CN104717412A - Camera module and assembly method thereof - Google Patents
Camera module and assembly method thereof Download PDFInfo
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- CN104717412A CN104717412A CN201510108659.3A CN201510108659A CN104717412A CN 104717412 A CN104717412 A CN 104717412A CN 201510108659 A CN201510108659 A CN 201510108659A CN 104717412 A CN104717412 A CN 104717412A
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- base
- lens barrel
- camera module
- substrate
- imageing sensor
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Abstract
A camera module comprises a base plate, an imaging sensor, a base, an infrared cut-off filter, a lens barrel and a camera lens. When assembled, firstly the imaging sensor is assembled onto the mounting surface of the base plate, the imaging sensor is electrically connected with the base plate, then the infrared cut-off filter is stuck to the position of a window of the base, then the base to which the infrared cut-off filter is stuck is installed onto the mounting surface of the base plate, and the imaging sensor is contained inside an inner cavity of the base. In addition, the lens is assembled in the lens barrel, and then the lens barrel in which the lens is assembled is installed onto the base. Split type structural design is adopted for the lens barrel and the base, the step for installing the infrared cut-off filter onto the base and the step for installing the lens into the lens barrel are conducted in an isolated mode, the two steps do not affect each other, and therefore chippings generated when thread teeth of the lens engage with threaded teeth of the lens barrel cannot fall down onto the IR filter or onto the imaging sensor, so that the imaging quality of the camera module is improved. Meanwhile, the invention provides an assembly method of the camera module.
Description
Technical field
The present invention relates to camera technical field, particularly relate to a kind of camera module and assemble method thereof.
Background technology
The microscope base of the front-facing camera module of the electronic installations such as mobile phone, notebook computer, panel computer adopts integral structure usually, the upper end of microscope base is for accommodating camera lens, lower end is for accommodating cutoff filter, and namely cutoff filter (IR) and camera lens (lens) are all assembled in microscope base sequentially.Due to microscope base need first to assemble with IR sheet after again with lens assembling, and camera lens and microscope base are coordinated by thread to fit together, in the process of therefore assembling at camera lens and microscope base, thread coordinates the chip produced easily to fall on IR sheet or imageing sensor (sensor), cause POG (particle on glass) phenomenon, affect the image quality of camera module.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of chip can effectively avoiding thread to be engaged generation to fall on IR sheet or imageing sensor to improve camera module and the assemble method thereof of image quality.
A kind of camera module, comprising:
Substrate, has installed surface;
Imageing sensor, is arranged at the installed surface of described substrate, and described imageing sensor is electrically connected with described substrate;
Base, is arranged at the installed surface of described substrate, and described base has an inner chamber, and described imageing sensor is contained in described inner chamber, and described base also offers window;
Cutoff filter, is pasted on the window place of described base, and covers described window;
Lens barrel, is installed on described base; And
Camera lens, is assembled in described lens barrel.
Wherein in an embodiment, the window of described base is rectangle, and described cutoff filter is rectangle, and the size of described cutoff filter is corresponding with the size of the induction zone of described imageing sensor; And the projection of cutoff filter on induction zone is completely overlapping with induction zone.
Wherein in an embodiment, the inwall of described base is recessed to form groove laterally, and described groove is arranged around described window, is used for holding described cutoff filter.
Wherein in an embodiment, the binding district that described imageing sensor has induction zone and arranges around described induction zone, described binding district is electrically connected with described substrate by conductive thread.
Wherein in an embodiment, the installed surface of described substrate is provided with multiple spaced first weld pad, described binding district is provided with multiple spaced second weld pad, and one end of described gold thread is connected with described first weld pad, and the other end is connected with described second weld pad.
Wherein in an embodiment, described base is also formed with boss, and described boss is positioned at the inner side of described lens barrel.
Wherein in an embodiment, described boss is annular boss.
Wherein in an embodiment, described lens barrel is pasted on described base by the mode of some glue mode or whole gluing.
