JP2022131700A - Light-emitting device, light-emitting module, planar light source, and liquid crystal display device - Google Patents

Abstract

To provide a light-emitting device with less luminance unevenness; and to provide a light-emitting module, a planar light source, and a liquid crystal display device with less luminance unevenness.SOLUTION: A light-emitting device of the present invention includes a light source, an encapsulation member covering a light-emitting surface and a side surface of the light source, and a translucent member covering an upper surface and a side surface of the encapsulation member. The translucent member is an octagon shape in a plan view, and the octagon shape has different internal angles, and all of the internal angles are less than 180 degrees.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a light-emitting device, a light-emitting module, a planar light source, and a liquid crystal display device.

A light-emitting device having a light source such as a light-emitting diode is known. As an example, a plurality of light guide plates having side surfaces and an emission surface and arranged with the side surfaces facing each other, and a plurality of light guide plates arranged on the side surfaces of each of the light guide plates and allowing light to enter the plurality of light guide plates at the same time. and a backlight unit having a point light source.

JP 2009-272251 A

An object of the present disclosure is to provide a light-emitting device with less luminance unevenness. Another object of the present invention is to provide a light-emitting module, a planar light source, and a liquid crystal display device with little luminance unevenness.

A light-emitting device according to an embodiment of the present disclosure includes a light source, a sealing member that covers a light-emitting surface and a side surface of the light source, and a sealing member that covers the light-emitting surface and laterally of the side surface. a positioned translucent member, wherein the translucent member is octagonal in plan view, and the octagon has interior angles with all interior angles less than 180 degrees and with different angles.

According to an embodiment of the present disclosure, it is possible to provide a light-emitting device with little luminance unevenness. Also, it is possible to provide a light-emitting module, a planar light source, and a liquid crystal display device with little luminance unevenness.

1 is a schematic plan view illustrating a light emitting device according to a first embodiment; FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1, illustrating the light emitting device according to the first embodiment; FIG. 1 is a schematic plan view (part 1) for explaining a light emitting device according to a first embodiment; FIG. FIG. 2 is a schematic plan view (part 2) for explaining the light emitting device according to the first embodiment; FIG. 4 is a plan view schematically showing directions of light from a light source with arrows. 1A to 1C are schematic cross-sectional views (part 1) illustrating the manufacturing process of the light emitting device according to the first embodiment; FIG. 2 is a schematic plan view (part 1) illustrating the manufacturing process of the light emitting device according to the first embodiment; FIG. 2A is a schematic cross-sectional view (part 2) illustrating the manufacturing process of the light emitting device according to the first embodiment; FIG. 2A is a schematic plan view (Part 2) illustrating the manufacturing process of the light emitting device according to the first embodiment; 3A to 3C are schematic cross-sectional views illustrating the manufacturing process of the light emitting device according to the first embodiment; 4A to 4C are schematic cross-sectional views illustrating the manufacturing process of the light emitting device according to the first embodiment; 5A to 5C are schematic cross-sectional views illustrating the manufacturing process of the light-emitting device according to the first embodiment (No. 5); FIG. 6 is a schematic cross-sectional view (No. 6) illustrating the manufacturing process of the light-emitting device according to the first embodiment; 1 is a schematic plan view (1) illustrating a planar light source using the light emitting device 1; FIG. FIG. 2 is a schematic plan view (No. 2) illustrating a planar light source using the light emitting device 1; FIG. 2 is a schematic plan view showing a specific example of a planar light source using the light emitting device 1; 17 is a schematic partial cross-sectional view taken along line XVII-XVII of FIG. 16, showing a specific example of a planar light source using the light emitting device 1. FIG. FIG. 2 is a cross-sectional view showing a specific example of a light-emitting module using the light-emitting device 1; FIG. 4 is a schematic cross-sectional view (Part 1) illustrating a light-emitting device according to Modification 1 of the first embodiment; FIG. 2 is a schematic cross-sectional view (Part 2) illustrating a light-emitting device according to Modification 1 of the first embodiment; FIG. 3 is a schematic cross-sectional view (No. 3) illustrating a light-emitting device according to Modification 1 of the first embodiment; FIG. 4 is a schematic cross-sectional view (No. 4) illustrating a light-emitting device according to Modification 1 of the first embodiment; FIG. 10 is a configuration diagram illustrating a liquid crystal display device according to a second embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the following description, terms indicating specific directions and positions (e.g., "upper", "lower", and other terms including those terms) are used as necessary, but the use of these terms is These terms are used to facilitate understanding of the invention with reference to the drawings, and the technical scope of the invention is not limited by the meaning of these terms. Also, parts with the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members.

In addition, in the present disclosure, “parallel” includes cases where two straight lines, sides, planes, etc. are in the range of about 0° to ±5°, unless otherwise specified. In the present disclosure, "perpendicular" or "perpendicular" includes cases where two straight lines, sides, planes, etc. are in the range of about 90° to ±5° unless otherwise specified.

Further, the embodiments shown below are examples of light-emitting devices and the like for embodying the technical idea of the present invention, and the present invention is not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative positions, etc. of the components described below are not intended to limit the scope of the present invention, but are intended to be illustrative. It is intended. Moreover, the content described in one embodiment can also be applied to other embodiments and modifications. Also, the sizes and positional relationships of members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid making the drawings overly complicated, schematic diagrams that omit illustration of some elements may be used, or end views showing only cut surfaces as cross-sectional diagrams may be used.

<First embodiment>
(Light emitting device 1)
FIG. 1 is a schematic plan view illustrating the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1, illustrating the light emitting device according to the first embodiment.

As shown in FIGS. 1 and 2, the light emitting device 1 has a substrate 10, a light source 20, a sealing member 30, and a translucent member 40. As shown in FIGS. However, the substrate 10 is a member provided as needed, and is not an essential component of the light emitting device 1 .

In the light emitting device 1 , the light source 20 is mounted on the upper surface 10 a side of the substrate 10 . The light source 20 has an upper surface 20a, a lower surface 20b and side surfaces 20c. In the present application, the upper surface 20a may be referred to as a light emitting surface, but the light from the light source 20 is emitted from the upper surface 20a as well as from the side surfaces 20c.

The sealing member 30 is provided on the upper surface 10 a side of the substrate 10 and covers the upper surface 20 a and side surfaces 20 c of the light source 20 . The translucent member 40 is provided on the upper surface 10 a side of the substrate 10 , covers the upper surface and side surfaces of the sealing member 30 , and is positioned above the upper surface 20 a of the light source 20 and beside the side surface 20 c. In the light-emitting device 1 , light from the light source 20 passes through the sealing member 30 and the translucent member 40 and is emitted upward and laterally from the translucent member 40 . Each element constituting the light emitting device 1 will be described in detail below.

