JP6732848B2 - Asymmetrical light emitting device, backlight module using the light emitting device, and method for manufacturing the light emitting device - Google Patents

Description

(Cross-reference of related applications)
This application claims the priority and benefits of Taiwan Patent Application No. 106124542 and Chinese Patent Application No. 201710601827.1 filed on Jul. 21, 2017, and is referred to in its entirety. Thus, those disclosures are incorporated into the present disclosure.

(Technical field)
The present disclosure relates to a light emitting device and a method for manufacturing the same. In particular, it relates to a chip scale package (CSP) type light emitting device (LED) having an asymmetric shape, which is used in a backlight module of a liquid crystal display device (LCD), and a manufacturing method thereof.

Light emitting devices are commonly used as light sources for lighting, backlights, or indicator lamps inside electronic products. Specifically, a light emitting device that emits primary light is typically disposed within a package structure to form an LED package. There, the photoluminescent material is typically distributed so as to cover the radiation path of the light emitting element, and a portion of the primary light is converted by the photoluminescent material as secondary light. Reflective materials are also used as part of the package structure to achieve the desired emission direction.

Among them, PLCC (Plastic Leaded Chip Carrier) type LED packages can be classified into a top view (top emission) LED package or a side view (side emission) LED package according to the emission direction thereof. The top view LED package is used as a light source for general lighting or as a backlight light source for a direct type LCD display. On the other hand, the side view LED package is used as a backlight light source for an edge light type LCD display for a television or a mobile device. Either the top view LED package or the side view LED package has a main light emitting surface. The optical axis of the LED package is generally specified by the axis passing through the center of the major emitting surface (eg, rectangle) and perpendicular to the major emitting surface. For simplicity, two additional axes are defined along the length and width of the main emitting surface, both perpendicular to the optical axis, and along the length and width. The axes are also orthogonal to each other. When the radiation pattern is measured along the length and width of the top-view LED package (or side-view LED package), the same (or similar) radiation pattern can usually be obtained. Since the top-view LED package or the side-view LED package has the same or similar emission pattern along the length direction and the width direction, the PLCC type LED package has a symmetrical emission pattern.

This type of LED package with a symmetrical radiation pattern cannot meet the requirements of some applications to identify asymmetrical radiation patterns such as street lights. Another application identifies the light source of a backlight module for an edge-lit LCD for a television or mobile device as an asymmetric radiation pattern. There, a larger angle of the radiation pattern along the length of the LED package (or the length of the backlight module) is desirable. Such a radiation pattern having a large viewing angle along the length direction can make the distribution of incident light on the light guide plate more uniform and reduce dark spots or areas along the light guide plate. Using a light source with a wide viewing angle can also reduce the number of LED packages used in the light bar along the light guide plate. Further, the edge light source reduces the viewing angle of the radiation pattern along the width direction of the LED package (or the thickness direction of the backlight module) so that the incident light from the LED light source is not leaked from the light guide plate. It can be effectively transmitted to the light guide plate of the backlight module. Thereby, the light utilization efficiency can be improved.

In the case of PLCC type LED package, whether in top view or side view, a lead frame with a reflective cup is used as the main design structure. Further, usually, a light emitting device provided with a photoluminescent material is packaged. Specifically, PLCC reflective cups are typically manufactured by casting. When a PLCC-type LED package is used in an application that specifies an asymmetric radiation pattern, an additional optical lens or secondary optical lens is incorporated to shape the light to achieve a particular radiation pattern. This inevitably increases manufacturing costs. Also, the overall space used to achieve the asymmetrical radiation pattern is significantly increased, which is unfavorable for the final product design of today's home appliances. If no optical lens is used to shape the radiation pattern, another approach is to manufacture some of the leadframe reflective cup structure to be translucent. That is, light can pass through this portion of the translucent structure to change the radiation pattern. However, the leadframe reflective cup structure is typically manufactured by casting. Therefore, an LED package having an asymmetrical shape such as a reflective cup having a partially translucent structure and a reflective structure is difficult to manufacture using a mass production process. Therefore, there remains a need for a streamlined, cost-effective way to achieve asymmetric radiation patterns for PLCC-type LED packages.

As LCDs for TVs or mobile devices become thinner and lighter, PLCC type LED packages used as backlight sources must also be continuously miniaturized. In this tendency, CSP type LEDs having a small form factor have been developed in recent years. The CSP type LED is one of the main development trends in the LED industry. For example, CSP-type LEDs have been introduced to replace the top-view PLCC-type LEDs used in direct-lit backlight LCD televisions. The application of CSP type LED in the backlight can further reduce the size of the LED backlight module and at the same time obtain higher light intensity. The smaller size of CSP-type LEDs is advantageous in the design of secondary optical lenses, and the higher light intensity is beneficial in the design of brighter LCDs, as well as in reducing the number of LEDs used.

Depending on the number of light emitting surfaces, CSP type LEDs can be classified into two types, top emitting type and five side emitting type. In the case of a top emitting CSP type LED, the four vertical end faces of the flip chip light emitting device are covered with a reflective material so that light is emitted alone or mainly from the top face of the CSP type LED. Therefore, the top-emitting CSP type LED has a smaller viewing angle (about 120°). The light of a five-sided CSP type LED can be emitted not only from the top surface but also from the four vertical end faces of the CSP type LED, and thus has a larger viewing angle (about 140° to 160°). .. However, like the PLCC-type LED packages, both of the two types of CSP-type LEDs belong to the category of light-emitting devices that have symmetrical emission patterns, so both types of CSP-type LEDs specify asymmetric emission patterns. Cannot meet the requirements of the intended use. In addition, in the case of CSP type LEDs, using the primary or secondary optical lens to generate the asymmetric radiation pattern not only significantly increases the manufacturing cost, but also the space of the CSP type LED combined with those lenses. Increase significantly. This negates the advantages of the small form factor of CSP LEDs. Therefore, there is still a lack of effective designs to achieve asymmetric radiation patterns using CSP type LEDs.

In the case of a side-view PLCC package or other side-view surface mount LED package, even though the main light emitting surface of the side view package is perpendicular to the bonding pad surface of the package, the main light emitting surface is still the electrode surface of the light emitting device. Is substantially parallel to. For CSP type LEDs, leadframes and submount substrates are usually not included. That is, the electrode surface of the CSP type LED is in parallel contact with the application mounting board. Therefore, some embodiments of the present disclosure identify top-view CSPs that have the technical feature that the primary emitting surface and the electrode surface of the CSP-type LED are substantially parallel. On the other hand, the side-view CSP having the technical feature that the main light emitting surface and the electrode surface of the CSP type LED are substantially vertical is specified.

Therefore, although the size of the CSP type LED can be significantly reduced, the CSP type LED used for the backlight application is a top-view CSP type LED. That is, the main light emitting surface and the lower electrode surface of the CSP type LED are substantially parallel to each other. When the top-view CSP-type LED is used as the backlight source of the edge-light-type LCD, a special L-shaped light bar design is included so that the main emission surface of the CSP-type LED faces the incident light side of the light guide plate. .. The L-shaped light bar increases the manufacturing cost and increases the alignment difficulty between the light bar and the light guide plate. In addition, as the thickness of the light emitting surface of the light bar module in the normal direction increases, the bezel size of the display frame increases. A CSP LED is designated as a side-view CSP LED when the main light emitting surface and the lower electrode surface of the CSP LED are perpendicular to each other. When the CSP type LED of the side view structure is adopted, the L-shaped light bar may be omitted and the upper light emitting surface may be rotated 90 degrees to the incident side of the light guide plate. Thereby, the thickness of the light bar module along the light emitting surface direction can be effectively reduced.

Therefore, in order to achieve the asymmetrical radiation pattern at low cost and efficiently, and to realize the side view CSP type LED of a small form factor such that the main light emitting surface and the lower electrode surface are orthogonal to each other, It is desired to manufacture a small form factor CSP LED having a geometric structure. This can be applied to the edge-light type backlight module to reduce the thickness of the light bar module along the direction of the light emitting surface and further reduce the bezel size of the display frame.

It is an object of some embodiments of the present disclosure to provide a top view CSP-type LED having an asymmetrically shaped reflective surface, a backlight module including the top view LED, and a method of manufacturing the top view LED. This effectively limits the emission angle of the LED to a particular emission direction, creating an asymmetric emission pattern.

Another object of some embodiments of the present disclosure is a side-view CSP-type LED having a main emitting surface and a bottom electrode surface substantially perpendicular to each other, a backlight module including the side-view LED, and a side-view LED. It is to provide a manufacturing method for manufacturing.

To achieve the above object, a top-view LED having an asymmetrical reflective structure according to some embodiments of the present disclosure includes a light emitting device, a photoluminescent member, and a reflective member. The light emitting element has an upper surface, a lower surface facing the upper surface, an end surface, and a set of electrodes. The end surface extends between the upper surface and the lower surface, and the pair of electrodes is arranged at or near the lower surface to form a lower electrode surface. Further, first and second horizontal directions orthogonal to each other are defined as the length direction and the width direction of the upper surface of the light emitting element, respectively. The photoluminescent member has a top surface, a bottom surface facing the top surface, and a side surface. The side surface extends between the top surface and the bottom surface. The photoluminescent member covers the upper surface and/or the end surface of the light emitting element. The reflective member partially covers the side surface of the photoluminescent member. The side surface of the photoluminescent member has four vertical side surfaces. Two vertical sides of which are arranged opposite to each other and are orthogonal to the second horizontal direction. One of them is covered with a reflection member to form a side reflection surface, and the other is not covered with a reflection member to form a side emission surface. The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other. The other two vertical side surfaces are arranged opposite to each other and are orthogonal to the first horizontal direction, and form two side light emitting surfaces.

To achieve the above object, some embodiments according to the present disclosure are directed to a side-view CSP type LED, and include a light emitting device, a photoluminescent member, and a reflective member. The light emitting element has an upper surface, a lower surface facing the upper surface, an end surface, and a set of electrodes. The end surface extends between the upper surface and the lower surface, and the pair of electrodes is arranged at or near the lower surface. The pair of electrodes and the lower surface together form the lower electrode surface of the light emitting element. Further, the first and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively. The photoluminescent member covers the end surface and/or the upper surface of the light emitting element. The reflecting member substantially completely covers the top surface of the photoluminescent member to form an upper reflecting surface, and partially covers the side surface of the photoluminescent member to form at least one side reflecting surface.

To achieve the above object, another embodiment according to the present disclosure is directed to a top-view monochromatic LED having an asymmetric reflective structure, including a light-emitting element, a translucent member, and a reflective member. It includes members. The light emitting element has an upper surface, a lower surface facing the upper surface, an end surface, and a set of electrodes. The end surface extends between the upper surface and the lower surface, and the pair of electrodes is arranged at or near the lower surface. The pair of electrodes and the lower surface together form the lower electrode surface of the light emitting element. Further, the first and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively. The translucent member has a top surface, a bottom surface facing the top surface, and a side surface. The side surface extends between the top surface and the bottom surface. The translucent member covers the upper surface and/or the end surface of the light emitting element. The reflecting member partially covers the side surface of the translucent member. The side surface of the translucent member has four vertical side surfaces. Two of them are arranged opposite to each other and are orthogonal to the second horizontal direction. One of them is covered with the reflecting member to form one side reflecting surface, and the other is not covered with the reflecting member to form a side light emitting surface. The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other. The other two vertical side surfaces are arranged to face each other, are orthogonal to the first horizontal direction, and form two lateral light emitting surfaces without being covered by the reflecting member.

