CN112702498B - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN112702498B CN112702498B CN202011593345.4A CN202011593345A CN112702498B CN 112702498 B CN112702498 B CN 112702498B CN 202011593345 A CN202011593345 A CN 202011593345A CN 112702498 B CN112702498 B CN 112702498B
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- connecting portion
- camera module
- photosensitive chip
- connection portion
- bending section
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses a camera module and electronic equipment, and belongs to the technical field of communication equipment, wherein the camera module comprises a lens, an optical filter, a circuit board and a photosensitive chip; the lens is arranged opposite to the optical filter, the circuit board comprises a first connecting part, a second connecting part and a first flexible bending section, the first connecting part and the second connecting part are connected through the first flexible bending section, the lens and the first connecting part are respectively positioned at two sides of the optical filter, the optical filter is arranged on the surface of the first connecting part, which is far away from the second connecting part, the photosensitive chip is arranged between the first connecting part and the second connecting part, and the photosensitive chip is electrically connected with the circuit board; the first connecting portion is provided with a light transmitting area, the light transmitting area is opposite to the light filter, and the photosensitive chip is opposite to the light transmitting area. According to the scheme, the problem that the electronic equipment is poor in light weight and thin property can be solved.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to a camera module and electronic equipment.
Background
At present, electronic devices (such as smart phones, tablet computers, and the like) have become indispensable products in human life. The electronic equipment is usually provided with a camera module to meet the requirements of users for shooting, video chatting and the like.
In the related art, the camera module generally comprises a shell, a lens and a photosensitive chip, wherein the lens and the photosensitive chip are arranged in the shell, the lens and the photosensitive chip are arranged oppositely, and light passes through the lens and then enters the photosensitive chip, so that the shooting function of the camera module is realized. In order to improve the shooting performance of the camera module, the camera module is further provided with an optical filter, and the optical filter is arranged between the lens and the photosensitive chip. At this time, the optical filter can filter light, so that the definition of an image can be improved.
In the process of implementing the invention, the inventor finds that in the related art, a fixing bracket for fixing the optical filter needs to be arranged in the housing, so that an installation space of the fixing bracket needs to be reserved in the housing, thereby enabling the volume of the camera module to be larger. Meanwhile, the thickness of the fixing support is large, so that the installation distance between the optical filter and the photosensitive chip is large, the size of the camera module is further increased, and the light weight and the thinness of the electronic equipment are poor.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, and the problem that the lightness and thinness of the electronic equipment are poor can be solved.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a camera module, which comprises a lens, an optical filter, a circuit board and a photosensitive chip;
the lens is arranged opposite to the optical filter, the circuit board comprises a first connecting part, a second connecting part and a first flexible bending section, the first connecting part and the second connecting part are connected through the first flexible bending section, the lens and the first connecting part are respectively positioned at two sides of the optical filter, the optical filter is arranged on the surface of the first connecting part, which is far away from the second connecting part, the photosensitive chip is arranged between the first connecting part and the second connecting part, and the photosensitive chip is electrically connected with the circuit board;
the first connecting portion is provided with a light transmitting area, the light transmitting area is opposite to the light filter, and the photosensitive chip is opposite to the light transmitting area.
The embodiment of the application also provides electronic equipment which comprises the camera module.
In the embodiment of the present application, the first connecting portion has a light-transmitting region, and the light-transmitting region is opposite to the optical filter and the photosensitive chip. The optical filter is arranged on the first connecting portion, so that the optical filter can be supported by the first connecting portion. The light rays pass through the light filter and the light-transmitting area and then enter the photosensitive chip. In the above embodiment, the first connecting portion can support the circuit board, so that the camera module is not required to be additionally provided with the fixed filter of the fixed support, the installation space of the camera module is saved, and the size of the camera module is smaller. Meanwhile, the optical filter and the photosensitive chip are both supported on the circuit board, and the thickness of the circuit board is smaller than that of the fixed support, so that the installation distance between the optical filter and the photosensitive chip is smaller, the size of the camera module is further reduced, and the light and thin property of the electronic equipment is further improved.
