WO2024055743A1

WO2024055743A1 - Camera module and electronic device

Info

Publication number: WO2024055743A1
Application number: PCT/CN2023/107767
Authority: WO
Inventors: 谢仲; 杨松; 门凯
Original assignee: Oppo广东移动通信有限公司
Priority date: 2022-09-15
Filing date: 2023-07-17
Publication date: 2024-03-21
Also published as: CN218162616U

Abstract

A camera module and an electronic device. The camera module comprises: a support plate; a first circuit board disposed on the support plate; a photosensitive chip disposed on the first circuit board; and a second circuit board, comprising a first sub-board, a second sub-board, and a third sub-board, wherein the second sub-board is connected between the first sub-board and the third sub-board, and the first sub-board and the third sub-board are bent with respect to each other by means of the second sub-board, the second sub-board is fixedly connected to the support plate, the first sub-board is connected to the first circuit board, and the third sub-board is configured to connect to a control component.

Description

Camera modules and electronic equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on September 15, 2022, with the application number 202222464126.7 and the invention name "A camera module and electronic device", the entire content of which is incorporated into this application by reference. middle.

Technical field

This application relates to the field of camera technology, and in particular to a camera module and electronic equipment.

Background technique

With the continuous popularization of electronic devices, electronic devices have become indispensable social tools and entertainment tools in people's daily lives, and people's requirements for electronic devices are getting higher and higher. Taking mobile terminals as an example, in order to meet people's needs for taking pictures, some mobile terminal manufacturers such as mobile phones use the OIS (Optical Image Stabilization) motor built into the mobile phone to drive the movement of the camera module built into the mobile phone to achieve anti-shake protection for the built-in camera of the mobile phone. jitter function.

Contents of the invention

This application provides a camera module and electronic equipment that can solve the problem of the photosensitive chip tilting during movement.

In the first aspect, this application provides a camera module, including:

load-bearing plate;

A first circuit board, arranged on the carrier board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip, the first circuit board and the carrier board can move along the lens perpendicular to the camera module. movement in the direction of the optical axis; and

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is bent to each other through the second sub-board. The second sub-board is also fixedly connected to the carrier board. The first sub-board is connected to the first circuit board. The third daughter board is used to connect the control components.

In the second aspect, this application provides a camera module, including:

Anti-shake assembly, the anti-shake assembly includes an upper bracket, a lower bracket and a driving part, the driving part connects the upper bracket and the lower bracket, the driving part can drive the lower bracket relative to the upper bracket Move along the optical axis direction perpendicular to the lens of the camera module;

The first circuit board is fixed on the lower bracket;

A photosensitive chip is provided on the first circuit board and can convert the acquired optical signal into an electrical signal;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-boards are arranged to be bent to each other through the second sub-boards, the first sub-boards are connected to the first circuit board, and the third sub-boards are used to connect control components; and

A connecting piece. One end of the connecting piece is fixedly connected to the lower bracket, and the other end of the connecting piece is fixedly connected to the second daughter board.

In a third aspect, this application provides a camera module, including:

first circuit board;

A photosensitive chip, arranged on the first circuit board, capable of converting the acquired light signal into an electrical signal, wherein the photosensitive chip and the first circuit board are capable of moving along an optical axis direction perpendicular to the lens of the camera module;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is bent to each other through the second sub-board, the first sub-board is connected to the first circuit board, and the third sub-board is used to connect the control component; and

The connecting piece is at least partially attached to the second sub-board to limit the deformation of the second sub-board during the movement of the first circuit board.

In a fourth aspect, this application provides an electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

Loading plate;

A first circuit board, arranged on the carrier board;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is bent to each other through the second sub-board. The second sub-board is also fixedly connected to the carrier board. The first sub-board is connected to the first circuit board. The third daughter board is connected to the control component.

In a fifth aspect, the application provides an electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

The first circuit board is fixed on the lower bracket;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is arranged by bending each other through the second sub-board, the first sub-board is connected to the first circuit board, and the third sub-board is connected to the control component; and

In a sixth aspect, the application provides an electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

first circuit board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip and the first circuit board can move along the optical axis direction perpendicular to the lens of the camera module. ;

Description of drawings

In order to explain the technical solutions in the embodiments of the present application more clearly, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

For a more complete understanding of the present application and its beneficial effects, the following description will be made in conjunction with the accompanying drawings, wherein the same reference numerals refer to the same parts in the following description.

Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Figure 2 is a first structural schematic diagram of a camera module provided by an embodiment of the present application.

Figure 3 is an exploded view of the camera module shown in Figure 1.

FIG. 4 is a schematic structural diagram of the base, the bearing component and the first driving component in FIG. 3 .

Figure 5 is a schematic structural diagram of the base, anti-shake assembly and bearing plate in Figure 3.

Figure 6 is a schematic structural diagram of the anti-shake component and optical filter in Figure 5.

Figure 7 is a schematic structural diagram of the anti-shake component in Figure 6.

FIG. 8 is an exploded view of the anti-shake assembly shown in FIG. 7 .

Fig. 9 is a schematic structural diagram of the driving member and the upper bracket in Fig. 8.

Figure 10 is a schematic structural diagram of the connection between the carrier board, the first circuit board and the second circuit board provided by the embodiment of the present application.

FIG. 11 is a schematic structural diagram of the connection between the first circuit board, the carrier board and the second circuit board in FIG. 10 .

Figure 12 is a schematic structural diagram of the carrier plate and optical filter in Figure 10.

Figure 13 is an exploded view of the structure shown in Figure 4.

Figure 14 is a second structural schematic diagram of a camera module provided by an embodiment of the present application.

Figure 15 is a second structural schematic diagram of an anti-shake component provided by an embodiment of the present application.

Figure 16 is a schematic structural diagram of the connecting piece provided by the embodiment of the present application when it is installed on the second circuit board.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of this application.

Embodiments of the present application provide a camera module and electronic equipment, which can solve the problem of the photosensitive chip tilting during movement. This will be explained below with reference to the accompanying drawings.

It will be understood that as used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive/transmit via wired line connections and/or via wireless communication networks such as cellular networks, wireless local area networks, etc. A device for communicating signals. Examples of mobile terminals include, but are not limited to, cellular telephones as well as conventional laptop and/or palmtop receivers or other electronic devices including radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 100 provided in the embodiment of the present application may specifically be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The following description takes a mobile phone as an example. As shown in FIG. 1 , the electronic device 100 may include a housing 10 , a camera module 20 and a display screen 30 . The display screen 30 is disposed on the casing 10 and can be used to display images. The camera module 20 can be disposed on the casing 10 and can receive light from the external environment to capture images.

