CN106328664A - Camera module manufacturing method and terminal handling equipment - Google Patents
Camera module manufacturing method and terminal handling equipment Download PDFInfo
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- CN106328664A CN106328664A CN201610889570.XA CN201610889570A CN106328664A CN 106328664 A CN106328664 A CN 106328664A CN 201610889570 A CN201610889570 A CN 201610889570A CN 106328664 A CN106328664 A CN 106328664A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims description 176
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- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 30
- 238000010438 heat treatment Methods 0.000 abstract description 6
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 21
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
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- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a camera module manufacturing method and terminal handling equipment. The camera module manufacturing method includes that a camera, a flexible printed circuit board, an assist processing chip and a connector are provided, and the assist processing chip and the connector are respectively located on the front side and the reverse side corresponding to the flexible printed circuit board; an image sensor chip of the camera transmits an original image signal to the assist processing chip, and the original image signal is transmitted to the terminal processing equipment after processed through the assist processing chip. An image signal processing chip receives a processed image, pressure of the image signal processing chip on image processing is alleviated, and image quality is improved; in addition, the assist processing chip is arranged in a stiffening plate, height increase of a camera module due to the assist processing chip is avoided, and performance of the image sensor chip is unaffected due to heating of the assist processing chip.
Description
Technical field
The present invention relates to photographic head module technical field, particularly relate to manufacture method and the terminal of a kind of photographic head module
Processing equipment.
Background technology
It is the skill that conventional a kind of photographic head processes that picture signal processes (Image Signal Process, ISP) technology
Art, is that the requirement according to human eye vision carries out post processing to the view data of output in imageing sensor.Along with photographic head picture
Element improves constantly, and the later stage is more and more higher to the requirement of image-capable.Low pixel image sensor carries ISP and processes single
Unit, and the output of high pixel image processing sensor commonly used Raw form adds the scheme of platform ISP.But be limited to photographic head module with
ISP chip transmission bandwidth, high-end image sensor also can built-in ISP image is carried out pretreatment and compression alleviate bandwidth problem
Pressure with platform ISP.
With reference to shown in Fig. 1, current high-end image sensor generally uses stacking-type to design, and stacking-type imageing sensor is
Image sensor chip 1 and chip 2 stacking being used for ISP process are arranged so that the chip processed for ISP is not take up shooting
Other spaces in head mould group, to reduce the area of whole photographic head module, for forming the photographic head module of high pixel.So
And, image sensor chip 1 is bonded with the chip 1 processed for ISP, is increased by the height causing whole photographic head module
Add, and affect the yield of photographic head module.Additionally, chip 2 power consumption for ISP process is relatively big, heating is serious, at shooting head mould
The picture signal of group introduces thermal noise.
Summary of the invention
It is an object of the invention to provide manufacture method and the terminal process equipment of a kind of photographic head module, solve existing
The chip processed for ISP in technology causes photographic head module height to increase, affects yield, produces the technical problem of thermal noise.
In order to solve above-mentioned technical problem, the present invention provides the manufacture method of a kind of photographic head module, including:
Thering is provided photographic head, flexible PCB, association to process chip and adapter, described association processes chip and described adapter position respectively
In the tow sides that described flexible PCB is corresponding；
The transmission of original image signal is processed chip, described original image signal to described association by the image sensor chip of described photographic head
Process after chip processes through described association and transmitted to terminal process equipment by described adapter again.
Optionally, the communication protocol defining described photographic head and described association process chip carries out the transmission of picture signal, institute
State photographic head and described association processes the number of pin transmitted for picture signal between chip and processes chip and institute less than described association
State the number of pin for picture signal transmission between adapter, reduce the complexity of flexible PCB wiring.
Optionally, the communication protocol defining described photographic head and described association process chip is transmitted in both directions agreement, saves use
In the serial line interface of control image sensor chip, reduce the complexity of flexible PCB wiring.
Optionally, described association processes has adhesive filler between chip and described flexible PCB, described association processes core
Sheet and described adhesive filler are for strengthening the intensity of described flexible PCB, to support the plug of described adapter.
Optionally, use surface mounting technology that described association is processed chip to bond with described flexible PCB, at described association
Solder bump and the described flexible PCB of reason chip are electrically connected, and described association process chip and described flexible PCB it
Between inject described adhesive filler.