Drawings
Fig. 1 is a sectional view of a camera module disclosed in an embodiment of the present application;
fig. 2 and 3 are cross-sectional views of a circuit board in an unfolded state in a camera module disclosed in an embodiment of the present application;
fig. 4 is a top view of a circuit board in the camera module disclosed in the embodiment of the present application;
fig. 5 is a bottom view of a circuit board in the camera module disclosed in the embodiment of the present application.
Description of reference numerals:
100-lens,
200-optical filter,
300-circuit board, 310-first connecting part, 311-light-transmitting area, 320-second connecting part, 321-third connecting part, 322-fourth connecting part, 323-second flexible bending section, 330-first flexible bending section,
400-photosensitive chip, 410-photosensitive surface,
500-electronic components,
600-first electrical connection,
700-a supporting plate,
800-a second electrical connection,
900-drive mechanism.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes the camera module provided in the embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 1 to 5, an embodiment of the present application discloses a camera module, which includes a lens 100, a filter 200, a circuit board 300, and a photosensitive chip 400.
The lens 100 is disposed opposite to the filter 200. The optical filter 200 can filter light entering the lens 100, so that light with a wavelength affecting the image of the camera module can be filtered, and the camera module can obtain a clearer image.
The circuit board 300 includes a first connection portion 310, a second connection portion 320, and a first flexible bending section 330, and the first connection portion 310 and the second connection portion 320 are connected by the first flexible bending section 330. Since the first flexible bending section 310 has a certain flexibility, the first connection portion 310 and the second connection portion 320 can be located at opposite positions by bending the first flexible bending section 330.
The lens 100 and the first connecting portion 310 are respectively located at two sides of the filter 200. The filter 200 is disposed on a surface of the first connection portion 310 away from the second connection portion 320. The photosensitive chip 400 is disposed between the first connection portion 310 and the second connection portion 320, and the photosensitive chip 400 is electrically connected to the circuit board 300.
The first connecting portion 310 has a light-transmitting region 311, the light-transmitting region 311 is disposed opposite to the filter 200, and the light-sensing chip 400 is disposed opposite to the light-transmitting region 311. Light rays in the external environment enter the camera module through the lens 100, then pass through the optical filter 200 and the photosensitive area, and are transmitted to the photosensitive chip 400, so that the light rays are converted into image information.
Alternatively, the photosensitive chip 400 may be electrically connected with at least one of the first connection portion 310, the second connection portion 320, or the third connection portion 321. The second connecting portion 320 may be electrically connected to a main board of the electronic device, the photosensitive chip 400 converts the received optical signal into an electrical signal, and the electrical signal is transmitted to the electronic device through the second connecting portion 320, so as to implement a shooting function of the electronic device.
In the embodiment disclosed in the present application, the optical filter 200 is disposed on the first connecting portion 310, and therefore the first connecting portion 310 can support the circuit board 300, so that the optical filter 200 is not required to be additionally fixed by a fixing bracket in the camera module, and thus the installation space of the camera module is saved, and the size of the camera module is small. Meanwhile, the optical filter 200 and the photosensitive chip 400 are both supported on the circuit board 300, and the thickness of the circuit board 300 is smaller than that of the fixed support, so that the installation distance between the optical filter 200 and the photosensitive chip 400 is smaller, the size of the camera module is further reduced, and the light and thin property of the electronic device is further improved.
Optionally, the photosensitive chip 400 may be a high-resolution photosensitive chip 400, so that the camera module has better performance, and thus the electronic device has better user experience. The photo-sensing chip 400 may be a CMOS (Complementary Metal Oxide Semiconductor) imaging chip.
