KR20100118623A - Light emitting device package, method for fabricating the same and camera flash module using the same - Google Patents

Abstract

PURPOSE: A method for manufacturing a light element package and a camera flash module are provided to improve the strength of light transferred to a flash lens by attaching a cover lens on the upper side of the light element package. CONSTITUTION: A conductive through hole(130) electrically connects a first pad(110) and a second pad(120). A light element chip(150) is flip-chip bonded to the first pad. The first pad is in electrical connection with an external connection terminal. A fluorescent substance(160) is formed on the upper side of the light emitting chip. A protective layer(170) surrounds a light emitting element and the fluorescent substance and is formed on the upper side of a substrate(100).

Description

Light emitting device package, method for manufacturing same and camera flash module using same {Light emitting device package, method for fabricating the same and camera flash module using the same}

The present invention relates to a light emitting device package capable of improving visibility, a manufacturing method thereof, and a camera flash module using the same.

LED (Light Emitting Diode) has the advantages of high efficiency, high-speed response, long life, miniaturization, light weight, low energy consumption and energy saving. Its characteristics make it applicable to many applications.

In addition, the point light source and micro-optical device can freely design lines, planes, and spaces, and thus the field of application is very broadly sustained throughout the industries such as display, signal display, lighting, bio, telecommunication, mobile phone, LCD, and automotive industry. It is predicted.

In particular, the LED module for camera flash, which has the advantage of small size and high brightness, is expected to draw the same trajectory as the upward curve of mobile devices.

The LED module for the camera flash has a form in which light incident in one direction is scattered evenly in all directions for high quality photography, so that uniform light is irradiated onto the subject.

The present invention solves the problem that can form uniform light on a subject.

According to a first preferred embodiment of the present invention,

A substrate provided with pads;

A light emitting device chip electrically connected to pads of the substrate;

A phosphor formed on the light emitting device chip;

A light emitting device package surrounding the light emitting device and the phosphor and including a protective layer formed on the substrate is provided.

According to a second preferred embodiment of the present invention,

Preparing a substrate provided with pads;

Electrically connecting a light emitting device chip to pads of the substrate;

Forming a phosphor on the light emitting device chip;

A method of manufacturing a light emitting device package including surrounding the light emitting device chip and the phosphor and forming a protective layer on the substrate is provided.

According to a third preferred embodiment of the present invention,

A substrate provided with pads; A light emitting device chip electrically connected to pads of the substrate; A phosphor formed on the light emitting device chip; A light emitting device package surrounding the light emitting device and the phosphor and including a protective layer formed on the substrate;

A camera flash module using a light emitting device package consisting of a flash lens positioned on the light emitting device package is provided.

Camera flash module of the present invention is provided with a light diffusion sheet can form a uniform light on the subject, there is an effect that can improve the visibility.

In addition, the present invention by adhering the cover lens on the light emitting device package, the light emitted from the light emitting device package is concentrated in the cover lens, there is an effect that can improve the light intensity transmitted to the flash lens.

In addition, the present invention places the light diffusion sheet in the protective layer region on the upper side of the light emitting device chip, and exposes the protective layer region not located on the upper surface of the light emitting device chip, whereby the light diffusion sheet is formed when the molding part is formed on the protective layer. Self-bonding is self-bonding, there is no need for a separate adhesive for bonding the light diffusion sheet has the effect of reducing the manufacturing cost.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a schematic structure of a light emitting device package according to a first embodiment of the present invention. The light emitting device package according to the first embodiment includes first pads 110 formed at an upper portion thereof and a lower portion thereof. A substrate (100) having second pads (120) and conductive through holes (130) for electrically connecting the first pads (110) and the second pads (120); A light emitting device chip (150) flip-chip bonded to the first pads (110) on the substrate (100); A phosphor 160 formed on the light emitting device chip 150; The light emitting device 150 and the phosphor 160 are surrounded by a protective layer 170 formed on the substrate 100.

Here, the protective layer 170 is preferably silicon resin.

In addition, the light emitting device chip 150 of the light emitting device package according to the present invention may be applied to include a light emitting device chip having a vertical and horizontal structure, and the light emitting device chip 150 is mounted on the substrate 100. And bonding is not limited to flip chip bonding, but may be performed by all applicable equivalent methods.

Therefore, in terms of the structural aspect of the light emitting device package, the electrode pads of the light emitting device chip 150 are electrically bonded to the first pads 110 of the substrate 100, and the second pads 120 are connected to each other. In addition, terminals of boards such as additional motherboards and connectors connected to external devices may be electrically connected.

In addition, in addition to the substrate structure including the first pads 110, the second pads 120, and the conductive through holes 130, the pad may be electrically connected to the light emitting device chip 150. It is also possible to apply a substrate provided with these.