Optionally, described flexible PCB also setting up a stiffening plate, described association processes chip compatibility and is arranged at described benefit
Strong intralaminar part, described stiffening plate is for strengthening the intensity of described flexible PCB, to support the plug of described adapter.
Optionally, compatibility arranges described association and processes the step of chip and is: provides and has the stiffening plate of hollow-out parts, at described association
Reason chip adhesive is arranged at the hollow-out parts of described stiffening plate, exposes association and processes the solder bump of chip；By described stiffening plate and
Being arranged on described flexible PCB of described association process chip one, and the solder bump of described association process chip is soft with described
Property circuit board electrical connection.
Optionally, compatibility arranges described association and processes the step of chip and is: provides and has the stiffening plate of hollow-out parts, by described benefit
Strong plate is bonded on described flexible PCB；Described association process chip is arranged in described hollow-out parts, and described association processes core
Sheet is electrically connected with described flexible PCB by solder bump.
Optionally, compatibility arranges described association and processes the step of chip and is: providing and have the stiffening plate of recess, described association processes
Chip adhesive is arranged at the recess of described stiffening plate, exposes described association and processes the solder bump of chip；By described stiffening plate with
Being arranged on described flexible PCB of described association process chip one, and the solder bump of described association process chip is soft with described
Property circuit board electrical connection.
Accordingly, the present invention also provides for a kind of terminal process equipment, including: mainboard and the upper described implementation method of employing
The photographic head module formed, wherein, described mainboard is electrically connected with described adapter, and described mainboard is received by described adapter
Described association processes the original image signal after chip processes.
Relative to prior art, the manufacture method of photographic head module of the present invention and terminal process equipment have following useful
Effect:
The photographic head module of the present invention includes that association processes chip, and association processes chip and is separately positioned on flexible PCB pair with adapter
The tow sides answered, association processes the original image signal that chip receives the image sensor chip output of photographic head, and by original image
Signal carries out ISP process, then the original image signal after being processed by adapter is transferred to image signal processing chip, thus image
Signal processing chip receives the image after processing, and alleviates image signal processing chip and carries out the pressure of image procossing, carries
High image quality.
It is arranged in stiffening plate additionally, association is processed chip by the present invention, it is to avoid owing to association processes the photographic head that chip causes
Module height increases, and also will not affect the performance of image sensor chip because of the heating of association's process chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of stacking-type imageing sensor in prior art；
Fig. 2 is the structural representation of photographic head module in one embodiment of the invention；
Fig. 3 is the structural representation of stiffening plate in one embodiment of the invention；
Fig. 4 is that in one embodiment of the invention, stiffening plate processes chip adhesive structural representation on auxiliary device with association；
Fig. 5 is the structural representation that in one embodiment of the invention, flexible PCB bonding association processes chip；
Fig. 6 is the structural representation of flexible PCB bonding reinforcement plate in another embodiment of the present invention；
Fig. 7 is the structural representation that in another embodiment of the present invention, flexible PCB bonding association processes chip；
Fig. 8 is the structural representation that in further embodiment of this invention, stiffening plate bonding association processes chip；
Fig. 9 is the structural representation that in further embodiment of this invention, flexible PCB bonding association processes chip；
Figure 10 is signal transmission schematic diagram in one embodiment of the invention；
Figure 11 is schematic wiring diagram in one embodiment of the invention.
Detailed description of the invention
Elaborate a lot of detail in the following description so that fully understanding the present invention.But the present invention can be with
Much being different from alternate manner described here to implement, those skilled in the art can be in the situation without prejudice to intension of the present invention
Under do similar popularization, therefore the present invention is not limited by following public being embodied as.
Secondly, the present invention utilizes schematic diagram to be described in detail, when describing the embodiment of the present invention in detail, for purposes of illustration only, institute
Stating schematic diagram is example, and it should not limit the scope of protection of the invention at this.
