KR20200068006A - Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same - Google Patents

Abstract

The present invention relates to an asymmetrically shaped chip scale packaging (CSP) light emitting device (LED) which comprises an LED chip, a photoluminescent structure (or a light transmitting structure), and a reflective structure. The photoluminescent structure covers an upper surface and/or an edge surface of the LED chip. The reflective structure at least partially covers the edge surface of the photoluminescent structure. The reflective structure partially reflects primary light emitted from the edge surface of the LED chip and converted secondary light radiated from the edge surface of the photoluminescent structure, therefore asymmetrically shaping a radiation pattern.

Description

Asymmetric shaped light emitting device, backlight module using the same and method for manufacturing the same{ASYMMETRICALLY SHAPED LIGHT-EMITTING DEVICE, BACKLIGHT MODULE USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME}

This application claims the benefit and priority of Taiwan Patent Application No. 106124542 filed on July 21, 2017 and Chinese Patent Application No. 201710601827.1 filed on July 21, 2017, the disclosures of which are The whole is incorporated herein by reference.

The present disclosure relates to a light emitting device and a method of manufacturing the same; More particularly, it relates to an asymmetric shaped chip-scale packaging (CSP) light emitting device (LED) used in a liquid crystal display (LCD) backlight module, and a method of manufacturing the same.

LED chips are commonly used as light sources for lighting, backlights or indicators inside electronics. Specifically, the LED chip that generates the primary light is typically disposed inside the package structure to form an LED package, and a portion of the primary light is converted to secondary light by photoluminescent materials, so that the photoluminescent Materials are typically dispensed to cover the radiation path of the LED chip. Reflective materials are also used as part of the package structure so that desirable emission directions can be achieved.

Among them, a PLCC (Plastic Leaded Chip Carrier) LED package may be classified into a top-view LED package or a side-view LED package according to their light emission direction. The top-view LED package is used as a light source for general illumination or as a backlight source for direct light LCD displays, while the side-view LED package is used as a backlight source for edge-light LCD displays for televisions or mobile devices. The top-view LED package or side-view LED package has a primary light emitting surface. The optical axis of the LED package is generally specified by an axis that passes through the center of the primary luminescent surface (eg, a rectangle) and is perpendicular to the primary luminescent surface. For simplicity, two additional axes are specified along the length and width directions of the primary light emitting surface, both are perpendicular to the optical axis, and the axis along the length direction and the axis along the width direction are also perpendicular to each other. If the radiation pattern is measured along the length and width directions of the top-view LED package (or side-view LED package), the same (or similar) radiation pattern can be typically obtained. Since the top-view LED package or side-view LED package has the same or similar emission patterns along the length and width directions, the PLCC-type LED package has a symmetrical emission pattern.

LED packages of this type with a symmetrical radiation pattern cannot meet some applications that specify an asymmetrical radiation pattern such as a street light. Another application specifies the light source of the backlight module so that the edge-light type LCD for televisions or mobile devices has an asymmetric emission pattern, where further of the radiation pattern along the longitudinal direction of the LED packages (or the longitudinal direction of the backlight module) Large angles are preferred. In this way, a radiation pattern with a large viewing angle along the longitudinal direction can provide a more uniform incident light distribution to the light guide plate, reducing dark spots or areas along the light guide plate. If a light source with a large viewing angle is used, the number of LED packages used for the light rod along the light guide plate can also be reduced. The edge-light source also provides a smaller viewing angle of the radiation pattern along the width direction (or the thickness direction of the backlight module) of the LED package, so that incident light can be effectively transmitted from the LED light source to the light guide plate of the backlight module instead of leaking from the light guide plate. Therefore, it is possible to increase the light utilization efficiency.

For the PLCC-type LED package, a lead frame with a reflective cup, whether top-view or side-view, is used as the main design structure. In addition, it is typically packaged as an LED chip without photoluminescent material. Specifically, PLCC reflective cups are typically made by molding. When PLCC-type LED packages are used in applications that specify asymmetric emission patterns, extra optical lenses or secondary optical lenses are integrated to shape the light to achieve a specific emission pattern, which will inevitably increase manufacturing costs. . In addition, the total space used to achieve asymmetric radiation patterns is greatly increased, which is not advantageous for the final product design of consumer electronic products today. If no optical lens is used to shape the radiation pattern, an alternative approach is that part of the reflective cup structure of the lead frame is made light-transmissive. That is, light can penetrate this portion of the light-transmissive structure, so that the radiation pattern can be changed. However, the reflective cup structure of the lead frame is typically manufactured through molding. Therefore, LED packages with asymmetric shape geometry, such as reflective cups with partially light-transmissive and partially reflective structures, are difficult to manufacture using mass production processes. Therefore, an efficient and cost effective method of achieving an asymmetric emission pattern for a PLCC type LED package is still desirable.

As the size of LCDs for televisions and mobile devices continues to be thinner in form factors and lighter in weight, the PLCC-type LED package used as a backlight source must also continue to be reduced in size. In this trend, CSP LEDs with a small form factor have been recently developed. CSP LEDs have become one of the major development trends in the LED industry. For example, CSP LEDs have been introduced to replace top-view PLCC LEDs used in direct backlight LCD TVs. The application of CSP LEDs in the backlight can further reduce the size of the LED backlight module, while at the same time obtaining a higher light intensity. The smaller size of the CSP LED is advantageous in the design of the secondary optical lens, and the higher light intensity is advantageous in the design of a brighter LCD or reduction in the number of LEDs otherwise used.

Depending on the number of light emitting surfaces, CSP LEDs can be categorized into two types: top surface light emission and five-side light emission. With respect to the top surface emitting CSP LED, the four vertical edge surfaces of the flip-chip LED chip are covered with a reflective material, so that light is emitted alone or mainly from the top surface of the CSP LED. Thus, the top surface emitting CSP LED has a smaller viewing angle (about 120°). The light of the five-sided emitting CSP LED can be transmitted outward from the four vertical edge surfaces as well as the top surface of the CSP LED, thus having a larger viewing angle (about 140° to 160°). However, similar to PLCC-type LED packages, both types of CSP LEDs belong to the category of light emitting devices with a symmetrical emission pattern, so both types of CSP LEDs specify an asymmetrical emission pattern. The application cannot be satisfied. In addition, in the case of a CSP LED, when a primary optical lens or a secondary optical lens is used to generate an asymmetric emission pattern, not only the production cost is greatly increased, but also the space of the CSP LED together with the lens is greatly increased, which is the CSP LED. Its small form factor will eliminate the benefits. Therefore, effective design to achieve an asymmetric emission pattern while using CSP LEDs is still lacking.

For side-view PLCC packages or other side-view surface mounted LED packages, even if the primary emitting surface of the side-view package is perpendicular to the bonding pad surface of the package, the primary emitting surface is still in contact with the electrode surface of the LED chip. Are substantially parallel. In the case of CSP LEDs, lead frames or submount substrates are typically not included. That is, the electrode surface of the CSP LED is parallel to and in contact with the application mounting board. Thus, in some embodiments of the present disclosure, the top-view CSP will be characterized by a technical feature that the primary light emitting surface and the electrode surface of the CSP LED are substantially parallel; The side-view CSP will be characterized by the technical feature that the primary light emitting surface and the electrode surface of the CSP LED are substantially vertical.

Thus, CSP LEDs can be greatly reduced in size, but CSP LEDs used in backlight applications are top-view CSP LEDs. That is, the primary light emitting surface and the lower electrode surface of the CSP LED are substantially parallel to each other. When a top-view CSP LED is used as a backlight source in an edge-light LCD, a special L-shaped light rod design is included such that the primary light emitting surface of the CSP LED is directed toward the incident light side of the light guide plate. L-shaped light rods will increase production cost and difficulty in alignment between the light rods and the light guide plate. In addition, an increase in the thickness of the light rod module in the normal direction of the light emitting surface results in a larger display frame bezel size. If the primary light emitting surface and the lower electrode surface of the CSP LED are perpendicular to each other, it is characterized as a side-view CSP LED. When a CSP LED having a side-view structure is employed, the L-shaped light rod can be omitted to rotate the top light emitting surface 90 degrees toward the incident light side of the light guide plate. Therefore, the thickness of the light rod module along the direction of the light emitting surface can be effectively reduced.

Thus, manufacturing small form factor CSP LEDs with asymmetric geometries to achieve asymmetric radiation patterns in a low cost and efficient manner, and small form factor side-view CSPs with primary light emitting surfaces and bottom electrode surfaces perpendicular to each other. It is still desirable to realize LEDs, which can be applied to edge-light type backlight modules to further reduce the display frame bezel size by reducing the thickness of the light bar module along the direction of the light emitting surface.

The purpose of some embodiments of the present disclosure includes a top-view CSP LED, top-view LED with asymmetrically shaped reflective surfaces, such that the emission angle of the LED is effectively limited to specific emission directions to create an asymmetric emission pattern. To provide a backlight module and a method for manufacturing a top-view LED.

Another object of some embodiments of the present disclosure is to produce a side-view CSP LED having a primary light-emitting surface and a lower electrode surface that are substantially perpendicular to each other, a backlight module comprising the side-view LED, and manufacturing a side-view LED. Is to provide a way.

To achieve the above objects, a top-view LED having an asymmetric shape reflective structure according to some embodiments of the present disclosure includes an LED chip, a photoluminescent structure and a reflective structure. The LED chip has a top surface, a bottom surface opposite the top surface, an edge surface and a set of electrodes. The edge surface is formed and extended between the top surface and the bottom surface, and a set of electrodes is disposed on or adjacent to the bottom surface to form the bottom electrode surface. Further, the first horizontal direction and the second horizontal direction perpendicular to each other are respectively specified along the length direction and the width direction on the upper surface of the LED chip. The photoluminescent structure has a top surface, a bottom surface facing the top surface, and a side surface. The side surface is formed and extends between the top surface and the bottom surface. The photoluminescent structure covers the top surface and/or edge surface of the LED chip. The reflective structure partially covers the side surface of the photoluminescent structure. The side surface of the photoluminescent structure has four vertical side surfaces. Two of the four vertical side surfaces are disposed vertically opposite to the second horizontal direction, one of which is covered by a reflective structure to form a side reflective surface, and the other is covered by a reflective structure Not forming a side light emitting surface, and the side light emitting surface and the lower electrode surface of the LED chip are substantially perpendicular to each other. The other two vertical side surfaces are disposed perpendicularly to the first horizontal direction to form two side light emitting surfaces.

