CN218162616U

CN218162616U - Camera module and electronic equipment

Info

Publication number: CN218162616U
Application number: CN202222464126.7U
Authority: CN
Inventors: 谢仲; 杨松; 门凯
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2022-12-27
Anticipated expiration: 2032-09-15
Also published as: WO2024055743A1

Abstract

The application provides a camera module and an electronic device, which comprise a bearing plate; the first circuit board is arranged on the bearing plate; the photosensitive chip, the first circuit board and the bearing plate can move along the direction perpendicular to the optical axis of the lens of the camera module; the second circuit board comprises a first sub-board, a second sub-board and a third sub-board, the second sub-board is connected with the first sub-board and the third sub-board, the first sub-board and the third sub-board are arranged in a bent mode through the second sub-board, the second sub-board is fixedly connected with the bearing plate, the first sub-board is connected with the first circuit board, and the third sub-board is used for being connected with the control assembly. With second daughter board and loading board fixed connection in the second circuit board, can prevent that first circuit board and sensitization chip from removing the in-process, the second daughter board takes place deformation, perhaps takes place great deformation in other words, so, can prevent to produce too big effort and lead to first circuit board and sensitization chip to take place the slope when the second daughter board takes place deformation.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of cameras, in particular to a camera module and electronic equipment.

Background

With the increasing popularity of electronic devices, electronic devices have become indispensable social tools and entertainment tools in people's daily life, and people have increasingly high requirements for electronic devices. Taking a mobile terminal as an example, in order to meet the photographing requirements of people, some mobile terminals, such as mobile phone manufacturers, use an internal Optical Image Stabilization (OIS) motor of a mobile phone to drive a built-in camera module of the mobile phone to move, so as to implement an anti-shake function of a built-in camera of the mobile phone.

In the correlation technique, the camera module includes OIS motor, flexible circuit board and is provided with the printed circuit board of sensitization chip, and the OIS motor is used for driving printed circuit board and removes in order to drive sensitization chip, and the flexible circuit board is connected with printed circuit board, and the flexible circuit board extends to after local the buckling and is connected with the external element of camera module. In the moving process of the printed circuit board, the bent part of the flexible circuit board can generate acting force acting on the printed circuit board, and when the acting force is too large, the printed circuit board can incline, so that the photosensitive chip inclines.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a camera module and electronic equipment, can solve the problem that the sensitization chip takes place to incline at the removal in-process.

In a first aspect, an embodiment of the present application provides a camera module, including:

carrying a plate;

the first circuit board is arranged on the bearing plate;

the photosensitive chip, the first circuit board and the bearing plate can move along the direction perpendicular to the optical axis of the lens of the camera module; and

the second circuit board comprises a first sub-board, a second sub-board and a third sub-board, the second sub-board is connected with the first sub-board and the third sub-board, the first sub-board and the third sub-board are arranged in a mutually bent mode through the second sub-board, the second sub-board is fixedly connected with the bearing board, the first sub-board is connected with the first circuit board, and the third sub-board is used for being connected with a control assembly.

In a second aspect, an embodiment of the present application provides a camera module, including:

the anti-shake device comprises an anti-shake assembly, a driving assembly and a control assembly, wherein the anti-shake assembly comprises an upper bracket, a lower bracket and a driving piece, the driving piece is connected with the upper bracket and the lower bracket, and the driving piece can drive the lower bracket to move relative to the upper bracket along a direction perpendicular to an optical axis of a lens of the camera module;

the first circuit board is fixed on the lower bracket;

the photosensitive chip is arranged on the first circuit board and can convert the acquired optical signal into an electric signal;

the second circuit board comprises a first sub-board, a second sub-board and a third sub-board, the second sub-board is connected with the first sub-board and the third sub-board, the first sub-board and the third sub-board are arranged in a mutually bent mode through the second sub-board, the first sub-board is connected with the first circuit board, and the third sub-board is used for being connected with a control assembly; and

and one end of the connecting piece is fixedly connected with the lower bracket, and the other end of the connecting piece is fixedly connected with the second sub-board.

In a third aspect, an embodiment of the present application provides a camera module, including:

a first circuit board;

the photosensitive chip is arranged on the first circuit board and can convert the acquired optical signal into an electric signal, and the photosensitive chip and the first circuit board can move along the direction perpendicular to the optical axis of the lens of the camera module;

and the connecting sheet is at least partially attached to the second sub-board so as to limit the deformation of the second sub-board in the moving process of the first circuit board.

In a fourth aspect, an embodiment of the present application further provides an electronic device, which includes a housing, a control component, and the camera module as described above, where the camera module and the control component are respectively disposed on the housing, and the second circuit board in the camera module is electrically connected to the control component.

The embodiment of the application provides camera module and electronic equipment, and the first circuit board in the camera module can remove along the optical axis direction of perpendicular to camera lens to can drive the sensitization chip that sets up on first circuit board and remove, so, can realize sensitization chip's anti-shake. The second circuit board in the camera module is connected with the first circuit board, and the second circuit board can be electrically connected with other components through a third daughter board in the second circuit board so as to realize the electrical connection of the first circuit board and other components. In addition, through second daughter board and loading board fixed connection with in the second circuit board, can prevent that first circuit board and sensitization chip from removing the in-process, deformation takes place for the second daughter board in the second circuit board, perhaps says so and takes place great deformation, so, can prevent that the second daughter board from producing too big effort and leading to first circuit board to take place the slope when taking place deformation to can prevent that the sensitization chip from taking place the slope.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can also be derived from them without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a first schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 3 is an exploded view of the camera module shown in fig. 1.

Fig. 4 is a schematic structural diagram of the base, the carrying assembly and the first driving assembly in fig. 3.

Fig. 5 is a schematic structural diagram of the base, the anti-shake assembly and the carrier plate in fig. 3.

Fig. 6 is a schematic structural diagram of the anti-shake assembly and the filter in fig. 5.