In order to achieve the above object, another embodiment according to the present disclosure is directed to a monochromatic side-view CSP type LED, and includes a light emitting element, a translucent member, and a reflective member. The light emitting element has an upper surface, a lower surface facing the upper surface, an end surface, and a set of electrodes. The end surface extends between the upper surface and the lower surface, and the pair of electrodes is arranged at or near the lower surface to form a lower electrode surface. Further, the first and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively. The translucent member covers the upper surface and/or the end surface of the light emitting element. The reflecting member substantially completely covers the top surface of the translucent member to form an upper reflecting surface, and partially covers the side surface of the translucent member to form at least one side reflecting surface.

To achieve the above object, a backlight module according to some embodiments of the present disclosure includes an application mounting board, a plurality of LEDs in a top view or a side view according to embodiments of the present disclosure, a reflective layer, and a light guide plate. ,including. The application mounting board includes horizontal and/or vertical surfaces. The LEDs are arranged on the application mounting board to form a light bar. The reflective layer is located on the horizontal surface of the application mounting board. The light guide plate is disposed on the reflective layer and includes a light incident side surface and a light exit surface. The light exit surface is continuous with the light entrance side surface and faces the side opposite to the reflective layer.

In order to achieve the above object, a method of manufacturing a top-view or side-view LED disclosed by some embodiments of the present disclosure includes a photoluminescent member so as to cover an upper surface and/or an end surface of a light emitting device. Alternatively, the method includes a step of disposing a light transmissive member, and a step of forming a reflective member so as to partially cover one vertical side surface of the photoluminescent member or the light transmissive member. First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively. The side surface of the photoluminescent member or translucent member has four vertical side surfaces. Two of them are arranged opposite to each other and are orthogonal to the second horizontal direction. One of them constitutes a side reflecting surface which is covered by the reflecting member, while the other constitutes a side emitting surface which is not covered by the reflecting member. The other two vertical sides are arranged opposite to each other and are orthogonal to the first horizontal direction.

In this configuration, the photoluminescent member covers the upper surface and/or the end surface of the light emitting element, the reflective member partially covers the side surface of the photoluminescent member, and the light emitted from the end surface of the light emitting element, And/or part of the light emitted from the side surface of the photoluminescent member is reflected. Therefore, it is possible to form an asymmetric radiation pattern along the first and/or second horizontal direction with respect to the normal direction of the light emitting surface. Further, the reflecting member covers the upper surface of the light emitting element almost completely and partially covers the end surface, thereby forming a side view CSP type LED having a technical feature that the main light emitting surface and the lower electrode surface are substantially orthogonal to each other. can do. Therefore, the LED can appropriately provide the asymmetrical radiation pattern required in different applications without using an additional optical lens. This effectively reduces the manufacturing cost of the LED, while retaining the advantage of small size and facilitating small design of the final product.

In addition, the top-view or side-view LED can provide a larger viewing angle (orientation angle) along the length direction of the light guide plate. As a result, the dark area is minimized, and the distance between two adjacent LEDs can be increased (the number of LEDs used for the light bar can be reduced). On the other hand, the LED can provide a smaller viewing angle (orientation angle) along the thickness direction of the light guide plate. Thereby, the light emitted by the LED is transmitted to the light guide plate more efficiently. Thereby, the loss of light energy can be reduced. Further, the main light emitting surface of the LED may be set to be substantially orthogonal to the lower electrode surface to form a side-view CSP type LED. When the side-view LED is applied to the edge-light type backlight module, the L-shaped application mounting board designed to use the top-view LED of the light bar is not required. Instead, a flat application mounting board designed to use the lightbar's side-view LEDs will suffice. Removal of the vertical portion of the L-shaped application mounting board reduces the overall thickness and placement difficulty of the light bar. As such, a display using a side-view LED backlight module may have a narrower frame bezel.

Other aspects and embodiments of the disclosure may also be considered. The above summary and the following detailed description are not meant to limit the present disclosure to the particular embodiments, but merely to describe some embodiments of the present disclosure.

FIG. 1A is a perspective view of a top view LED according to one embodiment of the present disclosure. FIG. 1B is a perspective view of a top view LED according to one embodiment of the present disclosure. FIG. 1C is a cross-sectional view of a top view LED according to one embodiment of the present disclosure. FIG. 1D is a cross-sectional view of a top view LED according to one embodiment of the present disclosure. 1E is a cross-sectional view of a top view LED according to one embodiment of the present disclosure. FIG. 2A is a perspective view of a top view LED according to another embodiment of the present disclosure. FIG. 2B is a perspective view of a top view LED according to another embodiment of the present disclosure. FIG. 2C is a cross-sectional view of a top view LED according to another embodiment of the present disclosure. 2D is a cross-sectional view of a top view LED according to another embodiment of the present disclosure. FIG. 3A is a perspective view of a side view LED according to another embodiment of the present disclosure. FIG. 3B is a perspective view of a side view LED according to another embodiment of the present disclosure. FIG. 3C is a cross-sectional view of a side view LED according to another embodiment of the present disclosure. FIG. 3D is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 3E is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 3F is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 4A is a perspective view of a side view LED according to another embodiment of the present disclosure. FIG. 4B is a perspective view of a side view LED according to another embodiment of the present disclosure. FIG. 4C is a cross-sectional view of a side view LED according to another embodiment of the present disclosure. FIG. 4D is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 4E is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 4F is a cross-sectional view of a side-view LED according to another embodiment of the present disclosure. FIG. 4 is a schematic diagram of a backlight module including a top view LED according to one embodiment of the present disclosure. FIG. 3 is a schematic diagram of a backlight module including a side-view LED according to one embodiment of the present disclosure. 6A and 6B are schematic views of the backlight module shown in FIG. 7A and 7B are schematic views of the backlight module shown in FIG. FIG. 8A is a schematic diagram of process steps of a method of manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 8B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 9A is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 9B is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 9C is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 10A is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 10B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 11A is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 11B is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 12A is a schematic diagram of process steps in a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 12B is a schematic diagram of process steps of a method for manufacturing a top-view LED according to one embodiment of the present disclosure. FIG. 13A is a schematic view of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 13B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 14A is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 14B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 14C is a schematic view of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 15A is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 15B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. 16A is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. 16B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 17A is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 17B is a schematic diagram of process steps of a method of manufacturing a top-view LED according to another embodiment of the present disclosure. FIG. 18A is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 18B is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 19A is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 19B is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 19C is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 20A is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. 20B is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 21A is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. 21B is a schematic view of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 22A is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 22B is a schematic diagram of process steps of a method of manufacturing a side-view LED according to another embodiment of the present disclosure. FIG. 23A is a schematic diagram of process steps of a partial manufacturing method of a side-view LED according to another embodiment of the present disclosure. FIG. 23B is a schematic diagram of process steps of a partial manufacturing method of a side-view LED according to another embodiment of the present disclosure. FIG. 23C is a schematic diagram of process steps of a partial manufacturing method of a side-view LED according to another embodiment of the present disclosure.

The following definitions apply to some of the technical aspects described with respect to some embodiments of the present disclosure. These definitions may be elaborated upon throughout the specification.

As used herein, the singular term may include the plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to a layer can include multiple layers unless the context clearly dictates otherwise.

As used herein, the term "set" refers to a collection of one or more components. Thus, for example, a set of layers can include a single layer or multiple layers. A set of components can also be called a member of the set. The set of components may be the same or different. In some cases, a set of components may have one or more common characteristics.

As used herein, the term "adjacent" refers to being adjacent or being adjacent. Adjacent components may be spaced apart from, or substantially in direct contact with, each other. In some cases, adjacent components may be connected to each other or may be integrally formed. In the description of some embodiments, the other component provided “on” one component is that the one component is directly above the other component (eg, physical). Directly in contact with each other), and when one or more intervening components are arranged between the components. In the description of some embodiments, the other component provided “below” one component means that the one component is directly below the other component (eg, physical). In direct contact with each other) and when one or more intervening components are arranged between the components.

As used herein, the terms "connect", "connected" and "connection" refer to an operable bond. The connected components may be directly coupled to each other, or indirectly coupled to each other by interposing a series of other components.

As used herein, the terms "about", "substantially" and "substantially" refer to the degree or limit to be considered. When used in connection with certain situations, such as those that describe typical error tolerance levels for the manufacturing methods described herein, those terms refer to those situations where they are realized without error. When it does, or when it realizes in the near range, it can mean. For example, when used in connection with a numerical value, those terms may include an error range of ±10% or less of the numerical value. For example, includes ±5% or less, ±4% or less, ±3% or less, ±2% or less, ±1% or less, ±0.5% or less, ±0.1% or less, or ±0.05% or less. I'm out. Further, “substantially (almost)” transparent can mean a light transmittance of 70% or more. For example, it means a light transmittance of 75% or more, 80% or more, 85% or more, or 90% or more over a part or the whole of the visible light region. In addition, “substantially (almost)” flat can mean two surfaces within 20 μm that are arranged on the same plane. For example, it means surface steps within 10 μm or within 5 μm arranged on the same plane. Further, “substantially (almost)” parallel can mean a range within ±10° of angular error with respect to 0°. For example, it means a range within ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°. Further, “substantially (almost)” orthogonal may mean a range within ±10° of an angular error with respect to 90°. For example, it means a range within ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°.

As used herein with respect to photoluminescence, the term "efficiency" or "quantum efficiency" refers to the ratio of output photons to input photons.

As used herein, the term "size" refers to a symbolic dimension. For spherical objects (eg particles), the size of the object can mean the diameter of the object. For non-spherical objects, the size of that object may mean the diameter of the corresponding sphere. Here, the corresponding sphere is a set of derivable and measurable features, and has or has the same features as the non-spherical object. When referring to a set of objects having a size, it is considered that those objects have a distribution centered on that size. Therefore, as used herein, the size of a set of objects may refer to a typical value of the size distribution, eg, mean, median, mode.

1A and 1B show perspective views of a top-view light emitting device 1A according to an embodiment of the present disclosure, and FIGS. 1C and 1D show cross-sectional views of the light emitting device 1A. The light emitting device 1A includes an LED element 10, an optical member 20, and a reflecting member 30. The technical details of these components are described in order below.

The LED element 10 is a flip-chip type semiconductor light emitting element. Further, as shown in FIGS. 1C and 1D, it has an upper surface 11, a lower surface 12, an end surface 13, and a set of electrodes 14. The upper surface 11 is arranged on the opposite side of the lower surface 12. The upper surface 11 and the lower surface 12 can be rectangular. Two edges forming the rectangular upper surface 11 (and the corresponding lower surface 12) are substantially parallel to the first horizontal direction D1, and the other two edges are substantially parallel to the second horizontal direction D2. Is. In other words, the first and second horizontal directions D1 and D2 are defined to be orthogonal to each other along the length direction and the width direction on the upper surface 11 of the LED element 10, respectively. The thickness direction (direction orthogonal to the upper surface 11, not shown) is defined to be along the vertical direction, which is orthogonal to both the first and second horizontal directions D1 and D2.

