KR101406067B1 - Light emitting device and manufacturing method thereof, and light emitting device module and manufacturing method thereof - Google Patents

Abstract

A manufacturing method of a light emitting device and a manufacturing method of a light emitting device module are disclosed. A method of manufacturing a light emitting device according to an embodiment of the present invention includes the steps of: preparing a plurality of light emitting elements; preparing a preliminary phosphor sheet including a plurality of mounting regions for mounting the light emitting elements; applying an adhesive in the preliminary phosphor sheet A step of mounting the light emitting element in each of the plurality of mounting areas, and a step of cutting the preliminary phosphor sheet in which the light emitting element is mounted, in chip units.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, a light emitting device, a light emitting device,

Embodiments of the present invention relate to a light emitting device, a method of manufacturing the same, a light emitting device module, and a method of manufacturing the light emitting device module, and more particularly, to a method of manufacturing a light emitting device including a phosphor sheet having uniform wavelength conversion characteristics, To a light emitting device module and a manufacturing method thereof.

A light emitting device is a semiconductor device that converts electrical energy into light energy, and is made of a compound semiconductor that generates light having a specific wavelength according to an energy band gap. In addition, the light emitting device has been widely used from a display field such as a mobile display, a computer monitor, and the like to a back light unit (BLU) for LCD to an illumination field.

Generally, a phosphor is coated on a light emitting device to produce a light emitting device that emits light having a desired wavelength. For example, a white light emitting device having a convex hemispherical surface was prepared by disposing a phosphor resin on the light emitting device.

As another example, a mask on which at least one light emitting device is mounted is exposed with a mask on which a light emitting device is exposed, the phosphor resin is printed, and then the mask is removed to produce a white light emitting device having a rectangular parallelepiped surface.

In the case of manufacturing the light emitting device as described above, uniform white light can not be realized due to uneven application of the phosphor resin. If the non-uniform application of the fluorescent resin is severe, the color scattering is large and the light emitting device can not be used for the product, thus affecting the overall yield.

On the other hand, in the case of applying the phosphor resin by the dispensing method, since the process proceeds in units of chips, the production amount per unit time is remarkably decreased. In addition, when printing a phosphor with a mask, there is a problem that the shape of the phosphor resin is deformed during the mask removal process.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a light emitting device having uniform wavelength conversion characteristics and low color dispersion by using a preliminary phosphor sheet, .

Another object of the present invention is to provide a light emitting device capable of increasing the amount of light emitting element production per unit time by using a preliminary phosphor sheet capable of mounting a plurality of light emitting elements, a manufacturing method thereof, a light emitting element module and a manufacturing method thereof .

Another object of the present invention is to provide a light emitting element and a method of manufacturing the light emitting element capable of securing the bonding force and the wire bonding space of the preliminary phosphor sheet by forming the first bump and the second bump composed of two stages on the light emitting element, And a method for producing the same.

A method of manufacturing a light emitting device according to an embodiment of the present invention includes the steps of manufacturing a plurality of light emitting devices, fabricating a preliminary phosphor sheet including a plurality of mounting regions for mounting the light emitting devices, A step of mounting the light emitting element in each of the plurality of mounting areas, and a step of cutting the preliminary phosphor sheet on which the light emitting element is mounted, in units of chips.

A light emitting device according to an embodiment of the present invention includes a mounting region, a phosphor sheet including a plurality of supporters on a bottom surface of the mounting region, and a light emitting surface bonded within the mounting region, And a light-emitting element supported.

A method of fabricating a light emitting device module according to an embodiment of the present invention includes the steps of fabricating a plurality of light emitting devices, fabricating a preliminary phosphor sheet including a plurality of mounting areas for mounting the light emitting devices, A step of mounting the light emitting element on each of the plurality of mounting areas, cutting the preliminary phosphor sheet on which the light emitting element is mounted in a chip unit, and mounting the cut chip on a substrate .

A light emitting device module according to an embodiment of the present invention includes a substrate including a circuit pattern, a phosphor sheet including a mounting region and including a plurality of supporters on a bottom surface of the mounting region, A light emitting element supported by the plurality of supporters and mounted on the substrate together with the phosphor sheet, and a lens portion formed on the phosphor sheet.

According to the embodiments of the present invention, by using the preliminary phosphor sheet, it is possible to manufacture a light emitting device capable of uniform wavelength conversion and having low color scattering.

