JP2003008065A - Method for manufacturing smd type optical element module - Google Patents
Method for manufacturing smd type optical element moduleInfo
- Publication number
- JP2003008065A JP2003008065A JP2001188921A JP2001188921A JP2003008065A JP 2003008065 A JP2003008065 A JP 2003008065A JP 2001188921 A JP2001188921 A JP 2001188921A JP 2001188921 A JP2001188921 A JP 2001188921A JP 2003008065 A JP2003008065 A JP 2003008065A
- Authority
- JP
- Japan
- Prior art keywords
- optical element
- resin
- manufacturing
- base substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光素子をベース基
板に実装し樹脂封止したレンズ付きのＳＭＤ型光素子モ
ジュールの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an SMD type optical element module with a lens in which an optical element is mounted on a base substrate and resin-sealed.
【０００２】[0002]
【従来の技術】近年、双方向の光素子モジュール構造
は、光ファイバをハウジングした光ファイバプラグと、
その先端に着脱可能に取り付けられ、光素子である発光
素子として発光ダイオード（ＬＥＤ）又はレーザー（Ｌ
Ｄ）と、その素子を制御するためのドライブＩＣが回路
基板上に実装され、また、光素子である受光素子として
フォトダイオード（ＰＤｉ）とＩＣが一体化になってい
て光信号を電気信号に変換する機能を有するＯＥＩＣが
基板上に実装され、それらの各素子は透光性の樹脂で封
止され、外部との電気的接続のために回路基板に電極端
子を有する発光モジュールと受光モジュールを独立にケ
ース内に収納した光ミニジャックモジュールとよりな
り、光ミニジャックモジュール内の発光モジュール及び
受光モジュールに２本の光ファイバがそれぞれ接続さ
れ、これにより光信号の授受を行い光通信が可能にす
る。また、発光モジュールと受光モジュールを単一のモ
ールド樹脂によりパッケージして一体化し、１本の光フ
ァイバで往復通信を可能にする。なお、前記封止樹脂の
表面に半球状のレンズが形成され、発光モジュール側で
は、発光素子から出射された光をレンズで集光させる。
また受光モジュール側では、光ファイバプラグより伝送
された光をレンズで集光させ受光素子に入射させる。2. Description of the Related Art Recently, a bidirectional optical element module structure has an optical fiber plug housing an optical fiber,
A light emitting diode (LED) or a laser (L
D) and a drive IC for controlling the element are mounted on a circuit board, and a photodiode (PDi) as a light receiving element which is an optical element and the IC are integrated to convert an optical signal into an electric signal. An OEIC having a conversion function is mounted on a substrate, each of these elements is sealed with a light-transmitting resin, and a light-emitting module and a light-receiving module each having an electrode terminal on a circuit board for electrical connection with the outside are provided. It consists of an optical minijack module that is housed independently in the case, and two optical fibers are connected to the light emitting module and the light receiving module inside the optical minijack module, respectively, which enables optical communication by exchanging optical signals. To do. In addition, the light emitting module and the light receiving module are packaged and integrated with a single molding resin to enable reciprocal communication with one optical fiber. A hemispherical lens is formed on the surface of the sealing resin, and the light emitted from the light emitting element is condensed by the lens on the light emitting module side.
On the side of the light receiving module, the light transmitted from the optical fiber plug is condensed by the lens and is incident on the light receiving element.
【０００３】図２により従来の発光側のＳＭＤ型光素子
モジュールの製造方法について説明する。図２（ａ）は
発光モジュールの断面図、図２（ｂ）はベース基板に発
光素子であるＬＥＤをＤＢ、ＷＢした状態を示す断面
図、図２（ｃ）は成形型を載置する状態を示す断面図、
図２（ｄ）は成形型内に封止樹脂を充填した状態を示す
断面図である。A conventional method of manufacturing a light emitting side SMD type optical element module will be described with reference to FIG. 2A is a sectional view of the light emitting module, FIG. 2B is a sectional view showing a state in which LEDs, which are light emitting elements, are DB and WB mounted on a base substrate, and FIG. 2C is a state in which a molding die is placed. Cross section showing
FIG. 2D is a sectional view showing a state in which the molding resin is filled with the sealing resin.