Fig. 7 is a schematic structural diagram of the anti-shake assembly shown in fig. 6.

Fig. 8 is an exploded view of the anti-shake assembly shown in fig. 7.

Fig. 9 is a schematic structural view of the driving member and the upper bracket in fig. 8.

Fig. 10 is a schematic structural diagram illustrating a connection structure of a carrier board, a first circuit board and a second circuit board according to an embodiment of the present application.

Fig. 11 is a schematic structural diagram of the connection of the first circuit board, the carrier board and the second circuit board in fig. 10.

FIG. 12 is a schematic diagram of the carrier plate and the filter of FIG. 10.

Fig. 13 is an exploded view of the structure shown in fig. 4.

Fig. 14 is a schematic view of a second structure of a camera module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are intended to be within the scope of the present application.

The embodiment of the application provides a camera module and electronic equipment, and the problem that the photosensitive chip inclines in the moving process can be solved. This will be explained below with reference to the drawings.

It will be understood that "electronic equipment" (or simply "terminal") as used herein includes, but is not limited to, devices that are arranged to receive/transmit communication signals via a wireline connection and/or via a wireless communication network, such as a cellular network, a wireless local area network, etc. Examples of mobile terminals include, but are not limited to, cellular telephones and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 100 provided in the embodiment of the present application may specifically be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device, and the following description will take the mobile phone as an example. As shown in fig. 1, the electronic device 100 may include a housing 10, a camera module 20, and a display screen 30. The display screen 30 is disposed on the housing 10, and can be used for displaying images, and the camera module 20 can be disposed on the housing 10 and can receive light emitted from an external environment to capture images.

Referring to fig. 2 to 4, fig. 2 is a first schematic structural diagram of a camera module according to an embodiment of the present disclosure, fig. 3 is an exploded view of the camera module shown in fig. 1, and fig. 4 is a schematic structural diagram of a base, a carrier assembly, and a first driving assembly in fig. 3. The carrier plate 28 in fig. 3 has not been installed with the optical filter 202. The camera module 20 may include a base 21, a lens 22, a carrying assembly 23, a first driving assembly 24, a photosensitive chip 25 and an anti-shake assembly 26. The base 21 is provided with an installation space 211, the bearing assembly 23 and the first driving assembly 24 are arranged in the installation space 211 of the base 21, the lens 22 is arranged on the bearing assembly 23, and the bearing assembly 23 is driven by the first driving assembly 24 to move along a direction perpendicular to an optical axis of the lens 22, so that the lens 22 can be driven to move to realize an anti-shake function of the lens 22 of the camera module 20. The photosensitive chip 25 is disposed at one side of the anti-shake assembly 26, and is disposed opposite to the lens 22 in a direction parallel to the optical axis of the lens 22, and the photosensitive chip 25 can convert the acquired optical signal into an electrical signal. Wherein, the photosensitive chip 25 is disposed on the first circuit board 27, it can be understood that the first circuit board 27 can be a printed circuit board, and the first circuit board 27 can implement transmission of current and signals, so that components disposed on the first circuit board 27 can work normally.

The anti-shake assembly 26 is configured to drive the first circuit board 27 and the photosensitive chip 25 to move in a plane perpendicular to the optical axis direction of the lens 22, so as to implement an anti-shake function of the photosensitive chip 25 of the camera module 20. In this way, the dual anti-shake of the photosensitive chip 25 and the lens 22 is realized by providing the anti-shake assembly 26 and the first driving assembly 24. In this embodiment, the camera module 20 may be used to implement functions of the electronic device 100, such as photographing, recording, unlocking by face recognition, and code scanning payment. In addition, the camera module 20 may be a rear-view camera or a front-view camera, which is not limited in this embodiment.

Specifically, the lens 22 may be made of glass or plastic. The lens 22 is mainly used to change the propagation path of light and focus the light. Lens 22 may include multiple sets of lenses that collimate and filter light; so that the multiple lens layers filter stray light (e.g., infrared light) when light passes through the lens 22, so as to increase the imaging effect of the camera module 20. The photosensitive chip 25 may be an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The photosensitive chip 25 can be disposed opposite to the lens 22 in an optical axis direction of the camera module 20 (i.e., the optical axis direction of the lens 22), and is mainly used for receiving light collected by the lens 22 and converting an optical signal into an electrical signal, so as to meet an imaging requirement of the camera module 20. The anti-shake assembly 26 and the first driving assembly 24 are mainly used to improve the imaging effect of the camera module 20 caused by the shake of the user during the use process, so that the imaging effect of the photosensitive chip 25 can meet the use requirement of the user.

Based on the optical anti-shake technology, a sensor such as a gyroscope or an accelerometer of the electronic device 100 (or the camera module 20) may detect shake of the lens 22 to generate a shake signal, and transmit the shake signal to a processing chip of the electronic device 100 and/or the camera module 20, the processing chip of the electronic device 100 and/or the camera module 20 may calculate a displacement amount that the anti-shake component 26 and the first driving component 24 need to compensate, so that the first driving component 24 may compensate the lens 22 according to a shake direction of the lens 22 and the displacement amount thereof, and the anti-shake component 26 may compensate the photosensitive chip 25 according to a shake direction and the displacement amount of the photosensitive chip 25, thereby improving an imaging effect of the camera module 20 caused by shake of a user during use.

It should be noted that, in the related art, some mobile terminals employ dual driving mechanisms to respectively control the movement of the lens and the photosensitive chip, so as to achieve the anti-shake of the lens and the anti-shake of the photosensitive chip. The dual-drive mechanism is usually disposed in the base, and when the dual-drive mechanism works, the dual-drive mechanism is easy to interfere with each other.

