CN110445957A - The electronic device of camera mould group and the application camera mould group - Google Patents
The electronic device of camera mould group and the application camera mould group Download PDFInfo
- Publication number
- CN110445957A CN110445957A CN201810414068.2A CN201810414068A CN110445957A CN 110445957 A CN110445957 A CN 110445957A CN 201810414068 A CN201810414068 A CN 201810414068A CN 110445957 A CN110445957 A CN 110445957A
- Authority
- CN
- China
- Prior art keywords
- groove
- mould group
- camera mould
- ceramic base
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
A kind of camera mould group, it includes a circuit substrate, one ceramic base, one optical filter, one image sensor, one framework and a lens module, the ceramic base includes a first surface and the second surface that is disposed opposite to each other with the first surface, the first surface offers one first groove, the second surface offers one second groove, the ceramic base also opens up the centre bore of a connection first groove and the second groove, the optical filter is embedded at first groove, the image sensor is embedded at the second groove, the ceramic base is by second surface in conjunction with the circuit substrate, the framework is set to the first surface, the lens module is contained in the framework, the camera mould group further includes at least one first electronic component, first electronic component is set to the first surface around first groove, and it is embedded in the framework.The present invention also provides the electronic devices of a kind of manufacturing method of above-mentioned camera mould group and the above-mentioned camera mould group of application.
Description
Technical field
The present invention relates to the electronic devices of a kind of camera mould group and the application camera mould group.
Background technique
In recent years, with the development of multimedia technology, will be used wider and wider for camera module is widely used
In mobile phone, computer, the first-class electronic product of miniature video camera.Camera module generally includes lens module, pedestal, infrared cutoff filter
Mating plate, imaging sensor (sensor), electronic component and circuit board, wherein electronic component generally comprises capacitor and resistance, mainly
Play the role of auxiliary supplement voltage.In traditional camera module structure, imaging sensor, optical filter and electronic component are set
Set the volume that often will increase camera module.
Summary of the invention
In view of this, it is necessary to provide a kind of camera mould groups of above problem.
Also provide a kind of above-mentioned camera mould group manufacturing method and a kind of electronic device using above-mentioned camera mould group.
A kind of camera mould group a comprising circuit substrate, a ceramic base, an optical filter, an image sensor, a framework
And a lens module, the ceramic base include a first surface and the second surface that is disposed opposite to each other with the first surface,
The first surface offers one first groove, and the second surface offers one second groove, and the ceramic base also opens up
The centre bore of one connection, first groove and the second groove, the optical filter are embedded at first groove, and the image passes
Sensor is embedded at the second groove, and through second surface in conjunction with the circuit substrate, the framework is set to the ceramic base
The first surface, the lens module are contained in the framework, and the camera mould group further includes at least one first electronics member
Part, first electronic component is set to the first surface around first groove, and is embedded in the framework.
A kind of manufacturing method of camera mould group comprising following steps:
A ceramic base is provided, the ceramic base includes that a first surface and one are disposed opposite to each other with the first surface
Second surface, the first surface offer one first groove, and the second surface offers one second groove, the ceramic bottom
Seat also opens up the centre bore of a connection first groove and the second groove；
One optical filter is embedded at first groove, an image sensor is embedded at second groove；
At least one first electronic component is set to the first surface around first groove；
By the second surface of the above-mentioned ceramic base equipped with first electronic component in conjunction with a circuit substrate；
One framework with lens module is installed on the first surface, the framework is in conjunction with the first surface
An at least accommodation groove is opened up on lower surface, to accommodate first electronic component, so that being embedded in first electronic component
In the framework.
A kind of electronic device a comprising shell and at least one be contained in camera mould as described above in the shell
Group.
Camera mould group of the invention, the first electronic component are embedded in the framework, save the sky of setting electronic component
Between, so that the camera modular structure is more compact, be conducive to the microminiaturization of camera mould group.In addition, the optical filter is embedded at
First groove, the image sensor are embedded at second groove, further make the camera modular structure compact.
Detailed description of the invention
Fig. 1 is the schematic cross-section of the camera mould group of a better embodiment of the invention.
Fig. 2 is the schematic cross-section of the ceramic base of a better embodiment of the invention.
