CN204334749U - Camera module - Google Patents
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- CN204334749U CN204334749U CN201420844836.5U CN201420844836U CN204334749U CN 204334749 U CN204334749 U CN 204334749U CN 201420844836 U CN201420844836 U CN 201420844836U CN 204334749 U CN204334749 U CN 204334749U
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- pcb board
- image sensing
- sensing chip
- camera module
- flex circuit
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Abstract
A kind of camera module comprises substrate, image sensing chip and many conductive lead wires.Substrate comprises the first pcb board, double-sided flex circuit plate and the second pcb board that are cascading, forms the circuit board of sandwich construction, ensures that wiring space is sufficient; The upper surface that double-sided flex circuit plate exposes is provided with multiple first weld pad, the upper surface of image sensing chip is provided with the second weld pad, one end of each conductive lead wire is connected with one first weld pad, and the other end is connected with one second corresponding weld pad, is electrically connected with substrate to realize image sensing chip; First pcb board offers the first through hole, image sensing chip is arranged in the first through hole, the height that total height after image sensing chip and substrate in batch can be made to install is less than image sensing chip itself and substrate itself with, effectively can reduce the height of camera module, day by day be tending towards frivolous, short and small growth requirement to meet.
Description
Technical field
The utility model relates to picture pick-up device technical field, particularly relates to a kind of camera module.
Background technology
Along with the development of science and technology, camera module not only will meet higher camera function, also day by day trends towards frivolous, short and small future development.And the frivolous, short and small of camera module affects one of frivolous key factor of the mobile terminal picture pick-up devices such as mobile phone, therefore improve the structure of camera module, just seem be even more important to being conducive to the frivolous future development of the mobile terminal picture pick-up devices such as mobile phone.
Traditional camera module is normally made up of camera lens, camera lens support component, sensor sensor devices and circuit board.Height+PCB the thickness of optical length (TTL, Total Track the Length)+sensor sensor devices of the total height=camera lens of camera module.The height of this traditional camera module is comparatively large, cannot meet frivolous, short and small demand.
Utility model content
Based on this, be necessary for the problems referred to above, a kind of camera module that can reduce height is provided.
A kind of camera module, comprising:
Substrate, the back side that there is installed surface and arrange back on described installed surface, described substrate comprises the first pcb board, double-sided flex circuit plate and the second pcb board that are cascading, the upper surface of described first pcb board is installed surface, the lower surface of described second pcb board is the back side, described first pcb board offers the first through hole, the upper surface portion of described double-sided flex circuit plate is exposed, the upper surface that described double-sided flex circuit plate exposes is provided with multiple first weld pad;
Image sensing chip, is arranged in described first through hole, and the size of described image sensing chip is less than the diameter of described first through hole, and the upper surface of described image sensing chip is provided with the second weld pad; And
Many conductive lead wires, one end of each conductive lead wire is connected with one first weld pad, and the other end is connected with one second corresponding weld pad, is electrically connected with described substrate to realize described image sensing chip.
Wherein in an embodiment, be also provided with adhesive-layer, the lower surface of described image sensing chip fits in the upper surface place of exposing of described double-sided flex circuit plate by described adhesive-layer.
Wherein in an embodiment, the upper surface that described double-sided flex circuit plate exposes offers the second through hole, the diameter of described second through hole and the size of described image sensing chip adapt, and the lower surface of described image sensing chip fits in the upper surface of described second pcb board.
Wherein in an embodiment, be also provided with adhesive-layer, the lower surface of described image sensing chip is arranged at the upper surface of described second pcb board by described adhesive-layer.
Wherein in an embodiment, be also provided with SMT components and parts, described SMT components and parts are arranged at the installed surface of described substrate.
Wherein in an embodiment, also comprise connector, described connector is arranged at the surface of the elongated end of described double-sided flex circuit plate.
Wherein in an embodiment, be also provided with stiffening plate, described stiffening plate is arranged at the back side of the elongated end of described double-sided flex circuit plate and corresponding with described connector.