Based on this, please refer to fig. 3 and fig. 4, in the camera module 20 provided in the embodiment of the present application, the bearing component 23 and the first driving component 24 for preventing the lens 22 from shaking are disposed in the installation space 211 of the base 21, and the anti-shaking component 26 for preventing the photosensitive chip 25 from shaking is disposed outside the installation space 211 of the base 21, that is, the bearing component 23 and the first driving component 24 are located in different spaces from the anti-shaking component 26, and there is a relatively independent movement space therebetween, so that the first driving component 24, the bearing component 23, and the anti-shaking component 26 do not intersect or overlap in the movement process, and interference among parts of the camera module 20, such as interference among the anti-shaking component 26, the first driving component 24, and the bearing component 23, is avoided. Also, when the anti-shake assembly 26 drives the first circuit board 27 and the photosensitive chip 25 to move, the photosensitive chip 25 does not interfere with the first driving assembly 24 or the carrying assembly 23.

It should be further noted that, in the related art, because the dual-driving mechanism is usually disposed in the base, in order to solve the interference problem, the size of the base is usually required to be increased to have a larger accommodating space for the dual-driving mechanism to move under the condition of mutual noninterference, and the size of the camera module mainly depends on the size of the base, so that the size of the camera module is increased.

In the camera module 20 provided in the embodiment of the present application, the anti-shake assembly 26 is disposed outside the installation space 211 of the base 21, so that interference between the anti-shake assembly 26 and elements in the base 21, such as interference between the anti-shake assembly 26 and the first driving assembly 24 and the carrying assembly 23 in the base 21, can be avoided, and it is not necessary to increase the size of the base 21 in order to prevent interference between the anti-shake assembly 26 and other elements in the base 21, so that the overall size of the base 21 can be made smaller, and the miniaturization design of the camera module 20 can be achieved. Moreover, the independent design of the anti-shake component 26 is convenient for the independent type selection and the independent assembly of the anti-shake component 26, and the practicability is higher.

It is understood that the anti-shake assembly 26 is disposed outside the installation space 211, and can be connected to the base 21, or can be connected to other components of the camera module 20. Referring to fig. 5 to 7, fig. 5 is a schematic structural view of the base, the anti-shake element and the carrier plate in fig. 3, fig. 6 is a schematic structural view of the anti-shake element and the filter in fig. 5, and fig. 7 is a schematic structural view of the anti-shake element in fig. 6. It will be appreciated that the carrier plate 28 of fig. 5 has the optical filter 202 mounted thereto. The anti-shake assembly 26 may include an upper bracket 261, a lower bracket 262 and a driving member 263, wherein the upper bracket 261 is connected to the base 21, and is connected to the base 21 through the upper bracket 261 so as to dispose the anti-shake assembly 26 outside the installation space 211 of the base 21.

The lower holder 262 is located on a side of the upper holder 261 facing away from the base 21, the upper holder 261 and the lower holder 262 are spaced apart in the optical axis direction of the lens 22, and in order to maintain a relative spacing between the upper holder 261 and the lower holder 262, or in order to make the upper holder 261 in a suspended state, the anti-shake assembly 26 further includes a connection spring (not shown) connected between the upper holder 261 and the lower holder 262, and it can be understood that the connection spring has a certain flexibility so as not to hinder the movement of the lower holder 262 relative to the upper holder 261.

It is understood that the driving member 263 connects the upper bracket 261 and the lower bracket 262, so that the lower bracket 262 can be driven by the driving member 263 to move relative to the upper bracket 261 in a direction perpendicular to the optical axis of the lens 22.

Referring to fig. 3, the first circuit board 27 is fixedly disposed on the lower bracket 262, and it can be understood that the camera module 20 can further include a supporting board 28, the supporting board 28 is fixed on a side of the lower bracket 262 away from the upper bracket 261, at this time, the first circuit board 27 can be fixed on a side of the supporting board 28 away from the lower bracket 262, and thus, the lower bracket 262 can drive the first circuit board 27 and the supporting board 28 to move together under the driving of the driving element 263. A filter 202 (as shown in fig. 5) may be disposed on the carrier plate 28 to filter the light guided by the lens.

It is understood that, in order not to obstruct the light incident on the photo chip 25 on the first circuit board 27, the upper support 261 and the lower support 262 are both provided with light holes for the light to be incident on the photo chip 25, and the photo chip 25 converts the obtained light signal into an electrical signal.

It will also be appreciated that the directions of movement associated with the camera module 20 generally include an X direction, a Y direction, and a Z direction, wherein the Z direction is the direction of the optical axis of the lens 22, and the X direction and the Y direction are perpendicular to each other and to the Z direction.

For a more clear description of the structure of the driving element 263, please refer to fig. 8 and fig. 9 in conjunction with fig. 7, in which fig. 8 is an exploded view of the anti-shake assembly shown in fig. 7, and fig. 9 is a schematic structural view of the driving element and the upper bracket in fig. 8, it can be understood that fig. 9 only illustrates the relative position relationship between the driving element and the upper bracket. The driving member 263 for driving the lower frame 262 to move may include a deformation part 2631, the deformation part 2631 connects the upper frame 261 and the lower frame 262, and the deformation part 2631 may deform to drive the lower frame 262 to move relative to the upper frame 261 in a direction perpendicular to the optical axis of the lens 22, so as to drive the photosensitive chip 25 to move in a direction perpendicular to the optical axis of the lens 22 (including an X direction and/or a Y direction), so as to implement an optical anti-shake function of the photosensitive chip 25. Illustratively, one end of the deformation portion 2631 is connected to the upper bracket 261, the other end of the deformation portion 2631 is connected to the lower bracket 262, and the deformation portion 2631 is deformable in the power-on state to move the lower bracket 262 relative to the upper bracket 261 in a direction perpendicular to the optical axis of the lens 22. The deformation portion 2631 may be made of Shape Memory Alloy (SMA), and the Shape Memory alloy may heat and deform the SMA in a power-on state, so that the length of the deformation portion 2631 may change during deformation, and the lower bracket 262 connected thereto is driven to move, thereby implementing the anti-shake function of the photo sensor chip 25. For example, the conductive pins 2621 may be disposed on the lower bracket 262, and the conductive pins 2621 are electrically connected to the deformation portion 2631. Accordingly, current can be conducted to the deformation portion 2631 through the conductive pins 2621 to deform the deformation portion 2631, so that the movement of the lower frame 262 can be controlled, and thus the movement of the photo sensor chip 25 can be controlled.

