CN213028255U - Circuit structure of photosensitive chip, camera module and electronic equipment - Google Patents
Circuit structure of photosensitive chip, camera module and electronic equipment Download PDFInfo
- Publication number
- CN213028255U CN213028255U CN202022110976.8U CN202022110976U CN213028255U CN 213028255 U CN213028255 U CN 213028255U CN 202022110976 U CN202022110976 U CN 202022110976U CN 213028255 U CN213028255 U CN 213028255U
- Authority
- CN
- China
- Prior art keywords
- photosensitive chip
- deformation
- camera module
- chip
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Adjustment Of Camera Lenses (AREA)
- Studio Devices (AREA)
Abstract
The utility model discloses a circuit structure and camera module and electronic equipment of sensitization chip, the circuit structure of sensitization chip, include: the flexible circuit board comprises a first connecting part, a second connecting part and a deformation part, wherein the deformation part is continuously bent to form an enclosing structure or a semi-enclosing structure; the first connecting part is provided with a plurality of first connecting ports, the second connecting part is provided with a plurality of second connecting ports, and a circuit for communicating the first connecting ports with the second connecting ports is arranged in the flexible circuit board; and the photosensitive chip is connected to the second connecting part and is electrically connected with the second connecting port. The utility model discloses a circuit structure of sensitization chip, it can produce the removal demand that warp in order to adapt to a plurality of not equidirectionals of sensitization chip in a plurality of directions.
Description
Technical Field
The utility model relates to an electron field, in particular to photosensitive chip's circuit structure and camera module and electronic equipment.
Background
In order to realize the anti-shake function of the camera module, a mode of driving the photosensitive chip to move so as to perform anti-shake compensation can be adopted; the photosensitive chip in the camera module needs to be supplied with power from the outside and also needs to transmit sensing signal data to the outside, so that the photosensitive chip needs to be electrically connected with other external parts by a circuit connection structure; when the drive sensitization chip removes and carries out the anti-shake, conventional circuit connection structure can restrict the motion of sensitization chip to a certain extent, and this not only makes sensitization chip need great drive moment to drive, is unfavorable for anti-shake actuating device's miniaturization, also causes electric connection structure's pine easily to take a photograph of taking a photograph taking part in the long-term use in addition and takes off to cause the trouble for camera module.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, for this reason, the utility model provides a photosensitive chip's circuit structure, it can produce the removal demand that warp in order to adapt to a plurality of not equidirectionals of photosensitive chip in a plurality of directions.
The utility model discloses still provide a camera module and electronic equipment of circuit structure with sensitization chip.
According to the utility model discloses a circuit structure of sensitization chip of first aspect embodiment, include:
the flexible circuit board comprises a first connecting part, a second connecting part and a deformation part, wherein the deformation part is continuously bent to form a surrounding structure or a semi-surrounding structure, the first connecting part and the second connecting part are respectively arranged at two ends of the deformation part, the deformation part is perpendicular to the second connecting part, and the second connecting part is positioned below the inner side of the surrounding structure or the semi-surrounding structure; the flexible printed circuit board comprises a flexible printed circuit board and a first connecting part, wherein the first connecting part is provided with a plurality of first connecting ports, the second connecting part is provided with a plurality of second connecting ports, and a circuit for communicating the first connecting ports with the second connecting ports is arranged in the flexible printed circuit board;
and the photosensitive chip is connected to the second connecting part and is electrically connected with the second connecting port.
According to the utility model discloses a circuit structure of sensitization chip of the embodiment of first aspect has following beneficial effect at least: the flexible circuit board can be simultaneously connected with an external circuit inlet and a photosensitive chip through the first connecting port on the first connecting part and the second connecting port on the second connecting part, so that power supply to the photosensitive chip or the photosensitive chip is electrically connected with the outside, signal transmission and the like are realized; with the help of the deformation portion, because the deformation portion is the surrounding structure or the semi-surrounding structure of continuous bending, at each crease position of bending, can make between two adjacent parts of crease use the crease as the pivot to carry out relative rotation, and continuous bending, the quantity of crease will have a plurality ofly, consequently when connecting in the first connecting portion of deformation portion one end fixed, the second connecting portion will have a plurality of degrees of freedom in order to adapt to the not equidirectional removal demand of photosensitive chip.