Alternatively, the first connection portion 310 and the second connection portion 320 may be rigid circuit boards or flexible circuit boards. For example, the first connection portion 310 and the second connection portion 320 may be printed circuit boards, or rigid-flex boards, or the first connection portion 310 and the second connection portion 320 may include a flexible circuit board and a stiffener that are attached to each other. Of course, other configurations may be used, and are not limited herein.
In the above embodiment, the camera module further includes a housing, and the housing provides an installation foundation for other components of the camera module. The lens 100, the filter 200, the circuit board 300 and the photosensitive chip 400 may be located in the housing.
In an alternative embodiment, the light-transmitting region 311 may be made of a transparent substrate, and in this case, the first connecting portion 310 is a structure without an opening. The light-transmitting region 311 may be made of transparent glass, PET (Polyethylene terephthalate), or the like. In this embodiment, the first connecting portion 310 does not have an opening, so the first connecting portion 310 has better strength.
Alternatively, in another alternative embodiment, the light-transmitting region 311 may be a light-transmitting hole, and in this case, the first connection portion 310 may be provided with a light-transmitting hole for transmitting light, and the light-transmitting hole may be made by a material-removing process. Such as stamping, laser cutting, milling, etc. In this scheme, the light transmission region 311 can be a light transmission hole, and the light transmission hole has better light transmissivity to can improve the optical property of camera module.
The camera module disclosed in the application further comprises an electronic component 500, and the electronic component 500 can be arranged on the circuit board 300, so that the function of the camera module is realized. The electronic component 500 may be at least one of a resistor, a capacitor, an inductor, a potentiometer, a tube, and a heat sink.
In the above embodiment, the electronic component 500 may be disposed on a side of the second connection portion 320 facing the first connection portion 310, and at this time, the electronic component 500 and the light sensing chip 400 may be disposed on the same side of the second connection portion 320, so that the second connection portion 320 has a larger mounting surface, and the volume of the second connection portion 320 is larger, so that the second connection portion 320 occupies a larger mounting space.
Based on this, in another alternative embodiment, the electronic component 500 may be disposed on a surface of the second connection portion 320 on a side away from the photosensitive chip 400, and electrically connected to the second connection portion 320. In this scheme, electronic components 500 and sensitization chip 400 distribute in the both sides of second connecting portion 320, and two surfaces that carry on the back of the body of second connecting portion 320 all can be for installing the face to make the volume of second connecting portion 320 can set up less, and then make second connecting portion 320 occupy less installation space, further reduced the length direction or the width direction's of camera module size.
In addition, the electronic component 500 may be mounted on both sides of the second connection portion 320, thereby improving the utilization rate of the second connection portion 320.
In addition, the photosensitive chip 400 and the electronic component 500 are disposed on two surfaces opposite to each other of the second connection portion 320, so that the photosensitive chip 400 is not easily interfered with the electronic component 500.
In the above embodiment, the circuit board 300 has the connection pins embedded therein, and the circuit board 300 can be connected to the photo sensor chip 400 through the connection pins. However, since the connection pins protrude from the photosensitive chip 400, the actual mounting surface of the photosensitive chip 400 is the contact surface between the photosensitive chip 400 and the circuit board 300 and the mounting surface occupied by the connection pins, so that the photosensitive chip 400 occupies a larger mounting area. Based on this, in another optional embodiment, the camera module disclosed in this application may further include a first electrical connection portion 600, and the first electrical connection portion 600 may be located between the first connection portion 310 and the photosensitive chip 400. The photosensitive chip 400 and the first connection portion 310 may be electrically connected through the first electrical connection portion 600. In this scheme, the first electrical connection portion 600 may be located between the first connection portion 310 and the photosensitive chip 400, so that the first electrical connection portion 600 does not protrude from the photosensitive chip 400, and therefore the photosensitive chip 400 occupies the mounting surface of the first connection portion 310, that is, the contact surface between the photosensitive chip 400 and the first connection portion 310, and therefore the mounting area of the circuit board 300 occupied by the photosensitive chip 400 is smaller.