Please refer to Figures 2 to 4. Figure 2 is a first structural schematic diagram of a camera module provided by an embodiment of the present application. Figure 3 is an exploded view of the camera module shown in Figure 1. Figure 4 is a view of the base and the camera module shown in Figure 3. Structural diagram of the load-bearing component and the first driving component. Among them, the optical filter 202 has not been installed on the carrier plate 28 in FIG. 3 . The camera module 20 may include a base 21, a lens 22, a carrying component 23, a first driving component 24, a photosensitive chip 25 and an anti-shake component 26. Among them, the base 21 is provided with an installation space 211. The bearing component 23 and the first driving component 24 are arranged in the installation space 211 of the base 21. The lens 22 is arranged on the bearing component 23. The first driving component 24 drives the bearing component 23 in a vertical direction. Moving in the direction of the optical axis of the lens 22 can drive the lens 22 to move to achieve the anti-shake function of the lens 22 of the camera module 20 . The photosensitive chip 25 is arranged on one side of the anti-shake component 26 and is opposite to the lens 22 in a direction parallel to the optical axis of the lens 22 . The photosensitive chip 25 can convert the acquired optical signal into an electrical signal. Among them, the photosensitive chip 25 is disposed on the first circuit board 27. It can be understood that the first circuit board 27 can be a printed circuit board, and the first circuit board 27 can realize the transmission of current and signals, so that the first circuit board 25 can be disposed on the first circuit board 27. The components on board 27 are functioning properly.

The anti-shake component 26 is used to drive the first circuit board 27 and the photosensitive chip 25 to move in a plane perpendicular to the optical axis direction of the lens 22 , thereby realizing the anti-shake function of the photosensitive chip 25 of the camera module 20 . In this way, dual anti-shake of the photosensitive chip 25 and the lens 22 is achieved by arranging the anti-shake component 26 and the first driving component 24 . In this embodiment, the camera module 20 can be used to implement functions of the electronic device 100 such as taking pictures, recording videos, unlocking by face recognition, and scanning QR codes for payment. In addition, it is necessary It should be noted that the camera module 20 may be a rear camera or a front camera, which is not limited in this embodiment.

Specifically, the material of the lens 22 may be glass or plastic. The lens 22 is mainly used to change the propagation path of light and focus the light. The lens 22 may include multiple sets of lenses that correct each other and filter light. When the light passes through the lens 22, the multiple sets of lenses filter stray light (such as infrared light) layer by layer to increase the imaging effect of the camera module 20. The photosensitive chip 25 may specifically be an image sensor such as CCD (Charge Coupled Device) or an image sensor such as CMOS (Complementary Metal Oxide Semiconductor). The photosensitive chip 25 can be arranged opposite the lens 22 in the optical axis direction of the camera module 20 (that is, the optical axis direction of the lens 22), and is mainly used to receive the light collected from the lens 22 and convert the optical signal into an electrical signal. , in order to realize the imaging requirements of the camera module 20. The anti-shake component 26 and the first driving component 24 are mainly used to improve the imaging effect of the camera module 20 due to user shake during use, so that the imaging effect of the photosensitive chip 25 can meet the user's needs.

Based on optical anti-shake technology, sensors such as gyroscopes or accelerometers of the electronic device 100 (or the camera module 20 ) can detect the shake of the lens 22 to generate a shake signal, and transmit the shake signal to the electronic device 100 and/or the camera. The processing chip of the module 20 , the electronic device 100 and/or the processing chip of the camera module 20 can calculate the displacement amount that the anti-shake component 26 and the first driving component 24 need to compensate, so that the first driving component 24 can adjust the lens 22 The lens 22 is compensated for the jitter direction and its displacement. The anti-shake component 26 can compensate the photosensitive chip 25 according to the jitter direction and its displacement of the photosensitive chip 25, thereby improving the camera module 20's jitter caused by the user during use. The resulting imaging effect.

It should be noted that in related technologies, some mobile terminals use dual drive mechanisms to control the movement of the lens and the photosensitive chip respectively to achieve lens anti-shake and photosensitive chip anti-shake. The dual drive mechanism is usually arranged in the base. When the dual drive mechanism is working, it is easy to interfere with each other.

Based on this, please refer to Figures 3 and 4. In the camera module 20 provided by the embodiment of the present application, the bearing component 23 and the first driving component 24 for anti-shake of the lens 22 are arranged in the installation space 211 of the base 21. The anti-shake component 26 for anti-shake of the photosensitive chip 25 is arranged outside the installation space 211 of the base 21 , that is, the carrying component 23 and the first driving component 24 are in different spaces from the anti-shake component 26 , and there is a gap between them. The relatively independent movement space can prevent the first driving component 24, the carrying component 23 and the anti-shake component 26 from intersecting or overlapping during the movement, thus avoiding interference between some components in the camera module 20, such as Interference between the anti-shake component 26, the first driving component 24 and the carrying component 23 is avoided. Moreover, when the anti-shake component 26 drives the first circuit board 27 and the photosensitive chip 25 to move, the photosensitive chip 25 will not interfere with the first driving component 24 or the carrying component 23 .

It should also be noted that in the related art, since the dual driving mechanisms are usually arranged in the base, in order to solve the interference problem, it is usually necessary to increase the volume of the base to have a larger accommodation space for the dual driving mechanisms to operate without interfering with each other. It moves downwards, and the volume of the camera module mainly depends on the volume of the base. This results in a larger volume of the camera module.

In the camera module 20 provided by the embodiment of the present application, the anti-shake component 26 is arranged outside the installation space 211 of the base 21. In this way, the interference between the anti-shake component 26 and the components in the base 21 can be avoided, such as preventing the anti-shake component from interfering with the components in the base 21. The component 26 interferes with the first driving component 24 and the bearing component 23 in the base 21, and there is no need to increase the size of the base 21 to prevent the anti-shake component 26 from interfering with other components in the base 21. In this way, The overall size of the base 21 can be made smaller to achieve a miniaturized design of the camera module 20 . Moreover, the independent design of the anti-shake component 26 also facilitates the independent selection and independent assembly of the anti-shake component 26, which is more practical.