In this case, the pads that may be electrically connected to the light emitting device chip 150 may be electrically connected to an external connection terminal so that a current for driving the light emitting device chip 150 may be applied.

2A to 2E are schematic cross-sectional views illustrating a method of manufacturing a light emitting device package according to a first embodiment of the present invention. The first pads 110 formed on the upper side and the second pads 120 formed on the lower side are shown. And the substrate 100 having conductive through holes 130 electrically connecting the first pads 110 and the second pads 120 to each other (FIG. 2A).

Next, the light emitting device chip 150 is flip chip bonded to the first pads 110 on the substrate 100 (FIG. 2B).

Subsequently, the phosphor 160 is formed on the light emitting device chip 150 (FIG. 2C).

Here, as a method for uniformly applying the phosphor 160, a method of forming a nanoimprint method using a phosphor having a particle size smaller than a micrometer and a screen printing method It may be formed by a spray coating method.

In addition, the phosphor powder may be formed by evaporation and vapor deposition, or by sputtering using a phosphor substrate.

In this case, the phosphor 160 may surround the light emitting device chip 150 and have a structure formed on the substrate 100.

The light emitting device chip 150 is a light emitting device chip that emits one of red, green, and blue, and the phosphor 160 is a phosphor that switches wavelengths of light emitted from the light emitting device chip 150.

Here, ultimately, the light emitted from the light emitting device package is to be white light.

Subsequently, the light emitting device chip 150 and the phosphor 160 are wrapped to form a protective layer 170 on the substrate 100 (FIG. 2D).

The method of manufacturing the light emitting device package may be performed at the wafer level, and when the wafer level is performed, the substrate 100 is a wafer, and a plurality of light emitting device chips are mounted on the substrate 100.

After the process of FIG. 2D is performed, as shown in FIG. 2E, dicing is performed by line A-A 'and separated into individual light emitting device package units.

3 is a cross-sectional view illustrating a schematic structure of a camera flash module using a light emitting device package according to a first embodiment of the present invention. The light emitting device package according to the first embodiment of FIG. 1 is bonded to a submount. The flash module is positioned on the light emitting device package to configure a camera flash module.

That is, the camera flash module according to the present invention includes a sub-mount 210 in which electrode pads 211 are formed; The first pads 110 formed on the upper portion, the second pads 120 formed on the lower portion, and the conductive through holes electrically connecting the first pads 110 and the second pads 120 ( 130 is provided, the light emitting device chip 150 flip-chip bonded to the first pads 110 on the substrate 100, and the upper light emitting device chip 150 Phosphor 160 formed on the; The light emitting device chip 150 and the phosphor 160 may be surrounded by a protective layer 170 formed on the substrate 100, and second pads may be formed on the electrode pads 211 of the sub-mount 210. 120 is bonded to the solder 25 and the light emitting device package 200 mounted on the sub-mount 210; A flash lens 300 positioned on the light emitting device package 200; It consists of a light diffusion sheet 310 facing the upper portion of the light emitting device package 200 and adhered to the flash lens 300.

The flash lens 300 may have a shape designed to focus light emitted from the light emitting device package 200 onto a subject in front of the flash lens 300.

The light diffusion sheet 310 scatters the light emitted in a predetermined direction from the surface of the light emitting device package 200 and spreads the light evenly across the object.

Here, the light diffusion sheet 310 is, as shown in Figure 3, the polyester resin (PET) layer 312; A light diffusion sheet including a bead coating layer 312 formed on the polyester resin layer 312 may be used.

In addition, the light diffusion sheet 310 should have excellent light transmittance in the visible light band, and a thickness of 0.5 mm or less is appropriate.

The adhesive layer 320 having excellent light transmittance is preferably adhered to the flash lens 300.

In this case, the light diffusion sheet 310 is attached to the flash lens 300 by the lamination method using an optical clear adhesive (OCA) film having excellent light transmittance and adhesive strength. Glue.

Therefore, the camera flash module of the present invention is provided with a light diffusion sheet to form uniform light on a subject, and there is an advantage of improving visibility.

FIG. 4 is a cross-sectional view illustrating a state in which a lens is mounted on a light emitting device package of the camera flash module of FIG. 3.

Therefore, the light emitting device package 200 is mounted on the sub-mount 210, and a cover lens 172 is adhered to the protective layer 170 of the light emitting device package 200.

As such, when the cover lens 172 is attached to the upper portion of the light emitting device package 200, the light emitted from the light emitting device package 200 is collected by the cover lens 172, so that the flash lens 300 may be used. There is an advantage to improve the light intensity transmitted to.

