module 10 in the mobile phone 1 is often dithered due to unstable hand holding or shaking of a shooting object, so that a shot image is blurred. Fig. 2 is a schematic diagram illustrating a shake of an image capturing module according to some embodiments of the present application. As shown in fig. 2, before dithering, light rays of an object P, which forms an image P on the chip assembly 200, are taken through the lens 100 to the chip assembly 200 1 . If the lens 100 of the image capturing module 10 is displaced due to shake during the capturing process, for example, as shown in fig. 2, the lens 100 moves in the positive X-axis direction (direction a in fig. 2) due to shake, and the lens 100 moves to the position of the lens 100' shown by the dotted line. At this time, the above-mentioned objectThe body P forms an image P on the chip assembly 200 2 Such as the dashed image P shown in fig. 2 2 . Therefore, the image photographed by the mobile phone 1 may have a ghost blur problem, which affects the imaging effect of the camera module 10.
For this purpose, as shown in fig. 1 (b), the camera module 10 further includes an anti-shake mechanism 400, and the anti-shake mechanism 400 is connected to the chip assembly 200, and the position of the chip assembly 200 is adjusted by the anti-shake mechanism 400 to implement an anti-shake function. Specifically, the position of the chip assembly 200 is adjusted to compensate the shake amount of the lens 100, so that the imaging position shifted due to shake is compensated to the position on the chip assembly 200 before shake, thereby improving the imaging effect and avoiding the phenomenon of blurring of the photographed image. As can be seen from fig. 1 (B) and fig. 2, when the lens 100 shakes along the positive X-axis direction, the anti-shake mechanism 400 can drive the chip assembly 200 to move along the negative X-axis direction (shown in the direction B in fig. 2) to compensate for the shake of the lens 100, so as to ensure the sharpness of the image captured by the image capturing module 10.
In order to realize the anti-shake of the anti-shake mechanism to the camera module, the anti-shake mechanism mainly comprises the following anti-shake mechanisms at present.
In some application scenarios, the anti-shake mechanism is a planar anti-shake mechanism. Fig. 3 is a schematic diagram of an anti-shake mechanism according to some embodiments. As shown in fig. 3, the anti-shake mechanism 400a includes a mounting portion 410a, a deformation portion 420a, and a movable portion 430a. Wherein, the installation portion 410a and the movable portion 430a are both frame-shaped, the installation portion 410a is enclosed around the movable portion 430a, and the installation portion 410a and the movable portion 430a are connected through the deformation portion 420 a. The deformation portion 420a is formed by arranging a plurality of metal wires 421a in parallel. The plurality of metal wires 421a can swing in the X-axis direction and the Y-axis direction, and thus the deformation portion 420a can deform in the X-axis direction and the Y-axis direction, thereby driving the movable portion 430a to move in the X-axis direction and the Y-axis direction with respect to the mounting portion 410 a.
The mounting portion 410a of the anti-shake mechanism 400a is fixedly connected to a lens (not shown) of the image capturing module. The movable portion 430a of the anti-shake mechanism 400a is fixedly connected to a chip assembly (not shown). The deformation part 420a of the anti-shake mechanism 400a can correspondingly deform along the X-axis direction and the Y-axis direction according to the shake condition of the photographed image, so as to drive the chip assembly mounted on the movable part 430a to move along the X-axis direction and the Y-axis direction relative to the lens, thereby realizing the anti-shake function of the anti-shake mechanism 400a and avoiding the problem of photographing ambiguity.
According to the above-described structure of the anti-shake mechanism 400a, it is not difficult to find that the plurality of metal wires 421a arranged in parallel can only swing along the direction in which the metal wires 421a are arranged (or "line width direction"), that is, the deformation portion 420a of the anti-shake mechanism 400a can only move along the X-axis direction and the Y-axis direction, so that the movement reaction force of the deformation portion 420a is large, the displacement of the chip assembly is limited, and the anti-shake angle of the anti-shake mechanism 400a is small.