To achieve the above object, some embodiments according to the present disclosure relate to a side-view CSP LED comprising an LED chip, a photoluminescent structure and a reflective structure. The LED chip has a top surface, a bottom surface opposite the top surface, an edge surface and a set of electrodes. The edge surface is formed and extended between the top surface and the bottom surface, and a set of electrodes is disposed on or adjacent to the bottom surface. The set of electrodes and the bottom surface collectively form the bottom electrode surface of the LED chip. Further, the first horizontal direction and the second horizontal direction perpendicular to each other are specified along the length direction and the width direction on the upper surface of the LED chip. The photoluminescent structure covers the edge surface and/or the top surface of the LED chip. The reflective structure substantially covers the top surface of the photoluminescent structure to form an upper reflective surface, and partially covers the side surface of the photoluminescent structure to form at least one side reflective surface.

To achieve the above object, other embodiments of the present disclosure relate to a top-view monochromatic LED having an asymmetric reflective structure including an LED chip, a light-transmissive structure and a reflective structure, wherein the LED chip has a top surface, a top surface It has a lower surface, an edge surface and a set of electrodes opposite to it. The edge surface is formed and extended between the top surface and the bottom surface, and a set of electrodes is disposed on or adjacent to the bottom surface. The set of electrodes and the bottom surface collectively form the bottom electrode surface. Further, the first horizontal direction and the second horizontal direction perpendicular to each other are respectively specified along the length direction and the width direction on the upper surface of the LED chip. The light-transmissive structure has a top surface, a bottom surface opposite the top surface, and a side surface. The side surface is formed and extends between the top surface and the bottom surface. The light-transmitting structure covers the top surface and/or edge surface of the LED chip. The reflective structure partially covers the side surface of the light-transmissive structure. The side surface of the light-transmitting structure has four vertical side surfaces. Two of the four vertical side surfaces are disposed vertically opposite to the second horizontal direction, one of which is covered by a reflective structure to form one side reflective surface, and the other to the reflective structure. Not covered by to form a side light emitting surface, and the side light emitting surface and the bottom electrode surface of the LED chip are substantially perpendicular to each other. The other two vertical side surfaces are arranged perpendicular to the first horizontal direction, and are not covered by the reflective structure to form two side light emitting surfaces.

To achieve the above object, other embodiments according to the present disclosure relate to a monochromatic side-view CSP LED comprising an LED chip, a light-transmissive structure and a reflective structure. The LED chip has a top surface, a bottom surface opposite the top surface, an edge surface and a set of electrodes. The edge surface is formed and extended between the top surface and the bottom surface, and a set of electrodes is disposed on or adjacent to the bottom surface to form the bottom electrode surface. Further, the first horizontal direction and the second horizontal direction perpendicular to each other are respectively specified along the length direction and the width direction on the upper surface of the LED chip. The light-transmitting structure covers the top surface and/or edge surface of the LED chip. The reflective structure substantially covers the top surface of the light-transmissive structure to form an upper reflective surface, and partially covers the side surface of the light-transmissive structure to form at least one side reflective surface.

To achieve the above object, a backlight module according to some embodiments of the present disclosure includes an application mounting board, a plurality of top-view or side-view LEDs, a reflective layer, and a light guide plate according to embodiments of the present disclosure. . The application mounting board includes a horizontal surface and/or a vertical surface. A plurality of LEDs are disposed on the application mounting board to form a light rod. The reflective layer is placed over the horizontal surface of the application mounting board. The light guide plate is disposed on the reflective layer, and includes an incident light side surface and an exit light surface connected to the incident light side surface and facing away from the reflective layer.

To achieve the above object, a method of manufacturing a top-view or side-view LED disclosed in accordance with some embodiments of the present disclosure includes a photoluminescent structure to cover the top surface and/or edge surface of an LED chip. Or disposing a light-transmitting structure; And forming a reflective structure to partially cover one vertical side surface of the photoluminescent structure or light-transmissive structure. The first horizontal direction and the second horizontal direction perpendicular to each other are respectively specified along the length direction and the width direction on the upper surface of the LED chip. The side surface of the photoluminescent structure or the light-transmissive structure has four vertical side surfaces. Two of the four vertical side surfaces are disposed opposite to each other perpendicular to the second horizontal direction, one of which is covered by a reflective structure to form a side reflective surface, the other to the reflective structure Not covered by to form a side emitting surface. The other two of the four vertical side surfaces are arranged perpendicular to the first horizontal direction.

In this arrangement, the photoluminescent structure covers the top surface and/or edge surface of the LED chip, and the reflective structure partially covers the side surface of the photoluminescent structure, so that light emitted from the edge surface of the LED chip And/or partially reflects light emitted from the side structure of the photoluminescent structure. Thus, an asymmetric radiation pattern can be formed with respect to the normal direction of the light emitting surface along the first horizontal direction and/or along the second horizontal direction. In addition, the reflective structure substantially covers the top surface and partially covers the edge surface of the LED chip, thereby forming a side-view CSP LED having technical features in which the primary light emitting surface and the bottom electrode surface are substantially perpendicular to each other. can do. Thus, the LED can provide asymmetric radiation patterns appropriately specified in different applications without the aid of an additional optical lens, effectively reducing the manufacturing cost of the LED, while its small size to facilitate the compact design of the final product. Can maintain the advantage of.

In addition, the top-view or side-view LED can provide a larger viewing angle along the longitudinal direction of the light guide plate, so that dark areas can be minimized and the distance between two adjacent LEDs can be increased (light bar The number of LEDs used in can be reduced). On the other hand, the LED can provide a smaller viewing angle along the thickness direction of the light guide plate, so that the light emitted by the LED is more effectively transmitted to the light guide plate, thereby reducing the loss of light energy. In addition, the primary light emitting surface of the LED can be further specified substantially perpendicular to the bottom electrode surface of the LED to form a side-view CSP LED. When the side-view LED is applied to an edge-light backlight module, the L-shaped application mounting board of the light bar designed for using the top-view LED can be omitted. Instead, a horizontal application mounting board of light bars for using side-view LEDs is sufficient. Removal of the vertical portion of the L-shaped application mounting board reduces the overall thickness of the light rod and reduces alignment and manufacturing difficulties. Thus, a display using a side-view LED backlight module can have a narrower frame bezel.

Other aspects and embodiments of the present disclosure are also contemplated. The above summary and the following detailed description are not intended to limit the present disclosure to any particular embodiment, but are only intended to describe some embodiments of the present disclosure.

1A, 1B, 1C, 1D, and 1E are two perspective views and three cross-sectional views of a top-view LED according to one embodiment of the present disclosure.
2A, 2B, 2C, and 2D are two perspective views and two cross-sectional views of a top-view LED according to another embodiment of the present disclosure.
3A, 3B, 3C and 3D are two perspective views and two cross-sectional views of a side-view LED according to another embodiment of the present disclosure.
3E and 3F are two cross-sectional views of a side-view LED according to another embodiment of the present disclosure.
4A, 4B, 4C, and 4D are two perspective views and two cross-sectional views of a side-view LED according to another embodiment of the present disclosure.
4E and 4F are cross-sectional views of a side-view LED according to another embodiment of the present disclosure.
5 is a schematic diagram of a backlight module including a top-view LED according to an embodiment of the present disclosure.
6 is a schematic diagram of a backlight module including a side-view LED according to an embodiment of the present disclosure.
7A and 7B illustrate a top view schematic view and a side view schematic view of the backlight module shown in FIGS. 5 and 6, respectively.
8A, 8B, 9A, 9B, 9C, 10A, 10B, 11A, 11B, 12A, and 12B are fabricated for manufacturing a top-view LED according to one embodiment of the present disclosure. These are schematics of the process steps of the method.
13A, 13B, 14A, 14B, 14C, 15A, 15B, 16A, 16B, 17A, and 17B are manufactured for manufacturing a top-view LED according to another embodiment of the present disclosure. These are schematics of the process steps of the method.
18A, 18B, 19A, 19B, 19C, 20A, 20B, 21A, 21B, 22A, and 22B are fabricated for manufacturing a side-view LED according to another embodiment of the present disclosure. These are schematics of the process steps of the method.
23A, 23B, and 23C are schematic diagrams of process steps of a partial manufacturing method for manufacturing a top-view or side-view LED according to another embodiment of the present disclosure.

Definitions

The following definitions apply to some of the technical aspects described for some embodiments of the present disclosure. Likewise, these definitions can be extended herein.

As used herein, singular expressions may include plural references unless the context clearly indicates otherwise. Thus, for example, a reference to a layer can include multiple layers unless the context clearly indicates otherwise.

As used herein, the term "set" refers to a set of one or more components. Thus, for example, a set of layers can include a single layer or multiple layers. Components of a set may also be referred to as members of the set. The components of the set may be the same or different. In some cases, components of a set may share one or more common characteristics.

As used herein, the term “adjacent” refers to being nearby or nearby. Adjacent components may be spaced apart from one another or may actually or directly contact each other. In some cases, adjacent components can be connected to each other or can be formed integrally with each other. In the description of some embodiments, a component provided “on” or “on top” of another component is one or more as well as cases in which the component is directly on (eg, in direct physical contact with) another component. Intervening components may be located between a component and another component. In the description of some embodiments, a component provided “below” another component is one or more intervening components that differ from the component, as well as cases in which the component directly exists (eg, in direct physical contact with the other component). It may include cases that are located between components.

As used herein, the terms "connect", "connected" and "connect" refer to an operable coupling or link. The connected components can be directly coupled to each other or can be coupled to each other indirectly, for example, through different sets of components.