[Substrate 10]
The substrate 10 has a pair of leads 11 and an insulating member 12 . Most of the periphery of each lead 11 is filled with the insulating member 12, and a part of the lead 11 is exposed from the insulating member 12. - 特許庁Also, the upper and lower surfaces of each lead 11 are exposed from the insulating member 12 . For example, the upper surface of each lead 11 and the upper surface of the insulating member 12 are on the same plane, and the lower surface of each lead 11 and the lower surface of the insulating member 12 are on the same plane. The lower surface of each lead 11 serves as an external connection terminal, for example.

The base material constituting the lead 11 is, for example, at least one metal selected from copper, aluminum, gold, silver, tungsten, iron and nickel, or an alloy such as an iron-nickel alloy or phosphor bronze, or a clad material. A plate-shaped body can be used. A film made of silver, aluminum, gold, or an alloy thereof (for example, a plated film) may be formed on the surface of the lead 11 in order to efficiently extract the light from the light source 20 . The metal film formed on the surface of the lead 11 may be a single layer film or a multilayer film.

The material of the insulating member 12 is preferably a material with excellent light reflectivity, and examples thereof include a white resin obtained by adding a white powder, a filler, a diffusing agent, etc., which is an additive that reflects light, to a transparent resin. . Silicone resin containing titanium oxide or the like is preferable for the insulating member 12 . Since the insulating member 12 contains the resin containing the light reflecting material, it is possible to suppress the leakage of light from the substrate to the outside. The insulating member 12 preferably has a reflectance of 60% or more, more preferably 90% or more, with respect to the light emitted from the light source 20 .

[Light source 20]
The light source 20 is, for example, a light emitting element. Moreover, the light emitting element and another member may be combined. In this embodiment, the light source 20 is exemplified by a light emitting element having an upper surface 20a, a lower surface 20b, and a side surface 20c. The light source 20 is, for example, rectangular in plan view.

The light source 20 has, for example, a pair of electrodes 20 t on the upper surface 20 a side, and the pair of electrodes 20 t of the light source 20 and the pair of leads 11 of the substrate 10 are electrically connected by metal wires 25 . Materials for the metal wire 25 include metals such as gold, silver, copper, platinum, and aluminum, and alloys thereof. In particular, it is preferable to use gold, which is excellent in thermal conductivity and the like. The thickness of the metal wire 25 can be appropriately selected according to the purpose and application.

When the light source 20 is a light emitting element, or when the light source 20 includes a light emitting element and other members, a typical example of the light emitting element is an LED (Light Emitting Diode). A light emitting device includes, for example, a device substrate such as sapphire or gallium nitride, and a semiconductor laminate.

The semiconductor laminate includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer sandwiched therebetween. The light-emitting layer may have a structure such as a double heterojunction or a single quantum well (SQW), or may have a structure with a group of active layers such as a multiple quantum well (MQW). good. The semiconductor laminate is configured to emit visible light or ultraviolet light. A semiconductor laminate including such a light-emitting layer can include, for example, InxAlyGa1 _-xyN (0≤x, _0≤y , _x +y≤1).

The semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer. A structure containing in order may have a structure repeated multiple times. When the semiconductor laminate includes a plurality of light-emitting layers, it may include light-emitting layers with different emission peak wavelengths, or may include light-emitting layers with the same emission peak wavelength. In addition, the same emission peak wavelength includes the case where there is a variation of about several nanometers. A combination of emission peak wavelengths between a plurality of light-emitting layers can be selected as appropriate. blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or , a combination of green light and red light, etc., to select the light-emitting layer. Each light-emitting layer may include a plurality of active layers with different emission peak wavelengths, or may include a plurality of active layers with the same emission peak wavelength.

[Sealing member 30]
The center of the sealing member 30 preferably coincides with the optical axis of the light source 20 in plan view. Here, the optical axis of the light source 20 is defined by a line that passes through the center of the upper surface 20a of the light source 20 and perpendicularly intersects the upper surface 20a. The light source 20 and the sealing member 30 have similar shapes, for example.

As the sealing member 30, it is preferable to use a resin having excellent heat resistance, weather resistance, and light resistance. Examples of such resins include silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, urea resins, phenol resins, acrylic resins, urethane resins, fluorine resins, or resins containing two or more of these resins. is mentioned.

At least one selected from the group consisting of a filler, a diffusing agent, a pigment, and a fluorescent substance can be mixed in the sealing member 30 so as to have a predetermined function. As the diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be suitably used. In addition, the sealing member 30 may contain organic or inorganic coloring dyes or coloring pigments for the purpose of cutting unwanted wavelengths. Further, the sealing member 30 may contain phosphor particles and resin.

When the sealing member 30 contains a phosphor, it functions as a wavelength conversion member. The wavelength conversion member absorbs at least part of the light emitted from the light source 20 and emits light with a wavelength different from that of the light emitted from the light source 20 . For example, the wavelength conversion member converts the wavelength of part of the blue light from the light source 20 to emit yellow light. According to such a configuration, white light is obtained by mixing the blue light that has passed through the wavelength conversion member and the yellow light emitted from the wavelength conversion member.

Any phosphor known in the art may be used as the phosphor. Specifically, yttrium-aluminum-garnet-based phosphors (e.g., Y3 ₍ Al, Ga) _5O12 :Ce), lutetium-aluminum-garnet-based phosphors (e.g., _{Lu3 (} Al, Ga) _{5O 12} :Ce), terbium-aluminum-garnet-based phosphors (e.g., Tb3 ₍ Al, Ga) _5O12 :Ce), CCA _- based phosphors ₍ e.g., _{Ca10 (} PO4) _6Cl2 :Eu), SAE phosphors (e.g. Sr ₄ Al ₁₄ O ₂₅ :Eu), chlorosilicate phosphors (e.g. Ca ₈ MgSi ₄ O ₁₆ Cl ₂ :Eu), β-sialon phosphors (e.g. (Si, Al) ₃ (O, N) ₄ :Eu), α-based SiAlON phosphors (e.g., Ca(Si, Al) ₁₂ (O, N) ₁₆ :Eu), SLA-based phosphors (e.g., SrLiAl ₃ N ₄ :Eu) , nitride phosphors such as CASN phosphors (e.g. CaAlSiN ₃ :Eu) or SCASN phosphors (e.g. (Sr, Ca)AlSiN ₃ :Eu), KSF phosphors (e.g. K ₂ SiF ₆ :Mn), KSAF-based phosphors (e.g., K ₂ (Si, Al) F ₆ :Mn), or MGF-based phosphors (e.g., 3.5MgO·0.5MgF ₂ ·GeO ₂ :Mn). A phosphor, a phosphor having a perovskite structure (for example, CsPb(F, Cl, Br, I) ₃ ), or a quantum dot phosphor (for example, CdSe, InP, AgInS ₂ or AgInSe ₂ ) can be used. .