It can be understood that the anti-shake component 26 is disposed outside the installation space 211 , and may be connected to the base 21 or other components of the camera module 20 . Please refer to Figures 5 to 7. Figure 5 is a schematic structural diagram of the base, anti-shake component and load-bearing plate in Figure 3. Figure 6 is a schematic structural diagram of the anti-shake component and optical filter in Figure 5. Figure 7 is a schematic diagram of the anti-shake component in Figure 6. Schematic diagram of the structure of the dither component. It can be understood that the optical filter 202 is installed on the carrier plate 28 in FIG. 5 . The anti-shake assembly 26 may include an upper bracket 261, a lower bracket 262 and a driving member 263. The upper bracket 261 is connected to the base 21. 261 is connected to the base 21 to realize that the anti-shake component 26 is arranged outside the installation space 211 of the base 21 .

The lower bracket 262 is located on the side of the upper bracket 261 away from the base 21. The upper bracket 261 and the lower bracket 262 are spaced apart in the direction of the optical axis of the lens 22, in order to maintain the relative distance between the upper bracket 261 and the lower bracket 262, or in order to make the upper bracket 261 and the lower bracket 262 spaced apart. The bracket 261 is in a suspended state. The anti-shake assembly 26 also includes a connecting spring (not shown). The connecting spring is connected between the upper bracket 261 and the lower bracket 262. It can be understood that the connecting spring has a certain degree of flexibility, so that it does not The movement of the lower bracket 262 relative to the upper bracket 261 is hindered.

It can be understood that the driving member 263 connects the upper bracket 261 and the lower bracket 262, so that the lower bracket 262 can be driven by the driving member 263 to move relative to the upper bracket 261 in a direction perpendicular to the optical axis of the lens 22.

Please refer to Figure 3. The first circuit board 27 is fixedly provided on the lower bracket 262. It can be understood that the camera module 20 can also include a bearing plate 28. The bearing plate 28 is fixed on the side of the lower bracket 262 away from the upper bracket 261. At this time, the first circuit board 27 can be fixed on the side of the carrier plate 28 away from the lower bracket 262 . In this way, driven by the driving member 263 , the lower bracket 262 can drive the first circuit board 27 and the carrier plate 28 to move together. Among them, a filter 202 (as shown in FIG. 5 ) can be disposed on the carrier plate 28 to filter the light introduced by the lens.

It can be understood that in order not to prevent light from entering the photosensitive chip 25 on the first circuit board 27, both the upper bracket 261 and the lower bracket 262 are provided with light-transmitting holes for light to enter the photosensitive chip 25, and the photosensitive chip 25 will capture the light. The optical signal is converted into an electrical signal.

It can also be understood that, relative to the camera module 20 , the movement directions associated therewith usually include the X direction, the Y direction and the Z direction, where the Z direction is the direction of the optical axis of the lens 22 , and the X direction and the Y direction are perpendicular to each other. and perpendicular to the Z direction.

In order to explain the structure of the driving member 263 more clearly, please refer to Fig. 8 and Fig. 9 in conjunction with Fig. 7. Fig. 8 is an exploded view of the anti-shake assembly shown in Fig. 7. Fig. 9 is a view of the driving member and the upper bracket in Fig. 8. Structural diagram, it can be understood that Figure 9 only illustrates the relative positional relationship between the driving member and the upper bracket. The driving member 263 that drives the lower bracket 262 to move may include a deformation part 2631. The deformation part 2631 connects the upper bracket 261 and the lower bracket 262. The deformation part 2631 may deform to drive the lower bracket 262 relative to the upper bracket 261 along the light direction perpendicular to the lens 22. The movement in the axial direction drives the photosensitive chip 25 to move in the direction perpendicular to the optical axis of the lens 22 (including the X direction and/or the Y direction), thereby realizing the optical anti-shake function of the photosensitive chip 25 . Exemplarily, one end of the deformation part 2631 is connected to the upper bracket 261, and the other end of the deformation part 2631 is connected to the lower bracket 262. The deformation part 2631 can deform in the energized state to drive the lower bracket 262 in a direction perpendicular to the upper bracket 261. The optical axis direction of the lens 22 moves. Among them, the deformation part 2631 can be made of shape memory alloys (Shape Memory Alloys, SMA). When the shape memory alloy is energized, the shape memory alloy can be heated and deformed. During deformation, the length of the deformation part 2631 can be changed. , thereby driving the lower bracket 262 connected thereto to move, thereby realizing the anti-shake function of the photosensitive chip 25 . For example, conductive pins 2621 may be provided on the lower bracket 262, and the conductive pins 2621 are electrically connected to the deformation part 2631. Therefore, the current can be guided to the deformation part 2631 through the conductive pin 2621 to realize the deformation of the deformation part 2631, thereby controlling the movement of the lower bracket 262 and thereby controlling the movement of the photosensitive chip 25.

Exemplarily, the driving members 263 may be provided in multiples, such as four, wherein two driving members 263 are disposed opposite each other in the first direction and are substantially symmetrical with respect to the lens 22 , and the other two driving members 263 are in the second direction. The first direction and the second direction are perpendicular to each other and are perpendicular to the optical axis direction of the lens 22 . For example, the first direction is the X direction and the second direction is the Y direction. Four drives The pieces 263 are enclosed into a square-like shape. In this way, the movement of the lower bracket 262 can be realized through the mutual cooperation of the four driving parts 263 .

Please refer to FIGS. 2 and 3 in conjunction with FIG. 6 . In order to control the operation of the driving member 263 , the conductive pins 2621 on the lower bracket 262 are electrically connected to the first circuit board 27 . When the lower bracket 262 needs to be driven to move, the driving member 263 can be energized through the first circuit board 27, and the length of the deformation portion 2631 of the driving member 263 changes, thereby driving the lower bracket 262 connected to it to move, and the lower bracket 262 moves relative to the upper bracket 262. When the bracket 261 moves, the circuit board 27 and the photosensitive chip 25 also move together.

It can be understood that please refer to FIG. 10 , which is a schematic structural diagram of the connection between the carrier board, the first circuit board and the second circuit board provided by the embodiment of the present application. It can be understood that the optical filter 202 is provided on the carrier plate 28 . The camera module 20 may also include a second circuit board 29. The first circuit board 27 may be electrically connected to the control component through the second circuit board 29. For example, the first circuit board 27 may be electrically connected to the electronic device 100 through the second circuit board 29. The main processor is electrically connected.