According to the utility model discloses the circuit structure of sensitization chip of some embodiments, first connecting portion perpendicular to deformation portion, and be located deformation portion keeps away from one side of sensitization chip.
According to the utility model discloses the circuit structure of sensitization chip of some embodiments, be provided with the terminal connecting seat on the first connecting portion, first connection port set up in the terminal connecting seat.
According to the utility model discloses the circuit structure of sensitization chip of some embodiments, flexible circuit board is including first insulating layer, circuit layer and second insulating layer, the circuit layer is located between first insulating layer and the second insulating layer, the second insulating layer with sensitization chip laminating, the circuit layer corresponds the position at second connecting portion edge is provided with a plurality of sheetmetals, the second insulating layer corresponds the position of sheetmetal is provided with the breach, so that the sheetmetal exposes flexible circuit board and forms second connection port.
According to the utility model discloses some embodiment's photosensitive chip's circuit structure, the deformation portion is buckled into C shape twice in succession.
According to the utility model discloses a camera module of second aspect embodiment, including the circuit structure and the anti-shake actuating device of the sensitization chip of above-mentioned first aspect embodiment, anti-shake actuating device connects sensitization chip.
According to the utility model discloses a camera module of second aspect embodiment has following beneficial effect at least: through adopting the circuit structure of the sensitization chip that above-mentioned first aspect was implemented, when the anti-shake actuating device drive sensitization chip in the camera module removed, can make the deformation portion follow the motion of sensitization chip and produce corresponding deformation to avoid the circuit structure of sensitization chip to cause the hindrance and influence the formation of image effect to the motion of sensitization chip.
According to the utility model discloses a camera module of some embodiments, still including base plate, lens subassembly and anti-shake actuating device, the lens subassembly erects the base plate top, the deformation portion is followed the side profile of lens subassembly is around setting up, the second connecting portion with the sensitization chip is located between base plate and the lens subassembly, anti-shake actuating device is used for the drive sensitization chip is at the perpendicular to remove in the plane of lens subassembly optical axis.
According to the utility model discloses a camera module of some embodiments, still including bearing the frame, it connects to bear the frame on the base plate, the lens subassembly is connected bear on the frame, bear the frame with form between the base plate and hold the chamber, the second connecting portion with photosensitive chip is located hold the intracavity, it is provided with the wiring mouth to bear on the frame, the second connecting portion are connected the one end of deformation portion is passed the wiring mouth.
According to the utility model discloses a camera module of some embodiments, first connecting portion connect the one end of deformation portion with base plate fixed connection.
According to the electronic device of the third aspect embodiment of the present invention, the camera module of the second aspect embodiment is included.
According to the utility model discloses an electronic equipment of third aspect embodiment has following beneficial effect at least: through adopting the camera module of above-mentioned second aspect implementation, when anti-shake actuating device drive sensitization chip moved, can make the flexible circuit board follow the motion by the driver part and produce corresponding deformation to avoid sensitization chip's circuit structure, restrict sensitization chip's motion, and avoid appearing the pine between sensitization chip's circuit structure and the external part in long-term use and take off, and then make electronic equipment break down.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a circuit structure of a photosensitive chip according to some embodiments of the present invention;
fig. 2 is an exploded schematic diagram of a circuit structure of a photo sensor chip according to some embodiments of the present invention;
fig. 3 is an exploded schematic view of a camera module according to some embodiments of the present invention;
fig. 4 is a schematic diagram of a connection structure between a circuit structure of a photosensitive chip and a carrier plate according to some embodiments of the present invention.