In addition, according to the embodiments of the present invention, a plurality of light emitting devices are mounted on a preliminary phosphor sheet, and then the process is performed in a step of cutting in a chip unit, whereby the production amount of the light emitting device per unit time can be increased, The shape and positional alignment between the element and the preliminary phosphor sheet can be increased.

Further, according to the embodiments of the present invention, the bonding strength of the preliminary phosphor sheet can be improved and the wire bonding space can be secured by forming the first bump and the second bump having two stages on the light emitting element.

1 and 2 are views showing a preliminary phosphor sheet according to an embodiment of the present invention.
FIGS. 3 and 4 are views showing a process of manufacturing a preliminary phosphor sheet according to an embodiment of the present invention.
5 and 6 are views illustrating a process of manufacturing a preliminary phosphor sheet according to another embodiment of the present invention.
Figs. 7 and 8 are views showing various types of supports included in the preliminary phosphor sheet. Fig.
9 to 12 are views showing a method of manufacturing a light emitting device according to an embodiment of the present invention.
13 is a view showing a light emitting device manufactured according to another embodiment of the present invention.
14 and 15 are views for explaining a method of manufacturing a light emitting device module according to an embodiment of the present invention.
16 to 21 are views showing a method of manufacturing a light emitting device according to another embodiment of the present invention.
22 to 23 are views for explaining a method of manufacturing a light emitting device module according to another embodiment of the present invention.
24 to 25 are views for explaining a method of manufacturing a light emitting device module according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. Also, terminologies used herein are terms used to properly represent preferred embodiments of the present invention, which may vary depending on the user, intent of the operator, or custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification. Like reference symbols in the drawings denote like elements.

1 and 2 are views showing a preliminary phosphor sheet according to an embodiment of the present invention. Specifically, FIG. 1 is a top plan view of the preliminary phosphor sheet, and FIG. 2 is a cross-sectional view taken along line A-A 'of the preliminary phosphor sheet shown in FIG.

Referring to FIGS. 1 and 2, the preliminary phosphor sheet 100 includes a plurality of mounting regions 111 for mounting light emitting elements. The plurality of mounting regions 111 may have a groove structure capable of accommodating up to the side surface of the light emitting device.

The first supporter 111a, the second supporter 111b and the third supporter 111c are positioned on the bottom surface of the plurality of mounting areas 111. [

The first to third supporters 111a, 111b and 111c represent the optimum coating thickness of the adhesive to be applied in each mounting region 111 and serve to support the light emitting element to be mounted in each mounting region 111. [ At this time, it is preferable that the first to third supporters 111a, 111b, and 111c are positioned so as to balance to support the light emitting device.

2, the first through third supporters 111a, 111b, and 111c have a structure protruding from the bottom surface of each of the mounting regions 111. In addition, The protruded structure allows the optimum coating thickness of the adhesive to be known, so that it is easy to apply the adhesive and deterioration of optical characteristics and defective devices due to overflow of the adhesive can be prevented.

FIGS. 3 and 4 are views showing a process of manufacturing a preliminary phosphor sheet according to an embodiment of the present invention.

The method of manufacturing the preliminary phosphor sheet 100 shown in Figs. 1 and 2 is a method of manufacturing a phosphor resin 10 by mixing phosphor particles and a transparent resin, and then the phosphor resin 10 is applied to the first mold 20 Injecting process.

The first mold 20 includes a rectangular receiving portion corresponding to the appearance of the preliminary phosphor sheet 100. The phosphor resin 10 can be injected into this accommodating portion.

4, the manufacturing method of the preliminary phosphor sheet 100 includes a step of pressing the phosphor resin 10 by using the second mold 30.

Specifically, the second mold 30 has a size that can be accommodated in the receiving portion of the first mold 20, and has a smaller size (circumference) than the first mold 20.

Further, the pressing surface of the second mold 30 may have a structure corresponding to the preliminary phosphor sheet 100. Specifically, the pressing surface of the second mold 30 includes a plurality of protruding portions 31 for forming a plurality of mounting regions 111, first to third supporters 111a, 111b and 111c A plurality of first grooves 31a for forming the phosphor resin 10, and a plurality of second grooves 32 for dividing the phosphor resin 10 in the mounting area unit.

