CN115077588A

CN115077588A - Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method

Info

Publication number: CN115077588A
Application number: CN202210870655.9A
Authority: CN
Inventors: 向美华; 薛永祥; 孟庆伟; 李宁
Original assignee: Panwoo Integrated Optoelectronic Inc
Current assignee: Panwoo Integrated Optoelectronic Inc
Priority date: 2022-07-23
Filing date: 2022-07-23
Publication date: 2022-09-20
Anticipated expiration: 2042-07-23
Also published as: CN115077588B

Abstract

The application relates to the field of optical fiber sensing, in particular to a sealing plug, a tube shell, an integrated photoelectric device and an assembly method for optical fiber sensing. The optical fiber connector has the advantages that the effect that the metal solder uniformly acts on the optical fiber after welding to reduce the optical polarization crosstalk problem is achieved, and meanwhile, the air tightness of an integrated photoelectric device can be improved.

Description

Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembly method

Technical Field

The invention relates to the field of optical fiber sensing, in particular to a sealing plug for optical fiber sensing, a tube shell, an integrated photoelectric device and an assembly method.

Background

The optical fiber sensing technology has been widely used in various industries due to the advantages of good insulation, good assembly, no movable parts, high reliability and the like. With the popularization of polarization maintaining technology, the signal-to-noise ratio and the sensitivity of a sensing system are improved, and in the application fields of fiber optic gyroscopes and fiber optic current transformers, a multifunctional integrated photoelectric device output by polarization maintaining fibers is the most core optical device.

Because most of the fiber optic gyroscopes and fiber optic current transformers are applied in harsh environments, the service lives of the optoelectronic devices forming the system are obviously influenced by high temperature, high humidity and air pressure change. In order to ensure that the system is not influenced by the outside, the system integration manufacturing unit adopts an integral airtight mode to improve the reliability of products.

In the related technology, a tube shell is needed for the multifunctional integrated photoelectric device, optical fibers are directly coupled end to end in the tube shell, ports are formed by slotting the two ends of the tube shell, the optical fibers are placed in the tube shell, extend out of the ports, and then the tube shell and the optical fibers are sealed.

In view of the above-mentioned related art, the inventors believe that there is a drawback that it is difficult for the metal solder to uniformly act on the optical fiber after soldering, which causes a birefringence effect in the optical fiber and a large optical polarization crosstalk problem.

Disclosure of Invention

In order to facilitate the effect that the metal solder uniformly acts on the optical fiber after welding so as to reduce the optical polarization crosstalk problem, the application provides a sealing plug for optical fiber sensing, a tube shell, an integrated photoelectric device and an assembly method.

In a first aspect, the application provides a sealing plug for optical fiber sensing, which adopts the following technical scheme:

the utility model provides a sealing plug for optical fiber sensing, includes the sealing plug body, the sealing plug body includes the sealing, seted up one or more through-hole on the sealing, the through-hole runs through the sealing in order to supply the optic fibre to pass, the one end of sealing is provided with the edge that sinks around the sealing outer wall.

By adopting the technical scheme, the sealing plug is provided with the through hole for the optical fiber to pass through so as to limit the position of the optical fiber, the sealing structure is provided between the optical fiber and the port by the arrangement of the sealing plug, the arrangement of the sinking edge is used for filling or coating the welding flux during welding, and the space for containing the welding flux is provided by the arrangement of the through hole on the sealing plug so that the metal welding flux can uniformly act on the optical fiber, the phenomenon that the optical fiber generates the birefringence effect is reduced, and the problem of generating larger optical polarization crosstalk is further reduced.

Preferably, the sealing plug body further comprises a boss fixed with the sealing part, the boss is arranged on the sealing part and far away from one end of the sinking edge, the through hole penetrates through the sealing part and the boss, and openings are formed in the sealing part and the boss.

Through adopting above-mentioned technical scheme, the setting of boss has increased welding operation's space, and the nozzle of the welding equipment of being convenient for moves to the welding department.

Preferably, the opening is provided with a chamfer to fill or spread the solder.