The planar shape of the sealing member 30 may be various shapes such as a rectangular shape and a circular shape. The planar shape of the sealing member 30 is preferably rectangular. When the planar shape of the light source 20 is rectangular, the planar shape of the sealing member 30 is also a rectangular shape larger than the planar shape of the light source, and the diagonal lines of the respective rectangular shapes overlap, the diagonal direction of the light source and the respective It is possible to reduce the difference in the distance that light passes through the sealing member 30 from the direction perpendicular to one side. In particular, when each rectangle is a square, the distance that light passes through the sealing member 30 in the diagonal direction of the light source and in the direction perpendicular to each side can be substantially the same. In particular, when the sealing member 30 contains a phosphor, as a result, the color of the light wavelength-converted by the phosphor becomes substantially the same in the diagonal direction and in the direction perpendicular to one side, so that the color unevenness of the light emitting device 1 can be eliminated. can be reduced.

[Translucent member 40]
As the translucent member 40, it is preferable to use a resin having excellent heat resistance, weather resistance, and light resistance. Examples of such resins include epoxy resins, silicone resins, modified silicone resins, urea resins, urethane resins, acrylic resins, polycarbonate resins, polyimide resins, and resins containing two or more of these resins. . At least one selected from the group consisting of fillers, diffusing agents, pigments, and reflective substances can be mixed into the translucent member 40 in order to provide a predetermined function.

The translucent member 40 is octagonal in plan view. This octagon has interior angles that are less than 180 degrees and have different angles. For example, the four interior angles indicated by A in FIG. 1 may have the same angle, and the four interior angles indicated by B may have the same angle. The four interior angles indicated by B may be larger than the four interior angles indicated by A. As a result, it is possible to adjust the intensity of light emitted in the lateral direction from the light emitting device so that the intensity of the light in the direction where the intensity of light is high is weakened and the intensity of the light in the direction where the intensity of light is low is increased. It is possible to obtain a light-emitting device that reduces luminance unevenness of the device.

In the translucent member 40, each side of the octagon may have the same length. In the translucent member 40, the octagon may be a four-fold symmetrical shape. In the translucent member 40, as shown in FIG. 3, the octagon is surrounded by four first vertices 40v1 inscribed in a circle C and chords and arcs determined by the first vertexes 40v1 adjacent in the circumferential direction. and four other second vertices 40v2 located in the region E that is drawn.

Also, the center of the translucent member 40 preferably coincides with the optical axis of the light source 20 in plan view. Further, when the sealing member 30 is rectangular in plan view and the light source 20 is rectangular in plan view smaller than the sealing member 30, as shown in FIG. It is preferably located on the extension of the diagonal D1 or D2 of the rectangle of the light source 20 . Moreover, as shown in FIG. 4, the four first vertices 40v1 are preferably positioned on extensions of the diagonal lines D1 or D2 of the rectangle of the light source 20 in plan view.

FIG. 5 is a plan view schematically showing the direction of light from the light source with arrows. When the translucent member 40 has an octagonal shape in plan view, as shown in FIG. It bends towards the direction of D1 or D2. As a result, the directivity in the directions of the diagonals D1 and D2 is improved, and the intensity of light directed toward the four first vertices 40v1 is reduced relative to the intensity of light directed toward the four second vertices 40v2 shown in FIG. can be high

That is, for example, if the translucent member 40 is circular in plan view, the directivity in each direction is uniform. can be high

Referring back to FIGS. 1 and 2, the surface of the translucent member 40 preferably has a slope 40a with the lower surface 20b of the light source 20 as a reference, the height on the outer peripheral side being lower than the height on the central side. The slope 40a is, for example, annularly provided outside the sealing member 30 in plan view. For example, in a plan view, the outermost periphery of the slope 40a is octagonal, and the innermost periphery is an octagonal shape similar to the outermost periphery.

In the translucent member 40, the light from the light source 20 is refracted by the slope 40a and emitted in the horizontal direction. Therefore, wide light distribution such as bad wing light distribution can be realized. The slope 40a may be curved in a cross-sectional view, may be straight in a cross-sectional view, or preferably straight in a cross-sectional view. When the slope 40a is formed linearly in a cross-sectional view, it is possible to increase the amount of light emitted in the horizontal direction compared to when it is formed in a curved shape in the cross-sectional view, which is advantageous for wide light distribution.

The surface of the translucent member 40 has a flat surface 40b that forms part of the side surface of the light emitting device 1 outside the slope 40a. Plane 40b is, for example, perpendicular to bottom surface 20b of light source 20 . However, it is not limited to being vertical, and may be inclined with respect to the lower surface 20b of the light source 20 . It is preferable that the height of the plane 40b is higher than the height of the light source 20 with the lower surface 20b of the light source 20 as a reference. The light emitted from the light source 20 and directed to the plane 40b is emitted in the lateral direction of the light emitting device 1 from the plane 40b.

The surface of the translucent member 40 preferably has a concave portion 40x recessed toward the light source 20 in a region overlapping the sealing member 30 in plan view. The deepest part of the concave portion 40x is preferably positioned at the center in a plan view. The inner side surface 40c of the translucent member 40 defining the recess 40x is preferably line symmetrical in a cross section including the central axis passing through the center of the recess 40x. The concave portion 40x has, for example, a cone shape or a truncated cone shape. The concave portion 40x is, for example, rectangular in plan view. The concave portion 40x is, for example, a quadrangular pyramid or a truncated quadrangular pyramid. The center of the recess 40x preferably coincides with the optical axis of the light source 20 in plan view.

When the sealing member 30 is rectangular in plan view, the light source 20 is rectangular in plan view smaller than the sealing member 30, and the concave portion 40x is rectangular in plan view larger than the sealing member 30, as shown in FIG. Thus, each vertex of each rectangle of the sealing member 30 and the concave portion 40x is preferably positioned on an extension line of the diagonal line D1 or D2 of the rectangle of the light source 20. As shown in FIG. As a result, the intensity of light in the direction of the extension of the diagonal can be made higher than the intensity of light in the direction perpendicular to the center of each side of the light source 20 .

In a cross-sectional view, the inner side surface 40c may be linearly inclined, or may be convexly curved toward the outside or the inside of the recess 40x. In particular, the inner side surface 40c preferably curves convexly toward the inside of the recess 40x. As shown in FIG. 2, the inner side surface 40c is curved convexly toward the inside of the concave portion 40x. It is possible to increase the amount of light directed laterally within the optical member 40 . As a result, the amount of light emitted in the lateral direction of the translucent member 40 can be increased, which is advantageous for wide light distribution.