As used herein, the terms “about”, “substantially” and “substantial” refer to a substantial extent or range. When used in conjunction with an event or situation, the terms occur when the event or situation occurs accurately, as well as when the event or situation occurs, for example, to approximate general tolerance levels of manufacturing operations described herein. Can refer to. For example, when used in conjunction with a numerical value, the terms range from ±10% or less of the numerical value, such as ±5% or less, ±4% or less, ±3% or less, ±2% or less, ± 1% or less, ±0.5% or less, ±0.1% or less, or ±0.05% or less. For example, “substantially” transparent can refer to a light transmittance of at least 70%, eg, at least 75%, at least 80%, at least 85% or at least 90%, at least partially or across the visible spectrum. have. For example, “substantially” two flush surfaces within 20 micrometers lying along the same plane, for example within 10 micrometers lying along the same plane, or within 5 micrometers lying along the same plane Can refer to. For example, “substantially” parallel means an angle variation range of ±10° or less with respect to 0°, eg, ±5° or less, ±4° or less, ±3° or less, ±2° or less, ±1 ° or less, ±0.5° or less, ±0.1° or less, or ±0.05° or less. For example, “substantially” vertical is an angular variation range of ±10° or less with respect to 90°, eg, ±5° or less, ±4° or less, ±3° or less, ±2° or less, ±1 ° or less, ±0.5° or less, ±0.1° or less, or ±0.05° or less.

The term "efficiency" or "quantum efficiency" as used herein for photoluminescence refers to the ratio of the number of output photons to the number of input photons.

As used herein, the term "size" refers to characteristic dimensions. For spherical objects (eg particles), the size of the object may refer to the diameter of the object. In the case of a non-spherical object, the size of the non-spherical object may refer to the diameter of the corresponding spherical object, where the corresponding spherical object is a specific set of inducible or measurable properties substantially the same as the non-spherical object. It has or has. When referring to a set of objects having a specific size, it is considered that the objects can have a size distribution near that size. Thus, as used herein, the size of a set of objects may refer to a typical size of a size distribution, such as average size, medium size, or peak size.

1A and 1B show two perspective views of a top-view LED 1A according to one embodiment of the present disclosure and FIGS. 1C and 1D show two cross-sections thereof. The LED 1A includes an LED chip 10, an optical structure 20 and a reflective structure 30. The technical details of the components will be sequentially described below.

The LED chip 10 is a flip-chip light emitting semiconductor chip and has an upper surface 11, a lower surface 12, an edge surface 13 and a set of electrodes 14 as illustrated in FIGS. 1C and 1D. . The upper surface 11 is disposed opposite the lower surface 12, the upper surface 11 and the lower surface 12 can be rectangular, and the rectangular upper surfaces 11 (and the corresponding lower surface 12 )) the two side edges or lines are substantially parallel to the first horizontal direction D1, and the other two side edges or lines are substantially parallel to the second horizontal direction D2. That is, the first horizontal direction D1 and the second horizontal direction D2 are respectively specified vertically on the upper surface 11 of the LED chip 10 along the length direction and the width direction. The thickness direction (direction perpendicular to the upper surface 11 not shown) is specified to follow a vertical direction perpendicular to both the first horizontal direction D1 and the second horizontal direction D2.

The edge surface 13 is formed between the upper surface 11 and the lower surface 12, and extends and connects the circumference of the upper surface 11 and the circumference of the lower surface 12. That is, the edge surface 13 is formed along the circumferential edge of the upper surface 11 and the circumferential edge of the lower surface 12, so that the edge surface 13 is annular with respect to the upper surface 11 and the lower surface 12 (For example, a rectangular ring). Edge surface 13 further comprises four vertical edge surfaces 131a to 131d (edge surface 13 is divided into four vertical edge surfaces 131a to 131d), and two vertical edge surfaces 131a and 131c are disposed opposite and perpendicular to the first horizontal direction D1, and the other two vertical edge surfaces 131b and 131d are disposed opposite and perpendicular to the second horizontal direction D2.

The set of electrodes 14 having two or more electrodes is disposed on or adjacent to the lower surface 12. The set of electrodes 14 and the lower surface 12 are hereinafter collectively referred to as the lower electrode surface. The light emitting active layer of the LED chip 10 is located near the lower surface 12 of the LED chip 10 and over the set of electrodes 14 (not shown). The defined space between the active layer, the top surface 11 and the four vertical edge surfaces 131a to 131d is formed of a transparent substrate material (eg sapphire). Electrical energy (not shown) is supplied to the LED chip 10 through a set of electrodes 14, so that primary light is emitted through the electroluminescence of the active layer (converting electrical energy into optical energy) Energy can be applied to the layer. Since the LED chip 10 is of the flip-chip type, no electrodes are disposed on the top surface 11, and light emitted by the active layer of the LED chip 10 is not only the top surface 11 but also the edge surface. It can be transferred out of the LED chip 10 from the four vertical edge surfaces 131a to 131d of (13).

An exemplary embodiment of the optical structure 20 is a photoluminescent structure 20 that forms a white LED. Another exemplary embodiment of the optical structure 20 is a substantially transparent light-transmissive structure 20 that forms a monochromatic LED. Hereinafter, the photoluminescent structure 20 will first be used as an embodiment for illustrating the technical features of the LED 1A. The photoluminescent structure 20, which can be used to convert the primary light portions emitted by the LED chip 10 to secondary light having different wavelengths to form the light beam L, comprises a light-transmissive resin material and Including a photoluminescent material, the photoluminescent material can be uniformly scattered in the light-transmissive resin material so that the photoluminescent structure 20 does not have a separate layered structure. The photoluminescent structure 20 may also include a photoluminescent layer that is laminated to each other and a substantially transparent light-transmissive layer (or light-transmissive structure). For specific technical details, reference may be made to U.S. Patent Application No. 15/416,921 (published as US 2017/0222107) for a photoluminescent structure having a light-transmissive layer laminated on the photoluminescent layer. .

As illustrated in FIGS. 1A-1D, the photoluminescent structure 20 has a top surface 21, a bottom surface 22 and a side surface 23, and a top surface 21 and a bottom surface 22 ) Are disposed opposite each other, and the top surface 21 and the bottom surface 22 may be rectangular. The two side edges or lines of the top surface 21 are substantially parallel to the first horizontal direction D1, and the other two side edges or lines are substantially parallel to the second horizontal direction D2. The bottom surface 22 of the photoluminescent structure 20 and the bottom surface 12 of the LED chip 10 together form the bottom surface of the LED 1A. The top surface 21 and the bottom surface 22 are horizontal surfaces and can also be substantially parallel to each other.

The side surface 23 is formed between the top surface 21 and the bottom surface 22 and connects the circumference and bottom surface 22 of the top surface 21. That is, the side surface 23 is formed along the circumferential edges of the top surface 21 and the bottom surface 22, so that the side surface 23 is annular (eg, along the top surface 21 and the bottom surface 22) (Rectangle ring). The side surface 23 further includes four vertical side surfaces 231a to 231d (the side surface 23 is divided into four vertical side surfaces 231a to 231d), and two vertical side surfaces (231a and 231c) are disposed opposite and perpendicular to the first horizontal direction D1, and the other two vertical side surfaces 231b and 231d are disposed opposite and perpendicular to the second horizontal direction D2.

In terms of relative position, the photoluminescent structure 20 is disposed on the LED chip 10 and substantially completely covers the top surface 11 and edge structure 13 of the LED chip 10 (eg For example, by covering at least 90%, at least 95%, at least 98%, or at least 99% of the total surface area), the top surface 21 of the photoluminescent structure 20 is the top surface of the LED chip 10 (11) is located above.

As shown in FIG. 1C, the reflective structure 30 blocks and reflects the light beam L, so that the emission angle of the light beam L may be limited. In this embodiment, the reflective structure 30 partially covers the side surface 23 and only one side of the side surface 23 of the photoluminescent structure 20 (also, the LED chip 10 ) Indirectly covers and shields one side of the edge surface 13). Specifically, among the four vertical side surfaces 231a to 231d of the side surface 23, one of the vertical side surfaces 231a to 231d that is perpendicular to the second horizontal direction D2, for example, a vertical side surface ( 231b) is directly shielded by the reflective structure 30 to form a side reflector. The vertical edge surface 131b of the LED chip 10 is directly or indirectly covered by the reflective structure 30 together with the vertical side surface 231b of the photoluminescent structure 20. That is, the other vertical side surfaces 231d and vertical side surfaces 231a and 231c of the photoluminescent structure 20 are disposed perpendicularly to the first horizontal direction D1, and the top surface 21 is a reflective structure It is not covered by 30. That is, the vertical side surfaces 231a, 231c, and 231d not covered by the reflective structure 30 form three side light emitting surfaces, and the upper surface 21 not shielded by the reflective structure 30 is the top A light emitting surface is formed. Accordingly, light emitted partially by the LED chip 10 and partially converted by the photoluminescent structure 20 and moving toward the vertical side surface 231b is reflected back by the reflective structure 30 ( Or absorbed) and mixed together to form the light beam L, which radiates out of the photoluminescent structure 20 from the light emitting surfaces, ie the vertical side surfaces 231a, 231c and 231d and the top surface 21. can do.

Preferably, the side light emitting surfaces and the bottom electrode surface are substantially perpendicular to each other. That is, the side emitting surfaces and the lower electrode surface are designed to be manufactured perpendicular to each other. Due to tolerances or variations in the manufacturing process or other factors, the side emitting surface may in turn be slightly inclined relative to the lower electrode surface. Under slightly tilted angles, the side emitting surface and the lower electrode surface are still considered to be substantially perpendicular to each other. Preferably, the top emission surface and the bottom electrode surface are substantially parallel to each other. That is, the top light emitting surface and the bottom electrode surface are designed to be manufactured parallel to each other. However, for the lower electrode, the top emitting surface may be slightly inclined due to manufacturing process tolerances and variations. Even under slight inclination, the top emitting surface and the bottom electrode surface are still considered to be substantially parallel to each other.