When the second mold 30 is received in the first mold 20 and the pressing surface presses the phosphor resin 10, the phosphor resin 10 is held between the first mold 20 and the second mold 30 Move to space. In this state, partial curing of the phosphor resin 10 can proceed.

4, after the phosphor resin 10 injected into the first mold 20 is pressed by the second mold 30, the first mold 20 and the second mold 30 are removed The preliminary phosphor sheet 100 shown in Figs. 1 and 2 can be manufactured.

5 and 6 are views illustrating a process of manufacturing a preliminary phosphor sheet according to another embodiment of the present invention.

Referring to FIG. 5, the method of manufacturing the preliminary phosphor sheet includes pressing the phosphor resin 200 injected into the first mold 20 using the second mold 50.

The pressing surface of the second mold 50 includes a plurality of protrusions 51, a plurality of first grooves 51a and a plurality of second grooves 52 in the same manner as the second mold 50 shown in FIG. can do.

However, in the second mold 50, the plurality of protrusions 51 may include the concavo-convex pattern P. Therefore, when the preliminary phosphor sheet is manufactured by using the second mold 50 shown in Fig. 5, the irregular pattern P can be directly transferred to the preliminary phosphor sheet.

Thereafter, when the first mold 20 and the second mold 50 are removed from the phosphor sheet 200, a preliminary phosphor sheet 200 'as shown in FIG. 6 can be obtained. At this time, the preliminary phosphor sheet 200 'includes a plurality of mounting regions 210 and a plurality of supports 220 located on the bottom surface of the plurality of mounting regions 210. In addition, the plurality of mounting regions 210 may include a concave-convex pattern on the bottom surface thereof.

Figs. 7 and 8 are views showing various types of supports included in the preliminary phosphor sheet. Fig. The preliminary phosphor sheet 100 ', 300 shown in FIGS. 7 and 8 is for illustrating the support, and shows only one mounting region 100', 300.

The preliminary fluorescent material sheet 100 'shown in Fig. 7 can be a unit preliminary fluorescent material sheet obtained by cutting the preliminary fluorescent material sheet 100 shown in Fig. 1 on a chip basis.

Referring to FIG. 7, a mounting region 111 of the light emitting device and a first support 111a, a second support 111b, and a third support 111c may be included.

The first, second, and third supports 111a, 111b, and 111c are spaced apart from each other by a predetermined distance from the bottom surface center point P1 of the mounting area 111, The support 111b, the third support 111c, the third support 111c, and the first support 111a can be positioned in a triangular shape. In this case, the first to third supports 111a, 111b, and 111c can form the vertices of the triangle.

The first through third supports 111a, 111b and 111c shown in FIGS. 1 and 7 may be cylindrical. However, the shapes of the first to third supports 111a, 111b, and 111c are not limited thereto, and may be a quadrangular prism shape or other shapes.

The first to third supports 111a, 111b and 111c may have a width (or diameter), a length, and a height in units of micrometers (占 퐉). For example, the first to third supports 111a, 111b, and 111c may have a diameter, a length, and a height of 10 mu m. However, the diameter, length, and height of the first to third supports 111a, 111b, and 111c are not limited to the above values, and may vary depending on the size of the mounting area 111 and the number of supports.

8, the preliminary phosphor sheet 300 includes a mounting region 310 of the light emitting device, a first support 311, a second support 312, a third support 313, a fourth support 314, . ≪ / RTI >

The first to fourth supports 311, 312, 313 and 314 are spaced a certain distance from the center P2 of the bottom surface of the mounting region 310 and are located adjacent to the respective edges of the mounting region 310 .

The first to fourth supports 311, 312, 313 and 314 may be arranged in a line symmetry or point symmetry with respect to the center P2 of the bottom surface of the mounting area 310. In the case where the first to fourth supports 311, 312, 313 and 314 have a line symmetry or a point symmetrical structure, the light emitting element to be mounted in the mounting region 310 can be more stably supported, Can be mounted.

The first to fourth supports 311, 312, 313 and 314 may include a first support 311 to a second support 312, a second support 312 to a third support 313, 313, a fourth support 314, a fourth support 314, and a first support 311, the first support 311 and the second support 311 may be arranged in a rectangular shape.