In order to solve the problem in background technology, the present invention provides manufacture method and the end of a kind of photographic head module
Reason equipment, photographic head module includes that association processes chip, and it is corresponding that association's process chip is separately positioned on flexible PCB with adapter
Tow sides, association processes the original image signal that chip receives the image sensor chip output of photographic head, and by original image signal
Carry out ISP process, then the picture signal that the original image signal after being processed by adapter is transferred in terminal process equipment processes
Chip, thus image signal processing chip receives the image after processing, and alleviates image signal processing chip and carries out image
The pressure processed, improves picture quality.It is arranged in stiffening plate additionally, association is processed chip by the present invention, it is to avoid owing to association processes
The photographic head module height that chip causes increases, and also will not affect the property of image sensor chip because of the heating of association's process chip
Energy.
Understandable, below in conjunction with accompanying drawing to the present invention for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from
The manufacture method of photographic head module be described in detail.
With reference to shown in Fig. 2, the photographic head module of the present invention includes that photographic head 10, flexible PCB (FPC) 20, association process core
Sheet (ISP Bridge) 40 and adapter (Connectors) 30.Wherein, described association processes chip 40 and described adapter 30 points
It is not positioned at the tow sides of described flexible PCB 20 correspondence.Described photographic head 10 includes that image sensor chip (does not shows in Fig. 2
Go out) and with the plain conductor of image sensor chip electrical connection, imageing sensor is electrically picked out by plain conductor, and with soft
Property circuit board connect.The transmission of original image signal is processed chip 40, described original image signal to described association by image sensor chip
Processing chip 40 through described association to process, wherein, described association processes chip 40 and described original image signal is carried out ISP process, including
HDR renders (HDR), phase-detection auto-focusing (PDAF), denoising (De-noise), AWB, data pressure
Contracting, auto-exposure control, removal bad point, hue adjustment etc..Afterwards, the original image signal after process is passed by described adapter 30 again
Transport to the image signal processing chip (not shown) being positioned in terminal process equipment primary processor, image signal processing chip
The picture signal received is further processed.
Additionally, the flexible material of flexible PCB 20, its mechanical strength is relatively low, heretofore described association process chip 40 with
Having adhesive filler between described flexible PCB 20, adhesive filler is capable of association and processes chip 40 and flexible PCB
Bonding between 20, association processes chip 40 and adhesive filler and can strengthen the mechanical strength of described flexible PCB 20 simultaneously,
In order to support the plug of described adapter 30.In the present embodiment, surface mounting technology (SMT) is used association to process chip 40 with soft
Property circuit board 20 engage, association processes the metal routing electrical connection in solder bump and the flexible PCB of chip, simultaneously
Process in association and inject adhesive filler between chip and flexible PCB, such as epoxy resin etc..Certainly, the present invention is not limited to
Use surface mounting technology that association processes chip 40 to bond with flexible PCB 20, it is also possible to use the form of laser welding, this
Invent and this is not limited.
With continued reference to shown in Fig. 2, in order to increase the mechanical strength of flexible PCB further, on described flexible PCB 20
Also setting up a stiffening plate 50, described association processes chip 40 compatibility and is arranged at the inside of described stiffening plate 50, and described association processes core
Sheet 40 is electrically connected with flexible PCB 20 by solder bump.Described stiffening plate is used for protecting described association to process chip, and uses
In the mechanical strength of the described flexible PCB of enhancing, to support the plug of described adapter.Wherein, compatibility arranges the process of described association
The step of chip 40 is:
First, with reference to shown in Fig. 3, it is provided that stiffening plate 50, described stiffening plate 50 has hollow-out parts 51, in the present embodiment, uses erosion
The modes such as quarter or machinery jet-bedding form hollow-out parts 51 in stiffening plate 50.Wherein, the thickness of stiffening plate 50 is 80 μm ~ 200 μm, example
As, 80 μm, 100 μm, 150 μm, 200 μm etc., the hollow-out parts 51 cut out is 1mm2~50mm2, according to this, association processes chip
The setting that size is carried out.
