CN102377921A - Camera module and assembling method thereof - Google Patents

Camera module and assembling method thereof Download PDF

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Publication number
CN102377921A
CN102377921A CN2010102633246A CN201010263324A CN102377921A CN 102377921 A CN102377921 A CN 102377921A CN 2010102633246 A CN2010102633246 A CN 2010102633246A CN 201010263324 A CN201010263324 A CN 201010263324A CN 102377921 A CN102377921 A CN 102377921A
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CN
China
Prior art keywords
circuit board
base
image sensor
camera module
lens
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Pending
Application number
CN2010102633246A
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Chinese (zh)
Inventor
王文志
罗世闵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2010102633246A priority Critical patent/CN102377921A/en
Publication of CN102377921A publication Critical patent/CN102377921A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a camera module. The camera module comprises a first circuit board, an image sensor, a camera seat, a light filter, a lens and a second circuit board. Both the image sensor and the second circuit board are electrically connected with the first circuit board. The image sensor is fixedly arranged on the first circuit board; the camera seat comprises a viewing tube and a base formed at one end of the viewing tube; a first containing part is formed inside the base; the lens is arranged in the viewing tube; the first circuit board is fixedly arranged on the base, and further, the image sensor is contained in the first containing part; the light filter is contained and fixedly arranged in the first containing part, and further, corresponds to the image sensor; the second circuit board is contained in the first containing part, and further, is fixedly arranged on the base; and incident light can shoot the image sensor through sequentially passing through the lens and the light filter. Through adopting the second circuit board, the volume of the camera module is smaller. The invention further provides an assembling method of the camera module.