Reference numerals:
the flexible circuit board 10, the photosensitive chip 20, the substrate 30, the lens assembly 40, the carrier 50, and the anti-shake actuator 60;
a first connection part 110, a first connection port 111, a second connection part 120, a second connection port 121, a deformation part 130, a fold 131; a wire-routing opening 510.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 and 2, the circuit structure of the photosensitive chip according to the embodiment of the first aspect of the present invention includes a flexible circuit board 10 and a photosensitive chip 20. The flexible circuit board 10 includes a first connection portion 110, a second connection portion 120 and a deformation portion 130, the deformation portion 130 is continuously bent to form a surrounding structure or a semi-surrounding structure, the first connection portion 110 and the second connection portion 120 are respectively disposed at two ends of the deformation portion 130, the deformation portion 130 is perpendicular to the second connection portion 120, and the second connection portion 120 is located below the inner side of the surrounding structure or the semi-surrounding structure; the first connecting portion 110 is provided with a plurality of first connecting ports 111, the second connecting portion 120 is provided with a plurality of second connecting ports 121, and the flexible circuit board 10 is internally provided with a circuit for communicating the first connecting ports 111 and the second connecting ports 121. The photosensitive chip 20 is connected to the second connection portion 120 and electrically connected to the second connection port 121.
Through the first connection port 111 on the first connection portion 110 and the second connection port 121 on the second connection portion 120, the flexible circuit board 10 can be simultaneously connected to the external circuit and the photosensitive chip 20, so that power supply to the photosensitive chip 20 is realized, or the photosensitive chip 20 is electrically connected to the outside, so that signal transmission and the like are realized; with the aid of the deformation portion 130, since the deformation portion 130 has a continuous bending surrounding structure or a semi-surrounding structure, at the position of each bending crease 131, two adjacent portions of the crease 131 can rotate relative to each other with the crease 131 as a rotation axis, and the number of the creases 131 can be continuously bent, so that when the first connection portion 110 connected to one end of the deformation portion 130 is fixed, with the aid of the continuous bending structure of the deformation portion 130, the second connection portion 120 has multiple degrees of freedom to adapt to the moving requirements of the photosensitive chip 20 in different directions, particularly the moving requirements of the second connection portion 120 in two directions of the plane.
In some embodiments of the present invention, the first connecting portion 110 is perpendicular to the deformation portion 130 and is located on a side of the deformation portion 130 away from the photosensitive chip 20; since the photosensitive chip 20 is disposed on the second connection portion 120, the second connection portion 120 is perpendicular to the deformation portion 130, and thus the first connection portion 110 is parallel to the second connection portion 120; in the camera module, the optical axis direction of the lens is perpendicular to the photosensitive chip 20, i.e. the optical axis will be perpendicular to the second connecting portion 120 and parallel to the deformation portion 130, and the first connecting portion 110 is set to be perpendicular to the deformation portion 130, i.e. the first connecting portion 110 is perpendicular to the optical axis of the lens, so that the size of the camera module in the optical axis direction is favorably reduced, and the camera module is favorably made smaller and thinner.
In some embodiments of the present invention, in order to facilitate connection with an external circuit, the first connection portion 110 is provided with a terminal connection seat, and the first connection port 111 is disposed in the terminal connection seat; specifically, the terminal connection socket may be configured as a female connection socket, or alternatively, may be configured as a male connection socket, so that the terminal connection socket may be connected to an external circuit in a manner of being inserted into each other.
In some embodiments of the present invention, the flexible circuit board 10 includes a first insulating layer, a circuit layer and a second insulating layer, the circuit layer is located between the first insulating layer and the second insulating layer, the second insulating layer is attached to the photosensitive chip 20, a plurality of metal sheets are disposed at positions of the circuit layer corresponding to the edges of the second connecting portions 120, and notches are disposed at positions of the second insulating layer corresponding to the metal sheets, so that the metal sheets are exposed out of the flexible circuit board 10 to form the second connecting port 121; a third connection port is arranged on one surface of the photosensitive chip 20, which is attached to the second connection portion 120, the third connection port and the second connection port 121 are arranged in a one-to-one correspondence manner, and the third connection port and each metal sheet are connected and conducted one by one in a welding manner.
In some embodiments of the present invention, the deformation portion 130 is bent into a C shape twice in succession; in the anti-shake process, the anti-shake compensation can be realized by driving the photosensitive chip 20 to move in the plane perpendicular to the optical axis direction, and the deformation portion 130 can generate two degrees of freedom by continuously bending into a C shape twice, so as to be matched with the movement of the photosensitive chip 20. Of course, in some other embodiments, the deformation portion 130 may be bent three or more times continuously, and the deformation portion 130 may be bent to form a frame-shaped surrounding structure, as long as at least two degrees of freedom are available to accommodate the movement of the photosensitive chip 20.
