CN112558243B - Signal transmission optical module - Google Patents
Signal transmission optical module Download PDFInfo
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- CN112558243B CN112558243B CN202011548169.2A CN202011548169A CN112558243B CN 112558243 B CN112558243 B CN 112558243B CN 202011548169 A CN202011548169 A CN 202011548169A CN 112558243 B CN112558243 B CN 112558243B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 86
- 230000008054 signal transmission Effects 0.000 title claims abstract description 34
- 239000013307 optical fiber Substances 0.000 claims abstract description 68
- 230000005540 biological transmission Effects 0.000 claims abstract description 49
- 238000006243 chemical reaction Methods 0.000 claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 3
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
Abstract
A signal transmission optical module comprises a PCB and a first lens module, wherein the first lens module is arranged in a structural frame, a transmission line is arranged inside the structural frame and is connected with a chip set, a pin set is arranged on the PCB and is connected with the transmission line, optical signal transmission is realized between an optical fiber set and a photoelectric conversion chip through the lens module, and partial thickness of the first lens module is embedded into a through groove of the PCB so that the whole thickness of the optical module is reduced. The whole thickness of the optical module is equal to the sum of the thicknesses of the structural frame, the PCB and the optical fiber carrier, an electric signal transmitted from an interface on the PCB is transmitted to the driving chip through the transmission line, the photoelectric conversion chip realizes photoelectric conversion, an optical signal sequentially passes through the first lens module and the second lens module, the transmission optical path is short, the signal can realize low-loss transmission, and the upper surface or the lower surface of the structure can be directly or through the contact of heat-conducting glue and the shell, so that the high-efficiency heat dissipation is facilitated.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a signal transmission optical module.
Background
An optical transceiver module, called optical module or optical fiber module for short, is an important part in an optical fiber communication system, and is composed of an optoelectronic device, a functional circuit, an optical interface and the like, wherein the optoelectronic device comprises a transmitting part and a receiving part, the transmitting end of the optical module converts an electrical signal into an optical signal, and the receiving end converts the optical signal into the electrical signal. The packaging mode and the signal transmission method of the optical module determine the size and the signal quality of the whole optical module, and in some application scenes, particularly in the fields of consumer products such as notebook computers, mobile phones, televisions and the like, the thickness requirement of a designer on the product per se is extremely strict, which means that the requirement on the thickness of the optical module used by the product is very high. However, the packaging thickness of the existing optical module does not meet the market demand of ultrathin products, and the invention is provided based on the market demand.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an optical module capable of realizing high-quality signal transmission.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
a signal transmission optical module comprises a PCB board used for transmitting signals to a standard interface, wherein the interface on the PCB board is an external electrical interface and comprises standard interfaces such as HDMI, TypeC and SFP28, the signal transmission optical module also comprises a first lens module used for collimating and focusing light, the first lens module is arranged in a structural frame, a transmission line is arranged in the structural frame and can be realized through a laser direct forming technology, the transmission line is connected with a chip set and is used for transmitting the signals between the chip set and the PCB board, a substrate is arranged in the structural frame and is used for bearing the chip set, the chip set is fixed on the substrate, a pin set is arranged on the PCB board and is connected with the transmission line so that the chip set is in signal connection with the PCB board through the transmission line, and a through groove is arranged on the PCB board, the first lens module couples the emitted light into the optical fiber group through the through groove, or transmits the light received by the optical fiber group into the chip group through the first lens module, the optical fiber group is arranged in the optical fiber carrier, the optical fiber carrier realizes the fixation and positioning of the optical fibers in the optical fiber group, the optical fiber group is an external optical interface, can be a multimode optical fiber or a single mode optical fiber, and the transmission optical path of the whole structure is short, the signal loss is small, and the high-quality signal transmission can be realized;
the optical module comprises a bottom surface and a top surface, the bottom surface of the optical module comprises a partial bottom surface of the PCB and an optical fiber carrier, the top surface of the optical module comprises a top surface of the substrate and the PCB, and the bottom surface of the optical module and the top surface of the optical module are both used for heat dissipation through a connecting shell.
Preferably, the structure frame is hollow structure, and it is inside including first step, second step and third step are located same one side of structure frame, just third step and first step are located the different sides of structure frame, the base plate inlays on the first step, the initiating terminal of transmission line is located on the side of the second step that structure frame set up, the end is located on structure frame to external contact surface.