The surface of the translucent member 40 may include a plane 40d parallel to the bottom surface 20b of the light source 20 between the slope 40a and the inner side surface 40c defining the recess 40x. The flat surface 40d is continuous with the slope 40a at one end and continuous with the inner side surface 40c at the other end. When the light from the light source 20 strikes the plane 40d, some of the light passes through the plane 40d, but some of the light is reflected by the plane 40d and travels sideways within the translucent member 40. FIG.

In this way, by providing the concave portion 40x, it is possible to control the emission direction of light using the refraction of light at the interface between the inside of the translucent member 40 and the external environment. For example, when the concave portion 40x has a shape having inclined side surfaces, such as a cone shape or a truncated cone shape, the interface between the inside of the translucent member 40 and the external environment, that is, the surface of the translucent member 40 The reflected light diffuses over a wider range in the translucent member 40 and travels toward the substrate 10 side. That is, by arranging the concave portion 40x above the light source 20, the light emitted above the light source 20 can be diffused downward and laterally while being appropriately transmitted. As a result, it is possible to prevent the luminance directly above the light source 20 from becoming extremely high compared to other areas. In order to obtain such an effect, the recess 40x is preferably larger than the sealing member 30 in plan view.

Note that it is not essential that the surface of the translucent member 40 has the concave portion 40x that is recessed toward the light source 20 side. For example, there may be no recess at the position of the recess 40x in FIG. 2, and the plane may be continuous with the plane 40d. In this case, when the light from the light source 20 hits the plane 40 d and a plane continuous with the plane 40 d , part of the light is reflected by the plane and travels laterally within the translucent member 40 .

(Manufacturing method of light-emitting device 1)
6 to 13 are schematic diagrams illustrating manufacturing steps of the light emitting device according to the first embodiment. As shown in FIGS. 6 to 11, the manufacturing process of the light emitting device 1 includes a process of preparing a first intermediate 140 having a support member 100, a light source 20 and a sealing member 30. FIG. Further, the manufacturing process of the light emitting device 1 includes a process of forming the first translucent member 42 on the first intermediate 140, as shown in FIG. Moreover, as shown in FIG. 13, the manufacturing process of the light-emitting device 1 includes cutting both the second light-transmitting member 41 and the first light-transmitting member 42 after the step of forming the first light-transmitting member 42 . A step may be included. Each step shown in FIGS. 6 to 13 will be described in detail below.

6 to 9 are steps for preparing the support member 100. FIG. To prepare the support member 100, first, as shown in FIGS. 6 and 7, a substrate 10 having a pair of leads 11 and an insulating member 12 is prepared. The substrate 10 may be purchased, or may be produced by insert molding or the like, for example. A plurality of octagonal regions E corresponding to the light emitting device 1 in a plan view are defined on the substrate 10 . A plurality of regions E that form the light emitting device 1 are two-dimensionally arranged in plan view in FIG. However, they are not limited to being two-dimensionally arranged in plan view as shown in FIG. 7, and may be arranged one-dimensionally in plan view. It should be noted that FIG. 6 shows a cross section including two adjacent regions E. In FIG. Moreover, FIG. 7 shows only the arrangement of the regions E, and detailed illustration of the substrate 10 in each region E is omitted.

Next, as shown in FIGS. 8 and 9, a second translucent member 41 having a through hole 41x is arranged on the substrate 10. Next, as shown in FIGS. When the second translucent member 41 is arranged on the substrate 10, the side wall of the second translucent member 41 defining the through hole 41x and the upper surface 10a of the substrate 10 define the accommodation recess 110x.

As a result, a support member 100 is formed that includes a plurality of housing portions 110 having housing recesses 110x with side walls and a bottom surface, and portions positioned between adjacent housing portions 110 . The accommodation portion 110 is a portion that can accommodate the light source in the accommodation recess 110x. On the other hand, a portion positioned between adjacent accommodation portions 110 is referred to as a connection portion 120 . The connecting portion 120 is lower than the side wall of the accommodating recess 110x with respect to the upper surface 10a of the substrate 10 forming the bottom surface of the accommodating recess 110x. For example, in plan view, the housing recess 110x has a rectangular shape, and the connecting portion 120 has a lattice shape. For example, the connection part 120 is arranged to include the outer edge of each region E, and the accommodation recesses 110x are arranged in each region E one by one.

The second translucent member 41 is made of resin, and is formed by transfer molding or compression molding, for example. When forming the second translucent member 41 by transfer molding, first, an upper mold having a hollow portion having a shape corresponding to the shape of the second translucent member 41 is placed on the upper surface 10a side of the substrate 10. . Also, a lower mold is arranged on the lower surface side of the substrate 10 . Then, the second translucent member 41 in an uncured state is poured into the hollow portion through the inlet. When forming the second translucent member 41 by compression molding, first, the substrate 10 is placed on the lower mold, and the uncured second translucent member 41 is placed on the upper surface 10a of the substrate 10. , the upper mold is closed, and the uncured second translucent member 41 is molded while being compressed.

The second translucent member 41 may or may not be cured in this step. It may be left in a semi-cured state in this step, and cured together with the first translucent member 42 in a later-described step. In order to make the second translucent member 41 semi-cured, for example, the second translucent member 41 may be heated at a temperature lower than the curing temperature of the second translucent member 41 . Note that the semi-cured state is a cured state in which the second translucent member 41 is not deformed.

The second translucent member 41 is preferably formed by transfer molding. In some cases, the substrate 10 is provided with holes for facilitating cutting when separating into individual pieces. 41 can fill holes provided in substrate 10 to form a continuous surface without holes. This makes it possible to use compression molding when forming the first translucent member 42 .

Next, as shown in FIG. 10 , the light source 20 is placed on the bottom surface of each housing recess 110 x of the support member 100 . Here, as an example, the light source 20 is a light emitting element having an upper surface 20a, a lower surface 20b, and side surfaces 20c. For example, the planar shape of the light source 20 is rectangular, and the planar shape of the accommodation recess 110x is a rectangular shape larger than the light source 20 . For example, the light source 20 is arranged on the bottom surface of the accommodation recess 110x so that each vertex of the rectangle of the accommodation recess 110x is positioned on an extension line of a diagonal line of the rectangle of the light source 20 in plan view.

Specifically, for example, the light source 20 is prepared, and the light source 20 is adhered to the bottom surface of the housing recess 110x with an adhesive member. Then, the pair of electrodes 20 t of the light source 20 and the pair of leads 11 of the substrate 10 are electrically connected by the metal wires 25 .

Through the steps shown in FIGS. 6 to 10, the second intermediate 130 having the support member 100 and the plurality of light sources 20 is prepared.