Description

Camera module and assemble method thereof
Technical field
The present invention relates to a kind of camera module and assemble method thereof.
Background technology
Digital camera more and more receives the consumer to be liked, the requirement of people's logarithmic code camera is also increasingly high, and digital camera satisfies powerful the time, also requires aesthetic in appearancely, is easy to carry, and digital camera is more and more miniaturization also.
See also Fig. 1, a kind of existing camera module 100 comprises substrate 11, is located at image sensor 12, microscope base 13, lens barrel 14, lens 15 and the filter 16 on substrate 11 surfaces.Microscope base 13 comprises the base 133 that the tube 131 and of finding a view links to each other with tube 131 1 ends of finding a view.The base 133 inner holding parts 1131 that form.Base 133 is fixedly connected with substrate 11 away from an end of the tube 131 of finding a view, and image sensor 12 is contained in the holding part 1131 and with substrate 11 and is electrically connected.Lens 15 are contained in the lens barrel 14.Filter 16 is contained in the holding part 1131 and with base 133 and is fixedly connected, and filter 16 and base 133 are adhesively fixed through hot-setting adhesive.Incident ray is incident upon image sensor 12 through lens 15 and filter 16 successively.Substrate 11 is provided with circuit board (figure does not show); This circuit board surface is covered with lead and electronic component; The image sensor 12 that is arranged at circuit board surface also takies the circuit board surface space; Make bigger and surperficial lead of this circuit board size and electronic component density bigger, thereby, make this camera module volume big and processing is comparatively difficult.
Summary of the invention
In view of above-mentioned condition, be necessary to provide the camera module and the assemble method thereof of the less and handling ease of a kind of volume.
A kind of camera module; It comprises first circuit board, image sensor, microscope base, filter, camera lens and second circuit board; Image sensor and second circuit board all are electrically connected with first circuit board, and image sensor is fixedly arranged on this first circuit board, microscope base comprise find a view the tube and be formed at find a view the tube one end base; Inner one first holding part that forms of base; Camera lens is located in the tube of finding a view, and first circuit board is fixedly arranged on base and image sensor is contained in first holding part, and filter is contained in first holding part and corresponding to image sensor; Second circuit board is contained in first holding part and sets firmly this base, and incident ray can be incident upon image sensor through camera lens and filter successively.
A kind of assemble method of camera module, it may further comprise the steps: a substrate is provided and is located at the first circuit board on the substrate, the portions of electronics element and the integrated circuit of camera module is arranged on the first circuit board; One image sensor is provided, image sensor is fixed on the first circuit board; Image sensor is electrically connected to first circuit board; One second circuit board is provided, and second circuit board offers loophole, and all the other electronic components and the integrated circuit of camera module is arranged on the second circuit board; One filter is provided, filter is fixed to second circuit board and covers loophole; One camera lens is provided, and camera lens comprises lens barrel and is arranged at the lens in the lens barrel; One microscope base is provided, and microscope base comprises find a view tube and base, and lens barrel is fixed to the tube of finding a view; Second circuit board is fixed in the base and with base is electrically connected, and loophole is corresponding to lens; First circuit board is fixed to base and is electrically connected with base, be contained in image sensor in the base and image sensor corresponding to loophole.
This camera module is through being provided with second circuit board; Make a plurality of electronic components and the lead alternative of this camera module be arranged at first circuit board and second circuit board; Camera module internal electronic component placement space is bigger, thereby electronic component density and wire density are less, handling ease; The portions of electronics element is arranged at second circuit board, thereby the first circuit board size can suitably reduce, and the volume of this camera module is less.
Description of drawings
Fig. 1 is the cutaway view of existing a kind of camera module.
Fig. 2 is the cutaway view of the camera module of first embodiment of the invention.
Fig. 3 is the cutaway view of the camera module of second embodiment of the invention.
Fig. 4 is the assemble method flow chart of the camera module of first embodiment of the invention.
The main element symbol description
Camera module 100,200,400
Microscope base 13,21
Find a view the tube 131,212
Screwed hole 2121
Base 133,214
Holding part 1131
First holding part 2141
Second holding part 2143
Stationary plane 2145
Camera lens 23
Lens barrel 14,231
External screw thread 2312
Lens 15,233
First circuit board 25,45
Image sensor 12,27
Lead 272,496
Second circuit board 29,49
Loophole 292
Interval 492
Filter 16,31
Substrate 11,33
Embodiment