Fig. 3 is the schematic cross-section that image sensor is embedded on ceramic base shown in Fig. 2.
Fig. 4 is the schematic cross-section that optical filter is embedded on ceramic base in Fig. 3.
Fig. 5 is that the schematic cross-section of the first electronic component is arranged in the first surface of ceramic base shown in Fig. 4.
Fig. 6 is that the second surface of ceramic base shown in Fig. 5 combines the schematic cross-section of a circuit substrate.
Main element symbol description
| Camera mould group | 100 |
| Circuit substrate | 10 |
| Ceramic base | 20 |
| Optical filter | 30 |
| Image sensor | 40 |
| Framework | 50 |
| Lens module | 70 |
| First surface | 21 |
| Second surface | 22 |
| First groove | 210 |
| Second groove | 220 |
| Centre bore | 23 |
| Accommodating chamber | 24 |
| Side | 25 |
| First electronic component | 80a |
| Second electronic component | 80b |
| Upper surface | 51 |
| Lower surface | 52 |
| Through-hole | 53 |
| Accommodation groove | 520 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
Referring to Fig. 1, the present invention provides a kind of camera mould group 100 comprising 10, ceramic bases of a circuit substrate
20,50, lens modules being contained in the framework 50 of framework of image sensor 40, one of optical filter 30, one
70。
The circuit substrate 10 can be any one in rigid circuit board, flexible electric circuit board and rigid-flexible combined circuit plate
Kind.
The ceramic base 20 includes a first surface 21 and second be disposed opposite to each other with the first surface 21
Surface 22.The center of the first surface 21 offers first groove 210, the center of the second surface 22
Offer second groove 220.The ceramic base 20 is also provided with a connection first groove 210 and described second
The centre bore 23 of groove 220, and the aperture of the centre bore 23 is respectively smaller than the groove width and described second of first groove 210
The groove width of groove 220.
The optical filter 30 is installed on first groove 210, and the image sensor 40 is installed on second groove
220.The depth of first groove 210 can be equal to or greater than the optical filter 30 thickness, might be less that the optical filter
30 thickness, is selected with specific reference to actual conditions.Preferably, the depth of first groove 210 is equal to the optical filter
30 thickness.The depth of second groove 220 can be equal to or greater than the image sensor 40 thickness, might be less that institute
The thickness for stating image sensor 40, is selected with specific reference to actual conditions.Preferably, the depth etc. of second groove 220
In the thickness of the image sensor 40.
The ceramic base 20 may also include at least one around first groove 210, the second groove 220 or centre bore
23 accommodating chambers 24 opened up, to accommodate the second electronic component 80b.The second electronic component 80b can be in capacitor and resistance
At least one.The accommodating chamber 24 opens up direction and can select as needed.In present embodiment, the ceramic base 20 is also
Side 25 including connecting the first surface 21 and the second surface 22, the accommodating chamber 24 are concaved by the side 25
It falls into and is formed.
The second surface 22 of the ceramic base 20 is in conjunction with a surface of the circuit substrate 10.In present embodiment,
The second surface 22 is combined by anisotropic conductive adhesive paste (figure is not marked) with the circuit substrate 10.
The camera mould group 100 further includes at least one around first groove 210 and is set to the first surface
21 the first electronic component 80a.The first electronic component 80a can be at least one of capacitor and resistance.
The framework 50 includes a upper surface 51 and a lower surface 52 being disposed opposite to each other with the upper surface 51.It is described
Framework 50 further includes a through-hole 53 through the upper surface 51 and lower surface 52.The lower surface 52 is installed on described
First surface 21, and the axial line of the through-hole 53 is overlapped with the axial line of the centre bore 23.The lower surface 52 is around described
Through-hole 53 forms at least one accommodation groove 520, to accommodate the first electronic component 80a.
The lens module 70 is contained in the through-hole 53.The lens module 70 includes the members such as voice coil motor and camera lens
Part.
The present invention also provides a kind of production methods of above-mentioned camera mould group 100 comprising following steps:
Step S1, referring to Fig. 2, provide a ceramic base 20, the ceramic base 20 include first surface 21 and with institute
The second surface 22 that first surface 21 is disposed opposite to each other is stated, and the center of the first surface 21 offers first groove
210, the center of the second surface 22 offers second groove 220, and the ceramic base 20 further includes a connection
The centre bore 23 of first groove 210 and second groove 220.