【０００４】図２（ａ）において、発光モジュール１
は、ベース基板２上に 発光素子として発光ダイオード
（ＬＥＤ）３又はレーザー（ＬＤ）と、ＬＥＤ３を制御
するための図示しないドライブＩＣがＤＢ実装され、ベ
ース基板１上のパターンと金属細線４でＷＢされてい
る。前記ＬＥＤ３及び金属細線４を保護するために透光
性の封止樹脂５で封止されている。この透光性の封止樹
脂５の表面には、ＬＥＤ３の正面側に位置してＬＥＤ３
から出射された光を集光する半球状のレンズ６が後述す
る成形型を用いて同時に形成されている。In FIG. 2A, the light emitting module 1
Is mounted on the base substrate 2 with a light emitting diode (LED) 3 or a laser (LD) as a light emitting element, and a drive IC (not shown) for controlling the LED 3 mounted on a DB. Has been done. In order to protect the LED 3 and the thin metal wire 4, the LED 3 and the metal thin wire 4 are sealed with a light-transmitting sealing resin 5. On the surface of the translucent sealing resin 5, the LED 3 is located on the front side of the LED 3.
A hemispherical lens 6 that collects the light emitted from is simultaneously formed by using a molding die described later.
【０００５】前記発光モジュールの製造方法について説
明する。図２（ｂ）において、集合ベース基板２Ａの所
定の位置に、例えばダイボンダーマシンを使用し発光素
子としてＬＥＤ３を所定のピッチでダイボンドする。次
に、ベース基板２Ａ上のパターンと金属細線４でＷＢし
て導通を行う。A method of manufacturing the light emitting module will be described. In FIG. 2B, for example, a die bonder machine is used to die-bond LEDs 3 as light emitting elements at a predetermined pitch on a predetermined position of the collective base substrate 2A. Then, the pattern on the base substrate 2A and the thin metal wires 4 are WB'd to conduct electricity.
【０００６】図２（ｃ）において、前記ＬＥＤ３と金属
細線４を保護するために、封止樹脂５とレンズ６を一体
化した形状をした成形型７と前記集合ベース基板２Ａと
の位置合わせを行う。In FIG. 2C, in order to protect the LED 3 and the thin metal wire 4, the mold 7 having a shape in which the sealing resin 5 and the lens 6 are integrated and the collective base substrate 2A are aligned with each other. To do.
【０００７】図２（ｄ）において、前記集合ベース基板
２Ａと成形型７との間に透光性の封止樹脂５を充填す
る。所定の時間加熱し、封止樹脂を固化させる。その
後、図２（ｅ）にて型を脱型した後、カットラインＸに
沿って切断して図２（ａ）に示すようなレンズ付きの単
個の発光モジュール１が完成される。In FIG. 2D, a translucent sealing resin 5 is filled between the collective base substrate 2A and the molding die 7. The sealing resin is solidified by heating for a predetermined time. After that, the mold is released from the mold in FIG. 2E and then cut along the cut line X to complete a single light emitting module 1 with a lens as shown in FIG. 2A.
【０００８】以上、発光モジュール側について説明した
が、受光モジュール側についても同様であるので説明は
省略する。Although the light emitting module side has been described above, the same applies to the light receiving module side, and therefore description thereof will be omitted.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、前述し
たＳＭＤ型光素子モジュールの製造する際、成形型に配
設するレンズのピッチ誤差や集合ベース基板と成形型の
合わせ誤差がある。また、集合ベース基板への光素子の
実装誤差などを加味すると、光素子の発光効率及び受光
効率のポイントとなるレンズセンターと光素子の位置ず
れが大きく、例えば最大１００μｍレベルになる。この
ことは、光素子の光伝達効率を低下させ、製品の品質を
低下させてしまうと言う問題がある。However, when manufacturing the above-mentioned SMD type optical element module, there are pitch errors of the lenses arranged in the molding die and alignment errors between the collective base substrate and the molding die. In addition, when the mounting error of the optical element on the collective base substrate is taken into consideration, the positional deviation between the lens center and the optical element, which is the point of the light emitting efficiency and the light receiving efficiency of the optical element, is large, for example, up to 100 μm level. This causes a problem that the light transmission efficiency of the optical element is lowered and the product quality is lowered.
