CN102298184B - Camera module and assembling method thereof - Google Patents
Camera module and assembling method thereof Download PDFInfo
- Publication number
- CN102298184B CN102298184B CN201010210083.9A CN201010210083A CN102298184B CN 102298184 B CN102298184 B CN 102298184B CN 201010210083 A CN201010210083 A CN 201010210083A CN 102298184 B CN102298184 B CN 102298184B
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- plate body
- camera module
- image sensor
- lens
- eyeglass
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Abstract
The invention relates to a camera module which comprises a lens component and a substrate component, wherein the substrate component is mounted on the lens component; the lens component comprises a lens, a lens cone and a lens base; the lens cone is used for accommodating the lens; the lens base is used for accommodating the lens cone; the substrate component comprises a plate body and an image sensing unit mounted on one surface of the plate body; a slant friction surface is formed on the side surface of the plate body; and the side surface is close to the surface on which the image sensing unit is mounted. The camera module provided by the invention has higher quality. The invention also provides an assembling method of the camera module.
Description
Technical field
The present invention relates to a kind of camera module and assemble method thereof.
Background technology
General camera module comprises eyeglass, holds microscope base and the substrate of eyeglass.On substrate, be provided with Image Sensor, for the light signal from eyeglass is converted to electric signal.During assembling, first eyeglass is arranged in microscope base, recycling fixture by substrate orientation in precalculated position, adopt surface mounting technology substrate is arranged on microscope base, thereby by microscope base with substrate package together with, formation camera module.
In above-mentioned assembling process, the position of substrate is for presetting, and still, eyeglass may exist alignment error while being arranged in microscope base, causes the center of the Image Sensor on substrate and the misalignment of eyeglass, affects image quality, or causes defective products to increase.
Summary of the invention
In view of foregoing, be necessary to provide camera module and the assemble method thereof that a kind of quality is higher.
A kind of camera module, it comprises lens assembly, is arranged on the board unit on lens assembly.Lens assembly comprises eyeglass, accommodate the lens barrel of this eyeglass and hold the microscope base of this lens barrel.Board unit comprises plate body and is arranged on a lip-deep Image Sensor of this plate body.On contiguous this surperficial side of plate body, be formed with the rubbing surface of inclination.
An assemble method for camera module, it comprises the steps: to provide a lens assembly, and this lens assembly comprises eyeglass and accommodates the lens barrel of this eyeglass; One board unit is provided, this lens assembly comprises eyeglass, accommodate the lens barrel of this eyeglass and hold the microscope base of this lens barrel, board unit comprise plate body and position on this plate body one surface for receiving the Image Sensor of light signal of comfortable eyeglass, and this light signal is converted into electric signal; On the side of plate body and Image Sensor vicinity, be formed with the rubbing surface of inclination; One the first clamp body that moves this substrate is provided, and this first clamp body is formed with the clamping face matching with this rubbing surface; One contact base is provided, and this contact base comprises the probe being electrically connected separably with plate body; One image display is provided, and image display is connected with this contact base and electric signal that Image Sensor is changed is shown as image; The first clamp body according to the shown picture quality lens fine-tuning assembly of this image display with the relative position of board unit to aim at this eyeglass and this Image Sensor; Plate body is fixed on this camera lens module.
The assemble method of above-mentioned camera module utilizes the real-time Imaging for Monitoring quality of image display, and according to image quality, utilize the relative position of floating holder fine tuning video sensing element and lens assembly, to aim at Image Sensor and camera lens, improve the camera module quality after assembling.The plate body of above-mentioned camera module has the rubbing surface that has inclination, the first clamp body has the corresponding clamping face of rubbing surface with plate body, in assembling process, the clamping face of the first clamp body matches with the rubbing surface of plate body, can offset the power of supporting of probe, avoid plate body that displacement or fracture, the quality while being conducive to improve assembly occur in assembling process.
Accompanying drawing explanation
Fig. 1 adopts the assemble method of camera module of the present invention to assemble the cut-open view of the camera module of the first embodiment.