The end surface 13 is formed between the upper surface 11 and the lower surface 12, contacts the peripheral edges of the upper surface 11 and the lower surface 12, and extends. In other words, the end surface 13 is formed along the peripheral edges of the upper surface 11 and the lower surface 12, and has an annular shape (for example, a rectangular ring) with respect to the upper surface 11 and the lower surface 12. Further, the end surface 13 includes vertical end surfaces 131a to 131d (the end surface 13 is divided into four vertical end surfaces 131a to 131d). The two vertical end faces 131a and 131c are arranged on opposite sides of each other and are orthogonal to the first horizontal direction D1. The other two vertical end faces 131b and 131d are arranged on the opposite sides to each other and are orthogonal to the second horizontal direction D2.

A set of electrodes 14 having two or more electrodes is disposed on the lower surface 12 either directly or in close proximity. Hereinafter, the pair of electrodes 14 and the lower surface 12 will be collectively referred to as a lower electrode surface. The light emitting active layer (not shown) of the LED element 10 is located near the lower surface 12 and above the electrode 14. The space defined by the active layer, the upper surface 11, and the four vertical end surfaces 131a to 131d is formed by a transparent substrate material (for example, sapphire). Electric energy (not shown) is supplied to the LED element 10 via the electrode 14 to excite the active layer, so that primary light can be emitted by electroluminescence (conversion of electric energy to light energy). Since the LED element 10 is a flip-chip type, there is no electrode on the upper surface 11, and the light emitted from the active layer is similarly sent to the outside of the LED element 10 from the upper surface 11 and also from the vertical end surfaces 131a to 131d. sell.

Since the white LED is formed on the optical member 20, the photoluminescent member 20 can be used as an example. Further, in order to form a monochromatic LED, as another example, a substantially transparent translucent member 20 can be used. Hereinafter, in order to describe the technical features of the light emitting device 1A, first, the photoluminescent member 20 will be used as an example. The photoluminescent member 20 can be used to combine a light beam L by converting a part of the primary light emitted from the LED element 10 into secondary light having a different wavelength. The photoluminescent member 20 includes a translucent resin material and a photoluminescent material (phosphor material). Since the photoluminescent material is uniformly dispersed in the translucent resin material, the photoluminescent member 20 does not have a clear layered structure. However, a photoluminescent layer and a substantially transparent light-transmitting layer (or light-transmitting structure) that are alternately stacked may be included. For specific technical details, US Patent Application No. 15/416,921 (US Patent Application Publication No. 2017/0222107) relating to a photoluminescent member in which a light transmitting layer is laminated on a photoluminescent layer is described. ) Can be referred to.

As shown in FIGS. 1A to 1D, the photoluminescent member 20 has a top surface 21, a bottom surface 22, and a side surface 23. The top surface 21 and the bottom surface 22 are arranged on opposite sides of each other, and can have a rectangular shape. Two edges of the top surface 21 are substantially parallel to the first horizontal direction D1, and the other two edges are substantially parallel to the second horizontal direction D2. The bottom surface 22 of the photoluminescent member 20 and the bottom surface 12 of the LED element 10 together form the bottom surface of the light emitting device 1A. The top surface 21 and the bottom surface 22 are horizontal surfaces and may be substantially parallel to each other.

The side surface 23 is formed between the top surface 21 and the bottom surface 22 and is connected to their peripheral edges. In other words, the side surface 23 is formed along the peripheral edges of the top surface 21 and the bottom surface 22 and has an annular shape (for example, a rectangular ring). Further, the side surface 23 includes four vertical side surfaces 231a to 231d (the side surface 23 is divided into four vertical side surfaces 231a to 231d). The two vertical side surfaces 231a and 231c are arranged on opposite sides of each other and are orthogonal to the first horizontal direction D1. The other two vertical side surfaces 231b and 231d are arranged on opposite sides to each other and are aligned with the second horizontal direction D2.

Regarding the relative position, the photoluminescent member 20 is arranged on the LED element 10, and the upper surface 11 and the end surface 13 of the LED element 10 are almost completely (for example, at least 90%, 95% of the entire surface, 98%, 99%, or more). As a result, the top surface 21 of the photoluminescent member 20 is located above the upper surface 11 of the LED element 10.

As shown in FIG. 1C, the reflecting member 30 blocks/reflects the light beam L to limit the radiation angle (directivity angle) of the light beam L. In the present embodiment, the reflection member 30 partially covers the side surface 23 of the photoluminescent member 20, and covers one surface of the side surface 23 alone (similarly, 1 of the end surfaces 13 of the LED element 10 is covered). Indirectly obscuring one surface). Specifically, of the four vertical side surfaces, one of the vertical side surfaces orthogonal to the second horizontal direction D2, for example, the vertical side surface 231b is directly covered by the reflecting member 30 to form a side reflector. .. Along with the vertical side surface 231b, the vertical end surface 131b of the LED element 10 is directly or indirectly covered with the reflecting member 30. In other words, the other vertical side surfaces 231d, the vertical side surfaces 231a and 231c that are arranged to face each other and are orthogonal to the first horizontal direction D1, and the top surface 21 are not covered by the reflecting member 30. That is, the vertical side surfaces 231a, 231c, 231d and the top surface 21 which are not covered with the reflecting member 30 respectively constitute three side light emitting surfaces and upper light emitting surfaces. The light partially emitted from the LED element 10, partially wavelength-converted by the photoluminescent member 20, and propagating to the vertical side surface 231b is reflected (or absorbed) by the reflecting member 30 and is combined with other light components. Then, the light beam L is formed. The light beam L is emitted to the outside of the photoluminescent member 20 from the light emitting surface, that is, the vertical side surfaces 231a, 231c, 231d and the top surface 21.

It is desirable that the side light emitting surface and the lower electrode surface are substantially orthogonal to each other. That is, they are designed to be manufactured orthogonally to each other. As a result, the side light emitting surface may be slightly inclined with respect to the lower electrode surface due to an error/variation in the manufacturing process or other factors. If the inclination angle is small, it is considered that the side light emitting surface and the lower electrode surface are substantially orthogonal to each other. Further, it is desirable that the upper light emitting surface and the lower electrode surface are substantially parallel. That is, they are designed to be manufactured parallel to each other. However, the upper light emitting surface may be slightly inclined with respect to the lower electrode surface due to an error/variation in the manufacturing process. If the inclination is slight, the upper light emitting surface and the lower electrode surface are considered to be substantially parallel.

When the reflecting member 30 covers the side surface 23, it is desirable that the reflecting member 30 is in contact with the side surface 23 so that there is substantially no gap between the reflecting member 30 and the side surface 23. Therefore, the reflecting member 30 is assumed to have an inner side surface 33 that is in close contact with the side surface 23 and an outer side surface 34 that faces the inner side surface 33 and functions as a side reflecting surface. The outer surface 34 may be a vertical surface. Similarly, the top surface 31 and the bottom surface of the reflection member 30 can be made substantially flat with the top surface 21 and the bottom surface 22 of the photoluminescent member 20, respectively.

As for the manufacturing material, the reflecting member 30 is made of a material containing a translucent resin material and light scattering particles dispersed in the resin material. As the translucent resin material, for example, polyphthalamide (PPA), polycyclohexylene-dimethylene terephthalate (PCT), epoxy encapsulant (EMC), or silicone can be used. Further, as the light scattering particles, for example, titanium dioxide particles, boron nitride particles, silicon dioxide particles, aluminum oxide particles, or other ceramic particles can be used.

In addition, the light emitting device 1A may include a submount substrate 50 (see FIG. 1E). As the submount substrate 50, a ceramic substrate, a glass substrate, a silicon substrate, a printed wiring board (PCB), a metal core PCB, or the like can be used. The submount substrate 50 has wiring (not shown) for supplying electric power. When the light emitting device 1A is electrically connected to the submount substrate 50, electric power can be transmitted to the light emitting device 1A through the submount substrate 50 and light can be emitted from the light emitting device 1A. The light emitting device 1A mounted on the submount substrate 50 can facilitate the mounting process such as the surface mounting process for module application. The submount substrate 50 may be used in other embodiments of the present disclosure.

The above is the technical content of each component of the light emitting device 1A. The light emitting device has at least the following technical features.

As shown in FIGS. 1C and 1D, the primary light emitted from the LED element 10 enters the photoluminescent member 20. After that, the light beam L travels toward the vertical side surface 231b, is reflected by the reflecting member 30, and is combined with other light components. Finally, the light beam L passes through the photoluminescent member 20 and is emitted from the side light emitting surface (vertical side surfaces 231a, 231c, 231d) or the upper light emitting surface (top surface 21). The light beam L propagating along the first horizontal direction D1 is not significantly affected or limited by the reflecting member 30. Therefore, the viewing angle (orientation angle) becomes larger. On the other hand, the light beam L propagating toward the vertical side surface 231b along the second horizontal direction D2 is shielded and reflected by the reflecting member 30. Therefore, the viewing angle becomes smaller than that applied in the first horizontal direction D1. The light beam L is directed again toward the vertical side surface 231d that is not shielded by the reflection member 30. Therefore, a radiation pattern asymmetric with respect to the normal line direction of the upper surface 11 of the LED element 10 (for example, the optical axis of the upper surface 11) is formed. Usually, the viewing angle (directivity angle) of the light beam L along the first horizontal direction D1 becomes larger. Further, the viewing angle (directivity angle) of the light beam L along the second horizontal direction D2 becomes smaller, and its radiation pattern becomes asymmetric.

Regarding the top surface 21 of the photoluminescent member 20, the length along the first horizontal direction D1 is preferably larger than the width along the second horizontal direction D2. This is useful for making the viewing angle along the first horizontal direction D1 of the light beam L larger than the viewing angle along the second horizontal direction D2.

In summary, the light emitting device 1A can realize mutually different viewing angles along the first and second horizontal directions D1 and D2. Further, it is possible to realize a radiation pattern that is asymmetric with respect to the normal direction of the light emitting surface along the predetermined horizontal direction.

Another embodiment of the optical member 20 of the light emitting device 1A is a substantially transparent light transmitting member 20. Thereby, the monochromatic light emitting device 1A can be formed. As another example, a substantially transparent light-transmissive member 20 may be used to form a single-color LED. That is, the light emitting device 1A includes the LED element 10, the translucent member 20 (or the translucent layer), and the reflective member 30. Accordingly, the light emitted by the LED element 10 is not wavelength-converted when passing through the translucent member 20. The light emitting device 1A having the translucent member 20 may be used to generate monochromatic light such as red light, green light, blue light, infrared light, and ultraviolet light, which has an asymmetric radiation pattern. it can. Such a translucent member may be used in the following other embodiments.

