CN111601020B

CN111601020B - Camera module and electronic equipment

Info

Publication number: CN111601020B
Application number: CN202010358451.8A
Authority: CN
Inventors: 熊玲; 易铃棋; 程传波; 李茂兴
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2022-02-08
Anticipated expiration: 2040-04-29
Also published as: CN111601020A

Abstract

The embodiment of the application provides a camera module and electronic equipment. The camera module comprises a lens component, a base, a photosensitive chip, a circuit board and an electronic component; the lens component is arranged on the base; the circuit board comprises a first surface and a second surface which are opposite, the photosensitive chip is arranged on the first surface, the base is arranged on the first surface, the light receiving surface of the photosensitive chip faces the lens assembly, and the electronic component is arranged on the second surface of the circuit board. In this application embodiment, because the lens subassembly sets up on the base, the sensitization chip sets up the first surface at the circuit board, the sensitive surface of sensitization chip is towards the lens subassembly, electronic components sets up the second surface at the circuit board, consequently, need not great space between base and sensitization chip and set up electronic components, thereby can reduce the area that the base occupied on the circuit board, can also reduce the area of circuit board, make the volume of camera module reduce, space utilization among the electronic equipment has been improved.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to a camera module and electronic equipment.

Background

With the development of communication technology, electronic devices have become indispensable articles in daily life. The user can usually shoot through the camera module on the electronic device.

In the related art, the camera module includes a lens, a filter, a base, a photosensitive chip, a circuit board, and an electronic component. The camera lens sets up on the base, and the base setting is on the circuit board, and photosensitive chip sets up on the circuit board, and electronic components surrounds photosensitive chip and sets up on the circuit board, and photosensitive chip's sensitive surface is towards the camera lens, and electronic components is located between base and the photosensitive chip. The inner wall of the base is provided with a boss, the optical filter is arranged on the boss, and the optical filter is positioned between the lens and the photosensitive chip.

Because electronic components is located between base and the sensitization chip, and electronic components itself has certain volume, consequently, need great space between base and the sensitization chip to set up electronic components, the area that leads to the base to occupy on the circuit board is great, and then makes the area of circuit board great for the space that the camera module occupied in electronic equipment is great, leads to the space utilization among the electronic equipment to be lower.

Disclosure of Invention

The purpose of the embodiment of the application is to provide a camera module and electronic equipment, can solve and need great space to set up electronic components between base and the sensitization chip among the correlation technique to the area that leads to the circuit board is great, makes the great problem in the space that the camera module occupied in electronic equipment.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a camera module, where the camera module includes a lens assembly, a base, a photosensitive chip, a circuit board, and an electronic component;

the lens assembly is arranged on the base;

the circuit board comprises a first surface and a second surface which are opposite, the photosensitive chip is arranged on the first surface, the base is arranged on the first surface, a light receiving surface of the photosensitive chip faces the lens component, and the electronic component is arranged on the second surface of the circuit board.

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes the camera module in the first aspect.

In this application embodiment, because the lens subassembly sets up on the base, the sensitization chip sets up the first surface at the circuit board, the sensitive surface of sensitization chip is towards the lens subassembly, electronic components sets up the second surface at the circuit board, therefore, need not great space between base and sensitization chip and set up electronic components, thereby can reduce the area that the base occupied on the circuit board, can also reduce the area of circuit board, make the volume of camera module reduce, thereby reduce the space that the camera module occupied in electronic equipment, space utilization among the electronic equipment has been improved.

Drawings

Fig. 1 is an isometric view of a camera module according to an embodiment of the present disclosure;

fig. 2 shows an exploded view of another camera module according to an embodiment of the present disclosure;

fig. 3 is a side view of another camera module according to an embodiment of the present disclosure;

fig. 4 is a schematic view of another camera module according to an embodiment of the present disclosure.

Reference numerals:

10: a lens assembly; 20: a base; 30: a photosensitive chip; 40: a circuit board; 50: an electronic component; 60: a protective cover; 70: a connector; 80: an adhesive; 90: an optical filter; 21: and (4) a boss.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1, an isometric view of a camera module provided in an embodiment of the present application is shown, referring to fig. 2, an exploded view of a camera module provided in an embodiment of the present application is shown in fig. 2, and referring to fig. 3, a side view of a camera module provided in an embodiment of the present application is shown. As shown in fig. 1, 2 and 3, the camera module includes a lens assembly 10, a base 20, a photosensitive chip 30, a circuit board 40 and an electronic component 50.

The lens assembly 10 is disposed on the base 20. The circuit board 40 includes a first surface and a second surface opposite to each other, the light sensing chip 30 is disposed on the first surface, the base 20 is disposed on the first surface, the light receiving surface of the light sensing chip 30 faces the lens assembly 10, and the electronic component 50 is disposed on the second surface of the circuit board 40.

