CN215494242U - Photoelectric device containing optical fiber array - Google Patents
Photoelectric device containing optical fiber array Download PDFInfo
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- CN215494242U CN215494242U CN202120714996.8U CN202120714996U CN215494242U CN 215494242 U CN215494242 U CN 215494242U CN 202120714996 U CN202120714996 U CN 202120714996U CN 215494242 U CN215494242 U CN 215494242U
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Abstract
The embodiment of the utility model discloses a photoelectric device containing an optical fiber array, which comprises a driving circuit board, a photoelectric chip, a single-channel optical fiber and a metal tube shell, wherein the driving circuit board is arranged in the metal tube shell, the photoelectric chip is connected to the driving circuit board, one side of the metal tube shell is provided with a fiber outlet, a plurality of single-channel optical fibers are arranged to form a multi-channel optical fiber array assembly, and the optical fiber array assembly is arranged in the metal tube shell and is in passive coupling with the photoelectric chip. The optical fiber array assembly is sleeved with an airtight packaging and shaping assembly, so that the airtight packaging and shaping assembly is packaged in the fiber outlet through metal solder, and the photoelectric device is hermetically packaged. And injecting a glue sealing layer on the outer side of the airtight packaging and shaping component in the fiber outlet to buffer external force applied to the optical fiber from the outside. The utility model can realize the airtight packaging of the photoelectric device while satisfying the passive coupling of the optical fiber array and the photoelectric chip, and effectively solves the problems of short service life and poor reliability of the existing product in a severe environment.
Description
Technical Field
The embodiment of the utility model relates to the technical field of photoelectric communication, in particular to a photoelectric device containing an optical fiber array.
Background
Optoelectronic devices are devices that are fabricated using the electro-photon conversion effect for a variety of applications. The design principle of the photoelectronic device is based on the change of the external field to the guided wave light propagation mode, and the photoelectronic device is the key and core part of photoelectronic technology, is an important product in the advanced research field of modern photoelectronic technology and microelectronic technology, and is an important component of information technology. In addition, the common packaging technologies at present include glass solder packaging, metal solder packaging, and parallel seam welding, wherein the parallel seam welding occupies most markets due to the advantages of welding temperature, room temperature operability, and the like.
Since a new challenge is provided for optoelectronic communication in the context of 5G communication, there is a more urgent need for optoelectronic communication devices with high bandwidth and high frequency, and a form of fiber array assembly integrating transceiving with each other needs to be adopted to replace the conventional single-channel communication device. However, the service life and performance stability of the integrated transceiver optical communication device are still required to be improved. There is therefore a great need for a hermetic packaging technique for such devices that improves upon the prior art.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides an optoelectronic device with an optical fiber array, so as to solve the problems of the prior art that the service life and the performance stability of an optical communication device integrating receiving and transmitting are poor.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
according to a first aspect of the embodiments of the present invention, an optoelectronic device including an optical fiber array includes a driving circuit board, an optoelectronic chip and a single-channel optical fiber, the photoelectric device also comprises a metal tube shell, the driving circuit board is arranged in the metal tube shell, the photoelectric chip is connected on the driving circuit board, a fiber outlet is arranged on one side of the metal tube shell, a plurality of single-channel optical fibers are arranged to form a multi-channel optical fiber array component, one end of the optical fiber array component is arranged in the metal tube shell from the fiber outlet, and is passively coupled with the photoelectric chip, an airtight packaging and shaping component is sleeved on the optical fiber array component and is arranged in the optical fiber outlet, a cavity is formed inside the airtight packaging and shaping component, the fiber array component is packaged and shaped in the cavity through high-temperature metal solder, and the fiber outlet is internally provided with a package respectively at the inner side and the outer side of the airtight package shaping component.
Further, airtight encapsulation design subassembly includes last design piece and lower design piece that the components of a whole that can function independently set up, go up the design piece laminating and set up in the top of design piece down, and set up the wire casing of transversal continuous S type of personally submitting on the opposite face of last design piece and lower design piece respectively, make the fiber array subassembly is placed in the wire casing, the solder injection hole has been seted up at the middle part of going up design piece roof, solder injection hole intercommunication cavity sets up to solder overflow hole has been seted up respectively in the both sides of last design piece roof, solder overflow hole intercommunication cavity sets up.