In addition, the light emitting device 1A may further include a fine lens layer 40 (see FIG. 1E). The fine lens layer 40 is preferably formed simultaneously with the formation of the optical member 20 and integrally with the optical member 20. The optical member 20 is manufactured by casting (molding) or another method. The fine lens layer 40 can be composed of a plurality of fine structures that are regularly arranged or irregularly formed. The microstructure may have a hemispherical shape, a pyramid shape, a cylindrical shape, a conical shape, or a rough surface. Thereby, the fine lens layer 40 can prevent the light emitted from the light emitting device 1A from being reflected and returned to the optical member 20 by total reflection. This increases the light extraction efficiency of the light emitting device 1A and also improves the light emission efficiency. Such fine lens layers may be used in other embodiments described in this disclosure.

The above is the description of the technical features of the light emitting device 1A. Next, technical features of the light emitting device according to another embodiment of the present disclosure will be described. The technical features of the light emitting devices are referred to each other, and similar or similar technical features are omitted or simplified for convenience.

2A and 2B are perspective views of a light emitting device 2A according to another embodiment, and FIGS. 2C and 2D are cross-sectional views of the light emitting device 2A. For the sake of explanation, the photoluminescent member 20 is used as an example of the optical member 20. In the light emitting device 2A, the area of the bottom surface 22 of the photoluminescent member 20 is larger than the area of the upper surface 11 of the LED element 10, and the upper surface 11 of the LED element 10 is completely covered by the photoluminescent member 20. At least, it is different from the light emitting device 1A. Further, the end surface 13 of the LED element 10 is surrounded and covered by the reflecting member 30. More detailed details are as follows.

The area of the upper surface 11 of the LED element 10 is smaller than the area of the bottom surface 22 of the photoluminescent member 20, and is completely covered by the photoluminescent member 20. The four vertical end faces 131 a to 131 d of the LED element 10 are not covered by the photoluminescent member 20, but are covered by the reflective member 30. The primary light generated in the LED element 10 can be emitted from the upper surface 11 exclusively or mostly, and can be transmitted through the photoluminescent member 20. One of the vertical side surfaces 231b and 231d of the photoluminescent member 20, for example, the vertical side surface 231b as shown in FIG. 2C is covered with the reflecting member 30 and constitutes a side reflecting surface. The vertical side surfaces 231a and 231c and the top surface 21 are not covered with the reflection member 30. That is, it is exposed to the outside of the reflection member 30. The vertical side surfaces 231a, 231c, 231d and the top surface 21 which are not covered by the reflecting member 30 respectively constitute three side light emitting surfaces and an upper light emitting surface.

The light beam L is emitted from the upper surface 11 of the LED element 10 and is incident on the photoluminescent member 20. After that, a part of the light beam L propagating toward the vertical side surface 231b is reflected (or absorbed) by the reflection member 30 and is combined with another part of the light beam L, and the vertical side surfaces 231a, 231c, 231d and the top surface. The light is emitted from the surface 21 to the outside of the photoluminescent member 20. Therefore, the viewing angle (directivity angle) of the light beam L along the first horizontal direction D1 is less likely to be affected by the reflecting member 30. Since the vertical side surface 213b is blocked by the reflecting member 30, the viewing angle (directivity angle) of the light beam L along the second horizontal direction D2 is limited, and its radiation pattern is not covered by the reflecting member 30. Biased towards. That is, the radiation pattern along the second horizontal direction D2 is asymmetric with respect to the normal line direction of the upper surface 11 of the LED element 10 (for example, the optical axis of the upper surface 11).

Therefore, the light emitting device 2A can also realize mutually different viewing angles in the first and second horizontal directions D1 and D2, and achieves the purpose of providing an asymmetric radiation pattern. Further, the light emitting device 2A has an asymmetrical radiation pattern along the second horizontal direction with respect to the optical axis of the upper surface 11 of the LED element 10.

3A to 3D show two perspective views and two sectional views of a light emitting device 3A according to another embodiment of the present disclosure. For the sake of explanation, the photoluminescent member 20 is used as the optical member 20 as an example. The light emitting device 3A differs from at least the light emitting device 2A in that the upper surface 11 of the LED element 10 and the four vertical end faces 131a to 131d are covered with the photoluminescent member 20. The top surface 21 of the photoluminescent member 20 is almost completely covered (eg, at least 90%, 95%, 98%, 99%, or more of the total surface) by the reflective member 30 and the top reflection Make up a surface. Further, the side surface 23 is partially covered with the reflecting member 30.

More specifically, one of the vertical side surfaces 231b, 231d of the photoluminescent member 20 (for example, the vertical side surface 231d as shown in FIG. 3C) and the top surface 21 are both covered by the reflective member 30. , Which respectively constitute a side reflection surface and an upper reflection surface. Since the vertical side surfaces 231a to 231c are not covered with the reflecting member 30 and are exposed, the light emitting device 3A has three side light emitting surfaces.

After the primary light is emitted from the LED element 10 and is incident on the photoluminescent member 20, a part of the light propagating toward the vertical side surface 231d or the top surface 21 is reflected (or absorbed) by the reflecting member 30, It is combined with other light to form a light beam L, which is emitted from any of the vertical side surfaces 231a, 231b, 231c of the photoluminescent member 20. Therefore, the viewing angle of the light beam L along the second horizontal direction D2 is limited. Compared with the light emitting devices 1A and 2A that emit light mainly from the top surface (slightly from the vertical side faces), the light emitting device 3A has a light beam mainly from the vertical side faces 231b (slightly from the vertical side faces 231a and 231c). Emit L. Therefore, most of the light transmitted laterally is emitted, forming a side-view LED.

Since most of the light is emitted from the vertical side surface 231b, the vertical side surface 231b becomes the main light emitting surface of the light emitting device 3A. Since the main light emitting surface and the lower electrode surface of the LED element 10 are substantially orthogonal to each other, the light emitting device 3A is a side-view CSP type LED. For convenience, the length direction S1 and the width direction S2 that are orthogonal to each other are defined along the vertical side surface 231b (main light emitting surface) so as to be substantially orthogonal to the second horizontal direction D2. In the present embodiment, because of the reflecting member 30, the light beam L is emitted from the vertical side surfaces 231a, 231b, 231c (three side light emitting surfaces) exclusively or mostly. Therefore, the light emitting device 3A has a larger viewing angle (orientation angle) along the length direction S1. On the other hand, since the top surface 21 of the photoluminescent member 20 is covered with the reflecting member 30, the light emitting device 3A has a smaller viewing angle along the width direction S2. Therefore, the light emitting device 3A can realize different viewing angles in the length direction S1 and the width direction S2. Further, unlike the light emitting devices 1A and 2A, the main light emitting surface of the light emitting device 3A is orthogonal to the lower electrode surface of the LED element 10. Therefore, the light emitting device 3A is a side-view LED and, in addition, also provides asymmetric lighting applications.

3E and 3F are schematic cross-sectional views of a light emitting device 3B according to another embodiment of the present disclosure. For the sake of explanation, the photoluminescent member 20 is used as the optical member 20 as an example. In the light emitting device 3B, the photoluminescent member 20 covers the end surface 13 of the LED element 10 (without covering the upper surface 11), and the reflective member 30 serves as the upper surface 11 of the LED element 10 and the top of the photoluminescent member 20. At least the light emitting device 3A is different in that it covers both the surfaces 21.

Specifically, the photoluminescent member 20 of the light emitting device 3B covers the end surface 13 of the LED element 10. Further, desirably, the top surface 21 of the photoluminescent member 20 constitutes the same plane as the upper surface 11 of the LED element 10 or is substantially flat. The reflecting member 30 is arranged so as to cover both the upper surface 11 and the top surface 21, and constitutes an upper reflecting surface. In addition, one of the vertical side surfaces 231b and 231d of the photoluminescent member 20 (for example, the vertical side surface 231d as shown in FIG. 3E) is covered with the reflective member 30 to form a side reflective surface. The vertical side surfaces 231a, 231b, 231c are not covered with the reflecting member 30 and are exposed, and form three side light emitting surfaces.

After the primary light is emitted from the end face 13 of the LED element 10 exclusively or mostly and is incident on the photoluminescent member 20, a part of the light propagating toward the vertical side surface 231d is reflected by the reflecting member 30 ( Or, it is absorbed), is combined with a part of another light beam L, and is emitted from any of the vertical side surfaces 231a, 231b, and 231c of the photoluminescent member 20. In the light emitting device 3A, during light propagation, multiple reflection may occur between the upper surface 11 of the LED element 10 and the top surface 21 of the photoluminescent member 20, and light energy may be lost. In the light emitting device 3B, the upper surface 11 of the LED element 10 is directly covered with the reflecting member 30, so that energy loss due to multiple reflection can be avoided and the light extraction efficiency can be improved.

In the light emitting devices 3A and 3B, in order to prevent energy loss due to multiple reflection, the width of the LED element 10 along the second horizontal direction D2 is smaller than the length of the LED element 10 along the first horizontal direction D1. Is desirable. In the present embodiment, if the dimension along the second horizontal direction D2 is smaller, the optical path of light propagating toward the vertical side surface 231d and reflected by the reflecting member 30 may be shorter. The light beam L is emitted from any of the vertical side surfaces 231a, 231b, and 231c of the photoluminescent member 20 together with other light.

Next, FIGS. 4A to 4D show two perspective views and two cross-sectional views of a light emitting device 4A according to another embodiment of the present disclosure. For the sake of explanation, the photoluminescent member 20 is used as the optical member 20 as an example. In the light emitting device 4A, the upper surface 11 of the LED element 10 and the four vertical end surfaces 131a to 131d are covered with the photoluminescent member 20, and the top surface 21 of the photoluminescent member 20 and the three vertical side surfaces are completely reflective members. At least different from the light emitting device 3A in that it is covered with 30.

Specifically, one of the vertical side surfaces 231b and 231d of the photoluminescent member 20 (for example, the vertical side surface 231d as shown in FIG. 4C), the vertical side surfaces 231a and 231c, and the top surface 21 are both reflected. Covered by member 30, each constituting three lateral and upper reflective surfaces. The vertical side surface 231b is not covered by the reflection member 30 and is exposed, and constitutes a side light emitting surface.

Specifically, after the primary light is emitted from the LED element 10 and is incident on the photoluminescent member 20, a part of the light propagating toward the vertical side surfaces 231a, 231c, 231d and the top surface 21 is reflected by the reflecting member. The light is reflected (or absorbed) by 30, is combined with other emitted light, and is emitted from the vertical side surface 231 b of the photoluminescent member 20. The direction of the main light emitting surface of the light emitting device 4A is different from the direction of the main light emitting surface of the light emitting devices 1A and 2A, and is substantially orthogonal to the lower electrode surface of the LED element 10. Therefore, the light emitting device 4A can also be used as a side view LED.

4E and 4F are schematic cross-sectional views of a light emitting device 4B according to another embodiment of the present disclosure. For the sake of explanation, the photoluminescent member 20 is used as the optical member 20 as an example. In the light emitting device 4B, the photoluminescent member 20 covers the end surface 13 of the LED element 10 (without covering the upper surface 11), and the reflective member 30 serves as the upper surface 11 of the LED element 10 and the top of the photoluminescent member 20. It differs from at least the light emitting device 4A in that it covers the surface 21 together and also covers the three vertical side surfaces 231a, 231c, 231d in the same manner.