【００１０】本発明は上記従来の課題に鑑みなされたも
のであり、その目的は、光素子とレンズセンターとの位
置精度が向上し、光伝達効率が改善されたレンズ付きの
ＳＭＤ型光素子モジュールの製造方法を提供するもので
ある。The present invention has been made in view of the above conventional problems, and an object thereof is an SMD type optical element module with a lens in which the positional accuracy between the optical element and the lens center is improved and the light transmission efficiency is improved. The present invention provides a method for manufacturing the same.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するため
に、本発明におけるＳＭＤ型光素子モジュールの製造方
法は、光素子を集合ベース基板上の所定位置に実装し、
その上面を透光性樹脂で封止し、外部との電気的接続の
ための電極端子を備えたレンズ付きのＳＭＤ型光素子モ
ジュールの製造方法において、前記光素子を集合ベース
基板上の所定位置にダイボンド実装し、金属細線でワイ
ヤボンィングした後、前記集合ベース基板上に成形型な
どを使用して位置決めし、透光性の封止樹脂を充填して
フラットな樹脂面を成形し、前記光素子の位置データに
もとづき前記フラットな樹脂面に予め別体で成形したレ
ンズを接合した後、所定のカットラインに沿って切断し
単個の光素子モジュールにしたことを特徴とするもので
ある。In order to achieve the above object, a method of manufacturing an SMD type optical element module according to the present invention comprises mounting an optical element at a predetermined position on a collective base substrate,
In a method of manufacturing an SMD type optical element module with a lens, the upper surface of which is sealed with a translucent resin and provided with electrode terminals for electrical connection to the outside, the optical element is provided at a predetermined position on a collective base substrate. After die-bonding and wire-bonding with a thin metal wire, position it by using a molding die or the like on the aggregate base substrate, fill a transparent sealing resin and mold a flat resin surface, A single optical element module is characterized in that after a lens molded separately as a separate body is bonded to the flat resin surface based on the position data of the optical element, it is cut along a predetermined cut line to form a single optical element module. .
【００１２】また、前記光素子は発光素子であることを
特徴とするものである。Further, the optical element is a light emitting element.
【００１３】また、前記光素子は受光素子であることを
特徴とするものである。The optical element is a light receiving element.
【００１４】また、前記光素子の位置データは、光素子
の実装に使用するダイボンダー素子実装時と同じ位置デ
ータを用いることを特徴とするものである。。Further, as the position data of the optical element, the same position data as when the die bonder element used for mounting the optical element is mounted is used. .
【００１５】また、前記レンズとフラットな樹脂面との
接合は、前記透光性の封止樹脂と同じ屈折率を有する接
着剤樹脂を使用したことを特徴とするものである。Further, the bonding between the lens and the flat resin surface is characterized by using an adhesive resin having the same refractive index as the translucent sealing resin.
【００１６】[0016]
【発明の実施の形態】以下、図面に基づいて本発明にお
けるＳＭＤ型光素子モジュールの製造方法について説明
する。図１は、本発明の実施の形態であるＳＭＤ型光素
子モジュールの製造方法に係わり、図１（ａ）はベース
基板に発光素子であるＬＥＤをＤＢ、ＷＢした状態を示
す断面図、図１（ｂ）はベース基板上に成形型を載置し
成形型内に封止樹脂を充填した状態を示す断面図、図１
（ｃ）は封止樹脂のフラットな樹脂面にレンズを接合し
た状態を示す断面図、図１（ｄ）はカットラインに沿っ
て切断した単個の発光モジュールの断面図である。図に
おいて、従来技術と同一部材は同一符号で示す。BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing an SMD type optical element module according to the present invention will be described below with reference to the drawings. 1 relates to a method of manufacturing an SMD type optical element module according to an embodiment of the present invention, and FIG. 1A is a sectional view showing a state in which LEDs, which are light emitting elements, are DB and WB on a base substrate. FIG. 1B is a cross-sectional view showing a state in which the molding die is placed on the base substrate and the molding resin is filled in the molding die;
FIG. 1C is a cross-sectional view showing a state where a lens is bonded to a flat resin surface of a sealing resin, and FIG. 1D is a cross-sectional view of a single light emitting module cut along a cut line. In the drawings, the same members as those in the conventional technique are designated by the same reference numerals.