In some embodiments of the present invention, the first connection portion 110, the deformation portion 130, and the second connection portion 120 are integrally formed by bending the single flexible circuit board 10 for multiple times; by integrally molding the first connection portion 110, the deformation portion 130, and the second connection portion 120, the circuit structure on the flexible circuit board 10 can be simplified; of course, in other embodiments, the first connection portion 110, the deformation portion 130, and the second connection portion 120 may be manufactured separately and then connected to each other.
Referring to fig. 3 and 4, a camera module according to an embodiment of the present invention is described below, wherein the camera module includes the circuit structure of the photosensitive chip according to the first embodiment and an anti-shake actuator 60, and the anti-shake actuator 60 is connected to the photosensitive chip 20. By adopting the circuit structure of the photosensitive chip implemented in the first aspect, when the anti-shake actuator 60 in the imaging module drives the photosensitive chip 20 to move, the deformation portion 130 can be deformed correspondingly following the movement of the photosensitive chip 20, so as to avoid the circuit structure of the photosensitive chip from hindering the movement of the photosensitive chip 20 and affecting the imaging effect.
In some embodiments of the present invention, the camera module further includes a substrate 30 and a lens assembly 40, the lens assembly 40 is erected above the substrate 30, the deformation portion 130 is disposed around the side profile of the lens assembly 40, and a gap exists between the deformation portion 130 and the lens assembly 40 to prevent the lens assembly 40 from affecting the deformation rotation of the deformation portion 130; the second connecting portion 120 and the photosensitive chip 20 are located between the substrate 30 and the lens assembly 40, and the anti-shake actuator 60 is configured to drive the photosensitive chip 20 to move in a plane perpendicular to the optical axis of the lens assembly 40. By disposing the deformation portion 130 around the side profile of the lens assembly 40, the size of the lens assembly 40 in the direction perpendicular to the optical axis can be effectively reduced, which is further advantageous for miniaturization of the camera module.
In some embodiments of the present invention, in order to fix the lens assembly 40 in the camera module, the camera module further includes a bearing frame 50, the bearing frame 50 is connected to the substrate 30, the lens assembly 40 is connected to the bearing frame 50, so that the lens assembly 40 can be suspended above the substrate 30 through the bearing frame 50. And, specifically, a receiving cavity is formed between the carrier 50 and the substrate 30, and the second connecting portion 120 and the photosensitive chip 20 are located in the receiving cavity to avoid the carrier 50 from affecting the movement of the photosensitive chip 20; meanwhile, in order to simplify the circuit structure for routing, specifically, the carrier 50 is provided with a routing port 510, and one end of the second connecting portion 120 connected to the deformation portion 130 passes through the routing port 510.
In some embodiments of the present invention, the first connection portion 110 connects one end of the deformation portion 130 with the substrate 30, and the end of the first connection portion 110 provided with the first connection port 111 extends to the outside of the substrate 30, so as to fix the flexible circuit board 10 and facilitate the connection of the first connection port 111 with an external circuit.
In some embodiments of the present invention, the anti-shake actuator 60 is disposed inside the accommodating cavity, and includes a movable plate, a fixed plate and an SMA wire, the fixed plate is disposed on the substrate 30, the movable plate is disposed between the lens module 40 and the fixed plate, an elastic arm is disposed on the movable plate, a free end of the elastic arm is connected to the fixed plate, one end of the SMA wire is connected to the fixed plate, the other end of the SMA wire is connected to the movable plate, and the SMA wire can drive the movable plate to move in a plane perpendicular to an optical axis of the lens module when being electrified and contracted; the second connecting portion 120 is fixedly connected to the movable plate. When the SMA wire is electrified and contracted, the SMA wire drives the movable plate to move, and the photosensitive chip 20 can be driven to move in a plane perpendicular to the optical axis of the lens module, so that the photosensitive chip 20 and the lens assembly 40 generate relative movement to realize anti-shake compensation.