The second circuit board 29 may be a flexible circuit board. It should be noted that in the related art, a printed circuit board equipped with a photosensitive chip is connected to a flexible circuit board, and the flexible circuit board is partially bent and then extended to connect with external components of the camera module. During the movement of the printed circuit board, the bent part of the flexible circuit board will generate a force acting on the printed circuit board. When the force is too large, the printed circuit board will tilt, causing the photosensitive chip to tilt.

Based on this, in some embodiments of the present application, please refer to Figures 10 to 12 together. Figure 11 is a schematic structural diagram of the connection between the first circuit board, the carrier board and the second circuit board in Figure 10. Figure 12 is a schematic diagram of the connection between the first circuit board, the carrier board and the second circuit board in Figure 10. Schematic diagram of the structure of the carrier plate and filter. The second circuit board 29 may include a first sub-board 291, a second sub-board 292 and a third sub-board 293. The second sub-board 292 connects the first sub-board 291 and the third sub-board 293, and the first sub-board 291 and The third sub-board 293 is arranged to be bent to each other through the second sub-board 292. The first sub-board 291 is connected to the first circuit board 27, and the third sub-board 293 is used to connect the control component. In this way, the electrical connection between the second circuit board 29 and the control component can be facilitated. For example, the third daughter board 293 may be electrically connected to the main processor of the electronic device 100 .

Moreover, the second sub-board 292 is also fixedly connected to the carrying plate 28 . It can prevent the second sub-board 292 in the second circuit board 29 from being deformed, or from being greatly deformed, during the movement of the first circuit board 27 and the photosensitive chip 25. In this way, the second sub-board 292 can be prevented from being deformed. When an excessive force is generated, the first circuit board 27 is tilted, thereby preventing the photosensitive chip 25 from tilting.

In order to facilitate the fixed connection between the load-bearing board 28 and the second sub-board 292, the load-bearing board 28 may include a board body 281 and a connection structure 282. The first circuit board 27 is provided on the board body 281, and the connection structure 282 is connected to the board body 281. The connection structure 282 Protruding from the side of the board body 281 facing the second sub-board 292 , the connecting structure 282 is fixedly connected to the second sub-board 292 . In this way, through the fixed connection between the connection structure 282 and the second sub-board 292, it is possible to prevent the second sub-board 292 in the second circuit board 29 from deforming during the movement of the first circuit board 27 and the photosensitive chip 25, or When the second sub-board 292 is deformed, excessive force is generated to prevent the first circuit board 27 from tilting, thereby preventing the photosensitive chip 25 from tilting.

The second sub-board 292 may include an arc surface 2921, the connection structure 282 includes a first fitting surface 2821, and the arc surface 2921 is fixedly connected to the first fitting surface 2821. Through the mutual cooperation between the arc surface 2921 and the first fitting surface 2821, the second sub-board 292 and the connection structure 282 can be fitted more closely. For example, the arc surface 2921 and the first fitting surface 2821 may be fixedly connected through an adhesive layer. For example, glue can be applied on the first bonding surface 2821 or the arcuate surface 2921, and then the first bonding surface 2821 and the arcuate surface 2921 are bonded to each other.

The radius of the arcuate surface 2921 ranges from 0.5 mm to 1.5 mm. This radius range of the arcuate surface 2921 coupled with the connection between the arcuate surface 2921 and the first fitting surface 2821 can further prevent the second sub-board 292 from being moved during the movement of the first circuit board 27 and the photosensitive chip 25 . Deformation occurs, or in other words, the second sub-plate 292 can be more effectively restricted from large deformation.

In order to facilitate the fixed connection between the arcuate surface 2921 and the first fitting surface 2821, in the normal direction perpendicular to the arcuate surface 2921, the length of the arcuate surface 2921 is less than or equal to the length of the first fitting surface 2821, that is, the first The length of the first fitting surface 2821 is larger, thus better ensuring that the arcuate surface 2921 can be completely fixed to the first fitting surface 2821.

It can be understood that the connection structure 282 may include a second fitting surface 2822 connected to the first fitting surface 2821, and the second fitting surface 2822 is fixedly connected to the third sub-board 293. That is, the connection structure 282 is not only connected to the second sub-board 292, but also connected to the third sub-board 293. In this way, the connection strength between the connection structure 282 and the second circuit board 29 can be improved to better prevent the third sub-board 292 from being damaged. The second sub-plate 292 is deformed.

Further, the connection structure 282 includes a third fitting surface 2823 connected to the first fitting surface 2821, and the first fitting surface 2821 is located between the second fitting surface 2822 and the third fitting surface 2823. Joint surface 2823 and first sub-plate 291 Fixed connection. That is, the connection structure 282 is connected to the first sub-board 291, the second sub-board 292 and the third sub-board 293. In this way, the connection strength between the connection structure 282 and the second circuit board 29 can be further improved to better The second sub-board 292 is prevented from deforming.

It can be understood that the first sub-board 291 and the third sub-board 293 can be substantially vertical, and the third sub-board 293 surrounds the base 21 and is fixedly connected to the base 21. The third sub-board 293 can also be connected to the components in the base 21. Electrical connection, such as electrical connection with the first driving component 24 in the base 21, the camera module 20 may also include a third circuit board 203, one end of the third circuit board 203 is electrically connected to the third sub-board 293, the third circuit board The other end of 203 can be extended to be electrically connected to the main processor of the electronic device 100 to achieve conduction of signals and current. Wherein, the third circuit board 203 may be a flexible circuit board.

It can also be understood that there may be two second circuit boards 29 , the first circuit board 27 includes a first side 272 and a second side 273 that are oppositely arranged, and a second circuit board 29 is connected to the first side. 272, another second circuit board 29 is connected to the second side 273. By providing two second circuit boards 29, more circuit connections can be achieved. It can be understood that the second sub-boards 292 in each second circuit board 29 are respectively fixedly connected to the carrier board 28. For the specific connection structure 282, refer to the above description about the fixed connection of the second sub-boards 292 to the carrier board 28. This article The application will not be described in detail here.