In other application scenarios, the anti-shake mechanism is a vertical anti-shake mechanism. The anti-shake mechanism includes a mounting portion and a deformation portion. The deformation part is arranged around the installation part in a surrounding mode, the installation part and the deformation part form an accommodating space together, and the lens, the chip assembly and the motor are located in the accommodating space. Wherein, on the installation department of anti-shake mechanism is located to the chip subassembly, the installation end of motor links to each other with the camera lens, and the drive end of motor links to each other with the installation department of anti-shake mechanism, and the drive end of motor can drive the installation department motion to make the installation department drive deformation portion and chip subassembly motion, with the shake of compensation camera lens, and then realize anti-shake mechanism to the anti-shake of camera module. The anti-shake mechanism has high assembly difficulty, and the deformation part of the anti-shake mechanism is easy to interfere with other parts (such as a motor) of the camera module due to assembly tolerance, so that the movement counter force of the deformation part of the anti-shake mechanism is increased, and the anti-shake function of the anti-shake mechanism is invalid.
To sum up, there is the great problem of removal counter force of the deformation portion of anti-shake mechanism in the current module of making a video recording, in order to promote anti-shake mechanism to the anti-shake effect of module of making a video recording, need optimize the structure of anti-shake mechanism.
In order to solve the above problems, the present application provides an anti-shake mechanism. According to the anti-shake mechanism provided by the application, the stress relief structure is arranged, so that the stress can be relieved in time when the deformation part is interfered, and the moving counter force of the deformation part is reduced. The following will describe in detail with reference to the accompanying drawings.
Fig. 4 (a) and 4 (b) are perspective views illustrating an anti-shake mechanism according to an embodiment of the present application. As can be seen in fig. 4 (a) and 4 (b), the anti-shake mechanism 400 includes a mounting portion 410, a deformation portion 420, and a stress relief structure 430.
Wherein the mounting portions 410 are distributed in an XOY plane, the mounting portions 410 are illustratively movable in an X-axis direction and a Y-axis direction.
In the embodiment of the present application, the deformation portion 420 has a strip-shaped structure, and the deformation portion 420 is disposed around the mounting portion 410 and is laterally erected along the Z-axis direction. Illustratively, the deformation 420 includes a first portion 421, a second portion 422, a third portion 423, a fourth portion 424, and a signal line 425. The first portion 421, the second portion 422, the third portion 423, and the fourth portion 424 are connected in this order, and the deformation portion 420 is similarly shaped like a quadrangle. The first portion 421 of the deformation portion 420 extends along the X-axis direction, the second portion 422 of the deformation portion 420 extends along the Y-axis direction, the third portion 423 of the deformation portion 420 extends along the X-axis direction, and the fourth portion 424 of the deformation portion 420 extends along the Y-axis direction. It can be understood that, in the natural state of the deformation portion 420 (i.e., in a state in which the deformation portion 420 is not deformed), the planes of the first portion 421, the second portion 422, the third portion 423, and the fourth portion 424 of the deformation portion 420 are perpendicular to the plane of the mounting portion 410, respectively. In the Z-axis direction, the signal line 425 extends from the edge of the third portion 423 away from the mounting portion 410.
The stress relief structure 430 is disposed on the deformation 420. Specifically, the stress relief structure 430 includes a first stress relief structure 431 and a second stress relief structure 432. The first stress relief structure 431 is disposed on the first portion 421 of the deformation portion 420, and the first stress relief structure 431 is configured to relieve stress when the first portion 421 deforms along the Z-axis direction; the second stress relief structure 432 is disposed on the second portion 422 of the deformation portion 420, and the second stress relief structure 432 is configured to relieve stress when the second portion 422 deforms along the Z-axis direction.
Illustratively, the third portion 423, the fourth portion 424, and the signal line 425 are used to implement the signal transmission function of the anti-shake mechanism 400, which will be described in detail later. The anti-shake and stress relief functions of the anti-shake mechanism 400 are described first below.