By adopting the technical scheme, the chamfer angle is arranged for providing a pit structure for forming a welding point so as to fill or paint the welding flux during welding.

Preferably, the cross section of the through hole is circular.

By adopting the technical scheme and the circular through holes, the stress of welding points formed by welding tin is uniform, and the uniform stress is favorable for polarization extinction of devices.

In a second aspect, the present application provides a sealed port for optical fiber sensing. The following technical scheme is adopted: the sealing plug comprises a port and the sealing plug, wherein the sealing plug body is arranged in the port, and the port and the sealing plug body are arranged in a sealing manner.

By adopting the technical scheme, the sealing plug and the port are sealed, and the optical fiber and the sealing plug are also sealed, so that the sealing performance is enhanced.

Preferably, the end surface of the plug body adjacent the port is lower than the end surface of the port.

Through adopting above-mentioned technical scheme, for the place of optic fibre department through-hole provides a rubber coating or sets up the position of rubber tail cover, go out the place of through-hole at optic fibre and carry out the rubber coating, treat after the glue solidification, can play protection optic fibre, cushion for example draw, the effect of bending stress that optic fibre received. The rubber tail sleeve is sleeved on the optical fiber, so as to prevent the optical fiber from being bent too much, and the performance of the optical fiber light transmission is reduced or even the optical fiber light transmission is failed.

Preferably, the plug body is welded to the port.

Through adopting above-mentioned technical scheme to reach the purpose of sealed port and sealing plug body, for sticky, sealed coefficient of expansion of gluing is too big, and easy fracture when ambient temperature changes widely causes to leak and can not reach sealed effect, and welded stability is higher.

In a third aspect, the application provides a tube shell for optical fiber sensing, which includes a housing, a port for allowing an optical fiber to penetrate out is arranged on the housing, a cavity is arranged in the housing, the port is communicated with the cavity, a sealing plug is arranged in the port, and the sealing plug body and the port are hermetically arranged.

By adopting the technical scheme, the optical fiber penetrates through the sealing plug body, so that the optical fiber extends into the shell from the port, the connection of the optical fiber is realized in the shell, the sealing plug body and the port are sealed, the difficulty of output sealing of the array optical fiber is reduced, the birefringence effect of the optical fiber caused by the fact that the metal solder is difficult to act uniformly after welding is reduced, and the problem of optical polarization crosstalk is reduced.

Preferably, the sealing plug body is welded to the port.

By adopting the technical scheme, the sealing plug body is welded with the port, so that the aim of sealing the sealing plug body and the port is fulfilled.

Preferably, an operation opening is formed in the shell, a cover body covers the operation opening, and the cover body and the shell are arranged in a sealing mode.

Through adopting above-mentioned technical scheme, provide the operation mouth of operation in the cavity for the user, the setting of lid is used for advancing sealedly to the operation mouth.

Preferably, a mounting plate is arranged on the shell.

Through adopting above-mentioned technical scheme to the fixed and installation of casing is convenient for.

In a fourth aspect, the present application provides a package for optical fiber sensing, including the housing and an electronic device for connecting an optical fiber, where the electronic device is disposed in the housing.

By adopting the technical scheme, the electronic device subjected to airtight packaging can keep lasting performance in severe environments, such as high temperature, humidity and the like, and reliability risks caused by water vapor to the adhesive bonding coupling point are avoided. At the same time, it can realize the leakage rate superior to

The optical waveguide device can meet the requirement of high polarization crosstalk required by an optical fiber sensing system.

Preferably, the electronic device includes an optical fiber and a chip coupled to the optical fiber, and the chip is provided with a first pin and a second pin electrically connected to the outside of the housing.

Through adopting above-mentioned technical scheme to when making optic fibre and chip intercommunication, introduce the outer quick-witted electric signal of shell body.

Preferably, the optical fiber is plated with a metal layer, and the optical fiber is welded with the through hole.