Then, with reference to shown in Fig. 4, described association is processed chip 40 bonding and is arranged at the hollow-out parts 51 of described stiffening plate 50
In, and expose association process chip 40 solder bump 41, wherein, association process chip 40 height be 8050 μm ~ 200 μm,
Such as 100 μm, the thickness of solder bump 41 is 50 μm ~ 1500 μm, such as 150 μm, and described association is processed chip 40 and stiffening plate
Bonded by adhesive filler 70 between 50.Concrete, with reference to shown in Fig. 4, it is provided that an auxiliary device 60, the table of auxiliary device 60
Mask toughness, and can be peeled off by methods such as heat treatments.First described stiffening plate 50 is bonded on described auxiliary device 60,
Again described association process chip 40 is arranged in hollow-out parts 51, and is bonded on auxiliary device 60, inject viscous in hollow-out parts 51
Property implant 70 so that described stiffening plate 50 and described association process chip 40 and are bonded as one, then peel off described auxiliary device 60.
The association of the present embodiment processes the total height height higher than stiffening plate 50 of chip 40 and solder bump 41, it is simple to solder bump 41 with
Flexible PCB 20 is electrically connected.
In the present embodiment, described auxiliary device 60 is ultraviolet tape (UV tape), by treatment with ultraviolet light thus peel off
Described auxiliary film 60, ultraviolet light makes the viscosity of ultraviolet light adhesive tape reduce, so that ultraviolet light adhesive tape falls off.Certainly,
In other embodiments of the present invention, the auxiliary device of the present invention is not limited to as ultraviolet tape, and described auxiliary device 60 also may be used
Think that blue film (Blue tape), described stiffening plate 50 and described association process chip 40 and be bonded as after one mechanically
Peel off described auxiliary film 60.In the present invention, as long as can be used in bonding reinforcement plate and association's process chip, and can therefrom peel off all
Within the thought range of present invention protection, such as, polyimides organic polymer etc., or use the modes such as laser ablation to shell
From.
Again, with reference to shown in Fig. 5, what described stiffening plate 50 and described association processed chip 40 one is bonded in described flexibility
Circuit board 20, is connected with flexible PCB as used the mode of SMT that association is processed chip, and described association processes the solder of chip 40
Salient point 41 is electrically connected with described flexible PCB 20, processes in described association and injects between chip 40 and described flexible PCB 20
Adhesive filler 70, strengthens described association and processes the bonding between chip 40 and described flexible PCB 20.In the present embodiment, reinforcement
Plate 50 can increase the mechanical strength of flexible PCB 20, to support the plug of adapter.
In another embodiment of the invention, with reference to shown in Fig. 6, compatibility arranges the step of described association process chip 40 and also may be used
Thinking: provide and have stiffening plate 50 ', stiffening plate 50 ' has hollow-out parts 51 ', uses encapsulation glue or hot pressing by described reinforcement
Plate 50 ' bonding is with on described flexible PCB 20, and wherein, the thickness of stiffening plate 50 ' is 200 μm；Then, with reference to shown in Fig. 7, will
Described association processes chip 40 bonding and is arranged in described hollow-out parts 51 ', such as, uses the mode of laser welding that association is processed chip
It is connected with flexible PCB, and described association is processed chip 40 and is electrically connected with described flexible PCB 20 by solder bump 41,
Further, injecting adhesive filler 70 in hollow-out parts 51 ' makes association process chip 40 and stiffening plate 50 ' bonding, to fix association
Process chip 40.
Additionally, in another embodiment of the present invention, compatibility arranges the step of described association process chip 40 and can also be: first
First, with reference to shown in Fig. 8, it is provided that stiffening plate 50 ", described stiffening plate 50 " there is recess 52, in the present embodiment, described stiffening plate 50 "
Thickness be 80 μm ~ 200 μm, such as, 80 μm.Use the mode of mechanical stamping at described stiffening plate 50 " the described recess of upper formation
52.Afterwards, described association processes chip 40 and is arranged at described stiffening plate 50 by packaging plastic 70 ' bonding " recess 52, and expose
Described association processes the solder bump 41 of chip 40, and the thickness of described packaging plastic 70 ' is 10 μm ~ 20 μm, such as, 10 μm, described weldering
The height of material salient point 41 is 80 μm ~ 150 μm, such as, 80 μm.Again, with reference to shown in Fig. 9, by described stiffening plate 50 " and described association
The bonding processing chip 40 one is arranged at described flexible PCB 20, as used the mode of SMT that association is processed chip with flexible
Circuit board connects, and described solder bump 41 is electrically connected with described flexible PCB 20.Afterwards, chip 40 is processed in described association
And inject adhesive filler 70 between described flexible PCB 20, to strengthen described association process chip 40 and described flexible PCB
Bonding between 20.
