CN104717412B - Camera module and its assemble method - Google Patents
Camera module and its assemble method Download PDFInfo
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- CN104717412B CN104717412B CN201510108659.3A CN201510108659A CN104717412B CN 104717412 B CN104717412 B CN 104717412B CN 201510108659 A CN201510108659 A CN 201510108659A CN 104717412 B CN104717412 B CN 104717412B
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- pedestal
- substrate
- lens barrel
- camera module
- cutoff filter
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Abstract
A kind of camera module includes substrate, imaging sensor, pedestal, cutoff filter, lens barrel and camera lens.When assembling, imaging sensor is first assembled to the mounting surface of substrate, and imaging sensor is made to be electrically connected with substrate, cutoff filter is pasted at the window of pedestal again, then it will be pasted on the floor installation to the mounting surface of substrate of cutoff filter, imaging sensor made to be contained in the inner cavity of pedestal.In addition, by lens assembling to lens barrel, then the lens barrel for being assembled with camera lens is installed to pedestal.Because lens barrel with pedestal is designed using split structure, so on installation cutoff filter to pedestal and on installation camera lens to lens barrel, the two steps are separately to be independent of each other, so the clast that camera lens generates when being engaged with the thread of lens barrel is not fallen out to IR pieces or imaging sensor, to improve the image quality of camera module.There is provided a kind of assemble method of camera module simultaneously.
Description
Technical field
The present invention relates to camera technical fields, more particularly to a kind of camera module and its assemble method.
Background technology
The microscope base generally use one of the front camera module of the electronic devices such as mobile phone, laptop, tablet computer
Formula structure, the upper end of microscope base is for accommodating camera lens, and lower end is for accommodating cutoff filter, i.e. cutoff filter (IR)
It is sequentially all assembled in microscope base with camera lens (lens).Due to microscope base need first with IR pieces assembling after again with lens assembling,
And camera lens is to be fitted together by thread cooperation, therefore during camera lens and microscope base assemble, thread cooperation is produced with microscope base
Raw clast is easy to fall on IR pieces or imaging sensor (sensor), causes POG (particle on glass) existing
As influencing the image quality of camera module.
Invention content
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of it is possible to prevente effectively from the clast that thread occlusion generates is fallen
To improve the camera module and its assemble method of image quality on to IR pieces or imaging sensor.
A kind of camera module, including：
Substrate has mounting surface；
Imaging sensor, is set to the mounting surface of the substrate, and described image sensor is electrically connected with the substrate；
Pedestal, is set to the mounting surface of the substrate, and there is the pedestal inner cavity, described image sensor to be contained in institute
It states in inner cavity, window is further opened on the pedestal；
Cutoff filter is pasted at the window of the pedestal, and covers the window；
Lens barrel is installed on the pedestal；And
Camera lens is assembled in the lens barrel.
The window of the pedestal is rectangle in one of the embodiments, and the cutoff filter is rectangle,
And the size of the cutoff filter is corresponding with the size of the induction zone of described image sensor；And infrared cutoff is filtered
Projection of the mating plate on induction zone and induction zone are completely overlapped.
Recess forms groove outward on the inner wall of the pedestal in one of the embodiments, the groove around
The window setting, for accommodating the cutoff filter.
Described image sensor has induction zone and the binding around induction zone setting in one of the embodiments,
Area, the binding area are electrically connected by conductive thread with the substrate.
The mounting surface of the substrate is provided with multiple spaced first weld pads in one of the embodiments, described
Binding area be provided with multiple spaced second weld pads, one end of the gold thread is connected with first weld pad, the other end and
Second weld pad is connected.
Boss is also formed on the pedestal in one of the embodiments, the boss is located at the inside of the lens barrel.
The boss is annular convex platform in one of the embodiments,.
The lens barrel is pasted on the bottom by the mode of dispensing mode or whole face gluing in one of the embodiments,
On seat.
A kind of assemble method of camera module, includes the following steps：
A substrate is provided, the substrate has mounting surface；
Imaging sensor is assembled on the mounting surface of the substrate, and described image sensor is made to be electrically connected with the substrate
It connects；
Cutoff filter is pasted at the window of pedestal；
It will be pasted on the floor installation to the mounting surface of the substrate of cutoff filter, make described image sensor
It is contained in the inner cavity of pedestal；
It will be in lens assembling to lens barrel；
The lens barrel for being assembled with camera lens is installed to pedestal.
Boss is also formed on the pedestal in one of the embodiments, the boss is located at the inside of the lens barrel.
