CN108156278A - Fingerprint chip packaging device and terminal - Google Patents
Fingerprint chip packaging device and terminal Download PDFInfo
- Publication number
- CN108156278A CN108156278A CN201711346969.4A CN201711346969A CN108156278A CN 108156278 A CN108156278 A CN 108156278A CN 201711346969 A CN201711346969 A CN 201711346969A CN 108156278 A CN108156278 A CN 108156278A
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- Prior art keywords
- packaging device
- fingerprint
- chip packaging
- fingerprint chip
- encapsulation part
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of fingerprint chip packaging device and terminals.Fingerprint chip packaging device includes packaging body and fingerprint recognition chip.Packaging body includes bottom surface and connects the side of bottom surface, and the junction of bottom surface and side is formed with recessed portion.Fingerprint recognition chip is arranged in packaging body.The fingerprint chip packaging device of embodiment of the present invention, recessed portion can coordinate with the support edge in case ring, so as to location fingerprint chip packaging device, and then improve the efficiency of assembling of fingerprint chip packaging device.In addition, recessed portion can also reduce the thickness of fingerprint chip packaging device with support edge cooperation, be conducive to the terminal miniaturization of employing fingerprint chip packaging device.
Description
Technical field
The present invention relates to field of terminal more particularly to a kind of fingerprint chip packaging device and terminals.
Background technology
In the related art, certain mobile phones include fingerprint chip packaging device and case ring, and fingerprint chip packaging device is set
It puts in case ring.Fingerprint chip packaging device includes fingerprint recognition chip and the packaging body for encapsulating fingerprint recognition chip.
But at present, the structure of fingerprint chip packaging device is unfavorable in location and installation to case ring, therefore leads to fingerprint chip package
The efficiency of assembling of device is relatively low.
Invention content
The present invention is directed at least solve one of technical problem in the prior art.For this purpose, the present invention provides a kind of finger
Line chip packaging device and a kind of terminal.
The fingerprint chip packaging device of embodiment of the present invention includes packaging body and fingerprint recognition chip.Packaging body includes bottom
The junction of face and the side for connecting bottom surface, bottom surface and side is formed with recessed portion.Fingerprint recognition chip is arranged in packaging body.
The fingerprint chip packaging device of embodiment of the present invention, recessed portion can coordinate with the support edge in case ring, from
And can location fingerprint chip packaging device, and then improve the efficiency of assembling of fingerprint chip packaging device.In addition, recessed portion and branch
The cooperation of support side can also reduce the thickness of fingerprint chip packaging device, and the terminal for being conducive to employing fingerprint chip packaging device is small-sized
Change.
In some embodiments, the packaging body includes the second envelope of the first encapsulation part and connection first encapsulation part
Dress portion, first encapsulation part include the bottom surface, and second encapsulation part includes the side.
In some embodiments, the fingerprint recognition chip is arranged in first encapsulation part.
In some embodiments, the shape of the form and dimension of first encapsulation part and the fingerprint recognition chip and
Size coordinates.
In some embodiments, the rounded cuboid of shape of first encapsulation part.
In some embodiments, second encapsulation part includes the top surface being connect with the side, the fingerprint chip
Packaging system includes fixed cover plate on the top surface.
In some embodiments, the form and dimension of the cover plate and the form and dimension of the top surface coordinate.
In some embodiments, the recessed portion includes second face in the first face and connection first face, and described the
On one side perpendicular to second face.
In some embodiments, the rounded transition shape in junction in first face and second face.
The terminal of embodiment of the present invention includes the fingerprint chip packaging device described in any of the above embodiment.