Fig. 2 is the cut-open view of the camera module of second embodiment of the invention.
Fig. 3 is the cut-open view of the camera module of third embodiment of the invention.
Fig. 4 is the cut-open view of the camera module of four embodiment of the invention.
Fig. 5 is the cut-open view of the camera module of fifth embodiment of the invention.
Main element symbol description
| |
100、600、700、800、900 |
| |
20、90 |
| |
21 |
| |
23 |
| |
231 |
| Microscope |
25 |
| |
251 |
| |
26 |
| |
27、67、97 |
| |
270 |
| |
271、871 |
| Passive device | 29、69 |
| Image Sensor | 28、68、78、88 |
| |
30 |
| The |
31 |
| Clamping |
313 |
| The |
32 |
| |
50 |
| |
501 |
| |
503 |
| Cylindrical shell | 5031 |
| |
5033 |
| |
5035 |
| |
5036 |
| Connecting |
5037 |
| Fixed part | 5038 |
| |
5039 |
| |
505 |
| |
51 |
| Host cavity | 601、801 |
| |
702 |
| Separate cavities | 703、803 |
| Add-in |
99 |
Embodiment
Below in conjunction with drawings and the embodiments, camera module of the present invention and assemble method thereof are described in further detail.
Refer to Fig. 1, assemble method of the present invention is used for assembling camera module 100, and this camera module 100 comprises lens assembly 10 and board unit 20.Lens assembly 10 comprises eyeglass 21, hold the lens barrel 23 of eyeglass 21, hold microscope base 25 and the optical filter 26 of lens barrel 23.Eyeglass 21 is fixed in lens barrel 23.Lens barrel 23 one end offer light hole 231, and microscope base 25 offers container cavity 251 at one end opening place, for holding optical filter 26.Optical filter 26 is arranged on the diapire in container cavity 251.On lens barrel 23 outer walls, be formed with external thread (not indicating), on microscope base 25 inwalls, be formed with the internal thread corresponding with lens barrel 23 external threads, and pass through threaded engagement, lens barrel 23 is arranged in microscope base 25, and lens barrel 23 offer light hole 231 one end away from optical filter 26, thereby lens assembly 10 is encapsulated.Board unit 20 comprises plate body 27 and a lip-deep Image Sensor 28 at plate body 27 and the difference position passive device 29 in these Image Sensor 28 both sides.Passive device 29 can be resistor, capacitor, inductor etc., to strengthen the function of board unit 20.Board unit 20 is arranged on lens barrel 23 proximity filter 26 one end, 29 of Image Sensor 28 and passive devices are in container cavity 251, light can be entered from this light hole 231, after eyeglass 21, optical filter 26, from lens barrel 23 other ends, penetrate to the Image Sensor 28 of board unit 20 successively.Optical filter 26 can elimination infrared light, improves imaging effect.Certainly, optical filter 26 can arrange according to the actual requirements or omit.The side of plate body 27 is formed with rubbing surface 270, and this rubbing surface 270 is inclined-plane, makes plate body 27 in the direction of contiguous Image Sensor 28, and width reduces gradually.
The assemble method of camera module of the present invention comprises the following steps:
The lens assembly 10 of encapsulation is provided.
One board unit 20 is provided, and board unit 20 comprises plate body 27 and a lip-deep Image Sensor 28 at plate body 27.Plate body 27 is a circuit board, and plate body 27 both sides of the edge are formed with respectively the rubbing surface 270 of an inclination, so that clamping.Between Image Sensor 28 and plate body 27, adopt wire (figure is mark not) to be connected.On the opposite side surface of plate body 27 away from Image Sensor 28, be provided with the contact chip 271 at two intervals, for being connected with motherboard (not shown) or other signal of video signal display device and signal transmission.