An assemble method for camera module, comprises the following steps:
There is provided a substrate, described substrate has installed surface;
Imageing sensor is assembled on the installed surface of described substrate, and described imageing sensor is electrically connected with described substrate;
Cutoff filter is pasted on the window place of base;
By on the installed surface of the floor installation Zhi described substrate that are pasted with cutoff filter, described imageing sensor is made to be contained in the inner chamber of base;
By lens assembling in lens barrel;
The lens barrel being assembled with camera lens is mounted on base.
Wherein in an embodiment, described base is also formed with boss, and described boss is positioned at the inner side of described lens barrel.
Above-mentioned camera module and assemble method thereof at least have the following advantages:
During assembling, first imageing sensor is assembled to the installed surface of substrate, and imageing sensor is electrically connected with substrate, again cutoff filter is pasted on the window place of base, then by the installed surface of the floor installation to substrate that are pasted with cutoff filter, imageing sensor is contained in the inner chamber of base.In addition, by lens assembling in lens barrel, then the lens barrel being assembled with camera lens is mounted on base.Because lens barrel and base adopt split-type structural design, so on installation infrared edge filter to base and to install these two steps on camera lens to lens barrel be separately be independent of each other, so the chip produced when camera lens is engaged with the thread of lens barrel can not fall on IR sheet or imageing sensor, thus improve the image quality of camera module.
Accompanying drawing explanation
Fig. 1 is the structural representation of camera module in an execution mode;
Fig. 2 is the cutaway view of the module of camera shown in Fig. 1;
Fig. 3 is the cutaway view at another visual angle of the module of camera shown in Fig. 1;
Fig. 4 is the schematic flow sheet of the assemble method of camera module in an execution mode.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 1 to Fig. 3, the camera module 10 in an execution mode comprises substrate 100, imageing sensor 200, base 300, cutoff filter 400, lens barrel 500 and camera lens 600.Specific in present embodiment, base 300 and lens barrel 500 adopt split type mode to arrange, and the chip produced when coordinating with the thread of lens barrel 500 to avoid camera lens 600 falls on cutoff filter 400 or imageing sensor 200.
The back side 120 that substrate 100 has installed surface 110 and is oppositely arranged with installed surface 110.Substrate 100 can be flexible PCB or printed circuit board.When substrate 100 is flexible PCB, stiffening plate can also be set at the back side of substrate 100, to increase the intensity of substrate 100.The installed surface 110 of substrate 100 is provided with multiple first weld pad 111, multiple first weld pad 111 is spaced, and encloses around imageing sensor 200 1.
Imageing sensor 200 is arranged at the installed surface 110 of substrate 100, and imageing sensor 200 is electrically connected with substrate 100.Imageing sensor 200 is generally square configuration.Particularly, the binding district 220 (bonding district) that imageing sensor 200 has induction zone 210 and arranges around induction zone 210, induction zone 210 is rectangle, and binding district 220 realizes being electrically connected with substrate 100 by conductive thread 700.Such as, in binding, district 220 arranges multiple second weld pad 221, and multiple second weld pad 221 is spaced in binding district 220 and arranges around induction zone 210.Conductive thread 700 can be gold thread, certainly, also can be the metal wire of other realization conduction.One end of gold thread is connected with second weld pad 221 in binding district 220, and the other end is connected with the first weld pad 111 on installed surface 110, to realize the electrical connection of imageing sensor 200 and substrate 100.
Base 300 is arranged on the installed surface 110 of substrate 100.Base 300 has an inner chamber 310, and imageing sensor 200 is contained in inner chamber 310.Base 300 also offers window 320, and cutoff filter 400 is pasted on window 320 place of base 300, and covers window 320.Specific in present embodiment, base and lens barrel are split manufacture, when manufacturing base, the window 320 of base 300 is designed to rectangle, corresponding cutoff filter 400 is also rectangle, and the size of cutoff filter 400 is corresponding with the size of the induction zone 210 of imageing sensor 200, and the projection of cutoff filter 400 on induction zone 210 is completely overlapping with induction zone 210.Namely, in different camera modules, the size of cutoff filter 400 can change with the size of the induction zone 210 of imageing sensor 200, but corresponding with the size of the induction zone 210 of the imageing sensor 200 all the time and projection that cutoff filter 400 is on induction zone 210 of the size of cutoff filter 400 is completely overlapping with induction zone 210.