The terminal of embodiment of the present invention, recessed portion can coordinate with the support edge in case ring, so as to location fingerprint
Chip packaging device, and then improve the efficiency of assembling of fingerprint chip packaging device.In addition, recessed portion may be used also with support edge cooperation
To reduce the thickness of fingerprint chip packaging device, be conducive to the terminal miniaturization of employing fingerprint chip packaging device.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the floor map of the terminal of embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section of the input module of embodiment of the present invention；
Fig. 3 is the stereoscopic schematic diagram of the case ring of embodiment of the present invention；
Fig. 4 is the diagrammatic cross-section of the case ring of embodiment of the present invention；
Fig. 5 is the floor map of the case ring of embodiment of the present invention；
Fig. 6 is the perspective exploded view of the case ring of embodiment of the present invention；
Fig. 7 is another perspective exploded view of the case ring of embodiment of the present invention；
Fig. 8 is the stereoscopic schematic diagram of the fingerprint chip packaging device of embodiment of the present invention；
Fig. 9 is the diagrammatic cross-section of the fingerprint chip packaging device of embodiment of the present invention；
Figure 10 is the floor map of the fingerprint chip packaging device of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instructions such as needle ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
The description present invention and simplified description rather than instruction imply that signified device or element must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
" first " is defined as a result, and the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature it " on " or it " under "
It can be in direct contact including the first and second features, it is not to be in direct contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " including first spy
Sign is right over second feature and oblique upper or is merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " immediately below second feature and obliquely downward or be merely representative of including fisrt feature
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 and Fig. 2, the input module 100 of embodiment of the present invention includes touch panel 10, case ring 20 and refer to
Line chip packaging device 30.
The input module 100 of embodiment of the present invention can be applied to terminal 1000, and terminal 1000 is, for example, mobile phone or tablet
The electronic devices such as computer.It is appreciated that terminal 1000 includes but not limited to the example of present embodiment.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14.It can manage
Solution, the upper surface 12 of touch panel 10 is the appearance of input module 100, towards user.User can be enterprising in upper surface 12
Row gesture operation, such as click or slide and corresponding function is realized with control terminal 1000.
The material of touch panel 10 can be made of translucent materials such as glass, ceramics or sapphires.Due to touch panel 10
Due to the input part as terminal 1000, touch panel 10 is often subject to collide or the contacts such as scratches.For example, user is by terminal
1000 when being put into pocket, and touch panel 10 may be scratched by the key in user's pocket and be damaged.
Therefore, the larger material of hardness, such as above-described sapphire material may be used in the material of touch panel 10.
It is of course also possible to cover sheet is set up in the upper surface of touch panel 10 12 so that touch panel 10 to be prevented to be scraped off.
Further, touch panel 10 includes display area 15 and non-display area 16.Normally, in touch panel 10
Between region be arranged on around display area 15 as display area 15, non-display area 16.For example, non-display area 16 is set
In the top side of display area 15 or bottom side.
Since touch panel 10 is made of translucent material, user can check terminal 1000 by display area 15
Screen shown by content.
In order to enable terminal 1000 is more beautiful, ink, ink can be sprayed in the lower surface of non-display area 16 14
Color be, for example, that colors, the concrete condition such as white, black or blue can be set according to actual demand.Ink not only can be with
Meet demand of the user to the terminal 1000 of different colours, the structure inside terminal 1000 can also be covered to reach beautification terminal
1000 effect.
It is appreciated that the shape of touch panel 10 can specifically be designed according to the shape of terminal 1000, for example, fillet square
Shape.
Further, touch panel 10 offers mounting hole 17.In present embodiment, mounting hole 17 is through upper surface 12
And the through-hole of lower surface 14.In other embodiments, mounting hole 17 can be formed in the blind hole of lower surface 14.
In present embodiment, mounting hole 17 is in the oval bodily form.Certainly, in other embodiments, mounting hole 17 can root
It takes on a different shape according to specific requirements design, such as round or ellipse shape.Therefore, the mounting hole 17 of present embodiment
The example of shape is not considered as limiting the invention.
In some embodiments, case ring 20 wears mounting hole 17, and is fixedly connected with touch panel 10.Fingerprint core
Chip package 30 is housed in case ring 20, and is fixedly connected with case ring 20.