Next, as shown in FIG. 11, the sealing member 30 covering the light source 20 is placed in each of the housing recesses 110x of the support member 100 to form the first intermediate 140. Next, as shown in FIG. That is, the first intermediate body 140 is composed of the second intermediate body 130 shown in FIG. 10 and the sealing member 30 arranged in the accommodation recess 110x. Specifically, first, an uncured resin that becomes the sealing member 30 is prepared. Then, if necessary, a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, or the like is added to the uncured resin and dispersed. Next, the obtained uncured resin is placed in the accommodation recess 110x using a dispenser or the like. Preferably, the uncured resin completely covers the light source 20 positioned within the housing recess 110x. Next, the uncured resin is cured. For example, when the uncured resin is thermosetting, the uncured resin can be cured by holding at a temperature equal to or higher than the curing temperature.

When the uncured resin that becomes the sealing member 30 contains phosphor particles, the step of disposing the sealing member 30 includes placing the uncured resin containing the phosphor particles in the accommodating recess 110x. and allowing the phosphor particles to settle on the bottom surface side of the accommodating recess 110x. For example, selecting a phosphor that has a higher specific gravity than the uncured resin allows the phosphor to settle before curing the uncured resin. By sedimenting the phosphor, the phosphor is unevenly distributed on the bottom surface side of the housing recess 110x, so that the color unevenness of the light emitting device 1 after singulation can be effectively reduced.

Next, as shown in FIG. 12, a structure 150 is obtained by forming a first translucent member 42 that continuously covers each of the accommodating portions 110 and connecting portions 120 . That is, the uncured first translucent member 42 is placed on the second translucent member 41, the first translucent member 42 is cured, and the second translucent member 41 and the first translucent member 41 are cured. A translucent member 40 integrated with the member 42 is formed. When the second translucent member 41 is left uncured in the steps shown in FIGS. 8 and 9, in the step shown in FIG. are cured together. The second translucent member 41 and the first translucent member 42 are preferably made of the same resin. By curing the same uncured resin that forms the second translucent member 41 and the first translucent member 42 in this step, the second translucent member 41 and the first translucent member 42 are formed. interface is substantially eliminated, and the occurrence of light refraction at the interface can be reduced.

The first translucent member 42 is formed by transfer molding or compression molding, for example. When forming the first translucent member 42 by transfer molding, first, an upper metal having a hollow portion having a shape corresponding to the shape of the first translucent member 42 is formed on the upper surface side of the second translucent member 41. Place the mold. In other words, when the shape of the first translucent member 42 is an octagon in a plan view having a concave portion and slopes, an upper mold having a hollow portion with a corresponding shape is arranged. Also, a lower mold is arranged on the lower surface side of the substrate 10 . Then, the first translucent member 42 in an uncured state is poured into the hollow portion through the inlet and cured. When forming the first translucent member 42 by compression molding, first, the first intermediate 140 is placed on the lower mold, and the uncured first translucent member 42 is placed on the first intermediate 140 . 2 After filling the translucent member 41, the upper mold is closed and the uncured first translucent member 42 is cured while being compressed.

The surface of the translucent member 40 has a slope 40a in which the height above the connecting portion 120 is lower than the height above the accommodating portion 110 with reference to the upper surface 10a of the substrate 10 forming the bottom surface of the accommodating recess 110x. . The slope 40a is, for example, formed linearly in a cross-sectional view. In the translucent member 40, it is preferable that a recess 40x recessed toward the light source 20 is formed in a region that overlaps with the accommodation recess 110x in plan view. The concave portion 40x is formed in, for example, a cone shape or a truncated cone shape.

In this step, the first translucent member 42 that continuously covers the housing portion 110 and the connecting portion 120 is formed. The connecting portion 120 is lower than the side wall of the accommodating recess 110x. Therefore, the adhesion between the second light-transmitting member 41 and the first light-transmitting member 42 can be improved due to the anchoring effect of the unevenness formed by the side wall of the housing recess 110x and the connecting portion 120 .

Next, as shown in FIG. 13, the structure 150 shown in FIG. For example, when the connecting portion 120 has a lattice shape as shown in FIG. That is, both the second translucent member 41 and the first translucent member 42 are cut. The cutting is performed, for example, so that the planar shape of the first translucent member 42 is a quadrangle larger than a desired octagon. Next, by further cutting the unnecessary portion of the outer peripheral portion of the singulated quadrangular member, the octagonal light-emitting device 1 shown in FIG. 1 is completed. As a cutting method, for example, a disk-shaped rotating blade, an ultrasonic cutter, laser light irradiation, or the like can be used.

When cutting the connecting portion 120 and the first translucent member 42 , at least a portion of the connecting portion 120 in the width direction may be cut along the connecting portion 120 in a grid pattern. That is, when the width of the connecting portion 120 is defined as the width of the connecting portion 120 corresponding to the interval between the adjacent accommodating portions 110, the connecting portion 120 may be entirely cut in the width direction in the cross section shown in FIG. may be partially cut in the width direction. When at least a portion of the connecting portion 120 in the width direction is cut in a grid shape along the connecting portion 120, for example, the singulated light emitting device 1 is arranged around the accommodating portion 110 in plan view. has the remainder of

Thus, in the manufacturing method of the light emitting device 1, the supporting member 100 including the accommodating portion 110 having the accommodating recess 110x with the side wall and the bottom surface and the connecting portion 120 positioned between the adjacent accommodating portions 110 is prepared. Then, the sealing member 30 that covers the light source 20 is arranged in the housing recess 110 x of the support member 100 . As a result, the shape of the sealing member 30 can be defined by the shape of the housing recess 110x, so that the sealing member 30 with little variation in shape can be easily formed.

In addition, in the support member 100, the connecting portion 120 is formed to have a height lower than the height of the side wall of the accommodating recess 110x with respect to the bottom surface of the accommodating recess 110x. Then, the first translucent member 42 is formed to continuously cover the accommodating portion 110 and the connecting portion 120 lower than the side wall of the accommodating recess 110x. Therefore, the surface of the first translucent member 42 can be formed to have a slope 40a in which the height above the connecting portion 120 is lower than the height above the accommodating portion 110 with respect to the bottom surface of the accommodating recess 110x. Thereby, the slope 40a can be provided while the light emitting device 1 is thinned. That is, in the translucent member 40, the light from the light source 20 is refracted by the slope 40a and emitted in the lateral direction, so that the light emitting device 1 can be thinned and wide light distribution can be realized.

In particular, in the step of forming the first translucent member 42, the lowest portion of the slope 40a from the bottom surface of the accommodation recess 110x is formed lower than the height of the side wall of the accommodation portion 110, whereby the light emitting device 1 can be made even thinner.

<Surface light source>
The light-emitting device 1 can be used alone, or can be used as a planar light source by arranging a plurality of devices. Here, an example of a planar light source using a plurality of light emitting devices 1 will be described.