In some embodiments, the second sub-board 292 of the second circuit board 29 may not be fixedly connected to the bearing plate 28 , but may be fixedly connected to the lower bracket 262 in the anti-shake assembly. For example, please refer to FIG. 15 and combine Figures 11 and 15 are schematic structural diagrams of a second type of anti-shake component provided by embodiments of the present application. The camera module 20 may include a connecting member 2901 , one end of the connecting member 2901 is fixedly connected to the lower bracket 262 , and the other end of the connecting member 2901 is fixedly connected to the second sub-board 292 in the second circuit board 29 . It can be understood that the specific structure of the connecting member 2901 may refer to the above description about the connecting structure 282 in the load-bearing plate 28 .

In some embodiments, the second sub-board 292 of the second circuit board 29 may not be connected to the carrier plate 28 or the lower bracket 262. For example, please refer to FIG. 16. FIG. 16 shows a connection piece provided by an embodiment of the present application installed on the Structural diagram of the second circuit board. The camera module 20 may include a connecting piece 2902, which is at least partially attached to the second sub-board 292 to limit the deformation of the second sub-board 292 during the movement of the first circuit board 27. The connecting piece 2902 can be attached to the second sub-board 292 through an adhesive layer. It can be understood that the connecting piece 2902 can be a steel piece, and the steel piece is attached to the second sub-plate 292. Since the steel piece has a certain stiffness, when the second sub-plate 292 is attached to the steel piece, the steel piece can limit the second sub-plate 292. The sub-board 292 is deformed, or in other words, the second sub-board 292 is prevented from being greatly deformed. In this way, excessive force is generated when the second sub-board 292 is deformed, causing the first circuit board 27 to tilt, so that the first circuit board 27 can be tilted. Prevent the photosensitive chip 25 from tilting.

It can be understood that the lower bracket 262 can move under the driving of the driving member 263. In order to enable the lower bracket 262 to move more accurately, the camera module 20 can also include a Hall sensor 271. The Hall sensor 271 is disposed on the first On the circuit board 27 , the base 21 is provided with support legs 212 opposite to the Hall sensor 271 . The support legs 212 are provided with magnets, and the magnets are arranged opposite to the Hall sensor 271 . In this way, when the first circuit board 27 moves along with the lower bracket 262 When moving, the relative position between the Hall sensor 271 and the magnet also changes, so the magnetic flux received by the Hall sensor 271 also changes accordingly and outputs a corresponding signal. In this way, the main processor of the electronic device 100 can according to the Hall sensor 271. The signal output by the sensor 271 accurately calculates the displacement of the lower bracket 262, thereby accurately controlling the movement of the lower bracket 262 to improve the anti-shake accuracy of the photosensitive chip 25.

For example, the base 21 is roughly a square structure, and the support legs 212 can be provided with four, and the four support legs 212 are respectively provided at the four corners of the base 21. It can be understood that the Hall sensor 271 can be provided with three. There are three corresponding magnets. Of course, the number of Hall sensors 271 can also be set at four. At this time, the number of magnets is also correspondingly set at four.

In order to explain the structure of the anti-shake assembly 26 more clearly, the specific structures of the upper bracket 261 and the lower bracket 262 in the anti-shake assembly and their cooperation with other structural components in the camera module 20 will be described below with reference to the drawings. Give a detailed explanation.

Referring to FIGS. 5 and 6 , the upper bracket 261 in the anti-shake assembly 26 is connected to the base 21 to secure the anti-shake assembly 26 to the base 21 . It can be understood that the base 21 includes a connecting bottom surface 213 opposite to the upper bracket 261. The connecting bottom surface 213 is provided with a raised portion 214 protruding toward the upper bracket 261. The connecting bottom surface 213 and the raised portion 214 are connected to the upper bracket 261. The upper bracket 261 is fixed to the base 21 .

The upper bracket 261 may include a connecting body 2611. The connecting body 2611 includes a first part 26111, a connecting part 26112 and a second part 26113. The first part 26111 has a first connecting surface 261111 that is opposite to the bottom surface of the protruding part 214. The connecting surface 261111 is connected to the bottom surface of the protruding part 214. For example, the first connecting surface 261111 and the bottom surface of the protruding part 214 can be fixedly connected through glue.

The connecting part 26112 is connected to the edge of the first part 26111 and is bent in a direction close to the base 21. The second part 26113 is connected to the connecting part 26112. The second part 26113 has a second connecting surface opposite to the connecting bottom surface 213 of the base 21. 261131. The second connection surface 261131 is connected to the connection bottom surface 213 of the base 21. For example, the second connection surface 261131 and the connection bottom surface 213 of the base 21 can be fixedly connected through glue.

In this way, the connecting body 2611 of the upper bracket 261 forms a structure that is concave downward along the optical axis direction of the lens 22. The first part 26111 of the connecting body 2611 is further away from the base 21 than the second part 26113 of the connecting body 2611, while the lower bracket 262 is located on the side of the upper bracket 261 facing the photosensitive chip 25, that is, the lower bracket 262 is located below the first part 26111 in the direction of the optical axis of the lens 22. This structure allows the lower bracket 262 to be further away from the installation space 211 of the base 21. components to further prevent the lower bracket 262 from interfering with the base 21 or components within the base 21 during movement.

It should be noted that all directional indications (such as up, down, left, right, front, and back) in the embodiments of the present application are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture. , if the specific posture changes, the directional indication also changes accordingly.

The upper bracket 261 can be made of metal, and the recessed structure connecting the body 2611 can be formed by stamping.

It should be noted that the anti-shake component 26 usually needs to be limited during movement. In the related art, the wall of the base is usually used as a limiting structure to limit the anti-shake component. That is, when the anti-shake component is in contact with the wall of the base, When the anti-shake component collides with the wall of the base, it is limited by the wall of the base. When the anti-shake component collides with the wall of the base for a large number of times, the base is easily damaged.

Based on this, please refer to Figures 7 and 8. The upper bracket 261 can also include a first limiting portion 2612. The first limiting portion 2612 is connected to the connecting body 2611. The free end of the first limiting portion 2612 faces away from the base 21. The direction is bent, and the first limiting portion 2612 is used to limit the lower bracket 262 . It can be understood that when the lower bracket 262 moves to abut the first limiting part 2612, the lower bracket 262 is limited by the first limiting part 2612. By providing the first limiting portion 2612 on the upper bracket 261, the lower bracket 262 can be limited and the lower bracket 262 can be prevented from colliding with the base 21.

Among them, the first limiting part 2612 can be made of metal. In this way, the first limiting part 2612 can be effectively prevented from being damaged by the lower bracket 262 and generating debris, and the debris can be prevented from affecting the normal operation of other parts of the camera module 20. For example, when debris is scattered to the photosensitive chip 25, the final formed image will have a shadow, affecting the quality of the generated image.