Through adopting above-mentioned technical scheme, optic fibre is made by glass usually, and the surface is smooth, is unable to carry out the welding with the metal, has plated the metal level outside optic fibre, makes optic fibre metallization, and then makes the welding between optic fibre and the through-hole, for sticky, sealed glue's coefficient of expansion is too big, and easy fracture when environmental temperature changes widely causes the leakage and can not reach sealed effect, and welded stability is higher.

Preferably, the accompanying sheets are arranged between the chip and the optical fibers, the accompanying sheets correspond to the optical fibers one to one, the accompanying sheets are coupled with the optical fibers, and the accompanying sheets are coupled with the chip.

Through adopting above-mentioned technical scheme, the setting of accompanying the piece is used for making better coupling between optic fibre and the chip, reduces coupling loss.

Preferably, the shell is internally provided with a groove and a base higher than the bottom of the groove, and the chip is fixed on the base so that the height of the optical fiber connected with the chip is the same as that of the through hole.

Through adopting above-mentioned technical scheme, the recess is used for reducing the phenomenon that the piece of accompanying appears to push up to shells inner wall, and the setting of base is used for raising the chip to make the height of optic fibre the same with the height of through-hole, be favorable to making the axis of optic fibre and the axis of through-hole keep coaxial.

In a fifth aspect, the present application provides an assembling method of an integrated optoelectronic device for optical fiber sensing, for assembling the integrated optoelectronic device, comprising the following steps,

placing a chip coupled with a first end of an optical fiber in a shell, and enabling a second end of the optical fiber to penetrate through an outlet;

placing the sealing plug body in the port and enabling the optical fiber to pass through the through hole on the sealing plug body;

and hermetically packaging the shell.

By adopting the technical scheme, the sealing plug is arranged, so that the sealing performance between the optical fiber and the port is improved, the problem that metal solder is difficult to uniformly act on the optical fiber after welding, the birefringence effect of the optical fiber is caused, and the problem of larger optical polarization crosstalk is reduced.

Preferably, placing the chip coupled to the first end of the optical fiber in the housing such that the second end of the optical fiber passes out of the port includes placing the chip in communication with the first end of the optical fiber outside the housing, and placing the first end of the optical fiber and the chip in the housing through the port.

By adopting the technical scheme, the chip and the optical fiber are placed into the shell from the port, and the chip is placed on the base, so that the bending of the optical fiber is reduced, and the process of placing the optical fiber is relatively straight and smooth.

Drawings

Fig. 1 is an exploded view of an integrated optoelectronic device for fiber optic sensing according to the present application.

Fig. 2 is a schematic plan view of a cover in an integrated optoelectronic device for optical fiber sensing according to the present application.

Fig. 3 is a structural diagram of a porous sealing plug in an integrated optoelectronic device for optical fiber sensing according to the present application.

FIG. 4 is a schematic structural diagram illustrating a boss on a porous sealing plug in an integrated optoelectronic device for optical fiber sensing according to the present application.

Fig. 5 is a structural diagram of a single-hole sealing plug in an integrated optoelectronic device for optical fiber sensing according to the present application.

Fig. 6 is a schematic cross-sectional structure diagram of a through hole in an integrated optoelectronic device for fiber sensing according to the present application.

Fig. 7 is a schematic cross-sectional view of an integrated optoelectronic device for fiber sensing according to the present application.

Fig. 8 is a schematic plan view of a housing and an internal electronic device of the housing in an integrated optoelectronic device for optical fiber sensing according to the present application.

Fig. 9 is a schematic structural diagram of a housing in an integrated optoelectronic device for optical fiber sensing according to the present application.

Fig. 10 is a connection diagram of an optical fiber and a substrate in an integrated optoelectronic device for optical fiber sensing according to the present application.

Reference numerals:

1. a housing; 10. a chamber; 100. a groove; 101. a base; 102. a protruding edge; 103. a bevel; 11. an operation port; 12. a port; 2. a chip; 20. a first pin; 21. a second pin; 23. carrying out accompany; 230. a V-shaped groove; 3. a cover body; 30. a bump; 4. a sealing plug body; 40. a sealing part; 400. sinking along the edge; 41. a boss; 42. a through hole; 43. an opening; 44. chamfering; 5. mounting a plate; 50. and (7) installing holes.