Preferably, when the reflective structure 30 covers the side surface 23, the reflective structure 30 is adjacent to the side surface 23, substantially between the reflective structure 30 and the side surface 23 There is no gap. Accordingly, the reflective structure 30 has an inner side surface 33 adjacent and in contact with the side surface 23 of the photoluminescent structure 20. The reflective structure 30 also has an outer side surface 34 opposite the inner side surface 33, which functions as a side reflective surface, and the outer side surface 34 can be a vertical surface. Further, the top surface 31 of the reflective structure 30 may be substantially the same height as the top surface 21 of the photoluminescent structure 20, and the bottom surface of the reflective structure 30 may be photoluminescent. It may be substantially flush with the bottom surface 22 of the structure 20.

Regarding the manufacturing material, the reflective structure 30 may be formed of a material comprising a light-transmissive resin material and optical scattering particles interspersed in the light-transmissive resin material. The light-transmissive resin material can be, for example, polyphthalamide (PPA), polycyclohexylene-dimethylene terephthalate (PCT), epoxy molding compound (EMC) or silicone; The optical scattering particles can be, for example, titanium dioxide particles, boron nitride particles, silicon dioxide particles, aluminum oxide particles or other ceramic particles.

Further, the LED 1A may also include a submount substrate 50 (see FIG. 1E ). The submount substrate 50 may be a ceramic substrate, a glass substrate, a silicon substrate, a printed circuit board (PCB), a metal-core PCB, or the like. The submount substrate 50 has wires (not shown) capable of conducting electrical energy. When the LED 1A is electrically connected to the submount substrate 50, power may be transmitted to the LED 1A through the submount substrate 50 to emit light. The LED 1A with the submount substrate 50 can facilitate the attachment process, such as the surface mounting process for module-level applications. Submount substrate 50 may also be included in other embodiments disclosed in the present disclosure.

The above is the technical content of each component of the LED 1A having at least the following technical features.

1C and 1D, after the primary light generated from the LED chip 10 enters the photoluminescent structure 20, the light beam L radiating toward the vertical side surface 231b is It is reflected back by the reflective structure 30 and mixed with other parts of the light. Eventually, the light beam L passes through the photoluminescent structures 20 and escapes from the side light emitting surfaces (vertical side surfaces 231a, 231c and 231d) or the top light emitting surface (top surface 21). , The light beam L moving along the first horizontal direction D1 is not significantly affected and limited by the reflective structure 30, and thus has a larger viewing angle, while vertical side surface 231b along the second horizontal direction D2 The light beam L moving toward) will be reflected back by the reflective structure 30. Since the light beam L is shielded by the reflective structure 30 along the second horizontal direction D2, the viewing angle is smaller than the former, It is redirected towards certain specific directions (to the vertical side surface 231d that is not shielded by the reflective structure 30.) Thus, the normal direction of the upper surface 11 of the LED chip 10 (for example, An asymmetric emission pattern is formed along the optical axis of the upper surface 11. Generally, the viewing angle of the light beam L emitted by the LED 1A along the first horizontal direction D1 is larger, and the second horizontal direction D2 The viewing angle along is smaller, and the radiation pattern is asymmetric.

Preferably, the length of the top surface 21 along the first vertical direction D1 may be greater than the width of the top surface 21 along the second horizontal direction D2, which is greater than the viewing angle along the second horizontal direction D2. It is advantageous to make the light beam L along the first horizontal direction D1 having a viewing angle.

In summary, the LED 1A can provide different viewing angles along different horizontal directions D1 and D2, and asymmetric emission with respect to the normal direction of the light emitting surface along a particular horizontal direction to provide non-symmetrical radiation patterns. A pattern can be formed.

Another embodiment of the optical structure 20 of the LED 1A is a substantially transparent light-transmissive structure 20 forming a monochromatic LED 1A. That is, the LED 1A will include an LED chip 10, a light emitting structure 20 (or light emitting layer) and a reflective structure 30. Thus, the wavelength of light emitted by the LED chip 10 is not converted when passing through the light-transmitting structure 20. The LED 1A with the light emitting structure 20 can be used to generate monochromatic light such as red light, green light, blue light, infrared light or ultraviolet light having an asymmetric emission pattern. The technical features of this embodiment of the monochromatic light CSP LED can also be applied to other embodiments disclosed below.

Further, the LED 1A may further include a micro-structured lens layer 40 (see FIG. 1E ). Preferably, the micro-structured lens layer 40 is manufactured of the optical structure 20 through molding or other manufacturing methods to integrally form the optical structure 20 and the micro-structured lens layer 40 together. Can be formed simultaneously. The micro-structured lens layer 40 may be composed of a plurality of microstructures arranged regularly or randomly, and the microstructures may be hemispherical, pyramidal, columnar, conical, or the like, or may be rough surfaces. Thus, the micro-structured lens layer 40 can prevent light transmitted out of the LED 1A from being reflected back to the optical structure 20 due to total internal reflection, thereby increasing light extraction efficiency and The luminous efficiency of 1A) can be improved. This technical feature of the optical structure 20 with a micro-structured lens layer can also be applied to other embodiments disclosed in the present disclosure.

The above is a description of technical features of the LED 1A. Next, technical features of LEDs according to other embodiments of the present disclosure will be described, and technical features of other embodiments of LEDs should be cross-referenced to each other, so that the same or similar technical features are omitted or simplified for simplicity. Will be.

2A and 2B show two perspective views of the LED 2A, and FIGS. 2C and 2D show two cross-sectional views of the LED 2A according to another embodiment of the present disclosure, for illustrative purposes, a photo Luminescent structure 20 is used as an exemplary embodiment of optical structure 20. In the LED 2A, at least the area of the bottom surface 22 of the photoluminescent structure 20 is larger than the area of the top surface 11 of the LED chip 10, so that the top surface 11 of the LED chip 10 is It is different from the LED 1A in that it is completely covered by the photoluminescent structure 20. In addition, the edge surface 13 of the LED chip 10 is covered and surrounded by a reflective structure 30. More specific details are as follows.

The area of the top surface 11 of the LED chip 10 is smaller than the area of the bottom surface 22 of the photoluminescent structure 20 and is completely covered by the photoluminescent structure 20. Further, the four vertical edge surfaces 131a to 131d of the edge surface 13 of the LED chip 10 are not covered by the photoluminescent structure 20 but are covered by the reflective structure 30. Primary light emitted from the LED chip 10 may be emitted alone or primarily from the top surface 11 to penetrate the photoluminescent structure 20. One of the vertical side surfaces 231b or 231d of the photoluminescent structure 20 is covered by the reflective structure 30 to form a side reflective surface, for example, vertical as illustrated in FIG. 2C in this embodiment. The side surface 231b is formed. The vertical side surfaces 231a and 231c and the top surface 21 are not covered by the reflective structure 30. That is, they are exposed outside the reflective structure 30, and the vertical side surfaces 231a, 231c and 231d not covered by the reflective structure 30 form three side light emitting surfaces, and the reflective structure 30 The top surface 21, which is not covered by, forms a top emitting surface.

Therefore, after the light beam L is emitted from the upper surface 11 of the LED chip 10 and enters the photoluminescent structure 20, the partial light beam L moving toward the vertical side surface 231b is a reflective structure. Reflected (or absorbed) by 30, will be mixed with other parts of light beam L, which are photoluminescent structures 20 from vertical side surfaces 231a, 231c and 231d and top surface 21 Will be released out. Therefore, the viewing angle of the light beam L is less affected by the reflective structure 30 along the first horizontal direction D1. Along the second horizontal direction D2, since the vertical side surface 231b is shielded by the reflective structure 30, the viewing angle is limited, and radiation radiates the vertical side surface 231d which is not covered by the reflective structure 30. Bias towards That is, with respect to the normal direction of the upper surface 11 of the LED chip 10 (eg, the optical axis of the upper surface 11) and along the second horizontal direction D2, the radiation pattern is asymmetric.

Thus, the LED 2A can also provide different viewing angles in different horizontal directions D1 and D2, thereby achieving the purpose of providing an asymmetric radiation pattern. The LED 2A also has an asymmetric emission pattern with respect to the optical axis of the upper surface 11 of the LED chip 10 along the second horizontal direction D2.

3A to 3D, two perspective views and two cross-sectional views of LED 3A are shown in accordance with another embodiment of the present disclosure, where for purposes of illustration, photoluminescent structure 20 Is used as an example to illustrate the optical structure 20. The LED 3A has at least four vertical edge surfaces 131a to 131d of the top surface 11 and the edge surface 13 of the LED chip 10 of the LED 3A to the photoluminescent structure 20. It is different from the light emitting device 2A in that it is covered by. The top surface 21 of the photoluminescent structure 20 is substantially completely covered by the reflective structure 30 (eg, at least 90%, at least 95%, at least 98% or at least 99% of the total surface area) Covering the above), forming an upper reflective surface, the side surface 23 of which is partially covered by the reflective structure 30.

More specifically, one of the vertical side surfaces 231b or 231d of the photoluminescent structure 20 (e.g., the vertical side surface 231d illustrated in FIG. 3C) and the top surface 21 are reflective structures Simultaneously covered by 30 to form a side reflective surface and an upper reflective surface, respectively. Since the vertical side surfaces 231a to 231c are not covered by the reflective structure 30 and are thus exposed outside the reflective structure 30, the LED 3A has three side emitting surfaces.

In this way, after the primary light is emitted from the LED chip 10 and enters the photoluminescent structure 20, some of the light moving toward the vertical side surface 231d or the top surface 21 is a reflective structure. It will be reflected (or absorbed) by 30, mixed with other parts of the light to form the light beam L, and the photoluminescent structure 20 from one of the vertical side surfaces 231a, 231b or 231c. Will exit. Therefore, the viewing angle is limited along the second horizontal direction D2 of the LED 3A. The light beam L emitted from the light emitting device 3A is mainly from the vertical side surface 231b, compared to the LEDs 1A and 2A, from which light is mainly emitted from the top surface and some from the vertical side surfaces. Is from the vertical side surfaces 231a and 231c, so that a large amount of light transmitted laterally can be emitted to form a side-view LED.