The photoluminescent member 20 covers the end surface 13 of the LED element 10. Further, desirably, the top surface 21 of the photoluminescent member 20 constitutes the same plane as the upper surface 11 of the LED element 10 or is substantially flat. The reflecting member 30 covers both the upper surface 11 and the top surface 21 to form an upper reflecting surface. In addition, one of the vertical side surfaces 231b and 231d of the photoluminescent member 20 (for example, the vertical side surface 231d as shown in FIG. 4E), the vertical side surfaces 231a and 231c, and the top surface 21 cover the reflective member 30. It is being appreciated. The vertical side surfaces 231a, 231c, 231d are covered with the reflection member 30 and form three side reflection surfaces. On the other hand, the vertical side surface 231b is not covered by the reflection member 30 and is exposed, and constitutes a side light emitting surface.

A part of the primary light emitted from the end face 13 of the LED element 10 exclusively or in large part, incident on the photoluminescent member 20, and then propagating toward the three vertical side faces 231a, 231c, 231d or the top face 21. The light is reflected (or absorbed) by the reflection member 30, is combined with a part of another light beam L, and is emitted from the vertical side surface 231b of the photoluminescent member 20. In the light emitting device 4B, similarly to the advantage of the light emitting device 3B, the upper surface 11 of the LED element 10 is directly covered with the reflecting member 30, so that energy loss due to multiple reflection is avoided and the light extraction efficiency is improved.

In the light emitting devices 4A and 4B, in order to prevent energy loss due to multiple reflection, the width of the LED element 10 along the second horizontal direction D2 is smaller than the length of the LED element 10 along the first horizontal direction D1. Is preferred. Thereby, the optical path of the light propagating toward the vertical side surfaces 231a, 231c, 231d or the top surface 21 and reflected by the reflecting member 30 becomes shorter. After that, the light beam L is combined with other light beams L and emitted from the vertical side surface 231b of the photoluminescent member 20.

In summary, the light emitting devices 1A, 2A, 3A, 3B, 4A and 4B can realize the following common advantages. Since all of these light emitting devices are CSP type LEDs, there is a factor that they can be miniaturized. The length (or width) of the light emitting devices 1A, 2A, 3A, 3B, 4A, 4B is about 2.0 times, about 1.6 times or about 1.2 times the length (or width) of the LED element 10. Not longer than twice as long. Thereby, it is suitable for being incorporated in an electronic device.

Furthermore, since an asymmetric radiation pattern can be generated without incorporating a primary optical lens or a secondary optical lens, the cost of the entire optical system can be reduced. Also, the space for the optical lens can be saved.

In addition, the light emitting device according to the embodiments of the present disclosure brings design advantages to the final product. For example, the light emitting device according to the present embodiment can be used instead of the PLCC type LED as a light source of an edge light type backlight module for an LCD TV or a mobile device. Since a larger viewing angle (orientation angle) can be provided along the length direction of the backlight module, the area of dark spots or dark regions can be reduced. In addition, since the spatial distance between adjacent light emitting devices can be increased, the number of light emitting devices used for the light bar can be reduced. Furthermore, since a smaller viewing angle can be provided along the thickness direction of the backlight module, the light emitted from the light emitting device can be efficiently introduced into the light guide plate of the backlight module, resulting in light energy loss. Can be reduced.

In addition, the light emitting device according to some embodiments of the present disclosure may be a side-view CSP type LED with the main light emitting surface and the lower electrode surface being substantially orthogonal. When such a light emitting device is applied to an edge light type backlight module, it is not necessary to provide a vertical surface on an application mounting board used for the backlight module (the technical structure of the backlight module 600 shown in FIG. 6 described below. See content). As a result, it is possible to minimize the overall thickness of the backlight module along the normal direction of the main light emitting surface of the light emitting device and reduce the difficulty in designing and manufacturing. A display using such a backlight module can realize a narrower bezel frame.

In addition, the light emitted by the light emitting devices 1A, 2A, 3A, 3B, 4A, 4B can be combined with an additional secondary optical lens for a more asymmetrical shape for applications requiring a more asymmetrical radiation pattern. May be

In addition, the technical features disclosed in the above-described light emitting device 1A, for example, the substantially transparent light transmitting member 20 as one embodiment of the optical member 20 is also applied to the light emitting devices 2A, 3A, 3B, 4A, 4B. , A monochromatic CSP LED with an asymmetric radiation pattern may be formed. Other technical features disclosed in the light emitting device 1A, such as features including a fine lens layer and a submount substrate, can also be applied to the light emitting devices 2A, 3A, 3B, 4A, 4B.

Next, a backlight module including any of the above light emitting devices will be described. 5 and 6 show backlight modules having various configurations. The backlight module shown in FIG. 5 includes a plurality of light emitting devices 1A or 2A that emit light from the top surface 21. The backlight module shown in FIG. 6 includes a plurality of light emitting devices 3A, light emitting devices 3B, light emitting devices 4A or 4B that emit light from the side light emitting surfaces. The backlight module further includes an application mounting board (AMB, a component mounting board), or any one of the light emitting devices described above (including a photoluminescent member for white light, and translucent for monochromatic light). (Including members), a reflective layer, and a light guide plate.

The backlight module 500 shown in FIG. 5 includes an application mounting board 510, an LED (for example, the light emitting device 1A) that emits light from the top surface 21, a reflective layer 520, and a light guide plate 530. The application mounting board 510 includes a horizontal portion 511 having a horizontal surface, a vertical portion 512 having a vertical surface, and a reflective film 513. The horizontal portion 511 and the vertical portion 512 are substantially orthogonal to each other. The reflective film 513 covers at least the horizontal surface of the horizontal portion 511 and/or the vertical surface of the vertical portion 512. For example, as shown in FIG. 5, both the horizontal surface of the horizontal portion 511 and the vertical surface of the vertical portion 512 are covered with the reflective film 513. The reflection film 513 can be, for example, a metal thin film, a metal plate material, or a high reflectance white paint. In addition, the application mounting board 510 may be flexible.

As shown in FIG. 5, the light emitting device 1A is arranged on the vertical surface of the vertical portion 512 of the application mounting board 510. The electrode 14 of the LED element 10 is electrically connected to the application mounting board 510. The light emitting device 1A is arranged as follows. That is, along the second horizontal direction D2, the vertical side surface 231d not covered by the reflection member 30 faces the horizontal surface of the horizontal portion 511 of the application mounting board 510, and the vertical side surface 231b covered by the reflection member 30 is formed. It is arranged so that it faces away from the horizontal part 511.

The reflective layer 520 is disposed above the horizontal portion 511 of the application mounting board 510 (above the reflective film 513) and extends away from the vertical portion 512 and the light emitting device 1A. The reflective layer 520 can be, for example, a metal thin film or a metal plate material. The light guide plate 530 is disposed on the reflective layer 520 and includes a light incident side surface 531 and a light exit surface 532 that are substantially orthogonal to each other. The light exit surface 532 is connected to the light entrance side surface 531 and is arranged substantially parallel to the reflective layer 520 apart from (facing the opposite side of the reflective layer 520).

The top surface 21 of the light emitting device 1A faces the light incident side surface 531 of the light guide plate 530. The length of the light emitting device 1A along the second horizontal direction D2 is preferably not larger than the thickness of the light guide plate 530 along the normal line of the light output surface 532. In other words, the size of the light emitting surface of the light emitting device 1A is preferably smaller than the size of the light incident side surface 531 of the light guide plate 530. Accordingly, the light emitted from the top surface 21 of the light emitting device 1A can be efficiently transmitted to the light incident side surface 531 of the light guide plate 530. Since the vertical side surface 231d of the light emitting device 1A is not covered with the reflective member 30, most of the light emitted from the vertical side surface 231d is emitted toward the reflective film 513. The reflective film 513 can be easily manufactured using a high-reflectance material, and its reflectance can be made higher than that of the reflecting member 30. The light emitted toward the reflection film 513 (for example, the light beam L1 as shown in FIG. 5) is reflected by the reflection film 513 and then guided to the light incident side surface 531 more efficiently. Thus, the light energy loss is reduced, and the backlight module 500 may have higher light energy utilization efficiency. The light is reflected by the reflection layer 520 disposed under the light guide plate 530, and most of the light is emitted from the light exit surface 532 of the light guide plate.

As shown in FIG. 6, the backlight module 600 includes an application mounting board 610, a plurality of side light emitting (side view) LEDs (for example, the light emitting device 3A), a reflective layer 620, and a light guide plate 630. The application mounting board 610 includes a horizontal portion 611 having a horizontal surface, and a reflective film 613 disposed on the horizontal surface of the horizontal portion 611 and covering the horizontal surface.

The light emitting device 3A is arranged on the horizontal portion 611 of the application mounting board 610. The electrode 14 of the LED element 10 is electrically connected to the application mounting board 610. The reflective layer 620 is also disposed above the horizontal portion 611 of the application mounting board 610 and extends away from the light emitting device 3A. The light guide plate 630 is disposed above the reflective layer 620 and includes a light incident side surface 631 and a light exit surface 632 that are substantially orthogonal to each other. The light emitting surface 632 is connected to the light incident side surface 631 and faces the opposite side of the reflective layer 620 and is arranged substantially in parallel.

As shown in FIG. 6, the vertical side surface 231b of the light emitting device 3A, which is substantially orthogonal to the second horizontal direction D2, is not covered by the reflective member 30 and faces the light incident side surface 631 of the light guide plate 630. There is. On the other hand, the vertical side surface 231d is covered with the reflection member 30 and faces the light incident side surface 631. In addition, the length of the light emitting device 3A along the normal direction of the upper surface 11 of the LED element 10 is preferably not thicker than the thickness of the light guide plate 630 along the normal direction of the light emitting surface 632.

The light emitted from the three vertical side surfaces 231a, 231b, 231c of the light emitting device 3A can be efficiently transmitted to the light incident side surface 631 of the light guide plate 630 by the guidance of the reflection member 30 and the reflection film 613. The light is reflected by the reflective layer 620 under the light guide plate 630, and most of the light can be emitted from the light exit surface 632 of the light guide plate 630. Compared to the backlight module 500, the application mounting board 610 of the backlight module 600 includes a horizontal portion 611 but no other vertical portion. Therefore, the application mounting board 610 should be accommodated along the direction of the light emitting surface of the light bar module (including the application mounting board 610 and the light emitting device 3A) (the second horizontal direction D2 shown in FIG. 6). Instead, it includes a space for housing the light emitting device 3A. Therefore, the light bar module can have a smaller size along the D2 direction. This is an advantage for designing and manufacturing LCD panels with narrower bezel frames.