Detailed Description

The present application is described in further detail below with reference to figures 1-10.

The embodiment of the application discloses optical fiber sensing uses integrated photoelectric device, refer to fig. 1, integrated photoelectric device includes casing 1 and the electron device of setting in casing 1, and casing 1 wholly is the cuboid setting, is provided with the cavity 10 of cuboid shape in the casing 1, and cavity 10 is formed with operation mouth 11 on casing 1's lateral wall, and operation mouth 11 is the rectangle setting, and casing 1 length direction's both ends are provided with respectively with the port 12 of cavity 10 intercommunication. Optical fibers to be connected are passed through the two ports 12, respectively, to communicate within the chamber 10.

Referring to fig. 1, an electronic device is set as a chip 2, the chip 2 is placed in a cavity 10, an optical fiber is coupled with the chip 2, a first pin 20 and a second pin 21 are arranged on a side wall of a housing 1, the first pin 20 is set as two, a positive electrode and a negative electrode are arranged on the chip 2, one of the first pins 20 is communicated with the positive electrode, the other of the first pins 20 is communicated with the negative electrode, one end of the first pin 20, which is far away from the chip 2, penetrates out of the side wall of the housing 1 so as to introduce an electric signal outside the housing 1, the first pin 20 is electrically communicated with the outside of the housing 1 in a glass insulator sealing lead mode, the second pin 21 is a grounding pin, and one end of the second pin 21 is welded with the housing 1.

Referring to fig. 1 and 2, a cover 3 is disposed at an operation opening 11 of a housing 1, a protrusion 30 is disposed on the cover 3, the cover 3 covers the operation opening 11, and the protrusion 30 is embedded in the operation opening 11 to seal the operation opening 11.

Wherein, the material of casing 1 and lid 3 is selected to be the metal material, and the material of this application casing 1 and lid 3 can be kovar alloy, places lid 3 and carries out parallel seal welding on casing 1, when parallel seal welding, with the interior evacuation of casing 1, refills inert gas to carry out airtight encapsulation, in order to reach the effect that improves the 3 leakproofness of lid.

In other embodiments, the material of the casing 1 and the cover 3 may also be selected from ceramic or glass, a gold plating layer is disposed outside the casing 1 and the cover 3, and then the cover 3 and the casing 1 are sealed and welded in parallel.

Referring to fig. 1, a sealing plug body 4 is embedded in the port 12, the sealing plug body 4 is made of metal, the sealing plug body 4 can also be made of ceramic or glass with a gold-plated layer, and the sealing plug body 4 and the port 12 are sealed by using soldering tin.

Referring to fig. 3 and 4, the sealing plug body 4 includes a sealing portion 40 and a boss 41, the sealing portion 40 is provided with a sinking edge 400 which is annularly arranged along one end in the thickness direction, the boss 41 is arranged on the end face of the other end in the thickness direction of the sealing plug body 4, a through hole 42 is provided in the thickness direction of the sealing plug body 4, the through hole 42 penetrates through the sealing portion 40 and the boss 41, an opening 43 is formed in each of the end face of one end of the sealing plug body 4 and the boss 41 through the through hole 42, and the sinking edge 400 is arranged outside the through hole 42 in a surrounding manner. The optical fiber passes through the through hole 42, so that the sealing plug body 4 is welded with the optical fiber. The boss 41 is arranged, so that the welding point can be expanded to the outside of the sealing part 40, the welding operation is facilitated, the space of the welding operation is increased, and the nozzle of the welding equipment is convenient to move to the welding position. In this application, the solder of the sealing plug body 4 and the optical fiber during welding is glass solder or soldering tin solder, and when the solder is soldering tin solder, the coating layer outside the optical fiber is removed, and the optical fiber is metallized, and the coating layer may be gold-plated, silver-plated or plated with other metals outside the optical fiber.

In this application, the operation that the optical fiber needs to be welded needs to be metalized to the optical fiber first, and is not described in detail below.