For example, the driving parts 263 may be disposed in a plurality of, such as four, wherein two driving parts 263 are disposed oppositely in a first direction and are substantially symmetrical with respect to the lens 22, another two driving parts 263 are disposed oppositely in a second direction and are substantially symmetrical with respect to the lens 22, the first direction is perpendicular to the second direction and are both perpendicular to the optical axis direction of the lens 22, such as the first direction is the X direction, the second direction is the Y direction, and the four driving parts 263 surround and form a similar square shape. In this manner, movement of the lower support 262 may be achieved by the cooperation of the four driving members 263.

Referring to fig. 2 and 3 in conjunction with fig. 6, in order to control the operation of the driving element 263, the conductive pins 2621 on the lower frame 262 are electrically connected to the first circuit board 27. When the lower bracket 262 needs to be driven to move, the driving element 263 can be powered through the first circuit board 27, the length of the deformation portion 2631 of the driving element 263 changes, so as to drive the lower bracket 262 connected with the driving element to move, and when the lower bracket 262 moves relative to the upper bracket 261, the circuit board 27 and the photosensitive chip 25 move together.

It can be understood that, referring to fig. 10, fig. 10 is a schematic structural diagram illustrating a connection between a carrier board, a first circuit board and a second circuit board according to an embodiment of the present disclosure. It will be appreciated that a filter 202 is provided on the carrier plate 28. The camera module 20 may further include a second circuit board 29, and the first circuit board 27 may be electrically connected to the control component through the second circuit board 29, for example, the first circuit board 27 may be electrically connected to the main processor of the electronic device 100 through the second circuit board 29.

The second circuit board 29 may be a flexible circuit board. It should be noted that, in the related art, the printed circuit board provided with the photosensitive chip is connected to a flexible circuit board, and the flexible circuit board is partially bent and then extends to be connected to an external element of the camera module. In the moving process of the printed circuit board, the bent part of the flexible circuit board can generate acting force acting on the printed circuit board, and when the acting force is too large, the printed circuit board can incline, so that the photosensitive chip can incline.

Accordingly, in some embodiments of the present application, please refer to fig. 10 to 12 together, fig. 11 is a schematic structural diagram illustrating connection of the first circuit board, the carrier board and the second circuit board in fig. 10, and fig. 12 is a schematic structural diagram illustrating the carrier board and the filter in fig. 10. The second circuit board 29 may include a first sub-board 291, a second sub-board 292, and a third sub-board 293, the second sub-board 292 is connected to the first sub-board 291 and the third sub-board 293, the first sub-board 291 and the third sub-board 293 are bent and disposed through the second sub-board 292, the first sub-board 291 is connected to the first circuit board 27, and the third sub-board 293 is used for connecting a control component. Thus, the second circuit board 29 can be conveniently electrically connected with the control component. For example, the third sub-board 293 may be electrically connected to the main processor of the electronic device 100.

Also, the second sub-plate 292 is fixedly connected to the carrier plate 28. The second sub-board 292 in the second circuit board 29 can be prevented from deforming or deforming greatly in the moving process of the first circuit board 27 and the photosensitive chip 25, so that the first circuit board 27 can be prevented from being inclined due to overlarge acting force generated when the second sub-board 292 deforms, and the photosensitive chip 25 can be prevented from being inclined.

In order to facilitate the fixed connection between the carrier board 28 and the second sub-board 292, the carrier board 28 may include a board body 281 and a connection structure 282, the first circuit board 27 is disposed on the board body 281, the connection structure 282 is connected to the board body 281, the connection structure 282 protrudes from a side of the board body 281 facing the second sub-board 292, and the connection structure 282 is fixedly connected to the second sub-board 292. Thus, through the fixed connection between the connection structure 282 and the second sub-board 292, the deformation, or large deformation, of the second sub-board 292 in the second circuit board 29 can be prevented when the first circuit board 27 and the photosensitive chip 25 move, so that the first circuit board 27 is prevented from being inclined due to an excessive acting force generated when the second sub-board 292 is deformed, and the photosensitive chip 25 can be prevented from being inclined.

The second sub-board 292 may include an arc surface 2921, the connection structure 282 includes a first engaging surface 2821, and the arc surface 2921 is fixedly connected to the first engaging surface 2821. The second sub-board 292 and the connecting structure 282 can be tightly attached by the cooperation between the arc-shaped surface 2921 and the first attaching surface 2821. Illustratively, the arc-shaped surface 2921 and the first attachment surface 2821 may be fixedly connected by an adhesive layer. For example, glue may be applied to the first attaching surface 2821 or the arc surface 2921, and then the first attaching surface 2821 and the arc surface 2921 are attached to each other.

Wherein the radius of the arcuate surface 2921 ranges from 0.5 mm to 1.5 mm. This kind of radius range of arcwall face 2921 and the connection between arcwall face 2921 and the first binding face 2821 can prevent further that first circuit board 27 and photosensitive chip 25 from removing the in-process, and second daughter board 292 takes place deformation, perhaps can more effective restriction second daughter board 292 take place great deformation.

In order to facilitate the fixed connection between the arc-shaped surface 2921 and the first attaching surface 2821, in the direction perpendicular to the normal of the arc-shaped surface 2921, the length of the arc-shaped surface 2921 is smaller than or equal to the length of the first attaching surface 2821, that is, the length of the first attaching surface 2821 is larger, so that the arc-shaped surface 2921 can be better ensured to be completely fixed on the first attaching surface 2821.