Floating holder 30 is provided.In present embodiment, floating holder 30 comprises the first clamp body 31 and the second clamp body 32.The first clamp body is used for clamping plate body 27.The inner side of the first clamp body 31 is formed with the clamping face corresponding with the rubbing surface 270 of plate body 27 313, for clamping plate body 27.The second clamp body 32 is for clamping microscope base 25.Certainly, the second clamp body 32 can omit according to actual conditions, and by the first clamp body 31 clamping mobile plate body 27 separately, the also position of capable of regulating board unit 20 and microscope base 25.
Utilize above-mentioned the first clamp body 31 to clamp board unit 20, utilize the first clamp body 31 to clamp microscope base 25, movable substrate assembly 20 and/or microscope base 25, make eyeglass 21 aim at Image Sensor 28 centers.
One contact base 50 and an image display 51 are provided.Contact base 50 comprises a matrix 501, two probes 503 and circuit boards 505.Probe 503 comprises cylindrical shell 5031, is contained in spring 5033 and probe 5035 in cylindrical shell 5031.In cylindrical shell 5031, position is in matrix 501, and expose outside matrix 501 at two ends.Cylindrical shell 5031 one end bend inwards and form limiting section 5036, and the other end is formed with the connecting portion 5037 of closed cylinder 5031.Probe 5035 comprises fixed part 5038 and contact site 5039, and wherein the diameter of fixed part 5038 is roughly suitable with cylindrical shell 5031 internal diameters, and the diameter of contact site 5039 is less than the diameter of fixed part 5038.Spring 5033 one end are fixed on fixed part 5038 away from contact site 5039 one end, and one end is fixed on connecting portion 5037 in addition.Spring 5033 supports probe 5035, makes contact site 5039 through limiting section 5036, and gives prominence to outside cylindrical shell 5031.Due to stopping of limiting section 5036, probe 5035 cannot be deviate from cylindrical shell 5031.Circuit board 505 is connected through wire with image display 51.In present embodiment, image display 51 is computing machine.
Floating holder 30 moves plate body 27 and lens assembly 10 to Image Sensor 28 centers on plate body 27 and the position of eyeglass 21 center rough alignment.
Two contact chips 271 that two probes 503 of contact base 50 supported respectively to plate body 27 with electric connection, the optical information of the external image entering from the light hole 231 of lens barrel 23 is successively after eyeglass 21 and optical filter, be radiated on Image Sensor 28 and be converted into telecommunications breath, through the circuit board 505 of plate body 27, probe 503, contact base 50, transferring on image display 51.By the shown quality of image of image display 51, the eyeglass 21 of lens fine-tuning assembly 10 and the relative position of Image Sensor 28.When the shown picture quality of image display 51 is best, eyeglass 21 is aimed at completely with Image Sensor 28, and floating holder 30 is located lens assembly 10 and plate body 27, plate body 27 is arranged on the microscope base 25 of lens assembly 10.Remove floating holder 30 and contact base 50, obtain camera module 100.The mode that plate body 27 is arranged on microscope base 25 can adopt surface mount mode or other fixed form.
The assemble method of this case camera module utilizes the real-time Imaging for Monitoring quality of image display 51, and according to image quality, utilize the relative position of floating holder 30 fine tuning video sensing elements 28 and lens assembly 10, to aim at Image Sensor 28 and eyeglass 21, improve camera module 100 yields and quality after assembling.
At two probes 503, support respectively in the process of two contact chips 271 of plate body 27, because plate body 27 has rubbing surface 270, make plate body 27 in the close direction of lens barrel 23, width reduces gradually.And the first clamp body 31 has the clamping face corresponding with the rubbing surface 270 of plate body 27 313, when the first clamp body 31 clamps after plate body 27, clamping face 313 matches with rubbing surface 270, can prevent that plate body 27 is shifted or fracture in the interior generation of the first clamp body 31 under the effect of the power of supporting of probe 503, impact assembling, improves assembling yield and quality.
Refer to Fig. 2, the camera module 600 of second embodiment of the invention is similar with the structure of camera module 100, its difference is: on plate body 67, offer host cavity 601, Image Sensor 68 is arranged in this host cavity 601, is conducive to the distance of conserve space or adjustment Image Sensor 68 and eyeglass.