Further, the position that the optical fiber array subassembly is close to the coupling is equipped with optical fiber positioning assembly, optical fiber positioning assembly includes supporting shoe and locating piece, the locating piece laminating sets up in the top of supporting shoe, and is equipped with the notch that supplies a plurality of single channel fiber array ization on the bottom surface of locating piece, wherein, glue through ultraviolet UV curing between the notch of single channel fiber and locating piece and carry out the point and glue the solidification, and glue through ultraviolet UV curing between locating piece and the supporting shoe and be connected fixedly.
Further, the notch is a V-shaped groove or a U-shaped groove.
Furthermore, the inner side of the airtight packaging and shaping component is injected with low-temperature metal solder for packaging to form a metal solder layer, and the outer side of the airtight packaging and shaping component is injected with silicon rubber for packaging to form a gluing sealing layer.
Further, the high-temperature metal solder and the low-temperature metal solder are two kinds of metal solders with different temperatures.
Furthermore, the coupling surface of the optical fiber array component and the photoelectric chip is plated with an antireflection film.
The embodiment of the utility model has the following advantages: adopt the multichannel fiber array subassembly that a plurality of single channel optic fibre constitute, fix through airtight encapsulation design subassembly, and put into the metal tube shell with fiber array subassembly from the play fiber mouth of metal tube shell, with photoelectric chip passive coupling, make airtight encapsulation design subassembly arrange the interior metal solder encapsulation of going out in the fiber mouth in, utilize in the outer side and the inboard of airtight encapsulation design subassembly to encapsulate respectively in going out the fiber mouth simultaneously, it is further sealed, when satisfying fiber array and photoelectric chip passive coupling, can realize the airtight encapsulation of photoelectric device, effectively solve current product life-span under the harsh environment short, the not strong problem of reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope of the present invention.
Fig. 1 is a schematic diagram illustrating an overall structure of an optoelectronic device including an optical fiber array according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a fiber positioning assembly of an optoelectronic device including an optical fiber array according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an assembly structure of a fiber array assembly of an optoelectronic device including a fiber array according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a hermetically sealed modular assembly of an optoelectronic device including an optical fiber array according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a package structure of an optoelectronic device including an optical fiber array according to an embodiment of the present invention.
In the figure: 1. a drive circuit board; 2. a photoelectric chip; 3. a metal tube shell; 31. a fiber outlet; 4. an optical fiber array assembly; 5. an optical fiber positioning assembly; 51. a support block; 52. positioning blocks; 6. hermetically packaging the shaping assembly; 61. an upper shaping block; 611. a solder injection hole; 612. a solder overflow hole; 62. a lower shaping block; 63. a wire slot; 64. a cavity; 7. a metal solder layer; 8. and gluing a sealing layer.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the utility model will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the utility model and that it is not intended to limit the utility model to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, the embodiment of the present invention provides an optoelectronic device including an optical fiber array, which includes an existing driving circuit board 1, an optoelectronic chip 2 and a single-channel optical fiber. The photoelectric device of the embodiment further comprises a metal tube shell 3, the metal tube shell 3 is internally provided with a closed space formed by parallel seam welding of the shell and the shell cover, and one side of the metal tube shell 3 is provided with a fiber outlet 31. The drive circuit board 1 is mounted in the metal case 3, and the photoelectric chip 2 is connected to the drive circuit board 1. Single channel fiber is equipped with a plurality ofly, and constitute multichannel's fiber array subassembly 4 through fiber positioning subassembly 5, wherein, fiber positioning subassembly 5 includes supporting shoe 51 and locating piece 52, the laminating of locating piece 52 sets up in supporting shoe 51's top, and be equipped with the notch that supplies a plurality of single channel fiber array ization on the bottom surface of locating piece 52, it is fixed through location fiber, with the stable in structure who guarantees many single channel fibers, and fix the interval between every single channel fiber, and utilize professional coupling platform, guarantee the same and triaxial uniformity of array face of a plurality of single channel fibers under electron microscope. The single-channel optical fiber and the notch of the positioning block 52 are subjected to dispensing and curing through ultraviolet UV curing glue, and the positioning block 52 and the supporting block 51 are fixedly connected through the ultraviolet UV curing glue. So that one end of the optical fiber array component 4 is placed into the metal tube 3 from the fiber outlet 31 and passively coupled with the optoelectronic chip 2. Among them, ultraviolet UV curing glue is commonly used for chip bonding in optical fiber devices.