Or, in another alternative embodiment, the first electrical connection portion 600 may be located between the second connection portion 320 and the photosensitive chip 400. The photosensitive chip 400 and the second connection portion 320 may be electrically connected through the first electrical connection portion 600. This embodiment can achieve the same effects as the above embodiments, and is not described herein again.
It should be noted that the first electrical connection portion 600 is only used for electrical connection between the photosensitive chip 400 and the first connection portion 310 or the second connection portion 320, so that the first electrical connection portion 600 can make full use of the gap between the first connection portion 310 and the second connection portion 320 and the photosensitive chip 400, and the first electrical connection portion 600 does not affect the overall thickness of the camera module.
Alternatively, the first electrical connection portion 600 may be a conductive contact or solder, but the first electrical connection portion 600 may also be other electrical connection structures, which is not limited herein.
In order to improve the rigidity of the photosensitive chip 400, in another alternative embodiment, the camera module disclosed in the embodiment of the present application may further include a supporting plate 700, and the supporting plate 700 may be located between the photosensitive chip 400 and the second connecting portion 320. The support plate 700 may be disposed at the second connection part 320. The photosensitive chip 400 may be disposed on the supporting plate 700, and the supporting plate 700 may be used to support the photosensitive chip 400. This scheme can improve sensitization chip 400's rigidity to make sensitization chip 400 be difficult to damage, and then improve the security and the reliability of camera module.
In addition, the supporting plate 700 is disposed on the second connecting portion 320, so that the second connecting portion 320 has good rigidity, and the plate surface of the second connecting portion 320 is not easy to bend, so that the joint between the second connecting portion 320 and the electronic component 500 is not easy to crack, and the safety of the camera module is further improved.
Specifically, the supporting plate 700 may be attached to the photosensitive chip 400, for example, the photosensitive chip 400 and the supporting plate 700 are attached by a double-sided tape, the supporting plate 700 may be a steel sheet or a PET (Polyethylene terephthalate) sheet, and of course, the supporting plate 700 may also be made of other materials, which is not limited herein. Of course, the support plate 700 and the second connecting portion 320 may also be connected in the above-mentioned manner, and the present disclosure is not limited thereto.
In order to prevent the edge of the photosensitive area from shielding the edge of the photosensitive surface 410 of the photosensitive chip 400, in another alternative embodiment, the projection profile of the photosensitive surface 410 of the photosensitive chip 400 in the direction perpendicular to the projection direction of the first connection portion 310 may be located within the projection profile of the transparent area 311. In this scheme, the photosurface 410 of the photosensitive chip 400 is exposed in the light-transmitting area 311, so that the photosurface 410 of the photosensitive chip 400 is not easily shielded, and further the photosensitive chip 400 can receive more light rays, thereby improving the optical performance of the photosensitive chip 400.
It should be noted that the projected contour of the photosensitive surface 410 may be located within the projected contour of the light-transmitting region 311, and not the projected contour of the entire photosensitive chip 400 is located within the projected contour of the light-transmitting region 311. Of course, the projection profile of the entire photosensitive chip 400 may be located within the projection profile of the light-transmitting region 311, which is not limited herein.
In order to make the circuit board 300 easier to bend, in another alternative embodiment, the thickness of the first connection portion 310 may be greater than that of the first flexible bending section 330. In this scheme, the thickness of the first flexible bending section 330 is smaller, so that the first flexible bending section is easier to bend, and the circuit board 300 is more convenient and simple to bend. Meanwhile, the thickness of the first flexible bending section 330 is small, so that excessive material accumulation is not easy to cause when the first flexible bending section 330 is bent, and the first flexible bending section 330 is not easy to break.
In another alternative embodiment, the thickness of the second connecting portion 320 may be greater than the thickness of the first flexible bending section 330. This scheme can achieve the same effect as the above embodiments, and therefore, is not described herein again.