Referring to fig. 4 and 5, the number of the through holes 42 on the sealing plug body 4 is set to be one or more, so that optical fibers with different numbers pass through, the cross section of the through holes 42 is circularly arranged, when the number of the through holes 42 on the sealing plug body 4 is set to be multiple, the through holes 42 and the through holes 42 are independently arranged, and the circular independent holes are adopted to respectively seal polarization maintaining optical fibers, so as to realize high-performance polarization crosstalk index.

Referring to fig. 6, chamfers 44 are provided at the openings 43 at both ends of the through-hole 42, and the chamfers 44 are provided to form a pit for filling or spreading solder in the through-hole 42.

Referring to fig. 7, when the plug body 4 is placed in the port 12, the boss 41 is disposed toward the inside of the housing 1, the depression 400 is disposed toward the outside of the housing 1, and the depression 400 is soldered by solder. The solder is intensively filled or coated at the sinking edge 400 to achieve the purpose of sealing between the sealing plug body 4 and the port 12, and the redundant solder can be reserved between the side wall of the sealing plug body 4 and the inner wall of the port 12 to further enhance the sealing performance between the sealing plug body 4 and the port 12.

Furthermore, the end face of the sealing plug body 4 far away from the end face of the boss 41 is lower than the end face of the port 12 far away from the end of the housing 1, and flexible glue can be filled or a rubber tail sleeve can be placed between the end face of the sealing plug body 4 far away from the end of the boss 41 and the end face of the port 12 far away from the end of the housing 1, so that the optical fiber at the fiber outlet is protected, and the phenomenon of breaking of the optical fiber is reduced.

In the present application, the ports 12 at the two ends of the housing 1 can respectively pass through different numbers of optical fibers, so as to realize one-to-one communication, one-to-many communication or many-to-many communication of the optical fibers.

Referring to fig. 7 and 8, the bottom of the chamber 10 begins to have two grooves 100, a base 101 is formed between the grooves 100, the height of the upper surface of the base 101 is higher than the bottom of the grooves 100, the chip 2 is placed on the upper surface of the base 101, the chip 2 is horizontally disposed on the base 101, and a glue layer is disposed between the chip 2 and the base 101 to fix the chip 2.

Referring to fig. 8, the chip 2 is obliquely arranged along the length direction of the shell 1, namely, two ends of the chip 2 are respectively close to two opposite inner walls of the shell 1, the oblique angle of the chip 2 is 2-10 degrees, the oblique angle of the chip 2 is 5 degrees, the optical fiber extends into the chip 2 from the port 12 and is communicated with the chip 2, an accompanying sheet 23 is arranged between the optical fiber and the chip 2, the optical fiber is coupled with the accompanying sheet 23, and the accompanying sheet 23 is coupled with the chip 2. The number of optical fibers is the same as the number of the cosets 23, and one optical fiber corresponds to one coset 23. The chip 2 is obliquely arranged and used for reducing the bending phenomenon of the optical fiber and keeping the optical fiber in a straight state when the optical fiber extends out of the shell 1.

Referring to fig. 9, a protruding edge 102 is disposed on the base 101, an inclined plane 103 is formed on the protruding edge 102, the inclined plane 103 and the side wall of the housing 1 where the first pin 20 is mounted are disposed at an angle, which is 5 ° in the present application, and the chip 2 is placed on the base 101, so that the chip 2 abuts against the inclined plane 103, and the chip 2 is disposed obliquely.

Referring to fig. 10, the accompanying sheet 23 is provided with a V-shaped groove 230, the optical fiber is arranged in the V-shaped groove 230 and is fixed by the fixing glue, the accompanying sheet 23 and the chip 2 are bonded by the fixing glue, and the fixing glue can be ultraviolet glue in the application. The provision of the cosets 23 serves to provide better coupling between the optical fibres and the chip 2, reducing coupling losses.

The groove 100 is used for reducing the phenomenon that the accompanying sheet 23 is pushed against the inner wall of the shell 1, and the base 101 is arranged for lifting the chip 2, so that the height of the optical fiber is the same as that of the through hole 42, and the coaxial keeping of the axis of the optical fiber and the axis of the through hole 42 is facilitated.