7A and 7B show a side view and a top view of a backlight module 600 including a plurality of light emitting devices 3A and a plurality of light emitting devices 4A, respectively. The light emitting device 3A may emit light from the three vertical side surfaces 231a, 231b, 231c. Therefore, the viewing angle (orientation angle) of the light emitting device 3A along the first horizontal direction D1 shown in FIG. 7A is larger than the viewing angle of the light emitting device 4A along the first horizontal direction D1 shown in FIG. 7B. Therefore, it is possible to effectively reduce the dark region of the light guide plate 630 that may occur in the gap between the adjacent light emitting devices 3A. Further, the interval between the adjacent light emitting devices 3A can be widened to reduce the number of the light emitting devices 3A used in the backlight module 600. Therefore, the cost of the entire module can be reduced. On the other hand, the light emitting device 4A has a technical feature that the emitted light is more concentrated in the light emitting direction orthogonal to the first horizontal direction D1.

Next, a method of manufacturing the light emitting device according to the embodiment of the present disclosure will be described. The manufacturing method may include at least two process steps. The first is a step of providing a photoluminescent member 20 (which may be a translucent member, which will not be described in detail below) covering the upper surface 11 and/or the end surface 13 of the LED element 10. The second is a step of forming the reflection member 30 that partially covers the side surface 23 of the photoluminescent member 20 (or the translucent member). Hereinafter, with reference to the technical details of the embodiments of the light emitting devices 1A to 4B, the technical details of the manufacturing method thereof will be sequentially described as an example.

8A to 12B are schematic views showing process steps in the method for manufacturing the light emitting device 1A according to the embodiment of the present disclosure.

As shown in FIG. 8A, first, a plurality of LED elements 10 are arranged on the release material 80 at a predetermined pitch to form an array of LED elements 10. It is desirable to press the LED element 10 against the release material 80 so that the set of electrodes 14 is embedded in the release material 80 without being exposed. The release material 80 can be a release film, an ultraviolet ray or a heat release tape, or the like. As shown in FIG. 8B, the photoluminescent member 20 is arranged on the LED element 10 so as to almost completely cover the upper surface 11 and the end surface 13 of each of the LED elements 10.

As shown in FIGS. 9A to 9C, a part of the photoluminescent member 20 is cut and removed along the first horizontal direction D1 to form a first trench 90. Here, the first trench 90 is assumed to be formed along one vertical end face 13 (for example, the vertical end face 131b) of the LED element 10. The formation of the first trench 90 exposes the vertical side surface 231b that is covered later by the reflective member 30.

As shown in FIGS. 10A and 10B, after the cutting process is completed, the reflecting member 30 is formed by molding (casting) or dispensing (dispensing) so as to fill the gap in the first trench 90. Here, the vertical end surface 231b of the photoluminescent member 20 is almost completely covered by the reflecting member 30, and the top surface 21 thereof is exposed to make the surface substantially the same as the top surface 31 of the reflecting member 30.

When the molding method is used to form the reflection member 30, the photoluminescent member 20, the LED element 10, and the release material 80 are arranged in a mold (not shown), and the material of the reflection member 30 is injected into the mold. To cover the vertical side surface 231b of the photoluminescent member 20. Then, when the material is hardened, the reflection member 30 is formed. When the dispensing method is used to form the reflection member 30, the above-mentioned mold is not used, and instead, the material of the reflection member 30 is directly arranged on the release material 80. Then, the material gradually increases on the release material 80 and covers the vertical side surface 231b of the photoluminescent member 20. At this time, in order to prevent the material of the reflective member 30 from spreading to the top surface 21 of the photoluminescent member 20, the top surface 31 of the reflective member 30 becomes slightly lower than the top surface 21 of the photoluminescent member 20. May be designed as

As shown in FIGS. 11A and 11B, after forming the reflecting member 30, the release material 80 is removed to obtain an array of connected light emitting devices 1A. The reflection member 30 of the light emitting device 1A may be connected. In the singularization process (shown in FIGS. 12A and 12B), the photoluminescent member 20 and the reflecting member 30 which are connected are cut along the second horizontal direction D2, and the vertical side surface not covered by the reflecting member 30. 231a and 231c will be formed. Similarly, in another singularization process, the photoluminescent member 20 and the reflecting member 30 which are connected are cut along the first horizontal direction D1, and the vertical side face 231d and the vertical side face 231b covered by the reflecting member 30 are cut. Is formed. By such a method, a plurality of light emitting devices 1A separated from each other can be obtained. Here, the vertical side surface 231b is covered with the reflection member 30.

The above is the description of the method for manufacturing the light emitting device 1A. Next, a method for manufacturing the light emitting device 2A will be described. The manufacturing method of the light emitting device 2A is partially the same as or similar to that of the light emitting device 1A, and thus detailed description of the similar steps will be appropriately omitted.

13A to 17B are schematic diagrams showing process steps in a manufacturing method for manufacturing the light emitting device 2A.

As shown in FIG. 13A, first, the release material 80 is prepared, and the photoluminescent member 20 is formed on the release material 80 by a method such as spray coating, printing, or casting. Alternatively, first, the photoluminescent member 20 is completed, and then the photoluminescent member 20 is attached onto the release material 80 so that the top surface 21 faces the release material 80.

Next, as shown in FIG. 13B, the plurality of LED elements 10 are arranged on the photoluminescent member 20 so that the upper surface 11 of each LED element 10 faces the photoluminescent member 20. At this time, the electrodes 14 of the individual LED elements 10 are exposed, facing the opposite side of the photoluminescent member 20.

Next, as shown in FIGS. 14A to 14C, the photoluminescent member 20 is cut along the first horizontal direction D1 to remove a part of the photoluminescent member 20 to remove the first trench. 90' is formed. The first trench 90' is formed near a predetermined end (for example, the vertical end surface 131b) of the LED element 10. As shown in FIG. 14B, the photoluminescent member 20 is connected along the first horizontal direction D1 even after the removal step is completed. As shown in FIG. 14C, the photoluminescent member 20 is separated along the second horizontal direction D<b>2 by the first trench 90 ′, and the vertical side surface that will be covered with the reflective member 30 later. 231b is exposed.

Next, as shown in FIGS. 15A and 15B, the reflection member 30 is used to fill the gaps between the first trenches 90′ and the end faces 13 of the individual LED elements 10 with the first trenches 90′. Form in between. The end surface 13 of the LED element 10 and the vertical side surface 231b of the photoluminescent member 20 are almost completely covered by the reflective member 30.

After forming the reflecting member 30, the release material 80 is removed (as shown in FIGS. 16A and 16B) to obtain a plurality of light emitting devices 2A. The photoluminescent member 20 and the reflecting member 30 may be connected to each other, and are cut in a later singularization step (as shown in FIGS. 17A and 17B) to obtain the light emitting devices 2A separated from each other. Specifically, as shown in FIG. 17A, the connected photoluminescent member 20 and reflective member 30 are cut along the second horizontal direction D2 to form vertical side surfaces 231a and 231c that are exposed surfaces. Form. Similarly, as shown in FIG. 17B, the connected photoluminescent member 20 and reflective member 30 are cut along the first horizontal direction D1 to expose the vertical side surface 231d and the reflective member. A vertical side surface 231b covered with 30 is formed.

The above is the description of the method for manufacturing the light emitting device 2A. Next, a method of manufacturing the light emitting devices 3A and 3B will be described. Detailed description of steps similar to or similar to the method of manufacturing the light emitting devices 1A and 2A will be omitted as appropriate.

As shown in FIG. 18A, first, the plurality of LED elements 10 are arranged on the release material 80 at a predetermined pitch. As shown in FIG. 19A, the width of the LED element 10 along the second horizontal direction D2 is preferably smaller than the length of the LED element 10 along the first horizontal direction D1. Next, as shown in FIG. 18B, the photoluminescent member 20 is formed on the LED element 10 so that the upper surface 11 and the end surface 13 of each LED element 10 are almost completely covered. However, in the present embodiment, the thickness of the photoluminescent member 20 on the upper surface 11 of the LED element 10 may be smaller than the thickness corresponding to the light emitting device 3A.

As shown in FIGS. 19A to 19C, the photoluminescent member 20 is cut along the first horizontal direction D<b>1 to form the first trench 90. At this time, the first trench 90 is uniformly formed so as to face a predetermined end face of the LED element 10 (for example, a vertical end face 131d as shown in FIGS. 19A to 19C). This exposes the vertical side surface 231d of the photoluminescent member 20, which will be covered by the reflective member 30 in the next manufacturing process.

As shown in FIGS. 20A and 20B, after the trench is completed, the reflection member 30 is formed so as to fill the gap of the first trench 90. In contrast to the light emitting device 1A, the reflecting member 30 covers not only the top surface 21 of the photoluminescent member 20 but also the vertical side surface 231d almost completely.

As shown in FIGS. 21A and 21B, after forming the reflecting member 30, the release material 80 can be removed to obtain a plurality of light emitting devices 3A. Then, as shown in FIGS. 22A and 22B, the photoluminescent member 20 and the reflecting member 30 which are connected to each other are separated along the second horizontal direction D2 and covered with the reflecting member 30 by a singularization process. The vertical side surfaces 231a and 231c which are not broken can be exposed. Then, by another dicing process, the photoluminescent member 20 and the reflective member 30 which are connected to each other are separated along the first horizontal direction D1 to form the vertical side surface 231b. The vertical side surface 231d is still covered with the reflecting member 30. In this way, a plurality of light emitting devices 3A separated from each other can be obtained.

With slight modification, the light emitting device 3B can be manufactured by the above manufacturing method. That is, as shown in FIG. 18B, which is a step of forming the photoluminescent member 20, the photoluminescent member 20 is selectively formed between the end faces 13 of the LED element 10, but the upper surface 11 is not covered. Alternatively, the photoluminescent member 20 may be formed so as to cover the upper surface 11 of the LED element 10, and then the portion covering the upper surface 11 may be removed.

The above is the description of the method for manufacturing the light emitting devices 3A and 3B. Next, a method for manufacturing the light emitting devices 4A and 4B will be described. Detailed description of steps similar to or similar to the method of manufacturing the light emitting devices 3A and 3B will be appropriately omitted.

As shown in FIG. 18A, first, the plurality of LED elements 10 are arranged on the release material 80 at a predetermined pitch, and as shown in FIG. 18B, the photoluminescent member 20 is arranged on the LED elements 10. To do. Then, as shown in FIGS. 19A to 19C, the photoluminescent member 20 is cut along the first horizontal direction D<b>1 to form the first trench 90, which is then covered with the reflective member 30. The wax vertical side surface 231d is exposed.

As shown in FIGS. 23A to 23C, another cutting process performed after forming the first trench 90 is different from the method of the light emitting device 3A. That is, the photoluminescent member 20 is cut along the second horizontal direction D2 to form the second trench 91. Then, the vertical side surfaces 231a and 231c, which are arranged on the opposite sides to each other and are substantially orthogonal to the first horizontal direction D1, are exposed.

After the two trenches are completed, the reflective member 30 (not shown) is filled in the gap between the first and second trenches 90 and 91 and formed inside them. The reflective member 30 covers the vertical side surfaces 231a, 231c, 231d of the photoluminescent member 20. Further, the top surface 21 of the photoluminescent member 20 is almost completely covered by the reflecting member 30. After forming the reflection member 30, the release material 80 can be removed to obtain a plurality of light emitting devices 4A or 4B. After that, a plurality of light emitting devices 4A or 4B separated from each other can be obtained by a singulation process.