As mentioned above, the notches on the positioning block 52 may be selected from V-shaped or U-shaped grooves, which are used only as arrays for placing single-channel fibers. In addition, after the coating layer of the single-channel optical fiber is removed, the cutting angle treatment is needed, and in order to improve the coupling efficiency, an antireflection film is plated on the coupling surface of the optical fiber array component 4 and the photoelectric chip 2; or the inclined end surface of the single-channel optical fiber is coated with a total reflection film for transmitting and receiving of the laser and the detector.
Referring to fig. 3 and 4, the optical fiber array module 4 is sleeved with the airtight sealing and shaping module 6, so that the airtight sealing and shaping module 6 is disposed in the fiber outlet 31 and sealed. Specifically, airtight encapsulation design subassembly 6 is including last design piece 61 and lower design piece 62 that the components of a whole that can function independently set up, go up the design piece 61 laminating and set up in the top of lower design piece 62, and set up the transversal wire casing 63 that personally submits continuous S type on the opposite face of last design piece 61 and lower design piece 62 respectively, so that place fiber array subassembly 4 in wire casing 63, with fiber array subassembly 4 in the same direction as after airtight seal dress design subassembly 6, again through the laminating of last design piece 61 and lower design piece 62, and utilize professional anchor clamps to press from both sides tight last design piece 61 and lower design piece 62, in order to fix fiber array subassembly 4. A cavity 64 is further formed inside the hermetically sealed and shaped component 6, and the fiber array component 4 is sealed and shaped in the cavity 64 through high-temperature metal solder, which includes that a solder injection hole 611 is opened in the middle of the top wall of the upper shaped block 61, so that the solder injection hole 611 is communicated with the cavity 64, and thus high-temperature metal solder is injected into the cavity 64 from the solder injection hole 611, so as to package and shape the fiber array component 4. And two sides of the top wall of the upper shaping block 61 are respectively provided with a solder overflow hole 612, so that the solder overflow holes 612 are communicated with the cavity 64, and the position of the solder overflow hole 612 is higher than the horizontal height of the optical fiber array assembly 4, thereby observing the distribution of the high-temperature metal solder in the cavities 64 of the upper shaping block 61 and the lower shaping block 62 according to the amount of the high-temperature metal solder overflowing from the solder overflow hole 612, and further determining the airtight effect of the airtight packaging shaping assembly 6 and the optical fiber array assembly 4. After the operation is good, the metal solder on the surface is wiped off, the airtight detection of the airtight packaging and shaping assembly 6 is carried out, and after the airtightness is qualified, the optical fiber array 4 with the airtight packaging and shaping assembly 6 is placed in the metal tube shell 3, so that the accurate alignment with the photoelectric chip 2 is realized, and the passive coupling is completed.
As described above, referring to fig. 5, the fiber outlet 31 is provided with the sealing members inside and outside the airtight sealing/molding member 6. The method comprises injecting low temperature metal solder package into the inner side of the airtight package shaping component 6 to form a metal solder layer 7, and injecting silicon rubber package into the outer side of the airtight package shaping component 6 to form a glue sealing layer 8 to protect the optical fiber. The high-temperature metal solder and the low-temperature metal solder are two metal solders with different temperatures. Specifically, a small amount of silicon rubber is coated on the outer side of the airtight packaging and shaping component 6 in the fiber outlet 31 for preliminary fixation, the metal tube shell 3 is placed downwards after the silicon rubber is solidified, namely, the fiber outlet 31 is downward, low-temperature metal solder is injected into the inner side of the airtight packaging and shaping component 6 from the fiber outlet 31 to form a metal solder layer 7, so that metal solder packaging is realized, and after the metal solder packaging is finished, the metal tube shell 3 is packaged by parallel seam welding between the shell and the shell cover. And then the outer side of the airtight packaging and shaping component 6 in the fiber outlet 31 is coated with silicon rubber to form a rubber coating sealing layer 8, so that airtight packaging and optical fiber protection are integrally realized.