FIG. 14 is a schematic plan view (part 1) illustrating a planar light source using the light emitting device 1. FIG. FIG. 15 is a schematic plan view (No. 2) illustrating a planar light source using the light emitting device 1. FIG. A planar light source 200 shown in FIG. 14 has a plurality of light emitting devices 1 arranged in a line on a wiring board 210 . A planar light source 200A shown in FIG. 15 has a plurality of light-emitting devices 1 arranged in a matrix on a wiring substrate 210 .

In the planar light sources 200 and 200A, the pitches of the plurality of light emitting devices 1 (P in FIG. 14) may be the same or different, and are preferably the same. The pitch of the light emitting devices 1 can be appropriately adjusted depending on the size, brightness, etc. of the light emitting devices. The pitch of the light emitting device 1 is, for example, in the range of 5 mm to 100 mm, preferably in the range of 8 mm to 50 mm.

A specific example of the planar light source will be described below with reference to FIGS. 16 and 17. FIG. FIG. 16 is a schematic plan view showing a specific example of a planar light source using the light emitting device 1. FIG. 17 is a schematic partial cross-sectional view taken along line XVII-XVII in FIG. 16, showing a specific example of a planar light source using the light emitting device 1. FIG. However, in FIG. 16, members below the partition member 320 shown in FIG. 17 are illustrated.

A planar light source 300 shown in FIGS. 16 and 17 includes a light emitting device 1 , a wiring board 310 and a partitioning member 320 . The wiring board 310 has an insulating base material 311 and wiring 312 provided on the base material 311, and has an insulating resin 313 that covers a part of the wiring 312 as necessary. good too. The insulating resin 313 preferably has light reflectivity.

The partition member 320 is arranged on the same side of the wiring substrate 310 as the light emitting device 1 . The partitioning member 320 includes top portions 321 arranged in a grid pattern in plan view, wall portions surrounding each of the light emitting devices 1 in plan view, and bottom portions 323 connected to the lower ends of the wall portions 322 to surround the light emitting device 1 . It has multiple regions. The wall portion 322 of the partitioning member 320 extends, for example, from the top portion 321 toward the wiring board 310 side, and in a cross-sectional view, the width of the region surrounded by the opposing wall portions 322 becomes narrower toward the wiring board 310 side. The light emitting device 1 is arranged in a through hole provided substantially in the center of the bottom portion 323 . The partition member 320 is preferably a member having light reflectivity.

A range (that is, a region and a space) surrounded by the walls 322 is defined as one section 300C, and the partition member 320 includes a plurality of sections 300C. For example, one light emitting device 1 is arranged in one section 300C.

In this way, by arranging the dividing member 320 having the wall portion 322 and the bottom portion 323 surrounding each of the light emitting devices 1 on the wiring board 310, the light from the light emitting device 1 can be reflected by the wall portion 322 and the bottom portion 323. It becomes possible, and the light extraction efficiency can be improved. In addition, it is possible to suppress luminance unevenness in each section 300C, and furthermore, luminance unevenness in units of groups of sections 300C.

The section 300C is rectangular in plan view. The partition member 320 is, for example, a reflector provided with a plurality of rectangular partitions 300C in plan view. Since the four corners of the section 300C have a longer distance from the center of the light emitting device 1 than other portions, the four corners of the section 300C tend to be dark. If the four corners of each section 300C become dark, the planar light source 300 will have uneven brightness.

However, in the light-emitting device 1, by making the translucent member 40 octagonal in plan view, the directivity in the extension line direction of the diagonal line of the rectangle of the light source 20 is improved, and the direction perpendicular to the center of each side of the light source 20 is improved. The intensity of the light in the direction of the extension of the diagonal line is increased with respect to the intensity of the light such as . Specifically, as shown in FIGS. 3 to 5, the directivity of the rectangular diagonal lines D1 and D2 of the light source 20 and the sealing member 30 is improved, and the light directed toward the four second vertexes 40v2. , the intensity of light directed toward the four first vertices 40v1 is increased with respect to the intensity of . Therefore, in the planar light source 300, darkening of the four corners of the section 300C can be suppressed, luminance unevenness in each section 300C can be suppressed, and furthermore, luminance unevenness in units of groups of the sections 300C can be suppressed. Further, when the sealing member 30 contains a phosphor, it is possible to suppress color unevenness in each section 300C, and furthermore, it is possible to suppress color unevenness in units of groups of the sections 300C.

The planar light source 300 may have an optical member 330 above the apex 321 of the partition member 320 . The optical member 330 may include at least one selected from the group consisting of a light diffusion plate 331 , prism sheets (first prism sheet 332 and second prism sheet 333 ), and polarizing sheets 334 . The planar light source 300 can improve the uniformity of light by having the optical member 330 .

The planar light source 300 can be used as a light source for a direct backlight by arranging the optical member 330 above the apex 321 of the partitioning member 320 and further arranging the liquid crystal panel thereon. The order of lamination of each member in the optical member 330 can be set arbitrarily. Note that the optical member 330 does not have to be in contact with the top portion 321 of the partitioning member 320 .

(Light diffusion plate 331)
The light diffusion plate 331 is arranged above the light emitting device 1 in contact with the top portion 321 of the partition member 320 . The light diffusion plate 331 is preferably a flat plate-like member, but unevenness may be arranged on the surface thereof. The light diffusion plate 331 is preferably arranged substantially parallel to the wiring board 310 .

The light diffusion plate 331 can be made of a material that absorbs less visible light, such as polycarbonate resin, polystyrene resin, acrylic resin, or polyethylene resin. In order to diffuse incident light, the light diffusing plate 331 may have unevenness on its surface, or materials with different refractive indices may be dispersed in the light diffusing plate 331 . The unevenness can be, for example, 0.01 mm to 0.1 mm in size. Materials with different refractive indices can be selected from, for example, polycarbonate resin, acrylic resin, and the like.

The thickness of the light diffusion plate 331 and the degree of light diffusion can be appropriately set, and commercially available members such as light diffusion sheets and diffuser films can be used. For example, the thickness of the light diffusion plate 331 can be 1 mm to 2 mm.

(First Prism Sheet 332 and Second Prism Sheet 333)
The surfaces of the first prism sheet 332 and the second prism sheet 333 have a shape in which a plurality of prisms extending in a predetermined direction are arranged. For example, the first prism sheet 332 has a plurality of prisms extending in the Y direction when the plane of the sheet is viewed two-dimensionally in the X direction and the Y direction perpendicular to the X direction. It can have multiple prisms extending in a direction. The first prism sheet 332 and the second prism sheet 333 can refract light incident from various directions toward the display panel facing the planar light source 300 . As a result, the light emitted from the light emitting surface of the planar light source 300 can be emitted mainly in a direction perpendicular to the upper surface, and the luminance when the planar light source 300 is viewed from the front can be increased.