Wherein in an embodiment, described stiffening plate is metallic heat radiating plate.
Wherein in an embodiment, be also provided with the 3rd pcb board and the 4th pcb board, described 3rd pcb board and described 4th pcb board are arranged at surface and the back side of the elongated end of described double-sided flex circuit plate respectively, and described connector is arranged on described 3rd pcb board.
Wherein in an embodiment, also comprise support, filter and camera lens module, described Bracket setting is in described installed surface, described filter is carried on described support, described camera lens module is arranged on described support, described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
Above-mentioned camera module at least has the following advantages:
Substrate comprises the first pcb board, double-sided flex circuit plate and the second pcb board that are cascading, forms the circuit board of sandwich construction, ensures that wiring space is sufficient; The upper surface that double-sided flex circuit plate exposes is provided with multiple first weld pad, the upper surface of image sensing chip is provided with the second weld pad, one end of each conductive lead wire is connected with one first weld pad, and the other end is connected with one second corresponding weld pad, is electrically connected with substrate to realize image sensing chip; First pcb board offers the first through hole, image sensing chip is arranged in the first through hole, the height that total height after image sensing chip and substrate in batch can be made to install is less than image sensing chip itself and substrate itself with, effectively can reduce the height of camera module, day by day be tending towards frivolous, short and small growth requirement to meet.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the camera module in the first execution mode;
Fig. 2 is the cutaway view of the camera module in the second execution mode;
Fig. 3 is the cutaway view of the camera module in the 3rd execution mode;
Fig. 4 is the cutaway view of the camera module in the 4th execution mode.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar improvement without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public concrete enforcement.
Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in specification of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Referring to Fig. 1, is the cutaway view of the camera module 100 in the first execution mode.This camera module 100 comprises substrate 110, image sensing chip 120, many conductive lead wires 130, connector 140, support 150, filter 160 and camera lens modules 170.
The back side 110b that substrate 110 has installed surface 110a and arranges back on installed surface 110a.The upper surface that substrate 110 comprises the first pcb board 111, double-sided flex circuit plate 112 and the second pcb board 113, first pcb board 111 be cascading is installed surface 110a, and the lower surface of the second pcb board 113 is back side 110b.First pcb board 111 offers the first through hole 111a, the upper surface portion of double-sided flex circuit plate 112 is exposed, the upper surface that double-sided flex circuit plate 112 exposes is provided with multiple first weld pad 1121.Multiple first weld pad 1121 interval is arranged.First through hole 111a is square opening.
Image sensing chip 120 is arranged in the first through hole 111a, and the lower surface of image sensing chip 120 fits in the upper surface place of exposing of double-sided flex circuit plate 112.Particularly, can arrange adhesive-layer (not shown), the lower surface of image sensing chip 120 fits in the upper surface place of exposing of double-sided flex circuit plate 112 by adhesive-layer.The size of image sensing chip 120 is much smaller than the diameter of the first through hole 111a, and the upper surface of image sensing chip 120 is provided with multiple second weld pad 121.One second weld pad 121 is corresponding with one first weld pad 1121 to be arranged.Particularly, the upper surface of image sensing chip 120 has sensing area and the non-sensing area around sensing area setting, and the second weld pad 121 is arranged on non-sensing area.
One end of each conductive lead wire 130 is connected with one first weld pad 1121, and the other end is connected with one second corresponding weld pad 121, to realize the object that image sensing chip 120 is electrically connected with substrate 110.Particularly, conductive lead wire 130 can gold thread.Certainly, in other embodiments, conductive lead wire 130 can also be other metal conductive leads 130.Camera module 100 is also provided with SMT components and parts 180, SMT components and parts and is arranged on the installed surface 110a of substrate.