Refer to Fig. 3, the camera module 700 of third embodiment of the invention is similar to the camera module 600 of the second embodiment, its difference is: the host cavity 701 of camera module 700 is opened in Image Sensor 78 belows, and camera module 700 also comprises the integrated circuit 702 being contained in host cavity 701.Integrated circuit 702 can be drive IC (integrated circuit), power supply control IC etc., and integrated circuit 702 also can be other functional IC certainly, to strengthen or to increase new function to board unit 70.Board unit 70 is arranged on passive device 79 and integrated circuit 702 inside of plate body 67, is conducive to conserve space.
Refer to Fig. 4, the camera module 800 of four embodiment of the invention is similar to camera module 600, and its difference is: on plate body 87, also offer separate cavities 803; Host cavity 801 and separate cavities 803 penetrate plate body 87 jointly, and 88 of Image Sensors are in host cavity 801 and separate this host cavity 801 and separate cavities 803, and 871 corners in the bottom of plate body 87 of contact chip.This camera module 800 is applicable to the camera head that side connects (side contact).
Refer to Fig. 5, the camera module 900 of fifth embodiment of the invention is similar to the camera module 800 of the 4th embodiment, its difference is: this board unit 90 also comprises an add-in card 99, and add-in card 99 is a circuit board, its with plate body 97 between adopt wire to be connected.Add-in card 99 is provided with lug plate (not shown) on the bottom surface away from plate body 97, for being connected with probe or motherboard.Camera module 900 is applicable to the camera head that the end connects (bottom contact).In addition, those skilled in the art also can do other variation in spirit of the present invention.Certainly, the variation that these do according to spirit of the present invention, all should be included in the present invention's scope required for protection.
Claims (9)
1. a camera module, it comprises lens assembly, is arranged on the board unit on lens assembly, this lens assembly comprises eyeglass, accommodate the lens barrel of this eyeglass and hold the microscope base of this lens barrel, this board unit comprises plate body and is arranged on a lip-deep Image Sensor of this plate body, it is characterized in that: the rubbing surface that is formed with inclination on contiguous this surperficial side of this plate body; This plate body diminishes gradually at the direction width that is close to lens assembly, and the surperficial width that this plate body arranges Image Sensor is greater than the external diameter that microscope base is close to the internal diameter of this plate body one end and is less than this end on microscope base.
2. camera module as claimed in claim 1, is characterized in that: on this plate body, offer host cavity, this Image Sensor position is in this host cavity.
3. camera module as claimed in claim 1, is characterized in that: on this plate body, also under this Image Sensor, offer host cavity, this camera module also comprises passive device and the integrated circuit of position in this host cavity.
4. camera module as claimed in claim 2, is characterized in that: on this plate body, also offer separate cavities, this Image Sensor separates this host cavity and this separate cavities.
5. camera module as claimed in claim 4, is characterized in that: this camera module also comprises add-in card, and this add-in card position is at this plate body on the surface away from lens assembly, for being connected with the motherboard of camera head.
6. an assemble method for camera module, it comprises the steps:
One lens assembly is provided, and this lens assembly comprises eyeglass, accommodate the lens barrel of this eyeglass and hold the microscope base of this lens barrel;
One board unit is provided, this board unit comprise plate body and position on this plate body one surface for receiving the Image Sensor of light signal of comfortable eyeglass, and this light signal is converted into electric signal, on the side of this plate body and Image Sensor vicinity, be formed with the rubbing surface of inclination; This plate body diminishes gradually at the direction width that is close to lens assembly, and the surperficial width that this plate body arranges Image Sensor is greater than the external diameter that microscope base is close to the internal diameter of this plate body one end and is less than this end on microscope base;
The assemble method of this camera module also comprises:
One the first clamp body that moves this substrate is provided, and this first clamp body is formed with the clamping face matching with this rubbing surface;
One contact base is provided, and this contact base comprises the probe being electrically connected separably with this plate body;
One image display is provided, and this image display is connected with this contact base and electric signal that Image Sensor is changed is shown as image;
This first clamp body according to the shown picture quality lens fine-tuning assembly of this image display with the relative position of this board unit to aim at this eyeglass and this Image Sensor;
This plate body is fixed on this camera lens module.