(Polarizing sheet 334)
For example, the polarizing sheet 334 selectively transmits light having a polarization direction that matches the polarization direction of a polarizing plate arranged on the backlight side of a display panel such as a liquid crystal display panel, and transmits polarized light in a direction perpendicular to the polarization direction. can be reflected toward the first prism sheet 332 and the second prism sheet 333 . A part of the polarized light returning from the polarizing sheet 334 is reflected again by the first prism sheet 332 , the second prism sheet 333 and the light diffusion plate 331 . At this time, the polarization direction changes, for example, the light is converted into polarized light having the polarization direction of the polarizing plate of the liquid crystal display panel, enters the polarizing sheet 334 again, and exits to the display panel. As a result, the polarization directions of the light emitted from the planar light source 300 can be aligned, and the light in the polarization direction effective for improving the luminance of the display panel can be emitted with high efficiency. As the polarizing sheet 334, the first prism sheet 332, the second prism sheet 333, etc., commercially available optical members for backlight can be used.

The planar light source 300 can be manufactured, for example, by placing the partitioning member 320 and the light emitting device 1 on the wiring substrate 310 and placing the optical member 330 on the partitioning member 320 if necessary.

A light-emitting module 350 shown in FIG. 18 can also be realized. In the light-emitting module 350, one light-emitting device 1 is arranged on the wiring substrate 310, and one partitioning member 320 including a wall portion 322 surrounding the light-emitting device 1 in plan view is provided on the same side of the wiring substrate 310 as the light-emitting device 1. are placed. 300 C of divisions are rectangular in planar view like the case of the planar light source 300 shown in FIG.

In the light-emitting module 350 as well, the four corners of the section 300C have a longer distance from the center of the light-emitting device 1 than the other portions, so the four corners of the section 300C tend to be dark and uneven in luminance. However, in the light-emitting device 1, since the translucent member 40 is octagonal in plan view, as in the case of the planar light source 300, luminance unevenness in the section 300C can be suppressed, and color unevenness can also be suppressed.

Note that the light emitting module 350 may have the optical member 330 above the top portion 321 of the partition member 320 .

<Modification 1 of the first embodiment>
Modification 1 of the first embodiment shows an example of a light emitting device having a different structure in the vicinity of the light source. 19 is a schematic cross-sectional view (Part 1) illustrating a light-emitting device according to Modification 1 of Embodiment 1. FIG. As shown in FIG. 19, in the light emitting device 1A, the light source 20 is mounted on the upper surface 10a of the substrate 10 with the electrodes 20t facing the substrate 10 side. A pair of electrodes 20t of the light source 20 are electrically connected to a pair of leads 11 of the substrate 10 via, for example, conductive joint members.

In order to mount the light source 20 on the substrate 10, for example, in the process of FIG. 20t and the pair of leads 11 of the substrate 10 are electrically connected by a conductive joining member. Examples of conductive bonding members include conductive pastes such as silver, gold, and palladium; eutectic solder materials such as gold-tin and tin-silver-copper; brazing materials such as low-melting-point metals; and bumps containing.

Thus, the light source 20 may be mounted on the substrate 10 with the electrode 20t facing away from the substrate 10 as shown in FIG. It may be placed on the substrate 10 facing

Further, as shown in FIGS. 20 to 22, the light source may have a structure in which an optical member such as a translucent member or a light adjustment member is combined with a light emitting element instead of a single light emitting element. A specific description will be given below.

20 is a schematic cross-sectional view (part 2) illustrating a light-emitting device according to Modification 1 of Embodiment 1. FIG. In light emitting device 1B shown in FIG. 20, light source 20B includes light emitting element 21, translucent member 22, and covering member .

The light emitting element 21 has an upper surface 21a, a lower surface 21b, and side surfaces 21c. The light emitting element 21 is, for example, an LED. Details of the light emitting element are as described in the first embodiment. Light emitting element 21 includes a pair of electrodes 21t formed on lower surface 21b. One of the pair of electrodes 21t is a p-side electrode and the other is an n-side electrode.

The light source 20 is mounted on the upper surface 10a of the substrate 10 with the electrode 21t of the light emitting element 21 facing the substrate 10 side. A pair of electrodes 21t of the light emitting element 21 are electrically connected to a pair of leads 11 of the substrate 10 via, for example, a conductive joining member. In FIG. 20, the pair of electrodes 21t (that is, the p-side electrode and the n-side electrode) of the light-emitting element 21 are used as they are as the electrodes of the light source 20B. The connected external connection electrodes may be used as the electrodes of the light source 20B.

The translucent member 22 covers the upper surface 21 a and side surfaces 21 c of the light emitting element 21 . The lower surface of the translucent member 22 is flush with the lower surface 21b of the light emitting element 21, for example. The translucent member 22 may contain a light diffusing material and a wavelength converting member. When using a wavelength conversion member, it is preferable to use a wavelength conversion member of a different type from the phosphor provided in the sealing member 30 .

The covering member 23 covers the lower surface 21b of the light emitting element 21, the side surface of the electrode 21t, and the lower surface of the translucent member 22, and exposes the lower surface of the electrode 21t. The lower surface of the light source 20B is composed of the lower surface of the covering member 23 and the lower surface of the electrode 21t. The covering member 23 is preferably one that reflects light. Note that the covering member 23 may not be provided.

In order to mount the light source 20B on the substrate 10, the light source 20B is disposed on the substrate 10, for example, in the process of FIG. , the pair of electrodes 21t and the pair of leads 11 of the substrate 10 are electrically connected by a conductive joining member.

21 is a schematic cross-sectional view (No. 3) illustrating a light-emitting device according to Modification 1 of Embodiment 1. FIG. In a light emitting device 1C shown in FIG. 21, a light source 20C includes a light emitting element 21, a translucent member 22, a covering member 23, and a light adjusting member 24. As shown in FIG. The light adjusting member 24 covers the upper surface of the translucent member 22 . The light adjustment member 24 preferably covers the entire upper surface of the translucent member 22 . The light adjustment member 24 reflects part of the light emitted from the light emitting element 21 and transmits another part of the light emitted from the light emitting element 21 . 20 C of light sources can be mounted on the board|substrate 10 by the method similar to the light source 20B, for example.

22 is a schematic cross-sectional view (No. 4) illustrating the light-emitting device according to Modification 1 of Embodiment 1. FIG. A light-emitting device 1D shown in FIG. 22 does not have a substrate 10 . A pair of electrodes 21 t of the light emitting element 21 are exposed on the lower surface side of the sealing member 30 , and each electrode 21 t is electrically connected to the external connection electrode 15 . The external connection electrode 15 has a larger area than the electrode 21t when the light emitting device 1D is viewed from below.