In order to facilitate understanding of the anti-shake principle and the stress relief principle of the anti-shake mechanism provided by the application, the following description is made in connection with the camera module.
Fig. 5 (a) and 5 (b) are perspective views of an image capturing module according to some embodiments of the present application. Fig. 5 (C) shows a cross-sectional view of the camera module along section C-C of fig. 5 (a) in some embodiments of the application. Referring to fig. 4 to 5 (c), the camera module 10 includes a lens 100, a chip assembly 200, a motor 300, and an anti-shake mechanism 400.
The mounting portion 410 and the deformation portion 420 of the anti-shake mechanism 400 together enclose an accommodating space 440, and the lens 100, the chip assembly 200 and the motor 300 are located in the accommodating space 440. The deformation portion 420 of the anti-shake mechanism 400 is disposed around the motor 300. Motor 300 includes a mounting end 310 and a driving end 320. The mounting end 310 of the motor 300 is formed with a cavity 311 extending in the Z-axis direction, and the lens 100 is disposed in the cavity 311. The driving end 320 of the motor 300 is connected to the mounting portion 410 of the anti-shake mechanism 400. The chip assembly 200 is disposed on the mounting portion 410 of the anti-shake mechanism 400, and the chip assembly 200 is bonded to the mounting portion 410 of the anti-shake mechanism 400, for example.
Based on this, when the lens 100 of the camera module 10 shakes, the motor 300 drives the mounting portion 410 to move along the X-axis direction or along the Y-axis direction or along both the X-axis direction and the Y-axis direction through the driving end 320, and accordingly, the mounting portion 410 can drive the chip assembly 200 to move along the X-axis direction or along the Y-axis direction or along both the X-axis direction and the Y-axis direction relative to the lens 100, so as to compensate for the shake of the lens 100, thereby realizing the anti-shake function of the anti-shake mechanism 400. Meanwhile, the mounting portion 410 further drives the deformation portion 420 to deform, so that the deformation portion 420 can ensure the stability of movement of the chip assembly 200, and further improve the anti-shake performance of the anti-shake mechanism 400.
When the camera module 10 is assembled, the deformation portion 420 deforms along the Z-axis direction due to the assembly tolerance, so that the deformation portion 420 interferes with other components of the camera module 10, and the movement reaction force of the deformation portion 420 increases. For example, the deformation portion 420 interferes with the interference region S of the mounting end 310 of the motor 300 shown in fig. 5 (c) 1 Interference and guidingThe reaction force of movement of the deformation portion 420 increases. By providing the stress relief structure 430, the stress generated by the deformation portion 420 due to the assembly tolerance can be relieved, thereby avoiding the above-described interference problem and reducing the movement reaction force of the deformation portion 420.
In particular, fig. 6 (a) to 6 (d) to show strain relief diagrams of the deformation portion in some embodiments of the present application. As shown in fig. 6 (a), taking the first stress relief structure 431 provided in the first portion 421 of the deformation portion 420 as an example, the deformation portion 420 is in a natural state before assembly, for example, the deformation portion 420 shown in fig. 6 (a) is in a shape, and at this time, the deformation portion 420 is not deformed. In the assembly process, the first portion 421 of the deformation portion 420 is deformed due to the stress generated by the assembly tolerance, for example, as shown in fig. 6 (b), the first portion 421 of the deformation portion 420 is bent along the Z-axis direction, and is similar to an arch shape, and the bent first portion 421 interferes with other components (such as a motor) of the camera module, so that the movement reaction force of the first portion 421 of the deformation portion 420 increases. That is, the movement of the first portion 421 of the deformation portion 420 in the Y-axis direction is blocked.
At this time, the bending region S may be located 2 The first stress relief structure 431 within breaks to relieve stress, such as shown in fig. 6 (c), in some embodiments, the bending region S will be located by a laser 2 The three first stress relief structures 431 within are open. Illustratively, one of the three first stress relief structures 431 is located near the upper edge l of the first portion 421 of the deformation 420 1 Two first stress relief structures 431 are located near the lower edge l of the first portion 421 of the deformation 420 2 . The three first stress relief structures 431 are changed from a hole-shaped structure to a U-shaped notch-like structure, so that the purpose of stress relief is achieved.