Below with embodiment and combine accompanying drawing that camera module and assemble method thereof that embodiment of the present invention provides are done further explain.
See also Fig. 2, the camera module 200 of first embodiment of the invention comprises microscope base 21, camera lens 23, first circuit board 25, image sensor 27 and second circuit board 29 and filter 31.Camera lens 23 is fixed to an end of microscope base 21, and first circuit board 25 is fixed to the other end of microscope base 21.Image sensor 27 and second circuit board 29 and filter 31 all are contained in microscope base 21.
Microscope base 21 comprises the base 214 of finding a view tube 212 and linking to each other with tube 212 1 ends of finding a view.The tube 212 of finding a view is column and offers a screwed hole 2121.Base 214 is one square, forms one first holding part 2141 and one second holding part 2143 in it.First holding part 2141 is roughly from the rectangular recess of base 214 away from a concave end of the tube 212 of finding a view, and it has stationary plane 2145.Second holding part 2143 is the groove from stationary plane 2145 depressions of first holding part 2141.Second holding part 2143 is communicated with first holding part 2141 and screwed hole 2121.Camera lens 23 comprises lens barrel 231 and is arranged at the lens 233 in the lens barrel 231.Lens barrel 231 outer surfaces are provided with external screw thread 2312.Through the screwed hole 2121 of external screw thread 2312 with the tube 212 of finding a view screwed togather, can lens barrel 231 be fixed in the microscope base 21 or screw togather the position through adjustment and focus.In this execution mode, camera lens 23 comprises lens 233.Be appreciated that a plurality of lens that are parallel to each other 233 can be set according to actual needs forms set of lenses.
First circuit board 25 is fixedly set in base 214 away from tube 212 the end and relative with stationary plane 2145 of finding a view, thereby first circuit board 25, camera lens 23 and microscope base 21 can form an enclosure space.First circuit board 25 can be printed circuit board (PCB) (pcb board), flexible PCB or soft-hard composite board.Image sensor 27 is bonded to the surface of first circuit board 25, and is contained in first holding part 2141.Image sensor 27 is electrically connected with first circuit board 25 through lead 272.Image sensor 27 can be CCD (Charge Coupled Device, charge coupled cell transducer) or CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide sensor).Image sensor 27 also can use and cover that crystalline form, interior pin are fitted, carrier band is fitted, lost money instead of making money encapsulation or the hot pressing connected mode is electrically connected with first circuit board 25 automatically.Portions of electronics element of camera module 200 (figure does not show) and integrated circuit can be arranged at first circuit board 25 and be set around around the image sensor 27.
Second circuit board 29 sizes are less than the size of first circuit board 25, and are contained in first holding part 2141 of base 214.Second circuit board 29 centers offer loophole 292.Second circuit board 29 is fixed in stationary plane 2145, makes loophole 292 and image sensor 27 over against setting.Be appreciated that second circuit board 29 also can be contained in first holding part 2141, image sensor 27 biasings are provided with relatively, and this moment, loophole 292 can omit.In this execution mode, microscope base 21 is processed by metal material, and second circuit board 29 is electrically connected with microscope base 21 through conducting resinl (figure does not show).Second circuit board 29 can be printed circuit board (PCB) (pcb board), flexible PCB or soft-hard composite board.In this execution mode, second circuit board 29 is a flexible PCB.Be appreciated that second circuit board 29 also can pass through modes such as 3 D stereo plating, welding and be electrically connected with microscope base 21.
Filter 31 is fixed in second circuit board 29 away from a side of first circuit board 25 and cover loophole 292, and incident ray can be successively be incident upon image sensor 27 through the lens 233 and the filter 31 of camera lens 23.Filter 31 is contained in second holding part 2143.Filter 31 can adopt hot-setting adhesive, PUR, double faced adhesive tape, ultraviolet curing glue or Ludox to be fixed to second circuit board 29.All the other electronic components of camera module 200 (figure does not show) and integrated circuit can be arranged at second circuit board 29 and be set around around the filter 31.Be appreciated that filter 31 also can directly be fixed to second holding part 2143, filter 31 is got final product corresponding to image sensor 27 and lens 233.
Camera module 200 further comprises a substrate 33, substrate 33 be positioned at first circuit board 25 away from a side of microscope base 21 to support first circuit board 25.Be appreciated that when camera module 200 comprised substrate 33, first circuit board 25 can be the flexible PCB that is arranged on the substrate 33.
This camera module 200 is through being provided with second circuit board 29; Make a plurality of electronic components and the integrated circuit alternative of this camera module 200 be arranged at first circuit board 25 and second circuit board 29; 29 two facing surfaces of second circuit board all can be provided with electronic component and integrated circuit; Camera module 200 internal electronic element placement spaces are bigger, thereby the existing camera module of electronic component density and integrated circuit density is little, handling ease; The portions of electronics element is arranged at second circuit board 29, thereby first circuit board 25 sizes can suitably reduce, and the volume of this camera module 200 is less.