In order to make the second flexible bending segment 323 easier to bend, in another alternative embodiment, the arrangement direction of the first connecting portion 310, the first flexible bending segment 330, and the second connecting portion 320 may be a first extending direction, and the first extending direction may be a length direction of the circuit board 300, where the length direction of the circuit board 300 is a length direction of the circuit board 300 when the circuit board 300 is unfolded. The thickness direction of the circuit board 300 is a second extending direction, and the thickness direction of the circuit board 300 is a direction in which the circuit board 300 is unfolded. The third extending direction may be perpendicular to the first extending direction and perpendicular to the second extending direction, and the third extending direction may be a width direction of the circuit board 300, where the width direction of the circuit board 300 is a width direction of the circuit board 300 when the circuit board 300 is unfolded.
The dimension of the first connecting portion 310 in the third extending direction may be greater than the dimension of the first flexible bending section 330 in the third extending direction, that is, the width of the first connecting portion 310 may be greater than the width of the first flexible bending section 330. The dimension of the second connection portion 320 in the third extending direction may be greater than the dimension of the first flexible bending section 330 in the third extending direction, that is, the width of the first flexible bending section 330 may be greater than the width of the second connection portion 320.
In this scheme, the size of first flexible bending section 330 is less, and then makes first flexible bending section 330 take place deformation more easily, and then makes things convenient for first flexible bending section 330 to bend.
In the above embodiment, the first extending direction may be a width direction of the circuit board 300, and the third extending direction may be a length direction of the circuit board 300, which is not limited herein.
In the above embodiment, when the second connection portion 320 is a rigid board, the second connection portion 320 is not easily bent, so that the difficulty of connecting the second connection portion 320 with the motherboard of the electronic device is large. When the second connecting portion 320 is a flexible board, the board surface of the second connecting portion 320 is easy to deform, so that the connecting portion between the second connecting portion 320 and the electronic component 500 or the photosensitive chip 400 is easy to break, and the security of the camera module is low.
Based on this, in another alternative embodiment, the second connection portion 320 may include a third connection portion 321, a fourth connection portion 322, and a second flexible bending section 323, the third connection portion 321 may be disposed opposite to the first connection portion 310, and the third connection portion 321 may be connected to the fourth connection portion 322 through the second flexible bending section 323. The fourth connection portion 322 may be provided with a second electrical connection portion 800, and the second electrical connection portion 800 may be electrically connected to a main board of the electronic device.
In this scheme, electronic component 500 or sensitization chip 400 can set up in third connecting portion 321, because the great third connecting portion 321 of the rigidity of third connecting portion 321 is difficult to take place deformation, and then make the junction of third connecting portion 321 and electronic component 500 or sensitization chip 400 be difficult to the fracture, and then improved the security of camera module. Similarly, the connection between the second electrical connection portion 800 and the fourth connection portion 322 is also not easily broken.
In addition, the second flexible bending piece has flexibility, so that the second flexible bending piece is easier to bend, and the connection difficulty between the second connecting portion 320 and the main board of the electronic device is smaller.
Alternatively, the second electrical connection portion 800 may be an electrical connection structure such as a board-to-board connector, a conductive contact, etc., and of course, the second electrical connection portion 800 may also adopt other electrical connection structures, which is not limited herein.
In another alternative embodiment, the thickness of the first connecting portion 310, the third connecting portion 321 and the fourth connecting portion 322 may be greater than the thickness of the first flexible bending section 330 and the second flexible bending section 323. In this scheme, the first flexible bending section 330 and the second flexible bending section 323 have smaller thicknesses, so that the circuit board 300 can be bent more easily, and the bending is more convenient and simple. Meanwhile, the thickness of the first flexible bending section 330 and the second flexible bending section 323 is small, so that the first flexible bending section 330 and the second flexible bending section 323 are not easy to cause excessive material accumulation, and the first flexible bending section 330 and the second flexible bending section 323 are not easy to break.