Since most of the light is transmitted from the vertical side surface 231b of the photoluminescent structure 20, the vertical side surface 231b is the primary light emitting surface of the LED 3A. The LED 3A is a side-view CSP LED because the primary light emitting surface and the lower electrode surface of the LED chip 10 are substantially perpendicular to each other. For ease of explanation, the longitudinal direction S1 and the width direction S2 are perpendicular to each other along the vertical side surface 231b (primary light emitting surface), and both the longitudinal direction S1 and the width direction S2 are in the second horizontal direction D2 It is substantially vertical. Through the arrangement of the reflective structure 30 according to this embodiment, the light beam L can be emitted alone or mainly from the vertical side surfaces 231a, 231b and 231c (three side light emitting surfaces). Therefore, the LED 3A may have a larger viewing angle along the longitudinal direction S1. On the other hand, due to the fact that the top surface 21 of the photoluminescent structure 20 is covered by the reflective structure 30, the LED 3A has a smaller viewing angle along the width direction S2. Thus, the LED 3A can provide different viewing angles along the longitudinal direction S1 and along the width direction S2. Further, the primary light emitting surface of the LED 3A is perpendicular to the surface of the lower electrode of the LED chip 10, which is different from the orientation of the primary light emitting surface of the LEDs 1A and 2A. Thus, in addition to providing asymmetric lighting applications, the LED 3A is a side-view LED.

3E and 3F are two schematic cross-sectional views of an LED 3B according to another embodiment of the present disclosure, and for purposes of illustration, the photoluminescent structure 20 is an exemplary embodiment of the optical structure 20 Is used. In the LED 3B, at least the photoluminescent structure 20 of the light emitting device 3B covers the edge surface 13 of the LED chip 10 (not the upper surface 11), and the reflective structure ( 30) differs from the LED 3A in that it covers both the top surface 11 of the LED chip 10 and the top surface 21 of the photoluminescent structure 20.

Specifically, the photoluminescent structure 20 of the LED 3B covers the edge surface 13 of the LED chip 10, preferably the top surface 21 of the photoluminescent structure 20 is The top surface 11 of the LED chip 10 is substantially the same height or coplanar. The reflective structure 30 is arranged to form an upper reflective surface to simultaneously cover the upper surface 11 and the upper surface 21. In addition, one of the vertical side surfaces 231b or 231d of the photoluminescent structure 20 (e.g., vertical side surface 231d as illustrated in FIG. 3E) is a reflective structure to form a side reflective surface. Covered by 30, the vertical side surfaces 231a, 231b and 231c are not covered by the reflective structure 30. Accordingly, these surfaces are exposed from the reflective structure 30 to form three side emitting surfaces.

Thus, the primary light alone or predominantly escapes from the edge surface 13 of the LED chip 10 and enters the photoluminescent structure 20, and a portion of the light traveling toward the vertical side surface 231d is reflected It will be reflected (or absorbed) by structure 30 and mixed with other parts of light beam L to exit photoluminescent structure 20 from any of vertical side surfaces 231a, 231b or 231c. Will go out. Compared to the LED 3A, during the transmission of light, a number of reflections occur between the top surface 11 of the LED chip 10 and the top surface 21 of the photoluminescent structure 20 to reduce the loss of light energy. Can cause. Thus, when the reflective structure 30 is formed by directly covering the top surface 11 of the LED chip 10, by avoiding the energy loss caused by the multiple reflections, the light extraction efficiency of the LED 3B is Further improvements can be made.

In order to prevent unnecessary light energy dissipation due to multiple reflections, the width of the LED chip 10 of the LEDs 3A and 3B along the second horizontal direction D2 is equal to the width of the LED chip 10 along the first horizontal direction D1. It should be noted that it is preferable to be smaller than the length of. In this embodiment, if this dimension is smaller along the second horizontal direction D2, light traveling along the vertical side surface 231d and reflected back by the reflective structure 30 may experience a shorter optical path. . The light beam L, along with other emitted light, is emitted from any of the vertical side surfaces 231a, 231b and 231c of the photoluminescent structure 20.

Next, as illustrated in FIGS. 4A-4D, two perspective views and two cross-sectional views of the LED 4A are shown according to another embodiment of the present disclosure, where for purposes of illustration, a photoluminescent structure 20 is used as an exemplary embodiment of the optical structure 20. The LED 4A has at least four vertical edge surfaces 131a to 131d of the top surface 11 and the edge surface 13 of the LED chip 10 of the LED 4A to the photoluminescent structure 20. Is different from the LED 3A in that all three vertical side surfaces of the top surface 21 and the side surface 23 of the photoluminescent structure 20 are covered by the reflective structure 30. Do.

Specifically, one of the vertical side surfaces 231b or 231d of the photoluminescent structure 20 (eg, vertical side surface 231d as illustrated in FIG. 4C), vertical side surfaces 231a and 231c) and the top surface 21 are simultaneously covered by the reflective structure 30 to form three side reflective surfaces and an upper reflective surface, respectively. The vertical side surface 231b is not covered by the reflective structure 30 and is thus exposed from the reflective structure 30 to form a side light emitting surface.

Specifically, after the primary light is emitted from the LED chip 10 and enters the photoluminescent structure 20, the light moving toward the vertical side surfaces 231a, 231c, 231d and the top surface 21 Some will be reflected (or absorbed) by the reflective structure 30, and light will be mixed with other emitted light and will be emitted out of the photoluminescent structure 20 from the vertical side surface 231b. Therefore, the orientation of the primary light emitting surface of the LED 4A is substantially perpendicular to the lower electrode surface of the LED chip 10, which is also different from the orientation of the primary light emitting surface of the LEDs 1A and 2A. Therefore, it can also be used as a side-view LED.

4E and 4F, two schematic cross-sectional views of LED 4B according to another embodiment of the present disclosure are shown, and for purposes of illustration, photoluminescent structure 20 is an optical structure 20 ) As an exemplary embodiment. In the LED 4B, at least the photoluminescent structure 20 of the LED 4B covers the edge surface 13 of the LED chip 10 (not the upper surface 11), and the reflective structure 30 ) The top surface 11 of the LED chip 10 and the top surface 21 of the photoluminescent structure 20 as well as the three vertical side surfaces 231a, 231c of the photoluminescent structure 20 and It differs from the LED 4A in that it simultaneously covers 231d).

Specifically, the photoluminescent structure 20 covers the edge surface 13 of the LED chip 10. Preferably, the top surface 21 of the photoluminescent structure 20 is substantially the same height or coplanar with the top surface 11 of the LED chip 10, and the top surface 21 and the top surface 11 ) Both are simultaneously covered by the reflective structure 30 to form an upper reflective surface. In addition, one of the vertical side surfaces 231b or 231d of the photoluminescent structure 20 (eg, vertical side surface 231d as illustrated in FIG. 4E), vertical side surfaces 231a and 231c ) And the top surface 21 are simultaneously covered by the reflective structure 30, and the vertical side surfaces 231a, 231c and 231d are covered by the reflective structure 30 to form three side reflective surfaces, The vertical side surface 231b is not covered by the reflective structure 30 and is therefore exposed outside the reflective structure 30, thereby forming a side emitting surface.

Thus, the primary light alone or mainly exits the edge surface 13 of the LED chip 10 and enters the photoluminescent structure 20, and three vertical side surfaces 231a, 231c, 231d or The portion of light traveling toward the top surface 21 will be reflected (or absorbed) by the reflective structure 30, and the photoluminescent structure 20 from the vertical side surface 231b along with the other parts of the light beam L Will escape. Similar to the advantages of the LED 3B, the reflective structure 30 directly covers the top surface 11 of the LED chip 10, thereby avoiding the energy loss caused by multiple reflections and thus the LED 4B. The light extraction efficiency of can be further improved.

To prevent unnecessary light energy reflection due to multiple reflections, the width of the LED chip 10 of the LEDs 4A and 4B along the second horizontal direction D2 is preferably greater than the length along the first horizontal direction D1. Being small, the light traveling toward the vertical side surfaces 231a, 231c, 231d or the top surface 21 and reflected by the reflective structure 30 is mixed with other light beams L and photoluminescent structure 20 It should be noted that it will experience a shorter optical path before it exits from the vertical side surface 231b.

In summary, the LEDs 1A, 2A, 3A, 3B, 4A and 4B can provide the following common advantages. Since they are all CSP LEDs, they all have a small form factor. Preferably, the length (or width) of the LEDs 1A, 2A, 3A, 3B, 4A or 4B is about 2.0 times, about 1.6 times or about 1.2 times or less the length (or width) of the LED chip 10. . Therefore, it is suitable to be assembled and embedded inside other electronic devices.

Further, since an asymmetric emission pattern can be generated without integrating the primary optical lens or the secondary optical lens, the cost of the entire optical system can be reduced, and space for the optical lens can be reduced.

In addition, the asymmetric optical radiation pattern of the LEDs according to embodiments of the present disclosure may allow the final product to have other design advantages. For example, it can replace the side-view PLCC-type LED as a light source of an edge-light type backlight module for LCD televisions and mobile devices, and the asymmetric emission pattern provides a larger viewing angle along the length direction of the backlight module. By providing, it can reduce dark areas or spots or increase the distance between two adjacent LEDs to reduce the number of LEDs used in the light bar. At the same time, along the thickness direction of the backlight module, the asymmetrically shaped LED provides a smaller viewing angle, so that the light emitted by the LED can be effectively delivered to the light guide plate of the backlight module to reduce the loss of light energy.