With reference to shown in Figure 10, described image sensor chip includes pel array 11 and is positioned at described pel array 11 weeks
The reading circuit module 12 enclosed, described pel array 11 is used for converting optical signals into the signal of telecommunication, and forms original image signal, institute
State reading circuit module 12 power supply signal in described image sensor chip, control signal and original image signal to be exported.Its
In, described original image signal is transferred to institute by the metal line in described flexible PCB 20 by described reading circuit module 12
State association process chip 40, described association process chip 40 described original image signal is processed, and will process after original image letter
Number it is transferred to described adapter 30.Further, described reading circuit module 12 is by the metal line in described flexible PCB 20
Described power supply signal and described control signal are transmitted directly to described adapter 20.
In order to reduce the complexity of metal line in flexible PCB 20, define described photographic head 10 and process core with described association
The communication protocol of sheet 40 carries out the transmission of picture signal so that photographic head 10 described in flexible PCB 20 processes core with described association
Between sheet 40, the number of pin for picture signal transmission is used for less than between described association process chip 40 and described adapter 30
The number of pin of picture signal transmission.Such as, with reference to shown in Figure 11, described image sensor chip is based on CPHY high-speed communication
Described original image signal is transferred to described association and processes chip 40 by agreement, sets between image sensor chip and association's process chip 40
Putting two groups of pins, often 3 cablings of group, arrange 6 cablings altogether, and its transfer rate is 3Gbps ~ 8Gbps.Association processes chip 40 and connects
Connecing the transmission being carried out picture signal between device 30 by MIPI agreement, association processes and arranges four lines between chip 40 and adapter 30
MIPI, including 4 pairs of data wires and a pair clock line, totally 10 cablings.Meanwhile, association processes also needs between chip 40 and adapter 30
2 I2C cablings are set, for the transmission of control signal, thus assist and arrange 12 altogether and walk between process chip 40 and adapter 30
Line.
Additionally, the communication protocol that described photographic head 10 and described association process chip 40 is transmitted in both directions agreement, save for
Controlling the serial line interface of image sensor chip, and up-high speed, descending low speed, i.e. photographic head 10 process chip 40 to association and transmit
The speed of picture signal uses high-speed transfer, and association processes the speed of the signal that chip 40 transmits to photographic head 10 and uses low speed to pass
Defeated, reduce the power consumption of whole photographic head module.
It should be noted that due to association process distance between chip and photographic head more than association process chip and adapter it
Between distance, therefore, the present invention processes the difficulty of metal line between chip and photographic head to reduce association in flexible PCB
Degree so that described photographic head and described association process the number of pin transmitted for picture signal between chip and process less than described association
For the number of pin of picture signal transmission between chip 40 and described adapter 30, and eliminate described photographic head with described
Association processes between chip for controlling the serial line interface of image sensor chip.
Accordingly, the present invention also provides for a kind of terminal process equipment, including: mainboard and use above-mentioned implementation method shape
The photographic head module become, wherein, described mainboard is electrically connected with described adapter, and described mainboard receives institute by described adapter
Stating association and process the original image signal after chip processes, the image signal processing chip on mainboard receives the figure after processing
Picture, alleviates image signal processing chip and carries out the pressure of image procossing, improve picture quality.
In sum, the present invention provides manufacture method and the terminal process equipment of a kind of photographic head module, images head mould
Group includes that association processes chip, and association processes chip and is separately positioned on the tow sides that flexible PCB is corresponding with adapter, and association processes
Chip receives the original image signal of the image sensor chip output of photographic head, and original image signal carries out ISP process, then by
Original image signal after adapter will process is transferred to image signal processing chip, thus image signal processing chip receives and passes through
Image after process, alleviates image signal processing chip and carries out the pressure of image procossing, improve picture quality.Additionally, this
The bright chip that association processed is arranged in stiffening plate, it is to avoid owing to association processes the photographic head module height increase that chip causes, the most not
The performance of image sensor chip can be affected because of the heating of association's process chip.