Preferably, the chipset includes a driving chip for controlling signal transmission and a photoelectric conversion chip for converting an optical signal and an electrical signal into each other, the driving chip and the photoelectric conversion chip are connected to each other so as to transmit the signals, and the driving chip and the photoelectric conversion chip can be connected by a gold wire bonding technology.
Preferably, first lens module inlays on the third step of structural frame, structural both match, realize the protection and the sealing of chipset and gold wire, just be equipped with lens district on the lens module, lens district includes array lens, array lens position with photoelectric conversion chip one-to-one to the light that collimation photoelectric conversion chip sent or the collimated light that the focus came from optic fibre to photoelectric conversion chip, the transmission line with pin group one-to-one, lens district embedding through the inslot, solved the thickness problem that traditional lens district exists, make lens district and the same thickness space of PCB board sharing, accomplished the optimization in the thickness of optical module.
Preferably, a first lens is integrated on the first lens module, a second lens is integrated on the optical fiber carrier, light emitted by the photoelectric conversion chip is collimated by the first lens and focused into an optical fiber group by the second lens, and light received by the optical fiber group is collimated by the second lens and focused into the photoelectric conversion chip by the first lens.
Preferably, the signal transmission optical module further comprises a second lens module, a positioning hole is formed in the lens area, the second lens module is assembled with the first lens module through the positioning hole, the first lens module is integrated with a first lens, a 90-degree corner block and a second lens are integrated on the second lens module, the 90-degree corner block is a right-angle triangular prism, the planes of the first lens and the second lens are respectively parallel to two right-angle surfaces of the 90-degree corner block, so that light collimated by the first lens enters the second lens after turning 90 degrees through the 90-degree corner block, light emitted by the photoelectric conversion chip is collimated by the first lens, is turned 90 degrees through the 90-degree corner block, is focused into the optical fiber group through the second lens for transmission, and light received by the optical fiber group is collimated by the second lens, and 90-degree steering is carried out through a 90-degree corner block, and the light is focused and projected onto the photoelectric conversion chip through the first lens.
Preferably, the signal transmission optical module further comprises a second lens module, a positioning hole is formed in the lens area, the second lens module is assembled with the first lens module through the positioning hole, the first lens module is integrated with a first lens, a 90-degree corner block is integrated on the second lens module, a second lens is integrated on the optical fiber carrier, the 90-degree corner block is a right-angle triangular prism, the planes of the first lens and the second lens are respectively parallel to two right-angle surfaces of the 90-degree corner block, so that light collimated by the first lens enters the second lens after turning 90 degrees through the 90-degree corner block, light emitted by the photoelectric conversion chip is collimated by the first lens, is turned 90 degrees through the 90-degree corner block, and is focused into the optical fiber group through the second lens for transmission, the light received by the optical fiber group is collimated by the second lens, is turned by 90 degrees through the 90-degree turning block, and is focused and projected onto the photoelectric conversion chip through the first lens.
Preferably, a signal transmission optical module still includes the second lens module, be provided with the locating hole on the lens district, the second lens module pass through the locating hole with the first lens module assembles, the last first lens that has integrated of first lens module, the last second lens that has integrated of second lens module, the light that the photoelectric conversion chip sent passes through the first lens is carried out the collimation, and passes through the second lens focuses on the optical fiber group, the optical fiber group received light through the collimation of second lens, and pass through the first lens is focused on the photoelectric conversion chip.
Preferably, the chip set is attached to the substrate by a chip-on-board process, and the transmission line is connected to the chip set by a gold wire bonding process.
Preferably, the structural frame is soldered to the PCB board by SMT patches.
The invention has the advantages and positive effects that:
the overall thickness of the optical module is equal to the sum of the thicknesses of the structural framework, the PCB and the optical fiber carrier, the first lens module and the second lens module hardly occupy thickness space, and the overall thickness reaches several millimeters, so that the thickness of the optical module is effectively reduced, the ultra-thin optical module is packaged, and an application scene with requirements on the thickness can be met. The signal of telecommunication of interface transmission on the follow PCB board passes through transmission line transmission to driver chip, driver chip control photoelectric conversion chip realizes photoelectric conversion, the transmission light passes through first lens module and second lens module in proper order, with optical coupling to the optical fiber group in, accomplish signal transmission, the loss of signal has greatly been reduced, and because the optical path transmission of entire structure is short, signal loss is little, can realize high-quality signal transmission, structural upper surface or lower surface all can be directly or through heat-conducting glue and shell contact, and structural symmetry, be favorable to the high efficiency heat dissipation.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of the structure of the various parts of the present invention;
FIG. 3 is a schematic view of a combination structure of the first lens module and the PCB of the present invention;
FIG. 4 is a schematic structural diagram of a first lens module according to the present invention;
FIG. 5 is a schematic diagram of a substrate, a frame and a chipset according to the present invention;
FIG. 6 is a schematic structural view of one side of the structural frame of the present invention;
FIG. 7 is a schematic structural view of another side of the structural frame of the present invention;
FIG. 8 is a schematic diagram of the light path of the first lens and the second lens of the present invention in the first embodiment;
fig. 9 is a schematic diagram of the light path of the first lens and the second lens in the second embodiment of the present invention.