In the embodiment of the present application, since the lens assembly 10 is disposed on the base 20, the photosensitive chip 30 is disposed on the first surface of the circuit board 40, the light receiving surface of the photosensitive chip 30 faces the lens assembly 10, and the electronic component 50 is disposed on the second surface of the circuit board 40, therefore, there is no need to dispose the electronic component 50 between the base 20 and the photosensitive chip 30, so as to reduce the area occupied by the base 20 on the circuit board 40, and also reduce the area of the circuit board 40, so that the volume of the camera module is reduced, thereby reducing the space occupied by the camera module in the electronic device, and improving the space utilization rate in the electronic device.

In addition, in the embodiment of the present application, when the electronic component 50 is disposed on the second surface of the circuit board 40, the volume of the base 20 can be reduced, and under the condition that the area of the circuit board 40 is not changed, the number of the bases 20 disposed on the circuit board 40 can be increased, so as to increase the number of the lens assemblies 10, and more camera modules can be disposed in the electronic device with the same size.

In addition, in the embodiment of the present application, the lens assembly 10 may be disposed on the base 20 in a manner that: as shown in fig. 2, the lens assembly 10 is adhered to the base 20 by an adhesive 80. Of course, the lens assembly 10 may be disposed on the base in other manners, such as welding, and the like, and the embodiment of the present application is not limited herein.

The adhesive 80 may be glue, but the adhesive 80 may also be of other types, such as a double-sided tape, and the type of the adhesive 80 is not limited herein.

In addition, in the embodiment of the present application, the base 20 may be disposed on the first surface in the same manner as the lens assembly 10 is disposed on the base 20, and the description thereof is omitted here.

Additionally, in some embodiments, as shown in fig. 2, the camera module may further include a protective cover 60. The protective cover 60 is disposed on the second surface of the circuit board 40, and the protective cover 60 covers the electronic component 50.

When the camera module includes the protection cover 60, and the protection cover 60 covers the electronic component 50, at this moment, the protection cover 60 can avoid the electronic component 50 to be extruded or collided with for the electronic component 50 can not be damaged, thereby can improve the life of the electronic component 50.

It should be noted that, in the related art, when the camera module is installed in an electronic device, generally, the circuit board 40 is in contact with a motherboard of the electronic device, and heat on the circuit board 40 can be transferred to the motherboard, which affects performance of the motherboard. In the embodiment of the present invention, by disposing the protection cover 60 on the second surface of the circuit board 40, the protection cover 60 is equivalent to a supporting function between the circuit board 40 and the motherboard, so that a larger gap exists between the circuit board 40 and the motherboard, and heat on the circuit board 40 is less transferred to the motherboard. In addition, heat dissipation from the circuit board 40 is facilitated due to the large gap.

Additionally, in some embodiments, the boot 60 may be a metal boot 60. When the protective cover 60 is a metal protective cover 60, the protective cover 60 has a high strength and is not easily damaged. Moreover, the metal protection cover 60 can also play a role of heat dissipation, so that heat generated by the photo chip 30 on the circuit board 40 can be easily dissipated.

It should be noted that the metal protection cover 60 may be a copper cover, and when the metal cover is a copper cover, the copper cover has a better heat dissipation property, so that heat on the circuit board 40 is more easily dissipated. Of course, the metal protective cover 60 may be of other types, such as a metal material with good thermal conductivity, for example, silver. The type of the metal protection cover 60 is not limited herein.

In addition, in some embodiments, the second surface of the circuit board 40 is provided with a grounding point, and the grounding point is electrically connected with the metal protection cover 60.

It should be noted that, in the related art, the second surface of the circuit board 40 is provided with a grounding point, and the grounding point is usually recessed along the second surface toward the first surface by a predetermined distance. After the camera module is installed in the electronic device, a conductive cloth is disposed between the main board and the circuit board 40, two surfaces of the conductive cloth are respectively in contact with the main board and the circuit board 40, and static electricity generated on the circuit board 40 is introduced into the main board through the conductive cloth. However, since the grounding point is recessed from the second surface toward the first surface by a predetermined distance, static electricity on the circuit board 40 cannot be conducted to the main board through the conductive cloth, and thus there is a problem that the circuit board 40 is burned out due to the effect of the static electricity.

In the present embodiment, the ground point is electrically connected to the metal protection cover 60. When the camera module is installed in the electronic equipment, the metal protection cover 60 can be in contact with the main board in the electronic equipment, so that static electricity on the circuit board 40 can be transmitted to the metal protection cover 60 through the grounding point, the metal protection cover 60 transmits the static electricity to the main board, and finally the static electricity is transmitted out, thereby avoiding the problem that the circuit board 40 is burnt out due to the action of the static electricity.

