CN113253401A - Integrated packaged optical device and optical module package containing same - Google Patents
Integrated packaged optical device and optical module package containing same Download PDFInfo
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- CN113253401A CN113253401A CN202110585371.0A CN202110585371A CN113253401A CN 113253401 A CN113253401 A CN 113253401A CN 202110585371 A CN202110585371 A CN 202110585371A CN 113253401 A CN113253401 A CN 113253401A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 252
- 230000008054 signal transmission Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 34
- 239000013307 optical fiber Substances 0.000 claims description 29
- 238000013461 design Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000013308 plastic optical fiber Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 9
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 7
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The utility model provides an integrated encapsulated optical device and contain optical module encapsulation of this optical device, including the optical device body, the optical device body includes optical device base plate and optical device electricity pin, optical device electricity pin realizes external signal transmission through inserting in the optical device base plate, integrated light receiving and dispatching driver chip and first lens module on the optical device base plate, laser instrument and photodiode chip pass through the optical device base plate constitute with the optical device electricity between the pin signal transmission, be equipped with first array lens on the first lens module, be equipped with the second lens module on the first lens module, be located the second lens module and be connected with second array lens with array fiber fixed orifices, can realize that the receiving and dispatching of optical device are parallel. The optical device has high integration level, can transmit high-capacity data, has a simple packaging structure, can realize mass production of the optical module, can realize quick replacement of the optical device on the optical module, and is beneficial to maintenance and upgrading of the optical module.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an integrated packaged optical device and an optical module package containing the same.
Background
In the field of optical communication, data is transmitted between optical modules, wherein an optical device is a core element of an optical module, and with the development of data communication, especially with the rapid expansion of services such as data centers, cloud computing, consumer products and the like, the density of the optical modules of the whole transmission network is increased, and the transmission capacity and the transmission rate of the optical module are both highly demanded, but the existing optical module is not enough to meet the requirements of the increasing transmission capacity and transmission rate, and the reliability of the existing optical module is poor.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an optical device which has small volume and high integration level and can realize high-speed and high-capacity data transmission, an optical module package containing the optical device and a quick replacement method of the optical device on an optical module.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
an integrated packaged optical device and an optical module package containing the optical device comprise an optical device body, wherein the optical device body comprises an optical device substrate and an optical device electric pin, the optical device electric pin is an external electric interface of the optical device, a hole for inserting the optical device electric pin is arranged on the optical device substrate, the optical device electric pin is inserted into the optical device substrate to realize external signal transmission, a circuit is arranged on the optical device substrate to transmit signals to the optical device electric pin, an optical transceiving driving chip, a laser, an optical diode chip and a first lens module are integrated on the optical device substrate, the laser and the optical diode chip form electric signal transmission with the optical device electric pin through the optical device substrate, and the first lens module and the optical device substrate transmit electric signals between the optical transceiving driving chip and the optical device electric pin, The laser and the photodiode chip are sealed, a first array lens is arranged on the first lens module and used for collimating and focusing light beams of the laser and the photodiode chip and transmitting optical signals, a second lens module is arranged on the first lens module, a plurality of array optical fiber fixing holes are arranged on the second lens module and used for fixing the optical fiber group in the second lens module, a second array lens is arranged in the second lens module and connected with the array optical fiber fixing holes, the optical signal transmission between the optical fiber group and the laser and the photodiode chip is realized through the matching of the second array lens and the first array lens, the received light is transmitted to the photodiode chip through the second array lens and the first array lens, and the emitted light is emitted by the laser, the optical fiber group is transmitted to the optical fiber group through the first array lens and the second array lens, so that the parallel receiving and transmitting of the optical device can be realized.
Preferably, the optical device electrical pin is made of a special material, has conductivity and elasticity, and can be conductive silica gel, for example.
Preferably, the shape and size of the optical device electrical pin and the hole pattern on the optical device substrate meet the design requirement of a high-speed circuit, and high-speed signal transmission can be realized.
Preferably, the optical transceiver driving chip, the laser and the photodiode chip are mounted on the optical device substrate and fixed by glue, and high-efficiency production can be realized by a Die Bonding technology.
Preferably, the laser, the photodiode chip, and the optical transceiver driving chip and the optical device substrate are connected by a Wire Bonding (Wire Bonding) technique.
Preferably, the connecting surfaces of the second lens module and the first lens module are both convex-concave symmetrical structures, and the light path alignment is realized through the structural matching between the second lens module and the first lens module.
Preferably, the optical fiber group can be a light guide pipe of a plastic optical fiber or a glass optical fiber, and the optical fiber group is fixed in the second lens module, so that the number of elements can be reduced, and the integration level of an optical device is improved.
The number of channels of the optical device is M N, the optical device is designed according to actual requirements, can be various combinations such as 8-transmission 8-receiving, 4-transmission 12-receiving, 12-transmission 4-receiving, 16-transmission 16-receiving and the like, and can be flexibly selected according to application scenes.