【００１７】図１（ａ）において、従来と同様に、集合
ベース基板２Ａの所定の位置に、例えばダイボンダーマ
シンを使用してＬＥＤ３をダイボンドし、ベース基板２
Ａ上のパターンと金属細線４でＷＢして導通を行う。In FIG. 1A, the LED 3 is die-bonded to a predetermined position of the collective base substrate 2A, for example, using a die bonder machine, as in the conventional case, and the base substrate 2 is formed.
WB is conducted between the pattern on A and the thin metal wire 4 to conduct electricity.
【００１８】図１（ｂ）において、前記ＬＥＤ３と金属
細線４を保護するために、上面がフラット形状にした封
止樹脂部を有する成形型７Ａと前記集合ベース基板２Ａ
との位置合わせを行う。その後、前記集合ベース基板２
Ａと成形型７Ａとの間に透光性の封止樹脂５Ａを充填
し、加熱・硬化した後脱型する。In FIG. 1B, in order to protect the LED 3 and the thin metal wire 4, a molding die 7A having a sealing resin portion having a flat upper surface and the collective base substrate 2A.
Align with. Then, the collective base substrate 2
A translucent sealing resin 5A is filled between A and the molding die 7A, heated and cured, and then released from the mold.
【００１９】図１（ｃ）において、前記ＬＥＤ３をダイ
ボンダーマシンを使用して実装した時と同じ位置データ
を用いて、予め別体で成形したレンズ６Ａを前記封止樹
脂５Ａのフラットな樹脂面５Ｂに前記封止樹脂５Ａと同
じ屈折率を有する接着剤樹脂８を使用して接合する。そ
の後、カットラインＸに沿って切断して図１（ｄ）に示
すようなレンズ付きの単個の発光モジュール１Ａが完成
される。In FIG. 1 (c), the lens 6A formed in advance as a separate body is used as a flat resin surface 5B of the sealing resin 5A by using the same position data as when the LED 3 is mounted using a die bonder machine. The adhesive resin 8 having the same refractive index as that of the sealing resin 5A is used for bonding. After that, by cutting along the cut line X, a single light emitting module 1A with a lens as shown in FIG. 1D is completed.
【００２０】上記した構成により製造された発光モジュ
ール１Ａは、ＬＥＤ３とレンズ６Ａのセンターとの位置
精度は、ダイボンダーマシンの精度になり、例えば１０
μｍレベルが実現できる。また、封止樹脂５Ａとレンズ
６Ａとの接合に透光性の封止樹脂５Ａと同じ屈折率を有
する接着剤樹脂８を使用するので、光学的特性の損失を
防ぐことができる。In the light emitting module 1A manufactured by the above-described structure, the positional accuracy of the LED 3 and the center of the lens 6A is the accuracy of the die bonder machine, for example, 10
The μm level can be realized. Further, since the adhesive resin 8 having the same refractive index as the translucent sealing resin 5A is used for joining the sealing resin 5A and the lens 6A, it is possible to prevent loss of optical characteristics.
【００２１】以上、発光モジュール側について説明した
が、受光モジュール側についても同様であるので説明は
省略する。Although the light emitting module side has been described above, the same applies to the light receiving module side, and a description thereof will be omitted.
【００２２】[0022]
【発明の効果】以上説明したように、ＳＭＤ型光素子モ
ジュールの製造方法は、ベース基板上に実装し光素子を
透光性の封止樹脂で成形したフラットな樹脂面に、予め
別体で成形したレンズを光素子の位置データにもとづ
き、封止樹脂と同じ屈折率を有する接着剤樹脂を使用し
接合することにより、光素子とレンズセンターとの位置
精度は著しく向上し、光伝達効率が改善されたＳＭＤ型
光素子モジュールの製造方法を提供することが可能であ
る。As described above, according to the method of manufacturing the SMD type optical element module, the optical element is mounted on the base substrate and the optical element is molded with the translucent sealing resin. By bonding the molded lens based on the position data of the optical element using an adhesive resin that has the same refractive index as the sealing resin, the positional accuracy between the optical element and the lens center is significantly improved, and the light transmission efficiency is improved. It is possible to provide an improved SMD type optical element module manufacturing method.