The first to fourth supports 311, 312, 313, and 314) may have a width, a length, and a height in units of micrometers (占 퐉). The height may vary depending on the appropriate coating thickness of the adhesive to be applied in the mounting region 310. [

9 to 12 are views for explaining a method of manufacturing a light emitting device according to an embodiment of the present invention. 9 to 12, the preliminary phosphor sheet 100 shown in Fig. 2 is used for convenience of explanation.

Referring to FIG. 9, a method of manufacturing a light emitting device includes a step of applying an adhesive 400 in the preliminary fluorescent material sheet 100, when the preliminary fluorescent material sheet 100 is provided as shown in FIG.

The adhesive 400 may be applied only to the heights of the first to third supporters 111a, 111b, and 111c provided in the plurality of mounting areas 111. [ As described above, only the appropriate amount of the adhesive 400 can be applied using the first to third supporters 111a, 111b, and 111c. Accordingly, it is possible to prevent the adhesive force from being lowered due to the insufficient amount of the adhesive 400, and to prevent the deterioration of the optical characteristics due to the increase in the thickness of the adhesive 400.

Referring to FIG. 10, a method of manufacturing a light emitting device includes a process of mounting a light emitting device 500 on a plurality of mounting regions 111. In this embodiment, the light emitting device 500 may have a flip chip structure including a light emitting surface on one surface and an electrode on the surface opposite to the light emitting surface. The light emitting surface of the light emitting element 500 is mounted on each of the plurality of mounting regions 111. [ At this time, the bump 510 may be formed on the electrode of the light emitting device 500 in advance.

11, the adhesive 400 is partially cured for bonding between the light emitting element 500 and the preliminary phosphor sheet 100 in a state that the light emitting element 500 is mounted on the plurality of mounting areas 111. [ . ≪ / RTI >

Referring to FIG. 12, the manufacturing method of the light emitting device includes cutting the preliminary phosphor sheet 100 shown in FIG. 11 on a chip basis. The cut chip may be a light emitting device 500 having a unit preliminary phosphor sheet 100 'attached thereto.

As described above, the light-emitting device 500 can have a uniform wavelength conversion characteristic as a whole by using the unit spare phosphor sheet 100 'having a uniform thickness. The unit spare phosphor sheet 100 'may have a uniform thickness over the light emitting surface and the side surface of the light emitting element 500, and may preferably have a thickness of 5 μm or less. Accordingly, in realizing white light, the light emitting device 500 having the unit spare phosphor sheet 100 'attached thereto can improve the color reproducibility and reduce color scattering.

Further, since the process of forming the unit spare phosphor sheet 100 'for a plurality of light emitting elements is not performed on a chip-by-chip basis, but the process proceeds to a sheet level of a large area, the production amount per unit time can be increased.

It is also possible to increase the shape and positional alignment of the light emitting element 500 and the unit spare phosphor sheet 100 'by proceeding in the order of cutting after mounting the light emitting element 500 on the preliminary phosphor sheet 100 have.

13 is a view showing a light emitting device manufactured according to another embodiment of the present invention.

As shown in FIG. 6, a plurality of light emitting devices 500 may be mounted on a preliminary phosphor sheet 200 'including a concavo-convex pattern P, and then cut into chip units. The cut chip may be a light emitting device 500 to which the unit spare phosphor sheet 200 'is attached.

12 and 13, the light emitting surface of the light emitting device 500 having a flip chip structure is disposed in the mounting regions 111 and 210 of the preliminary fluorescent substance sheets 100 and 200 or the unit spare fluorescent substance sheets 100 'and 200' The embodiments to which the invention is applied have been described. However, a light emitting element having another structure is also applicable.

14 and 15 are views for explaining a method of manufacturing a light emitting device module according to an embodiment of the present invention.

Referring to FIG. 14, a method of fabricating a light emitting device module includes flip chip bonding a light emitting device 500 manufactured by the method shown in FIGS. 9 to 12 onto a substrate 120. The substrate 120 includes a first circuit pattern 121 and a second circuit pattern 122 connected to an external circuit or an external power source. Therefore, the light emitting device 500 can be flip-chip bonded on the substrate 120 so that the electrode provided in the light emitting device 500 faces the first circuit pattern 121 and the second circuit pattern 122. [

As shown in FIG. 12, the unit spare phosphor sheet 100 'may be attached to the light emitting surface of the light emitting device 500.

Then, as shown in FIG. 15, a transparent resin may be coated on the light emitting device 500 and the unit spare phosphor sheet 100 'to form the lens unit 130.