The silicone rubber can be type 930 silicone rubber, and the working temperature range is as follows: the adhesive can resist the high temperature of +120 ℃ in a short time at the temperature of-50 ℃ to +100 ℃, and can also meet the leakage rate requirement. The gluing sealing layer 8 is divided into an inner layer and an outer layer, so that the inner part of the photoelectric device is in an inactive nitrogen environment, which has a favorable factor for prolonging the service life of the silicon rubber, and the gluing sealing layer 8 on the outer layer can be modified aiming at the service environment of the photoelectric device, and can be selected from ageing-resistant silicon rubber or epoxy resin glue.
The specific packaging steps of this embodiment are as follows:
1. carrying out metallization treatment on the optical fiber array component 4 to be placed in the metal tube shell 3, and marking the metallized optical fiber array component 4 as M;
2. carrying out optical fiber array treatment on the M through an optical fiber positioning component 5 etched with a notch, using a professional coupling table to ensure the same and three-axis consistency of optical fiber array surfaces under an electron microscope, carrying out dispensing (ultraviolet UV curing glue) curing treatment, and then preliminarily attaching the optical fiber array component 4 through an upper shaping block 61 and a lower shaping block 62 of an airtight packaging shaping component 6, wherein the optical fiber array component 4 obtained in the step is marked as N;
3. placing N into the photoelectric device from the fiber outlet 31 of the metal tube shell 3, taking out after proper placement, placing into a special fixture, electrifying at high temperature, injecting high-temperature metal solder into the cavity 64 from the solder injection hole 611, observing the solder overflow hole 612, checking whether the metal solder is injected well, and recording the obtained component as X;
4. and (3) detecting the leakage rate of the X, placing the X into a proper position in the photoelectric device from the fiber outlet 31 of the metal tube shell 3 after the X is qualified, then passively coupling the optical fiber array component 4 and the photoelectric chip 2 to realize accurate alignment, and then fixing the supporting block 51 and the positioning block 52 of the optical fiber positioning component 5 by using glue (ultraviolet UV curing glue). After the process is finished, a small amount of silicon rubber is firstly coated on the outer side of the airtight packaging and shaping assembly 6 in the fiber outlet 31 for preliminary fixation, after the silicon rubber is solidified, the metal tube shell 3 is placed downwards, namely the fiber outlet 31 is downward, low-temperature metal solder is injected into the inner side of the airtight packaging and shaping assembly 6 from the fiber outlet 31 to form a metal solder layer 7, then the photoelectric device is placed into an electronic component, and a circuit system is connected through routing, so that whether all data are normally qualified is detected;
5. after all the inspection is qualified, the shell and the shell cover of the metal tube shell 3 are subjected to parallel sealing welding, the integral airtight packaging function requirement is ensured to be met, and then the outer side of the airtight packaging and shaping component 6 in the fiber outlet 31 is coated with silicon rubber to form a rubber coating sealing layer 8, so that the purpose of protecting optical fibers is achieved.
The utility model adopts a plurality of single-channel optical fibers, forms a multi-channel optical fiber array component 4 through an optical fiber positioning component 5, is fixed by an airtight packaging and shaping component 6, puts the optical fiber array component 4 into a metal tube shell 3 from a fiber outlet 31 of the metal tube shell 3, is passively coupled with a photoelectric chip 2, leads the airtight packaging and shaping component 6 to be placed in the fiber outlet 31 and packaged through metal welding materials, simultaneously utilizes the metal welding materials injected into the inner side of the airtight packaging and shaping component 6 in the fiber outlet 31 to seal so as to achieve the airtight packaging of the fiber outlet 31, and then realizes the airtight packaging of a shell and a shell cover through parallel sealing welding, thereby achieving the integral airtight packaging, and effectively solving the problems of short service life and weak reliability of the existing product in a severe environment.