Connector 140 is arranged on substrate 110, and particularly, connector 140 is arranged at the surface of the elongated end 112a of double-sided flex circuit plate 112.Camera lens module 170 realizes the electric connection with exterior electrical components by connector 140.Camera module 100 is also provided with stiffening plate 190, stiffening plate 190 is arranged at the back side of the elongated end 112a of double-sided flex circuit plate 112 and corresponding with connector 140, and stiffening plate 190 is for supporting elongated end 112a and the connector 140 of double-sided flex circuit plate 112.Particularly, stiffening plate 190 can be metallic heat radiating plate, and such as stiffening plate 190 can be stainless steel substrates, thus optimizes heat dispersion, improves radiating efficiency, extends the useful life of product.
Support 150 is arranged at the installed surface 110a of substrate 110, and support 150 is mainly used in carrying filter 160 and camera lens module 170.Camera lens module 170 is arranged on support 150, and filter 160 is carried on support 150, and filter 160 is between camera lens module 170 and image sensing chip 120.Filter 160 is cutoff filter 160.Camera lens module 170 comprises camera lens support component 171 and camera lens 172, and camera lens 172 is assembled in camera lens support component 171.Camera lens support component 171 can be a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module 100 at least has the following advantages:
Substrate 110 comprises the first pcb board 111, double-sided flex circuit plate 112 and the second pcb board 113 that are cascading, forms the circuit board of sandwich construction, ensures that wiring space is sufficient; The upper surface that double-sided flex circuit plate 112 exposes is provided with multiple first weld pad 1121, the upper surface of image sensing chip 120 is provided with the second weld pad 121, one end of each conductive lead wire 130 is connected with one first weld pad 1121, the other end is connected with one second corresponding weld pad 121, is electrically connected with substrate 110 to realize image sensing chip 120; First pcb board 111 offers the first through hole 111a, image sensing chip 120 is arranged in the first through hole 111a, total height after image sensing chip 120 and substrate 110 can be made to assemble be less than image sensing chip 120 itself and substrate 110 itself height and, effectively can reduce the height of camera module 100, day by day be tending towards frivolous, short and small growth requirement to meet.
Referring to Fig. 2 and Fig. 3, is the camera module 200 in the second execution mode and the camera module 300 in the 3rd execution mode.Second and the 3rd in execution mode, camera module saves stiffening plate, and the 3rd pcb board 190a and the 4th pcb board 190b is set respectively on the surface of the elongated end 112a of double-sided flex circuit plate 112 and the back side, again connector 140 is arranged on the 3rd pcb board 190a, utilizes the rigidity speciality of pcb board to support double-sided flex circuit plate 112 and connector 140.
Referring to Fig. 3 and Fig. 4, is the camera module 300 in the 3rd execution mode and the camera module 400 in the 4th execution mode.In the third and fourth execution mode, the upper surface that double-sided flex circuit plate 112 exposes also offers the second through hole 112a.The diameter of the second through hole 112a and the size of image sensing chip 120 adapt.Such as, the diameter of the second through hole 112a can be equal with the size of image sensing chip 120.Certainly, in other embodiments, the second through hole 112a diameter can also or slightly larger than the size of image sensing chip 120.So the diameter of the second through hole 112a is less than the diameter of the first through hole 111a.
The lower surface of image sensing chip 120 fits in the upper surface of the second pcb board 113.Particularly, can arrange adhesive-layer, the lower surface of image sensing chip 120 is arranged at the upper surface of the second pcb board 113 by adhesive-layer, with the upper surface making image sensing chip 120 more firmly fit in the second pcb board 113.
In in the third embodiment with four execution mode, the second through hole 112a is offered by the upper surface exposed at double-sided flex circuit plate 112, make image sensing chip 120 through the second through hole 112a, the lower surface of image sensing chip 120 to be fitted in the upper surface of the second pcb board 113, the height after camera module 100 assembling can be reduced further.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprising:
Substrate, the back side that there is installed surface and arrange back on described installed surface, described substrate comprises the first pcb board, double-sided flex circuit plate and the second pcb board that are cascading, the upper surface of described first pcb board is installed surface, the lower surface of described second pcb board is the back side, described first pcb board offers the first through hole, the upper surface portion of described double-sided flex circuit plate is exposed, the upper surface that described double-sided flex circuit plate exposes is provided with multiple first weld pad;
Image sensing chip, is arranged in described first through hole, and the size of described image sensing chip is less than the diameter of described first through hole, and the upper surface of described image sensing chip is provided with the second weld pad; And
Many conductive lead wires, one end of each conductive lead wire is connected with one first weld pad, and the other end is connected with one second corresponding weld pad, is electrically connected with described substrate to realize described image sensing chip.