After the three first stress relief structures 431 relieve the stress, the first portion 421 of the deformation portion 420 changes from the arch shape of fig. 6 (c) to the "in-line" shape of fig. 6 (d). That is, after the stress is released by the three first stress releasing structures 431, the deformation portion 420 is not deformed along the Z axis direction, so that the interference problem is avoided, the moving reaction force of the first portion 421 can be reduced, and the power consumption of the motor (not shown) can be reduced.
In other embodiments, the first portion 421 of the deformation portion 420 is recessed along the Z-axis direction (opposite to the bending deformation direction in fig. 6 (b)), and is similar to a "U" shape, where the first portion 421 of the deformation portion 420 interferes with the mounting portion 410, and the reaction force increases, and the thrust of the motor also needs to be greater. Similarly, the above-mentioned interference problem can be avoided by disconnecting a plurality of first stress relief structures 431. Illustratively, three upper edges l proximate the first portion 421 are broken 1 And a lower edge l adjacent to the first portion 421 2 Is provided, the first stress relief structure 431.
The stress relief principle of the second stress relief structure 432 is the same as that of the first stress relief structure 431 described above, and will not be described here.
Above-mentioned anti-shake mechanism 400, when realizing anti-shake function, through seting up stress relief structure 430 on deformation portion 420, avoid deformation portion 420 to produce the interference with other parts of module 10 (e.g. motor 300) of making a video recording to effectively reduced the removal counter-force when deformation portion 420 moves along X axis direction and Y axis direction, and then made the anti-shake angle of anti-shake mechanism 400 bigger, application scope is wide. In addition, the anti-shake mechanism 400 has the advantages of large design tolerance, low assembly difficulty, high yield, stable mechanical property and the like.
In some embodiments of the present application, the stress relief structure 430 is a hole-like structure. Illustratively, the hole-like structure may be any one of a circular hole, an elliptical hole, a rectangular hole, and a slot-shaped hole, which is not limited in the present application.
In some implementations, the first stress relief structure 431 includes one or more rows of holes spaced along the X-axis direction, where any two adjacent rows of holes are staggered along the Z-axis direction, so that the first stress relief structure 431 can relieve stress at various positions of the first portion 421 while ensuring the strength of the first portion 421 of the deformation portion 420. Illustratively, as shown in FIG. 6 (a), in some embodiments, when S of the first portion 421 3 The region is deformed by stress and can be deformed by S 3 The first stress relief structure 431 at the region relieves the stress. In other embodiments, when S of first portion 421 4 Deformation in the Z-axis direction due to stress in the region can be achieved by S 4 The first stress relief structure 431 at the region relieves the stress. Alternatively, in other embodiments, when S of first portion 421 3 Region and S 4 The region is simultaneously stressed to generate deformation along the Z-axis direction, and can be simultaneously processed by S 3 Region and S 4 The first stress relief structure 431 at the region relieves the stress.
In some of these implementations, the first stress relief structure 431 is proximate to an edge of the first portion 421 of the deformation 420 (e.g., an upper edge l of the first portion 421 shown in fig. 6 (c) 1 And a lower edge l 2 ) The first stress relief structure 431 is disposed at the S-shaped portion defined by the broken line of the first portion 421 as shown in FIG. 4 5 The region is configured to break the first stress relief structure 431 in time to relieve the stress when the first portion 421 of the deformation portion 420 deforms along the Z-axis direction.
In some implementations, the second stress relief structure 432 includes one or more rows of holes spaced apart along the Y-axis, wherein any two adjacent rows of holes are staggered along the Z-axis, and the second stress relief structure 432 is configured to relieve stress at various locations of the second portion 422 while ensuring the strength of the second portion 422 of the deformed portion 420. The stress relief principle of the second stress relief structure 432 is the same as that of the first stress relief structure 431 described above, and will not be described here.