Usually, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, mounting hole 17 in order to prevent
It is interfered with receiver, preferably, mounting hole 17 is opened in the bottom section of touch panel 10, so as to carrying for mounting hole 17
For larger design space.Further, mounting hole 17 is opened in the non-display area 16 of touch panel 10.
Preferably, mounting hole 17 is opened in the centre position of 10 bottom section of touch panel so that touch panel 10 is in big
Cause symmetrical structure.So so that terminal 1000 is more beautiful, two is user-friendly.
It, can be first by case ring 20 from touch panel 10 when manufacturing input module 100 when mounting hole 17 is through-hole
Lower section is packed into mounting hole 17, and then glue is clicked and entered in the gap between the inner wall of mounting hole 17 and case ring 20, so that case ring
20 are fixedly connected with touch panel 10.
Fingerprint chip packaging device 30 is packed into case ring 20, and consolidated using colloid from the top of touch panel 10 later
Surely connection fingerprint chip packaging device 30 and case ring 20.
When mounting hole 17 is blind hole, first fingerprint chip packaging device 30 can be packed into case ring 20, then refers to band
The case ring 20 of line chip packaging device 30 is packed into mounting hole 17, and usable glue is adhesively fixed case ring 20 and touch panel
10。
It please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inner wall 211 of self-chambering circlets 21 extends internally.
The support edge 22 of the case ring 20 of embodiment of the present invention can support and location fingerprint chip packaging device 30, from
And improve the efficiency of assembling of fingerprint chip packaging device 30 and case ring 20.
In other words, fingerprint chip packaging device 30 is supported on support edge 22.Fingerprint chip packaging device 30 is packed into
When in rosette 21, fingerprint chip packaging device 30 can be pressed from top to bottom, if the position of fingerprint chip packaging device 30
It cannot move again, then it represents that fingerprint chip packaging device 30 has been resisted against on support edge 22, and is installed into precalculated position.
It is appreciated that rosette 21 is formed with accommodating hole 212, support edge 22 is located in accommodating hole 212.Accommodating hole 212 can
To be in right cylinder shape, in other words, inner wall 211 is linearly, in order to which fingerprint chip packaging device 30 is rapidly packed into accommodating hole 212
It is interior.
The material that accommodating hole 212 and support edge 22 can be removed on part by way of machining is formed, can also
It is formed by modes such as castings.
In order to ensure the intensity of case ring 20, preferably, the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the service life of case ring 20.Certainly, case ring 20
The other materials such as plastics can be used to be made.
In some embodiments, support edge 22 is perpendicular to the inner wall 211 of rosette 21.
In this way, support edge 22 is easily formed, the manufacture cost of rosette 21 can be reduced.In addition, when manufacture input module
When 100, support edge 22 is horizontally situated, and the inner wall 211 of rosette 21 is located at vertical position so that is coordinated with support edge 22
The face of fingerprint chip packaging device 30 is horizontal plane, can simplify the fingerprint chip packaging device being supported on support edge 22 in this way
30 structure.
In some embodiments, rosette 21 includes the first bottom surface 213 for being connect with inner wall 211, under support edge 22
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, such as arrangement above, larger accommodating space can be formed in rosette 21, with
Ensure that fingerprint chip packaging device 30 can be housed in rosette 21.
In other words, in the case where the thickness of fingerprint chip packaging device 30 is constant, the height of rosette 21 is smaller, so as to
The thickness of input module 100 can be reduced, and then can be thinned for the thickness of terminal 1000 and design basis is provided.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connect with inner wall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
In this way, the finger that guide ramp 2142 can guide user smoothly enters in rosette 21 to carry out fingerprint recognition behaviour
Make, the accuracy rate that user carries out fingerprint recognition operation can be improved.It is shinny it is possible to further be plated in guide ramp 2142
Metal layer (such as layers of chrome), so that rosette 21 is more beautiful.
It is appreciated that guide ramp 2142 is annular surface, user can be facilitated to be placed in finger from all directions in this way and decorated
To press fingerprint chip packaging device 30 in ring 21, so as to carry out fingerprint recognition operation.