In the above embodiment, the camera module disclosed in this application may further include a driving mechanism 900, the driving mechanism 900 may be disposed in the housing of the camera module, the driving mechanism 900 is connected to the lens 100, and the driving mechanism 900 is configured to drive the lens 100 to move, so as to implement focusing and anti-shake functions of the camera module. Need set up fixed knot structure in the casing and be used for fixed actuating mechanism 900, consequently need reserve fixed knot structure's installation space in the casing to make the volume of camera module great.
Based on this, in another alternative embodiment, the driving mechanism 900 may be disposed on the first connection portion 310 and electrically connected to the first connection portion 310, and specifically, the driving mechanism 900 and the filter 200 may be disposed on the same side of the first connection portion 310. In this scheme, actuating mechanism 900 is installed on first connecting portion 310 to make the casing of camera module need not additionally to set up the fixed actuating mechanism 900 of fixed knot structure in, and then save the installation space of camera module, further reduce the volume of camera module.
In addition, since the driving mechanism 900 is directly overlapped on the first connecting portion 310, the driving mechanism 900 and the first connecting portion 310 can be electrically connected in a contact manner, so that the driving mechanism 900 and the circuit board 300 do not need to be additionally provided with other electrical connection structures, the structure of the camera module is simple and compact, and the manufacturing cost of the camera module is reduced.
Alternatively, the driving mechanism 900 and the first connection portion 310 may be respectively provided with corresponding solders, and the driving mechanism 900 may be welded to the first connection portion 310. Of course, the driving mechanism 900 and the first connecting portion 310 may be connected in other ways, and the present disclosure is not limited thereto.
The driving mechanism 900 in the above embodiments may be a linear motor, an air cylinder, a servo motor, a voice coil motor, or other power structures, and the driving mechanism 900 may also be other power structures, which is not limited herein.
In the above embodiments, the driving mechanism 900 and the optical filter 200 are located on the same side of the first connecting portion 310, and the driving mechanism 900 is easily interfered with the optical filter 200 during assembly, thereby easily causing difficulty in assembling the camera module.
Based on this, in another alternative embodiment, the housing of the driving mechanism 900 may be opened with an avoiding groove, and at least a portion of the optical filter 200 may be located in the avoiding groove. At this time, at least a portion of the filter 200 may be hidden in the avoiding groove, so that the driving mechanism 900 may be prevented from interfering with the filter 200. In addition, at least part of the filter 200 can be hidden in the avoiding groove, so that the stacking height of the filter 200 and the driving mechanism 900 can be reduced, and the thickness of the camera module is further reduced. In addition, the groove bottom of the avoiding groove is lapped on the edge of the optical filter 200, so that the driving mechanism 900 is installed more stably.
Based on the camera module of the above-mentioned embodiment of this application embodiment, this application embodiment also discloses an electronic equipment, and the electronic equipment who discloses includes above-mentioned embodiment the camera module.
The electronic device disclosed in the embodiment of the application can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.
Claims (12)
1. A camera module is characterized by comprising a lens (100), an optical filter (200), a circuit board (300) and a photosensitive chip (400);
the lens (100) and the optical filter (200) are arranged oppositely, the circuit board (300) comprises a first connecting portion (310), a second connecting portion (320) and a first flexible bending section (330), the first connecting portion (310) and the second connecting portion (320) are connected through the first flexible bending section (330), the lens (100) and the first connecting portion (310) are respectively located on two sides of the optical filter (200), the optical filter (200) is arranged on the surface, deviating from the second connecting portion (320), of the first connecting portion (310), the photosensitive chip (400) is arranged between the first connecting portion (310) and the second connecting portion (320), and the photosensitive chip (400) is electrically connected with the circuit board (300);
a light transmission area (311) is formed in the first connecting portion (310), the light transmission area (311) is opposite to the optical filter (200), and the photosensitive chip (400) is opposite to the light transmission area (311).
2. The camera module according to claim 1, further comprising an electronic component (500), wherein the electronic component (500) is disposed on a surface of the second connecting portion (320) on a side away from the photosensitive chip (400), and is electrically connected to the second connecting portion (320).