2. camera module according to claim 1, is characterized in that, be also provided with adhesive-layer, and the lower surface of described image sensing chip fits in the upper surface place of exposing of described double-sided flex circuit plate by described adhesive-layer.
3. camera module according to claim 1, it is characterized in that, the upper surface that described double-sided flex circuit plate exposes offers the second through hole, the diameter of described second through hole and the size of described image sensing chip adapt, and the lower surface of described image sensing chip fits in the upper surface of described second pcb board.
4. camera module according to claim 3, is characterized in that, be also provided with adhesive-layer, and the lower surface of described image sensing chip is arranged at the upper surface of described second pcb board by described adhesive-layer.
5. camera module according to claim 1, is characterized in that, is also provided with SMT components and parts, and described SMT components and parts are arranged at the installed surface of described substrate.
6. camera module according to claim 1, is characterized in that, also comprise connector, and described connector is arranged at the surface of the elongated end of described double-sided flex circuit plate.
7. camera module according to claim 6, is characterized in that, be also provided with stiffening plate, and described stiffening plate is arranged at the back side of the elongated end of described double-sided flex circuit plate and corresponding with described connector.
8. according to claim 7 or described camera module, it is characterized in that, described stiffening plate is metallic heat radiating plate.
9. camera module according to claim 6, it is characterized in that, also be provided with the 3rd pcb board and the 4th pcb board, described 3rd pcb board and described 4th pcb board are arranged at surface and the back side of the elongated end of described double-sided flex circuit plate respectively, and described connector is arranged on described 3rd pcb board.
10. camera module according to claim 1, it is characterized in that, also comprise support, filter and camera lens module, described Bracket setting is in described installed surface, described filter is carried on described support, described camera lens module is arranged on described support, and described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844836.5U CN204334749U (en) | 2014-12-25 | 2014-12-25 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844836.5U CN204334749U (en) | 2014-12-25 | 2014-12-25 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204334749U true CN204334749U (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420844836.5U Active CN204334749U (en) | 2014-12-25 | 2014-12-25 | Camera module |
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| CN (1) | CN204334749U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104580857A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN105915769A (en) * | 2016-03-30 | 2016-08-31 | 努比亚技术有限公司 | Pick-up head heat dissipation apparatus and mobile terminal |
| CN106328664A (en) * | 2016-10-12 | 2017-01-11 | 格科微电子（上海）有限公司 | Camera module manufacturing method and terminal handling equipment |
| CN106937032A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155043A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155041A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155025A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155024A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155021A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155023A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN108843896A (en) * | 2018-06-28 | 2018-11-20 | 信利光电股份有限公司 | A kind of spare bracket of dual camera mould group |
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2014
- 2014-12-25 CN CN201420844836.5U patent/CN204334749U/en active Active
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104580857A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106937033A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937031A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937032A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937034A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937058A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937035A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN106937030A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155043A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155041A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155025A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155024A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155021A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN107155023A (en) * | 2016-03-03 | 2017-09-12 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
| CN105915769A (en) * | 2016-03-30 | 2016-08-31 | 努比亚技术有限公司 | Pick-up head heat dissipation apparatus and mobile terminal |
| CN106328664A (en) * | 2016-10-12 | 2017-01-11 | 格科微电子（上海）有限公司 | Camera module manufacturing method and terminal handling equipment |
| CN108843896A (en) * | 2018-06-28 | 2018-11-20 | 信利光电股份有限公司 | A kind of spare bracket of dual camera mould group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210621 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right |