An electronic device according to a third aspect of the present invention, including the camera module according to the second aspect of the present invention, is described below. Through adopting the camera module of above-mentioned second aspect implementation, when anti-shake actuating device 60 drive sensitization chip 20 motion, can make flexible circuit board 10 follow the motion of driven part and produce corresponding deformation to avoid sensitization chip's circuit structure to restrict sensitization chip 20's motion, and avoid appearing the pine between sensitization chip's circuit structure and the external part in long-term use process and take off, and then make electronic equipment break down.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. Circuit structure of sensitization chip, its characterized in that includes:
the flexible circuit board comprises a first connecting part, a second connecting part and a deformation part, wherein the deformation part is continuously bent to form a surrounding structure or a semi-surrounding structure, the first connecting part and the second connecting part are respectively arranged at two ends of the deformation part, the deformation part is perpendicular to the second connecting part, and the second connecting part is positioned below the inner side of the surrounding structure or the semi-surrounding structure; the flexible printed circuit board comprises a flexible printed circuit board and a first connecting part, wherein the first connecting part is provided with a plurality of first connecting ports, the second connecting part is provided with a plurality of second connecting ports, and a circuit for communicating the first connecting ports with the second connecting ports is arranged in the flexible printed circuit board;
and the photosensitive chip is connected to the second connecting part and is electrically connected with the second connecting port.
2. The circuit structure of the photosensitive chip of claim 1, wherein the first connecting portion is perpendicular to the deformation portion and located on a side of the deformation portion away from the photosensitive chip.
3. The circuit structure of a photosensitive chip according to claim 1, wherein the first connecting portion is provided with a terminal connecting seat, and the first connecting port is provided in the terminal connecting seat.
4. The circuit structure of the photosensitive chip as claimed in claim 1, wherein the flexible printed circuit board includes a first insulating layer, a circuit layer and a second insulating layer, the circuit layer is located between the first insulating layer and the second insulating layer, the second insulating layer is attached to the photosensitive chip, a plurality of metal sheets are disposed on the circuit layer at positions corresponding to the edges of the second connecting portions, and notches are disposed on the second insulating layer at positions corresponding to the metal sheets, so that the metal sheets are exposed out of the flexible printed circuit board to form a second connecting port.
5. The circuit structure of the photosensitive chip of any one of claims 1 to 4, wherein the deformation portion is bent into a C-shape twice in succession.
6. The camera module is characterized by comprising a circuit structure of the photosensitive chip of any one of claims 1 to 5 and an anti-shake actuating device, wherein the anti-shake actuating device is connected with the photosensitive chip.
7. The camera module of claim 6, further comprising a substrate and a lens assembly, wherein the lens assembly is disposed above the substrate, the deformation portion is disposed around a side profile of the lens assembly, the second connecting portion and the photosensitive chip are disposed between the substrate and the lens assembly, and the anti-shake actuator is configured to drive the photosensitive chip to move in a plane perpendicular to an optical axis of the lens assembly.
8. The camera module of claim 7, further comprising a carrier, wherein the carrier is connected to the substrate, the lens assembly is connected to the carrier, a receiving cavity is formed between the carrier and the substrate, the second connecting portion and the photo sensor chip are located in the receiving cavity, the carrier is provided with a wire trace opening, and one end of the second connecting portion, which is connected to the deformation portion, penetrates through the wire trace opening.
9. The camera module according to claim 7, wherein one end of the first connecting portion, which is connected to the deformation portion, is fixedly connected to the substrate.