In some of these implementations, the second stress relief structure 432 is disposed proximate to edges (upper and lower edges) of the second portion 422 of the deformation 420, such as shown in FIG. 4, with the second stress relief structure 432 disposed at an S defined by a dashed line of the second portion 422 6 The region is configured to facilitate timely disconnection of the second stress relief structure 432 when the second portion 422 of the deformation portion 420 is deformed in the Z-axis direction.
It is understood that the layout positions of the first stress relief structure 431 and the second stress relief structure 432 in the above implementation are merely exemplary embodiments of the present application, and any layout form of the first stress relief structure 431 and the second stress relief structure 432 capable of achieving the above stress relief effect is within the scope of the present application.
In some embodiments, the mounting portion 410 may be a printed circuit board (Printed Circuit Board, PCB) and the deformation portion 420 may be a flexible circuit board (Flexible Printed Circuit, FPC). The deformation part 420 is electrically connected to the mounting part 410 for signal transmission. Illustratively, the third portion 423 and the fourth portion 424 are electrically connected to the mounting portion 410, the signal line 425 is electrically connected to other components (e.g., an image processor), and the deformation portion 420 transmits the electrical signal formed by the chip assembly 200 mounted on the mounting portion 410 to the other components (e.g., the image processor) through the third portion 423, the fourth portion 424, and the signal line 425.
The deformation portion 420 will be described in detail below using the deformation portion 420 as an FPC as an example.
Fig. 7 is a schematic view showing the structure of the deformation portion in some embodiments of the present application. As shown in fig. 7, the deformed portion 420 includes a dielectric layer 426 and a cover layer 427, which are stacked in this order in the stacking direction. The stacking direction may be an X-axis direction or a Y-axis direction, for example, as shown in fig. 4, the stacking direction of the first portion 421 of the deformation portion 420 is a Y-axis direction, and for example, as shown in fig. 4, the stacking direction of the second portion 422 of the deformation portion 420 is an X-axis direction. The following will exemplify an example in which the lamination direction is the Y axis direction.
Specifically, in the stacking direction (i.e., the Y-axis direction), the dielectric layer 426 is formed with a first surface 4261 and a second surface 4262 disposed opposite to each other, and the first surface 4261 and the second surface 4262 are provided with a cover layer 427, respectively. The dielectric layer 426 includes a substrate 4263 and a wiring layer 4264 disposed in the lamination direction. Illustratively, opposite surfaces of the substrate 4263 are respectively covered with a trace layer 4264 in the lamination direction. In some embodiments of the present application, the substrate 4263 is Polyimide (PI), and the trace layer 4264 is copper foil. Illustratively, the trace layer 4264 may be formed by etching or electroplating on the substrate 4263, which has low manufacturing cost and wide application range.
The movement reaction force of the deformation portion 420 is inversely proportional to the deflection deformation amount f of the deformation portion 420. For example, the deflection deformation amount f of the deformation portion 420 increases by 1 time, and the movement reaction force of the deformation portion 420 decreases by 1 time. For another example, the deflection deformation amount f of the deformation portion 420 increases by 2 times, and the movement reaction force of the deformation portion 420 decreases by 2 times. Wherein, the deflection deformation f of the deformation part 420 and each parameter of the deformation part 420 satisfy the following relation:
wherein f is the deflection deformation of the deformation portion 420; e is the elastic modulus of the deformation 420; b is the width of the deformation 420 (i.e., the dimension of the deformation 420 along the Z-axis direction); h is the thickness of the deformed portion 420 (i.e., the dimension of the deformed portion 420 in the stacking direction); p is the external load received by the deformation portion 420; l is the length of the deformation 420 (i.e., the dimension of the deformation 420 in the extending direction (shown as direction D in fig. 4))
In summary, the deflection deformation amount f of the deformation portion 420 is inversely related to the elastic modulus E of the deformation portion 420 and the thickness h of the deformation portion 420, and the movement reaction force of the deformation portion 420 is positively related to the elastic modulus E of the deformation portion 420 and the thickness h of the deformation portion 420. That is, the larger the elastic modulus E of the deformation portion 420 and the thickness h of the deformation portion 420, the smaller the deflection deformation amount f of the deformation portion 420, and the larger the movement reaction force accordingly; the smaller the elastic modulus E of the deformation portion 420 and the thickness h of the deformation portion 420, the larger the deflection deformation amount f of the deformation portion 420, and the smaller the movement reaction force.