Although the utility model has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the utility model. Accordingly, such modifications and improvements are intended to be within the scope of the utility model as claimed.
Claims (7)
1. The photoelectric device containing the optical fiber array comprises a driving circuit board, a photoelectric chip and a single-channel optical fiber, and is characterized in that: the photoelectric device still includes the metal tube shell, drive circuit board installs in the metal tube shell, just photoelectric chip connects on drive circuit board, is equipped with out fine mouthful in one side of metal tube shell, single channel optic fibre is equipped with a plurality ofly to constitute multichannel fiber array subassembly, fiber array subassembly's one end is put into in the metal tube shell from going out fine mouthful to with photoelectric chip passive coupling, airtight encapsulation design subassembly has been cup jointed on the fiber array subassembly, airtight encapsulation design subassembly is arranged in going out in the fine, is formed with the cavity in airtight encapsulation design subassembly's inside, and encapsulates and design fiber array subassembly through high temperature metal solder in the cavity, wherein, be equipped with the encapsulation in airtight encapsulation design subassembly's inboard and outside respectively in going out the fine.
2. An optoelectronic device comprising an array of optical fibers according to claim 1, wherein: airtight encapsulation design subassembly is including the last design piece and the lower design piece that the components of a whole that can function independently set up, go up the design piece laminating and set up in the top of design piece down, and set up the transversal wire casing of personally submitting continuous S type respectively on the opposite face of design piece and lower design piece, make the fiber array subassembly is placed in the wire casing, the solder injection hole has been seted up at the middle part of going up the design piece roof, solder injection hole intercommunication cavity sets up to set up in the both sides of last design piece roof and seted up the solder overflow hole respectively, the solder overflow hole communicates the cavity setting.
3. An optoelectronic device comprising an array of optical fibers according to claim 1, wherein: the optical fiber array component is provided with an optical fiber positioning component at a position close to the coupling, the optical fiber positioning component comprises a supporting block and a positioning block, the positioning block is attached to the upper portion of the supporting block, and notches for arraying a plurality of single-channel optical fibers are formed in the bottom surface of the positioning block, the single-channel optical fibers and the notches of the positioning block are glued through ultraviolet UV curing glue for glue dispensing and curing, and the positioning block and the supporting block are fixedly connected through the ultraviolet UV curing glue.
4. An optoelectronic device comprising an array of optical fibers according to claim 3, wherein: the notch is a V-shaped groove or a U-shaped groove.
5. An optoelectronic device comprising an array of optical fibers according to claim 1, wherein: the inner side of the airtight packaging and shaping component is injected with low-temperature metal solder for packaging to form a metal solder layer, and the outer side of the airtight packaging and shaping component is injected with silicon rubber for packaging to form a gluing sealing layer.
6. An optoelectronic device comprising an array of optical fibers according to claim 5, wherein: the high-temperature metal solder and the low-temperature metal solder are two kinds of metal solders with different temperatures.
7. An optoelectronic device comprising an array of optical fibers according to claim 1, wherein: and an antireflection film is plated on the coupling surface of the optical fiber array component and the photoelectric chip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120714996.8U CN215494242U (en) | 2021-04-08 | 2021-04-08 | Photoelectric device containing optical fiber array |
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| CN202120714996.8U CN215494242U (en) | 2021-04-08 | 2021-04-08 | Photoelectric device containing optical fiber array |
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| CN215494242U true CN215494242U (en) | 2022-01-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115077588A (en) * | 2022-07-23 | 2022-09-20 | 北京浦丹光电股份有限公司 | Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method |
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2021
- 2021-04-08 CN CN202120714996.8U patent/CN215494242U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115077588A (en) * | 2022-07-23 | 2022-09-20 | 北京浦丹光电股份有限公司 | Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method |
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