The ceramic base 20 may also include at least one and bury the second interior electronic component 80b.Second electronic component
80b is arranged around first groove 210, the second groove 220 or centre bore 23.
Step S2 a, referring to Fig. 3, image sensor 40 is embedded in second groove 220.
In present embodiment, the image sensor 40 is installed in institute by controlled collapsible chip connec-tion (Flip-chip technique)
It states in the second groove 220.
Preferably, the thickness of the image sensor 40 is equal to the depth of second groove 220.The image sensor
40 thickness be also less than or greater than second groove 220 depth.
Step S3 a, referring to Fig. 4, optical filter 30 is embedded in first groove 210.
Preferably, the thickness of the optical filter 30 is equal to the depth of first groove 210.The optical filter 30 can be with
More than or less than the depth of first groove 210.
Step S4, referring to Fig. 5, will at least one first electronic component 80a be set to around first groove 210 it is described
First surface 21.
In present embodiment, the first electronic component 80a can be attached at described first by surface mounting technology (STM)
Surface 21.
Step S5, referring to Fig. 6, providing a circuit substrate 10, and by the above-mentioned ceramic bottom for being equipped with the first electronic component 80a
The second surface 220 of seat 20 is in conjunction with 10 1 surface of circuit substrate.
Specifically, the second surface 220 is bonded with the circuit substrate 10 by anisotropic conductive adhesive paste.
One can be also equipped in present embodiment, on the surface of the circuit substrate 10 to be arranged with the ceramic substrate 20 interval
Connector (figure do not mark).
Step S6 a, referring to Fig. 1, framework 50 with lens module 70 is installed on the first surface 21, institute
It states and opens up at least one accommodation groove 520 on the lower surface 52 that framework 50 is combined with the first surface 21, to accommodate described
One electronic component 80a, so that being embedded in the framework 50 in the first electronic component 80a.
Specifically, the framework 50 further includes a upper surface 51 being disposed opposite to each other with the lower surface 52 and one through institute
State the through-hole 53 of upper surface 51 and lower surface 52.The through-hole 53 is corresponding with the centre bore 23.The lens module 70 accommodates
In the through-hole 53.The lens module 70 includes the elements such as voice coil motor and camera lens.
The present invention also provides a kind of electronic devices 200 (such as mobile phone, laptop etc.) comprising shell 201 and receipts
The above-mentioned camera mould group 100 of at least one being dissolved in the shell 201.
Camera mould group 100 of the invention is embedded in the ceramic base 20, the first electronics member in second electronic component 80b
Part 80a is embedded in the framework 50, the space of setting electronic component (80a, 80b) is saved, so that 100 knot of camera mould group
Structure is more compact, is conducive to the microminiaturization of camera mould group 100.In addition, the optical filter 30 is embedded at first groove 210,
The image sensor 40 is embedded at second groove 220, further makes the camera mould group 100 compact-sized.
The above is only better embodiment of the invention, not the limitation to the present invention in any form, though
The right present invention has been that better embodiment is disclosed above, is not intended to limit the invention, any person skilled in the art,
Without departing from the scope of the present invention, when the technology contents using the disclosure above are modified or are modified to
With the equivalent implementations of variation, but without departing from the technical solutions of the present invention, according to the technical essence of the invention to
Any simple modification, equivalent change and modification that upper embodiment is done, all of which are still within the scope of the technical scheme of the invention.
Claims (9)
1. a kind of camera mould group comprising a circuit substrate, a ceramic base, an optical filter, an image sensor, a framework and
One lens module, the ceramic base include a first surface and the second surface that is disposed opposite to each other with the first surface, institute
It states first surface and offers one first groove, the second surface offers one second groove, and the ceramic base also opens up one
It is connected to the centre bore of first groove and the second groove, the optical filter is embedded at first groove, the image sensing
Device is embedded at the second groove, and for the ceramic base through second surface in conjunction with the circuit substrate, the framework is set to institute
First surface is stated, the lens module is contained in the framework, and the camera mould group further includes at least one first electronic component,
First electronic component is set to the first surface around first groove, and is embedded in the framework.