To further reduce the thickness h of the deformation portion 420, the movement reaction force of the deformation portion 420 is further reduced. In some embodiments of the present application, the cover layer 427 is a photosensitive polyimide (Photo Sensitive Poly Imide, PSPI). Illustratively, the cover layer 427 is applied to the first surface 4261 and the second surface 4262 of the dielectric layer 426 by a coating process. The cover layer 427 has a light and thin property, and can effectively reduce the thickness h of the deformation portion 420, thereby further reducing the movement reaction force of the deformation portion 420 and the driving power consumption of the motor, and further improving the anti-shake performance of the anti-shake mechanism 400.
For example, fig. 8 shows a schematic structural view of the deformation portion in some embodiments. As shown in fig. 8, in other embodiments, the deformed portion 420 includes a dielectric layer 426 and a cover layer 427' sequentially stacked in a stacking direction (Y direction in fig. 8). Wherein the dielectric layer 426 includes a substrate 4263 and a wiring layer 4264 arranged in a lamination direction, and the cover layer 427' includes a cover film 428 and an adhesive 429 arranged in the lamination direction. The cover layer 427' is disposed on two surfaces of the trace layer 4264 opposite to each other along the stacking direction. Illustratively, the cover film 428 is adhered to the two surfaces of the trace layer 4264 disposed opposite thereto by an adhesive 429. In order to ensure that the cover film 428 and the wiring layer 4264 are firmly bonded, the adhesive 429 cannot be made too thin, and therefore, the thickness h of the deformed portion 420 is difficult to be reduced, resulting in a large reaction force for movement of the deformed portion 420.
With continued reference to fig. 7, 8 and equation (1) above, for ease of description, the dimension of the cover layer 427 in the stacking direction will now be defined as the thickness d of the cover layer 427 1 The dimension of the wiring layer 4264 in the lamination direction is defined as the thickness d of the wiring layer 4264 2 。
Compared with the prior art, the deformation part 420 of the application adopts the coating layer 427 made of photosensitive polyimide, and the coating layer 427 is not required to be bonded with the medium layer 426 by an adhesive 429, thus the thickness d of the coating layer 427 1 The thickness h of the deformation part 420 is reduced by one third, the elastic modulus E of the deformation part 420 is reduced by 1 time, and based on the reduction, the movement counterforce of the deformation part 420 is reduced by 4 times. In addition, compared with the prior art, the anti-shake mechanism 400 of the application has more compact structure, smaller occupied space and wider application range.
While ensuring the compactness of the anti-shake mechanism 400, the cover layer 427 needs to be effectively insulated from moisture and dust, so as to prevent the wiring layer 4264 from being oxidized and damaged, and further improve the service life of the anti-shake mechanism 400. Thus, in an embodiment of the present application, the thickness d of the cover layer 427 1 A thickness d of the wiring layer 4264 or more 2 。
In some of these implementations, the thickness d of the cover layer 427 1 Is more than or equal to 3 mu m, ensures anti-shakeThe mechanism 400 is compact and the service life of the anti-shake mechanism 400 is further improved. For example, the thickness d of the cover layer 427 1 Is 3 μm, for example, the thickness d of the cover layer 427 1 Is 4 μm, for example, the thickness d of the cover layer 427 1 Is 5 μm.