16 to 21 are views showing a method of manufacturing a light emitting device according to another embodiment of the present invention.

16 is a view showing a manufacturing process for a single chip light emitting device 600. FIG.

Referring to FIG. 16, the light emitting device 600 has a vertical structure, and includes a first electrode 611 and a second electrode 612 disposed on one surface including a light emitting surface. The first bumps 621 and 622 are formed on the first electrode 611 and the second electrode 612 in the manufacturing process of the light emitting device 600 according to this embodiment. The first bumps 621 and 622 may be formed by plating a metal material, and may have a cylindrical shape.

The first bumps 621 and 622 may be formed in a first size. The first size may include at least one of a first width (w ₁ ), a first length, and a first height (h ₁ ). In this embodiment, the first bumps 621 and 622 have a cylindrical shape, and the first width w ₁ and the first length may be the same.

17 is a view showing a preliminary phosphor sheet according to another embodiment of the present invention.

Since the preliminary phosphor sheet 100 shown in Figs. 1 and 2 mounts the light emitting element having the flip chip structure, a configuration for exposing the electrodes is not required. However, since the surface including the electrode is bonded to the mounting region of the preliminary phosphor sheet, a structure for exposing the electrode is required for the light-emitting element having the epitaxial structure or the vertical structure. Thus, Fig. 17 shows a preliminary phosphor sheet for mounting the light emitting element of the epitaxial structure or the vertical structure.

The preliminary phosphor sheet 700 shown in Fig. 17 includes one mounting region 710 for mounting the light emitting element 600 shown in Fig. In FIG. 17, the preliminary phosphor sheet 700 includes one mounting region 710, but this is for convenience of explanation, and the actual preliminary phosphor sheet may include a plurality of mounting regions.

The preliminary phosphor sheet 700 includes bump accommodating portions 711 and 712 and supporters 711a and 712a on the bottom surface of the mounting region 710. [

The bump receiving portions 711 and 712 are for accommodating the first bumps 621 and 622 provided in the light emitting element 600 and may have a cylindrical shape corresponding to the first bumps 621 and 622.

It is preferable that the bump accommodating portions 711 and 712 are slightly larger than the first widths of the first bumps 621 and 622 for easy accommodating of the first bumps 621 and 622, 622 are slightly smaller than the first height so as to slightly protrude.

The supporters 711a and 712a are connected to the bump receiving portions 711 and 712 and have a structure protruding from the bottom surface of the mounting region 220. [ The supporters 711a and 712a indicate the optimum coating thickness of the adhesive and can prevent the adhesive from overflowing into the bump receiving portions 711 and 712. [

The preliminary phosphor sheet 700 shown in Fig. 17 can also be produced by a method of pressurizing and partially curing the phosphor resin using a mold.

Referring to FIG. 18, a method of manufacturing a light emitting device includes a step of applying an adhesive 720 in a mounting region 710 of a preliminary phosphor sheet 700. Here, the adhesive 720 can be applied only up to the height of the supporters 711a and 712a. The adhesive 720 may be applied only to the bottom surface of the mounting region 710 and not to the bump accommodating portions 711 and 712.

Referring to FIG. 19, a method of manufacturing a light emitting device includes a step of mounting a light emitting device 600 on a preliminary phosphor sheet 700. 16, the first electrode 611 and the second electrode 612 are disposed on one surface of the light emitting device 600, and the first electrode 611 and the second electrode 612 are disposed on the first electrode 611 and the second electrode 612 And the first bumps 621 and 622 are disposed. The light emitting device 600 can be mounted on the mounting region 710 such that the first bumps 621 and 622 are received in the bump receiving portions 711 and 712. [

The process of fully curing the preliminary phosphor sheet 700 after the light emitting element 600 is mounted on the preliminary phosphor sheet 700 can be performed.

Referring to FIG. 20, a method of manufacturing a light emitting device may include a step of grinding one surface of a preliminary phosphor sheet 700 to open the bump receiving portions 711 and 712. By this process, the two bump receiving portions 711 and 712 are opened to expose the first bumps 621 and 622. [ The polished preliminary phosphor sheet 700 may have a thickness of 5 mu m or less.