2. camera mould group as described in claim 1, which is characterized in that be embedded at least one second electronics member in the ceramic base
Part, second electronic component is around first groove, the second groove or centre bore setting.
3. camera mould group as described in claim 1, which is characterized in that it is recessed that the aperture of the centre bore is respectively smaller than described first
The groove width of the groove width of slot and second groove.
4. camera mould group as described in claim 1, which is characterized in that the depth of first groove is equal to or more than the filter
The thickness of mating plate, the depth of second groove are equal to or more than the thickness of the image sensor.
5. a kind of manufacturing method of camera mould group comprising following steps:
One ceramic base is provided, the ceramic base include a first surface and one be disposed opposite to each other with the first surface second
Surface, the first surface offer one first groove, and the second surface offers one second groove, and the ceramic base is also
Open up the centre bore of a connection first groove and the second groove；
One optical filter is embedded at first groove, an image sensor is embedded at second groove；
At least one first electronic component is set to the first surface around first groove；
By the second surface of the above-mentioned ceramic base equipped with first electronic component in conjunction with a circuit substrate；
One framework with lens module is installed on the first surface, following table of the framework in conjunction with the first surface
An at least accommodation groove is opened up on face, to accommodate first electronic component, so that being embedded in first electronic component described
In framework.
6. the manufacturing method of camera mould group as claimed in claim 5, which is characterized in that be embedded at least 1 in the ceramic base
Two electronic components, second electronic component is around first groove, the second groove or centre bore setting.
7. the manufacturing method of camera mould group as claimed in claim 5, which is characterized in that the aperture of the centre bore is respectively smaller than institute
State the groove width of the first groove and the groove width of second groove.
8. the manufacturing method of camera mould group as claimed in claim 5, which is characterized in that the depth of first groove is equal to or greatly
In the thickness of the optical filter, the depth of second groove is equal to or more than the thickness of the image sensor.
9. a kind of electronic device comprising a shell and at least one be contained in the shell as claim 1-4 is any
Camera mould group described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810414068.2A CN110445957A (en) | 2018-05-03 | 2018-05-03 | The electronic device of camera mould group and the application camera mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810414068.2A CN110445957A (en) | 2018-05-03 | 2018-05-03 | The electronic device of camera mould group and the application camera mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110445957A true CN110445957A (en) | 2019-11-12 |
Family
ID=68427418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810414068.2A Pending CN110445957A (en) | 2018-05-03 | 2018-05-03 | The electronic device of camera mould group and the application camera mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110445957A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| TWI792356B (en) * | 2021-06-17 | 2023-02-11 | 大陸商慶鼎精密電子（淮安）有限公司 | Circuit board assembly and method for manufacturing the same |
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| KR20080069845A (en) * | 2007-01-24 | 2008-07-29 | 엘지이노텍 주식회사 | Camera module |
| KR20100018408A (en) * | 2008-08-06 | 2010-02-17 | 주식회사 아이리버 | Portable terminal and method for playing contents using the same |
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| CN105450914A (en) * | 2015-12-01 | 2016-03-30 | 宁波舜宇光电信息有限公司 | Camera module, electrical bracket and circuit setting method thereof |
| CN105472217A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Electrical support with EMI shielding conductive layer, camera module group, and assembly method of camera module group |
| CN206696574U (en) * | 2016-10-14 | 2017-12-01 | 宁波舜宇光电信息有限公司 | Camera module based on integral packaging technique |
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2018
- 2018-05-03 CN CN201810414068.2A patent/CN110445957A/en active Pending
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|---|---|---|---|---|
| KR20080069845A (en) * | 2007-01-24 | 2008-07-29 | 엘지이노텍 주식회사 | Camera module |
| KR20100018408A (en) * | 2008-08-06 | 2010-02-17 | 주식회사 아이리버 | Portable terminal and method for playing contents using the same |
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| CN105472217A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Electrical support with EMI shielding conductive layer, camera module group, and assembly method of camera module group |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| TWI792356B (en) * | 2021-06-17 | 2023-02-11 | 大陸商慶鼎精密電子（淮安）有限公司 | Circuit board assembly and method for manufacturing the same |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191112 |
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| WD01 | Invention patent application deemed withdrawn after publication |