Be appreciated that second holding part 2143 can omit, second circuit board 29 was fixedly arranged on stationary plane 2145 and filter 31 and was contained in the tube 212 of finding a view this moment.
See also Fig. 3; The structure of the camera module 400 of second embodiment of the invention is identical substantially with the structure of the camera module 200 of first execution mode; Its difference is: second circuit board 49 has two; Two second circuit boards 49 are provided with at interval, and two second circuit boards 49 are electrically connected with first circuit board 45 through lead 496, have interval 492 between two second circuit boards 49; Filter is located between two second circuit boards 49 and is simultaneously affixed with two second circuit boards 49, incident ray can be successively through lens, the filter of camera lens and 492 be incident upon image sensor at interval.
Below be example with the method for assembling camera module 200, introduce the assemble method of camera module 200 of the present invention.
See also Fig. 4, camera module 200 assemble methods of first embodiment of the invention may further comprise the steps:
Step S501 provides a substrate 33 and first circuit board 25, and first circuit board 25 is located at substrate 33 surfaces.First circuit board 25 can be printed circuit board (PCB) (pcb board), flexible PCB or soft-hard composite board.When first circuit board 25 was printed circuit board (PCB) or soft-hard composite board, substrate 33 can omit.The portions of electronics element of camera module 200 and integrated circuit can adopt SMT (surface mounted technology) technology to be arranged on the first circuit board 25.
Step S503 provides an image sensor 27, image sensor 27 is fixed in a side of first circuit board 25.Image sensor 27 can adopt hot-setting adhesive, PUR, double faced adhesive tape, ultraviolet curing glue or Ludox to be fixed to first circuit board 25.
Step S505 is electrically connected to first circuit board 25 with image sensor 27.Image sensor 27 is electrically connected with first circuit board 25 through lead 272.Being appreciated that image sensor 27 can also use covers that crystalline form, interior pin are fitted, carrier band is fitted, lost money instead of making money encapsulation or the hot pressing connected mode is electrically connected with first circuit board 25 automatically.
Step S507 provides a second circuit board 29, and second circuit board 29 centers offer loophole 292.Second circuit board 29 can be printed circuit board (PCB) (pcb board), flexible PCB or soft-hard composite board.All the other electronic components of camera module 200 and integrated circuit can adopt SMT (surface mounted technology) technology to be arranged on the second circuit board 29.In this execution mode, second circuit board 29 is a flexible PCB.
Step S509 provides a filter 31, and filter 31 is fixed to second circuit board 29 and covers loophole 292.Filter 31 can adopt hot-setting adhesive, PUR, double faced adhesive tape, ultraviolet curing glue or Ludox to be fixed to second circuit board 29.
Step S511 provides a camera lens 23, and camera lens 23 comprises lens barrel 231 and is arranged at the lens 233 in the lens barrel 231.Lens barrel 231 outer surfaces are provided with external screw thread 2312.
Step S513 provides a microscope base 21, and microscope base 21 is processed by metal material, it comprise find a view tube 212 and with the tube 212 integrated bases 214 of finding a view.The tube 212 of finding a view is column and offers a screwed hole 2121.Base 214 forms one first holding part 2141 and second holding part 2143.The external screw thread 2312 of camera lens 23 is screwed togather with screwed hole 2121, and so that lens barrel 231 is fixed in the microscope base 21, lens 233 are corresponding to filter 31, and lens 233 and filter 31 that incident ray can pass through camera lens 23 successively are incident upon image sensor 27.
Step S515 is fixed to second circuit board 29 in first holding part 2141 of base 214 and with base 214 and is electrically connected, and loophole 292 is corresponding to lens 233.Second circuit board 29 is fixed in the stationary plane 2145 of base 214 through conducting resinl, and this moment, filter 31 was contained in second holding part 2143.Be appreciated that second circuit board 29 also can pass through modes such as 3 D stereo plating, welding and be electrically connected with microscope base 21.
Step S517; First circuit board 25 is fixed to base 214 and is electrically connected with base 214; Image sensor 27 is contained in first holding part 2141; Image sensor 27 is corresponding to loophole 292, and lens 233 and filter 31 that incident ray can pass through camera lens 23 successively are incident upon image sensor 27.First circuit board 25 is fixed in the end of base 214 away from the tube 212 of finding a view through conducting resinl.
In addition, those skilled in the art also can do all the other variations in spirit of the present invention, and certainly, these all should be included in the present invention's scope required for protection according to the variation that the present invention's spirit is done.