It is understood that the connecting structure 282 may include a second abutting surface 2822 connected to the first abutting surface 2821, and the second abutting surface 2822 is fixedly connected to the third sub-board 293. That is, the connection structure 282 is not only connected to the second sub-board 292, but also connected to the third sub-board 293, so that the connection strength between the connection structure 282 and the second circuit board 29 can be improved to better prevent the second sub-board 292 from being deformed.

Further, the connecting structure 282 includes a third attaching surface 2823 connected to the first attaching surface 2821, the first attaching surface 2821 is located between the second attaching surface 2822 and the third attaching surface 2823, and the third attaching surface 2823 is fixedly connected to the first sub-board 291. That is, the connection structure 282 is connected to the first sub-board 291, the second sub-board 292, and the third sub-board 293, so that the connection strength between the connection structure 282 and the second circuit board 29 can be further improved to better prevent the second sub-board 292 from being deformed.

It is understood that the first sub-board 291 and the third sub-board 293 may be substantially perpendicular, the third sub-board 293 surrounds the base 21 and is fixedly connected to the base 21, wherein the third sub-board 293 may further be electrically connected to components in the base 21, such as the first driving component 24 in the base 21, the camera module 20 may further include a third circuit board 203, one end of the third circuit board 203 is electrically connected to the third sub-board 293, and the other end of the third circuit board 203 may extend to be electrically connected to a main processor of the electronic device 100, so as to implement signal and current conduction. Wherein the third circuit board 203 may be a flexible circuit board.

It will also be appreciated that two second circuit boards 29 may be provided, the first circuit board 27 including a first side and a second side disposed opposite to each other, one second circuit board 29 being connected to the first side and the other second circuit board 29 being connected to the second side, and that by providing two second circuit boards 29, further circuit connections may be realized. It can be understood that the second sub-board 292 of each second circuit board 29 is respectively and fixedly connected to the carrier board 28, and the specific connection structure 282 can refer to the above description about the fixed connection between the second sub-board 292 and the carrier board 28, which is not described herein again.

In some embodiments, the second sub-board 292 of the second circuit board 29 may not be fixedly connected to the carrier board 28, and may be fixedly connected to the lower bracket 262 of the anti-shake assembly, for example, the camera module 20 may include a connector, one end of which is fixedly connected to the lower bracket 262, and the other end of which is fixedly connected to the second sub-board 292 of the second circuit board 29. It will be appreciated that the specific construction of the connector can be as described above with respect to the connector structure 282 in the carrier plate 28.

In some embodiments, the second sub-board 292 of the second circuit board 29 may not be connected to the carrier board 28 or the lower bracket 262, such as the camera module 20 may include a connecting tab at least partially fitting to the second sub-board 292 to limit the deformation of the second sub-board 292 during the movement of the first circuit board 27. Wherein, the connecting sheet can be attached to the second sub-sheet 292 through a glue layer. It can be understood that the connection piece can adopt the steel sheet, and the steel sheet laminating is in second daughter board 292, because the steel sheet has certain rigidity, when second daughter board 292 laminating has the steel sheet, the steel sheet can restrict second daughter board 292 and take place deformation, or prevent that second daughter board 292 from taking place great deformation, so, produce too big effort and lead to first circuit board 27 to take place the slope when can prevent that second daughter board 292 from taking place deformation to can prevent that sensitization chip 25 from taking place the slope.

It can be understood that, the lower frame 262 can move under the driving of the driving element 263, in order to make the lower frame 262 move more accurately, the camera module 20 can further include a hall sensor 271, the hall sensor 271 is disposed on the first circuit board 27, the base 21 is provided with a supporting leg 212 disposed opposite to the hall sensor 271, the supporting leg 212 is provided with a magnet, the magnet is disposed opposite to the hall sensor 271, and thus, when the first circuit board 27 moves along with the lower frame 262, the relative position between the hall sensor 271 and the magnet also changes, so that the magnetic flux received by the hall sensor 271 also correspondingly changes and outputs a corresponding signal, and thus, the main processor of the electronic device 100 can accurately calculate the displacement of the lower frame 262 according to the signal output by the hall sensor 271, thereby accurately controlling the movement of the lower frame 262, and improving the anti-shake precision of the photo sensor chip 25.

Illustratively, the base 21 is substantially a square structure, the number of the supporting legs 212 may be four, and the four supporting legs 212 are respectively and correspondingly disposed at four corners of the base 21, it can be understood that the number of the hall sensors 271 may be three, and the number of the magnets may also be correspondingly three, of course, the number of the hall sensors 271 may also be four, and at this time, the number of the magnets is also correspondingly four.

In order to explain the structure of the anti-shake assembly 26 more clearly, the detailed structure of the upper bracket 261 and the lower bracket 262 of the anti-shake assembly and the matching relationship between the upper bracket and the lower bracket and other structural members in the camera module 20 will be described in detail below with reference to the drawings.

Referring to fig. 5 and fig. 6, the upper bracket 261 of the anti-shake assembly 26 is connected to the base 21, so as to fix the anti-shake assembly 26 to the base 21. It is understood that the base 21 includes a connecting bottom surface 213 disposed opposite to the upper rack 261, the connecting bottom surface 213 is provided with a protruding portion 214 protruding toward the upper rack 261, and the upper rack 261 is connected to the base 21 by the connecting bottom surface 213 and the protruding portion 214 to realize the fixing of the upper rack 261 to the base 21.

The upper bracket 261 may include a connecting body 2611, where the connecting body 2611 includes a first portion 26111, a connecting portion 26112 and a second portion 26113, the first portion 26111 has a first connecting surface disposed opposite to the bottom surface of the protrusion 214, and the first connecting surface is connected to the bottom surface of the protrusion 214, such as the first connecting surface may be fixedly connected to the bottom surface of the protrusion 214 by glue.