Above-mentioned camera module and its assemble method have at least the following advantages：
When assembling, imaging sensor is first assembled to the mounting surface of substrate, and imaging sensor is made to be electrically connected with substrate, then
Cutoff filter is pasted at the window of pedestal, then will be pasted with the floor installation of cutoff filter to substrate
Mounting surface on, so that imaging sensor is contained in the inner cavity of pedestal.In addition, by lens assembling to lens barrel, it then will assembling
There is the lens barrel of camera lens to install to pedestal.Because lens barrel with pedestal is designed using split structure, infrared cutoff is installed
The two steps are separately to be independent of each other on optical filter to pedestal and on installation camera lens to lens barrel, so camera lens and lens barrel
The clast that generates is not fallen out to IR pieces or imaging sensor when thread is engaged, to improve camera module at image quality
Amount.
Description of the drawings
Fig. 1 is the structural schematic diagram of camera module in an embodiment；
Fig. 2 is the sectional view of camera module shown in Fig. 1；
Fig. 3 is the sectional view at another visual angle of camera module shown in Fig. 1；
Fig. 4 is the flow diagram of the assemble method of camera module in an embodiment.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Term as used herein " vertical ", " horizontal ", "left", "right" and similar statement simply to illustrate that
Purpose, be not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
It please refers to Fig.1 to Fig.3, the camera module 10 in an embodiment includes substrate 100, imaging sensor 200, bottom
Seat 300, cutoff filter 400, lens barrel 500 and camera lens 600.Specific in present embodiment, pedestal 300 and lens barrel 500
It is arranged using split type mode, the clast generated when coordinating to avoid the thread of camera lens 600 and lens barrel 500 falls to infrared cutoff
On optical filter 400 or imaging sensor 200.
The back side 120 that substrate 100 has mounting surface 110 and is oppositely arranged with mounting surface 110.Substrate 100 can be flexibility
Circuit board or printed circuit board.When substrate 100 is flexible PCB, can also stiffening plate be set at the back side of substrate 100,
To increase the intensity of substrate 100.Multiple first weld pads 111, multiple first weld pads 111 are provided on the mounting surface 110 of substrate 100
It is alternatively arranged, and is enclosed around imaging sensor 200 1.
Imaging sensor 200 is set to the mounting surface 110 of substrate 100, and imaging sensor 200 is electrically connected with substrate 100.Figure
As sensor 200 is usually square configuration.Specifically, imaging sensor 200 has induction zone 210 and is set around induction zone 210
The binding area 220 (areas bonding) set, induction zone 210 are rectangle, and binding area 220 passes through conductive thread 700 and substrate 100
Realize electrical connection.For example, multiple second weld pads 221 are arranged in binding area 220, multiple second weld pads 221 are alternatively arranged in binding
Area 220 and around induction zone 210 be arranged.Conductive thread 700 can be gold thread, it is of course also possible to realize conductive gold to be other
Belong to line.One end of gold thread is connected with second weld pad 221 in binding area 220, the other end and the first weld pad 111 on mounting surface 110
It is connected, to realize being electrically connected for imaging sensor 200 and substrate 100.
Pedestal 300 is set on the mounting surface 110 of substrate 100.Pedestal 300 has an inner cavity 310, imaging sensor 200
It is contained in inner cavity 310.Window 320 is further opened on pedestal 300, cutoff filter 400 is pasted on the window of pedestal 300
At 320, and cover window 320.Specific in present embodiment, pedestal is separately manufacturing with lens barrel, when manufacturing pedestal, pedestal
300 window 320 is designed as rectangle, and corresponding cutoff filter 400 is also rectangle, and cutoff filter
400 size is corresponding with the size of induction zone 210 of imaging sensor 200, and cutoff filter 400 is in induction zone
Projection and induction zone 210 on 210 is completely overlapped.That is, in different camera modules, the ruler of cutoff filter 400
It is very little to change with the size of the induction zone 210 of imaging sensor 200, but the size of cutoff filter 400 always with figure
As the size of the induction zone 210 of sensor 200 is corresponding and cutoff filter 400 is on induction zone 210 projection with
Induction zone 210 is completely overlapped.
Cutoff filter 400 in present embodiment is corresponding with the induction zone 210 of imaging sensor 200, therefore
The binding area 220 of imaging sensor 200 is avoided, light injects the induction of imaging sensor 200 from cutoff filter 400
Area 210 will not return cutoff filter 400 using the gold thread back reflection in binding area 220, secondary light ray is avoided to enter image
The induction zone 210 of sensor 200 is conducive to improve image quality.And compared to traditional structure, infrared section in the present invention
Only the size of optical filter 400 reduces, therefore cost reduction.
Also recess forms groove 330 outward on the inner wall of pedestal 300, and groove 330 is arranged around window 320.It is infrared
The bottom of groove 330 is arranged in edge filter 400, in the induction table for ensureing cutoff filter 400 and imaging sensor 200
One timing of distance in face, can reduce the height of pedestal 300, to reduce the height of entire camera module 10.