In the figure:
1. a substrate; 6. a second lens module; 7. an optical fiber carrier; 8. a group of optical fibers; 9. a first lens; 10. a second lens; 11. a 90 degree corner block;
2. a structural frame; 21. a first step; 22. a second step; 23. a third step; 24. a transmission line;
3. a chipset; 31. a driving chip; 32. a photoelectric conversion chip;
4. a first lens module; 41. a lens region; 42. positioning holes;
5. a PCB board; 51. a lead group; 52. a through groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The embodiments of the invention will be described in further detail below with reference to the accompanying drawings:
as shown in fig. 1 and fig. 2, the signal transmission optical module according to the present invention includes a PCB 5 for transmitting signals to a standard interface, and further includes a first lens module 4 for collimating and focusing light, the first lens module 4 is disposed in a structural frame 2, the structural frame 2 is soldered on the PCB 5 by SMT, a transmission line 24 is disposed inside the structural frame 2, the transmission line 24 is connected with a chipset 3 by gold wire bonding, a substrate 1 is disposed in the structural frame 2, the chipset 3 is attached to the substrate 1 by a mounting process, a lead group 51 is disposed on the PCB 5, the lead group 51 is attached to the transmission line 24, so that the chipset 3 is connected with the PCB 5 by the transmission line 24, an interface on the PCB 5 is an external electrical interface, and includes standard interfaces such as HDMI, TypeC, SFP28, and the like, a through slot 52 is disposed on the PCB 5, the first lens module 4 couples light into an optical fiber group 8 by the through slot 52, or the light emitted from the optical fiber group 8 is transmitted to the chip group 3 through the first lens module 4, the optical path is reversible and can be transmitted in two directions at the same time, that is, the optical fiber receiving optical signal is transmitted to the chip set 3 through the first lens module 4 or the optical fiber transmitting optical signal from the chip set 3 is transmitted to the optical fiber set 8 through the first lens module 4, the optical fiber group 8 is arranged in the optical fiber carrier 7, the optical fiber carrier 7 realizes the fixation and positioning of the optical fibers in the optical fiber group 8, the structural frame 2 integrated with the first lens module 4 and the substrate 1 is connected with the PCB 5 only through the transmission line 24 to complete the transmission of signals, the through groove 52 plays a role of accommodating the partial thickness of the first lens module 4, the optical fiber group 8 is an external optical interface, the optical fiber can be a multimode optical fiber or a single mode optical fiber, and the optical path transmission of the whole structure is short, so that the signal loss is small, and high-quality signal transmission can be realized.
As shown in fig. 6 and 7, the structural frame 2 is a hollow structure, and includes a first step 21, a second step 22 and a third step 23 inside thereof, the second step 22 and the third step 23 are located on the same side of the structural frame 2, and the third step 23 and the first step 21 are located on different sides of the structural frame 2, the substrate 1 is embedded on the first step 21, so that the chipset 3 is located inside the structural frame 2, the start end of the transmission line 24 is located on the side of the second step 22 disposed on the structural frame 2, and the end is located on the external contact surface of the structural frame 2, so as to ensure that the transmission line 24 on the external contact surface is connected with the pin group 51 when the first lens module 4 is embedded in the structural frame 2.