5 is a cross-sectional view illustrating a schematic structure of a light emitting device package according to a second embodiment of the present invention. The light emitting device package according to the second embodiment of the present invention may include first pads 110 formed thereon, A substrate (100) having second pads (120) formed at a lower portion thereof, and conductive through holes (130) for electrically connecting the first pads (110) and the second pads (120); A light emitting device chip (150) flip-chip bonded to the first pads (110) on the substrate (100); A phosphor 160 formed on the light emitting device chip 150; A protective layer 170 formed on the substrate 100 to surround the light emitting device chip 150 and the phosphor 160; The light diffusion sheet 310 is attached to the upper portion of the protective layer 170.

FIG. 6 is a schematic cross-sectional view illustrating a method of manufacturing a light emitting device package according to a second embodiment of the present invention. After performing the above-described processes of FIGS. 2A to 2D, the light diffusion sheet is formed on the protective layer 170. When the 310 is bonded with the adhesive sheet 321, the manufacturing of the light emitting device package according to the second embodiment of the present invention is completed.

In this case, when manufacturing the light emitting device package at the wafer level, after adhering the light diffusion sheet 310, the wafer bonded with a plurality of light emitting devices is individually light-emitted by the line B-B ', as shown in Figure 2e Dicing by device package unit is separated.

FIG. 7 is a cross-sectional view illustrating a schematic structure of a camera flash module using a light emitting device package according to a second embodiment of the present invention. Similar to the camera flash module of FIG. 3, FIG. When the light emitting device package 200 is bonded to the sub-mount 210 and the flash lens 300 is positioned on the light emitting device package 210, the camera flash module may be completed.

FIG. 8 is a cross-sectional view illustrating a state in which a lens is mounted on the light emitting device package of the camera flash module of FIG. 7, and is disposed on the light diffusion sheet 310 of the light emitting device package 260 according to the second embodiment of the present invention. The cover lens 172 is attached, the light emitting device package 260 to which the cover lens 172 is attached is mounted on the sub-mount 210, and the flash lens 300 is positioned on the cover lens 172. .

9 is a cross-sectional view illustrating a schematic structure of a light emitting device package according to a third embodiment of the present invention. The light emitting device package according to the third embodiment of the present invention may include first pads 110 formed thereon, A substrate (100) having second pads (120) formed at a lower portion thereof, and conductive through holes (130) for electrically connecting the first pads (110) and the second pads (120); A light emitting device chip (150) flip-chip bonded to the first pads (110) on the substrate (100); A phosphor 160 formed on the light emitting device chip 150; A protective layer 170 formed on the substrate 100 to surround the light emitting device chip 150 and the phosphor 160; A light diffusion sheet 310 positioned on the protective layer 170; The light diffusion sheet 310 is formed to be molded on the protective layer 170 and the molding part 500 having a lens shape 510 formed thereon.

10A to 10F are schematic cross-sectional views illustrating a method of manufacturing the light emitting device package of FIG. 9. First, first pads 110 formed on an upper portion thereof, second pads 120 formed on a lower portion thereof, and A substrate 100 having conductive through holes 130 for electrically connecting the first pads 110 and the second pads 120 is prepared (FIG. 10A).

Thereafter, the light emitting device chip 150 is flip chip bonded to the first pads 110 on the substrate 100 (FIG. 10B).

The flip chip bonding is to mount the light emitting device chip 150 on the substrate 100 while bonding the electrode pads of the light emitting device chip 150 and the first pads 110 with solder. .

Subsequently, the phosphor 160 is formed on the light emitting device chip 150 (FIG. 10C).

Subsequently, the light emitting device chip 150 and the phosphor 160 are wrapped to form a protective layer 170 on the substrate 100 (FIG. 10D).

Subsequently, a light diffusion sheet 310 exposing an area of the protective layer 170 that is not positioned above the light emitting device chip 150 is disposed on the protective layer 170 (FIG. 10E).

Next, the light diffusion sheet 310 is wrapped and the upper portion of the protective layer 170 is molded to form a molding part 500 having the lens shape part 510 formed thereon (FIG. 10F).

The lens shape part 510 performs the same function as the lens cover of FIG. 8.

As described above, the light diffusion sheet 310 is positioned in the protective layer 170 region above the light emitting device chip 150 and is not positioned above the light emitting device chip 150. By exposing the region, when the molding part 500 is formed on the passivation layer 170, the light diffusion sheet 310 has a self-bonding effect.

That is, a separate adhesive for adhering the light diffusing sheet is not required, thereby reducing manufacturing costs.

In the method of manufacturing the camera flash module, the manufacturing process may be performed at the wafer level. In this case, the light diffusion sheet of FIG. 10E may expose an area of the protective layer 170 that is not positioned above the light emitting device chip 150. The through hole 320 is formed, and the light diffusion sheet is self-bonded by filling the molding resin of the molding part 500 in the through hole 320.