Boss 340 is also formed on pedestal 300, boss 340 is located at the inside of lens barrel 500.Lens barrel 500 is installed on pedestal
On 300, specifically, lens barrel 500 is pasted on by dispensing mode or whole face gluing mode on pedestal 300.Specifically, boss
340 can be annular convex platform.The purpose that boss 340 is arranged is prevented when being bonded with lens barrel 500 after glue is drawn on 300 surface of pedestal
Glue is overflowed from 300 surface of pedestal is formed in place corresponding with camera lens 600.
Above-mentioned camera module 10 has at least the following advantages：
In assembling, imaging sensor 200 is first assembled to the mounting surface 110 of substrate 100, and make imaging sensor 200
It is electrically connected with substrate 100, then cutoff filter 400 is pasted at the window 320 of pedestal 300, then will be pasted with red
In the installation to the mounting surface 110 of substrate 100 of pedestal 300 of outer edge filter 400, imaging sensor 200 is made to be contained in pedestal
In 300 inner cavity 310.In addition, camera lens 600 is assembled in lens barrel 500, then the lens barrel 500 for being assembled with camera lens 600 is installed
To pedestal 300.Because lens barrel 500 with pedestal 300 is designed using split structure, cutoff filter is installed
400 to the two steps are separately to be independent of each other on pedestal 300 and on installation camera lens 600 to lens barrel 500, so camera lens
600 clasts generated when being engaged with the thread of lens barrel 500 are not fallen out to IR pieces or imaging sensor 200, to improve
The image quality of camera module 10.
Meanwhile the present invention also provides a kind of assemble method of camera module, specifically including following steps：
Step S110 provides a substrate 100, the back of the body that substrate 100 has mounting surface 110 and is oppositely arranged with mounting surface 110
Face 120.Substrate 100 can be flexible PCB or printed circuit board.It, can also be when substrate 100 is flexible PCB
Stiffening plate is arranged in the back side 120 of substrate 100, to increase the intensity of substrate 100.
Imaging sensor 200 is assembled on the mounting surface 110 of substrate 100 by step S120, and makes imaging sensor 200
It is electrically connected with substrate 100.Specifically, imaging sensor 200 has induction zone 210 and around the binding area that induction zone 210 is arranged
220.It is arranged by the way that multiple spaced first weld pads 111 are arranged on the mounting surface 110 of substrate 100, then in binding area 220
Multiple spaced second weld pads 221, then one end of gold thread is connected with the first weld pad 111 on mounting surface 110, the other end
It is connected with second weld pad 221 in binding area 220, realizes that imaging sensor 200 is electrically connected with substrate 100.
Cutoff filter 400 is pasted at the window 320 of pedestal 300 by step S130.Specifically, can pass through
Cutoff filter 400 is pasted at the window 320 of pedestal 300 by the mode of viscose glue, and cutoff filter 400 covers window
Mouth 320.Boss 340 is also formed on pedestal 300, boss 340 is located at the inside of lens barrel 500.
Step S140 will be pasted with the installation of pedestal 300 of cutoff filter 400 to the mounting surface 110 of substrate 100
On, so that imaging sensor 200 is contained in the inner cavity 310 of pedestal 300.
Camera lens 600 is assembled in lens barrel 500 by step S150.Camera lens 600 is assembled to the step of lens barrel 500 and installation is red
Step on outer edge filter 400 to pedestal 300 is separately carried out and is independent of each other.It can be carried out at the same time, it can also be according to elder generation
Sequence carries out afterwards.
Step S160 will be assembled in the installation to pedestal 300 of lens barrel 500 of camera lens 600.
The assemble method of above-mentioned camera has at least the following advantages：
Because lens barrel 500 and pedestal 300 are designed using split structure, installation cutoff filter 400 to
The two steps are separately to be independent of each other on pedestal 300 and on installation camera lens 600 to lens barrel 500, and camera lens 600 and lens barrel
500 thread occlusion step is carried out in the step of the installation of camera lens 600 to lens barrel 500, so camera lens 600 and lens barrel 500
The clast that thread generates when being engaged is not fallen out to IR pieces or imaging sensor 200, to improve camera module 10
Image quality.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of camera module, which is characterized in that including：
Substrate has mounting surface；
Imaging sensor is set to the mounting surface of the substrate, and described image sensor is electrically connected with the substrate, described image
Sensor has induction zone and around the binding area of induction zone setting；
Pedestal, is set to the mounting surface of the substrate, and there is the pedestal inner cavity, described image sensor to be contained in described
In chamber, window is further opened on the pedestal；
Cutoff filter is pasted at the window of the pedestal, and covers the window, the cutoff filter
Size is corresponding with the size of the induction zone of described image sensor, and the cutoff filter is in described image sensor
On projection be staggered with the binding area；
Lens barrel is installed on the pedestal；And
Camera lens is assembled in the lens barrel；
Wherein, the pedestal is arranged with the lens barrel using split type mode.