It can be understood that two first limiting portions can be provided in the first direction (or X direction), and the two first limiting portions are spaced apart. The lower bracket 262 can have two first limiting portions in the first direction. When the lower bracket 262 moves to abut the first limiting portion in the first direction, it can be limited by the first limiting portion in the first direction. For ease of understanding, the two first limiting portions spaced apart along the first direction are named the first sub-limiting portion 2612a and the second sub-limiting portion 2612b. The lower bracket 262 can be located between the first sub-limiting portion 2612a and the second sub-limiting portion 2612b. There is movement between the two sub-limiting parts 2612b. When the lower bracket 262 moves to abut the first sub-limiting part 2612a or the second sub-limiting part 2612b, it can be limited.

Of course, two first limiting portions can also be provided in the second direction (or Y direction). The two first limiting portions are spaced apart. The lower bracket 262 can be positioned between the two first limiting portions in the second direction. When the lower bracket 262 moves to abut the first limiting portion in the second direction, it can be limited by the first limiting portion in the second direction. For ease of understanding, the two first limiting portions spaced apart along the second direction (or Y direction) are named third sub-limiting portions. 2612c and the fourth sub-limiting part 2612d. The lower bracket 262 can move between the third sub-limiting part 2612c and the fourth sub-limiting part 2612d. The lower bracket 262 moves to be in contact with the third sub-limiting part 2612c and the fourth sub-limiting part 2612d. When the sub-limiting portions 2612d are in contact with each other, they can be limited.

Among them, in order to better limit the position of the lower bracket 262, the lower bracket 262 may include a bracket body 2622 and a second limiting part 2623. The second limiting part 2623 is connected to the bracket body 2622, and the second limiting part 2623 is free. The end is bent in a direction close to the upper bracket 261 , and the second limiting portion 2623 is used to cooperate with the first limiting portion 2612 to limit the relative positional relationship between the upper bracket 261 and the lower bracket 262 . By providing the second limiting portion 2623 on the lower bracket 262, it can better cooperate with the first limiting portion 2612 of the upper bracket 261 to limit the relative positional relationship between the upper bracket 261 and the lower bracket 262.

It can be understood that the number and arrangement position of the second limiting parts 2623 correspond to the number and arrangement position of the first limiting parts 2612. For example, the second limiting part 2623 includes fifth sub-limiting parts 2623a and sixth sub-limiting parts 2623b arranged at intervals along the first direction (or X direction). The fifth limiting part 2623a is different from the first sub-limiting part 2623a. The sixth sub-limiting part 2623b cooperates with the second sub-limiting part 2612b. The second limiting part may also include seventh sub-limiting parts 2623c and eighth sub-limiting parts 2623d spaced apart along the second direction (or Y direction). The seventh sub-limiting part 2623c and the third sub-limiting part 2623c are The eighth sub-limiting portion 2623d cooperates with the fourth sub-limiting portion 2612d.

The second limiting part 2623 may be made of metal.

The above is an introduction to the specific structure of the anti-shake component 26 and the components that match it. Next, the load-bearing component 23 and the first driver that drive the lens 22 of the camera module 20 to move to achieve the anti-shake function of the lens 22 will be combined with the drawings. The specific structure of the assembly 24 and the components cooperating with the bearing assembly 23 and the first driving assembly 24 are described in detail.

Please refer to Figure 13 in conjunction with Figure 4. Figure 13 is an exploded view of the structure shown in Figure 4. It can be understood that the bearing component 23 and the first driving component 24 are disposed in the installation space 211 of the base 21 . The carrying component 23 is used to carry the lens 22 of the camera module 20 , and the first driving component 24 is used to drive the carrying component 23 to move in a direction perpendicular to the optical axis of the lens 22 , thereby driving the lens 22 to move in a direction perpendicular to the optical axis of the lens 22 , to compensate for the shake of the lens 22, thereby achieving anti-shake of the lens 22.

The carrying component 23 includes a first carrier 231. The first carrier 231 is used to carry the lens 22. The first carrier 231 is configured to move along the first direction (or X direction) in the installation space 211 of the base 21. A driving assembly 24 includes a first magnetic component 241 and a first conductive component 242. One of the first magnetic component 241 and the first conductive component 242 is disposed on the first carrier 231, and the other is disposed on the base 21, such as the first The magnetic member 241 is provided on the first carrier 231, and the first conductive member 242 is provided on the base 21. The base 21 may be provided with a first installation groove 215 for installing the first conductive member 242. The first conductive member 242 is installed on the first In the mounting groove 215 , the first conductive member 242 can cooperate with the first magnetic member 241 in the energized state to enable the first carrier 231 to move in a first direction, where the first direction is perpendicular to the optical axis direction of the lens 22 . It can be understood that the first magnetic component 241 and the first conductive component 242 are arranged oppositely in the first direction (or X direction). Based on Fleming's left-hand rule, the first conductive component 242 can generate a magnetic field after being energized. The magnetic field generated by a conductive member 242 can interact with the magnetic field of the first magnetic member 241 to generate a first force (or magnetic force) perpendicular to the optical axis direction of the lens 22. The first force acts on the first The carrier 231 drives the first carrier 231 to move in a direction perpendicular to the optical axis of the lens 22 to compensate for the shake of the lens 22 in a direction perpendicular to the optical axis of the lens 22 .

It can be understood that the direction of the first force can be changed by controlling the direction of the current of the first conductive member 242 .

The first conductive member 242 may be a coil, which is electrically connected to the first circuit board 27, and the first circuit board 27 controls the on and off of the coil current to control whether the first carrier 231 moves. Of course, the coil may also be electrically connected to the main processor of the electronic device 100 through the third circuit board 203.

Of course, in some embodiments, the first magnetic component 241 may also be disposed on the base 21 and the first conductive component 242 may be disposed on the first carrier 231, which is not limited in this application.

By arranging one of the first magnetic element 241 and the first conductive element 242 on the first carrier 231, the other one is As for the base 21, the structure of the base 21 and the first carrier 231 can be fully utilized, thereby saving the installation space 211 of the base 21 to a certain extent, and achieving a miniaturized design of the camera module 20.