In some embodiments, support edge 22 is formed with avoid holes 222.
In this way, avoid holes 222 are conducive to the cabling of fingerprint flexible PCB 40 being connect with fingerprint chip packaging device 30
Layout.For example, fingerprint flexible PCB 40 can be to pass through avoid holes 222 to be connect with fingerprint chip packaging device 30 (such as Fig. 2 institutes
Show).
In some embodiments, 222 rounded rectangle of avoid holes, the side walls 2221 of avoid holes 222 is along avoid holes 222
Axial direction is formed with escape groove 2222, and escape groove 2222 is connected with avoid holes 222.
Such as shown in Fig. 2, after fingerprint flexible PCB 40 is connect with fingerprint chip packaging device 30, first to escape groove 2222
Direction extension, be then bent detour.Therefore, escape groove 2222 can prevent fingerprint flexible PCB 40 from occurring with side wall 2221
Interference, is conducive to fingerprint flexible PCB 40 and connects up.
In some embodiments, case ring 20 includes the outwardly extending flange 23 of outer wall of self-chambering circlets 21.
In this way, flange 23 can be resisted against the lower surface 14 of touch panel 10, so as to increase case ring 20 and touch surface
The connection area of plate 10 improves the reliability that case ring 20 is fixedly connected with touch panel 10.
In addition, when case ring 20 is packed into mounting hole 17 from the bottom up, flange 23 is resisted against under touch panel 10
During surface 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduce the manufacture cost of input module 100.
In some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 to prevent water from case ring 20
Gap between mounting hole 17 enters in terminal 1000, so as to improve the waterproof effect of terminal 1000.
As Fig. 3-Fig. 5 embodiment in, flange 23 is an integral molding structure with rosette 21.And such as the reality of Fig. 6 and Fig. 7
It applies in mode, flange 23 is split molding structure with rosette 21.Specifically, rosette 21 includes socket part 24, socket part 24
Connect support edge 22.Flange 23 is set on socket part 24.Flange 23 can reduce case ring 20 with 21 split of rosette molding
Manufacture difficulty so that when producing case ring 20 in batches, the consistency of each case ring 20 can be improved.
It should be pointed out that in some embodiments, socket part 24 can be offered to be passed through for fingerprint flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connection side 241 and loading plate 242.It connects side 241 and connects support edge 22 and loading plate
242, connection side 241 is approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connection side 241 offers
Via 24a.
Socket part 24 is hollow partly or entirely to accommodate fingerprint chip packaging device 30.It should be noted that at certain
In a little embodiments, fingerprint chip packaging device 30 can be supported on loading plate 242.
Referring to Fig. 3-Fig. 5, in some embodiments, flange 23 is perpendicular to the outer wall 215 of rosette 21.
In this way, 20 manufacturing process of case ring is simple, the contact area being connect with touch panel 10 can also be increased.
In some embodiments, flange 23 includes the first protrusion 231 and connects the second protrusion 232 of the first protrusion 231,
First protrusion 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second protrusion 232,
It is convexly equipped in first 2311 and the second protrusion 232 for second 2312.
After case ring 20 is packed into mounting hole 17, the longitudinal direction of first 2311 and the second protrusion 232 along touch panel 10
Extension, second 2312 extends along 10 horizontal direction of touch panel.
Since the accommodating space of 10 horizontal direction of touch panel is larger, second 2312 is convexly equipped in first 2311
And second protrusion 232 can increase the connection area of flange 23 and touch panel 10.
In addition, the width of first 2311 and the second protrusion 232 is smaller, it can be to avoid the non-display area of touch panel 10
16 longitudinal length lengthens due to the width of first 2311 and the second protrusion 232, and reduces the area of display area 15 with touching
The area ratio of panel 10 is touched, and then influences the appearance of terminal 1000.
In some embodiments, the top surface 231a of the first protrusion 231 is concordant with the top surface 232a of the second protrusion 232, the
The thickness of one 2311 is more than the thickness of the second protrusion 232.