2. camera module according to claim 1, which is characterized in that the window of the pedestal is rectangle, described red
Outer edge filter is rectangle, and the size of the induction zone of the size and described image sensor of the cutoff filter
It is corresponding；And projection of the cutoff filter on induction zone and induction zone are completely overlapped.
3. camera module according to claim 2, which is characterized in that recess is formed outward on the inner wall of the pedestal
Groove, the groove are arranged around the window, for accommodating the cutoff filter.
4. camera module according to claim 1, which is characterized in that the binding area passes through conductive thread and the base
Plate is electrically connected.
5. camera module according to claim 4, which is characterized in that the mounting surface of the substrate is provided with multiple intervals
First weld pad of arrangement, the binding area is provided with multiple spaced second weld pads, one end of the conductive thread and institute
It states the first weld pad to be connected, the other end is connected with second weld pad.
6. camera module according to claim 1, which is characterized in that boss is also formed on the pedestal, it is described convex
Platform is located at the inside of the lens barrel.
7. camera module according to claim 6, which is characterized in that the boss is annular convex platform.
8. camera module according to claim 1, which is characterized in that the lens barrel is applied by dispensing mode or whole face
The mode of glue is pasted on the pedestal.
9. a kind of assemble method of camera module, which is characterized in that include the following steps：
A substrate is provided, the substrate has mounting surface；
Imaging sensor is assembled on the mounting surface of the substrate, and described image sensor is made to be electrically connected with the substrate,
Described image sensor has induction zone and around the binding area of induction zone setting；
Cutoff filter is pasted at the window of pedestal；
It will be pasted on the floor installation to the mounting surface of the substrate of cutoff filter, described image sensor made to accommodate
In the inner cavity of pedestal, the size of the cutoff filter is corresponding with the size of the induction zone of described image sensor,
Projection of the cutoff filter in described image sensor is staggered with the binding area；
It will be in lens assembling to lens barrel；
The lens barrel for being assembled with camera lens is installed to pedestal；
Wherein, the pedestal forms split structure with the lens barrel separately manufacturing.
10. the assemble method of camera module according to claim 9, which is characterized in that be also formed on the pedestal
Boss, the boss are located at the inside of the lens barrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108659.3A CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108659.3A CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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| CN104717412A CN104717412A (en) | 2015-06-17 |
| CN104717412B true CN104717412B (en) | 2018-10-12 |
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| CN201510108659.3A Expired - Fee Related CN104717412B (en) | 2015-03-12 | 2015-03-12 | Camera module and its assemble method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106060350A (en) * | 2016-06-24 | 2016-10-26 | 信利光电股份有限公司 | Photographing module and electronic equipment using photographing module |
| CN107040701B (en) * | 2017-04-17 | 2020-05-29 | 信利光电股份有限公司 | Camera assembly process method and camera |
| CN108322632B (en) * | 2018-02-28 | 2020-09-08 | Oppo广东移动通信有限公司 | Camera module, electronic device and camera module manufacturing method |
| CN110445957A (en) * | 2018-05-03 | 2019-11-12 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of camera mould group and the application camera mould group |
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| CN101114039A (en) * | 2006-07-28 | 2008-01-30 | 鸿富锦精密工业（深圳）有限公司 | Lens module |
| CN102681124A (en) * | 2011-03-07 | 2012-09-19 | 鸿富锦精密工业（深圳）有限公司 | Lens module and assembly method thereof |
| CN203492103U (en) * | 2013-09-17 | 2014-03-19 | 南昌欧菲光电技术有限公司 | An image module |
| CN203912055U (en) * | 2014-05-04 | 2014-10-29 | 光宝电子(广州)有限公司 | Voice coil motor and camera module |
| CN204517924U (en) * | 2015-03-12 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009253427A (en) * | 2008-08-25 | 2009-10-29 | Cheng Uei Precision Industry Co Ltd | Camera module and method of manufacturing the same |
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2015
- 2015-03-12 CN CN201510108659.3A patent/CN104717412B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101114039A (en) * | 2006-07-28 | 2008-01-30 | 鸿富锦精密工业（深圳）有限公司 | Lens module |
| CN102681124A (en) * | 2011-03-07 | 2012-09-19 | 鸿富锦精密工业（深圳）有限公司 | Lens module and assembly method thereof |
| CN203492103U (en) * | 2013-09-17 | 2014-03-19 | 南昌欧菲光电技术有限公司 | An image module |
| CN203912055U (en) * | 2014-05-04 | 2014-10-29 | 光宝电子(广州)有限公司 | Voice coil motor and camera module |
| CN204517924U (en) * | 2015-03-12 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Camera module |
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