Referring to fig. 8, a mounting plate 5 is arranged on the housing 1, the mounting plate 5 is welded to the housing 1, the mounting plate 5 can also be integrally formed with the housing 1, the number of the mounting plate 5 is at least one, in this application, the mounting plate 5 is two, the two mounting plates 5 are arranged on the side wall of the housing 1 where the first pins 20 and the second pins 21 are arranged, and the mounting holes 50 are formed in the mounting plate 5. The installation hole 50 is provided at one side of the case 1, reducing the volume of the integrated photoelectric device.

In other embodiments, the mounting plates 5 may be disposed on both sides of the housing 1.

The implementation principle of the integrated photoelectric device for optical fiber sensing in the embodiment is as follows: the optical fiber is made to pass through the through hole 42 on the sealing plug body 4, the sealing plug body 4 is arranged in the port 12, the sealing plug body 4 and the port 12 are welded through soldering tin, and the optical fiber and the through hole 42 are welded through soldering tin to form two sealing structures, so that the airtightness between the optical fiber and the sealing plug body 4 and the airtightness between the sealing plug body 4 and the shell 1 are respectively realized. Can realize the leakage rate superior to that of the prior art

The optical waveguide device can meet the requirement of high polarization crosstalk required by an optical fiber sensing system. The device subjected to airtight packaging can keep lasting performance in severe environments such as high temperature, humidity and the like, and reliability risks caused by water vapor to the adhesive bonding coupling point are avoided.

The embodiment of the application also discloses an assembling method of the integrated photoelectric device for optical fiber sensing, which comprises the following steps:

s1, placing the chip 2 coupled with the first end of the optical fiber and the optical fiber in the shell 1, and enabling the second end of the optical fiber to penetrate the port 12;

s10: communicating the chip 2 with the first end of the optical fiber outside the shell 1;

specifically, the optical fiber is coupled with the chip 23, and the chip 23 is coupled with the chip 2;

s11: the first end of the optical fiber and the chip 2 are led through the port 12 and are arranged in the shell 1;

the chip 2 and the optical fiber are placed into the housing 1 from the port 12, and the chip 2 is placed on the base 101, so as to reduce the bending of the optical fiber, and make the process of placing the optical fiber more straight and smooth.

S2, placing the sealing plug body 4 in the port 12 and enabling the optical fiber to pass through the through hole 42 on the sealing plug body 4;

after the sealing plug body 4 is sleeved on the optical fiber, the sealing plug body 4 is placed in the port 12.

And S3, hermetically sealing the case 1.

Specifically, the sealing plug body 4 and the port 12 are sealed by soldering, the sealing plug body 4 and the optical fiber are sealed by soldering, and the cover body 3 is covered at the operation opening 11 for parallel sealing.

The implementation principle of the assembly method of the integrated photoelectric device for optical fiber sensing in the embodiment is as follows: the optical fiber and the sealing plug body 4 are made to penetrate through the port 12 and are placed in the shell 1, then the optical fiber penetrates through the through hole 42 in the sealing plug body 4, the sealing plug body 4 is arranged in the port 12, the sealing plug body 4 and the port 12 are welded and sealed through soldering tin, and the optical fiber and the through hole 42 are welded and sealed through soldering tin, so that two sealing structures are formed, and the air tightness between the optical fiber and the sealing plug body 4 and the air tightness between the sealing plug body 4 and the shell 1 are achieved respectively. Can realize the leakage rate superior to that of the prior art

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A sealing plug for optical fiber sensing is characterized in that: including sealing plug body (4), sealing plug body (4) are including sealing portion (40), one or more through-hole (42) have been seted up on sealing portion (40), through-hole (42) run through sealing portion (40) and pass for optic fibre, the one end of sealing portion (40) is provided with along (400) sinking around sealing portion (40) outer wall.

2. A sealing plug for optical fiber sensing according to claim 1, wherein: the sealing plug body (4) further comprises a boss (41) fixed with the sealing part (40), the boss (41) is arranged on the sealing part (40) and far away from one end of the sinking edge (400), the through hole (42) penetrates through the sealing part (40) and the boss (41), and an opening (43) is formed in each of the sealing part (40) and the boss (41).