It is appreciated that after case ring 20 is packed into mounting hole 17, relative to first 2311, the second protrusion 232 is closer to aobvious
Show region 15.In other words, it is set far from display area 15 for first 2311, the second protrusion 232 is set close to display area 15.
Since part of the input module 100 close to the position of display area 15 is more, the thickness of the second protrusion 232
It is relatively thin to be interfered (as shown in Figure 2) with the other parts close to display area 15 to avoid the second protrusion 232.
As shown in Fig. 2, the screen flexible PCB 50 and other parts of screen of the case ring 20 with connecting terminal 1000 exist
There is the part of overlapping in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second protrusion 232 can to avoid with
Screen flexible PCB 50 and other parts interfere so that case ring 20 can be set closer to display area 15, decoration
Circle 20 even can be partly or entirely arranged in the display area 15 of touch panel 10, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, increase the ratio of the area of display area 15 and the area of touch panel 10.
In some embodiments, rosette 21 is in oblong, and the outer wall 215 of rosette 21 includes two parallel straight lines
Section 2151 and two bending sections 2152 for connecting two straightways 2151, first 2311 is disposed therein a straightway 2151
On, second 2312 is arranged on two bending sections 2152.
In this way, rosette 21 is more beautiful.Specifically, transversely arranged (such as Fig. 1 of two bending sections 2152 along touch panel 10
In left and right to), two straightways 2151 along touch panel 10 longitudinal direction (with laterally it is vertical) arrange.
In some embodiments, the shape of second 2312 is matched with the shape of bending section 2152.
For example, the outer profile of second 2312 is also arc-shaped, and substantially it is arranged concentrically with bending section 2152.In this way may be used
So that the structure of case ring 20 is compacter.
Also referring to Fig. 8-Figure 10, in some embodiments, fingerprint chip packaging device 30 include packaging body 31 and
Fingerprint recognition chip 32.
Packaging body 31 includes the second bottom surface 311 and connects the side 312 of the second bottom surface 311, the second bottom surface 311 and side
312 junction is formed with recessed portion 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
The fingerprint chip packaging device 30 of embodiment of the present invention, recessed portion 33 can be with the support edges 22 in case ring 20
Cooperation, so as to location fingerprint chip packaging device 30, and then improves the efficiency of assembling of fingerprint chip packaging device 30.
In addition, recessed portion 33 coordinates the thickness that can also reduce fingerprint chip packaging device 30 with support edge 22, be conducive to
The terminal 1000 of employing fingerprint chip packaging device 30 minimizes.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
32 corresponding positions.The signal of fingerprint recognition chip 32 identifies the fingerprint pattern of user through packaging body 31 with acquisition, by user
Fingerprint pattern matched with the fingerprint pattern to prestore, if successful match, unlock terminal 1000.
It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, with acquisition
The fingerprint pattern of user.Packaging body 31, which encapsulates fingerprint recognition chip 32, can reduce sensor pixel array when acquiring fingerprint pattern
It is influenced by other interference signals, to improve the accuracy rate of identification.
It should be noted that recessed portion 33 is used to coordinate with support edge 22 so that fingerprint chip packaging device 30 passes through recess
Portion 33 is supported on support edge 22.
Recessed portion 33 coordinates with support edge 33, and in other words, support edge 22 is housed in recessed portion 33.
In the present embodiment, the structure in a ring of recessed portion 33, correspondingly, support edge 22 also in a ring structure so that recess
Portion 33 can accommodate support edge 22.
In other embodiments, recessed portion 33 can be circumferentially-spaced around the junction of the second bottom surface 311 and side 312
Multiple recessed portions 33 of setting, correspondingly, support edge 22 are also around circumferentially spaced multiple support edges 22, multiple recessed portions
33 with multiple 22 corresponding matchings of support edge.
Such as the quantity of recessed portion 33 is 3, two neighboring recessed portion 33 is around circumferentially-spaced 120 degree settings, support edge 22
Quantity also for 3, it is and corresponding with 3 recessed portions in locations of structures.