The carrying component 23 may also include a second carrier 232. The second carrier 232 is disposed on the side of the first carrier 231 facing the photosensitive chip 25. The first carrier 231 can move along the first direction (or X direction) on the second carrier 232. The second carrier 232 plays the role of carrying the first carrier 231. In order to facilitate the first carrier 231 to move in the first direction (or X direction) on the second carrier 232, the first carrier 231 and the second carrier 232 can move. The first ball 234 is disposed between the two carriers 232. The first carrier 231 can move in the first direction based on the rolling of the first ball 234. It can be understood that the first carrier 231 and the second carrier 232 can be provided with mating Limiting structure, so that the first carrier 231 can move in the first direction on the second carrier 232 without moving in the second direction (or Y direction) relative to the second carrier 232, where the second direction is vertical in the first direction and the optical axis direction of the lens 22 .

Exemplarily, the limiting structures on the first carrier 231 and the second carrier 232 that cooperate with each other may be limiting grooves and limiting protrusions, such as a limiting structure provided on the side of the first carrier 231 facing the second carrier 232 groove, a limiting protrusion corresponding to the limiting groove is provided on the second carrier 232, wherein the limiting groove has a space for the limiting protruding part to move in the first direction, and part of the groove wall of the limiting groove is in contact with the The limiting protrusion cooperates so that the limiting protrusion cannot move in the second direction in the limiting groove, so that the first carrier 231 can move in the first direction on the second carrier 232 without being relative to the second carrier. 232 moves along the second direction. It can be understood that at this time, if the first carrier 231 receives a force along the second direction, due to the interaction between the limiting groove and the limiting protrusion, the first carrier 231 and the second carrier 232 move together in the second direction.

It can be understood that the first driving component 24 is also used to drive the first carrier 231 and the second carrier 232 to move together in the second direction (or Y direction). At this time, the first driving component 24 may also include a second magnetic member 243 and the second conductive member 244, one of the second magnetic member 243 and the second conductive member 244 is provided on the first carrier 231, and the other is provided on the base 21, such as, the second magnetic member 243 is provided on the first carrier 231. The carrier 231 and the second conductive member 244 are provided on the base 21. The base 21 may be provided with a second installation slot 216 for installing the second conductive member 244. The second conductive member 244 is installed in the second installation slot 216. The conductive member 244 can cooperate with the second magnetic member 243 in the energized state, so that the first carrier 231 and the second carrier 232 can move together in the second direction. It can be understood that the second magnetic member 243 and the second conductive member 244 are arranged oppositely in the second direction (or Y direction). Based on Fleming's left-hand rule, the second conductive member 244 can generate a magnetic field after being energized. The magnetic field generated by the two conductive members 244 can interact with the magnetic field of the second magnetic member 243 to generate a second force (or magnetic force) along the second direction. The second force acts on the first carrier 231. It is understood that when the first carrier 231 receives a force along the second direction, due to the interaction between the limiting groove and the limiting protrusion, the first carrier 231 and the second carrier 232 move together in the second direction, so that the first carrier 231 and the second carrier 232 move together in the second direction. A carrier 231 drives the second carrier 232 to move along the second direction to compensate for the shake of the lens 22 in the second direction.

It can also be understood that the direction of the second force can be changed by controlling the direction of the current in the second conductive member 244 .

The second conductive member 244 may be a coil, and the coil may be electrically connected to the first circuit board 27 through the second circuit board 29. The first circuit board 27 controls the switching of the coil current to control the first carrier 231 and the second carrier 231. Whether the carriers 232 move together in the second direction. Of course, the coil can also be electrically connected to the main processor of the electronic device 100 through the third circuit board 203 .

Of course, in some embodiments, the second magnetic member 243 may also be provided on the base 21 and the second conductive member 244 may be provided on the first carrier 231, which is not limited in this application.

In order to facilitate the movement of the first carrier 231 and the second carrier 232 in the second direction, the bearing assembly 23 may also include a third carrier 233. The third carrier 233 is disposed in the base 21, and the second carrier 232 is carried on the third carrier. 233, a second ball 235 is disposed between the second carrier 232 and the third carrier, and the second carrier 232 can move in the second direction based on the rolling of the second ball 235.

In order to facilitate understanding of the movement process of the lens 22 , the movement process of the lens 22 will be introduced in detail below.

When it is necessary to achieve anti-shake of the lens 22 in the first direction (or X direction), the first conductive member 242 can be energized through the first circuit board 27, and the first conductive member 242 can generate a magnetic field in the energized state. the magnetic field produced It interacts with the magnetic field of the first magnetic member 241 to generate thrust on the first carrier 231, thereby driving the first carrier 231 to move in the first direction (or X direction). When the first carrier 231 moves, it can drive the lens 22 together. Move in the first direction (or X direction) to compensate for the shake of the lens 22 in the first direction.

When it is necessary to achieve anti-shake of the lens 22 in the second direction (or Y direction), the second conductive component 244 can be energized through the first circuit board 27, and the second conductive component 244 can generate a magnetic field when it is energized. The generated magnetic field interacts with the magnetic field of the second magnetic member 243 to generate thrust on the first carrier 231, thereby driving the first carrier 231 to drive the second carrier 232 to move together in the second direction (or Y direction). The first carrier 231 When the second carrier 232 moves, the lens 22 can be driven to move in the second direction (or Y direction) together, thereby compensating for the shake of the lens 22 in the second direction.

It can be understood that in order to protect the above-mentioned components, such as the base 21, the carrying component 23, the first driving component 24, the photosensitive chip 25, the anti-shake component 26 and the first circuit board 27, please refer to Figure 14 , Figure 14 is a second structural schematic diagram of a camera module provided by an embodiment of the present application. The camera module 20 may also include a housing 201. The base 21, the carrying component 23, the first driving component 24, the photosensitive chip 25, the anti-shake component 26, the first circuit board 27 and other components may be accommodated in the housing 201, wherein the camera The module 20 can be installed at a desired installation location through the housing 201, such as on the housing 10 of a mobile phone.

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

In the description of this application, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more features.

The above is a detailed introduction to the camera module and electronic equipment provided by the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. Methods and their core ideas; at the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. In summary, the content of this specification should not be understood as an infringement of this application. limits.