Referring to FIG. 21, the manufacturing method of the light emitting device may include forming the second bumps 631 and 632 on the first bumps 621 and 622. The second bumps 631 and 632 are formed on the outside of the preliminary phosphor sheet 700 'and may be formed in the areas of the bump receiving portions 711 and 712 and bonded to the first bumps 621 and 622. In this embodiment, the second bumps 631 and 632 preferably have a second size that is greater than the first size of the first bumps 621 and 622. The second size may include at least one of a second width (w ₂ ), a second length, and a second height (h ₂ ).

The second bumps 631 and 632 may have a cylindrical shape like the first bumps 621 and 622 and the width w ₂ thereof is larger than the first width w ₁ . It is preferable that the second bumps 631 and 632 are larger than the cross-sectional size of the wire because the wires are bonded. For example, if the cross-sectional diameter of the wire is 1.5 mil inches, the second width w ₂ is preferably greater than this.

Further, the second bumps 631 and 632 may have a width larger than the bump accommodating portions 711 and 712. Accordingly, the second bumps 631 and 632 are formed to cover the bump receiving portions 711 and 712 from the outside of the preliminary phosphor sheet 700 ', thereby fixing the preliminary phosphor sheet 700'.

22 to 23 are views for explaining a method of manufacturing a light emitting device module according to another embodiment of the present invention.

Referring to FIG. 22, a manufacturing method of a light emitting device module includes a process of bonding a light emitting device 600 manufactured by the method shown in FIGS. 16 to 21 on a substrate 1000.

The substrate 1000 includes a first circuit pattern 1100 and a second circuit pattern 1200 connected to an external circuit or an external power source. The first circuit pattern 1100 and the second circuit pattern 1200 and the two second bumps 631 and 632 formed outside the preliminary phosphor sheet 700 ' 641, 642).

23, the light emitting device module can be manufactured by applying a transparent resin to the upper portion of the preliminary phosphor sheet 700 to form the lens unit 650. [

In the light emitting element module shown in Fig. 23, the preliminary phosphor sheet 700 'has a thickness of 5 mu m or less on the light emitting surface and the side surface of the light emitting element 600, so that the color reproducibility can be improved, .

In addition, the preliminary phosphor sheet 700 'is fixed by the second bumps 631 and 632 formed on the bump receiving portions 711 and 712, so that the bonding strength with the light emitting element 600 can be improved.

24 to 25 are views for explaining a method of manufacturing a light emitting device module according to another embodiment of the present invention.

24 is a view showing a light emitting element 900 including a preliminary phosphor sheet 800. Fig. The light emitting device 900 shown in Fig. 24 can be manufactured by a method similar to that shown in Figs. 16 to 21. However, in this embodiment, the light emitting device 900 having a vertical structure in which the first electrode 910 is disposed on the upper surface and the second electrode 920 is disposed on the lower surface may be applied. In addition, the light emitting device 900 includes a first bump 930 formed on the first electrode 910.

In order to mount the light emitting device 900 of the above-described structure, the preliminary phosphor sheet 800 may include a bump receiving portion 810 capable of receiving the first bump 930. Since the bump receiving portion 810 is configured to accommodate the first bumps 930, the bump receiving portion 810 may have a size and a shape corresponding to the first bumps 930.

The preliminary phosphor sheet 800 can be bonded to the light emitting element 900 by an adhesive 820 applied inside thereof. On the outside of the preliminary phosphor sheet 800, a second bump 940 is formed in a region including the bump accommodating portion 810. The second bump 940 has a larger size than the first bump 930 and the bump receiving portion 810 and provides a wire bonding space and improves the bonding force between the preliminary phosphor sheet 800 and the light emitting element 900 .

Referring to FIG. 25, a method of manufacturing a light emitting device module includes mounting a light emitting device 900 shown in FIG. 24 on a substrate 2000 and performing wire bonding.

The substrate 2000 includes a first circuit pattern 2100 and a second circuit pattern 2200. The light emitting device 900 is mounted so that the second electrode 920 of the light emitting device 900 is bonded to the first circuit pattern 2100. In this state, the wire 950 is bonded to the second bump 940 and the second circuit pattern 2200, which are exposed through the bump accommodating portion 810 of the preliminary phosphor sheet 800. At this time, the second bump 940 has a larger size than the cross-section of the wire 950, which facilitates the bonding of the wire 950.