Further, the primary light emitting surface and the lower electrode surface of the LEDs in accordance with some embodiments of the present disclosure may be substantially perpendicular to each other to form a side-view CSP LED. When applied to an edge-light backlight module, the LED allows the application mounting board of the backlight module to omit the vertical surface (see the technical content of the backlight module 600 of FIG. 6 to be described below), so that the normal direction of the light emitting surface It is possible to minimize the overall thickness of the backlight module and reduce the difficulty in design and manufacturing. In this way, a display using such a backlight module can achieve a narrower bezel frame.

In addition, the light emitted by the LEDs 1A, 2A, 3A, 3B, 4A and 4B is also more asymmetrical through the incorporation of additional secondary optical lenses for some applications that specify a more asymmetrically shaped radiation pattern. It can be specified as an enemy shape.

In addition, the technical features disclosed in the LED 1A, for example, a substantially transparent light-transmissive structure 20 as an embodiment of the optical structure 20, also include LEDs 2A, 3A, 3B, 4A and 4B. It will be appreciated that it can be applied to form monochromatic light CSP LEDs having asymmetric emission patterns. Other technical features disclosed in accordance with LED 1A, such as including a micro-structured lens layer or submount substrate, can also be applied to LEDs 2A, 3A, 3B, 4A and 4B.

Next, a backlight module comprising any one of the LEDs described above will be described. 5 and 6 respectively illustrate a backlight module having a configuration of various aspects, and the former includes a plurality of LEDs 1A or a plurality of LEDs 2A capable of emitting light from the top surface 21. The latter includes a plurality of LEDs 3A, 3B, 4A or 4B that emit light from the side emitting surface. The backlight modules may include an application mounting board, any one of the LEDs described above (which may include a photoluminescent structure if white light is specified, or a light-transmissive structure when monochromatic light is specified), It further includes a reflective layer and a light guide plate. The technical features of the components will be described sequentially as follows.

The backlight module 500 illustrated in FIG. 5 includes an application mounting board 510, an LED capable of emitting light from the top surface 21 (eg, LED 1A), a reflective layer 520, and a light guide plate 530. The application mounting board 510 includes a horizontal portion 511 having a horizontal surface, a vertical portion 512 having a vertical surface, and a reflective layer 513. The horizontal portion 511 and the vertical portion 512 are substantially perpendicular to each other, and the reflective layer 513 covers at least the horizontal surface of the horizontal portion 511 or the vertical surface of the vertical portion 512 or both. For example, as illustrated in FIG. 5, the horizontal surface of horizontal portion 511 and the vertical surface of vertical portion 512 are covered by reflective layer 513. The reflective layer 513 may be, for example, a metal thin film, a metal plate, or a highly reflective white paint. Further, the application mounting board 510 may also be a flexible application mounting board.

As illustrated in FIG. 5, LED 1A is disposed on a vertical surface of vertical portion 512 of application mounting board 510. The set of electrodes 14 of the LED chip 10 is electrically connected to the application mounting board 510. In the LED 1A, along the second horizontal direction D2, a vertical side surface 231d not covered by the reflective structure 30 faces the horizontal surface of the horizontal portion 511 of the application mounting board 510, and reflects The vertical side surface 231b covered by the structure 30 is disposed with this structure facing away from the horizontal portion 511.

The reflective layer 520 is disposed over the horizontal portion 511 of the application mounting board 510 (and may be disposed over the reflective layer 513), extending away from the vertical portion 512 and away from the LED 1A. do. The reflective layer 520 may be, for example, a metal thin film, a metal plate, or other structures. The light guide plate 530 is disposed on the reflective layer 520 and includes incident light side surfaces 531 and exit light surfaces 532 that are substantially perpendicular to each other. The exit light surface 532 is connected to the incident light side surface 531, and the exit light surface 532 is parallel to the reflective layer 520 but is configured to be away from it (to face away from the reflection layer 520 ).

Thus, the top surface 21 of the LED 1A faces the incident light side surface 531 of the light guide plate 530. Preferably, the length of the LED 1A along the second horizontal direction D2 is not greater than the thickness of the light guide plate 530 measured along the normal direction of the exit light surface 532. That is, the dimension of the light emitting surface of the LED 1A is preferably smaller than that of the incident light side surface 531. Accordingly, light emitted from the top surface 21 of the LED 1A can be effectively transmitted to the incident light side surface 531 of the light guide plate 530. Since the vertical side surface 231d of the LED 1A is not covered by the reflective structure 30, light escaping from the vertical side surface 231d is usually emitted toward the reflective layer 513. Since the reflective layer 513 is easily manufactured using a high-reflectivity material, the reflectivity of the reflective layer 513 can be made greater than that of the reflective structure 30. Thus, after being reflected by the reflective layer 513, the light emitted towards the reflective layer 513 (eg, light beam L1 as illustrated in FIG. 5) is more effectively directed to the incident light side surface 531 Can be. In this way, the loss of light energy can be reduced, so that the backlight module 500 can have a higher efficiency of utilizing light energy. The reflective layer 520 disposed under the light guide plate 530 reflects light, so that most of the light is transmitted out from the exit light surface 532.

As illustrated in FIG. 6, the backlight module 600 includes an application mounting board 610, a plurality of side-emitting LEDs (eg, LED 3A), a reflective layer 620 and a light guide plate 630. Includes. The application mounting board 610 includes a horizontal portion 611 including a horizontal surface and a reflective layer 613 disposed on and covers the horizontal surface of the horizontal portion 611.

The LED 3A is disposed on the horizontal portion 611 of the application mounting board 610, and the set of electrodes 14 of the LED chip 10 is electrically connected to the application mounting board 610. The reflective layer 620 is also disposed over the horizontal portion 611 of the application mounting board 610 and extends away from the LED 3A. The light guide plate 630 is disposed on the reflective layer 620 and includes incident light side surfaces 631 and emitted light surfaces 632 that are substantially perpendicular to each other. The exit light surface 632 is connected to the incident light side surface 631, and the exit light surface 632 is configured to be parallel to, but away from, the reflective layer 620.

As illustrated in FIG. 6, the vertical side surface 231b of the LED 3A substantially perpendicular to the second horizontal direction D2 is not covered by the reflective structure 30 and is incident light side surface 631 of the light guide plate 630. ). Meanwhile, the vertical side surface 231d is covered by the reflective structure 30 and is directed away from the incident light side surface 631. Further, the length of the LED 3A along the normal direction of the upper surface 11 of the LED chip 10 is preferably not greater than the thickness of the light guide plate 630 along the normal direction of the exit light surface 632.

In this way, under the guidance of the reflective structure 30 and the reflective layer 613, the LED 3A can emit light from three vertical side surfaces 231a, 231b and 231c, and the light guide plate 630 It can be effectively transmitted to the incident light side surface 631. The reflective layer 620 under the light guide plate 630 reflects light, so that most of the light is transmitted from the exit light surface 632 out of the light guide plate 630. Compared to the backlight module 500, the application mounting board 610 of the backlight module 600 includes a horizontal portion 611 and no other vertical portion. Thus, along the direction of the light emitting module (comprising the application mounting board 610 and the LEDs 3A) of the light emitting surface (direction D2 shown in FIG. 6), without accommodating the application mounting board 610 Space for accommodating the LED 3A is included. Thus, the light rod module can have smaller dimensions along the D2 direction, which is advantageous for the design and manufacture of LCD panels with narrower bezel frames.

7A and 7B, a side view and a top view of a backlight module 600 including a plurality of LEDs 3A and 4A are shown, respectively. Since the LED 3A can emit light from three vertical side surfaces 231a, 231b and 231c, the viewing angle along the first horizontal direction D1 illustrated in FIG. 7A is the first horizontal direction illustrated in FIG. 7B. Larger than the viewing angle of the LED 4A along D1, it will effectively reduce the dark area of the light guide plate 630 that may result in the area between adjacent LEDs 3A. In addition, the distance between adjacent LEDs 3A can also be increased to reduce the number of LEDs 3A used in the backlight module 600, thereby reducing the overall module cost. Conversely, the LED 4A may have a technical feature in which the emitted light is more concentrated toward the forward direction perpendicular to the first horizontal direction D1.

Next, a method for manufacturing an LED according to an embodiment of the present disclosure will be described. The method comprises at least two process steps, i.e., a photoluminescent structure 20 (which is also described in detail below) to cover the top surface 11 and/or edge surface 13 of the LED chip 10. Providing a light-transmissive structure that will not be described); And second, forming a reflective structure 30 to partially cover the side surface 23 of the photoluminescent structure 20 (or light-transmissive structure). Hereinafter, the LEDs 1A to 4B will be sequentially described as an example for further describing the technical details of the manufacturing method, which may be referred to as technical features of the embodiments of the LEDs 1A to 4B. .

Schematic diagrams of process steps of a method for manufacturing an LED 1A according to an embodiment of the present disclosure are illustrated in FIGS. 8A-12B.

8A, the plurality of LED chips 10 are first arranged at a specific pitch on a release material 80 to form an array of LED chips 10. Preferably, the LED chip 10 is pressed against the shedding material 80, so that the set of electrodes 14 is not exposed and is embedded in the shedding material 80. In addition, the diverging material 80 may be a diverging film, an ultraviolet (UV) emitting tape, a heat emitting tape, or the like. 8B, the photoluminescent structure 20 is disposed on the LED chips 10, and substantially completes the top surface 11 and edge surface 13 of each LED chip 10. Cover.

Then, as illustrated in FIGS. 9A to 9C, a portion of the photoluminescent structure 20 is cut and removed along the first horizontal direction D1 to form the first trench 90, and the first trench ( 90) is cut along one vertical edge surface of the edge surface 13 of the LED chip 10 (eg, vertical edge surface 131b). After the first trench 90 is formed, the vertical side surface 231b will be exposed and subsequently covered by the reflective structure 30.

After the cutting is completed, as shown in FIGS. 10A and 10B, a reflective structure 30 is formed inside to fill the gap of the first trench 90 by molding or distribution, and the reflective structure 30 is a photo The vertical side surface 231b of the luminescent structure 20 is substantially completely covered, and the top surface 31 of the reflective structure 30 is substantially the same as the top surface 21 of the photoluminescent structure 20. Being the same height, the top surface 21 of the photoluminescent structure 20 is exposed from the reflective structure 30.