【００２３】本発明は、ＳＭＤ型光素子モジュールのみ
ならず、レンズを有する光関係のＳＭＤモジュール全般
に適用できる。The present invention can be applied not only to the SMD type optical element module but also to general SMD modules related to light having a lens.
【図１】本発明の実施の形態であるＳＭＤ型光素子モジ
ュールの製造方法に係わり、図１（ａ）はベース基板に
ＬＥＤをＤＢ、ＷＢした状態を示す断面図、図１（ｂ）
はベース基板上に成形型を載置し成形型内に封止樹脂を
充填した状態を示す断面図、図１（ｃ）は封止樹脂のフ
ラット面にレンズを接合した状態を示す断面図、図１
（ｄ）はカットラインに沿って切断した単個の発光モジ
ュールの断面図である。1 relates to a method for manufacturing an SMD type optical element module according to an embodiment of the present invention, FIG. 1 (a) is a cross-sectional view showing a state in which LEDs are DB and WB on a base substrate, FIG. 1 (b).
Is a cross-sectional view showing a state where a molding die is placed on a base substrate and the molding resin is filled in the molding die, and FIG. 1C is a cross-sectional view showing a state where a lens is bonded to a flat surface of the molding resin. Figure 1
(D) is sectional drawing of the single light emitting module cut | disconnected along the cut line.
【図２】従来の発光側のＳＭＤ型光素子モジュールの製
造方法に係わり、図２（ａ）は発光モジュールの断面
図、図２（ｂ）はベース基板にＬＥＤをＤＢ、ＷＢした
状態を示す断面図、図２（ｃ）は成形型を載置する状態
を示す断面図、図２（ｄ）は成形型内に封止樹脂を充填
した状態を示す断面図、図２（ｅ）は樹脂をキュアし型
を脱型した後、カットラインに沿って切断した発光モジ
ュールの断面図である。2A and 2B relate to a conventional method for manufacturing an SMD type optical element module on the light emitting side, FIG. 2A shows a sectional view of the light emitting module, and FIG. 2B shows a state in which LEDs are DB and WB on a base substrate. Sectional view, FIG. 2 (c) is a sectional view showing a state in which a molding die is placed, FIG. 2 (d) is a sectional view showing a state in which a molding resin is filled with a sealing resin, and FIG. 2 (e) is a resin FIG. 3 is a cross-sectional view of a light emitting module, which is cut along a cut line after the mold is cured and the mold is released from the mold.
【符号の説明】 １Ａ 発光モジュール ２ ベース基板 ２Ａ 集合ベース基板 ３ ＬＥＤ ４ 金属細線 ５Ａ 封止樹脂 ５Ｂ フラットな樹脂面 ６Ａ レンズ ７Ａ 成形型 ８ 接着剤樹脂 Ｘ カットライン[Explanation of symbols] 1A light emitting module 2 base substrate 2A Assembly base substrate 3 LED 4 thin metal wires 5A sealing resin 5B Flat resin surface 6A lens 7A Mold 8 Adhesive resin X cut line
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4M109 AA02 BA04 CA21 EC11 EE11 GA01 5F041 AA39 DA01 DA07 DA31 DA43 EE11 EE15 5F061 AA02 BA04 CA21 CB13 FA01 5F088 EA02 JA01 JA06 JA10 JA12 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 4M109 AA02 BA04 CA21 EC11 EE11 GA01 5F041 AA39 DA01 DA07 DA31 DA43 EE11 EE15 5F061 AA02 BA04 CA21 CB13 FA01 5F088 EA02 JA01 JA06 JA10 JA12
Claims (5)
実装し、その上面を透光性樹脂で封止し、外部との電気
的接続のための電極端子を備えたレンズ付きのＳＭＤ型
光素子モジュールの製造方法において、前記光素子を集
合ベース基板上の所定位置にダイボンド実装し、金属細
線でワイヤボンィングした後、前記集合ベース基板上に
成形型などを使用して位置決めし、透光性の封止樹脂を
充填してフラットな樹脂面を成形し、前記光素子の位置
データにもとづき前記フラットな樹脂面に予め別体で成
形したレンズを接合した後、所定のカットラインに沿っ
て切断し単個の光素子モジュールにしたことを特徴とす
るＳＭＤ型光素子モジュールの製造方法。1. An SMD type with a lens, in which an optical element is mounted at a predetermined position on a collective base substrate, an upper surface thereof is sealed with a translucent resin, and an electrode terminal for electrical connection with the outside is provided. In the method of manufacturing an optical element module, the optical element is die-bonded at a predetermined position on the collective base substrate, wire-bonded with a fine metal wire, and then positioned on the collective base substrate using a molding die or the like. A flat resin surface is molded by filling it with a light-sealing resin, and a flat lens surface is attached to the flat resin surface based on the position data of the optical element. A method for manufacturing an SMD type optical element module, which is characterized in that a single optical element module is cut by cutting.