As shown in fig. 5, the chip set 3 includes a driving chip 31 for controlling signal transmission and a photoelectric conversion chip 32 for converting an optical signal and an electric signal into each other, and the driving chip 31 and the photoelectric conversion chip 32 are connected by a gold wire bonding technique. As shown in fig. 3, 4 and 6, the first lens module 4 is embedded on the third step 23 of the structural frame 2, and the lens module 4 is provided with a lens area 41, the lens area 41 includes an array lens, the array lens is in one-to-one correspondence with the photoelectric conversion chips 32, so as to collimate light emitted by the photoelectric conversion chips 32 or focus collimated light from an optical fiber to the photoelectric conversion chips 32, after the transmission lines 24 are connected with the pin groups 51 one-to-one, the lens area 41 can be embedded in the through grooves 52, thereby solving the problem that the conventional lens area has thickness, so that the lens area 41 and the PCB 5 share the same thickness space, and optimizing the thickness of the optical module.
First embodiment
As shown in fig. 9, a first lens 9 is integrated on the first lens module 4, a second lens 10 is integrated on the optical fiber carrier 7, light emitted by the photoelectric conversion chip 32 is collimated by the first lens 9 and focused into the optical fiber group 8 by the second lens 10, light received by the optical fiber group 8 is collimated by the second lens 10 and focused onto the photoelectric conversion chip 32 by the first lens 9, and at this time, the optical fiber carrier 7 is perpendicular to the PCB 5.
Second embodiment
As shown in fig. 8, the optical module further includes a second lens module 6, a positioning hole 42 is disposed on the lens area 41, the second lens module 6 is assembled with the first lens module 4 through the positioning hole 42, the first lens module 4 is integrated with a first lens 9, the second lens module 6 is integrated with a 90-degree corner block 11 and a second lens 10, the 90-degree corner block 11 is a right-angled triangular prism, and the planes of the first lens 9 and the second lens 10 are respectively parallel to two right-angled surfaces of the 90-degree corner block 11, so that light collimated by the first lens 9 enters the second lens 10 after being turned 90 degrees through the 90-degree corner block 11, light emitted by the photoelectric conversion chip 32 is collimated by the first lens 9 and then turned 90 degrees through the 90-degree corner block 11, is focused into the optical fiber group 8 through the second lens 10 for transmission, light received by the optical fiber group 8 is collimated by the second lens 10, and after 90-degree steering is carried out by the 90-degree steering block 11, the light is focused by the first lens 9 and then is sent to the photoelectric conversion chip 32, so that bidirectional transmission of the light path is realized.
Third embodiment
As shown in fig. 8, the optical module further includes a second lens module 6, a positioning hole 42 is disposed on the lens area 41, the second lens module 6 is assembled with the first lens module 4 through the positioning hole 42, the first lens 9 is integrated on the first lens module 4, a 90-degree corner block 11 is integrated on the second lens module 6, a second lens 10 is integrated on the optical fiber carrier 7, the 90-degree corner block 11 is a right-angled triangular prism, and the planes of the first lens 9 and the second lens 10 are respectively parallel to two right-angled surfaces of the 90-degree corner block 11, so that light collimated by the first lens 9 is turned 90 degrees through the 90-degree corner block 11 and enters the second lens 10, which is compared with the second embodiment, only the second lens 10 is separated from the second lens module 6, and the transmission principles of optical paths are consistent.
Fourth embodiment
As shown in fig. 9, the optical module further includes a second lens module 6, a positioning hole 42 is disposed on the lens area 41, the second lens module 6 is assembled with the first lens module 4 through the positioning hole 42, the first lens 9 is integrated on the first lens module 4, and the second lens 10 is integrated on the second lens module 6, compared with the first embodiment, the optical path transmission principle of the first lens module and the optical path transmission principle of the second lens module are the same, except that the second lens 10 is integrated into the second lens module 6, and the optical fiber carrier 7 is connected with the first lens module 4 through the second lens module 6.
During the concrete implementation, the external equipment is connected to the electrical interface on the PCB board 5, the signal of telecommunication passes through PCB board 5 and transmits to driver chip 31, driver chip 31 transmits the signal of telecommunication to photoelectric conversion chip 32, photoelectric conversion chip 32 converts the signal of telecommunication into optical signal, optical signal passes through first lens module 4 or second lens module 6 and transmits optical signal to optical fiber group 8, realize the transmission of optical signal, otherwise, the optical signal who sends from optical fiber group 8 transmits to photoelectric conversion chip 32 through second lens module 6 and first lens module 4, photoelectric conversion chip 32 converts optical signal into the signal of telecommunication, carry to PCB board 5 in through transmission line 24, retransmission to external equipment, realize the receipt of optical signal.