3. The optical fiber sensing sealing plug according to claim 2, wherein: a chamfer (44) is arranged at the opening (43) to fill or smear the solder.

4. A sealing plug for optical fiber sensing according to claim 2 or 3, wherein: the cross section of the through hole (42) is circular.

5. A sealed port for optical fiber sensing, comprising a port (12) and a sealing plug according to any of claims 1 to 4, wherein the sealing plug body (4) is arranged in the port (12), and the port (12) and the sealing plug body (4) are arranged in a sealing manner.

6. The sealed port for optical fiber sensing of claim 5, wherein: the end surface of one end of the sealing plug body (4) close to the port (12) is lower than the end surface of the port (12).

7. The sealed port for optical fiber sensing of claim 5 or 6, wherein: the sealing plug body (4) and the port (12) are welded.

8. A tube shell for optical fiber sensing, which comprises a shell (1), wherein a port (12) for an optical fiber to pass through is arranged on the shell (1), a chamber (10) is arranged in the shell (1), the port (12) is communicated with the chamber (10), a sealing plug according to any one of claims 1 to 4 is arranged in the port (12), and the sealing plug body (4) and the port (12) are arranged in a sealing manner.

9. A package for optical fiber sensing of claim 8, wherein: the sealing plug body (4) and the port (12) are welded.

10. The optical fiber sensing package according to claim 8 or 9, wherein: the improved portable air conditioner is characterized in that an operation opening (11) is formed in the shell (1), a cover body (3) is covered at the operation opening (11), and the cover body (3) and the shell (1) are arranged in a sealing mode.

11. The optical fiber sensing package according to claim 8 or 9, wherein: the shell (1) is provided with a mounting plate (5).

12. An integrated optoelectronic device for fiber optic sensing, comprising a package according to any of claims 8 to 11 and electronics for connecting an optical fiber, said electronics being arranged in the housing (1).

13. The integrated optoelectronic device for fiber optic sensing of claim 12, wherein: the electronic device comprises an optical fiber and a chip (2) coupled with the optical fiber, wherein a first pin (20) and a second pin (21) which are electrically connected with the outside of the shell (1) are arranged on the chip (2).

14. The integrated optoelectronic device for fiber optic sensing of claim 13, wherein: the optical fiber is plated with a metal layer, and the optical fiber is welded with the through hole (42).

15. The integrated optoelectronic device for fiber optic sensing according to claim 13 or 14, wherein: be provided with between chip (2) and the optic fibre and accompany piece (23), accompany piece (23) and optic fibre one-to-one, accompany piece (23) and optic fibre coupling, accompany piece (23) and chip (2) coupling.

16. The integrated optoelectronic device for optical fiber sensing of claim 15, wherein: a groove (100) and a base (101) higher than the bottom of the groove (100) are arranged in the shell (1), and the chip (2) is fixed on the base (101) so that the height of an optical fiber connected with the chip (2) is the same as that of the through hole (42).

17. A method of assembling an integrated optoelectronic device for optical fiber sensing, for assembling an integrated optoelectronic device according to any one of claims 12 to 16, wherein: comprises the following steps of (a) carrying out,

placing a chip (2) coupled with a first end of an optical fiber in a shell (1) to enable a second end of the optical fiber to penetrate through an outlet (12);

placing the sealing plug body (4) in the port (12) and enabling the optical fiber to pass through a through hole (42) on the sealing plug body (4);

the housing (1) is hermetically sealed.

18. The method of assembling an integrated optoelectronic device for optical fiber sensing of claim 17, wherein: the step of placing the chip (2) coupled with the first end of the optical fiber in the shell (1) and enabling the second end of the optical fiber to penetrate through the port (12) comprises the steps of communicating the chip (2) and the first end of the optical fiber outside the shell (1) and enabling the first end of the optical fiber and the chip (2) to penetrate through the port (12) and be placed in the shell (1).