10. An electronic device characterized by comprising the camera module of any one of claims 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022110976.8U CN213028255U (en) | 2020-09-23 | 2020-09-23 | Circuit structure of photosensitive chip, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022110976.8U CN213028255U (en) | 2020-09-23 | 2020-09-23 | Circuit structure of photosensitive chip, camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028255U true CN213028255U (en) | 2021-04-20 |
Family
ID=75479178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022110976.8U Active CN213028255U (en) | 2020-09-23 | 2020-09-23 | Circuit structure of photosensitive chip, camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213028255U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660404A (en) * | 2021-08-24 | 2021-11-16 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115484363A (en) * | 2021-06-16 | 2022-12-16 | 宁波舜宇光电信息有限公司 | Photosensitive chip anti-shake device, camera module and terminal equipment |
| WO2023284276A1 (en) * | 2021-07-14 | 2023-01-19 | 高瞻创新科技有限公司 | Elastic circuit board |
| WO2023036295A1 (en) * | 2021-09-10 | 2023-03-16 | 宁波舜宇光电信息有限公司 | Circuit board for camera module and corresponding camera module |
| CN115811642A (en) * | 2021-09-10 | 2023-03-17 | 宁波舜宇光电信息有限公司 | Camera shooting module |
| CN116033267A (en) * | 2022-10-13 | 2023-04-28 | 荣耀终端有限公司 | Anti-shake mechanism, camera module and electronic equipment |
| WO2024055743A1 (en) * | 2022-09-15 | 2024-03-21 | Oppo广东移动通信有限公司 | Camera module and electronic device |
-
2020
- 2020-09-23 CN CN202022110976.8U patent/CN213028255U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484363A (en) * | 2021-06-16 | 2022-12-16 | 宁波舜宇光电信息有限公司 | Photosensitive chip anti-shake device, camera module and terminal equipment |
| WO2023284276A1 (en) * | 2021-07-14 | 2023-01-19 | 高瞻创新科技有限公司 | Elastic circuit board |
| CN113660404A (en) * | 2021-08-24 | 2021-11-16 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113660404B (en) * | 2021-08-24 | 2023-11-24 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| WO2023036295A1 (en) * | 2021-09-10 | 2023-03-16 | 宁波舜宇光电信息有限公司 | Circuit board for camera module and corresponding camera module |
| CN115811642A (en) * | 2021-09-10 | 2023-03-17 | 宁波舜宇光电信息有限公司 | Camera shooting module |
| WO2024055743A1 (en) * | 2022-09-15 | 2024-03-21 | Oppo广东移动通信有限公司 | Camera module and electronic device |
| CN116033267A (en) * | 2022-10-13 | 2023-04-28 | 荣耀终端有限公司 | Anti-shake mechanism, camera module and electronic equipment |
| CN116033267B (en) * | 2022-10-13 | 2023-10-24 | 荣耀终端有限公司 | Anti-shake mechanism, camera module and electronic equipment |
| WO2024078152A1 (en) * | 2022-10-13 | 2024-04-18 | 荣耀终端有限公司 | Anti-shake mechanism, camera module, and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213028255U (en) | Circuit structure of photosensitive chip, camera module and electronic equipment | |
| JP6995862B2 (en) | Camera module and mobile terminal | |
| JP2023513638A (en) | Camera modules and electronic devices | |
| CN207926732U (en) | Camera module and electronic device | |
| US8432486B2 (en) | Heat dissipating structure for an imaging unit | |
| WO2022105748A1 (en) | Sma motor, camera module and electronic device | |
| CN213028217U (en) | Camera module and electronic equipment with same | |
| CN108808295A (en) | Vehicle-mounted vidicon | |
| JP2010183271A (en) | Electronic device | |
| WO2021258999A1 (en) | Camera module and electronic device | |
| CN212463346U (en) | Lens module | |
| WO2023284276A1 (en) | Elastic circuit board | |
| CN213276090U (en) | SMA actuator, camera module having the same, and electronic apparatus | |
| US20190058835A1 (en) | Imaging device | |
| CN212086313U (en) | Camera module and electronic equipment | |
| CN114363495A (en) | Camera module with anti-shake and focusing functions | |
| CN213028705U (en) | Flexible circuit board, camera module with same and electronic equipment | |
| CN213960147U (en) | Flexible circuit board structure and camera module | |
| JP2021152609A (en) | Imaging apparatus and vehicle | |
| CN110191262A (en) | The optical camera to be installed on vehicle | |
| CN213876259U (en) | Circuit structure of optical anti-shake device and camera module | |
| CN220307288U (en) | Movable circuit element, movable electronic photosensitive module, camera module and electronic device | |
| CN218041524U (en) | Camera module and terminal equipment | |
| CN213279875U (en) | Anti-shake actuating device and camera module | |
| CN218830008U (en) | Electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210721 Address after: 523062 Room 301, building 4, No. 7, Xinhe Shengfeng Road, Wanjiang street, Dongguan City, Guangdong Province Patentee after: Guangdong haideya Technology Co.,Ltd. Address before: 523062 3rd floor, building D, No. 12, Shengfeng Road, Xinhe community venture industrial park, Wanjiang District, Dongguan City, Guangdong Province Patentee before: DONGGUAN YADENG ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right |