An optical module package containing an optical device comprises the optical device of an integrated package and an optical module PCB, wherein a first pin is arranged on the optical module PCB, the first pin corresponds to an optical device electric pin on an optical device substrate one to one, and an optical device body is positioned on the optical module PCB.
Preferably, the optical module comprises an optical device base, a second pin is arranged on the optical module PCB, a bonding pad corresponding to the second pin is arranged at the bottom of the optical device base, the optical device base is welded to the optical module PCB through SMT, and the optical device base is used for fixing the optical device body on the optical module PCB.
Preferably, the side of the optical device base is provided with a through groove, a fixing pressing strip is arranged in the through groove, the fixing pressing strip is used for fixing the optical device body in the optical device base in a locking manner and other manners, a locking structure is realized, when the optical device is replaced, the optical device is replaced only by unlocking/locking the fixing pressing strip and the optical device base, other operations are not needed, the optical device can be replaced quickly, and the optical module is maintained and upgraded conveniently.
The invention has the advantages and positive effects that:
the optical device has small volume and high integration level, can transmit high-capacity data, has a simple packaging structure, can realize mass optical module production, can realize quick replacement of the optical device on the optical module, can finish the replacement of the optical device only by opening the fixing pressing strip and the lock catch of the optical device base, taking out the optical device and inserting the replaced optical device into the optical device base, and is beneficial to the maintenance and the upgrade of the optical module.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic illustration of a split structure of the present invention;
FIG. 3 is a schematic illustration of a split structure of an integrally packaged optical device of the present invention;
FIG. 4 is a schematic diagram of an isometric configuration of an integrally packaged optical device of the present invention;
FIG. 5 is another schematic isometric view of an integrally packaged optical device of the present invention;
FIG. 6 is a schematic axial view of a second lens module according to the present invention;
FIG. 7 is a schematic side view of another embodiment of a second lens module of the present invention;
FIG. 8 is a schematic side view of a second lens module according to the present invention;
FIG. 9 is a schematic axial view of a first lens module according to the present invention;
FIG. 10 is a schematic axial view of the first lens module of the present invention.
In the figure:
1. fixing a pressing strip; 2. an optical device base; 3. an optical device body; 4. an optical module PCB board;
31. a group of optical fibers; 32. a second lens module; 33. a first lens module; 34. a light receiving and transmitting driving chip; 35. an optical device electrical pin; 36. an optical device substrate; 37. a laser and a photodiode chip;
321. a second array lens; 322. array optical fiber fixing holes;
331. a first array lens;
41. a first pin; 42. a second pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The embodiments of the invention will be described in further detail below with reference to the accompanying drawings:
as shown in fig. 3, 4 and 5, an integrally packaged optical device includes an optical device body 3, the optical device body 3 includes an optical device substrate 36 and an optical device electrical pin 35, the optical device substrate 36 is provided with a hole for inserting the optical device electrical pin 35, the optical device electrical pin 35 is inserted into the optical device substrate 36 to realize external signal transmission, the shape and size of the optical device electrical pin 35 and the hole pattern on the optical device substrate 36 meet the design requirement of high-speed circuit to realize high-speed signal transmission, the optical device substrate 36 includes a circuit to transmit signals to the optical device electrical pin 35, the optical device substrate 36 is integrated with an optical transceiver driving chip 34, a laser and photodiode chip 37 and a first lens module 33, as shown in fig. 9, the laser and photodiode chip 37 form electrical signal transmission with the optical device electrical pin 35 through the optical device substrate 36, the first lens module 33 and the optical device substrate 36 seal the optical transceiving driving chip 34, the laser and the photodiode chip 37, the first lens module 33 is provided with a first array lens 331, as shown in fig. 10, the first array lens 331 is used for collimating and focusing light beams of the laser and the photodiode chip 37 and transmitting optical signals, the first lens module 33 is provided with a second lens module 32, as shown in fig. 6 and 7, the second lens module 32 is provided with a plurality of array optical fiber fixing holes 322, as shown in fig. 8, the array optical fiber fixing holes 322 are used for fixing the optical fiber group 31 in the second lens module 32, the second lens module 321 is positioned in the second lens module 32 and connected with the array optical fiber fixing holes 322, and the optical signal transmission between the optical fiber group 31 and the laser and the photodiode chip 37 is realized through the cooperation of the second array lens 321 and the first array lens 331, the received light is transmitted to the photodiode chip by the optical fiber group 31 through the second array lens 321 and the first array lens 331, the emitted light is emitted by the laser, and is transmitted to the optical fiber group 31 through the first array lens 331 and the second array lens 321, so that parallel receiving and transmitting of the optical device can be realized.