In the embodiment of the present application, the metal protection cover 60 may be soldered to the second surface of the circuit board 40 by solder paste, so that the metal protection cover 60 is electrically connected to the ground point of the circuit board 40.

Additionally, in some embodiments, as shown in FIG. 2, the metal shield 60 includes a sidewall with a notch disposed therein.

When being provided with the breach on metal protection cover 60, can reduce metal protection cover 60's weight to reduce the weight of camera module, finally can reduce electronic equipment's weight, make electronic equipment portable.

Additionally, in some embodiments, the lens assembly 10 may include a lens, or the lens assembly 10 may include a lens and a motor.

When the lens assembly 10 includes a lens, the lens may be directly disposed on the base 20, wherein the lens may be adhesively bonded to the base 20 such that the lens is integral with the base 20.

When the lens assembly 10 includes a lens and a motor, the motor may be disposed on the base 20 and connected to the lens, and the lens is moved by the motor, so that the lens can perform a focusing function.

Additionally, in some embodiments, as shown in fig. 2, the camera module may further include a connector 70. The connector 70 is electrically connected to the circuit board 40.

When the camera module includes the connector 70 and the connector 70 is electrically connected to the circuit board 40, when the camera module is mounted in an electronic device, the connector 70 may connect the circuit board 40 with a motherboard in the electronic device, so that data on the circuit board 40 may be transmitted to the motherboard through the connector 70. That is, by providing the connector 70, the circuit board 40 can facilitate data transmission to the motherboard.

It should be noted that, in the embodiment of the present application, the electronic component 50 may include at least one of the following: a capacitor device, a resistor device.

In addition, in some embodiments, referring to fig. 4, a schematic view of another camera module provided in the embodiments of the present application is shown, and as shown in fig. 4, the camera module may further include a filter 90. The base 20 is provided with a boss 21, the optical filter 90 is disposed on the boss 21, and the optical filter 90 is located between the photosensitive chip 30 and the lens assembly 10.

When the optical filter 90 is disposed on the boss 21 of the base 20 and the optical filter 90 is located between the photosensitive chip 30 and the lens assembly 10, when light passes through the lens assembly 10, the light irradiates on the optical filter 90, the light is filtered by the optical filter 90, and the filtered light irradiates on the photosensitive chip 30, so that the photosensitive chip 30 can convert the filtered light into an image. That is, by providing the optical filter 90, light irradiated on the photosensitive chip 30 can be filtered, so that image clarity after the photosensitive chip 30 converts the light into an image can be improved.

It should be noted that, in the embodiment of the present application, the filter 90 may be an infrared filter 90.

The embodiment of the application provides electronic equipment, and the electronic equipment comprises the camera module provided by any one of the embodiments.

The electronic equipment can include the mainboard, and when installing the camera module in electronic equipment, the metal safety cover in the camera module can contact with the mainboard.

It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.

The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.

Claims

1. A camera module is characterized by comprising a lens component, a base, a photosensitive chip, a circuit board and an electronic component;

the lens assembly is arranged on the base;

the circuit board comprises a first surface and a second surface which are opposite, the photosensitive chip is arranged on the first surface, the base is arranged on the first surface, a light receiving surface of the photosensitive chip faces the lens component, and the electronic component is arranged on the second surface of the circuit board;

the camera module further comprises a protective cover;

the protective cover is arranged on the second surface of the circuit board, and the electronic component is covered by the protective cover;

the protection cover is a metal protection cover, the metal protection cover is in contact with a mainboard of the electronic equipment, and the metal protection cover is used for transmitting static electricity of the circuit board to the mainboard;

the metal protection cover is a copper cover, or the metal protection cover is made of silver;

and a gap is formed between the circuit board and the mainboard.

2. The camera module of claim 1, wherein the second surface of the circuit board is provided with a grounding point, and the grounding point is electrically connected with the metal protective cover.

3. The camera module of claim 1, wherein the metal protective cover includes a sidewall, and the sidewall is provided with a notch.

4. A camera module according to any one of claims 1 to 3, wherein the lens arrangement comprises a lens, or the lens arrangement comprises a lens and a motor.

5. The camera module of any one of claims 1-3, wherein the camera module further comprises a connector;

the connector is electrically connected with the circuit board.

6. The camera module according to any one of claims 1 to 3, wherein the electronic component comprises at least one of: a capacitor device, a resistor device.

7. The camera module of any one of claims 1-3, further comprising: an optical filter;

the base is provided with a boss, the optical filter is arranged on the boss, and the optical filter is located between the photosensitive chip and the lens component.

8. An electronic device, characterized in that the electronic device comprises the camera module of any one of claims 1-7.