The whole thickness of the optical module is equal to the sum of the thicknesses of the structural frame 2, the PCB 5 and the optical fiber carrier 7, the first lens module 4 and the second lens module 6 hardly occupy the thickness space, the whole thickness reaches several millimeters, the thickness of the optical module is effectively reduced, the ultra-thin optical module is packaged, and the application scene with the requirement on the thickness can be met. The signal of telecommunication of interface transmission on the follow PCB board 5 passes through transmission line 24 and transmits to driver chip 31, driver chip 31 control photoelectric conversion chip 32 realizes photoelectric conversion, the transmission light passes through first lens module 4 and second lens module 6 in proper order, with optical coupling to in the optical fiber group 8, accomplish signal transmission, the loss of signal has greatly been reduced, and because the transmission optical path of overall structure is short, signal loss is little, can realize high-quality signal transmission, structural upper surface or lower surface all can be directly or through heat-conducting glue and shell contact, and structural symmetry, be favorable to the high efficiency heat dissipation.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (10)
1. A signal transmission optical module, comprising: including being used for PCB board (5) with signal transmission to standard interface, be equipped with pin group (51) on PCB board (5), still including the collimation that is used for the light to focus first lens module (4), first lens module (4) are settled in structural framework (2), structural framework (2) inside is provided with transmission line (24), transmission line (24) are connected with chipset (3), are located be equipped with base plate (1) in structural framework (2), chipset (3) are fixed on base plate (1), pin group (51) with transmission line (24) are connected, so that chipset (3) pass through transmission line (24) with PCB board (5) signal connection, be equipped with logical groove (52) on PCB board (5), first lens module (4) pass through logical groove (52) with launch optical coupling entering optical fiber group (8), or the light received by the optical fiber group (8) is transmitted to the chip group (3) through the first lens module group (4), and the optical fiber group (8) is arranged in an optical fiber carrier (7);
the optical module comprises a bottom surface and a top surface, the bottom surface of the optical module comprises a partial bottom surface of the PCB (5) and an optical fiber carrier (7), the top surface of the optical module comprises top surfaces of the base plate (1) and the PCB (5), and the bottom surface of the optical module and the top surface of the optical module are both used for heat dissipation through a connecting shell.
2. A signal transmission optical module according to claim 1, characterized in that: structural frame (2) are hollow structure, and it is inside including first step (21), second step (22) and third step (23) are located same one side of structural frame (2), just third step (23) are located with first step (21) the different sides of structural frame (2), inlay base plate (1) on first step transmission line (21), the initiating terminal of transmission line (24) is located on the side of second step (22) that structural frame (2) set up, the end is located on the external contact surface of structural frame (2).
3. A signal transmission optical module according to claim 2, characterized in that: the chip group (3) comprises a driving chip (31) for controlling signal transmission and a photoelectric conversion chip (32) for converting optical signals and electric signals into each other, and the driving chip (31) and the photoelectric conversion chip (32) are electrically connected with each other to transmit signals.
4. A signal transmission optical module according to claim 3, characterized in that: first lens module (4) inlay on third step (23) of structural frame (2), just be equipped with lens district (41) on lens module (4), lens district (41) include array lens, array lens position with photoelectric conversion chip (32) one-to-one to the light that collimated photoelectric conversion chip (32) sent or the collimated light that the focus came from optical fiber group (8) are to photoelectric conversion chip (32) on, transmission line (24) with lead foot group (51) correspond and are connected, lens district (41) embedding lead to in groove (52).
5. The optical signal transmission module as claimed in claim 4, wherein: first lens (9) are integrated on first lens module (4), second lens (10) are integrated on optical fiber carrier (7), the light that photoelectric conversion chip (32) sent passes through first lens (9) are collimated, and the warp second lens (10) are focused to in the optic fibre group (8), optic fibre group (8) receive the light through second lens (10) collimation, through focus of first lens (9) are squeezed into on photoelectric conversion chip (32).
6. The optical signal transmission module as claimed in claim 4, wherein: the bottom surface of the optical module further comprises a second lens module (6), a positioning hole (42) is formed in the lens area (41), the second lens module (6) is assembled with the first lens module (4) through the positioning hole (42), a first lens (9) is integrated on the first lens module (4), a 90-degree corner block (11) and a second lens (10) are integrated on the second lens module (6), the 90-degree corner block (11) is a right-angle triangular prism, planes of the first lens (9) and the second lens (10) are respectively parallel to two right-angle surfaces of the 90-degree corner block (11), so that light collimated by the first lens (9) enters the second lens (10) after being turned to 90 degrees through the 90-degree corner block (11), and light emitted by the photoelectric conversion chip (32) is collimated by the first lens (9), the light is turned 90 degrees through the 90-degree turning block (11), is focused into the optical fiber group (8) through the second lens (10) and is transmitted, the light received by the optical fiber group (8) is collimated through the second lens (10), is turned 90 degrees through the 90-degree turning block (11), and is focused and driven onto the photoelectric conversion chip (32) through the first lens (9).