Cutoff filter 400 in present embodiment is corresponding with the induction zone 210 of imageing sensor 200, therefore the binding district 220 of imageing sensor 200 is avoided, light injects the induction zone 210 of imageing sensor 200 from cutoff filter 400, cutoff filter 400 can not be returned by gold thread back reflection again through binding district 220, avoid secondary light ray to enter the induction zone 210 of imageing sensor 200, be conducive to improving image quality.And compared to traditional structure, the size of the cutoff filter 400 in the present invention reduces, and therefore cost reduces.
The inwall of base 300 is also recessed to form groove 330 laterally, and groove 330 is arranged around window 320.Cutoff filter 400 arranges the bottom of groove 330, ensureing distance one timing of cutoff filter 400 with the sensitive surface of imageing sensor 200, can reduce the height of base 300, thus reducing the height of whole camera module 10.
Base 300 is also formed with boss 340, and boss 340 is positioned at the inner side of lens barrel 500.Lens barrel 500 is installed on base 300, and particularly, lens barrel 500 is pasted on base 300 by some glue mode or whole gluing mode.Particularly, boss 340 can be annular boss.The object arranging boss 340 is when fitting with lens barrel 500 after glue is drawn on base 300 surface, prevents glue from overflowing from base 300 surface and is formed in the place corresponding with camera lens 600.
Above-mentioned camera module 10 at least has the following advantages:
When assembling, first imageing sensor 200 is assembled to the installed surface 110 of substrate 100, and imageing sensor 200 is electrically connected with substrate 100, again cutoff filter 400 is pasted on window 320 place of base 300, then the base 300 being pasted with cutoff filter 400 is mounted on the installed surface 110 of substrate 100, imageing sensor 200 is contained in the inner chamber 310 of base 300.In addition, camera lens 600 is assembled in lens barrel 500, then the lens barrel 500 being assembled with camera lens 600 is mounted on base 300.Because lens barrel 500 and base 300 adopt split-type structural design, so on installation infrared edge filter 400 to base 300 and to install these two steps on camera lens 600 to lens barrel 500 be separately be independent of each other, so the chip produced when camera lens 600 is engaged with the thread of lens barrel 500 can not fall on IR sheet or imageing sensor 200, thus improve the image quality of camera module 10.
Meanwhile, the present invention also provides a kind of assemble method of camera module, specifically comprises the following steps:
Step S110, provides a substrate 100, the back side 120 that substrate 100 has installed surface 110 and is oppositely arranged with installed surface 110.Substrate 100 can be flexible PCB or printed circuit board.When substrate 100 is flexible PCB, stiffening plate can also be set at the back side 120 of substrate 100, to increase the intensity of substrate 100.
Step S120, is assembled to imageing sensor 200 on the installed surface 110 of substrate 100, and imageing sensor 200 is electrically connected with substrate 100.Particularly, imageing sensor 200 has induction zone 210 and the binding district 220 around induction zone 210 setting.By arranging multiple spaced first weld pad 111 on the installed surface 110 of substrate 100, again multiple spaced second weld pad 221 is set in binding district 220, again one end of gold thread is connected with the first weld pad 111 on installed surface 110, the other end is connected with second weld pad 221 in binding district 220, realizes imageing sensor 200 and is electrically connected with substrate 100.
Step S130, is pasted on window 320 place of base 300 by cutoff filter 400.Particularly, by the mode of viscose glue, cutoff filter 400 can be pasted on window 320 place of base 300, cutoff filter 400 covers window 320.Base 300 is also formed with boss 340, and boss 340 is positioned at the inner side of lens barrel 500.
Step S140, is mounted to the base 300 being pasted with cutoff filter 400 on the installed surface 110 of substrate 100, and imageing sensor 200 is contained in the inner chamber 310 of base 300.
Step S150, is assembled to camera lens 600 in lens barrel 500.The step that camera lens 600 is assembled to lens barrel 500 is separated with the step on installation infrared edge filter 400 to base 300 and is carried out and be independent of each other.Can carry out simultaneously, also can carry out according to sequencing.