The connecting portion 26112 is connected to an edge of the first portion 26111 and is bent toward a direction close to the base 21, the second portion 26113 is connected to the connecting portion 26112, the second portion 26113 has a second connecting surface opposite to the connecting bottom surface 213 of the base 21, and the second connecting surface is connected to the connecting bottom surface 213 of the base 21, for example, the second connecting surface and the connecting bottom surface 213 of the base 21 may be fixedly connected by glue.

In this way, the connecting body 2611 of the upper bracket 261 forms a structure that is recessed downward along the optical axis direction of the lens 22, the first portion 26111 of the connecting body 2611 is farther away from the base 21 relative to the second portion 26113 of the connecting body 2611, and the lower bracket 262 is located on one side of the upper bracket 261 facing the photosensitive chip 25, that is, the lower bracket 262 is located below the first portion 26111 in the optical axis direction of the lens 22, which makes the lower bracket 262 farther away from the components in the mounting space 211 of the base 21, thereby further avoiding the interference between the lower bracket 262 and the components in the base 21 or the base 21 during the moving process.

It should be noted that all directional indications (such as up, down, left, right, front, and back) in the embodiments of the present application are only used for explaining the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indication is changed accordingly.

The upper bracket 261 may be made of metal, and the recess structure of the connection body 2611 may be formed by stamping.

It should be noted that, the anti-shake assembly 26 usually needs to be limited during the moving process, and in the related art, the wall of the base is usually used as a limiting structure to limit the anti-shake assembly, that is, when the anti-shake assembly collides with the wall of the base, the wall of the base limits the anti-shake assembly, and when the number of times of collisions between the anti-shake assembly and the wall of the base is large, the base is easily damaged.

Based on this, referring to fig. 7 and fig. 8, the upper bracket 261 may further include a first limiting portion 2612, the first limiting portion 2612 is connected to the connecting body 2611, a free end of the first limiting portion 2612 is bent toward a direction away from the base 21, and the first limiting portion 2612 is used for limiting the lower bracket 262. It can be understood that when the lower bracket 262 moves to abut against the first retaining portion 2612, the lower bracket 262 is retained by the first retaining portion 2612. By providing the first stopper 2612 on the upper bracket 261, the lower bracket 262 can be stopped and the lower bracket 262 can be prevented from hitting the base 21.

The first limiting portion 2612 can be made of metal, so that the first limiting portion 2612 can be effectively prevented from being damaged by the lower bracket 262 to generate debris, and the debris is prevented from affecting the normal operation of other parts of the camera module 20, such as when the debris is scattered to the photosensitive chip 25, the finally imaged image has shadow and the quality of the generated image is affected.

It can be understood that two first limiting portions may be disposed in the first direction (or the X direction), two first limiting portions are disposed at an interval, the lower bracket 262 may move between the two first limiting portions in the first direction, and when the lower bracket 262 moves to abut against the first limiting portions in the first direction, the lower bracket may be limited by the first limiting portions in the first direction. For convenience of understanding, the two first limiting portions spaced apart from each other along the first direction are named as a first sub-limiting portion 2612a and a second sub-limiting portion 2612b, the lower bracket 262 can move between the first sub-limiting portion 2612a and the second sub-limiting portion 2612b, and the lower bracket 262 can be limited when moving to abut against the first sub-limiting portion 2612a or the second sub-limiting portion 2612 b.

Of course, two first limiting portions may also be disposed in the second direction (or the Y direction), the two first limiting portions are disposed at an interval, the lower bracket 262 may move between the two first limiting portions in the second direction, and when the lower bracket 262 moves to abut against the first limiting portions in the second direction, the lower bracket may be limited by the first limiting portions in the second direction. For convenience of understanding, the two first limiting portions spaced apart along the second direction (or Y direction) are named as a third sub-limiting portion 2612c and a fourth sub-limiting portion 2612d, the lower rack 262 can move between the third sub-limiting portion 2612c and the fourth sub-limiting portion 2612d, and the lower rack 262 can be limited when moving to abut against the third sub-limiting portion 2612c and the fourth sub-limiting portion 2612 d.

In order to better limit the lower rack 262, the lower rack 262 may include a rack body 2622 and a second limiting portion 2623, the second limiting portion 2623 is connected with the rack body 2622, a free end of the second limiting portion 2623 is bent toward a direction close to the upper rack 261, and the second limiting portion 2623 is used for cooperating with the first limiting portion 2612 to limit a relative position relationship between the upper rack 261 and the lower rack 262. By providing the second position limiting portion 2623 on the lower bracket 262, it is possible to better cooperate with the first position limiting portion 2612 of the upper bracket 261 to limit the relative positional relationship between the upper bracket 261 and the lower bracket 262.

It is understood that the number and the arrangement positions of the second stopper portions 2623 correspond to those of the first stopper portions 2612. For example, the second position-limiting portion 2623 includes a fifth sub-limiting portion 2623a and a sixth sub-limiting portion 2623b spaced apart from each other along the first direction (or the X direction), the fifth limiting portion 2623a is engaged with the first sub-limiting portion 2612a, and the sixth limiting portion 2623b is engaged with the second sub-limiting portion 2612 b. The second position-limiting portion may further include a seventh sub-limiting portion 2623c and an eighth sub-limiting portion 2623d spaced apart from each other along the second direction (or the Y direction), the seventh sub-limiting portion 2623c is engaged with the third sub-limiting portion 2612c, and the eighth sub-limiting portion 2623d is engaged with the fourth sub-limiting portion 2612 d.

The second limiting portion 2623 may be made of a metal material.

The specific structure of the anti-shake assembly 26 and the components cooperating with the same are described above, and the specific structure of the carrier assembly 23 and the first driving assembly 24 for driving the lens 22 of the camera module 20 to move to realize the anti-shake function of the lens 22, and the components cooperating with the carrier assembly 23 and the first driving assembly 24 will be described in detail with reference to the drawings.