3. The camera module according to claim 1, further comprising a first electrical connection portion (600), wherein the first electrical connection portion (600) is located between the first connection portion (310) and the photosensitive chip (400), and the photosensitive chip (400) and the first connection portion (310) are electrically connected through the first electrical connection portion (600).
4. The camera module according to claim 1, further comprising a first electrical connection portion (600) between the second connection portion (320) and the photo-sensing chip (400), wherein the photo-sensing chip (400) and the second connection portion (320) are electrically connected through the electrical connection portion.
5. The camera module according to claim 1, further comprising a support plate (700), wherein the support plate (700) is located between the photosensitive chip (400) and the second connecting portion (320), the support plate (700) is disposed on the second connecting portion (320), and the photosensitive chip (400) is disposed on the support plate (700).
6. The camera module according to claim 1, wherein a projection profile of a light-sensing surface (410) of the light-sensing chip (400) is located within a projection profile of the light-transmitting region (311) in a direction perpendicular to a projection direction of the first connecting portion (310).
7. The camera module according to claim 1, wherein the thickness of the first connecting portion (310) is greater than the thickness of the first flexible bending section (330); and/or the presence of a gas in the gas,
the thickness of the second connecting part (320) is larger than that of the first flexible bending section (330).
8. The camera module according to claim 1, wherein when the circuit board (300) is unfolded, the arrangement direction of the first connecting portion (310), the first flexible bending section (330) and the second connecting portion (320) is a first extending direction, the thickness direction of the circuit board (300) is a second extending direction, a third extending direction is perpendicular to the first extending direction and the second extending direction, the dimension of the first connecting portion (310) in the third extending direction is greater than the dimension of the first flexible bending section (330) in the third extending direction, and the dimension of the second connecting portion (320) in the third extending direction is greater than the dimension of the first flexible bending section (330) in the third extending direction.
9. The camera module according to claim 1, wherein the second connecting portion (320) includes a third connecting portion (321), a fourth connecting portion (322), and a second flexible bending section (323), the third connecting portion (321) is disposed opposite to the first connecting portion (310), the third connecting portion (321) is connected to the fourth connecting portion (322) through the second flexible bending section (323), the fourth connecting portion (322) is provided with a second electrical connecting portion (800), and the second electrical connecting portion (800) is electrically connected to a main board of an electronic device.
10. The camera module according to claim 9, wherein the first connecting portion (310), the third connecting portion (321) and the fourth connecting portion (322) have a thickness greater than the first flexible bending section (330) and the second flexible bending section (323).
11. The camera module according to claim 1, further comprising a driving mechanism (900), wherein the driving mechanism (900) is disposed on the first connecting portion (310) and electrically connected to the first connecting portion (310), and the driving mechanism (900) is drivingly connected to the lens (100).
12. An electronic device, comprising the camera module according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011593345.4A CN112702498B (en) | 2020-12-29 | 2020-12-29 | Camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011593345.4A CN112702498B (en) | 2020-12-29 | 2020-12-29 | Camera module and electronic equipment |
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| CN112702498A CN112702498A (en) | 2021-04-23 |
| CN112702498B true CN112702498B (en) | 2022-07-01 |
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| CN202011593345.4A Active CN112702498B (en) | 2020-12-29 | 2020-12-29 | Camera module and electronic equipment |
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| WO2022241741A1 (en) * | 2021-05-20 | 2022-11-24 | 欧菲光集团股份有限公司 | Circuit board assembly, camera module, and electronic device |
| CN117201899A (en) * | 2022-05-27 | 2023-12-08 | 华为技术有限公司 | Camera assembly, preparation method of camera assembly and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108668066A (en) * | 2018-08-01 | 2018-10-16 | 歌尔股份有限公司 | Camera module and its installation method |
| CN112019722A (en) * | 2020-09-04 | 2020-12-01 | 湖南金康光电有限公司 | Camera module and electronic equipment |
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