7. the assemble method of camera module as claimed in claim 6, is characterized in that: this plate body adopts surface-pasted mode to be arranged on this lens assembly.
8. the assemble method of camera module as claimed in claim 6, it is characterized in that: this probe comprises cylindrical shell, be movably arranged on probe in cylindrical shell and position in cylindrical shell and support the spring of this probe, and this substrate of this probe support is also electrically connected separably with this substrate.
9. the assemble method of camera module as claimed in claim 8, is characterized in that: this plate body is provided with the contact chip for being connected with this probe on the other surface away from Image Sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010210083.9A CN102298184B (en) | 2010-06-25 | 2010-06-25 | Camera module and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010210083.9A CN102298184B (en) | 2010-06-25 | 2010-06-25 | Camera module and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102298184A CN102298184A (en) | 2011-12-28 |
| CN102298184B true CN102298184B (en) | 2014-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010210083.9A Expired - Fee Related CN102298184B (en) | 2010-06-25 | 2010-06-25 | Camera module and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102298184B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102902137B (en) * | 2012-10-31 | 2015-12-02 | 信利光电股份有限公司 | A kind of camera module and base thereof |
| KR20150129513A (en) * | 2014-05-12 | 2015-11-20 | 삼성전기주식회사 | Camera module |
| US9772465B2 (en) * | 2015-06-04 | 2017-09-26 | Qualcomm Incorporated | Methods and devices for thin camera focusing alignment |
| CN113992818A (en) * | 2016-08-12 | 2022-01-28 | 宁波舜宇光电信息有限公司 | Camera module and array camera module based on integrated packaging technology |
| CN111090158B (en) * | 2018-10-24 | 2022-02-25 | 宁波舜宇光电信息有限公司 | Clamping device, clamping method, optical lens and camera module assembly method |
| CN112285523B (en) * | 2019-07-24 | 2024-07-09 | 北京振兴计量测试研究所 | Hybrid integrated circuit detection system and method |
| CN112702498B (en) * | 2020-12-29 | 2022-07-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992019069A1 (en) * | 1991-04-17 | 1992-10-29 | Gec Ferranti Defence Systems Limited | A method of fixing an optical image sensor in alignment with the image plane of a lens assembly |
| CN1576931A (en) * | 2003-07-24 | 2005-02-09 | 松下电器产业株式会社 | Lens integral photographic device, producing method and apparatus thereof |
| CN1791182A (en) * | 2004-12-14 | 2006-06-21 | 新光电气工业株式会社 | Image pickup module, method of manufacturing the same, and spacer with infrared ray cut film |
| JP3995521B2 (en) * | 2002-04-26 | 2007-10-24 | オリンパス株式会社 | Imaging unit assembly device |
-
2010
- 2010-06-25 CN CN201010210083.9A patent/CN102298184B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992019069A1 (en) * | 1991-04-17 | 1992-10-29 | Gec Ferranti Defence Systems Limited | A method of fixing an optical image sensor in alignment with the image plane of a lens assembly |
| JP3995521B2 (en) * | 2002-04-26 | 2007-10-24 | オリンパス株式会社 | Imaging unit assembly device |
| CN1576931A (en) * | 2003-07-24 | 2005-02-09 | 松下电器产业株式会社 | Lens integral photographic device, producing method and apparatus thereof |
| CN1791182A (en) * | 2004-12-14 | 2006-06-21 | 新光电气工业株式会社 | Image pickup module, method of manufacturing the same, and spacer with infrared ray cut film |
Non-Patent Citations (1)
| Title |
|---|
| JP特许第3995521号B2 2007.10.24 |
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| Publication number | Publication date |
|---|---|
| CN102298184A (en) | 2011-12-28 |
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