To manufacture the light emitting device 1D, for example, in the process of FIG. 10 of the first embodiment, the light source 20B is placed on the substrate 10 with the electrode 21t of the light emitting element 21 facing the bottom surface of the housing recess 110x. Then, the substrate 10 is removed before or after the process shown in FIG. 11 of the first embodiment. After that, a pair of external connection electrodes 15 electrically connected to the respective electrodes 21t of the light emitting elements 21 are formed on the lower surface side of the sealing member 30 by sputtering, plating, or the like. In this case, a support plate made of metal, resin, or the like may be used as the substrate 10 .

<Second embodiment>
In the second embodiment, an example of a liquid crystal display device (liquid crystal display device) using the planar light source 300 as a backlight source is shown.

FIG. 23 is a configuration diagram illustrating the liquid crystal display device according to the second embodiment. As shown in FIG. 23, liquid crystal display device 1000 includes liquid crystal panel 720, optical sheet 710, and planar light source 300 in order from the top. The optical member 330 of the planar light source 300 may include a DBEF (reflective polarizing sheet), a BEF (brightness enhancement sheet), a color filter, or the like.

The liquid crystal display device 1000 is a so-called direct type liquid crystal display device in which the planar light source 300 is laminated below the liquid crystal panel 720 . The liquid crystal display device 1000 irradiates the liquid crystal panel 720 with light emitted from the planar light source 300 .

Generally, in a direct type liquid crystal display device, since the distance between the liquid crystal panel and the planar light source is short, the uneven color and brightness of the planar light source may affect the uneven color and brightness of the liquid crystal display device. be. Therefore, a planar light source with little color unevenness and luminance unevenness is desired as a planar light source for a direct type liquid crystal display device. By using the planar light source 300 in the liquid crystal display device 1000, the thickness of the planar light source 300 is reduced to 5 mm or less, 3 mm or less, or 1 mm or less, while suppressing the darkening of the outer periphery to reduce luminance unevenness and color unevenness. can be less.

Thus, the planar light source 300 is suitable for use as a backlight for the liquid crystal display device 1000. FIG.

However, it is not limited to this, and the planar light source 300 can be suitably used as a backlight for televisions, tablets, smartphones, smart watches, head-up displays, digital signage, bulletin boards, and the like. Further, the planar light source 300 can also be used as a light source for illumination, and can be used for emergency lighting, line lighting, various kinds of illumination, installation for vehicles, and the like.

Although the preferred embodiments and the like have been described in detail above, the present invention is not limited to the above-described embodiments and the like, and various modifications and substitutions can be made to the above-described embodiments and the like without departing from the scope of the claims. can be added.

1, 1A, 1B, 1C, 1D Light emitting device 10 Substrate 10a Upper surface 11 Lead 12 Insulating member 15 External connection electrodes 20, 20B, 20C Light source 20a Upper surface 20b Lower surface 20c Side surface 20t, 21t Electrode 21 Light emitting element 22 Translucent member 23 Covering member 24 Light adjusting member 25 Metal wire 30 Sealing member 40 Translucent member 40a Slopes 40b, 40d Plane 40c Inner side 40x Recess 41 Second translucent member 41x Through hole 42 First translucent member 100 Supporting member 110 Accommodating portion 110x Accommodating recess 120 Connecting portion 130 Second intermediate 140 First intermediate 150 Structures 200, 200A, 300 Planar light sources 210, 310 Wiring board 300C Division 311 Base material 312 Wiring 313 Insulating resin 320 Division member 321 Top 322 wall portion 323 bottom portion 330 optical member 331 light diffusion plate 332 first prism sheet 333 second prism sheet 334 polarizing sheet 350 light emitting module 710 optical sheet 720 liquid crystal panel 1000 liquid crystal display device

Claims (23)

a light source;
a sealing member that covers the light emitting surface and side surfaces of the light source;
a translucent member covering the upper and side surfaces of the sealing member;
has
The translucent member is octagonal in plan view,
The light-emitting device, wherein the octagon has all internal angles less than 180 degrees and has different internal angles. The light emitting device according to claim 1, wherein the octagon has sides of equal length. 3. The light-emitting device according to claim 1, wherein the surface of said light-transmitting member is provided with a sloping surface in which the height on the outer peripheral side is lower than the height on the center side with reference to the lower surface of said light source. 4. The light-emitting device according to claim 3, wherein said slope is annularly provided outside said sealing member in plan view. 5. The light-emitting device according to claim 3, wherein said slope is linear in a cross-sectional view. The light emitting device according to any one of claims 3 to 5, wherein the surface of the translucent member has a plane perpendicular to the lower surface of the light source outside the slope. 7. The light emitting device according to claim 6, wherein the height of said plane is higher than the height of said light source with respect to the lower surface of said light source. The light-emitting device according to any one of claims 3 to 7, wherein the translucent member has a recess recessed toward the light source in a region overlapping the sealing member in plan view. 9. The light-emitting device according to claim 8, wherein the recess has a cone shape or a truncated cone shape. 10. The light-emitting device according to claim 9, wherein, in a cross-sectional view, an inner surface of the translucent member that defines the recess is convexly curved toward the inside of the recess. The light-emitting device according to any one of claims 8 to 10, wherein the recess is rectangular in plan view. 12. The light emitting device according to any one of claims 8 to 11, wherein the surface of said translucent member has a plane parallel to the lower surface of said light source between said concave portion and said inclined surface. The light emitting device according to any one of claims 8 to 12, wherein the recess is larger than the sealing member in plan view. The light-emitting device according to any one of claims 1 to 13, wherein the sealing member is rectangular in plan view. 15. The light emitting device according to claim 14, wherein the sealing member contains phosphor particles and resin. The light emitting device according to claim 14 or 15, wherein the light source has a rectangular shape that is smaller than the sealing member in plan view. 17. The light-emitting device according to claim 16, wherein each vertex of the rectangle of the sealing member is positioned on an extension line of a diagonal line of the rectangle of the light source in plan view. The octagon is
four first vertices inscribed in a circle; and
18. A light emitting device according to claim 16 or 17, having a chord defined by said circumferentially adjacent first vertices and four other second vertices located in an area bounded by an arc. 19. The light emitting device according to claim 18, wherein said first vertex is positioned on an extension line of a diagonal line of said light source in plan view. a substrate on which the light emitting device according to any one of claims 1 to 19 is arranged;
and a partitioning member arranged on the same side of the substrate as the light emitting device and including a wall surrounding the light emitting device in plan view. A planar light source in which the light emitting devices according to any one of claims 1 to 19 are arranged one-dimensionally or two-dimensionally. a substrate on which a plurality of the light emitting devices are arranged;
22. The planar light source according to claim 21, further comprising a partitioning member disposed on the same side of the substrate as the light emitting device, including a wall portion surrounding each of the light emitting devices in plan view, and having a plurality of surrounding regions. A liquid crystal display device using the planar light source according to claim 21 or 22 as a backlight source.

Images