Then, the light emitting device module can be manufactured by forming the lens portion 960 on the preliminary phosphor sheet 310.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. This is possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

100, 100 ', 200, 200', 300, 700, 700 ', 800: preliminary phosphor sheet
111, 210, 310, 710: mounting area
500, 600, 900: Light emitting element
711, 712, 810: bump housing groove
621, 622, 930: First bump
631, 632, 940: second bump

Claims (30)

Fabricating a plurality of light emitting devices separated from each other;
Fabricating a preliminary phosphor sheet including a plurality of mounting regions for mounting the light emitting elements;
Applying an adhesive in the preliminary phosphor sheet;
Mounting the light emitting device on each of the plurality of mounting regions; And
A step of cutting the preliminary phosphor sheet on which the light emitting element is mounted in a chip unit between the plurality of mounting regions
Emitting device.
The method according to claim 1,
Wherein the step of mounting the light emitting device on the plurality of mounting regions includes:
And a light emitting surface of the light emitting element having a flip chip structure is bonded within the plurality of mounting regions.
3. The method of claim 2,
The manufacturing of the plurality of light emitting devices may include:
Forming a first bump having a first size on at least one electrode disposed on a surface opposite to the light emitting surface of each of the light emitting elements
Emitting device.
The method according to claim 1,
The manufacturing of the plurality of light emitting devices may include:
Forming a first bump having a first size on at least one electrode disposed on a surface to be joined to a bottom surface of each of the plurality of mounting regions in the light emitting element,
The step of preparing the preliminary phosphor sheet includes:
And the bump accommodating portion is provided at a position corresponding to the first bump on the bottom surface of each of the plurality of mounting regions.
5. The method of claim 4,
Wherein the step of mounting the light emitting device on each of the plurality of mounting areas comprises:
And the light emitting element is mounted in each of the plurality of mounting areas so that the first bump is received in the bump receiving part.
Claim 6 has been abandoned due to the setting registration fee. 6. The method of claim 5,
A step of polishing the preliminary phosphor sheet so that the bump accommodating portion is opened after mounting the light emitting element in each of the plurality of mounting regions
A method of manufacturing a light emitting device
Claim 7 has been abandoned due to the setting registration fee. The method according to claim 6,
Forming a second bump having a second size larger than the first size on the first bump exposed through the bump receiving portion at the outside of the preliminary fluorescent sheet and having a width larger than that of the bump accommodating portion
Emitting device.
Claim 8 has been abandoned due to the setting registration fee. The method according to claim 6,
Wherein the step of polishing the preliminary phosphor sheet comprises:
And the thickness of the preliminary phosphor sheet is not more than 5 mu m.
The method according to claim 1,
The step of preparing the preliminary phosphor sheet includes:
And the at least one supporter representing the optimum coating thickness of the adhesive in the plurality of mounting areas is included.
Claim 10 has been abandoned due to the setting registration fee. 10. The method of claim 9,
Wherein the at least one supporter comprises:
Wherein the light emitting device has a structure protruding in the plurality of mounting regions.
Claim 11 has been abandoned due to the set registration fee. The method according to claim 1,
The step of preparing the preliminary phosphor sheet includes:
Preparing a phosphor resin by mixing phosphor particles and a transparent resin;
Injecting the phosphor resin into a first mold;
Pressing the phosphor resin injected into the first mold with a second mold having a structure corresponding to the preliminary phosphor sheet;
Partially curing the pressed phosphor resin; And
Removing the first mold and the second mold
Emitting device.
Claim 12 is abandoned in setting registration fee. 12. The method of claim 11,
The second mold may include:
And the convexo-concave pattern is transferred to the preliminary phosphor sheet by including the concave-convex pattern in the portion corresponding to the bottom surface of the plurality of mounting regions in the preliminary phosphor sheet.
The method according to claim 1,
After mounting the plurality of light emitting elements in the plurality of mounting regions,
The step of fully curing the preliminary phosphor sheet
Emitting device.
A phosphor sheet including a mounting region and including a plurality of supporters protruding from a bottom surface of the mounting region; And
Wherein the light emitting surface is bonded to the mounting region, and the light emitting element
.
Claim 15 is abandoned in the setting registration fee payment. 15. The method of claim 14,
The light-
At least one electrode disposed on a surface opposite to the light emitting surface, and a first bump formed on the at least one electrode and having a first size.