Then, as shown in FIG. 10E, dicing with a line C-C ′ separates each camera flash module including a plurality of light emitting device chips.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1 is a cross-sectional view showing a schematic structure of a light emitting device package according to a first embodiment of the present invention

2A to 2E are schematic cross-sectional views illustrating a method of manufacturing a light emitting device package according to a first embodiment of the present invention.

3 is a cross-sectional view showing a schematic structure of a camera flash module using a light emitting device package according to a first embodiment of the present invention

4 is a cross-sectional view showing a state in which a lens is mounted on the light emitting device package of the camera flash module of FIG.

5 is a cross-sectional view showing a schematic structure of a light emitting device package according to a second embodiment of the present invention

6 is a schematic cross-sectional view illustrating a method of manufacturing a light emitting device package according to a second embodiment of the present invention.

7 is a cross-sectional view showing a schematic structure of a camera flash module using a light emitting device package according to a second embodiment of the present invention

8 is a cross-sectional view illustrating a state in which a lens is mounted on a light emitting device package of the camera flash module of FIG. 7.

9 is a cross-sectional view showing a schematic structure of a light emitting device package according to a third embodiment of the present invention

10A through 10F are schematic cross-sectional views illustrating a method of manufacturing the light emitting device package of FIG. 9.

Claims (16)

A substrate provided with pads; A light emitting device chip electrically connected to pads of the substrate; A phosphor formed on the light emitting device chip; A light emitting device package surrounding the light emitting device and the phosphor and including a protective layer formed on the substrate. The method according to claim 1, The pads, First pads formed on the substrate; It is connected to the first pads, and composed of second pads formed under the substrate, And the first pads and the second pads are electrically connected to conductive through holes formed in the substrate. The method according to claim 1, The light emitting device chip, A light emitting device package comprising a light emitting device chip having a vertical structure or a light emitting device chip having a horizontal structure. The method according to claim 1, The light emitting device package further comprises a light diffusion sheet positioned above the protective layer. The method according to claim 4, The light diffusion sheet is bonded to the upper portion of the protective layer, the light emitting device package. The method according to claim 4, The light emitting device package surrounding the light diffusion sheet and molded on the upper portion of the protective layer, wherein the molding unit is formed with a lens-shaped portion on the top. The method according to claim 6, The light diffusion sheet, Exposing the protective layer region, which is not located above the light emitting device chip, The molding part, The light emitting device package according to claim 1, wherein the light emitting device package is also formed in the exposed protective layer area not located above the light emitting device chip. Preparing a substrate provided with pads; Electrically connecting a light emitting device chip to pads of the substrate; Forming a phosphor on the light emitting device chip; A method of manufacturing a light emitting device package comprising surrounding the light emitting device chip and the phosphor and forming a protective layer on the substrate. The method according to claim 8, After forming the protective layer on the substrate surrounding the light emitting device chip and the phosphor, The method of manufacturing a light emitting device package, characterized in that further comprising the step of adhering the light diffusion sheet on the protective layer. The method according to claim 8, After forming the protective layer on the substrate surrounding the light emitting device chip and the phosphor, Placing a light diffusion sheet on the passivation layer, the light diffusion sheet exposing the passivation layer region not located above the light emitting device chip; A lens-shaped part is formed on the top, and the method of manufacturing a light emitting device package characterized in that it further comprises the step of forming a molding by wrapping the light diffusion sheet and the molding on the protective layer. The method according to claim 8, Forming a phosphor on the light emitting device chip, The phosphor is formed by one of a nanoimprint method, a screen printing method, a spray coating method, an evaporation method of depositing phosphor powder, and a sputtering method. The manufacturing method of the light emitting element package made into. A substrate provided with pads; A light emitting device chip electrically connected to pads of the substrate; A phosphor formed on the light emitting device chip; A light emitting device package surrounding the light emitting device and the phosphor and including a protective layer formed on the substrate; Camera flash module using a light emitting device package consisting of a flash lens positioned on the light emitting device package. The method of claim 11, The pads, First pads formed on the substrate; It is connected to the first pads, and composed of second pads formed under the substrate, And the first pads and the second pads are electrically connected to conductive through-holes formed in the substrate. The method according to claim 12, A camera flash module using a light emitting device package, characterized in that the light diffusion sheet which is opposite to the upper portion of the light emitting device package and adhered to the flash lens. The method according to claim 12, Camera flash module using a light emitting device package, characterized in that the light diffusion sheet is further provided on the protective layer. The method according to claim 14, Camera flash module using a light emitting device package characterized in that the cover lens is further provided on the light emitting device package.

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