In summary, the anti-shake mechanism provided by the application has the advantages that the stress relief mechanism is arranged at the deformation part, so that the stress can be relieved when the deformation part deforms along the Z-axis direction, the deformation part is prevented from interfering with other parts, and the moving counter force of the anti-shake mechanism and the power consumption of a motor are further reduced. Meanwhile, the cover layer of the deformation part is made of photosensitive polyimide material, so that the thickness of the deformation part is effectively reduced, the moving counter force of the anti-shake mechanism is further reduced, the anti-shake mechanism is compact in structure and wide in application range.
Claims (10)
1. An anti-shake mechanism is characterized by comprising a mounting part and a deformation part;
the mounting part can move along a first direction or a second direction;
the deformation part is arranged around the mounting part in a surrounding manner, the deformation part is erected along a third direction, the deformation part comprises a first part and a second part which are connected, the first part extends along the first direction, and the second part extends along the second direction;
the first part is provided with a first stress relief structure, the second part is provided with a second stress relief structure, the first stress relief structure is used for relieving stress when the first part deforms along the third direction, and the second stress relief structure is used for relieving stress when the second part deforms along the third direction;
the first stress relief structure comprises a row of first holes arranged at intervals along a first direction, each first hole is arranged at intervals with a first side edge of the first part, and the hole wall of each first hole can be broken to form a notch on the first side edge, so that stress is relieved when the first part deforms along a third direction.
2. The anti-shake mechanism of claim 1 wherein the first stress relief structure comprises at least two rows of first apertures each spaced along the first direction, the first apertures of any adjacent two rows being staggered in the third direction.
3. The anti-shake mechanism of claim 1, wherein the second stress relief structure includes a row of second apertures spaced apart along the second direction.
4. The anti-shake mechanism of claim 1 wherein the second stress relief structure comprises at least two rows of second apertures spaced apart along the second direction, the second apertures of any adjacent two rows being staggered in the third direction.
5. The anti-shake mechanism of any of claims 1-4, wherein the second stress relief structure is disposed proximate an edge of the second portion.
6. The anti-shake mechanism according to any one of claims 1 to 4, wherein the deformation portion includes a dielectric layer and a cover layer that are stacked, wherein the dielectric layer includes a first surface and a second surface that are disposed opposite to each other in a stacking direction, the first surface and the second surface being provided with the cover layer, respectively, the cover layer being made of photosensitive polyimide.
7. The anti-shake mechanism according to claim 6, wherein the dielectric layer includes a substrate and wiring layers arranged along the stacking direction, the wiring layers being respectively arranged on the surfaces of the substrate along the stacking direction;
the thickness of the covering layer is larger than or equal to that of the wiring layer.
8. The anti-shake mechanism according to any one of claims 1 to 4, wherein the deformation portion is an FPC.
9. A camera module comprising a lens, a chip assembly, a motor, and the anti-shake mechanism of any one of claims 1 to 8;
the chip component is arranged opposite to the lens in the optical axis direction of the lens, the motor is used for driving the anti-shake mechanism, and the anti-shake mechanism can drive the chip component to move relative to the lens.
10. An electronic device comprising the camera module of claim 9.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311470221.0A CN117676335A (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
| CN202211262907.6A CN116033267B (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
| PCT/CN2023/114714 WO2024078152A1 (en) | 2022-10-13 | 2023-08-24 | Anti-shake mechanism, camera module, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211262907.6A CN116033267B (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311470221.0A Division CN117676335A (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116033267A CN116033267A (en) | 2023-04-28 |
| CN116033267B true CN116033267B (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211262907.6A Active CN116033267B (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
| CN202311470221.0A Pending CN117676335A (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311470221.0A Pending CN117676335A (en) | 2022-10-13 | 2022-10-13 | Anti-shake mechanism, camera module and electronic equipment |
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| Country | Link |
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| CN (2) | CN116033267B (en) |
| WO (1) | WO2024078152A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116033267B (en) * | 2022-10-13 | 2023-10-24 | 荣耀终端有限公司 | Anti-shake mechanism, camera module and electronic equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2024078152A1 (en) | 2024-04-18 |
| CN117676335A (en) | 2024-03-08 |
| CN116033267A (en) | 2023-04-28 |
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