Although the present invention is open as above with preferred embodiment, but it is not for limiting the present invention, any this area
Technical staff without departing from the spirit and scope of the present invention, may be by the method for the disclosure above and technology contents to this
Bright technical scheme makes possible variation and amendment, therefore, every content without departing from technical solution of the present invention, according to the present invention
Technical spirit any simple modification, equivalent variations and modification that above example is made, belong to technical solution of the present invention
Protection domain.
Claims (10)
1. the manufacture method of a photographic head module, it is characterised in that including:
Thering is provided photographic head, flexible PCB, association to process chip and adapter, described association processes chip and described adapter position respectively
In the tow sides that described flexible PCB is corresponding；
The transmission of original image signal is processed chip, described original image signal to described association by the image sensor chip of described photographic head
Process after chip processes through described association and transmitted to terminal process equipment by described adapter again.
The manufacture method of photographic head module the most according to claim 1, it is characterised in that define described photographic head with described
The communication protocol of association's process chip carries out the transmission of picture signal, and described photographic head and described association process between chip for image
The number of pin of signal transmission processes the number of pins transmitted between chip and described adapter for picture signal less than described association
Amount, reduces the complexity of flexible PCB wiring.
The manufacture method of photographic head module the most according to claim 2, it is characterised in that define described photographic head with described
It is transmitted in both directions agreement that association processes the communication protocol of chip, saves the serial line interface for controlling image sensor chip, reduces
The complexity of flexible PCB wiring.
The manufacture method of photographic head module the most according to claim 2, it is characterised in that described association processes chip with described
Having adhesive filler between flexible PCB, described association processes chip and is used for strengthening described flexible electrical with described adhesive filler
The intensity of road plate, to support the plug of described adapter.
5. according to the manufacture method of the photographic head module described in claim 4, it is characterised in that employing surface mounting technology will
Described association processes chip and bonds with described flexible PCB, and described association processes solder bump and the described flexible PCB electricity of chip
Gas connects, and injects described adhesive filler between described association process chip and described flexible PCB.
The manufacture method of photographic head module the most according to claim 1, it is characterised in that also set on described flexible PCB
Putting a stiffening plate, described association processes chip compatibility and is arranged at inside described stiffening plate, and described stiffening plate is used for strengthening described flexibility
The intensity of circuit board, to support the plug of described adapter.
The manufacture method of photographic head module the most according to claim 6, it is characterised in that compatibility arranges described association and processes core
The step of sheet is: provide the stiffening plate with hollow-out parts, and described association processes chip adhesive and is arranged at the hollow-out parts of described stiffening plate,
Expose association and process the solder bump of chip；What described stiffening plate and described association processed chip one is arranged at described flexible electrical
On the plate of road, and described association processes solder bump and the electrical connection of described flexible PCB of chip.
The manufacture method of photographic head module the most according to claim 6, it is characterised in that compatibility arranges described association and processes core
The step of sheet is: provides the stiffening plate with hollow-out parts, is bonded on described flexible PCB by described stiffening plate；By described association
Process chip to be arranged in described hollow-out parts, and described association is processed chip and electrically connected with described flexible PCB by solder bump
Connect.
The manufacture method of photographic head module the most according to claim 6, it is characterised in that compatibility arranges described association and processes core
The step of sheet is: provide the stiffening plate with recess, and described association processes chip adhesive and is arranged at the recess of described stiffening plate, exposes
Go out described association and process the solder bump of chip；What described stiffening plate and described association processed chip one is arranged at described flexible electrical
On the plate of road, and described association processes solder bump and the electrical connection of described flexible PCB of chip.
10. a terminal process equipment, it is characterised in that including: mainboard and employing are such as any one institute in claim 1 ~ 9
The photographic head module that the implementation method stated is formed, wherein, described mainboard is electrically connected with described adapter, and described mainboard passes through institute
State adapter and receive the original image signal after described association processes chip process.
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| CN201610889570.XA CN106328664B (en) | 2016-10-12 | 2016-10-12 | Manufacturing method of camera module and terminal processing equipment |
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| CN201610889570.XA CN106328664B (en) | 2016-10-12 | 2016-10-12 | Manufacturing method of camera module and terminal processing equipment |
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