Step S160, is mounted to the lens barrel 500 being assembled with camera lens 600 on base 300.
The assemble method of above-mentioned camera at least has the following advantages:
Because lens barrel 500 and base 300 adopt split-type structural design, so on installation infrared edge filter 400 to base 300 and to install these two steps on camera lens 600 to lens barrel 500 be separately be independent of each other, and camera lens 600 is engaged step with the thread of lens barrel 500 be carry out when camera lens 600 is mounted to the step of lens barrel 500, so the chip produced when camera lens 600 is engaged with the thread of lens barrel 500 can not fall on IR sheet or imageing sensor 200, thus improve the image quality of camera module 10.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprising:
Substrate, has installed surface;
Imageing sensor, is arranged at the installed surface of described substrate, and described imageing sensor is electrically connected with described substrate;
Base, is arranged at the installed surface of described substrate, and described base has an inner chamber, and described imageing sensor is contained in described inner chamber, and described base also offers window;
Cutoff filter, is pasted on the window place of described base, and covers described window;
Lens barrel, is installed on described base; And
Camera lens, is assembled in described lens barrel.
2. camera module according to claim 1, is characterized in that, the window of described base is rectangle, and described cutoff filter is rectangle, and the size of described cutoff filter is corresponding with the size of the induction zone of described imageing sensor; And the projection of cutoff filter on induction zone is completely overlapping with induction zone.
3. camera module according to claim 2, is characterized in that, the inwall of described base is recessed to form groove laterally, and described groove is arranged around described window, is used for holding described cutoff filter.
4. camera module according to claim 1, is characterized in that, the binding district that described imageing sensor has induction zone and arranges around described induction zone, and described binding district is electrically connected with described substrate by conductive thread.
5. camera module according to claim 4, it is characterized in that, the installed surface of described substrate is provided with multiple spaced first weld pad, described binding district is provided with multiple spaced second weld pad, one end of described gold thread is connected with described first weld pad, and the other end is connected with described second weld pad.
6. camera module according to claim 1, is characterized in that, described base is also formed with boss, and described boss is positioned at the inner side of described lens barrel.
7. camera module according to claim 6, is characterized in that, described boss is annular boss.
8. camera module according to claim 1, is characterized in that, described lens barrel is pasted on described base by the mode of some glue mode or whole gluing.
9. an assemble method for camera module, is characterized in that, comprises the following steps:
There is provided a substrate, described substrate has installed surface;
Imageing sensor is assembled on the installed surface of described substrate, and described imageing sensor is electrically connected with described substrate;
Cutoff filter is pasted on the window place of base;
By on the installed surface of the floor installation Zhi described substrate that are pasted with cutoff filter, described imageing sensor is made to be contained in the inner chamber of base;
By lens assembling in lens barrel;
The lens barrel being assembled with camera lens is mounted on base.
10. the assemble method of camera module according to claim 9, is characterized in that, described base is also formed with boss, and described boss is positioned at the inner side of described lens barrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108659.3A CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108659.3A CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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| Publication Number | Publication Date |
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| CN104717412A true CN104717412A (en) | 2015-06-17 |
| CN104717412B CN104717412B (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510108659.3A Expired - Fee Related CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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| CN106060350A (en) * | 2016-06-24 | 2016-10-26 | 信利光电股份有限公司 | Photographing module and electronic equipment using photographing module |
| CN107040701A (en) * | 2017-04-17 | 2017-08-11 | 信利光电股份有限公司 | The assembly technique and camera of a kind of camera |
| CN108322632A (en) * | 2018-02-28 | 2018-07-24 | 广东欧珀移动通信有限公司 | Camera module, electronic device and camera module production method |
| CN110445957A (en) * | 2018-05-03 | 2019-11-12 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of camera mould group and the application camera mould group |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106060350A (en) * | 2016-06-24 | 2016-10-26 | 信利光电股份有限公司 | Photographing module and electronic equipment using photographing module |
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| CN110445957A (en) * | 2018-05-03 | 2019-11-12 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of camera mould group and the application camera mould group |
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| Publication number | Publication date |
|---|---|
| CN104717412B (en) | 2018-10-12 |
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