Claims (10)

1. camera module; It comprises first circuit board, image sensor, microscope base, filter, camera lens; This image sensor is fixedly arranged on this first circuit board and is electrically connected with this first circuit board, and this microscope base comprises the base of finding a view tube and linking to each other with this tube one end of finding a view, inner one first holding part that forms of this base; This camera lens is located in this tube of finding a view; This first circuit board is fixedly arranged on this base and this image sensor is contained in this first holding part, and this filter is contained in this first holding part and corresponding to this image sensor, it is characterized in that: this camera module also comprises the second circuit board that is electrically connected with this first circuit board; This second circuit board is contained in this first holding part and is fixedly arranged on this base, and incident ray can be incident upon image sensor through camera lens and filter successively.
2. camera module as claimed in claim 1 is characterized in that: this first circuit board and this second circuit board all are electrically connected with this base through conducting resinl.
3. camera module as claimed in claim 1 is characterized in that: this second circuit board is electrically connected with this first circuit board through lead.
4. camera module as claimed in claim 1 is characterized in that: this second circuit board position and this first circuit board lay respectively at the both sides of this image sensor, and this second circuit board offers the loophole corresponding to this image sensor.
5. camera module as claimed in claim 4 is characterized in that: this filter is fixedly arranged on this second circuit board and covers this loophole.
6. camera module as claimed in claim 5; It is characterized in that: this first holding part has and this first circuit board face that is relatively fixed; This base comprises that also this second circuit board is fixed to this stationary plane from second holding part of this stationary plane depression, and this filter is contained in this second holding part.
7. camera module as claimed in claim 1; It is characterized in that: this second circuit board has two; Two these second circuit boards are fixedly arranged between this first holding part and two these second circuit board circuit boards to have at interval, and this is at interval corresponding to this image sensor and this camera lens.
8. camera module as claimed in claim 7 is characterized in that: this filter is located between two these second circuit boards and is affixed with two these second circuit boards.
9. the assemble method of a camera module, it may further comprise the steps:
One substrate and first circuit board are provided, this first circuit board is located on this substrate, the portions of electronics element and the integrated circuit of this camera module is arranged on this first circuit board;
One image sensor is fixed on this first circuit board;
This image sensor is electrically connected to this first circuit board;
One second circuit board is provided, and this second circuit board center offers loophole, and all the other electronic components of this camera module and integrated circuit are arranged on this second circuit board;
One filter is fixed to this second circuit board and covers this loophole;
One camera lens is provided, and this camera lens comprises lens barrel and is arranged at the lens in this lens barrel;
One microscope base is provided, and this microscope base comprises find a view tube and base, and this lens barrel is fixed to this tube of finding a view;
This second circuit board is fixed in this base and is electrically connected with this base, and this loophole is corresponding to these lens; And
This first circuit board is fixed to this base and is electrically connected with this base, and so that this image sensor is contained in the base, this image sensor is corresponding to this loophole.
10. the assemble method of camera module as claimed in claim 9 is characterized in that: this second circuit board and this first circuit board all are electrically connected with this base through conducting resinl.
CN2010102633246A 2010-08-26 2010-08-26 Camera module and assembling method thereof Pending CN102377921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102633246A CN102377921A (en) 2010-08-26 2010-08-26 Camera module and assembling method thereof

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Application Number Priority Date Filing Date Title
CN2010102633246A CN102377921A (en) 2010-08-26 2010-08-26 Camera module and assembling method thereof

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CN102377921A true CN102377921A (en) 2012-03-14

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CN2010102633246A Pending CN102377921A (en) 2010-08-26 2010-08-26 Camera module and assembling method thereof

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103633033A (en) * 2012-08-23 2014-03-12 鸿富锦精密工业（深圳）有限公司 Image sensor module and image capture module
CN104580856A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module and camera equipment provided with same
CN105120138A (en) * 2015-09-11 2015-12-02 南昌欧菲光电技术有限公司 Camera module and assembling method thereof
CN107770422A (en) * 2017-10-25 2018-03-06 信利光电股份有限公司 The preparation method and electronic equipment of a kind of camera module
CN110445957A (en) * 2018-05-03 2019-11-12 鹏鼎控股(深圳)股份有限公司 The electronic device of camera mould group and the application camera mould group
CN112702498A (en) * 2020-12-29 2021-04-23 维沃移动通信有限公司 Camera module and electronic equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103633033A (en) * 2012-08-23 2014-03-12 鸿富锦精密工业（深圳）有限公司 Image sensor module and image capture module
CN103633033B (en) * 2012-08-23 2018-04-20 鸿富锦精密工业（深圳）有限公司 Image Sensor module and taken module
CN104580856A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module and camera equipment provided with same
CN105120138A (en) * 2015-09-11 2015-12-02 南昌欧菲光电技术有限公司 Camera module and assembling method thereof
CN107770422A (en) * 2017-10-25 2018-03-06 信利光电股份有限公司 The preparation method and electronic equipment of a kind of camera module
CN110445957A (en) * 2018-05-03 2019-11-12 鹏鼎控股(深圳)股份有限公司 The electronic device of camera mould group and the application camera mould group
CN112702498A (en) * 2020-12-29 2021-04-23 维沃移动通信有限公司 Camera module and electronic equipment

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Application publication date: 20120314