Claim 16 has been abandoned due to the setting registration fee. 15. The method of claim 14,
Wherein the phosphor sheet includes a bump accommodating portion on a bottom surface of the mounting region,
The light-
A first bump having a first size on at least one electrode disposed on a surface to be joined to a bottom surface of the mounting region in the light emitting device; And
And a second bump formed on the first bump exposed through the bump receiving portion and having a second size larger than the first size.
Claim 17 has been abandoned due to the setting registration fee. 15. The method of claim 14,
Wherein the plurality of supporters comprise:
And wherein the light emitting device is arranged in a symmetrical structure of any one of line symmetry and point symmetry on the bottom surface of the mounting area.
Fabricating a plurality of light emitting devices separated from each other;
Fabricating a preliminary phosphor sheet including a plurality of mounting regions for mounting the light emitting elements;
Applying an adhesive in the preliminary phosphor sheet;
Mounting the light emitting device on each of the plurality of mounting regions;
Cutting the preliminary phosphor sheet on which the light emitting element is mounted, in a chip unit between the plurality of mounting regions; And
Mounting the cut chips on a substrate
Emitting device module.
Claim 19 is abandoned in setting registration fee. 19. The method of claim 18,
Wherein the step of mounting the plurality of light emitting devices on the plurality of mounting regions includes:
Wherein a light emitting surface of the light emitting element having a flip chip structure is bonded within the plurality of mounting regions.
Claim 20 has been abandoned due to the setting registration fee. 19. The method of claim 18,
The manufacturing of the plurality of light emitting devices may include:
Forming a first bump having a first size on at least one electrode disposed on one side of each of the light emitting elements,
Emitting device module.
Claim 21 has been abandoned due to the setting registration fee. 21. The method of claim 20,
The step of preparing the preliminary phosphor sheet includes:
And the bump accommodating portion is formed at a position corresponding to the first bump on the bottom surface of each of the plurality of mounting regions.
Claim 22 is abandoned in setting registration fee. 22. The method of claim 21,
Wherein the step of mounting the light emitting device on each of the plurality of mounting areas comprises:
And the light emitting device is mounted on each of the plurality of mounting areas so that the first bumps are received in the bump receiving part.
Claim 23 has been abandoned due to the setting registration fee. 23. The method of claim 22,
A step of polishing the preliminary phosphor sheet so that the bump accommodating portion is opened after mounting the light emitting element in each of the plurality of mounting regions
The light emitting device module further comprising:
Claim 24 is abandoned in setting registration fee. 24. The method of claim 23,
Forming a second bump having a second size larger than the first size on the first bump exposed through the bump receiving portion at the outside of the preliminary fluorescent sheet and having a width larger than that of the bump accommodating portion
The light emitting device module further comprising:
Claim 25 is abandoned in setting registration fee. 24. The method of claim 23,
Wherein the step of polishing the preliminary phosphor sheet comprises:
And the thickness of the preliminary phosphor sheet is less than 5 탆.
Claim 26 is abandoned in setting registration fee. 19. The method of claim 18,
Forming a lens portion by applying a transparent resin on the light emitting element mounted on the substrate
The light emitting device module further comprising:
A substrate including a circuit pattern;
A light emitting element formed on the substrate, the light emitting element including a light emitting surface;
A phosphor sheet formed on the light emitting element and including a plurality of supporters, the plurality of supporters including a mounting region, the plurality of supporters protruding from the inner surface of the mounting region; And
And a lens portion formed on the phosphor sheet,
Wherein a light emitting surface of the light emitting element is supported on the plurality of supporters so as to face the inner surface of the mounting region in the mounting region of the phosphor sheet.
Light emitting device module.
Claim 28 has been abandoned due to the set registration fee. 28. The method of claim 27,
The light-
At least one electrode disposed on a surface opposite to the light emitting surface, and a first bump formed on the at least one electrode and having a first size.
Claim 29 has been abandoned due to the setting registration fee. 28. The method of claim 27,
Wherein the phosphor sheet includes a bump accommodating portion on an inner surface of the mounting region,
The light-
A first bump having a first dimension on at least one electrode disposed on a surface to be joined to the inner surface of the mounting region; And
And a second bump formed on the first bump exposed through the bump receiving portion, the second bump having a second size larger than the first size.
Claim 30 has been abandoned due to the set registration fee. 28. The method of claim 27,
Wherein the phosphor sheet has a thickness of 5 占 퐉 or less.

Images