Referring to fig. 13 in conjunction with fig. 4, fig. 13 is an exploded view of the structure shown in fig. 4. It is understood that the bearing assembly 23 and the first driving assembly 24 are disposed in the installation space 211 of the base 21. The carrier assembly 23 is used for carrying the lens 22 of the camera module 20, and the first driving assembly 24 is used for driving the carrier assembly 23 to move along a direction perpendicular to the optical axis of the lens 22, so as to drive the lens 22 to move along the direction perpendicular to the optical axis of the lens 22, so as to compensate the shake of the lens 22, and further to realize the anti-shake of the lens 22.

The carrier assembly 23 includes a first carrier 231, the first carrier 231 is used for carrying the lens 22, the first carrier 231 is configured to be movable in a first direction (or X direction) in the installation space 211 of the base 21, the first driving assembly 24 includes a first magnetic component 241 and a first conductive component 242, one of the first magnetic component 241 and the first conductive component 242 is disposed on the first carrier 231, and the other is disposed on the base 21, such as the first magnetic component 241 is disposed on the first carrier 231, and the first conductive component 242 is disposed on the base 21, wherein the base 21 may be configured with a first installation slot 215 for installing the first conductive component 242, the first conductive component 242 is installed in the first installation slot 215, and the first conductive component 242 can cooperate with the first magnetic component 241 in an electrified state to enable the first carrier 231 to move in the first direction, wherein the first direction is perpendicular to an optical axis direction of the lens 22. It can be understood that, the first magnetic element 241 and the first conductive element 242 are disposed opposite to each other in the first direction (or the X direction), based on the fleming's left-hand rule, after the first conductive element 242 is powered on, a magnetic field can be generated, the magnetic field generated by the first conductive element 242 can interact with the magnetic field of the first magnetic element 241 to generate a first acting force (or a magnetic acting force) perpendicular to the optical axis direction of the lens 22, and the first acting force acts on the first carrier 231 to drive the first carrier 231 to move in the optical axis direction perpendicular to the optical axis direction of the lens 22, so as to compensate for the shake of the lens 22 in the optical axis direction perpendicular to the optical axis direction of the lens 22.

It is understood that the direction of the first force may be changed by controlling the direction of the current flowing through the first conductive member 242.

The first conductive member 242 may be a coil, the coil is electrically connected to the first circuit board 27, and the first circuit board 27 controls the on/off of the coil current to control whether the first carrier 231 moves. Of course, the coil may also be electrically connected to the main processor of the electronic device 100 through the third circuit board 203.

Of course, in some embodiments, the first magnetic element 241 may be disposed on the base 21, and the first conductive element 242 may be disposed on the first carrier 231, which is not limited herein.

By disposing one of the first magnetic member 241 and the first conductive member 242 on the first carrier 231 and the other one on the base 21, the structures of the base 21 and the first carrier 231 can be fully utilized, the installation space 211 of the base 21 is saved to a certain extent, and the miniaturization design of the camera module 20 can be realized.

The carrier assembly 23 may further include a second carrier 232, the second carrier 232 is disposed on a side of the first carrier 231 facing the photosensitive chip 25, the first carrier 231 is capable of moving on the second carrier 232 along the first direction (or the X direction), and the second carrier 232 plays a role of carrying the first carrier 231, wherein, in order to facilitate the first carrier 231 moving on the second carrier 232 along the first direction (or the X direction), a first ball 234 may be disposed between the first carrier 231 and the second carrier 232, and the first carrier 231 may move along the first direction based on rolling of the first ball 234, it is understood that a mutually matched limit structure may be disposed on the first carrier 231 and the second carrier 232, so that the first carrier 231 may move on the second carrier 232 along the first direction without moving relative to the second carrier 232 along the second direction (or the Y direction), wherein the second direction is perpendicular to the first direction and the optical axis direction of the lens 22.

Illustratively, the mutually fitting limit structures on the first carrier 231 and the second carrier 232 may be limit grooves and limit protrusions, such as a limit groove provided in the first carrier 231 toward one side of the second carrier 232 and a limit protrusion provided on the second carrier 232 corresponding to the limit groove, wherein the limit groove has a space for the limit protrusion to move in the first direction, and a part of a groove wall of the limit groove is fitted with the limit protrusion so that the limit protrusion cannot move in the limit groove in the second direction, so that the first carrier 231 can move on the second carrier 232 in the first direction but not move relative to the second carrier 232 in the second direction, it can be understood that if the first carrier 231 is subjected to a force in the second direction, the first carrier 231 and the second carrier 232 are moved together in the second direction due to the interaction of the limit groove and the limit protrusion.

It is understood that the first driving assembly 24 is further configured to drive the first carrier 231 and the second carrier 232 to move together along the second direction (or Y direction), in this case, the first driving assembly 24 may further include a second magnetic component 243 and a second conductive component 244, one of the second magnetic component 243 and the second conductive component 244 is disposed on the first carrier 231, and the other is disposed on the base 21, such as the second magnetic component 243 is disposed on the first carrier 231, and the second conductive component 244 is disposed on the base 21, wherein the base 21 may be provided with a second mounting groove 216 for mounting the second conductive component 244, the second conductive component 244 is mounted in the second mounting groove 216, and the second conductive component 244 can be matched with the second magnetic component 243 in a power-on state, so that the first carrier 231 and the second carrier 232 can move together along the second direction. It can be understood that the second magnetic component 243 and the second conductive component 244 are disposed opposite to each other in the second direction (or Y direction), based on fleming's left-hand rule, a magnetic field can be generated after the second conductive component 244 is powered on, the magnetic field generated by the second conductive component 244 can interact with the magnetic field of the second magnetic component 243 to generate a second acting force (or magnetic acting force) along the second direction, and the second acting force acts on the first carrier 231, and it can be understood that, when the first carrier 231 is subjected to the acting force along the second direction, due to the interaction between the limiting groove and the limiting protrusion, the first carrier 231 and the second carrier 232 move together along the second direction, so that the first carrier 231 drives the second carrier 232 to move together along the second direction, so as to compensate for the shake of the lens 22 in the second direction.