When a molding method is used to form the reflective structure 30, the photoluminescent structure 20, the LED chip 10 and the diverging material 80 are placed in a mold (not shown), and then, the reflective structure The manufacturing material of 30 is injected into the mold, so that the vertical side surface 231b of the photoluminescent structure 20 is covered. When the manufacturing material is cured and solidified, a reflective structure 30 can be formed. If the dispensing method is used to form the reflective structure 30, the aforementioned mold can be omitted. Instead, the manufacturing material of the reflective structure 30 is distributed directly on the diverging material 80, and then, the manufacturing material is gradually increased on the diverging material 80, so that the photoluminescent structure 20 is vertically The side surface 231b is covered. In this case, the top surface 31 of the reflective structure 30 is also designed to be slightly lower than the top surface 21 of the photoluminescent structure 20, so that the manufacturing material of the reflective structure 30 is photoluminescent. It is possible to prevent diffusion to the top surface 21 of the structure 20.

After the reflective structure 30 is formed, as shown in FIGS. 11A and 11B, the divergent material 80 is removed to obtain an array of connected LEDs 1A. The reflective structures 30 of the LEDs 1A can be connected to cut the photoluminescent structures 20 and the reflective structure 30 connected along the second horizontal direction D2 (FIGS. 12A and 12B) A singulation process step (as shown in) can be taken to form vertical side surfaces 231a and 231c that are not covered by the reflective structure 30. Similarly, another singulation procedure is performed to cut the photoluminescent structures 20 and reflective structures 30 connected along the first horizontal direction D1, such that vertical side surfaces 231d and vertical side surfaces 231b are formed, which are shielded by the reflective structure 30. In this way, a plurality of LEDs 1A separated from each other can be obtained, and one vertical side surface 231b is shielded by the reflective structure 30.

The above is the description of the method for manufacturing the LED 1A. Next, a method of manufacturing the LED 2A will be described. Since the method of manufacturing the LED 2A is partially the same or similar to the method of manufacturing the LED 1A, detailed descriptions of similar process steps will be appropriately omitted.

13A-17B are schematic diagrams of process steps of a manufacturing method for manufacturing the LED 2A.

As shown in FIG. 13A, a divergent material 80 is first provided, and a photoluminescent structure 20 is formed on the divergent material 80 through a manufacturing process such as spray coating, printing or molding. Alternatively, the photoluminescent structure 20 is first completed, and then, the photoluminescent structure 20 is attached and disposed on the diverging material 80, and the photoluminescent structure 20 is The top surface 21 faces the diverging material 80.

Next, as shown in FIG. 13B, a plurality of LED chips 10 are disposed upside down on the photoluminescent structure 20, so that the upper surface 11 of the LED chip 10 faces down, and the photo It is disposed on the luminescent structure 20. At this time, the set of electrodes 14 of each chip 10 faces upward, and is exposed from the diverging material 80.

Then, as shown in FIGS. 14A to 14C, the photoluminescent structure 20 is cut along the first horizontal direction D1 to remove a portion of the photoluminescent structure 20 to remove the first trench 90 '), which will be formed close to one particular edge portion of the LED chip 10 (eg, vertical edge surface 131b). After the removal process of the first trench is completed, as shown in FIG. 14B, the photoluminescent structures 20 along the first horizontal direction D1 are still connected. Along the second horizontal direction D2, as shown in FIG. 14C, the photoluminescent structures 20 are separated by the first trenches 90' to expose the vertical side surface 231b, which is reflective It will be covered by structure 30.

Next, as shown in FIGS. 15A and 15B, the reflective structure 30 is provided with the first trenches 90 ′ and each LED chip 10 to fill the gap of the first trenches 90 ′. It is formed between the edge surfaces 13 and subsequently substantially completely covers the edge surfaces 13 of the LED chip 10 and the vertical side surfaces 231b of the photoluminescent structure 20.

After the reflective structure 30 is formed, the diverging material 80 (as shown in FIGS. 16A and 16B) is removed to obtain a plurality of LEDs 2A. The photoluminescent structures 20 and reflective structures 30 of the LEDs 2A can be connected, so that the singulation process (as shown in FIGS. 17A and 17B) is separated from each other by the LEDs 2A ) Can be performed to disconnect the connected photoluminescent structures 20 and reflective structures 30 so as to be obtained. Specifically, as shown in FIG. 17A, the connected photoluminescent structure 20 and the reflective structure 30 are cut along the second horizontal direction D2, and vertical side surfaces exposed from the reflective structure 30 ( 231a and 231c). Similarly, as shown in FIG. 17B, the connected photoluminescent structures 20 and reflective structures 30 are cut along the first horizontal direction D1, so that the vertical side surface 231b has a reflective structure 30 ), while vertical side surface 231d is exposed from reflective structure 30.

The above is the description of the manufacturing method for manufacturing the LED 2A. Next, a method of manufacturing the LEDs 3A and 3B will be described. Detailed descriptions of the same or similar manufacturing steps to those of the manufacturing methods for manufacturing the LEDs 1A and 2A will be appropriately omitted.

18A, the plurality of LED chips 10 are first arranged at a specific pitch on the diverging material 80. Preferably, as illustrated in FIG. 19A, the width of the LED chips 10 along the second horizontal direction D2 is less than the length of the LED chips 10 along the first horizontal direction D1. Next, as shown in FIG. 18B, photoluminescent structures 20 are formed on the LED chips 10, and the top surface 11 and edge surface 13 of each LED chip 10 are formed. Covers substantially completely. However, in this particular embodiment, the thickness of the photoluminescent structure 20 covered on the top surface 11 of the LED chips 10 may be less than the thickness corresponding to the LED 3A.

Next, referring to FIGS. 19A-19C, the photoluminescent structure 20 is cut along the first horizontal direction D1 to form the first trench 90. When cut, the first trench 90 is uniformly formed toward one particular edge surface of the chip 10 (eg, vertical edge surface 131d as illustrated in FIGS. 19A and 19C), The vertical side surface 231d of the photoluminescent structure 20 will be exposed, which will be covered by the reflective structure 30 in the next manufacturing step.

After the trench removal is completed, a reflective structure 30 is formed to fill the gap in the first trench 90, as shown in FIGS. 20A and 20B. Contrary to manufacturing the LED 1A, the reflective structure 30 substantially completely covers the vertical side surface 231d as well as the top surface 21 of the photoluminescent structure 20.

After the reflective structure 30 is formed, as shown in FIGS. 21A and 21B, the divergent material 80 may be removed to obtain a plurality of LEDs 3A. Then, as shown in FIGS. 22A and 22B, a singulation process is performed to separate the connected photoluminescent structure 20 and reflective structures 30 along the second horizontal direction D2, to reflect Vertical side surfaces 231a and 231c that are not covered by structure 30 may be exposed. Then, another dicing process is performed to separate the photoluminescent structures 20 and reflective structures 30 connected along the first horizontal direction D1 to form a vertical side surface 231b. You can. The vertical side surface 231d is still shielded by the reflective structure 30. In this way, a plurality of mutually separated LEDs 3A can be obtained.

The manufacturing method can be performed to manufacture the LED 3B after a slight modification. That is, referring to FIG. 18B, in the manufacturing step for forming the photoluminescent structure 20, the photoluminescent structure 20 is selectively formed between the edge surfaces 13 of the LED chips 10. However, it does not cover the top surface 11 of the LED chip 10. Alternatively, the photoluminescent structure 20 can be formed to cover the top surface 11 of the LED chip 10, and then the portion covering the top surface 11 can be removed.

The above is a description of a method for manufacturing the LEDs 3A and 3B. Next, a method of manufacturing the LEDs 4A and 4B will be described. Detailed descriptions of manufacturing processes identical or similar to those of the LEDs 3A and 3B will be omitted as appropriate.

18A, first, a plurality of LED chips 10 are arranged at a specific pitch on the diverging material 80, and then, as shown in FIG. 18B, photoluminescent structures 20 It is disposed on the LED chips (10). Thereafter, as shown in FIGS. 19A to 19C, the photoluminescent structure 20 is cut along the first horizontal direction D1 to form the first trench 90 and covered by the reflective structure 30 The vertical side surface 231d to be exposed is exposed.

23A to 23C, this manufacturing process is different from the method of manufacturing the LED 3A. After the first trench 90 is formed, other cutting process steps will be performed. That is, the photoluminescent structure 20 is cut along the second horizontal direction D2 to form the second trench 91, and the two vertical side faces arranged substantially opposite to each other in the first vertical direction D1 The surfaces 231a and 231c are exposed.

After the two trench removal processes are completed, reflective structures 30 (not shown) are formed inside the first and second trenches 90 and 91 to form vertical side surfaces of the photoluminescent structure 20 ( 231a, 231c and 231d), and fill the gaps of the first and second trenches 90 and 91. In addition, the reflective structure 30 substantially completely covers the top surface 21 of the photoluminescent structure 20. After the reflective structure 30 is formed, the diverging material 80 is removed so that a plurality of LEDs 4A or 4B can be obtained. Then, a singulation process is performed, so that a plurality of LEDs 4A or 4B separated from each other can be obtained.

In summary, a method for manufacturing an LED according to embodiments of the present disclosure can generate various LEDs that can effectively control a radiation pattern and a viewing angle along at least one specific horizontal direction, or a side-view light emitting structure It is possible to form a CSP LED having. These LEDs can be manufactured in a batch manner.