In summary, according to the method for manufacturing a light emitting device according to the embodiment of the present disclosure, a light emitting device in which a radiation pattern and a viewing angle (orientation angle) are effectively controlled along at least one predetermined direction, and a side view (side light emitting). ) It is possible to form a CSP type light emitting device having a structure. Further, such a light emitting device can be manufactured collectively.

Although the above disclosure has been described with reference to specific embodiments, those skilled in the art can make various changes without departing from the true spirit and scope of the disclosure defined in the appended claims. It will be appreciated that there is and that equivalents can be substituted. In addition, various modifications may be made to adapt a particular situation, material, composition of matter, process, or step to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. In particular, although the methods disclosed herein have been described with reference to particular acts performed in a particular order, these acts may be combined, subdivided, or permuted to It should be appreciated that equivalent methods may be configured without departing from the teachings of the present disclosure. Therefore, unless stated otherwise herein, the order of operations and groupings do not limit the present disclosure.

[Appendix]
[Appendix 1]
What is claimed is: 1. A light-emitting device comprising: an upper surface, a lower surface facing the upper surface, an end surface extending between the upper surface and the lower surface, and a set of electrodes arranged on the lower surface, the lower surface and the set of A light emitting element in which the electrode constitutes the lower electrode surface,
An optical member that covers an upper surface or an end surface or both of the light emitting element, and includes a top surface, a bottom surface facing the top surface, and a side surface extending between the top surface and the bottom surface.
A reflecting member that partially covers the side surface of the optical member,
Equipped with
First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. One of the vertical side surfaces that are arranged substantially orthogonal to each other in the second horizontal direction and face each other, and one of the vertical side surfaces that are substantially orthogonal to the second horizontal direction is covered with the reflection member to form a side reflection surface. The other of the vertical side surfaces that are substantially orthogonal to the second horizontal direction constitutes a side light emitting surface that is not covered by the reflecting member,
The light emitting device, wherein the side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other.

[Appendix 2]
2. The light emitting device according to appendix 1, wherein the optical member is a photoluminescent member or a translucent member.

[Appendix 3]
Both the upper surface and the end surface of the light emitting element are covered with the optical member,
The top surface of the optical member and the two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and that are arranged facing each other are not covered by the reflecting member, respectively, Comprises an upper light emitting surface and two lateral light emitting surfaces,
The upper light emitting surface and the lower electrode surface of the light emitting element are substantially parallel,
3. The light emitting device according to appendix 2, wherein the two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other.

[Appendix 4]
The area of the bottom surface of the optical member is larger than the area of the upper surface of the light emitting element,
The upper surface of the light emitting element is covered with the optical member,
The end surface of the light emitting element is covered with the reflective member,
The top surface of the optical member and the two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and that are arranged facing each other are not covered by the reflecting member, respectively, Comprises an upper light emitting surface and two lateral light emitting surfaces,
The upper light emitting surface and the lower electrode surface of the light emitting element are substantially parallel,
3. The light emitting device according to appendix 2, wherein the two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other.

[Appendix 5]
Both the upper surface and the end surface of the light emitting element are covered with the optical member,
The top surface of the optical member is covered with the reflective member to form an upper reflective surface,
Two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and are arranged to face each other are not covered by the reflective member, and form two side light emitting surfaces.
3. The light emitting device according to appendix 2, wherein the two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other.

[Appendix 6]
An end surface of the light emitting element is covered with the optical member,
The upper surface of the light emitting element and the top surface of the optical member are both covered with the reflective member to form an upper reflective surface,
The two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and are arranged to face each other are not covered by the reflective member, and form two side light emitting surfaces.
3. The light emitting device according to appendix 2, wherein the second side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other.

[Appendix 7]
Both the upper surface and the end surface of the light emitting element are covered with the optical member,
The top surface of the optical member is covered with the reflective member to form an upper reflective surface,
The light emission according to appendix 2, wherein two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and are arranged to face each other are covered with the reflecting member to form two side reflecting surfaces. apparatus.

[Appendix 8]
An end surface of the light emitting element is covered with the optical member,
The upper surface of the light emitting element and the top surface of the optical member are both covered with the reflective member to form an upper reflective surface,
The light emission according to appendix 2, wherein two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and are arranged to face each other are covered with the reflecting member to form two side reflecting surfaces. apparatus.

[Appendix 9]
9. The light emitting device according to any one of appendices 3 to 8, wherein the optical member further includes a fine lens layer.

[Appendix 10]
9. The light emitting device according to claim 3, further comprising a submount substrate electrically connected to the light emitting device.

[Appendix 11]
9. The light emitting device according to any one of appendices 3 to 8, wherein the optical member further includes at least one light transmitting layer.

[Appendix 12]
9. The light-emitting device according to any one of appendices 3 to 8, wherein the reflective member includes a translucent resin material and light scattering particles dispersed in the translucent resin material.

[Appendix 13]
13. The light emitting device according to appendix 12, wherein the translucent resin material contains polyphthalamide, polycyclohexylene-dimethylene terephthalate, an epoxy encapsulant, or silicone.

[Appendix 14]
An application mounting board that includes a horizontal surface,
A light emitting device according to appendix 1, which is arranged on the application mounting board;
A reflective layer disposed above the horizontal surface of the application mounting board,
A light guide plate disposed above the reflection layer, the light guide plate including a light incident side surface, and a light emission surface connected to the light incident side surface and facing the opposite side to the reflection layer,
Backlight module with.

[Appendix 15]
The application mounting board further includes a vertical surface,
The light emitting device is arranged in a vertical plane of the application mounting board,
The side light emitting surface of the light emitting device faces a horizontal surface of the application mounting board,
An upper light emitting surface of the light emitting device faces a light incident side surface of the light guide plate;
The backlight module according to attachment 14.

[Appendix 16]
16. The backlight according to appendix 15, wherein the length of the upper light emitting surface defined along the second horizontal direction is not greater than the thickness of the light guide plate defined along the normal direction of the light exit surface. module.

[Appendix 17]
16. The backlight module according to appendix 15, wherein the application mounting board further includes a reflective film that covers the horizontal surface, the vertical surface, or both.

[Appendix 18]
16. The backlight module according to appendix 15, wherein the application mounting board has flexibility.

[Appendix 19]
The light emitting device is arranged on a horizontal plane of the application mounting board,
The side light emitting surface of the light emitting device faces the light incident side surface of the light guide plate,
The backlight module according to attachment 14.

[Appendix 20]
Note 19 that the length of the side light emitting surface defined along the normal direction of the upper surface of the light emitting element is not greater than the thickness of the light guide plate defined along the normal direction of the light emitting surface. Backlight module described.

[Appendix 21]
20. The backlight module according to appendix 19, wherein the application mounting board further includes a reflective film that covers the horizontal surface.

[Appendix 22]
A step of disposing an optical member so as to cover the upper surface or the end surface of the light emitting element or both of them;
A step of forming a reflecting member so as to partially cover the side surface of the optical member,
Have
First and second horizontal directions are defined along a length direction and a width direction of an upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. Two of the vertical side surfaces, which are arranged so as to face each other substantially at right angles to the horizontal direction, are covered by the reflecting member to form a side reflecting surface, The other one of the vertical side surfaces that are substantially orthogonal to the horizontal direction is a method for manufacturing a light emitting device, which is not covered with the reflection member and constitutes a side light emitting surface.

[Appendix 23]
In the step of disposing the optical member,
A step of forming the optical member on the upper surface and the end surface of the light emitting element,
Cutting the optical member along the first horizontal direction to form a first trench, and exposing a side surface of the optical member covered with the reflecting member.
23. The method for manufacturing a light emitting device according to attachment 22, wherein in the step of forming the reflecting member, the reflecting member is formed so as to fill the first trench.

[Appendix 24]
24. The method for manufacturing a light emitting device according to appendix 23, wherein in the step of forming the reflecting member, the reflecting member further covers the top surface of the optical member.

[Appendix 25]
Further, the optical member is cut along the second horizontal direction to form a second trench, and two vertical side surfaces that are substantially orthogonal to the first horizontal direction are exposed.
25. The method for manufacturing a light emitting device according to appendix 24, wherein in the step of forming the reflection member, the reflection member is formed so as to fill the second trench.

[Appendix 26]
In the step of disposing the optical member,
Arranging the light emitting element on the optical member with the upper surface of the light emitting element facing downward,
Cutting the optical member along the first horizontal direction to form a first trench, and exposing a side surface of the optical member covered with the reflecting member.
23. The method for manufacturing a light emitting device according to appendix 22, wherein in the step of forming the reflecting member, the reflecting member is formed so as to fill the first trench and further cover the end face of the light emitting element.

[Appendix 27]
In the step of disposing the optical member,
Forming the optical member so as to cover the end face of the light emitting element;
Cutting the optical member along the first horizontal direction to form a first trench, and exposing a side surface of the optical member covered with the reflecting member.
23. The light emitting device according to appendix 22, wherein in the step of forming the reflection member, the reflection member is formed so as to fill the first trench and further cover the top surface of the optical member and the top surface of the light emitting element. Manufacturing method.

[Appendix 28]
In the step of forming the reflective member, the optical member is cut along the second horizontal direction to form a second trench, and two vertical side surfaces that are substantially orthogonal to the first horizontal direction are exposed. Further comprising:
28. The method for manufacturing a light emitting device according to attachment 27, wherein the reflective member is formed so as to fill the second trench.

[Appendix 29]
23. The method of manufacturing the light emitting device according to appendix 22, further comprising cutting the optical member along the first horizontal direction and then cutting the optical member along the second horizontal direction.

[Appendix 30]
23. The method for manufacturing a light-emitting device according to appendix 22, further comprising a step of cutting the optical member and a step of cutting the reflective member, the steps being simultaneously performed.