It will also be appreciated that the direction of the second force may be changed by controlling the direction of current flow through the second conductive member 244.

The second conductive member 244 may be a coil, the coil may be electrically connected to the first circuit board 27 through the second circuit board 29, and the first circuit board 27 controls the on/off of the coil current to control whether the first carrier 231 and the second carrier 232 move together along the second direction. Of course, the coil may also be electrically connected to the main processor of the electronic device 100 through the third circuit board 203.

Of course, in some embodiments, the second magnetic component 243 may be disposed on the base 21, and the second conductive component 244 may be disposed on the first carrier 231, which is not limited herein.

In order to facilitate the first carrier 231 and the second carrier 232 to move in the second direction, the bearing assembly 23 may further include a third carrier 233, the third carrier 233 is disposed in the base 21, the second carrier 232 is carried on the third carrier 233, a second ball 235 is disposed between the second carrier 232 and the third carrier, and the second carrier 232 may move in the second direction based on the rolling of the second ball 235.

In order to facilitate understanding of the movement process of the lens 22, the movement process of the lens 22 will be described in detail below.

When the lens 22 needs to be anti-shake in the first direction (or X direction), the first conductive member 242 may be powered through the first circuit board 27, the first conductive member 242 may generate a magnetic field in the powered state, the generated magnetic field and the magnetic field of the first magnetic member 241 interact to generate a thrust force on the first carrier 231, so as to drive the first carrier 231 to move along the first direction (or X direction), and when the first carrier 231 moves, the lens 22 may be driven to move together in the first direction (or X direction), so as to compensate shake of the lens 22 in the first direction.

When the anti-shake of the lens 22 in the second direction (or Y direction) needs to be realized, the first circuit board 27 may be used to energize the second conductive member 244, the second conductive member may generate a magnetic field in an energized state, the magnetic field generated by the second conductive member interacts with the magnetic field of the second magnetic member 243 to generate a thrust force on the first carrier 231, so as to drive the first carrier 231 to drive the second carrier 232 to move together along the second direction (or Y direction), and when the first carrier 231 and the second carrier 232 move, the lens 22 may be driven to move together in the second direction (or Y direction), so as to compensate the shake of the lens 22 in the second direction.

It can be understood that, in order to protect the above-mentioned components, such as the base 21, the bearing assembly 23, the first driving assembly 24, the photosensitive chip 25, the anti-shake assembly 26 and the first circuit board 27, please refer to fig. 14, and fig. 14 is a second structural schematic diagram of the camera module according to the embodiment of the present application. The camera module 20 may further include a housing 201, and the parts such as the base 21, the bearing assembly 23, the first driving assembly 24, the photosensitive chip 25, the anti-shake assembly 26, and the first circuit board 27 may be accommodated in the housing 201, wherein the camera module 20 may be mounted at a desired mounting position through the housing 201, such as on the housing 10 of the mobile phone.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.

The camera module and the electronic device provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A camera module, its characterized in that includes:

a carrier plate;

the first circuit board is arranged on the bearing plate;

the second circuit board comprises a first sub-board, a second sub-board and a third sub-board, the second sub-board is connected with the first sub-board and the third sub-board, the first sub-board and the third sub-board are arranged through the second sub-board in a mutually bent mode, the second sub-board is further fixedly connected with the bearing plate, the first sub-board is connected with the first circuit board, and the third sub-board is used for being connected with a control assembly.

2. The camera module according to claim 1, wherein the carrier board includes a board body and a connection structure, the connection structure is connected to the board body, the connection structure protrudes from a side of the board body facing the second daughter board, the connection structure is fixedly connected to the second daughter board, and the first circuit board is disposed on the board body.

3. The camera module according to claim 2, wherein the second sub-board includes an arc-shaped surface, and the connecting structure includes a first abutting surface, and the arc-shaped surface is fixedly connected to the first abutting surface.

4. The camera module of claim 3, wherein a length of the arc surface is less than or equal to a length of the first abutting surface in a direction perpendicular to a normal of the arc surface.

5. The camera module of claim 3, wherein the radius of the arcuate surface ranges between 0.5 mm and 1.5 mm.

6. The camera module of claim 3, wherein the connecting structure includes a second engaging surface connected to the first engaging surface, and the second engaging surface is fixedly connected to the third sub-board.

7. The camera module according to claim 6, wherein the connecting structure includes a third attaching surface connected to the first attaching surface, the first attaching surface is located between the second attaching surface and the third attaching surface, and the third attaching surface is fixedly connected to the first sub-board.

8. The camera module according to any one of claims 1 to 7, wherein there are two second circuit boards, the first circuit board includes a first side and a second side that are opposite to each other, one of the second circuit boards is connected to the first side, the other of the second circuit boards is connected to the second side, and the second daughter board of each of the second circuit boards is fixedly connected to the carrier board.

9. The camera module of claim 1, further comprising an anti-shake assembly for driving the carrier plate and the first circuit board to move.

10. The utility model provides a camera module which characterized in that includes:

the anti-shake assembly comprises an upper bracket, a lower bracket and a driving piece, the driving piece is connected with the upper bracket and the lower bracket, and the driving piece can drive the lower bracket to move relative to the upper bracket along the direction perpendicular to the optical axis of the lens of the camera module;

the first circuit board is fixed on the lower bracket;

and one end of the connecting piece is fixedly connected with the lower bracket, and the other end of the connecting piece is fixedly connected with the second daughter board.

11. The utility model provides a camera module which characterized in that includes:

a first circuit board;

the photosensitive chip is arranged on the first circuit board and can convert the acquired optical signals into electric signals, and the photosensitive chip and the first circuit board can move along the direction perpendicular to the optical axis of the lens of the camera module;

12. An electronic device, comprising a housing, a control component and the camera module according to any one of claims 1 to 11, wherein the camera module and the control component are respectively disposed on the housing, and the second circuit board in the camera module is electrically connected to the control component.