Although this disclosure has been described with reference to specific embodiments of the disclosure, those skilled in the art will appreciate that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the disclosure as defined by the appended claims. You have to understand. In addition, many modifications can be made to adapt a particular situation, material, composition of materials, method or process to the purpose, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the appended claims. In particular, although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it will be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. . Thus, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims (30)

As a light emitting device,
A light emitting chip comprising a top surface, a bottom surface opposite the top surface, an edge surface and a set of electrodes, wherein the edge surface extends between the top surface and the bottom surface, and the set of electrodes is on the bottom surface. Disposed on, the set of electrodes and the lower surface form a lower electrode surface;
An optical structure comprising a top surface, a bottom surface and a side surface opposite the top surface, wherein the side surface extends between the top surface and the bottom surface, and the optical structure is an upper surface of the light emitting chip, the light emitting chip Covering the edge surface of or both; And
A reflective structure partially covering a side surface of the optical structure,
The first horizontal direction and the second horizontal direction perpendicular to each other are respectively specified along the length direction and the width direction on the upper surface of the light emitting chip,
The side surface of the optical structure comprises four vertical side surfaces;
Two of the four vertical side surfaces are disposed to face substantially perpendicular to the first horizontal direction,
The other two of the four vertical side surfaces are disposed substantially perpendicular to the second horizontal direction;
One of the vertical side surfaces substantially perpendicular to the second horizontal direction is covered by the reflective structure to form a side reflective surface;
The other of the vertical side surfaces substantially perpendicular to the second horizontal direction is not covered by the reflective structure to form a side light emitting surface;
The side light emitting surface of the light emitting device and the bottom electrode surface of the light emitting chip are substantially perpendicular to each other,
Light emitting device.
According to claim 1,
The optical structure
Which is a photoluminescent structure or a light-transmissive structure,
Light emitting device.
According to claim 2,
Both the top surface and the edge surface of the light emitting chip are covered by the optical structure;
The top surface of the optical structure, and the two vertical side surfaces of the optical structure, which are disposed opposite to each other and substantially perpendicular to the first horizontal direction, are not covered by the reflective structure so that the top light emitting surface and the two sides Forming light emitting surfaces;
The top light emitting surface of the light emitting device and the bottom electrode surface of the light emitting chip are substantially parallel to each other;
The two side light emitting surfaces of the light emitting device and the bottom electrode surface of the light emitting chip are substantially perpendicular to each other,
Light emitting device.
According to claim 2,
The area of the bottom surface of the optical structure is larger than that of the top surface of the light emitting chip;
The upper surface of the light emitting chip is covered by the optical structure;
The edge surface of the light emitting chip is covered by the reflective structure;
The top surface of the optical structure, and the two vertical side surfaces of the optical structure, which are disposed opposite each other and substantially perpendicular to the first horizontal direction, are not covered by the reflective structure so that the top light emitting surface and the two sides Forming light emitting surfaces;
The top light emitting surface of the light emitting device and the bottom electrode surface of the light emitting chip are substantially parallel to each other;
The two side light emitting surfaces of the light emitting device and the bottom electrode surface of the light emitting chip are substantially perpendicular to each other,
Light emitting device.
According to claim 2,
Both the top surface and the edge surface of the light emitting chip are covered by the optical structure;
The top surface of the optical structure is covered by the reflective structure to form an upper reflective surface;
The two vertical side surfaces of the optical structure facing each other and substantially perpendicular to the first horizontal direction are not covered by the reflective structure to form two side light emitting surfaces;
The two side light emitting surfaces of the light emitting device and the bottom electrode surface of the light emitting chip are substantially perpendicular to each other,
Light emitting device.
According to claim 2,
The edge surface of the light emitting chip is covered by the optical structure;
Both the upper surface of the light emitting chip and the upper surface of the optical structure are covered by the reflective structure to form an upper reflective surface;
The two vertical side surfaces of the optical structure facing each other and substantially perpendicular to the first horizontal direction are not covered by the reflective structure to form two side light emitting surfaces;
The two side light emitting surfaces of the light emitting device and the bottom electrode surface of the light emitting chip are substantially perpendicular to each other,
Light emitting device.
According to claim 2,
Both the top surface and the edge surface of the light emitting chip are covered by the optical structure;
The top surface of the optical structure is covered by the reflective structure to form an upper reflective surface;
The two vertical side surfaces of the optical structure disposed opposite each other and substantially perpendicular to the first horizontal direction are covered by the reflective structure to form two side reflective surfaces,
Light emitting device.
According to claim 2,
The edge surface of the light emitting chip is covered by the optical structure;
Both the upper surface of the light emitting chip and the upper surface of the optical structure are covered by the reflective structure to form an upper reflective surface;
Both of the two vertical side surfaces of the optical structure disposed opposite each other and substantially perpendicular to the first horizontal direction are covered by the reflective structure to form two side reflective surfaces,
Light emitting device.
The method according to any one of claims 3 to 8,
The optical structure further comprises a micro-structured lens layer,
Light emitting device.
The method according to any one of claims 3 to 8,
Further comprising a submount substrate, the light emitting device is electrically connected to the submount substrate,
Light emitting device.
The method according to any one of claims 3 to 8,
The optical structure further comprises at least one light-transmissive layer,
Light emitting device.
The method according to any one of claims 3 to 8,
The reflective structure includes a light-transmissive resin material and optical scattering particles interspersed with the light-transmissive resin material,
Light emitting device.
The method of claim 12,
The light-transmissive resin material comprises polyphthalamide, polycyclohexylene-dimethylene terephthalate, epoxy molding compound or silicone;
The optical scattering particles include titanium dioxide, boron nitride, silicon dioxide, or aluminum oxide,
Light emitting device.
As a backlight module,
An application mounting board comprising a horizontal surface;
The light emitting device of claim 1 disposed on the application mounting board;
A reflective layer disposed over a horizontal surface of the application mounting board; And
A light guide plate disposed over the reflective layer, the light guide plate comprising an incident light side surface and an exit light surface connected to the incident light side surface and facing away from the reflective layer,
Backlight module.
The method of claim 14,
The application mounting board further comprises a vertical surface;
The light emitting device is disposed on a vertical surface of the application mounting board;
The side emitting surface of the light emitting device faces the horizontal surface of the application mounting board;
The top light emitting surface of the light emitting device faces the incident light side surface of the light guide plate,
Backlight module.
The method of claim 15,
The length of the top emitting surface of the light emitting device is specified along the second horizontal direction;
The thickness of the light guide plate is specified along the normal direction of the exit light surface;
The length of the top light emitting surface is not greater than the thickness of the light guide plate,
Backlight module.
The method of claim 15,
The application mounting board further comprises a reflective layer covering the vertical surface, the horizontal surface, or both,
Backlight module.
The method of claim 15,
The application mounting board is a flexible application mounting board,
Backlight module.
The method of claim 14,
The light emitting device is disposed on a horizontal surface of the application mounting board;
The side light emitting surface of the light emitting device faces the incident light side surface of the light guide plate,
Backlight module.
The method of claim 19,
The length of the side light emitting surface of the light emitting device is specified along the normal direction of the top surface of the light emitting chip;
The thickness of the light guide plate is specified along the normal direction of the exit light surface;
The length of the side light emitting surface is not greater than the thickness of the light guide plate,
Backlight module.
The method of claim 19,
The application mounting board further comprises a reflective layer covering the horizontal surface,
Backlight module.
A method for manufacturing a light emitting device,
Disposing an optical structure covering the top surface of the light emitting chip, the edge surface of the light emitting chip, or both; And
Forming a reflective structure partially covering a side surface of the optical structure,
The first horizontal direction and the second horizontal direction are respectively specified along the length direction and the width direction on the upper surface of the light emitting chip;
The side surface of the optical structure comprises four vertical side surfaces;
Two of the four vertical side surfaces are disposed to face substantially perpendicular to the first horizontal direction,
The other two of the four vertical side surfaces are disposed substantially perpendicular to the second horizontal direction;
One of the vertical side surfaces substantially perpendicular to the second horizontal direction is covered by the reflective structure to form a side reflective surface;
The other of the vertical side surfaces substantially perpendicular to the second horizontal direction is not covered by the reflective structure to form a side light emitting surface,
Method for manufacturing a light emitting device.
The method of claim 22,
When placing the optical structure, the method,
Forming the optical structure on an upper surface and an edge surface of the light emitting chip; And
Further comprising cutting the optical structure along the first horizontal direction to form a first trench and exposing a side surface of the optical structure to be covered by the reflective structure,
When forming the reflective structure, the reflective structure is formed to fill the first trench,
Method for manufacturing a light emitting device.
The method of claim 23,
When forming the reflective structure, the reflective structure further covers the top surface of the optical structure,
Method for manufacturing a light emitting device.
The method of claim 24,
The above method,
Cutting the optical structure along the second horizontal direction to form a second trench, and exposing the two vertical side surfaces substantially perpendicular to the first horizontal direction,
When forming the reflective structure, the reflective structure is formed to fill the second trench,
Method for manufacturing a light emitting device.
The method of claim 22,
When placing the optical structure, the method,
Arranging the light emitting chip on the optical structure such that the upper surface faces down; And
Cutting the optical structure along the first horizontal direction to form a first trench, and exposing the side surface to be covered by the reflective structure,
When forming the reflective structure, the reflective structure is formed to fill the first trench, and also to cover the edge surface of the light emitting chip,
Method for manufacturing a light emitting device.
The method of claim 22,
When placing the optical structure, the method,
Forming the optical structure to cover an edge surface of the light emitting chip; And
Cutting the optical structure along the first horizontal direction to form a first trench, and exposing the side surface to be covered by the reflective structure,
When forming the reflective structure, the reflective structure is formed to fill the first trench, and also to cover the top surface of the optical structure and the top surface of the light emitting chip,
Method for manufacturing a light emitting device.
The method of claim 27,
The step of forming the reflective structure,
Cutting the optical structure along the second horizontal direction to form a second trench, and exposing the two vertical side surfaces substantially perpendicular to the first horizontal direction,
The reflective structure is formed to fill the second trench,
Method for manufacturing a light emitting device.
The method of claim 22,
Cutting the optical structure along the first horizontal direction, and subsequently cutting the optical structure along the second horizontal direction,
Method for manufacturing a light emitting device.
The method of claim 22,
The method further includes cutting the optical structure and cutting the reflective structure, wherein cutting the reflective structure is simultaneous with cutting the optical structure.
Method for manufacturing a light emitting device.

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