Claims (25)

What is claimed is: 1. A light-emitting device comprising: an upper surface, a lower surface facing the upper surface, an end surface extending between the upper surface and the lower surface, and a set of electrodes arranged on the lower surface, the lower surface and the set of A light emitting element in which the electrode constitutes the lower electrode surface,
Covers both the top and the end face of the light emitting device, a top surface, a bottom surface opposed to said top surface includes a side surface, extending between said top surface and said bottom surface, photoluminescent member or An optical member which is a translucent member ,
A reflecting member that partially covers the side surface of the optical member,
Equipped with
First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. One of the vertical side surfaces that are arranged substantially orthogonal to each other in the second horizontal direction and face each other, and one of the vertical side surfaces that are substantially orthogonal to the second horizontal direction is covered with the reflection member to form a side reflection surface. The other of the vertical side surfaces that are substantially orthogonal to the second horizontal direction constitutes a side light emitting surface that is not covered by the reflecting member,
The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other ,
The top surface of the optical member and the two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and that are arranged facing each other are not covered by the reflecting member, respectively, Comprises an upper light emitting surface and two lateral light emitting surfaces,
The upper light emitting surface and the lower electrode surface of the light emitting element are substantially parallel,
The two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other,
The distance between the side reflection surface along the second horizontal direction and the end surface of the light emitting element is a distance between the side emission surface along the second horizontal direction and the end surface of the light emitting element. Smaller than the light emitting device. What is claimed is: 1. A light-emitting device comprising: an upper surface, a lower surface facing the upper surface, an end surface extending between the upper surface and the lower surface, and a set of electrodes arranged on the lower surface, the lower surface and the set of A light emitting element in which the electrode constitutes the lower electrode surface,
Not cover the but covering the upper surface of the light emitting element end face of the light emitting device, comprising a bottom surface opposite the top surface, on the top surface, side surfaces extending between said top surface and said bottom surface, a Fotorumi An optical member that is a luminescent member or a translucent member ,
A reflecting member that partially covers the side surface of the optical member,
Equipped with
First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. One of the vertical side surfaces that are arranged substantially orthogonal to each other in the second horizontal direction and face each other, and one of the vertical side surfaces that are substantially orthogonal to the second horizontal direction is covered with the reflection member to form a side reflection surface. The other of the vertical side surfaces that are substantially orthogonal to the second horizontal direction constitutes a side light emitting surface that is not covered by the reflecting member,
The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other ,
The area of the bottom surface of the optical member is larger than the area of the upper surface of the light emitting element,
The upper surface of the light emitting element is covered with the optical member,
The end surface of the light emitting element is covered with the reflective member,
The top surface of the optical member and the two vertical side surfaces of the optical member that are substantially orthogonal to the first horizontal direction and that are arranged facing each other are not covered by the reflecting member, respectively, Comprises an upper light emitting surface and two lateral light emitting surfaces,
The upper light emitting surface and the lower electrode surface of the light emitting element are substantially parallel,
The light emitting device, wherein the two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other . What is claimed is: 1. A light-emitting device comprising: an upper surface, a lower surface facing the upper surface, an end surface extending between the upper surface and the lower surface, and a set of electrodes arranged on the lower surface, the lower surface and the set of A light emitting element in which the electrode constitutes the lower electrode surface,
Top-surface, and the optical member is the bottom surface, side surfaces extending between said top surface and said bottom surface, including, photoluminescent member or the translucent member opposite to said top surface,
A reflecting member that partially covers the side surface of the optical member,
Equipped with
First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. One of the vertical side surfaces that are arranged substantially orthogonal to each other in the second horizontal direction and face each other, and one of the vertical side surfaces that are substantially orthogonal to the second horizontal direction is covered with the reflection member to form a side reflection surface. The other of the vertical side surfaces that are substantially orthogonal to the second horizontal direction constitutes a side light emitting surface that is not covered by the reflecting member,
The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other ,
Both the upper surface and the end surface of the light emitting element are covered with the optical member,
The top surface of the optical member is covered with the reflective member to form an upper reflective surface,
Two vertical side surfaces of the optical member, which are substantially orthogonal to the first horizontal direction and are arranged to face each other, are not covered by the reflective member and form two side light emitting surfaces, or , Two lateral reflecting surfaces are covered by the reflecting member,
The two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other,
The distance between the side reflection surface along the second horizontal direction and the end surface of the light emitting element is a distance between the side emission surface along the second horizontal direction and the end surface of the light emitting element. Smaller than the light emitting device. What is claimed is: 1. A light-emitting device comprising: an upper surface, a lower surface facing the upper surface, an end surface extending between the upper surface and the lower surface, and a set of electrodes arranged on the lower surface, the lower surface and the set of A light emitting element in which the electrode constitutes the lower electrode surface,
Covering the top surface or the end surface or both of the light emitting element, a top surface, a bottom surface opposed to said top surface includes a side surface, extending between said top surface and said bottom surface, photoluminescent member or An optical member which is a translucent member ,
A reflecting member that partially covers the side surface of the optical member,
Equipped with
First and second horizontal directions orthogonal to each other are defined along the length direction and the width direction of the upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. One of the vertical side surfaces that are arranged substantially orthogonal to each other in the second horizontal direction and face each other, and one of the vertical side surfaces that are substantially orthogonal to the second horizontal direction is covered with the reflection member to form a side reflection surface. The other of the vertical side surfaces that are substantially orthogonal to the second horizontal direction constitutes a side light emitting surface that is not covered by the reflecting member,
The side light emitting surface and the lower electrode surface of the light emitting element are substantially orthogonal to each other ,
An end surface of the light emitting element is covered with the optical member,
The upper surface of the light emitting element and the top surface of the optical member are both covered with the reflective member to form an upper reflective surface,
Two vertical side surfaces of the optical member, which are substantially orthogonal to the first horizontal direction and are arranged to face each other, are not covered by the reflective member and form two side light emitting surfaces, or , Two lateral reflecting surfaces are covered by the reflecting member,
The two side light emitting surfaces and the lower electrode surface of the light emitting element are substantially orthogonal to each other,
The distance between the side reflection surface along the second horizontal direction and the end surface of the light emitting element is a distance between the side emission surface along the second horizontal direction and the end surface of the light emitting element. Smaller than the light emitting device. The optical member further includes a microlens layer, the light emitting device according to any one of claims 1 to 4. Further, the light emitting device electrically comprising a submount substrate, to be connected, the light-emitting device according to any one of claims 1 to 4. The optical member further comprises at least one light transmitting layer, the light emitting device according to any one of the preceding claims. The reflecting member has a light-transmitting resin material, comprising a light-scattering particles dispersed in the light transmitting resin material, a light emitting device according to any one of claims 1 to 4. The light emitting device according to claim 8 , wherein the translucent resin material includes polyphthalamide, polycyclohexylene-dimethylene terephthalate, an epoxy encapsulant, or silicone. An application mounting board that includes a horizontal surface,
The light emitting device according to claim 3 or 4 , wherein the light emitting device is arranged on a horizontal plane of the application mounting board.
A reflective layer disposed above the horizontal surface of the application mounting board,
A light guide plate disposed above the reflective layer, and the incident side surface, and connected to the light input side, seen containing a said reflective layer and the light exit surface facing the opposite side, the, the light emitting device A lateral light emitting surface, which faces the light incident side surface of the light guide plate;
Backlight module with. Application mounting board including horizontal and vertical planes ,
3. The light emitting device according to claim 1 , wherein the light emitting device is arranged on a vertical plane of the application mounting board , and a side light emitting surface of the light emitting device faces a horizontal surface of the application mounting board. Device ,
A reflective layer disposed above the horizontal surface of the application mounting board,
A light guide plate disposed above the reflective layer, and the incident side surface, and connected to the light input side, seen containing a said reflective layer and the light exit surface facing the opposite side, the, the light emitting device An upper light emitting surface, which faces the light incident side surface of the light guide plate;
Backlight module with. The back according to claim 11 , wherein the length of the upper light emitting surface defined along the second horizontal direction is not greater than the thickness of the light guide plate defined along the normal direction of the light emitting surface. Light module. The backlight module according to claim 11 , wherein the application mounting board further includes a reflective film that covers the horizontal surface, the vertical surface, or both. The backlight module according to claim 10 , wherein the application mounting board is flexible. The length of the side light emitting surface defined along the normal direction of the upper surface of the light emitting element is not greater than the thickness of the light guide plate defined along the normal direction of the light emitting surface, 10. The backlight module described in 10 . The backlight module of claim 10 , wherein the application mounting board further includes a reflective film that covers the horizontal surface. A step of disposing an optical member so as to cover the upper surface or the end surface of the light emitting element or both of them;
A step of forming a reflecting member so as to partially cover the side surface of the optical member,
Have
First and second horizontal directions are defined along a length direction and a width direction of an upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. Two of the vertical side surfaces, which are arranged so as to face each other substantially at right angles to the horizontal direction, are covered by the reflecting member to form a side reflecting surface, another of the vertical side substantially perpendicular to the horizontal direction constitute the lateral light emitting surface not covered with the reflecting member,
In the step of disposing the optical member, the optical member is cut along the first horizontal direction to form a first trench, and a side surface of the optical member covered with the reflection member is exposed. In the step of forming a reflecting member, the reflecting member is formed so as to fill the first trench,
The distance between the side reflection surface along the second horizontal direction and the end surface of the light emitting element is a distance between the side emission surface along the second horizontal direction and the end surface of the light emitting element. A manufacturing method of a light emitting device , which is smaller than the above . Wherein in the step of disposing an optical member, the step of forming the optical member on the upper surface and the end surface of the light emitting element, that further having a method for manufacturing a light emitting device according to claim 17. 19. The method for manufacturing a light emitting device according to claim 18 , wherein in the step of forming the reflecting member, the reflecting member further covers the top surface of the optical member. Further, the optical member is cut along the second horizontal direction to form a second trench, and two vertical side surfaces that are substantially orthogonal to the first horizontal direction are exposed.
20. The method for manufacturing a light emitting device according to claim 19 , wherein in the step of forming the reflection member, the reflection member is formed so as to fill the second trench. In the step of arranging the optical member, so as to cover an end face of the light emitting device, further comprising a step of forming the optical member,
18. The light emission according to claim 17 , wherein in the step of forming the reflection member, the reflection member is formed so as to fill the first trench and further cover a top surface of the optical member and an upper surface of the light emitting element. Device manufacturing method. In the step of forming the reflective member, the optical member is cut along the second horizontal direction to form a second trench, and two vertical side surfaces that are substantially orthogonal to the first horizontal direction are exposed. Further comprising:
22. The method of manufacturing a light emitting device according to claim 21 , wherein the reflective member is formed so as to fill the second trench. 18. The method for manufacturing a light emitting device according to claim 17 , further comprising the step of cutting the optical member along the first horizontal direction and then cutting the optical member along the second horizontal direction. 18. The method for manufacturing a light emitting device according to claim 17 , further comprising a step of cutting the optical member and a step of cutting the reflective member, and these steps are simultaneously performed. A step of disposing an optical member so as to cover the upper surface or the end surface of the light emitting element or both of them;
A step of forming a reflecting member so as to partially cover the side surface of the optical member,
Have
First and second horizontal directions are defined along a length direction and a width direction of an upper surface of the light emitting element, respectively.
The side surface of the optical member includes four vertical side surfaces, two of the vertical side surfaces are arranged to face each other at substantially right angles to the first horizontal direction, and the other two vertical side surfaces are arranged to face each other. Two of the vertical side surfaces, which are arranged so as to face each other substantially at right angles to the horizontal direction, are covered by the reflecting member to form a side reflecting surface, The other of the vertical side surfaces which are substantially orthogonal to the horizontal direction constitutes a side light emitting surface which is not covered by the reflecting member,
In the step of disposing the optical member,
Arranging the light emitting element on the optical member with the upper surface of the light emitting element facing downward,
Cutting the optical member along the first horizontal direction to form a first trench, and exposing a side surface of the optical member covered with the reflecting member.
In the step of forming the reflecting member, the reflecting member, the filled in the first trench, further formed so as to cover the end surface of the light emitting device, a manufacturing method of the light emission device.