In this embodiment, the optical device electrical lead 35 is made of a special material, has electrical conductivity and elasticity, and can be conductive silica gel, the optical transceiver driving chip 34, the laser and the photodiode chip 37 are attached to the optical device substrate 36 and fixed by glue, high-efficiency production can be realized by a Die Bonding technology, the connection between the laser and the photodiode chip 37 and the optical transceiver driving chip 34, and the connection between the optical transceiver driving chip 34 and the optical device substrate 36 are performed by a Wire Bonding method, the connection surfaces of the second lens module 32 and the first lens module 33 are both convex-concave symmetrical structures, optical path alignment is realized by structural matching between the second lens module 32 and the first lens module 33, and the optical fiber group 31 can be a light guide tube of a plastic optical fiber or a glass optical fiber.
The number of channels of the optical device is M × N, and the optical device is designed according to actual requirements, in fig. 3 of this embodiment, the optical transceiver design of 2 × 8 can implement high-speed and high-capacity data transmission of 2 × 8 × 10Gbps and 2 × 8 × 25Gbps, the number of optical transceivers of the optical device can also be various combinations of 8-transceiver and 8-transceiver, 4-transceiver and 12-transceiver, 12-transceiver and 4-transceiver, 16-transceiver and 16-transceiver, and the optical transceiver can be flexibly selected according to application scenarios.
An optical module package containing an optical device, as shown in fig. 1 and 2, comprises an integrated packaged optical device, and further comprises an optical module PCB 4, wherein a first pin 41 is arranged on the optical module PCB 4, the first pin 41 corresponds to an optical device electrical pin 35 on an optical device substrate 36 one by one, an optical device body 3 is arranged on the optical module PCB 4, in order to fix the optical device body 3 on the optical module PCB 4, the optical module package is further provided with an optical device base 2, a second pin 42 is arranged on the optical module PCB 4, a pad corresponding to the second pin 42 is arranged at the bottom of the optical device base 2, the optical device base 2 is welded on the optical module PCB 4 by SMT, the optical device base 2 is used for fixing the optical device body 3 on the optical module PCB 4, a through groove is arranged at a side edge of the optical device base 2, a fixing bead 1 is arranged in the through groove, the fixing bead 1 is used for fixing the optical device body 3 in the optical device base 2, the locking structure is realized, when the optical device is replaced, the optical device is replaced only by unlocking/locking the fixing pressing strip and the optical device base, other operations are not needed, the optical device can be replaced quickly, and the optical module can be maintained and upgraded conveniently.
During specific implementation, the optical device body 3 is inserted into the optical device base 2, and then the fixing pressing strip 1 is used for fixing, so that the stability of the optical device body 3 in work can be ensured, and if the optical device body 3 is to be replaced, the fixing pressing strip 1 and the optical device base 2 are taken down to replace a new optical device body 3.
The optical device body 3 has small volume and high integration level, can transmit high-capacity data, has a simple packaging structure of an optical module containing the optical device body 3, can realize mass optical module production, can realize quick replacement of the optical device body 3 on the optical module, can finish the replacement work of the optical device only by opening the lock catches of the fixing pressing strips 1 and the optical device base 2, taking out the optical device body 3 and inserting the replaced optical device into the optical device base 2, and is beneficial to the maintenance and upgrading of the optical module.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (10)
1. An integrally packaged optical device, comprising: the optical device comprises an optical device body (3), wherein the optical device body (3) comprises an optical device substrate (36) and optical device electric pins (35), holes for the optical device electric pins (35) to be inserted are formed in the optical device substrate (36), the optical device electric pins (35) are inserted into the optical device substrate (36) to realize external signal transmission, circuits are arranged on the optical device substrate (36) to transmit signals to the optical device electric pins (35), an optical transceiving driving chip (34), a laser and an optical diode chip (37) and a first lens module (33) are integrated on the optical device substrate (36), the laser and the optical diode chip (37) form electric signal transmission with the optical device electric pins (35) through the optical device substrate (36), and the first lens module (33) and the optical device substrate (36) enable the optical transceiving driving chip (34) to be connected, The laser and the photodiode chip (37) are sealed, a first array lens (331) is arranged on the first lens module (33), the first array lens (331) is used for collimating and focusing light beams of the laser and the photodiode chip (37) and transmitting optical signals, a second lens module (32) is arranged on the first lens module (33), a plurality of array optical fiber fixing holes (322) are arranged on the second lens module (32), the array optical fiber fixing holes (322) are used for fixing an optical fiber group (31) in the second lens module (32), a second array lens (321) is arranged in the second lens module (32) and connected with the array optical fiber fixing holes (322), and the optical signal transmission between the optical fiber group (31) and the laser and the photodiode chip (37) is realized through the matching of the second array lens (321) and the first array lens (331), the received light is transmitted to the photodiode chip by the optical fiber group (31) through the second array lens (321) and the first array lens (331), the emitted light is emitted by the laser and is transmitted to the optical fiber group (31) through the first array lens (331) and the second array lens (321), and parallel receiving and transmitting of the optical device can be achieved.