Claims

A camera module including:

load-bearing plate;

A first circuit board, arranged on the carrier board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip, the first circuit board and the carrier board can move along the lens perpendicular to the camera module. movement in the direction of the optical axis; and

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is bent to each other through the second sub-board. The second sub-board is also fixedly connected to the carrier board. The first sub-board is connected to the first circuit board. The third daughter board is used to connect the control components.
The camera module according to claim 1, wherein the load-bearing plate includes a plate body and a connecting structure, the connecting structure is connected to the plate body, and the connecting structure protrudes from the plate body toward the first On the side where the second sub-board is located, the connection structure is fixedly connected to the second sub-board, and the first circuit board is arranged on the board body.
The camera module according to claim 2, wherein the second sub-board includes an arc surface, the connection structure includes a first fitting surface, and the arc surface is fixedly connected to the first fitting surface. .
The camera module according to claim 3, wherein the arc surface and the first bonding surface are fixedly connected through an adhesive layer.
The camera module according to claim 3, wherein in a normal direction perpendicular to the arcuate surface, the length of the arcuate surface is less than or equal to the length of the first fitting surface.
The camera module according to claim 3, wherein the radius of the arc surface ranges from 0.5 mm to 1.5 mm.
The camera module according to claim 3, wherein the connection structure includes a second fitting surface connected to the first fitting surface, and the second fitting surface is fixedly connected to the third daughter board. .
The camera module according to claim 7, wherein the connection structure includes a third fitting surface connected to the first fitting surface, and the first fitting surface is located on the second fitting surface. and the third bonding surface, the third bonding surface is fixedly connected to the first sub-board.
The camera module according to claim 1, wherein there are two second circuit boards, the first circuit board includes a first side and a second side arranged oppositely, and one second circuit board The board is connected to the first side, the other second circuit board is connected to the second side, and the second sub-board in each second circuit board is fixedly connected to the carrier board respectively. .
The camera module according to claim 1, wherein the camera module further includes an anti-shake component, the anti-shake component is used to drive the carrier plate and the first circuit board to move.
The camera module according to claim 10, wherein the camera module further includes:

A base, the base is provided with an installation space;

A carrying component, disposed in the installation space, used to carry the lens of the camera module; and

A first driving component, disposed in the installation space, is used to drive the carrying component to move in a direction perpendicular to the optical axis of the lens;

Wherein, the anti-shake module is arranged outside the installation space.
The camera module according to claim 11, wherein the anti-shake module includes:

Upper bracket, the upper bracket is connected to the base;

a lower bracket, the lower bracket is located on the side of the upper bracket facing the photosensitive element, and the bearing plate is provided on the side of the lower bracket facing away from the upper bracket; and

Driving part, the driving part connects the upper bracket and the lower bracket, and the driving part can drive the lower bracket Move relative to the upper bracket in a direction perpendicular to the optical axis of the lens.
The camera module according to claim 12, wherein the base includes a connecting bottom surface, and the connecting bottom surface is provided with a protruding portion protruding toward the upper bracket;

The upper bracket includes:

The connection body includes:

The first part has a first connecting surface, and the first connecting surface is connected to the bottom surface of the raised portion;

A connecting part, which is connected to the edge of the first part and bent in a direction close to the base; and

The second part is connected to the connecting part, the second part has a second connecting surface, and the second connecting surface is connected to the connecting bottom surface.
The camera module according to claim 13, wherein the upper bracket further includes a first limiting part, the first limiting part is connected to the connecting body, and the free end of the first limiting part faces toward It is bent away from the base.
The camera module according to claim 14, wherein the lower bracket includes:

stent body; and

A second limiting part, the second limiting part is connected to the bracket body, the free end of the second limiting part is bent in a direction close to the upper bracket, the second limiting part is It cooperates with the first limiting portion to limit the relative positional relationship between the upper bracket and the lower bracket.
A camera module including:

Anti-shake assembly, the anti-shake assembly includes an upper bracket, a lower bracket and a driving part, the driving part connects the upper bracket and the lower bracket, the driving part can drive the lower bracket relative to the upper bracket Move along the optical axis direction perpendicular to the lens of the camera module;

The first circuit board is fixed on the lower bracket;

A photosensitive chip is provided on the first circuit board and can convert the acquired optical signal into an electrical signal;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-boards are arranged to be bent to each other through the second sub-boards, the first sub-boards are connected to the first circuit board, and the third sub-boards are used to connect control components; and

A connecting piece. One end of the connecting piece is fixedly connected to the lower bracket, and the other end of the connecting piece is fixedly connected to the second daughter board.
A camera module including:

first circuit board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip and the first circuit board can move along the optical axis direction perpendicular to the lens of the camera module. ;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-boards are arranged to be bent to each other through the second sub-boards, the first sub-boards are connected to the first circuit board, and the third sub-boards are used to connect control components; and

The connecting piece is at least partially attached to the second sub-board to limit the deformation of the second sub-board during the movement of the first circuit board.
An electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

load-bearing plate;

A first circuit board, arranged on the carrier board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip, the first circuit board and the carrier board can move along the lens perpendicular to the camera module. moves in the direction of the optical axis; and

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is bent to each other through the second sub-board. The second sub-board is also fixedly connected to the carrier board. The first sub-board is connected to the first circuit board. The third daughter board is connected to the control component.
An electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

Anti-shake assembly, the anti-shake assembly includes an upper bracket, a lower bracket and a driving part, the driving part connects the upper bracket and the lower bracket, the driving part can drive the lower bracket relative to the upper bracket Move along the optical axis direction perpendicular to the lens of the camera module;

The first circuit board is fixed on the lower bracket;

A photosensitive chip is provided on the first circuit board and can convert the acquired optical signal into an electrical signal;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is arranged by bending each other through the second sub-board, the first sub-board is connected to the first circuit board, and the third sub-board is connected to the control component; and

A connecting piece. One end of the connecting piece is fixedly connected to the lower bracket, and the other end of the connecting piece is fixedly connected to the second daughter board.
An electronic device, including a housing, a control component and a camera module. The camera module and the control component are respectively provided on the housing. The camera module includes:

first circuit board;

The photosensitive chip is disposed on the first circuit board and can convert the acquired optical signal into an electrical signal. The photosensitive chip and the first circuit board can move along the optical axis direction perpendicular to the lens of the camera module. ;

The second circuit board includes a first sub-board, a second sub-board and a third sub-board. The second sub-board connects the first sub-board and the third sub-board, and the first sub-board and The third sub-board is arranged by bending each other through the second sub-board, the first sub-board is connected to the first circuit board, and the third sub-board is connected to the control component; and

The connecting piece is at least partially attached to the second sub-board to limit the deformation of the second sub-board during the movement of the first circuit board.