It should be pointed out that the shape of recessed portion 33 and quantity are not limited to situation discussed above, if recessed portion 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip packaging device 30, and therefore, example described above is not
It is interpreted as limitation of the present invention.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip packaging device 30, fingerprint chip package dress
Recessed portion 33 can also be omitted by putting 30.
In some embodiments, packaging body 31 includes the first encapsulation part 313 and connects the second envelope of the first encapsulation part 313
Dress portion 314, the first encapsulation part 313 include the second bottom surface 311, and the second encapsulation part 314 includes side 312.
In this way, the first encapsulation part 313 is connect with the second encapsulation part 314 can form recessed portion 33.Packaging body 31 can pass through
The material on packaging body 31 is machined away so as to form recessed portion 33, can also be connected by the first encapsulation part 313 and the second encapsulation part 314
It connects to be formed.
It is appreciated that in order to form recessed portion 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 is arranged in avoid holes 222, and the second encapsulation part 314 is supported on
It supports on side 22.
In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.
In this way, the circuit junction of fingerprint recognition chip 32 easily exposes to connect with fingerprint flexible PCB 40.
In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big
Small cooperation.
In other words, the shape of fingerprint recognition chip 32 and the shape of the first encapsulation part 313 are similar or identical, for example, fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or rounded cuboid shape.
The size of first encapsulation part 313 encapsulates fingerprint recognition chip 32 slightly larger than the size of fingerprint recognition chip 32 to realize
Effect.Therefore, it can cause that the structure of fingerprint chip packaging device 30 is compacter in this way.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
In this way, the first packaging body 31 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part
The shape of 313 shape and avoid holes 222 coordinates, that is to say, that the shape of avoid holes 222 also rounded cuboid.
In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connect with side 312, fingerprint chip envelope
Assembling device 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 is consolidated by colloid
It is scheduled on the top surface 3141 of the second encapsulation part 314.
When carrying out fingerprint recognition operation, finger can be pressed in cover plate 34 user.Cover plate 34 can protect envelope
It is without damage to fill body 31, to improve the reliability of fingerprint chip packaging device 30.
Cover plate 34 is touched due to being often subject to, the material that cover plate 34 can be used hardness higher is made, such as with
On the sapphire material that refers to.
In some embodiments, the form and dimension of cover plate 34 and the shape of the top surface 3141 of the second encapsulation part 314
And size cooperation.
For example, the shape of top surface 3141 is in oblong, the shape of cover plate 34 is also in oblong.The area of cover plate 34 omits
More than the area of the top surface 3141 of the second encapsulation part 314.Therefore, the second encapsulation part 314 can be completely covered in cover plate 34.
In some embodiments, sealing element 60 is provided between the second encapsulation part 314 and support edge 22, sealing element 60 is close
Seal the gap between the second encapsulation part 314 and support edge 22.Sealing element 60 is for example made (as shown in Figure 2) of silica gel.
In this way, sealing element 60 can prevent the foreign matters such as water and dust between fingerprint chip packaging device 30 and case ring 20
Gap enter in terminal 1000, improve the water proof and dust proof effect of terminal 1000.
In some embodiments, recessed portion 33 includes the first face 331 and connects second face 332 in the first face 331, and first
Face 331 is perpendicular to the second face 332.
In this way, recessed portion 33 is easily formed, the first face 331 is easily connect with support edge 22.First face 331 and the second face
332 vertically so that packaging body 31 is in step-like.
Specifically, sealing element 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the rounded transition shape in the junction in the first face 331 and the second face 332.
In this way, the defects of crackle is less likely to occur for the junction in the first face 331 and the second face 332, and recessed portion 33 holds
Easily formed.