7. The optical signal transmission module as claimed in claim 4, wherein: the bottom surface of the optical module further comprises a second lens module (6), a positioning hole (42) is formed in the lens area (41), the second lens module (6) is assembled with the first lens module (4) through the positioning hole (42), a first lens (9) is integrated on the first lens module (4), a 90-degree corner block (11) is integrated on the second lens module (6), a second lens (10) is integrated on the optical fiber carrier (7), the 90-degree corner block (11) is a right-angle triangular prism, planes of the first lens (9) and the second lens (10) are respectively parallel to two planes of the 90-degree corner block (11), so that light collimated by the first lens (9) is turned to 90 degrees through the 90-degree corner block (11) to enter the second lens (10), and light emitted by the photoelectric conversion chip (32) passes through the first lens (9), the light is turned 90 degrees through the 90-degree turning block (11), is focused into the optical fiber group (8) through the second lens (10) and is transmitted, the light received by the optical fiber group (8) is collimated through the second lens (10), is turned 90 degrees through the 90-degree turning block (11), and is focused and driven onto the photoelectric conversion chip (32) through the first lens (9).
8. The optical signal transmission module as claimed in claim 4, wherein: the optical module bottom surface still includes second lens module (6), be provided with locating hole (42) on lens district (41), second lens module (6) pass through locating hole (42) with first lens module (4) assemble, it has first lens (9) to integrate on first lens module (4), it has second lens (10) to integrate on second lens module (6), the light that photoelectric conversion chip (32) sent passes through first lens (9) are collimated, and the warp second lens (10) are focused to in the optic fibre group (8), optic fibre group (8) received light is through second lens (10) collimation, and pass through first lens (9) are focused to on photoelectric conversion chip (32).
9. A signal transmission optical module according to claim 1, characterized in that: the chip group (3) is attached to the substrate (1) through a chip-on-chip process, and the transmission line (24) is connected with the chip group (3) through a gold wire bonding process.
10. A signal transmission optical module according to claim 1, characterized in that: the structural frame (2) is welded on the PCB (5) through an SMT patch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011548169.2A CN112558243B (en) | 2020-12-24 | 2020-12-24 | Signal transmission optical module |
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| CN113253401A (en) * | 2021-05-27 | 2021-08-13 | 杭州耀芯科技有限公司 | Integrated packaged optical device and optical module package containing same |
| CN113848616B (en) * | 2021-09-23 | 2022-08-16 | 杭州耀芯科技有限公司 | Signal transmission device based on MID/LDS technology and assembling method thereof |
| CN115308855A (en) * | 2022-08-13 | 2022-11-08 | 山东华云光电技术有限公司 | Geminate transistors COB single data transmission light engine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087150A (en) * | 2002-08-23 | 2004-03-18 | Nec Corp | Card type optical communication module |
| CN101788701A (en) * | 2009-01-22 | 2010-07-28 | 河北华美光电子有限公司 | Parallel optical transceiver used for data transmission |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN109856738A (en) * | 2019-03-19 | 2019-06-07 | 中航海信光电技术有限公司 | A kind of light module package structure and optical module |
| CN110568569A (en) * | 2019-09-18 | 2019-12-13 | 杭州耀芯科技有限公司 | integrated packaged optical engine and signal transmitting and receiving method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7334948B2 (en) * | 2004-05-21 | 2008-02-26 | Finisar Corporation | Modular optical device with component insert |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087150A (en) * | 2002-08-23 | 2004-03-18 | Nec Corp | Card type optical communication module |
| CN101788701A (en) * | 2009-01-22 | 2010-07-28 | 河北华美光电子有限公司 | Parallel optical transceiver used for data transmission |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN109856738A (en) * | 2019-03-19 | 2019-06-07 | 中航海信光电技术有限公司 | A kind of light module package structure and optical module |
| CN110568569A (en) * | 2019-09-18 | 2019-12-13 | 杭州耀芯科技有限公司 | integrated packaged optical engine and signal transmitting and receiving method thereof |
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