とするＳＭＤ型光素子モジュールの製造方法。2. The method for manufacturing an SMD type optical element module, wherein the optical element is a light emitting element.
とするＳＭＤ型光素子モジュールの製造方法。3. The method for manufacturing an SMD type optical element module, wherein the optical element is a light receiving element.
装に使用するダイボンダー素子実装時と同じ位置データ
を用いることを特徴とする請求項１記載のＳＭＤ型光素
子モジュールの製造方法。4. The method of manufacturing an SMD type optical element module according to claim 1, wherein the positional data of the optical element is the same positional data as when mounting the die bonder element used for mounting the optical element.
は、前記透光性の封止樹脂と同じ屈折率を有する接着剤
樹脂を使用したことを特徴とする請求項１記載のＳＭＤ
型光素子モジュールの製造方法。5. The SMD according to claim 1, wherein an adhesive resin having the same refractive index as that of the translucent sealing resin is used for joining the lens and the flat resin surface.
Type optical element module manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001188921A JP2003008065A (en) | 2001-06-21 | 2001-06-21 | Method for manufacturing smd type optical element module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001188921A JP2003008065A (en) | 2001-06-21 | 2001-06-21 | Method for manufacturing smd type optical element module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003008065A true JP2003008065A (en) | 2003-01-10 |
Family
ID=19027924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001188921A Pending JP2003008065A (en) | 2001-06-21 | 2001-06-21 | Method for manufacturing smd type optical element module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003008065A (en) |
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| WO2005056269A2 (en) * | 2003-12-09 | 2005-06-23 | G.L.I. Global Light Industries Gmbh | Method for the production of light-emitting semiconductor diodes on a printed circuit board, and illumination units comprising an integrated circuit board |
| JP2007329467A (en) * | 2006-05-10 | 2007-12-20 | Hitachi Chem Co Ltd | Optical semiconductor device and its manufacturing method |
| JP2009200172A (en) * | 2008-02-20 | 2009-09-03 | Sharp Corp | Manufacturing method of optical semiconductor device, and manufacturing device of optical semiconductor device |
| WO2009145376A1 (en) * | 2008-05-30 | 2009-12-03 | Industry-Academic Cooperation Foundation, Yonsei University | Light emitting diode module having lens and manufacturing method thereof |
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| WO2005056269A3 (en) * | 2003-12-09 | 2005-11-10 | G L I Global Light Ind Gmbh | Method for the production of light-emitting semiconductor diodes on a printed circuit board, and illumination units comprising an integrated circuit board |
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| JP2011029665A (en) * | 2006-01-10 | 2011-02-10 | Samsung Led Co Ltd | Light-emitting chip, led package, backlight for liquid crystal display, liquid crystal display, and illumination |
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| US8785953B2 (en) | 2011-03-25 | 2014-07-22 | Samsung Electronics Co., Ltd. | Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof |
| US9153759B2 (en) | 2011-03-25 | 2015-10-06 | Samsung Electronics Co., Ltd. | Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof |
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