In the description of this specification, reference term " embodiment ", " is schematically implemented " certain embodiments "
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can in an appropriate manner combine in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
In the case of not departing from the principle of the present invention and objective can these embodiments be carried out with a variety of variations, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (10)
1. a kind of fingerprint chip packaging device, which is characterized in that including：
Packaging body, the packaging body include the side of bottom surface and the connection bottom surface, the junction of the bottom surface and the side
It is formed with recessed portion, recessed portion structure in a ring；And
The fingerprint recognition chip being arranged in the packaging body, the packaging body encapsulate the fingerprint recognition chip；
The packaging body includes the second encapsulation part of the first encapsulation part and connection first encapsulation part, the first encapsulation part packet
The bottom surface is included, second encapsulation part includes the side；
For being housed in case ring, the case ring includes rosette and from the rosette fingerprint chip packaging device
The support edge that extends internally of inner wall, support edge structure in a ring, the support edge is housed in the recessed portion, described
Support edge is formed with avoid holes, and first encapsulation part wears the avoid holes, and second encapsulation part is supported on the support
Bian Shang.
2. fingerprint chip packaging device as described in claim 1, which is characterized in that the fingerprint recognition chip is arranged on described
In first encapsulation part.
3. fingerprint chip packaging device as claimed in claim 2, which is characterized in that the form and dimension of first encapsulation part
Coordinate with the form and dimension of the fingerprint recognition chip.
4. fingerprint chip packaging device as described in claim 1, which is characterized in that the shape of first encapsulation part is rounded
Cuboid.
5. fingerprint chip packaging device as described in claim 1, which is characterized in that second encapsulation part includes and the side
The top surface of face connection, the fingerprint chip packaging device include fixed cover plate on the top surface.
6. fingerprint chip packaging device as claimed in claim 5, which is characterized in that the cover plate is fixed on institute by viscose glue
It states on top surface.
7. fingerprint chip packaging device as claimed in claim 5, which is characterized in that the form and dimension of the cover plate and institute
State the form and dimension cooperation of top surface.
8. such as claim 1-7 any one of them fingerprint chip packaging devices, which is characterized in that the recessed portion includes first
Face and second face in connection first face, first face is perpendicular to second face.
9. fingerprint chip packaging device as claimed in claim 8, which is characterized in that the company in first face and second face
Connect the rounded transition shape in place.
10. a kind of terminal, which is characterized in that including such as claim 1-9 any one of them fingerprint chip packaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711346969.4A CN108156278B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675148.4A CN106101323B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
| CN201711346969.4A CN108156278B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675148.4A Division CN106101323B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
Publications (2)
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| CN108156278A true CN108156278A (en) | 2018-06-12 |
| CN108156278B CN108156278B (en) | 2019-10-15 |
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| CN201610675148.4A Active CN106101323B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
| CN201711346969.4A Active CN108156278B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610675148.4A Active CN106101323B (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging device and terminal |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10565426B2 (en) * | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
| CN106650627B (en) * | 2016-11-16 | 2023-06-20 | 江西合力泰科技有限公司 | Biological recognition module mounting structure and mounting method thereof |
| CN106815572A (en) * | 2017-01-03 | 2017-06-09 | 广东欧珀移动通信有限公司 | Support, cover plate assembly and terminal for fingerprint recognition component |
| CN109313697B (en) * | 2017-02-23 | 2021-08-10 | 深圳市汇顶科技股份有限公司 | Sensing device |
| CN106953947B (en) * | 2017-03-14 | 2019-08-20 | Oppo广东移动通信有限公司 | Cover plate assembly, the manufacturing method of cover plate assembly and electronic device |
| CN207965907U (en) * | 2017-09-14 | 2018-10-12 | 中兴通讯股份有限公司 | A kind of fingerprint recognition module, touching display screen and mobile terminal |
| CN107835273B (en) | 2017-11-02 | 2020-03-06 | 京东方科技集团股份有限公司 | Cover plate, preparation method thereof and electronic device |
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Also Published As
| Publication number | Publication date |
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| CN106101323B (en) | 2018-01-19 |
| CN106101323A (en) | 2016-11-09 |
| CN108156278B (en) | 2019-10-15 |
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