2. An integrally packaged optical device according to claim 1, wherein: the optical device electrical pin (35) is conductive and elastic, and is conductive silica gel.
3. An integrally packaged optical device according to claim 1, wherein: the shape and size of the optical device electrical pin (35) and the hole pattern on the optical device substrate (36) meet the design requirement of a high-speed line.
4. An integrally packaged optical device according to claim 1, wherein: the light receiving and transmitting driving chip (34), the laser and the photodiode chip (37) are attached to the optical device substrate (36) and fixed by glue.
5. An integrally packaged optical device according to claim 1, wherein: the laser and the photodiode chip (37) are connected with the light receiving and transmitting driving chip (34), and the light receiving and transmitting driving chip (34) is connected with the optical device substrate (36) through a wire connection mode of a gold wire bonding technology.
6. An integrally packaged optical device according to claim 1, wherein: the connecting surface of the second lens module (32) and the first lens module (33) is of a convex-concave symmetrical structure, and the light path alignment is realized through the structural matching between the second lens module (32) and the first lens module (33).
7. An integrally packaged optical device according to claim 1, wherein: the optical fiber group (31) is a plastic optical fiber or a glass optical fiber.
8. A light module package comprising a light device, characterized by: an integrally packaged optical device comprising any one of claims 1-7, further comprising an optical module PCB (4), wherein the optical module PCB (4) is provided with first pins (41), the first pins (41) are in one-to-one correspondence with the optical device electrical pins (35) on the optical device substrate (36), and the optical device body (3) is located on the optical module PCB (4).
9. A light module package containing a light device as claimed in claim 8, wherein: including optical device base (2), be equipped with second pin (42) on optical module PCB board (4), optical device base (2) bottom be equipped with the pad that second pin (42) correspond, optical device base (2) weld through SMT to on optical module PCB board (4), optical device base (2) are used for with optical device body (3) are fixed on optical module PCB board (4).
10. A light module package containing a light device as claimed in claim 9, characterized in that: the side of optical device base (2) is equipped with logical groove, is equipped with fixed layering (1) in logical inslot, fixed layering (1) are used for with optical device body (3) are fixed in optical device base (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110585371.0A CN113253401A (en) | 2021-05-27 | 2021-05-27 | Integrated packaged optical device and optical module package containing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110585371.0A CN113253401A (en) | 2021-05-27 | 2021-05-27 | Integrated packaged optical device and optical module package containing same |
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| Publication Number | Publication Date |
|---|---|
| CN113253401A true CN113253401A (en) | 2021-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110585371.0A Pending CN113253401A (en) | 2021-05-27 | 2021-05-27 | Integrated packaged optical device and optical module package containing same |
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| CN103984066A (en) * | 2014-05-20 | 2014-08-13 | 昆山柯斯美光电有限公司 | Multi-path parallel optical component for high-speed transmission and assembling method thereof |
| TW201432336A (en) * | 2013-02-04 | 2014-08-16 | Shao-Hsuan Chen | High density optical transceiver module |
| CN110568569A (en) * | 2019-09-18 | 2019-12-13 | 杭州耀芯科技有限公司 | integrated packaged optical engine and signal transmitting and receiving method thereof |
| CN112558243A (en) * | 2020-12-24 | 2021-03-26 | 杭州耀芯科技有限公司 | Signal transmission optical module |
| CN213023668U (en) * | 2020-09-22 | 2021-04-20 | 成都市德科立菁锐光电子技术有限公司 | Optical module for mounting optical devices with different lengths |
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2021
- 2021-05-27 CN CN202110585371.0A patent/CN113253401A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1430466A (en) * | 2001-12-11 | 2003-07-16 | 日本碍子株式会社 | Set-up structure of shield casing of circuit base plate or flat aerial |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| TW201432336A (en) * | 2013-02-04 | 2014-08-16 | Shao-Hsuan Chen | High density optical transceiver module |
| CN103984066A (en) * | 2014-05-20 | 2014-08-13 | 昆山柯斯美光电有限公司 | Multi-path parallel optical component for high-speed transmission and assembling method thereof |
| CN110568569A (en) * | 2019-09-18 | 2019-12-13 | 杭州耀芯科技有限公司 | integrated packaged optical engine and signal transmitting and receiving method thereof |
| CN213023668U (en) * | 2020-09-22 | 2021-04-20 | 成都市德科立菁锐光电子技术有限公司 | Optical module for mounting optical devices with different lengths |
| CN112558243A (en) * | 2020-12-24 | 2021-03-26 | 杭州耀芯科技有限公司 | Signal transmission optical module |
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Application publication date: 20210813 |
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